CN116532337A - Method for manufacturing ultrasonic transducer - Google Patents
Method for manufacturing ultrasonic transducer Download PDFInfo
- Publication number
- CN116532337A CN116532337A CN202310043404.8A CN202310043404A CN116532337A CN 116532337 A CN116532337 A CN 116532337A CN 202310043404 A CN202310043404 A CN 202310043404A CN 116532337 A CN116532337 A CN 116532337A
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- Prior art keywords
- piezoelectric film
- metal
- ultrasonic transducer
- metal body
- manufacturing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 107
- 239000002184 metal Substances 0.000 claims abstract description 107
- 239000000463 material Substances 0.000 claims abstract description 34
- 239000002033 PVDF binder Substances 0.000 claims abstract description 12
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims abstract description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 239000011651 chromium Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229920006335 epoxy glue Polymers 0.000 claims description 3
- 238000003760 magnetic stirring Methods 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229940099259 vaseline Drugs 0.000 claims description 3
- 239000010408 film Substances 0.000 claims 14
- 239000010409 thin film Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000002604 ultrasonography Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
- B06B2201/50—Application to a particular transducer type
- B06B2201/55—Piezoelectric transducer
- B06B2201/56—Foil type, e.g. PVDF
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Abstract
The application discloses a method for manufacturing an ultrasonic transducer, which comprises the following steps: providing a hollow metal shell, a metal body and a piezoelectric film; fixing the piezoelectric film to the surface of the metal body, and positioning the metal body with the piezoelectric film below the metal housing so that the metal body completely closes the hollow bottom of the metal housing; folding and attaching the reserved part of the piezoelectric film to the inner wall of the metal shell; connecting a wire to the piezoelectric film and pouring a backing material into the interior of the metal housing; after the backing material is cured, the metal body is separated from the piezoelectric film; an SMA connector is secured to an inner wall of the metal housing at an opposite face of the piezoelectric film of the metal housing. Compared with the prior art that PVDF film grows layer by layer on the substrate, the manufacturing method of the ultrasonic transducer is simpler, more convenient and feasible and is easy to operate.
Description
Technical Field
The present application relates to the field of ultrasound transducer technology, and in particular, to a method for manufacturing an ultrasound transducer.
Background
With the development of ultrasonic technology, the application prospect and value of the ultrasonic imaging device in the fields of high-resolution ultrasonic microscopic imaging, biological cell research, nondestructive detection and the like are increasing. The ultrasonic transducer is used as a carrier for ultrasonic excitation and reception, and has the advantages of focusing and high frequency.
Existing ultrasonic transducers use PVDF (Poly Vinylidene Fluoride, a short for polyvinylidene fluoride film) piezoelectric film to achieve energy conversion. The PVDF piezoelectric film is usually grown on the substrate layer by adopting processes such as deposition, sputtering and the like, and the growth process is relatively complex.
The existing piezoelectric material is often grown on the surface of an acoustic lens, and the acoustic lens is used as a carrier to prepare an ultrasonic transducer, but the acoustic impedance between the piezoelectric material and the acoustic lens is very different, and the prepared ultrasonic transducer can only work under narrow frequency or single frequency. Furthermore, acoustic impedances of the acoustic lens and water are also very different, and there is attenuation of the transmission of signals through the acoustic lens, which will necessarily result in a reduction of the energy transmission efficiency.
Disclosure of Invention
Aiming at the problems in the related art, the application provides a manufacturing method of an ultrasonic transducer, which can simplify the process steps for manufacturing the ultrasonic transducer and increase the energy transmission efficiency of the ultrasonic transducer.
The technical scheme of the application is realized as follows:
according to one aspect of the present application, there is provided a method of manufacturing an ultrasonic transducer, comprising:
providing a hollow metal shell, a metal body and a piezoelectric film;
fixing the piezoelectric film to the surface of the metal body, and positioning the metal body with the piezoelectric film below the metal housing so that the metal body completely closes the hollow bottom of the metal housing;
folding and attaching the reserved part of the piezoelectric film to the inner wall of the metal shell;
connecting a wire to the piezoelectric film and pouring a backing material into the interior of the metal housing;
after the backing material is cured, the metal body is separated from the piezoelectric film;
an SMA connector is secured to an inner wall of the metal housing at an opposite face of the piezoelectric film of the metal housing.
The piezoelectric film comprises a negative electrode layer, a piezoelectric layer and a positive electrode layer which are sequentially stacked, the negative electrode layer of the reserved portion is fixed with the inner wall of the metal shell through conductive silver paste, and the side wall of the SMA connector is fixed with the inner wall of the metal shell, so that the SMA connector is electrically connected with the negative electrode layer through the metal shell.
Wherein the lead is fixed to the positive electrode layer of the reserved portion of the piezoelectric film via conductive silver paste.
Wherein the metal body includes a metal ball having a curved surface, a metal cylinder having a curved surface, and a metal plate having a flat surface, and the surface of the metal body is polished.
When the piezoelectric film is attached to the metal body, the piezoelectric film has the same curved surface or plane shape as the metal body, and the curved surface or plane shape of the piezoelectric film depends on the center frequency, line focus, point focus or unfocused type required by the ultrasonic transducer.
Wherein the material of the piezoelectric layer comprises a PVDF film and a polymer thereof; the metal housing comprises aluminum, copper and stainless steel; the material of the negative electrode layer comprises gold and chromium; the material of the positive electrode layer comprises gold and chromium.
The backing material comprises epoxy resin glue and tungsten powder in a mass ratio of 1:1, and the epoxy resin glue and the tungsten powder are fully mixed by means of a magnetic stirring rod so as to remove bubbles in the backing material.
The piezoelectric film is fixed on the surface of the metal body through vaseline so as to facilitate the subsequent separation of the metal body from the piezoelectric film.
In addition, an ultrasonic transducer is formed by the above manufacturing method.
The piezoelectric film is formed on a metal housing through a metal body, and then the positive electrode layer and the negative electrode layer of the piezoelectric film are led out through filling a backing material. Compared with the prior art that PVDF film grows layer by layer on the substrate, the manufacturing method of the ultrasonic transducer is simpler, more convenient and feasible and is easy to operate.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 illustrates a cross-sectional view of an ultrasound transducer having a curved surface provided in accordance with some embodiments;
FIG. 2 illustrates a schematic view of a cylindrical metal body, a corresponding metal housing, and a piezoelectric film provided in accordance with some embodiments;
FIG. 3 illustrates a schematic view of a spherical metal body, a corresponding metal housing, and a piezoelectric film provided in accordance with some embodiments;
FIG. 4 illustrates a schematic view of a planar metal body, a corresponding metal housing, and a piezoelectric film provided in accordance with some embodiments;
FIG. 5 illustrates a cross-sectional view of an ultrasound transducer having a plane provided in accordance with some embodiments;
FIG. 6 shows a pulse-echo response plot of an ultrasound transducer;
FIG. 7 shows a pulse-echo response fast Fourier transform plot of an ultrasound transducer;
fig. 8 shows a schematic of a piezoelectric film with leads.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application are within the scope of the protection of the present application.
According to an embodiment of the present application, a method of manufacturing an ultrasonic transducer is provided. As shown in fig. 1, the ultrasonic transducer includes a metal housing 1, a piezoelectric film 3, a backing material 4, and a radio frequency coaxial SMA connector (Sub-Miniature A Connector, short for subminiature connector) 5. The manufacturing method will be described in detail below.
Step 1, a hollow metal housing 1, a metal body 2, and a piezoelectric film 3 are provided. Wherein the metal housing 1 comprises aluminum, copper and stainless steel. As shown in fig. 2, 3 and 4, the metal body 2 includes a metal cylinder having a curved surface, a metal ball having a curved surface, and a metal plate having a flat surface, and the surface of the metal body 2 is polished. The piezoelectric film 3 includes a negative electrode layer 6, a piezoelectric layer 7 and a positive electrode layer 8 laminated in this order, the material of the piezoelectric layer 7 includes a PVDF film and its polymer, the material of the negative electrode layer 6 includes gold and chromium, and the material of the positive electrode layer 8 includes gold and chromium.
Step 2, fixing the piezoelectric film 3 to the surface of the metal body 2, and positioning the metal body 2 with the piezoelectric film 3 under the metal housing 1 such that the metal body 2 completely closes the hollow bottom of the metal housing 1. In some embodiments, the piezoelectric film 3 is fixed to the surface of the metal body 2 via vaseline, so as to facilitate subsequent detachment of the metal body 2 from the piezoelectric film 3. When the piezoelectric film 3 is attached to the metal body 2, the piezoelectric film 3 has the same curved surface or planar shape as the metal body 2. It is noted that the curved or planar shape of the piezoelectric film 3 depends on the desired center frequency, line focus, point focus, or type of unfocused ultrasonic transducer. As shown in fig. 2, when the metal body 2 is a cylinder, the line focus type ultrasonic transducer is obtained when the metal housing 1 has a bottom portion that matches the surface of the metal body 2. As shown in fig. 3, when the metal body 2 is a sphere, the point focusing type ultrasonic transducer is obtained when the metal housing 1 has a bottom portion that matches the surface of the metal body 2. As shown in fig. 4, when the metal body 2 is a flat plate, an unfocused ultrasonic transducer shown in fig. 5 is obtained in which the piezoelectric film 3 is planar.
And 3, folding up the reserved part of the piezoelectric film 3 and attaching the reserved part to the inner wall of the metal shell 1. In some embodiments, the reserved portion of the negative electrode layer 6 is fixed to the inner wall of the metal case 1 via conductive silver paste. The reserved portion is used for leading out the electrical signals of the positive electrode layer 8 and the negative electrode layer 6 of the piezoelectric film 3.
In step 4, high-frequency coaxial wires 9 are connected to the piezoelectric film 3, and the backing material 4 is poured into the inside of the metal case 1. In some embodiments, the wire 9 is fixed to the positive electrode layer 8 of the reserved portion of the piezoelectric film 3 via conductive silver paste. In some embodiments, the backing material 4 comprises a mass ratio of 1:1 of epoxy glue and tungsten powder, which are thoroughly mixed by means of a magnetic stirring rod to exclude bubbles in the backing material 4 and prevent the bubbles from adversely affecting the backing material 4.
Step 5, after the backing material 4 is cured, the metal body 2 is separated from the piezoelectric film 3.
At step 6, the SMA connector 5 is fixed to the inner wall of the metal case 1 at the opposite face of the piezoelectric film 3 of the metal case 1, thereby manufacturing the ultrasonic transducer. In some embodiments, the side walls of SMA connector 5 are threadably secured to the inner wall of metal casing 1 such that SMA connector 5 is electrically connected to negative electrode layer 6 via metal casing 1.
In the ultrasonic transducer, both ends of an input voltage are respectively connected to a side wall of an SMA connector 5 and a high-frequency coaxial wire 9 in the center of the SMA connector 5, the side wall of the SMA connector 5 is connected to a negative electrode layer 6 of a piezoelectric film 3 through a metal housing 1, the high-frequency coaxial wire 9 in the center of the SMA connector 5 is connected to a positive electrode layer 8 of the piezoelectric film 3 through conductive silver paste, and the piezoelectric film 3 vibrates under a reverse piezoelectric effect after receiving the input voltage, thereby generating ultrasonic waves.
The piezoelectric film 3 of the present application is formed on the metal case 1 through the metal body 2, and then the positive electrode layer 8 and the negative electrode layer 6 of the piezoelectric film 3 are led out through the filler backing material 4. Compared with the prior art that PVDF film grows layer by layer on the substrate, the manufacturing method of the ultrasonic transducer is simpler, more convenient and feasible and is easy to operate.
In addition, compared with an ultrasonic transducer comprising an acoustic lens, the backing material 4 is formed above the positive electrode layer 8 of the piezoelectric film 3, so that the piezoelectric film 3 is protected and packaged and fixed, the backing material 4 can effectively absorb ultrasonic signals transmitted to the rear end, the reflection of the ultrasonic signals is reduced, the signal waveform of broadband narrow pulses is obtained, and the detection resolution can be effectively improved.
Moreover, the backing material 4 and the coupling liquid are similar to the acoustic impedance of the piezoelectric film 3, so that the bandwidth of the ultrasonic transducer is effectively increased, the ultrasonic transducer can be more suitable for the operation of narrow pulse broadband signals, and the aim of increasing the energy transmission efficiency is finally achieved.
Acoustic impedance data for each material is listed in table 1, and the data shows that the acoustic impedance of the PVDF piezoelectric film 3 and backing material 4 is well matched and close to that of coupling fluid water. The center frequency of the prepared ultrasonic transducer is approximately inversely related to the thickness of the piezoelectric film 3. The thickness of the piezoelectric film 3 in the manufacturing method of the present application ranges from 9um to 100um.
| Parameters (parameters) | PVDF piezoelectric film | Backing lining | Water and its preparation method |
| Sound velocity C/(Km/s) | 0.94 to 1.620 | 1.41 | 1.48 |
| Density ρ/(g/cm) 3 ) | 1.76 | 1.95 | 1.00 |
| Acoustic impedance Za/106 (Kg/s/m) 2 ) | 1.65 to 2.85 | 2.75 | 1.48 |
TABLE 1
In addition, the ultrasonic transducer of the present application was connected to a DPR500 pulse generator, and the ultrasonic transducer was placed in pure water, and signal transmission and reception tests were performed using a stainless steel block at positions up and down of a focus radius of 15 mm. As shown in fig. 6, the pulse-echo response signal of the ultrasonic transducer was measured to be stable and the stray waves were less. As shown in fig. 7, the signals are collected by using an oscilloscope and then fourier-rapidly converted, so that the center frequency of the prepared ultrasonic transducer is about 9.3MHz, the bandwidth is 120%, and the performance is stable.
The piezoelectric film 3 shown in fig. 2, 3 and 4 has no lead thereon. Leads are provided on the piezoelectric film 3 shown in fig. 8 to lead out the positive electrode layer 8 and the negative electrode layer 6 of the piezoelectric film 3, respectively, so as to facilitate fixing the piezoelectric film 3 with the leads to the metal housing 1 and the UHF (Ultra High Frequency, i.e., ultra-high frequency for short) connector.
The foregoing description of the preferred embodiments of the present invention is not intended to limit the invention to the precise form disclosed, and any modifications, equivalents, and variations which fall within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. A method of manufacturing an ultrasonic transducer, comprising:
providing a hollow metal shell, a metal body and a piezoelectric film;
fixing the piezoelectric film to the surface of the metal body, and positioning the metal body with the piezoelectric film below the metal housing so that the metal body completely closes the hollow bottom of the metal housing;
folding and attaching the reserved part of the piezoelectric film to the inner wall of the metal shell;
connecting a wire to the piezoelectric film and pouring a backing material into the interior of the metal housing;
after the backing material is cured, the metal body is separated from the piezoelectric film;
an SMA connector is secured to an inner wall of the metal housing at an opposite face of the piezoelectric film of the metal housing.
2. The method of manufacturing an ultrasonic transducer according to claim 1, wherein the piezoelectric thin film includes a negative electrode layer, a piezoelectric layer, and a positive electrode layer laminated in this order, the negative electrode layer of the predetermined portion is fixed to an inner wall of the metal case via conductive silver paste, and a side wall of the SMA connector is fixed to the inner wall of the metal case so that the SMA connector is electrically connected to the negative electrode layer via the metal case.
3. The method of manufacturing an ultrasonic transducer according to claim 2, wherein the wire is fixed to the positive electrode layer of the reserved portion of the piezoelectric film via conductive silver paste.
4. The method of manufacturing an ultrasonic transducer according to claim 1, wherein the metal body includes a metal ball having a curved surface, a metal cylinder having a curved surface, and a metal plate having a flat surface, and the surface of the metal body is polished.
5. The method according to claim 4, wherein the piezoelectric film has the same curved or planar shape as the metal body when the piezoelectric film is attached to the metal body, and the curved or planar shape of the piezoelectric film depends on a center frequency, line focus, point focus, or unfocused type required for the ultrasonic transducer.
6. The method of manufacturing an ultrasonic transducer according to claim 2, wherein the material of the piezoelectric layer includes PVDF film and its polymer; the metal housing comprises aluminum, copper and stainless steel; the material of the negative electrode layer comprises gold and chromium; the material of the positive electrode layer comprises gold and chromium.
7. The method of manufacturing an ultrasonic transducer according to claim 1, wherein the backing material comprises an epoxy glue and a tungsten powder in a mass ratio of 1:1, and the epoxy glue and tungsten powder are thoroughly mixed by means of a magnetic stirring rod to exclude bubbles in the backing material.
8. The method of manufacturing an ultrasonic transducer according to claim 1, wherein the piezoelectric film is fixed to the surface of the metal body via vaseline to facilitate subsequent detachment of the metal body from the piezoelectric film.
9. An ultrasonic transducer formed by the method of manufacturing an ultrasonic transducer according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310043404.8A CN116532337A (en) | 2023-01-29 | 2023-01-29 | Method for manufacturing ultrasonic transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310043404.8A CN116532337A (en) | 2023-01-29 | 2023-01-29 | Method for manufacturing ultrasonic transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116532337A true CN116532337A (en) | 2023-08-04 |
Family
ID=87447733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310043404.8A Pending CN116532337A (en) | 2023-01-29 | 2023-01-29 | Method for manufacturing ultrasonic transducer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116532337A (en) |
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2023
- 2023-01-29 CN CN202310043404.8A patent/CN116532337A/en active Pending
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Inventor after: Huang Yanfeng Inventor after: Liu Duan Inventor before: Liu Duan |