CN116565101A - Fluorescent powder-free multi-primary-color LED planar packaging structure and preparation method thereof - Google Patents
Fluorescent powder-free multi-primary-color LED planar packaging structure and preparation method thereof Download PDFInfo
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- CN116565101A CN116565101A CN202310420820.5A CN202310420820A CN116565101A CN 116565101 A CN116565101 A CN 116565101A CN 202310420820 A CN202310420820 A CN 202310420820A CN 116565101 A CN116565101 A CN 116565101A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention discloses a fluorescent powder-free multi-primary-color LED plane packaging structure and a preparation method thereof. The multi-primary LED planar packaging light extraction and light mixing are realized through the double-layer refractive index packaging adhesive layer, the surface microstructure array and the three-layer high-reflectivity reflective coating, the use of fluorescent powder is avoided, and the problems of low light extraction efficiency and poor light mixing of the multi-primary LED adopting the traditional planar packaging structure are solved.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to a fluorescent powder-free multi-primary-color LED plane packaging structure and a preparation method thereof.
Background
LED (Light Emitting Diodes) has the advantages of high electro-optic conversion efficiency, long service life, environmental protection, energy saving, small volume and the like, along with the development of LED illumination technology, the requirements on the quality, the service and the like of LED illumination are gradually improved, compared with a method for exciting fluorescent powder to synthesize white light by using a main stream blue LED, the fluorescent powder-free multi-primary LED synthesizes white light into electroluminescence, fluorescent powder is not needed, conversion loss is avoided, electro-optic response is fast, the reliability problems of LED light efficiency reduction, color temperature drift and the like caused by aging of the fluorescent powder are avoided, the fluorescent powder-free multi-primary LED white light illumination has larger potential than the fluorescent powder-converted white light illumination, and has wider prospect in the fields of outdoor illumination, indoor illumination and the like, and the high-quality high-light-efficiency fluorescent powder-free multi-primary LED white light is the necessary trend of next-generation semiconductor illumination.
The LED industrial chain is mainly divided into upstream epitaxial growth, chip manufacturing, midstream device packaging, downstream product application, wherein the LED product application is the link closest to the requirement of a user, and the LED device packaging is the key for connecting upstream and downstream. Generally, light emitted by an LED package light source is a non-uniform circular light spot, and cannot meet the requirement of actual illumination, such as road illumination, tunnel illumination and the like, while key illumination, such as a spotlight, a searchlight, a stage lamp and the like, needs a uniform circular light spot, and a secondary optical system is required to be introduced to perform light distribution in order to meet the requirements of different illumination application scenes on the light spot.
The most widely used light distribution mode at present is to use a secondary lens to realize the light spot regulation and control requirements of different lighting application occasions. The LED packaging structure matched with the secondary lens is planar packaging, and good optical regulation and control effects can be achieved through near-field light distribution and secondary lens coupling. However, when the conventional planar packaging structure is used for a non-fluorescent powder multi-primary LED light source, the following key problems exist: firstly, as shown in fig. 1, according to the snell's law, light emitted by a large number of LED chips is totally reflected at the interface between a planar lens and air, so that light extraction efficiency is reduced, and a problem of low light efficiency exists; secondly, as shown in fig. 2, as the light intensities of the light emitted by the LED chips with different colors at different angles are not matched, the light mixing difference of the non-fluorescent powder multi-primary-color LED planar packaging module is caused, and the color separation problem exists. Therefore, developing a fluorescent powder-free multi-primary LED planar packaging structure with high light extraction efficiency and high spatial color uniformity and a preparation method thereof has very important application value.
Disclosure of Invention
The first object of the present invention is to provide a fluorescent powder-free multi-primary LED planar packaging structure, which uses a packaging adhesive layer with gradient refractive index, a high-reflectivity reflective coating and a microstructure array, so as to solve the problems of low light extraction efficiency and poor light mixing of a fluorescent powder-free multi-primary LED planar packaging module, and improve the light extraction efficiency and spatial color uniformity of the multi-primary LED planar packaging structure.
The second aim of the invention is to provide a preparation method of the fluorescent powder-free multi-primary-color LED planar packaging structure.
The first object of the present invention is achieved by:
a fluorescent powder-free multi-primary-color LED plane packaging structure is characterized in that: including package substrate, a plurality of LED chips of different primary colors, die bonding layer, lead wire, first high reflectivity reflection coating, second high reflectivity reflection coating, third high reflectivity reflection coating, bowl cup support, first encapsulation glue film, second encapsulation glue film, characterized by: the LED chip is installed on the packaging substrate through the die bonding layer, each LED chip is connected with the packaging substrate through a lead wire in a circuit mode, a first high-reflectivity reflecting coating is arranged in a complementary area of the surface of the packaging substrate and the LED chip, a bowl cup support is fixedly installed at the edge of the upper surface of the packaging substrate, a containing cavity is formed in the middle of the bowl cup support, a second high-reflectivity reflecting coating and a third high-reflectivity reflecting coating are arranged on the inner wall of the bowl cup support from bottom to top, a first packaging adhesive layer is arranged in the containing cavity of the upper surface of the packaging substrate, a second packaging adhesive layer is covered on the first packaging adhesive layer, the upper surface of the second packaging adhesive layer is a plane, and a microstructure array is arranged on the plane.
Further, the surface of the packaging substrate is provided with a bonding pad area for realizing the fixation and electric connection of the LED chip, and the packaging substrate is one of a ceramic substrate, a copper substrate and an aluminum substrate.
Further, the LED chips with different primary colors are a red LED chip, a yellow LED chip, a green LED chip and a blue LED chip, or a red LED chip, a yellow LED chip, a green LED chip, a cyan LED chip and a blue LED chip, or a red LED chip, an orange LED chip, a yellow LED chip, a green LED chip, a cyan LED chip and a blue LED chip, wherein the peak wavelength range of the red LED chip is 615 nm-635 nm, the peak wavelength range of the yellow LED chip is 560 nm-580 nm, the peak wavelength range of the green LED chip is 510 nm-530 nm, the peak wavelength range of the blue LED chip is 445 nm-465 nm, the peak wavelength range of the orange LED chip is 590 nm-610 nm, the peak wavelength range of the cyan LED chip is 480 nm-500 nm, and the synthesized white light of at least four different primary colors can realize spectrum adjustability.
Further, the first high-reflectivity reflective coating and the third high-reflectivity reflective coating are diffuse reflective coatings, and the materials of the first high-reflectivity reflective coating and the third high-reflectivity reflective coating are white glue, barium sulfate, a nanofiber film and a polyester resin composite material doped with high-concentration titanium dioxide (TiO 2) nano particles; the second high-reflectivity reflective coating is a specular reflective coating, and the second high-reflectivity reflective coating is made of one of chromium, silver and aluminum. As shown in fig. 3, the purpose of the high reflectivity reflective coating arrangement is to: the light extraction of the large visual angle light emission is realized, the light extraction efficiency is further improved due to the segmented arrangement, and in addition, the diffuse reflection coating has strong light scattering property, and the light propagation direction is changed, so that the light mixing is enhanced.
Further, the geometric relationship between the thickness characteristic dimension D0 of the first high-reflectivity reflective coating on the surface of the packaging substrate and the thickness characteristic dimension D1 of the chip and the thickness characteristic dimension D2 of the die bonding layer is d0 less than or equal to d1+d2, as shown in fig. 3, by improving the reflectivity of the surface of the packaging substrate and avoiding the light absorption of the side wall of the chip, the light extraction efficiency is improved, and the secondary light extraction of the light emitted from the inside of the packaging structure is realized.
Further, the relationship between the shortest distance characteristic dimension R0 of the center of the bottom of the bowl cup support and the characteristic dimension R of the largest radius of the bonding pad area is that R0 is more than or equal to R, an included angle alpha=90 DEG-150 DEG between the side wall of the bowl cup support and the plane of the packaging substrate, the accommodating cavity of the bowl cup support is one of a prismatic table shape, a round table shape, a prismatic table and a round table combined shape, and the upper surface of the bowl cup support and the upper surface of the second packaging adhesive layer are located on the same horizontal plane.
Further, the inner wall of the bowl cup support is divided into two parts by the cross section perpendicular to the central axis, a second high-reflectivity reflective coating is arranged at a part close to the bottom of the bowl cup support, the other part is a third high-reflectivity reflective coating, as shown in fig. 3, the second high-reflectivity reflective coating is used for realizing extraction of light emitted from a large viewing angle, the third high-reflectivity reflective coating can further improve light extraction efficiency, light mixing is considered, the relationship between the vertical height characteristic dimension d1 of the second high-reflectivity reflective coating area and the thickness characteristic dimension h1 of the first packaging adhesive layer is d1=h1+d0, and the relationship between the vertical height characteristic dimension d2 of the third high-reflectivity reflective coating area and the thickness characteristic dimension h2 of the second packaging adhesive layer is d2=h2.
Further, the first packaging adhesive layer and the second packaging adhesive layer are made of one of high-light-transmittance epoxy resin, silica gel and polyurethane, the refractive index n1 of the first packaging adhesive layer is 1.48-1.54, the refractive index n2 of the second packaging adhesive layer is 1.41-1.48, fresnel loss is reduced through the packaging adhesive layer with gradient refractive index change, and primary light extraction efficiency is improved; the relation between the thickness characteristic dimension h1 of the first packaging adhesive layer and the distance characteristic dimension r1 from the center of the upper surface of the first packaging adhesive layer to the inner wall of the bowl cup support is h1> r 1/(tan (arcsin (n 2/n 1))), the relation between the thickness characteristic dimension h2 of the second packaging adhesive layer and the distance characteristic dimension r2 from the center of the upper surface of the second packaging adhesive layer to the inner wall of the bowl cup support is h2> r 2/(tan (arcsin (1/n 2))), and as shown in fig. 3, the thicknesses of the two packaging adhesive layers are adjusted through the refractive index of the packaging adhesive layer, so that the light rays directly emitted from a small visual angle cannot be totally reflected on the top light-emitting surface, and the primary light extraction efficiency is improved.
Further, a concave or convex microstructure array is disposed on the surface of the second packaging glue layer, wherein the shape of the microstructure includes but is not limited to sphere, ellipsoid, cone and pyramid, and the arrangement mode of the microstructure array includes but is not limited to rectangle, staggered rectangle, hexagon and circle, as shown in fig. 3, the microstructure array of the light emitting surface can break total reflection, improve primary light extraction efficiency, and change the propagation direction of light to realize light mixing.
The second object of the present invention is achieved by:
a method for preparing a fluorescent powder-free multi-primary LED planar packaging structure comprises the following steps,
a: preparing a plurality of LED chips with different primary colors, and connecting the LED chips which are placed at intervals with a packaging substrate through a die bonding layer;
b: adopting a wire bonding process, and connecting an upper electrode of the LED chip with a circuit on the packaging substrate through gold wires, aluminum wires, copper wires or silver wires to realize electric connection;
c: coating a second high-reflectivity reflecting coating and a third high-reflectivity reflecting coating on the inner wall of the bowl and cup bracket, and fixing the bowl and cup bracket on the packaging substrate;
d: coating a first high-reflectivity reflecting coating on the surface of the packaging substrate and the complementary area of the LED chip by adopting a spot coating or printing process;
e: preparing a first packaging adhesive layer, manufacturing the first packaging adhesive layer in the accommodating cavity by adopting a spot coating process, and heating the first packaging adhesive layer to realize solidification of the first packaging adhesive layer;
f: preparing a second packaging adhesive layer, preparing the second packaging adhesive layer above the first packaging adhesive layer in the accommodating cavity by adopting a spot coating process, preparing a microstructure array on the upper surface of the second packaging adhesive layer through die imprinting, heating the whole packaging module to realize the solidification of the second packaging adhesive layer, and removing the microstructure array die to obtain a finished product.
Compared with the prior art, the technical scheme provided by the invention has the following advantages:
1. the multi-primary color LED chip is adopted to directly synthesize white light, so that the damage of blue light is reduced, the problems of light effect reduction and color drift caused by using fluorescent powder are solved, the spectrum is adjustable, and the green healthy high-quality LED illumination is truly realized;
2. according to the fluorescent powder-free multi-primary-color LED planar packaging structure, the Fresnel loss and the critical angle total reflection loss are reduced by utilizing the two layers of packaging adhesive layers with gradient refractive indexes and specific thickness, and meanwhile, the microstructure array is arranged on the light emitting surface, so that the total reflection is broken, the direct emission of light rays with small visual angles is ensured, and the primary light extraction efficiency is greatly improved; the high-reflectivity reflective coating on the side wall of the bowl-cup bracket is utilized to realize the extraction of light emitted from a large visual angle, and part of the area is set to be in specular reflection, so that the light extraction efficiency is further improved; the diffuse reflection coating is arranged on the surface of the packaging substrate, so that the secondary light extraction efficiency of the light emitted from the inside of the packaging structure is improved;
3. the fluorescent powder-free multi-primary-color LED plane packaging structure provided by the invention has stronger light scattering property by utilizing the diffuse reflection coating, and changes the light propagation direction, thereby enhancing the light mixing; arranging a microstructure array on the light-emitting surface, changing the propagation direction of light, and enhancing light mixing;
4. the preparation method of the fluorescent powder-free multi-primary-color LED planar structure provided by the invention avoids the use of fluorescent powder, improves the suitability of the multi-primary-color LED packaging structure and a secondary optical element, and can solve the problems of low light extraction efficiency and poor spatial color uniformity of the traditional planar packaging method.
Drawings
FIG. 1 is a schematic diagram of the light extraction principle of the conventional non-phosphor multi-primary LED planar package;
FIG. 2 is a schematic diagram of the color separation principle of the prior multi-primary LED light source without fluorescent powder;
FIG. 3 is a schematic diagram of light extraction and mixing of a phosphor-free multi-primary LED planar package structure according to the present invention;
FIG. 4 is a cross-sectional front view of a multi-primary LED package structure without phosphor according to embodiment 1 of the present invention;
fig. 5 is a schematic diagram of the distribution of LED chips with four primary colors according to embodiment 1 of the present invention;
FIG. 6 is a schematic spectrum diagram of implementing 2000K-50000K different color temperature changes for a four primary LED light source according to embodiment 1 of the present invention;
fig. 7 is a schematic diagram of the distribution of five primary color LED chips according to embodiment 2 of the present invention;
FIG. 8 is a spectrum diagram and CIE chromaticity diagram of a five-primary LED light source of example 2 of the present invention at a color temperature of 4800K;
fig. 9 is a schematic diagram of a distribution of six primary color LED chips according to embodiment 3 of the present invention;
FIG. 10 is a spectrum and CIE chromaticity diagram of a six primary color LED light source of example 3 of the present invention at a color temperature of 3639K;
FIG. 11 is a top view (a) and a three-dimensional schematic (b) of a phosphor-free multi-primary LED planar package housing cavity according to embodiment 4 of the present invention;
FIG. 12 is a cross-sectional front view of a multi-primary LED package structure without phosphor according to embodiment 5 of the present invention;
fig. 13 is a top view (a) and a front view (b) of a surface microstructure array of a phosphor-free multi-primary LED planar package structure according to embodiment 6 of the present invention.
Detailed Description
The invention will now be described in more detail by means of examples, which are given for illustrative purposes only and are not intended to limit the scope of the invention.
Example 1:
as shown in fig. 4, the fluorescent powder-free multi-primary-color LED planar packaging structure comprises a packaging substrate 101, four LED chips 102 with different primary colors, a die bonding layer 103, a lead 104, a first high-reflectivity reflective coating 105, a second high-reflectivity reflective coating 106, a third high-reflectivity reflective coating 107, a bowl cup support 108, a first packaging adhesive layer 109 and a second packaging adhesive layer 110, wherein the LED chips 102 are mounted on the packaging substrate 101 through the die bonding layer 103, each LED chip 102 is in circuit connection with the packaging substrate 101 through the lead 104, a first high-reflectivity reflective coating 105 is arranged in a region complementary to the LED chips 102 on the surface of the packaging substrate 101, the bowl cup support 108 is fixedly mounted at the edge of the upper surface of the packaging substrate 101, a containing cavity 108a is arranged in the middle of the bowl cup support 108, the second high-reflectivity reflective coating 106 and the third high-reflectivity reflective coating 107 are arranged in the containing cavity 108a of the upper surface of the packaging substrate 101, the first packaging adhesive layer 109 is covered with the second packaging adhesive layer 110, and the upper surface of the second packaging adhesive layer 110 is a planar array 110 is arranged on the upper surface of the micro-planar structure.
A bonding pad area for realizing the fixation and electrical connection of the LED chip 102 is arranged on the surface of the packaging substrate 101, and the packaging substrate 101 is a ceramic substrate; in order to better explain the four LED chips 102 with different primary colors, as shown in fig. 5, the four LED chips 102 with different primary colors are a red LED chip 102R, a yellow LED chip 102Y, a green LED chip 102G, and a blue LED chip 102B, where the peak wavelength of the red LED chip 102R is 650nm, the peak wavelength of the yellow LED chip 102Y is 579nm, the peak wavelength of the green LED chip 102G is 529nm, the peak wavelength of the blue LED chip 102B is 459nm, and the spectrum of the white light synthesized by the four primary colors is adjustable.
As shown in fig. 4, the first high-reflectivity reflective coating 105 on the surface of the package substrate 101 is diffusely reflective, the material is white glue, the geometric relationship between the thickness characteristic dimension d0=0.11 mm of the first high-reflectivity reflective coating 105 and the thickness characteristic dimension d1=0.1 mm of the LED chip 102, and the thickness characteristic dimension d2=0.01 mm of the die bonding layer 103 is d0=d1+d2, by improving the reflectivity of the surface of the package substrate 101 and avoiding the absorption of the chip side wall, the light extraction efficiency is improved, and the surface of the first high-reflectivity reflective coating 105 on the interface portion between the surface of the package substrate 101 and the inner wall of the bowl-cup bracket 108 is arc-shaped, and the arc-shaped structure enhances the light extraction and simultaneously enhances the light mixing.
As shown in fig. 4, the relationship between the shortest distance characteristic dimension r0=1 mm between the bottom center of the bowl and cup support 108 and the inner wall of the bowl and cup support 108 and the characteristic dimension r=0.8 mm of the largest radius of the bonding pad area is R0> R, the included angle α=110° between the side wall of the bowl and cup support 108 and the plane of the package substrate 101, the accommodating cavity 108a of the bowl and cup support 108 is in a truncated cone shape, and the upper surface of the bowl and cup support 108 and the upper surface of the second package adhesive layer 110 are located on the same horizontal plane.
As shown in fig. 4, the inner wall of the bowl-cup support 108 is divided into two parts by a cross section perpendicular to the central axis, a second high-reflectivity reflective coating 106 is arranged at a part close to the bottom of the bowl-cup support 108, the second high-reflectivity reflective coating 106 is made of a specular reflection made of silver, the other part is a third high-reflectivity reflective coating 107, the third high-reflectivity reflective coating 107 is made of a diffuse reflection made of barium sulfate, the two high-reflectivity reflective coatings can achieve extraction of light with a large viewing angle, the second high-reflectivity reflective coating 106 is made of a specular reflection, light extraction efficiency can be further improved, in addition, the diffuse reflective coating has a strong light scattering property, the light propagation direction is changed, and therefore mixed light is enhanced, wherein the relationship between the vertical height characteristic dimension d1=0.63 mm of the area of the second high-reflectivity reflective coating 106 and the thickness characteristic d1=0.52 mm of the first encapsulation glue layer 109, the thickness characteristic d0=0.11 mm of the first high-reflectivity reflective coating 105 is d1=h1+d0, and the thickness characteristic d2=2mm of the third high-reflectivity reflective coating area 107 is provided with the thickness characteristic d1=2d2.7mm of the second encapsulation glue layer.
As shown in fig. 4, the materials of the first packaging adhesive layer 109 and the second packaging adhesive layer 110 are both silica gel, the refractive index n1 of the first packaging adhesive layer 109 is 1.54, the refractive index n2 of the second packaging adhesive layer 110 is 1.41, fresnel loss can be reduced through the packaging adhesive layer with gradient change of refractive index, and primary light extraction efficiency is improved; the relation between the thickness characteristic dimension h1=0.52 of the first packaging adhesive layer 109 and the distance characteristic dimension r1=1.19 mm from the center of the upper surface of the first packaging adhesive layer 109 to the inner wall of the bowl cup support 108 is h1> r 1/(tan (arcsin (n 2/n 1))), the relation between the thickness characteristic dimension h2=1.87 mm of the second packaging adhesive layer 110 and the distance characteristic dimension r2=1.87 mm from the center of the upper surface of the second packaging adhesive layer 110 to the inner wall of the bowl cup support 108 is h2> r 2/(tan (arcsin (1/n 2))), the critical angle of incident light is determined through the refractive index of the packaging adhesive layer, and the thicknesses of the two packaging adhesive layers are adjusted, so that the purpose is to ensure that light rays directly emitted from a small viewing angle cannot be totally reflected on the top emergent surface, and the primary light extraction efficiency is improved.
As shown in fig. 4, a convex spherical microstructure array 110a is disposed on the surface of the second packaging adhesive layer 110, where the microstructure array 110a is arranged in a hexagonal manner, and the microstructure array 110a on the light emitting surface can break total reflection, so as to improve primary light extraction efficiency.
The preparation method of the fluorescent powder-free multi-primary-color LED planar packaging structure comprises the following specific implementation steps:
a: preparing a red LED chip 102R with a peak wavelength of 650nm, a yellow LED chip 102Y with a peak wavelength of 579nm, a green LED chip 102G with a peak wavelength of 529nm and a blue LED chip 102B with a peak wavelength of 459nm, and connecting the four LED chips 102 placed at intervals with the package substrate 101 through the die bonding layer 103;
b: an electrode on the LED chip 102 is connected with a circuit on the packaging substrate 101 through a gold wire 104 by adopting a wire bonding process, so that electric connection is realized;
c: a second high-reflectivity reflecting coating 106 with a silver mirror surface reflecting material and a third high-reflectivity reflecting coating 107 with a barium sulfate diffuse reflecting material are coated on the wall in the bowl and cup support 108, and the bowl and cup support 108 is fixed on the packaging substrate 101;
d: coating a first high-reflectivity reflective coating 105 made of white glue on the surface of the packaging substrate 101 and complementary areas of the four LED chips 102 by adopting a spot coating process;
e: preparing a first packaging adhesive layer 109 with a refractive index n1 of 1.54, manufacturing the first packaging adhesive layer 109 in the accommodating cavity 108a by adopting a spot coating process, and heating the first packaging adhesive layer 109 to realize the solidification of the first packaging adhesive layer 109;
f: preparing a second packaging adhesive 110 with a refractive index n2 of 1.41, preparing the second packaging adhesive layer 110 above the first packaging adhesive layer 109 in the accommodating cavity 108a by adopting a dispensing process, preparing a microstructure array 110a on the upper surface of the second packaging adhesive layer 110 by die imprinting, heating the whole packaging module to realize the solidification of the second packaging adhesive layer 110, and removing a microstructure array die to obtain the LED packaging module.
Fig. 6 is a spectrum diagram of different color temperatures (2000K, 3000K, 4000K, 5000K) realized by adjusting the current of different primary color chips to achieve different ratios of light power according to embodiment 1 of the present invention.
Example 2:
example 2 is substantially identical to the phosphor-free multi-primary LED planar package structure of example 1 and the method of fabrication, except that:
the types and numbers of the multi-primary LED chips are different, as shown in fig. 7, the multi-primary LED chip of embodiment 2 includes five LED chips with different dominant wavelengths, namely: one red light LED chip 21 with the dominant wavelength of 620nm, one yellow light LED chip 22 with the dominant wavelength of 565nm, one green light LED chip 23 with the dominant wavelength of 520nm, one green light LED chip 24 with the dominant wavelength of 490nm, one blue light LED chip 25 with the dominant wavelength of 450nm, and the LED chips with different dominant wavelengths are distributed at intervals.
The preparation method of the fluorescent powder-free multi-primary-color LED planar packaging structure comprises the following specific implementation steps:
a: preparing a red light LED chip 21 with a dominant wavelength of 620nm, a yellow light LED chip 22 with a dominant wavelength of 565nm, a green light LED chip 23 with a dominant wavelength of 520nm, a green light LED chip 24 with a dominant wavelength of 490nm and a blue light LED chip 25 with a dominant wavelength of 450nm, and connecting five LED chips placed at intervals with a packaging substrate through a crystal fixing layer;
b: adopting a wire bonding process, and connecting an electrode on the chip with a circuit on the packaging substrate through a gold wire to realize electric connection;
c: the inner wall of the bowl and cup bracket is coated with a second high-reflectivity reflecting coating with a silver mirror surface reflecting material and a third high-reflectivity reflecting coating with a barium sulfate diffuse reflecting material, and the bowl and cup bracket is fixed on the packaging substrate;
d: coating a first high-reflectivity reflective coating which is white glue on the surface of the packaging substrate and the complementary areas of the five LED chips by adopting a spot coating process;
e: preparing a first packaging adhesive with a refractive index n1 of 1.54, manufacturing a first packaging adhesive layer in the accommodating cavity by adopting a spot coating process, and heating the first packaging adhesive layer to realize the solidification of the first packaging adhesive layer;
f: preparing a second packaging adhesive with the refractive index n2 of 1.41, preparing the second packaging adhesive layer above the first packaging adhesive layer in the accommodating cavity by adopting a spot coating process, preparing a microstructure array on the upper surface of the second packaging adhesive layer through die imprinting, heating the whole packaging module to realize the solidification of the second packaging adhesive layer, and removing a microstructure array die to obtain the LED packaging module.
Fig. 8 shows the spectrum and CIE chromaticity diagram of the five-primary LED at a color temperature of 4800K.
Example 3:
example 3 is substantially identical to the phosphor-free multi-primary LED planar package structure and the manufacturing method of example 1, except that:
the types and numbers of the multi-primary LED chips are different, as shown in fig. 9, and the multi-primary LED chip of embodiment 3 includes six chips with different dominant wavelengths, namely: one red light LED chip 31 with the dominant wavelength of 630nm, one orange light LED chip 32 with the dominant wavelength of 590nm, one yellow light LED chip 33 with the dominant wavelength of 560nm, one green light LED chip 34 with the dominant wavelength of 530nm, one green light LED chip 35 with the dominant wavelength of 480nm, one blue light LED chip 36 with the dominant wavelength of 460nm, and the LED chips with different dominant wavelengths are distributed at intervals.
The preparation method of the fluorescent powder-free multi-primary-color LED planar packaging structure comprises the following specific implementation steps:
a: preparing a red light LED chip 31 with a dominant wavelength of 630nm, an orange light LED chip 32 with a dominant wavelength of 590nm, a yellow light LED chip 33 with a dominant wavelength of 560nm, a green light LED chip 34 with a dominant wavelength of 530nm, a green light LED chip 35 with a dominant wavelength of 480nm and a blue light LED chip 36 with a dominant wavelength of 460nm, and connecting six LED chips placed at intervals with a packaging substrate through a crystal fixing layer;
b: adopting a wire bonding process, and connecting an electrode on the chip with a circuit on the packaging substrate through a gold wire to realize electric connection;
c: the inner wall of the bowl and cup bracket is coated with a second high-reflectivity reflecting coating with a silver mirror surface reflecting material and a third high-reflectivity reflecting coating with a barium sulfate diffuse reflecting material, and the bowl and cup bracket is fixed on the packaging substrate;
d: coating a first high-reflectivity reflective coating which is white glue on the surface of the packaging substrate and the complementary areas of the six LED chips by adopting a spot coating process;
e: preparing a first packaging adhesive with a refractive index n1 of 1.54, manufacturing a first packaging adhesive layer in the accommodating cavity by adopting a spot coating process, and heating the first packaging adhesive layer to realize the solidification of the first packaging adhesive layer;
f: preparing a second packaging adhesive with the refractive index n2 of 1.41, preparing the second packaging adhesive layer above the first packaging adhesive layer in the accommodating cavity by adopting a spot coating process, preparing a microstructure array on the upper surface of the second packaging adhesive layer through die imprinting, heating the whole packaging module to realize the solidification of the second packaging adhesive layer, and removing a microstructure array die to obtain the LED packaging module.
Fig. 10 shows the spectrum and CIE chromaticity diagram of a six-primary LED at a color temperature of 4800K.
Example 4:
example 4 is substantially identical to the phosphor-free multi-primary LED planar package structure and the manufacturing method of example 1, except that:
the accommodating cavities of the bowl and cup support are different, as shown in fig. 11, the accommodating cavity 408a of the bowl and cup support 408 is in a shape of a combination of a prismatic table and a circular table, the prismatic table of the accommodating cavity 408a, which is close to the packaging substrate, is connected with the circular table at the top, the shape of the joint surface of the accommodating cavity 408a and the packaging substrate is quadrilateral, and the upper surface is circular, so that the area of the bottom of the accommodating cavity 408a is reduced, and meanwhile, the light emitting surface is kept circular, so that high light extraction efficiency and light type control are realized.
Example 5:
example 5 is substantially identical to the phosphor-free multi-primary LED planar package structure and the method of fabrication of example 1, except that:
the first high-reflectivity reflective coating 505 on the surface of the packaging substrate 501 is diffusely reflective, the material is a polyester resin composite material doped with high-concentration titanium dioxide (TiO 2) nano particles, the surface is a plane, and the secondary light extraction efficiency of the light emitted from the inside of the packaging structure is improved. In addition, the included angle between the side wall of the bowl cup bracket 508 and the plane of the package substrate 501 is different, the refractive indexes of the first package adhesive layer and the second package adhesive layer are different from the vertical height, as shown in fig. 12, the included angle α=100° between the side wall of the bowl cup bracket 508 and the plane of the package substrate 501, the refractive index n1 of the first package adhesive layer 509 is 1.5, the refractive index n2 of the second package adhesive layer 510 is 1.4, fresnel loss is reduced by the package adhesive layer with gradient change of refractive index, and the primary light extraction efficiency is improved; the relation between the thickness characteristic dimension h1=0.42 mm of the first encapsulation glue layer 509 and the distance characteristic dimension r1=1.07 mm from the center of the upper surface of the first encapsulation glue layer 509 to the inner wall of the bowl cup support 508 is h1> r 1/(tan (arcsin (n 2/n 1))), the relation between the thickness characteristic dimension h2=1.27 mm of the second encapsulation glue layer 510 and the distance characteristic dimension r2=1.29 mm from the center of the upper surface of the second encapsulation glue layer 510 to the inner wall of the bowl cup support 508 is h2> r 2/(tan (arcsin (1/n 2))), the critical angle of incident light is determined through the refractive index of the encapsulation glue layers, the thicknesses of the two encapsulation glue layers are adjusted, total reflection is reduced, and the primary light extraction efficiency is improved.
The preparation method of the fluorescent powder-free multi-primary-color LED planar packaging structure comprises the following specific implementation steps:
a: preparing a red light LED chip with a peak wavelength of 650nm, a yellow light LED chip with a peak wavelength of 579nm, a green light LED chip with a peak wavelength of 529nm and a blue light LED chip with a peak wavelength of 459nm, and connecting the four LED chips which are arranged at intervals with a packaging substrate through a die bonding layer;
b: adopting a wire bonding process, and connecting an electrode on the chip with a circuit on the packaging substrate through a gold wire to realize electric connection;
c: the inner wall of the bowl and cup bracket is coated with a second high-reflectivity reflecting coating with a silver mirror surface reflecting material and a third high-reflectivity reflecting coating with a barium sulfate diffuse reflecting material, and the bowl and cup bracket is fixed on the packaging substrate;
d: coating a first high-reflectivity reflective coating of a polyester resin composite material doped with high-concentration titanium dioxide (TiO 2) nano particles on the surface of the packaging substrate and the complementary areas of the four LED chips by adopting a spot coating process;
e: preparing a first packaging adhesive with a refractive index n1 of 1.5, manufacturing a first packaging adhesive layer in the accommodating cavity by adopting a spot coating process, and heating the first packaging adhesive layer to realize the solidification of the first packaging adhesive layer;
f: preparing a second packaging adhesive with the refractive index n2 of 1.4, preparing the second packaging adhesive layer above the first packaging adhesive layer in the accommodating cavity by adopting a spot coating process, preparing a microstructure array on the upper surface of the second packaging adhesive layer through die imprinting, heating the whole packaging module to realize the solidification of the second packaging adhesive layer, and removing a microstructure array die to obtain the LED packaging module.
Example 6:
example 6 is substantially identical to the phosphor-free multi-primary LED planar package structure and the manufacturing method of example 1, except that:
as shown in fig. 13 (a), a protruding pyramid microstructure array 610a is disposed on the surface of the second packaging adhesive layer, and the microstructure array 610a is arranged in a rectangular manner, as shown in fig. 13 (b), the microstructure array 610a on the light emitting surface can break total reflection, so as to improve primary light extraction efficiency.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A fluorescent powder-free multi-primary-color LED plane packaging structure is characterized in that: including package substrate, a plurality of LED chips of different primary colors, die bonding layer, lead wire, first high reflectivity reflection coating, second high reflectivity reflection coating, third high reflectivity reflection coating, bowl cup support, first encapsulation glue film, second encapsulation glue film, characterized by: the LED chips are arranged on the packaging substrate through the die bonding layers (each LED chip is connected with the packaging substrate through a lead wire in a circuit way, a first high-reflectivity reflecting coating is arranged in a complementary area of the surface of the packaging substrate and the LED chips, a bowl cup support is fixedly arranged at the edge of the upper surface of the packaging substrate, a containing cavity is arranged in the middle of the bowl cup support, a second high-reflectivity reflecting coating and a third high-reflectivity reflecting coating are arranged on the inner wall of the bowl cup support from bottom to top, a first packaging adhesive layer is arranged in the containing cavity on the upper surface of the packaging substrate, a second packaging adhesive layer is covered on the first packaging adhesive layer, the upper surface of the second packaging adhesive layer is a plane, and a microstructure array is arranged on the plane.
2. The phosphor-free multi-primary LED planar package structure of claim 1, wherein: the packaging substrate is one of a ceramic substrate, a copper substrate and an aluminum substrate.
3. The phosphor-free multi-primary LED planar package structure of claim 1, wherein: the LED chips with different primary colors are a red LED chip, a yellow LED chip, a green LED chip and a blue LED chip, or a red LED chip, a yellow LED chip, a green LED chip, a cyan LED chip and a blue LED chip, or a red LED chip, an orange LED chip, a yellow LED chip, a green LED chip, a cyan LED chip and a blue LED chip, wherein the peak wavelength range of the red LED chip is 615 nm-635 nm, the peak wavelength range of the orange LED chip is 590 nm-610 nm, the peak wavelength range of the yellow LED chip is 560 nm-580 nm, the peak wavelength range of the green LED chip is 510 nm-530 nm, the peak wavelength range of the cyan LED chip is 480 nm-500 nm, and the peak wavelength range of the blue LED chip is 445 nm-465 nm.
4. The phosphor-free multi-primary LED planar package structure of claim 1, wherein: the first high-reflectivity reflective coating and the third high-reflectivity reflective coating are diffuse reflective coatings, and the materials of the first high-reflectivity reflective coating and the third high-reflectivity reflective coating are white glue, barium sulfate, nanofiber films and polyester resin composite materials doped with high-concentration titanium dioxide nanoparticles; the second high-reflectivity reflective coating is a specular reflective coating, and the second high-reflectivity reflective coating is made of one of chromium, silver and aluminum.
5. The phosphor-free multi-primary LED planar package structure of claim 1, wherein: the geometric relation between the thickness characteristic dimension D0 of the first high-reflectivity reflective coating on the surface of the substrate, the thickness characteristic dimension D1 of the chip and the thickness characteristic dimension D2 of the die bonding layer is d0 less than or equal to d1+d2.
6. The phosphor-free multi-primary LED planar package structure of claim 1, wherein: the relation between the shortest distance characteristic dimension R0 of the center of the bottom of the bowl and cup support and the maximum radius characteristic dimension R of the packaging substrate bonding pad area is that R0 is more than or equal to R, an included angle alpha=90-150 DEG between the side wall of the bowl and cup support and the packaging substrate plane is formed, the accommodating cavity of the bowl and cup support is one of a prismatic table shape, a round table shape, a prismatic table and a round table combined shape, and the upper surface of the bowl and cup support and the upper surface of the second packaging adhesive layer are located on the same horizontal plane.
7. The phosphor-free multi-primary LED planar package structure of claim 1, wherein: the inner wall of the bowl and cup support is divided into two parts by a cross section perpendicular to the central axis, a second high-reflectivity reflecting coating is arranged at the bottom part close to the bowl and cup support, a third high-reflectivity reflecting coating is arranged at the other part, the relation between the vertical height characteristic dimension d1 of the second high-reflectivity reflecting coating area and the thickness characteristic dimension h1 of the first packaging adhesive layer is d1=h1+d0, and the relation between the vertical height characteristic dimension d2 of the third high-reflectivity reflecting coating area and the thickness characteristic dimension h2 of the second packaging adhesive layer is d2=h2.
8. The phosphor-free multi-primary LED planar package structure of claim 1, wherein: the material of the first packaging adhesive layer and the second packaging adhesive layer is one of high-light-transmittance epoxy resin, silica gel and polyurethane, the refractive index n1 of the first packaging adhesive layer is 1.48-1.54, the refractive index n2 of the second packaging adhesive layer is 1.41-1.48, the relation between the thickness characteristic dimension h1 of the first packaging adhesive layer and the distance characteristic dimension r1 from the center of the upper surface of the first packaging adhesive layer to the inner wall of the bowl support is h1> r 1/(tan (arcsin (n 2/n 1)), and the relation between the thickness characteristic dimension h2 of the second packaging adhesive layer and the distance characteristic dimension r2 from the center of the upper surface of the second packaging adhesive layer to the inner wall of the bowl support is h2> r 2/(tan (arcsin (1/n 2)).
9. The phosphor-free multi-primary LED planar package structure of claim 1, wherein: the surface of the second packaging adhesive layer is provided with a concave or convex microstructure array, wherein the shape of the microstructure comprises but is not limited to a sphere, an ellipsoid, a cone and a pyramid, and the arrangement mode of the microstructure array comprises but is not limited to a rectangle, a staggered rectangle, a hexagon and a circle.
10. A preparation method of a fluorescent powder-free multi-primary-color LED planar packaging structure is characterized by comprising the following steps: comprises the steps of,
a: preparing a plurality of LED chips with different primary colors, and connecting the LED chips which are placed at intervals with a packaging substrate through a die bonding layer;
b: adopting a wire bonding process, and connecting an upper electrode of the LED chip with a circuit on the packaging substrate through gold wires, aluminum wires, copper wires or silver wires to realize electric connection;
c: coating a second high-reflectivity reflecting coating and a third high-reflectivity reflecting coating on the inner wall of the bowl and cup bracket, and fixing the bowl and cup bracket on the packaging substrate;
d: coating a first high-reflectivity reflecting coating on the surface of the packaging substrate and the complementary area of the LED chip by adopting a spot coating or printing process;
e: preparing a first packaging adhesive layer, manufacturing the first packaging adhesive layer in the accommodating cavity by adopting a spot coating process, and heating the first packaging adhesive layer to realize solidification of the first packaging adhesive layer;
f: preparing a second packaging adhesive layer, preparing the second packaging adhesive layer above the first packaging adhesive layer in the accommodating cavity by adopting a spot coating process, preparing a microstructure array on the upper surface of the second packaging adhesive layer through die imprinting, heating the whole packaging module to realize the solidification of the second packaging adhesive layer, and removing the microstructure array die to obtain a finished product.
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