CN116543955A - Enameled wire and preparation method thereof - Google Patents
Enameled wire and preparation method thereof Download PDFInfo
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- CN116543955A CN116543955A CN202310561747.3A CN202310561747A CN116543955A CN 116543955 A CN116543955 A CN 116543955A CN 202310561747 A CN202310561747 A CN 202310561747A CN 116543955 A CN116543955 A CN 116543955A
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- Prior art keywords
- wire
- layer
- enameled wire
- core material
- polytetrafluoroethylene
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- 238000002360 preparation method Methods 0.000 title abstract description 5
- 239000003973 paint Substances 0.000 claims abstract description 42
- 239000004696 Poly ether ether ketone Substances 0.000 claims abstract description 26
- 229920002530 polyetherether ketone Polymers 0.000 claims abstract description 26
- -1 polytetrafluoroethylene Polymers 0.000 claims abstract description 25
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 25
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 25
- 239000004020 conductor Substances 0.000 claims abstract description 24
- 229920006259 thermoplastic polyimide Polymers 0.000 claims abstract description 20
- 239000000203 mixture Substances 0.000 claims abstract description 11
- 239000011162 core material Substances 0.000 claims description 23
- 229920001721 polyimide Polymers 0.000 claims description 16
- 239000004642 Polyimide Substances 0.000 claims description 13
- 210000003298 dental enamel Anatomy 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 238000003490 calendering Methods 0.000 claims description 12
- 239000000047 product Substances 0.000 claims description 11
- 238000000137 annealing Methods 0.000 claims description 9
- 238000005096 rolling process Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000000155 melt Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000010422 painting Methods 0.000 claims description 4
- 239000011265 semifinished product Substances 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 230000001050 lubricating effect Effects 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000005491 wire drawing Methods 0.000 claims description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 2
- 239000000839 emulsion Substances 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- 239000002966 varnish Substances 0.000 claims 4
- 238000012360 testing method Methods 0.000 description 10
- 239000004962 Polyamide-imide Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920002312 polyamide-imide Polymers 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
- H01B7/0208—Cables with several layers of insulating material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/06—Insulating conductors or cables
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Conductors (AREA)
Abstract
The embodiment of the invention discloses an enameled wire and a preparation method thereof. The enameled wire comprises a conductor, and a primer layer and a finish layer which are sequentially coated on the conductor from inside to outside, wherein the primer layer is made of thermoplastic polyimide paint, and the dielectric constant of the thermoplastic polyimide paint is 3.0; the top coat layer is prepared from the following components in percentage by mass: 70-80 wt% of polyether-ether-ketone, 20-30 wt% of polytetrafluoroethylene, and the relative dielectric constant of the mixture of polyether-ether-ketone and polytetrafluoroethylene is not more than 2.8; wherein the sum of the thicknesses of the primer layer and the finish layer on one side of the conductor is 0.10 mm-0.17 mm. According to the embodiment of the invention, the PDIV value of the enameled wire can be improved, and the thickness of the insulating layer is basically kept unchanged, so that the requirement of a high-voltage platform with the voltage of more than 800V can be met.
Description
Technical Field
The invention relates to the technical field of electromagnetic wires, in particular to an enameled wire and a preparation method thereof.
Background
The occurrence probability of corona corrosion is increased under a high-voltage platform of more than 800V, and the corona corrosion can generate a large amount of charged ions such as electrons and positive ions to strike at high energy and high speed, so that the problems of reduced mechanical strength of an insulating layer of an enameled wire, occurrence of pits, holes and the like of the insulating layer in a partial discharge area are caused. Enamelled wires in the related art can be manufactured by increasing the partial discharge initiation voltage (Partial Discharge Inception Voltage, PDIV) value of the enamelled wires; the PDIV value of the enameled wire is higher than the overcharge voltage in the operation of the motor, so that the phenomenon of insulation loss caused by partial discharge is avoided. For example, the insulation performance of the enamel wire is improved by increasing the thickness of the insulation layer thereof. However, increasing the thickness of the insulating layer beyond a certain range may instead reduce the slot filling rate of the motor winding, thereby limiting the electrical performance of the motor.
Disclosure of Invention
The invention aims to overcome the defects in the related art, provides an enameled wire and a preparation method thereof, and aims to improve the PDIV value of the enameled wire and simultaneously maintain the thickness of an insulating layer unchanged basically so as to meet the high-voltage platform requirement of the enameled wire above 800V.
In order to achieve the above purpose, the invention adopts the following technical scheme: providing an enameled wire, wherein the enameled wire comprises a conductor, and a primer layer and a finish layer which are sequentially coated on the conductor from inside to outside, the primer layer is made of thermoplastic polyimide paint, and the dielectric constant of the thermoplastic polyimide paint is 3.0; the finish paint layer is prepared from the following components in percentage by mass: 70-80 wt% of polyether-ether-ketone, 20-30 wt% of polytetrafluoroethylene, and the relative dielectric constant of the mixture of polyether-ether-ketone and polytetrafluoroethylene is not more than 2.8;
wherein the sum of the thicknesses of the primer layer and the top-coat layer on one side of the conductor is 0.10 mm-0.17 mm.
Alternatively, the polyether-ether-ketone is 75wt% and the polytetrafluoroethylene is 25wt%.
Optionally, the polyetheretherketone and polytetrafluoroethylene are mixed.
Optionally, the thermoplastic polyimide paint is selected from at least one of an aliphatic polyimide paint, a semiaromatic polyimide paint, or an aromatic polyimide paint.
Optionally, the conductor is low-oxygen copper with the concentration of 200 ppm-350 ppm.
The second invention provides a method for preparing the enameled wire, which comprises the following steps:
s1, drawing a round wire parent metal into a round wire core material suitable for calendaring by a calendaring machine through a triple single-die wire drawing machine;
s2, cleaning the surface of the round wire core material through an ultrasonic cleaning water tank, and annealing the round wire core material in an annealing furnace to remove residual stress and residual emulsion and/or greasy dirt;
s3, rolling the round wire core material into a flat wire core material through a rolling machine;
s4, uniformly coating thermoplastic polyimide paint on the outer peripheral surface of the flat wire core material, and after painting, sending the flat wire core material into a baking furnace for baking and curing to obtain an enameled wire semi-finished product;
s5, calendaring the semi-finished enameled wire product into an enameled wire semi-finished enameled wire product with the required width-to-thickness ratio through a calendaring machine;
s6, paying off the semi-finished enameled wire, preheating, extruding a mixture of polyether-ether-ketone and polytetrafluoroethylene on the primer layer in a melt extruder, painting, and then sending the painted mixture into a baking furnace for baking and curing so as to form the finish paint layer on the outer peripheral surface of the semi-finished enameled wire;
and S7, removing the wire rod from the burning furnace, naturally cooling and lubricating the wire rod, and then taking up the wire rod to obtain a finished enameled wire product.
Optionally, the annealing temperature in S2 is 400 ℃ to 650 ℃.
Optionally, the baking temperature in S4 is 300-450 ℃ and the baking speed is 5-60 m/min.
Optionally, the polyimide resin in the primer layer has a solid content of 25-40% and a coating amount of 4-5 times.
Optionally, the top coat layer is applied in an amount of 1 layer.
The embodiment of the invention has the beneficial effects that: compared with the prior art, the temperature of the modified polyether-ether-ketone extruded in the polyimide paint exceeds 400 ℃, the modified polyether-ether-ketone and the polytetrafluoroethylene are in a non-complete crystallization state, the polytetrafluoroethylene and the modified polyether-ether-ketone are both linear materials, and the polytetrafluoroethylene and the modified polyether-ether-ketone are physically crosslinked by utilizing a substance similar compatibility principle, so that the bonding degree of the primer layer 2 and the finish layer 3 can be well maintained even though an intermediate layer serving as an adhesive effect is omitted. In addition, compared with the relative dielectric constant of polyamide imide in the related art, the relative dielectric constant of the thermoplastic polyimide paint is reduced to 3.0 from original 4.5, namely the PD IV value is increased from original 200V to 400V, the overall PD IV value reflected on the enameled wire is increased from 1800V to 2000V, the thickness of the paint film is basically maintained unchanged, and the high-voltage platform requirement of the enameled wire above 800V can be met.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. Like elements or portions are generally identified by like reference numerals throughout the several figures. In the drawings, elements or portions thereof are not necessarily drawn to scale.
Fig. 1 shows a specific structure of the enamel wire according to the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other.
As the background art indicates, most of enamelled wires in the related art have a three-composite paint film structure, namely, a composite structure that a primer layer 2 adopts high-adhesion polyamide imide, an intermediate layer adopts corona-resistant polyamide imide or corona-resistant polyimide, and a finish layer 3 adopts oil-resistant and hydrolysis-resistant polyamide imide. The enameled wire adopting the composite structure is difficult to meet the high PDIV performance of the enameled wire required by a high-voltage platform with the voltage of more than 800V because the thickness of a paint film of the enameled wire is limited in order to ensure better power density. In view of this, the inventors of the present invention improved the paint film of the enamel wire, aiming at improving the PDIV value of the enamel wire while maintaining the thickness of the paint film substantially unchanged so as to satisfy the high-pressure plateau requirement of above 800V.
The invention is further described below with reference to the drawings and specific examples, which are not intended to be limiting.
Fig. 1 shows a specific structure of the enamel wire according to the present invention. Referring to the example shown in fig. 1, the enamel wire includes: the conductor 1 is sequentially coated with a primer layer 2 and a finish paint layer 3 on the periphery of the conductor 1 from inside to outside; wherein the primer layer 2 is made of thermoplastic polyimide paint, and the relative dielectric constant of the thermoplastic polyimide paint is 3.0; the finish paint layer 3 is prepared from the following components in percentage by mass: 70-80 wt% of polyether-ether-ketone, 20-30 wt% of polytetrafluoroethylene, and the relative dielectric constant of the mixture of polyether-ether-ketone and polytetrafluoroethylene is not more than 2.8. Compared with the enameled wire adopting the three-layer composite structure in the related art, the temperature exceeds 400 ℃ in the process of extruding the modified polyether-ether-ketone into the polyimide paint, the modified polyether-ether-ketone and the polytetrafluoroethylene are in a non-complete crystallization state, the polytetrafluoroethylene and the modified polyether-ether-ketone are both linear materials, and the polytetrafluoroethylene and the modified polyether-ether-ketone are physically crosslinked by utilizing a substance similar compatibility principle, so that the bonding degree of the primer layer 2 and the finish paint layer 3 can be well maintained even if an intermediate layer serving as a bonding effect is omitted. In addition, compared with the relative dielectric constant of polyamide imide in the related art, the relative dielectric constant of the thermoplastic polyimide paint is reduced to 3.0 from original 4.5, namely the PDIV value is increased from original 200V to 400V, the overall PDIV value reflected on the enameled wire is increased from 1800V to 2000V, the thickness of the paint film is basically maintained unchanged, and the high-voltage flat bench requirement of the enameled wire above 800V can be met.
The relative dielectric constants of the primer layer 2 and the topcoat layer 3 were measured at 23℃and a measurement frequency of 1 MHz. Specifically, each single film layer obtained in the following examples was cut into strips having a width of 2 mm/length of 100mm, and the relative dielectric constant at 1MHz was measured by a resonator perturbation method (dielectric constant measuring apparatus manufactured by Kanto electronic application development of Kabushiki Kaisha, network analyzer manufactured by Agilent Technologies Co., ltd.).
It should be noted here that the thicknesses of the primer layer 2 and the topcoat layer 3 on the outer side of the conductor 1 should satisfy: 0.1 mm-0.17 mm. This is because the primer layer 2 and the topcoat layer 3 do not have such a high PDIV value and are resistant to chemical corrosion, hydrolysis, radiation, etc. if the single-sided thickness is less than 0.1 mm. The single-side thickness of the primer layer 2 and the finish layer 3 is larger than 0.17mm, so that the electric performance of the motor winding is contributed, and the full slot ratio of the motor winding is reduced. Preferably, the thickness of the primer layer 2 and the top coat layer 3 on the outer side of the conductor 1 may be selected from any two numerical ranges of 0.12mm, 0.13mm, 0.14mm, 0.16mm, 0.17mm.
Continuing from fig. 1, it can be seen that in some embodiments of the invention, the conductor 1 has a flat rectangular cross-sectional shape, which may be selected from 200ppm to 350ppm low oxygen copper. Of course, it is understood that the material for forming the conductor 1 is not limited to low-oxygen copper, and may be any material having good electrical conductivity, for example, copper alloy, copper clad aluminum, silver, gold, galvanized iron, or the like. The shape of the conductor 1 is not particularly limited, and may be a regular shape other than a flat rectangle, for example, a circular shape.
In some embodiments of the present invention, the thermoplastic polyimide paint is selected from at least one of an aliphatic polyimide paint, a semiaromatic polyimide paint, or an aromatic polyimide paint. For example, the primer layer 2 is a heat-resistant grade 220-grade thermoplastic polyimide paint, which can enable the paint to be tightly combined with the conductor 1, effectively improves the adhesion of the enameled wire, and further improves the situation that the paint film is damaged when the wire is wound. Specifically, the thermoplastic polyimide paint comprises the following components in percentage by weight: 25% by weight of a polyimide resin, 54% by weight of N-methylpyrrolidone, 21% by weight of N-dimethylformamide; when the enameled wire is prepared, thermoplastic polyimide paint is coated on the surface of the conductor 1, and after high-temperature baking, an organic solvent in the thermoplastic polyimide paint volatilizes, and only one layer of polyimide particles is remained to coat the surface of the conductor 1, so that a primer layer 2 is formed.
According to another aspect of the present invention, there is provided a method for preparing the above enamel wire, comprising the steps of:
s1, placing a copper core (conductor) with the diameter of TR phi of 8.00mm on a wire coil, entering a continuous extruder through a guide wheel, manufacturing the conductor into a round wire parent metal through the continuous extruder, and drawing the round wire parent metal into a round wire core material suitable for calendaring by a calendaring machine through a triple single-die wire drawing machine;
s2, cleaning the surface of the round wire core material through an ultrasonic cleaning water tank, annealing the round wire core material in an annealing furnace at a speed of 5-60 m/min, and stewing the round wire core material in the annealing furnace at 400-650 ℃ to remove tensile stress, softening the round wire core material, and removing lubricant, greasy dirt and the like remained on the surface of the round wire core material in the drawing process;
s3, rolling the round wire core material into a flat wire core material through a rolling machine;
s4, coating a primer layer (composed of thermoplastic polyimide paint) with 25 weight percent of solid content for 4 times, sequentially threading the polycrystalline material painting dies one by one from small to large in a sintering furnace according to the process design of the primer layer, and curing the paint film coated outside the flat wire core material by adopting a high-number continuous single-head single-furnace enamelling machine (Suzhou co-creation company) with DV value of 30, wherein the temperature of an evaporation area of the drying furnace is 320 ℃, the temperature of a curing area of the drying furnace is 430 ℃, the rotating speed of a circulating fan is 3000 r/min, the rotating speed of a waste discharge fan is 4000 r/min, the speed of a row line is 5-60 m/min, so as to obtain an enameled wire semi-finished product;
s5, calendaring the semi-finished enameled wire product into an enameled wire semi-finished enameled wire product with the required width-to-thickness ratio through a calendaring machine;
s6, paying off the semi-finished enameled wire, and preheating; extruding a mixture of 75 weight percent of polyether-ether-ketone and 25 weight percent of polytetrafluoroethylene on a primer layer of an enameled wire semi-finished product in a melt extruder, designing the melt extruder according to the process of a finish layer, wherein the screw compression ratio of the melt extruder is 2.5:1, the screw rotating speed is 35-45 r/min, the melt extruder comprises six heating areas, the temperature of the first area is 313-317 ℃, the temperature of the third area is 323-317 ℃, the temperature of the fourth area is 333-337 ℃, the temperature of the fifth area is 343-347 ℃, and the temperature of the sixth area is 348-352 ℃;
before extruding the mixture of the polyether-ether-ketone and the polytetrafluoroethylene, stirring 25-35 min of 25-75 wt% of the polytetrafluoroethylene at the temperature of 110 ℃ to uniformly mix the polyether-ether-ketone and the polytetrafluoroethylene to obtain the mixture of the polyether-ether-ketone and the polytetrafluoroethylene;
s7, naturally cooling the wires in the air, lubricating the wires through a lubricating oil coating device, and then rolling the wires through a wire rolling machine, wherein the flat wires are tightly and uniformly rolled on the wire coil, and thus the enameled wire finished product is obtained.
The produced product passes through a PDIV testing instrument under the testing condition of 100PC discharge quantity, and the PDIV peak value is 2000. The enameled wire of the produced product meets the test method test of the insulation specification (GB/T2107-2008) requirement of three special asynchronous motors for variable frequency speed regulation.
In addition, table 1 shows the results of enamelled wires with a conductor diameter of 8.00mm produced by different process schemes.
TABLE 1
As can be seen from table 1 above:
(1) As is clear from a comparison of example 1 and example 2, while the ratio of the topcoat layer is kept unchanged, the PDIV test value is affected by the different types of primer layers, specifically, the PDIV test value is inversely related to the relative dielectric constants of the different types of primer layers, and as the relative dielectric constant of the primer layer decreases, the PDIV test value increases, and the two approaches a linear relationship.
(2) As can be seen from a comparison of example 1 and example 3, when the ratio of the primer layer is kept unchanged, the PDIV test value is inversely related to the relative dielectric constants of the top coat layers with different ratios, and as the relative dielectric constant of the top coat layers is reduced, the PDIV test value is increased, and the PDIV test value and the top coat layers are nearly in a linear relationship.
(3) As is clear from a comparison of example 1 and example 4, when the parameters are the same, an increase in the film thickness increases the PDIV test value, but an increase in the film thickness decreases the slot filling rate of the coil winding.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.
Claims (10)
1. The enameled wire is characterized by comprising a conductor, and a primer layer and a finish layer which are sequentially coated on the conductor from inside to outside, wherein the primer layer is made of thermoplastic polyimide paint, and the dielectric constant of the thermoplastic polyimide paint is 3.0; the finish paint layer is prepared from the following components in percentage by mass: 70-80 wt% of polyether-ether-ketone, 20-30 wt% of polytetrafluoroethylene, and the relative dielectric constant of the mixture of polyether-ether-ketone and polytetrafluoroethylene is not more than 2.8;
wherein the sum of the thicknesses of the primer layer and the top-coat layer on one side of the conductor is 0.10 mm-0.17 mm.
2. The wire according to claim 1, wherein the polyetheretherketone is 75wt% and the polytetrafluoroethylene is 25wt%.
3. The wire according to claim 2, wherein the polyetheretherketone and the polytetrafluoroethylene are mixed.
4. The wire enamel of claim 1 wherein the thermoplastic polyimide varnish is selected from at least one of an aliphatic polyimide varnish, a semiaromatic polyimide varnish, or an aromatic polyimide varnish.
5. The wire according to claim 1, wherein the conductor is selected from 200ppm to 350ppm of low oxygen copper.
6. A method of making the enamel wire according to any one of claims 1 to 5, comprising the steps of:
s1, drawing a round wire parent metal into a round wire core material suitable for calendaring by a calendaring machine through a triple single-die wire drawing machine;
s2, cleaning the surface of the round wire core material through an ultrasonic cleaning water tank, and annealing the round wire core material in an annealing furnace to remove residual stress and residual emulsion and/or greasy dirt;
s3, rolling the round wire core material into a flat wire core material through a rolling machine;
s4, uniformly coating thermoplastic polyimide paint on the outer peripheral surface of the flat wire core material, and after painting, sending the flat wire core material into a sintering furnace for baking and curing to obtain a semi-finished product of the enameled wire;
s5, calendaring the semi-finished enameled wire product into an enameled wire semi-finished enameled wire product with the required width-to-thickness ratio through a calendaring machine;
s6, paying off the semi-finished enameled wire, preheating, and extruding a mixture of polyether-ether-ketone and polytetrafluoroethylene on the primer layer in a melt extruder;
and S7, removing the wire rod from the burning furnace, naturally cooling and lubricating the wire rod, and then taking up the wire rod to obtain a finished enameled wire product.
7. The method for manufacturing an enamel wire according to claim 6, wherein the annealing temperature in S2 is 400-650 ℃.
8. The method for manufacturing an enamel wire according to claim 6, wherein the baking temperature in S4 is 300 to 450 ℃ and the baking speed is 10 to 60m/min.
9. The method for manufacturing an enamel wire according to claim 6, wherein the polyimide resin in the primer layer has a solid content of 25 to 30% and a coating amount of 4 to 5 passes.
10. The method for manufacturing an enamel wire according to claim 6, wherein the coating amount of the finish layer is 1 layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310561747.3A CN116543955A (en) | 2023-05-17 | 2023-05-17 | Enameled wire and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310561747.3A CN116543955A (en) | 2023-05-17 | 2023-05-17 | Enameled wire and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116543955A true CN116543955A (en) | 2023-08-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310561747.3A Pending CN116543955A (en) | 2023-05-17 | 2023-05-17 | Enameled wire and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116543955A (en) |
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2023
- 2023-05-17 CN CN202310561747.3A patent/CN116543955A/en active Pending
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