CN116577356A - Defect depth positioning method and detection device for ray detection - Google Patents

Defect depth positioning method and detection device for ray detection Download PDF

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Publication number
CN116577356A
CN116577356A CN202310274376.0A CN202310274376A CN116577356A CN 116577356 A CN116577356 A CN 116577356A CN 202310274376 A CN202310274376 A CN 202310274376A CN 116577356 A CN116577356 A CN 116577356A
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scale
defect
distance
size
image
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甘勇
马海全
王倩妮
范洪涛
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AECC Beijing Institute of Aeronautical Materials
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E30/00—Energy generation of nuclear origin
    • Y02E30/30—Nuclear fission reactors

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  • Analysing Materials By The Use Of Radiation (AREA)

Abstract

The invention discloses a depth positioning method and a detection device for a ray detection defect, wherein the method comprises the following steps: step S1: measuring the actual size of the defect; step S2: placing scales on the surfaces of the source side and the detector side of the detected part where the defect is located, measuring the distance between the scales, and collecting images; step S3: calculating the amplification ratio of the scale; step S4: the distance between the source and the detector is calculated and the distance of the defect to the source scale or the detector side scale is further calculated. According to the invention, the distance from the radiation source to the actual imaging area of the detector, which is difficult to accurately measure, is obtained by utilizing the amplification ratio and the distance between the defect and the source side surface scale or the detector side surface scale, and the depth direction positioning is realized by combining the amplification ratio of the defect. The invention has low use condition, strong operability and good applicability, and can provide assistance for polishing and trimming defects in the material forming process.

Description

Defect depth positioning method and detection device for ray detection
Technical Field
The invention relates to the field of ray detection, in particular to a defect depth positioning method and a defect depth detection device for ray detection.
Background
The radiation detection has the advantages of high detection sensitivity, visual result, mature technology and the like, and is widely applied to the internal defect detection in the industrial field. The basic principle is that rays penetrate through a detection area and form projection on a negative film, and whether defects are contained or not is judged according to blackness change in a projection image. Since the result image is a projection of the three-dimensional structure on the two-dimensional plane, the depth direction density change is overlapped and compressed to the same plane, the depth density change information cannot be obtained, and the defect depth direction positioning is always one of the limitations of ray detection.
Aiming at the defect depth positioning problem, patent document CN114965519a (patent No. 202210570837.4) discloses a method and a system for positioning the internal structure of an object based on radial digital imaging, wherein the method provides a defect depth direction positioning method, but has two limitations: firstly, the positions of the detector and the ray source need to be converted once, which cannot be realized for a rod anode X-ray machine penetrating into the annular piece; secondly, in the method, the distance from the radiation emission position to the imaging plane of the detector needs to be accurately measured, and during actual detection, the actual emission position of the X-ray and the actual imaging area of the detector are packaged in equipment, so that accurate measurement is difficult. Patent document CN105092614B (patent No. 201510554183.6) discloses a system and a method for detecting the depth of a point defect of a casting by rays, the method determines the depth of the defect by defect movement and combines a similar triangle principle, and another defect depth positioning method is provided, but the method is only applicable to point defects with smaller size, and for large-size or large-volume defects, the defect image can be greatly deformed in movement, so that the positioning precision is affected; on the other hand, the actual emission position of the X-rays is difficult to determine accurately, and may have an influence on the measurement result.
Disclosure of Invention
The purpose of the invention is that: aiming at the problems in the background, the invention provides a defect depth positioning method for ray detection aiming at the limitation of defect depth calculation. Then, scales similar to the size of the defect are respectively placed on the detector side and the radiation source side of the defect, and the depth position of the defect is obtained by using the magnification ratio of the two scales and the distance between the two scales.
In order to solve the technical problem, the technical scheme of the invention is as follows:
in one aspect, a method for locating a depth of a defect in a radiation detection is provided, including the following steps:
step S1: measuring the size of a defect in the workpiece;
step S2: respectively placing a first scale and a second scale on the radiation source side and the detector side of the defect, measuring the distance between the first scale and the second scale, and collecting images;
step S3: measuring the image sizes of the first scale, the second scale and the defects, and respectively calculating the amplification ratio between the image size and the actual size;
step S4: and calculating the distance between the ray source and the imaging plane of the detector by using the amplification ratios of the first scale and the second scale, and calculating the distance from the defect to the first scale and the second scale by using the distance and the amplification ratio of the defect.
The size of the defect in step S1 can be measured in one of two ways:
step S1, measuring by adopting a moving mode of defects in a workpiece; the specific method is as follows: firstly, moving the defect to an imaging area of a detector to acquire a result image, and counting the number of pixels of a defect image in the result image; secondly, moving the defect, when the difference value between the number of pixels moved by the defect and the number of pixels of the defect is minimum, recording the moving distance of the defect at the moment, and calculating the pixel size according to the moving distance of the defect and the number of the pixels moved, so as to obtain the actual size of the defect.
A scale may also be used in step S1 to measure defects in the workpiece.
In the step S1, the detector is first calibrated, and after the defect is found, the defect is moved to the center of the imaging area of the detector by using the motion control module, and an image is acquired. And obtaining a gray level distribution map of the defect in the result image, counting the number of pixels of the defect image, and then moving the defect image by using a motion control module. When the difference between the number of pixels of the defect moving and the number of pixels of the defect is minimum, recording the moving distance of the defect at the moment.
The smallest difference means: the number of moving pixels of the defect image during movement gradually approaches to the number of pixels of the defect image itself, and then the difference between the two is increased, so that a stepping distance exists, so that the difference between the number of moving pixels of the defect image and the number of pixels of the defect image itself is minimum, and the stepping distance is an integer multiple of the minimum stepping precision.
The actual size of the defect is calculated using the following formula:
wherein d r For the actual size of the defect, s is the moving distance of the defect, d m The number of moving pixels, d, being defect i The number of pixels in the center area of the detector for defects.
In the step S2, the selection of the scale material, the selection of the size, and the selection of the placement position are as follows:
the first scale and the second scale are made of the same material as the workpiece;
the difference between the actual size of the first scale and the second scale and the defect size measured in the step one is as small as possible; as small as possible means: in the scales with the serial sizes changing in a gradient way, two scales which are the closest to the defect sizes measured in the step S1 are selected;
the first scale and the second scale are preferably placed on the source side surface and the detector side surface of the site where the defect is located.
Preferably, the first scale and the second scale are plate hole type image quality gauges.
In the step S3, the amplification ratio calculation formula of the first scale and the second scale is:
wherein M is 1 For the amplification ratio of the first scale, f is the distance from the radiation emitting position to the actual imaging plane of the detector, SOD 1 X is the distance from the radiation emitting position to the first scale 1 D is the size of the image of the first scale m1 For the actual size of the first scale, delta gt X is the distance between the first scale and the second scale 2 D is the size of the image of the second scale m2 Is the actual size of the second scale.
In the step S4, a calculation formula of a distance between the radiation emitting position and the imaging plane of the detector is as follows:
wherein f is the distance from the radiation emitting position to the actual imaging plane of the detector, delta gt X is the distance between the first scale and the second scale 1 Is the size of the image of the first scale, x 2 D is the size of the image of the second scale m2 Is the actual size of the second scale d m1 Is the actual size of the first scale.
The distance calculation formulas from the defect to the first scale and the second scale are respectively as follows:
Δ SOD2 ＝Δ gt -Δ SOD1
wherein delta is SOD1 Delta as distance of defect to first scale gt D is the distance between the first scale and the second scale s2 For the size of the defect image in the image obtained in step S2, x 2 D is the size of the image of the second scale r For the defect size, x, measured in step S1 1 D is the size of the image of the first scale m1 Is the actual size of the first scale, d m2 Is the actual size of the second scale.
On the other hand, the invention also provides a device for detecting the depth of the ray detection defect, which comprises a ray excitation module, a workpiece clamping module, an imaging module, a motion control module, a data processing module and a display module;
the ray excitation module is used for generating rays; the workpiece clamping module is used for clamping the inspected workpiece; the imaging module is used for receiving the ray radiation signals and generating images; the motion control module is used for controlling the ray excitation module, the imaging module and the workpiece clamping module to move and displaying the moving distance; the data processing module is used for carrying out calculation processing on each item of obtained data to obtain a calculation result including the depth of the defect; the display module is used for controlling parameters of the ray excitation module and the imaging module and displaying imaging results and calculation results;
the imaging module is typically a digital detector array or film.
The beneficial effects of the invention are as follows:
the depth positioning method for the ray detection defect has the following advantages:
1. the depth of the defect is accurately positioned, the placement positions of the first scale and the second scale and the approximation of the size of the defect enable the amplification ratio of the scale and the defect to have small phase difference, and in principle, the depth positioning effect is good.
2. The use condition is low, and because the radiographic digital imaging system usually operates in an automatic mode, the flat panel detector, the radiographic source and the workpiece mounting device controlled by the motion module are easy to meet, and the measuring scale flat panel type image quality meter is a common radiographic detection tool.
3. The application range is wide, and the X-ray source is not only suitable for common X-ray sources, but also suitable for rod anode X-ray sources, and is suitable for point defects and other defects with larger sizes.
4. The operation is simple. The defect depth positioning method provided by the invention can accurately position the depth direction of the defect, combines the rapid imaging characteristic of the ray digital imaging, can efficiently and three-dimensionally position the defect, and provides support for polishing the defect and improving the defect processing efficiency.
Drawings
FIG. 1 is a schematic illustration of the source-to-detector distance difference measured by the method of the present invention versus other methods of the present invention;
FIG. 2 is a schematic diagram of a method for locating depth of a radiation detection defect according to the present invention;
FIG. 3 is a schematic block diagram of the detection device of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are some, but not all, embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without making any inventive effort are intended to fall within the scope of the present invention.
Features of various aspects of embodiments of the invention are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without these specific details. The following description of the embodiments is merely for a better understanding of the invention by showing examples of the invention. The present invention is not limited to any particular arrangement and method provided below, but covers any modifications, substitutions, etc. of all product constructions, methods, and the like covered without departing from the spirit of the invention. Well-known structures and techniques have not been shown in detail in the various drawings and the following description in order not to unnecessarily obscure the present invention.
Examples:
the invention is further described below with reference to the drawings and examples. Referring to fig. 1 and fig. 2, fig. 2 is a schematic diagram of a method for locating depth of a defect detected by radiation according to the present invention, where the distance f between the radiation emitting position and the imaging plane of the detector is calculated, as in the conventional method of fig. 1, where the difference between the distances f and f between the surface of the radiation source package and the surface of the detector package may cause deviation in locating depth of the defect.
The detailed process of the ray detection defect depth positioning method of the invention is as follows:
1. the actual size of the defect is measured, the detector is corrected according to the method recommended by the detector manufacturer, and then the detected defect is positioned in the center of the image by utilizing the motion control module, so that the defect image is prevented from being obviously deformed in length in the subsequent measuring process. Collecting the detection image at the moment, obtaining a gray level distribution diagram of the longest direction of the defect by utilizing image analysis software, determining the boundary between the defect image and the background image on the gray level diagram, and recording the pixel number d representing the defect image at the moment i . Then the detected position of the defect is moved relative to the ray source and the detector by utilizing the motion control module, at the moment, the image of the defect is reversely moved, the boundary pixel of the defect is observed and the pixel distance of the movement of the boundary pixel of the defect is calculated during the movement, and the number of the pixel movements of the defect image is increased along with the increase of the movement distance, and the number of the pixel movements of the defect image is equal to d i If there is a moving distance s, when the moving distance is (s+delta) or (s-delta) (delta is the minimum stepping precision of the motion system), the pixels of the defect image move by the number of times and d i The difference of the defect images is increased, and the moving number of the defect images is equal to d at the moving distance s i The gap is the smallest, the moving distance s at this time is recorded, and the size of the defect at this time can be expressed as:
wherein d r For measuring the size of the defect, s is the moving distance of the defect, d m The number of moving pixels, d, being defect i The number of pixels in the center area of the detector for defects.
The measuring method calculates the pixel size by utilizing the moving distance of the defect on the defect plane, and meanwhile, the moving distance is approximately equal to the defect, so that the measuring error caused by large difference between the scale and the defect size and the defect not being on the same depth plane when the scale is placed is avoided, and the measuring method is high in precision. The measuring method can control the measuring error of the defect within the minimum stepping precision of the motion module.
Other high precision non-destructive inspection methods may also be used to measure the size of defects, such as microfocus CT and the like.
2. And (3) selecting two plate hole type image quality meters with the diameters of 4T holes closest to the defect size measured in the step one from the plate hole type image quality meters with the same material as the detected part as a first scale and a second scale, respectively placing the two plate hole type image quality meters on the surface of the radiation source side and the surface of the detector side of the detected part, and collecting images. When the scale on the result image is overlapped with the defect image, the position of the first scale or the second scale should be readjusted so that the three images are not overlapped,
when the image is acquired, the images of the defect on the image, the first scale and the second scale should be as close as possible but not coincide, so that the amplification ratio of the three is closest but does not affect the statistics of the number of pixels of the respective images.
3. And measuring the image sizes of the first scale, the second scale and the defects, and respectively calculating the magnification ratio between the image size and the actual size. Since the actual sizes of the first scale and the second scale are known, the size of the image is obtained by multiplying the number of pixels by the size of the probe element of the detector, and thus the calculation formula of the magnification ratio of the first scale and the second scale is:
wherein M is 1 For the amplification ratio of the first scale, f is the distance from the radiation emitting position to the actual imaging plane of the detector, SOD 1 X is the distance from the radiation emitting position to the first scale 1 D is the size of the image of the first scale m1 For the first scale actualSize, delta gt X is the distance between the first scale and the second scale 2 D is the size of the image of the second scale m2 Is the actual size of the second scale.
4. Calculating the distance f between the radiation emission position and the imaging plane of the detector by using the amplification ratios of the first scale and the second scale, and calculating the distance delta from the defect to the first scale by using the calculated f and the amplification ratio of the defect SOD1 Or the distance delta of the second scale SOD2 . The amplification ratio formula of the first scale and the second scale is combined, and the calculation formula of the distance f between the radiation emission position and the imaging plane of the detector can be obtained as follows:
wherein f is the distance from the radiation emitting position to the actual imaging plane of the detector, delta gt X is the distance between the first scale and the second scale 1 Is the size of the image of the first scale, x 2 D is the size of the image of the second scale m2 Is the actual size of the second scale d m1 Is the actual size of the first scale.
Because the actual occurrence position of the rays and the actual imaging plane of the detector cannot be determined in engineering application, the distance from the radiation emission position to the detector, the distance from the radiation emission position to the surface of the workpiece or the distance from the surface of the workpiece to the detector cannot be accurately measured, and the distance delta from the first scale to the second scale can be accurately measured in the position relation gt I.e. the distance of the source side surface of the workpiece from the detector surface. Thus, when measuring the actual depth position of the defect, the distance delta of the defect from the surface of the workpiece is obtained SOD1 Or delta SOD2 Compared with the distance between the defect and the ray source or detector, the method has the advantages of practicability and convenience in polishing and trimming the defect.
The distance calculation formulas from the defect to the first scale and the second scale are respectively as follows:
Δ SOD2 ＝Δ gt -Δ SOD1 (6)
wherein delta is SOD1 Delta as distance of defect to first scale gt D is the distance between the first scale and the second scale s2 For the size of the defect image in the image obtained in the second step, x 2 D is the size of the image of the second scale r For the defect size measured in step one, x 1 D is the size of the image of the first scale m1 Is the actual size of the first scale, d m2 Is the actual size of the second scale.
In a specific embodiment, a 4T hole of an aluminum flat hole type image quality gauge with a defect number of 25 is provided, and a first scale and a second scale are respectively flat hole type image quality gauges (4T holes) with a defect number of 20 and a defect number of 32, and are respectively placed on the source side surface and the detector side surface of the detected part. To verify the error and validity, the actual value of the defect to scale 2 is preset to 38.44mm. The results of the calculation of the steps using the method of the present invention are as follows:
d is calculated according to the formula (1) r 2.56mm, where s=2.6 mm, obtained by reading the distance of movement of the workpiece loading module, d m =73, calculated by observing the pixel coordinates of the defect boundary before and after movement, d i =71.9, obtained by measuring the pixel coordinates of the defect boundary and calculating the distance between the two boundary coordinates;
calculating the magnification M of the first scale according to formula (2) 1 = 4.2224, where x 1 =8.58 mm, obtained by detector pixel size (0.1 mm) and first scale pixel number (85.8), d m1 =2.032 mm, a known quantity, obtainable by querying a plate hole type imager instruction;
calculating the magnification M of the second scale according to formula (3) 2 = 2.2330, where x 2 =7.26 mm, obtained by detector pixel size (0.1 mm) and second scale pixel number (72.6), d m2 = 3.2512mm, a known quantity, available by querying a plate hole-type image meter instruction;
calculating the distance f= 415.56mm between the radiation emission position and the detector imaging plane according to equation (4), wherein Δ gt =87.68 mm, obtained by measuring the distance between the first and second scales, x 1 ＝8.58mm，x 2 ＝7.26mm，d m1 ＝2.032mm，d m2 ＝3.2512mm；
Calculating the distance delta of the defect to the first scale and the second scale according to the formula (5) (6) SOD1 、Δ SOD2 Respectively is
Δ SOD1 ＝49.54mm；
Δ SOD2 ＝38.14mm。
The actual value from the preset defect to the scale 2 is 38.44mm, and the defect depth value obtained by the method is only different from the actual value by 0.3mm, so that the method has good accuracy.
Whereas in the conventional calculation method, only the distance f from the tube to the detector surface in fig. 2 (400 mm in this embodiment) can be measured, and the distance f from the emission position of the emission line to the imaging plane of the detector (415 mm) cannot be calculated, and the difference between the two distances is 15mm, which increases the defect depth positioning error.
As can be seen from the final numerical comparison, the accuracy of the method is improved by an order of magnitude compared with the conventional calculation method.

Claims (10)

1. A depth positioning method for a ray detection defect; characterized in that the method comprises the steps of:
step S1: measuring the size of a defect in the workpiece;
step S2: respectively placing a first scale and a second scale on the radiation source side and the detector side of the defect, measuring the distance between the first scale and the second scale, and collecting images;
step S3: measuring the image sizes of the first scale, the second scale and the defects, and respectively calculating the amplification ratio between the image size and the actual size;
step S4: and calculating the distance between the ray source and the imaging plane of the detector by using the amplification ratios of the first scale and the second scale, and calculating the distance from the defect to the first scale and the second scale by using the distance and the amplification ratio of the defect.
2. The method according to claim 1, characterized in that:
step S1, measuring by adopting a moving mode of defects in a workpiece; the specific method is as follows: firstly, moving the defect to an imaging area of a detector to acquire a result image, and counting the number of pixels of a defect image in the result image; secondly, moving the defect, when the difference value between the number of pixels moved by the defect and the number of pixels of the defect is minimum, recording the moving distance of the defect at the moment, and calculating the pixel size according to the moving distance of the defect and the number of the pixels moved, so as to obtain the actual size of the defect.
3. The method according to claim 1, characterized in that: in step S1, a scale is used to measure defects in the workpiece.
4. The method according to claim 2, characterized in that: in step S1, the actual size of the defect is calculated by the following formula:
wherein d r For the actual size of the defect, s is the moving distance of the defect, d m The number of moving pixels, d, being defect i The number of pixels in the center area of the detector for defects.
5. The method according to claim 1, characterized in that: in step S2, the scale material and the size are selected as follows:
the first scale and the second scale are made of the same material as the workpiece;
the difference between the actual size of the first scale and the second scale and the defect size measured in the step one is as small as possible; as small as possible means: in the scales with gradient changes in the series sizes, two scales closest to the defect sizes measured in the step S1 should be selected.
6. The method according to claim 1, characterized in that: in step S2, the first scale and the second scale are placed on the source-side surface and the detector-side surface of the portion where the defect is located.
7. The method according to claim 5, wherein: the first scale and the second scale are plate hole type image quality meters.
8. The method according to claim 1, characterized in that:
in the step S3, the amplification ratio calculation formula of the first scale and the second scale is:
wherein M is 1 For the amplification ratio of the first scale, f is the distance from the radiation emitting position to the actual imaging plane of the detector, SOD 1 X is the distance from the radiation emitting position to the first scale 1 D is the size of the image of the first scale m1 For the actual size of the first scale, Δg t X is the distance between the first scale and the second scale 2 D is the size of the image of the second scale m2 Is the actual size of the second scale.
9. The method according to claim 1, characterized in that:
in the step S4, a calculation formula of a distance between the radiation emitting position and the imaging plane of the detector is as follows:
wherein f is the distance from the radiation emitting position to the actual imaging plane of the detector, delta gt X is the distance between the first scale and the second scale 1 Is the size of the image of the first scale, x 2 D is the size of the image of the second scale m2 Is the actual size of the second scale d m1 Is the actual size of the first scale.
The distance calculation formulas from the defect to the first scale and the second scale are respectively as follows:
Δ SOD2 ＝Δ gt -Δ SOD1
wherein delta is SOD1 Delta as distance of defect to first scale gt D is the distance between the first scale and the second scale s2 For the size of the defect image in the image obtained in step S2, x 2 D is the size of the image of the second scale r For the defect size, x, measured in step S1 1 D is the size of the image of the first scale m1 Is the actual size of the first scale, d m2 Is the actual size of the second scale.
10. A depth of defect detection apparatus for radiation detection using the method of claim 1, wherein: the device comprises a ray excitation module, a workpiece clamping module, an imaging module, a motion control module, a data processing module and a display module;
the ray excitation module is used for generating rays; the workpiece clamping module is used for clamping the inspected workpiece; the imaging module is used for receiving the ray radiation signals and generating images; the motion control module is used for controlling the ray excitation module, the imaging module and the workpiece clamping module to move and displaying the moving distance; the data processing module is used for carrying out calculation processing on each item of obtained data to obtain a calculation result including the depth of the defect; the display module is used for controlling parameters of the ray excitation module and the imaging module and displaying imaging results and calculation results;
the imaging module is typically a digital detector array or film.
CN202310274376.0A 2023-03-21 2023-03-21 Defect depth positioning method and detection device for ray detection Pending CN116577356A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117929427A (en) * 2024-03-25 2024-04-26 苏州一目万相科技有限公司 Method and device for determining magnification, readable storage medium and imaging device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117929427A (en) * 2024-03-25 2024-04-26 苏州一目万相科技有限公司 Method and device for determining magnification, readable storage medium and imaging device
CN117929427B (en) * 2024-03-25 2024-06-04 苏州一目万相科技有限公司 Method and device for determining magnification, readable storage medium and imaging device

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