CN116506708A - Image acquisition equipment and chip mounter - Google Patents
Image acquisition equipment and chip mounter Download PDFInfo
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- CN116506708A CN116506708A CN202310769473.7A CN202310769473A CN116506708A CN 116506708 A CN116506708 A CN 116506708A CN 202310769473 A CN202310769473 A CN 202310769473A CN 116506708 A CN116506708 A CN 116506708A
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- reflecting mirror
- reflecting
- side wall
- mirror
- bottom plate
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- 239000000758 substrate Substances 0.000 description 18
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- 238000000034 method Methods 0.000 description 5
- 238000013459 approach Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
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- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 230000003287 optical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
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- 238000012545 processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/17—Bodies with reflectors arranged in beam forming the photographic image, e.g. for reducing dimensions of camera
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T3/00—Geometric image transformation in the plane of the image
- G06T3/40—Scaling the whole image or part thereof
- G06T3/4038—Scaling the whole image or part thereof for image mosaicing, i.e. plane images composed of plane sub-images
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/95—Computational photography systems, e.g. light-field imaging systems
- H04N23/951—Computational photography systems, e.g. light-field imaging systems by using two or more images to influence resolution, frame rate or aspect ratio
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2200/00—Indexing scheme for image data processing or generation, in general
- G06T2200/32—Indexing scheme for image data processing or generation, in general involving image mosaicing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to an image acquisition device and a chip mounter, wherein the image acquisition device comprises a reflecting piece and a linear array camera, the reflecting piece comprises a bearing piece, a first reflecting mirror, a second reflecting mirror and a third reflecting mirror, the first reflecting mirror, the second reflecting mirror and the third reflecting mirror are arranged on the same side of the bearing piece, the bearing piece is provided with a gap, and the first reflecting mirror is provided with a gap corresponding to the gap and used for reflecting light passing through a surface mounting element. The linear array camera and the reflecting piece are relatively fixed in position, the light inlet of the linear array camera faces the third reflecting mirror, the first reflecting mirror is used for reflecting the reflected light of the surface mounting element to the third reflecting mirror through the second reflecting mirror, and the linear array camera is used for receiving the reflected light of the third reflecting mirror. After the surface mounting element is absorbed by the surface mounting machine, the surface mounting element can be driven to move above the gap, the first reflecting mirror, the second reflecting mirror and the third reflecting mirror reflect reflected light of the surface mounting element to the linear array camera, an image with higher precision can be obtained, the characteristic position of the image can be identified, and the mounting precision is improved.
Description
Technical Field
The invention relates to the technical field of automation equipment, in particular to image acquisition equipment and a chip mounter.
Background
The automatic chip mounter is equipment for realizing high-speed and high-precision mounting of components, and is the most critical and complex equipment in the whole SMT (Surface Mounted Technology, surface mounting technology) production.
In the related art, a head of an automatic chip mounter is generally equipped with a camera, which can be used to photograph a surface mount component for identifying a characteristic position of the surface mount component, such as a center point, to ensure accuracy of mounting. Conventional cameras usually take a whole picture of a surface mount device and perform image recognition, and such cameras have a limited accuracy in recognizing the surface mount device, particularly a miniaturized surface mount device, and occupy a large space.
Disclosure of Invention
The embodiment of the invention provides an image acquisition device and a chip mounter, which are used for improving the mounting identification precision and the structural compactness of the chip mounter.
An image acquisition apparatus comprising:
the reflecting piece comprises a bearing piece, a first reflecting mirror, a second reflecting mirror and a third reflecting mirror, wherein the first reflecting mirror, the second reflecting mirror and the third reflecting mirror are arranged on the same side of the bearing piece, a gap is formed in the bearing piece, the first reflecting mirror is arranged corresponding to the gap, and the gap is used for reflecting light passing through a surface mounting element; and
the linear array camera is relatively fixed with the position of the reflecting piece, the light inlet of the linear array camera faces the third reflecting mirror, the first reflecting mirror is used for reflecting the reflected light of the surface mounting element to the third reflecting mirror through the second reflecting mirror, and the linear array camera is used for receiving the reflected light of the third reflecting mirror.
In one embodiment, the bearing piece comprises a bottom plate and a cover plate detachably connected to the bottom plate, the cover plate is arranged at the edge of the bottom plate and provided with the gap, and the first reflecting mirror is fixed on the bottom plate through the cover plate; the second reflecting mirror and the third reflecting mirror are respectively fixed on the bottom plate.
In one embodiment, the bottom plate has a reference plane, the first reflecting mirror, the second reflecting mirror and the third reflecting mirror are respectively arranged obliquely with the reference plane, and the axis direction of the light inlet of the linear array camera is arranged obliquely with the reference plane; the reference plane is a geometric plane perpendicular to the thickness direction of the base plate.
In one embodiment, the bearing member includes a supporting member detachably connected to the bottom plate, the supporting member is disposed at an edge of the bottom plate and includes a supporting portion, two mounting portions connected to opposite ends of the supporting portion in a one-to-one correspondence, and a fastener penetrating through the mounting portions, the supporting portion has a supporting surface obliquely disposed with the reference plane, and the first reflecting mirror is attached to the supporting surface; the mounting portion comprises a flexible body propped against the bottom plate, the fastening piece is fixedly connected to the bottom plate and used for enabling the bottom plate to squeeze the flexible body so as to respectively adjust the intervals between the two opposite ends of the propping portion and the bottom plate.
In one embodiment, the cover plate comprises an upper cover and an adjusting plate, wherein the upper cover is detachably connected with the adjusting plate, and the adjusting plate is detachably connected with the bottom plate and covers the supporting piece; the upper cover is provided with a first groove, the adjusting plate is provided with a second groove, the first groove is communicated with the first groove and is combined to form the gap for reflecting light passing through the surface mounting element, and the adjusting plate is interchangeably arranged on the bottom plate and is used for adjusting the width of the gap; the supporting part further comprises a rotating part arranged at one end of the supporting part, two opposite ends of the supporting part are respectively connected with the two mounting parts in a rotating mode, and the rotating part is used for adjusting the inclination angle of the first reflecting mirror and the bottom plate through the supporting part.
In one embodiment, the bottom plate has a boss, the bearing member includes a fastener detachably connected to the bottom plate, the fastener has a fastening groove, one end of the second reflector is accommodated in the fastening groove, and the opposite other end of the second reflector abuts against the boss.
In one embodiment, the bottom plate has a first side wall, a second side wall, and a third side wall and a fourth side wall, wherein the first side wall, the second side wall, the third side wall and the fourth side wall are oppositely arranged, the first side wall, the second side wall, the third side wall and the fourth side wall are enclosed to form a mounting groove for mounting the third reflecting mirror, and an avoidance hole is formed at a connection position of any adjacent two of the first side wall, the second side wall, the third side wall and the fourth side wall.
In one embodiment, the image acquisition device comprises a linear motor, an output end of the linear motor is fixedly connected with the linear array camera, and the reflecting piece is fixedly connected with the linear array camera.
In one embodiment, the image acquisition device comprises a mounting frame and a guide rail, wherein the guide rail and the linear motor are respectively and fixedly connected to the mounting frame, and the output end of the linear motor is in sliding fit with the guide rail.
A chip mounter including a head and an image pickup device according to any one of the above, the image pickup device being connected to the head, the head being for sucking the surface mount component, the image pickup device being for moving relative to the head so that the surface mount component corresponds to the slit.
The image acquisition equipment and the chip mounter can be used for sucking the surface mounting element, and the surface mounting element can be corresponding to the upper part of the gap; in the process, the surface mounting element can be polished, reflected light of the surface mounting element enters from the gap and is reflected to the linear array camera by the first reflecting mirror, the second reflecting mirror and the third reflecting mirror, partial images of the surface mounting element are collected by the linear array camera at a certain moment, the images of the whole surface mounting element can be obtained through continuous scanning and splicing, and further, the characteristic positions such as the center point of the images are identified. The structure that the first reflecting mirror, the second reflecting mirror and the third reflecting mirror are arranged on the same side of the bearing piece can reduce the overall size of the reflecting piece and shorten the length of a light path, so that miniaturization and high integration design of the image acquisition equipment are facilitated, and the assembly precision of the first reflecting mirror, the second reflecting mirror and the third reflecting mirror and the bearing piece can be guaranteed through the machining precision of the bearing piece, so that the identification precision of the image acquisition equipment is guaranteed.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a chip mounter according to an embodiment;
FIG. 2 is a schematic diagram of a handpiece with an image acquisition apparatus mounted thereto in accordance with an embodiment;
FIG. 3 is an exploded view of an image capturing device according to an embodiment;
FIG. 4 is a schematic view of a reflective member of the image capture device of FIG. 3;
fig. 5 is a schematic view of a reflecting member of an image capturing apparatus according to another embodiment.
Reference numerals:
the mounter 10, the first component conveying mechanism 11, the second component conveying mechanism 12, the first substrate conveying mechanism 13, the second substrate conveying mechanism 14, the first moving mechanism 15, the second moving mechanism 16, the third moving mechanism 17, the head 18, the image pickup apparatus 100, the reflecting member 110, the carrier 111, the slit 111a, the mounting groove 111B, the escape hole 111C, the bottom plate 1111, the first side wall D1, the second side wall D2, the third side wall D3, the fourth side wall D4, the boss 11111, the cover plate 1113, the upper cover 11131, the first groove B1, the regulating plate 11133, the second groove B2, the abutting member 1115, the abutting surface A1, the flexible body A2, the abutting portion 1115a, the mounting portion 1115B, the rotating member 1115C, the fastening member 1117, the fastening groove C1, the linear motor 1118, the first reflecting mirror 113, the second reflecting mirror 115, the third reflecting mirror 117, the linear camera 120, the linear motor 130, the mounting frame 140, and the guide rail 150.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, the present invention discloses a chip mounter 10, and the chip mounter 10 may be used to mount surface mount devices onto a circuit substrate. The mounter 10 may include a first component conveying mechanism 11, a second component conveying mechanism 12, a first substrate conveying mechanism 13, a second substrate conveying mechanism 14, a first moving mechanism 15, a second moving mechanism 16, a third moving mechanism 17, and two heads 18. One of the heads 18 is linked with the first moving mechanism 15, the other head 18 is linked with the second moving mechanism 16, and the first moving mechanism 15 and the second moving mechanism 16 are respectively linked with the third moving mechanism 17. The first moving mechanism 15 is used for driving the corresponding machine head 18 to reciprocate along the first direction corresponding to the first substrate conveying mechanism 13, the second moving mechanism 16 is used for driving the corresponding machine head 18 to reciprocate along the first direction corresponding to the second substrate conveying mechanism 14, the third moving mechanism 17 is used for driving the first moving mechanism 15 and the second moving mechanism 16 to reciprocate along the second direction respectively, the first component conveying mechanism 11 is used for conveying the surface mounting component to one machine head 18, and the second component conveying mechanism 12 is used for conveying the surface mounting component to the other machine head 18.
For easy understanding, a rectangular coordinate system is established with the first direction as the X axis, the second direction as the Y axis, and the third direction as the Z axis, as shown in FIG. 1.
In some embodiments, the surface mount component for mounting is provided on a film material wound in a roll shape, and the first component conveying mechanism 11 and the second component conveying mechanism 12 may mount the roll-shaped film material, respectively. Taking the first element conveying mechanism 11, the first substrate conveying mechanism 13, the first moving mechanism 15 and the corresponding machine head 18 as examples, the film material placed on the first element conveying mechanism 11 can be gradually unfolded and straightened and the surface-mounted element can be transferred to a preset position; the third moving mechanism 17 can drive the corresponding machine head 18 to move along the second direction (Y-axis direction) to approach the surface mounting component, and the first moving mechanism 15 can drive the machine head 18 to move along the first direction (X-axis direction) to approach the surface mounting component; after the head 18 sucks the surface mount component, the third moving mechanism 17 can drive the head 18 to be far away from the film material and close to the first substrate conveying mechanism 13 along the second direction (Y-axis direction); the first moving mechanism 15 further drives the head 18 to be positioned to the circuit substrate of the first substrate conveying mechanism 13, and the head 18 mounts the sucked surface mount component to the circuit substrate, so as to realize the mounting process. The second component conveying mechanism 12, the second substrate conveying mechanism 14, the second moving mechanism 16 and the corresponding heads 18 operate in a similar manner to that described above, and will not be described again here.
The first substrate conveying mechanism 13 and the second substrate conveying mechanism 14 have similar structures and working principles, and taking the first substrate conveying mechanism 13 as an example, the first substrate conveying mechanism may include a conveying belt and a first power mechanism, the conveying belt extends along a first direction (X-axis direction), the first power mechanism drives the conveying belt to move, that is, can drive the circuit substrate thereon to move along the first direction (X-axis direction), and the first power mechanism is not limited to a motor.
The first moving mechanism 15 and the second moving mechanism 16 are similar in structure and operation principle, and the first moving mechanism 15 may include a guide member extending in a first direction (X-axis direction) and a second power mechanism driving the head 18 to move in the first direction (X-axis direction), and the second power mechanism is not limited to a motor, a cylinder, a hydraulic cylinder, or the like.
The third movement mechanism 17 may include a rail and a third power mechanism for driving the first movement mechanism 15 and the handpiece 18 thereon to move in the Y-axis direction, and the third power mechanism for driving the second movement mechanism 16 and the handpiece 18 thereon to move in the Y-axis direction. The third power mechanism is not limited to a motor, a cylinder, a hydraulic cylinder, or the like.
In the chip mounter 10, two heads 18 are adopted, and the two heads 18 can work independently, so that the mounting efficiency is improved.
Referring to fig. 2, 3 and 4, the chip mounter 10 includes an image capturing device 100 connected to a head 18, the image capturing device 100 includes a reflecting member 110 and a line camera 120, the reflecting member 110 includes a carrying member 111, and a first reflecting mirror 113, a second reflecting mirror 115 and a third reflecting mirror 117 connected to the same side of the carrying member 111, the carrying member 111 is provided with a gap 111a, the first reflecting mirror 113 is disposed corresponding to the gap 111a, and the gap 111a is used for reflecting light passing through a surface mount component. The positions of the linear array camera 120 and the reflecting member 110 are relatively fixed, for example, the positions of the two can be relatively fixed through an intermediate connecting member, the light inlet of the linear array camera 120 faces the third reflecting mirror 117, the first reflecting mirror 113 is used for reflecting the reflected light of the surface mount element to the third reflecting mirror 117 through the second reflecting mirror 115, and the linear array camera 120 is used for receiving the reflected light of the third reflecting mirror 117.
The first mirror 113, the second mirror 115, and the third mirror 117 may each be in a sheet shape and have a reflective surface for reflecting light, and the reflective surface may be provided with a reflective film such as a silver layer for reflecting incident light. The reflection surface may also be provided with a reflection enhancing film to enhance the reflection effect and improve the image acquisition accuracy of the image acquisition apparatus 100.
After the surface mount component is sucked by the machine head 18, the image collecting apparatus 100 may move relative to the machine head 18 so that the surface mount component corresponds to the gap 111a of the reflector 110, the machine head 18 may perform polishing on the surface mount component, that is, irradiate the surface mount component with lamplight, enhance the reflected light of the surface mount component, and the reflected light is incident from the gap 111a to the first reflector 113, where the reflected light of the surface mount component is reflected by the first reflector 113 to the second reflector 115, reflected by the second reflector 115 to the third reflector 117, reflected by the third reflector 117 to the light inlet of the line camera 120, and further sensed by the line camera 120. The first reflecting mirror 113, the second reflecting mirror 115 and the third reflecting mirror 117 are arranged, so that the light path can be changed for a plurality of times without being transmitted along a straight line, the structure of the image acquisition device 100 can be compact, and the structure of the chip mounter 10 can be compact.
The above image capturing apparatus 100 and the chip mounter 10, after the chip mounter 10 sucks the surface mount device, the surface mount device may be corresponding to above the slit 111 a; in this process, the surface mount component is polished, the reflected light of the surface mount component enters from the slit 111a and is reflected to the line camera 120 by the first mirror 113, the second mirror 115 and the third mirror 117, and at a moment, the line camera 120 collects partial images of the surface mount component, and through continuous scanning and image stitching, the images of the whole surface mount component can be obtained, and further, the characteristic positions such as the center point of the images are identified. The first mirror 113, the second mirror 115 and the third mirror 117 are arranged on the same side of the bearing member 111, so that the overall size of the reflecting member 110 can be reduced, the length of an optical path can be shortened, the miniaturization and the highly integrated design of the image acquisition device 100 are facilitated, and the assembly precision of the first mirror 113, the second mirror 115 and the third mirror 117 and the bearing member 111 can be ensured through the processing precision of the bearing member 111, so that the identification precision of the image acquisition device 100 is ensured.
With continued reference to fig. 3 and 4, the carrier 111 may include a base 1111 and a cover 1113 detachably connected to the base 1111, the cover 1113 being disposed at an edge of the base 1111 and having a slit 111a, the first mirror 113 being fixed to the base 1111 through the cover 1113, and the second and third mirrors 115 and 117 being respectively fixed to the base 1111. Specifically, the bottom plate 1111 has a substantially rectangular block shape, and the cover plate 1113 is disposed at the edge of the bottom plate 1111, so that the size of the bottom plate 1111 can be reduced, and the compactness of the reflector 110 can be ensured. The geometric plane perpendicular to the thickness direction of the base plate 1111 is used as a reference plane, and the first mirror 113, the second mirror 115, and the third mirror 117 are respectively disposed obliquely to the reference plane, or the reflective surfaces of the first mirror 113, the second mirror 115, and the third mirror 117 are respectively disposed obliquely to the reference plane, and the axis direction of the light entrance of the line camera 120 is also disposed obliquely to the reference plane. In other words, the axis direction of the light entrance of the line camera 120 is inclined to the third direction (Z direction). With this structure, compared with the scheme that the axis direction of the light inlet of the line camera 120 is parallel to the Y-axis direction, the installation space of the Y-axis direction can be saved, so that the structure of the chip mounter 10 is more compact.
In some embodiments, the reference plane is parallel to the horizontal plane after the image capturing device 100 is mounted to the handpiece 18, the first mirror 113 is tilted at about 45 degrees to the reference plane, the second mirror 115 is tilted at about 45 degrees to the reference plane, and the third mirror 117 is tilted at about 10 degrees to the reference plane. Of course, it is understood that the inclination angle can be adaptively adjusted according to actual requirements.
With continued reference to fig. 4, the carrier 111 includes a retainer 1115 removably coupled to the base 1111, for example, the retainer 1115 may be removably coupled to the base 1111 by threaded fasteners. The supporting member 1115 is disposed at an edge of the bottom plate 1111 and includes a supporting portion 1115a, two mounting portions 1115b connected to opposite ends of the supporting portion 1115a in a one-to-one correspondence manner, and a fastener (not shown) penetrating through the mounting portions 1115b, the supporting portion 1115a has a supporting surface A1 obliquely disposed with respect to the reference plane, the first reflector 113 is attached to the supporting surface A1, one end of the first reflector can be supported on the bottom plate 1111, and the opposite end of the first reflector 113 can be supported on the cover plate 1113. The abutting surface A1 is arranged, so that the inclination angle of the first reflecting mirror 113 and the reference plane can be accurately controlled, the assembly process is simplified, the assembly precision is improved, and the acquisition precision of the image acquisition equipment 100 is further improved. The above structure can also make the first reflecting mirror 113 reliably fixed to the bottom plate 1111, preventing the first reflecting mirror 113 from loosening during the movement of the head 18 and reducing the acquisition accuracy of the image acquisition apparatus 100.
Further, the mounting portion 1115b may include a flexible body A2 abutting against the bottom plate 1111, the fastener is fixedly connected to the bottom plate 1111 and is used for enabling the bottom plate 1111 to press the flexible body A2 to adjust the distance between the opposite ends of the abutting portion 1115a and the bottom plate 1111, so as to adjust the height of the opposite ends of the first reflector 113 relative to the bottom plate 1111, thereby realizing the posture adjustment of the first reflector 113, and ensuring that the first reflector 113 completely reflects the reflected light of the surface mount component to the second reflector 115, so as to ensure the accuracy of recognition. Specifically, the flexible body A2 may be made of a material such as silicone or rubber, and may be compressively deformed when pressed. The fastener may be a threaded fastener such as a bolt or a screw, for example, a fastener at one end of the abutting portion 1115a, and when the fastener is rotated, the distance between the end of the abutting portion 1115a and the base plate 1111 may be reduced or increased. When the interval between the end of the abutting part 1115a and the bottom plate 1111 increases, the flexible body A2 recovers part of deformation, ensuring the position stability of the abutting part 1115 a; when the distance between the end of the abutting portion 1115a and the bottom plate 1111 is reduced, the flexible body A2 is compressed by being pressed by the bottom plate 1111, so that the flexible body A2 can ensure the position stability of the abutting portion 1115a, thereby conveniently adjusting the posture of the first mirror 113 and ensuring the accuracy of recognition.
Further, referring to fig. 5, the supporting member 1115 may further include a rotating member 1115c disposed at one end of the supporting portion 1115a, where opposite ends of the supporting portion 1115a are respectively rotatably connected to two mounting portions 1115b, and the rotating member 1115c is configured to adjust an inclination angle of the first reflecting mirror 113 and the supporting portion 1115 through the supporting portion 1115a, so as to change an incident angle of the first reflecting mirror 113 and an incident light, and further adjust a reflection angle of a reflected light, so as to ensure that the first reflecting mirror 113 completely reflects the reflected light of the surface mount component to the second reflecting mirror 115, thereby ensuring identification accuracy.
It will be appreciated that the second mirror 115 or the third mirror 117 may also be added with a similar position and posture adjustment structure, so as to facilitate adjustment of the image capturing apparatus 100 and ensure accuracy of identifying the surface mount component.
Referring to fig. 4, the cover plate 1113 may include an upper cover 11131 and an adjustment plate 11133, the upper cover 11131 may be detachably coupled to the adjustment plate 11133, for example, the upper cover 11131 may be detachably coupled to the adjustment plate 11133 by a threaded fastener, and the adjustment plate 11133 may be detachably coupled to the base plate 1111 and cover the abutment 1115 by a threaded fastener. The upper cover 11131 has an elongated first groove B1, the adjustment plate 11133 has an elongated second groove B2, the first groove B1 communicates with the first groove B1 and forms a slit 111a for reflecting light through the surface mount component in combination, and the adjustment plate 11133 is provided on the bottom plate 1111 in a replaceable or detachable manner for adjusting the width of the slit 111 a. In other words, by changing the different adjustment plate 11133, the position of the second groove B2 of the adjustment plate 11133 relative to the second groove B2 of the upper cover 11131 may be changed, and the length and width of the slit 111a formed by the combination thereof may also be changed, so that the size of the slit 111a may be adaptively adjusted according to the size of the surface mount component, so as to avoid that the size of the slit 111a is too large or too small to reduce the recognition accuracy of the image capturing apparatus 100.
In some embodiments, the base 1111 has a boss 11111, the carrier 111 includes a fastener 1117 detachably connected to the base 1111, the edge of the fastener 1117 has a fastening groove C1, one end of the second mirror 115 is accommodated in the fastening groove C1, and the opposite end of the second mirror 115 abuts against the boss 11111. The structure can assemble the second reflecting mirror 115 on the bottom plate 1111 more conveniently, and the inclination angle of the second reflecting mirror 115 and the bottom plate 1111 has relatively higher assembly precision, and the structure can also ensure that the second reflecting mirror 115 is reliably fixed on the bottom plate 1111, so as to prevent the second reflecting mirror 115 from loosening during the movement of the machine head 18 and reduce the acquisition precision of the image acquisition device 100.
Referring to fig. 4, the base plate 1111 has a first side wall D1, a second side wall D2, and a third side wall D3 and a fourth side wall D4 connected between the first side wall D1 and the second side wall D2 and disposed opposite to each other, the first side wall D1, the second side wall D2, the third side wall D3, and the fourth side wall D4 enclose a mounting groove 111b for mounting the third mirror 117, and the mounting groove 111b has a substantially rectangular groove shape and matches the shape of the third mirror 117. The avoidance hole 111c is formed at the connection position of any adjacent two of the first, second, third and fourth side walls D1, D2, D3 and D4. In some embodiments, the avoidance holes 111c are circular holes, and after the third reflector 117 is mounted in the mounting groove 111b, four sharp corners of the third reflector 117 correspond to the four avoidance holes 111c one by one, so that extrusion and collision of the bottom plate 1111 to the sharp corners of the third reflector 117 can be avoided, the third reflector 117 is protected, and the third reflector 117 is reliably limited to the bottom plate 1111, so that the acquisition precision of the image acquisition apparatus 100 is ensured.
With continued reference to fig. 3, the image capturing apparatus 100 includes a linear motor 130, an output end of the linear motor 130 is fixedly connected to the line camera 120, and the reflecting member 110 is fixedly connected to the line camera 120. Referring to fig. 2, in some embodiments, the image capturing apparatus 100 includes a mounting frame 140, where the linear camera 120 and the reflector 110 are fixed in position by the mounting frame 140, and the linear motor 130 may drive the linear camera 120 to move along a straight line, for example, along an X direction, so as to scan and splice the surface mount component after the surface mount component is sucked by the machine head 18, and further identify the characteristic position of the surface mount component.
The image capturing apparatus 100 may further include a guide rail 150, the guide rail 150 and the linear motor 130 are fixedly connected to the mounting frame 140, respectively, and an output end of the linear motor 130 is slidably matched with the guide rail 150. The linear motor 130 can drive the image capturing device 100 and the reflecting member 110 to move along the guide rail 150, so as to guide and limit the movement of the image capturing device 100 and the reflecting member 110, thereby improving the movement stability of the image capturing device 100 and the reflecting member 110 and preventing the surface mounting element or the suction head from being damaged due to deflection in the movement process. The linear motor 130 is arranged, so that the image acquisition device 100 can move relative to the suction head of the machine head 18, and compared with the scheme that the image acquisition device 100 is fixed relative to the machine head 18 and the suction head moves back and forth to perform image recognition, the complexity of a mechanism can be reduced, and the structural compactness of the chip mounter 10 is improved.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. An image capturing apparatus, comprising:
the reflecting piece comprises a bearing piece, a first reflecting mirror, a second reflecting mirror and a third reflecting mirror, wherein the first reflecting mirror, the second reflecting mirror and the third reflecting mirror are arranged on the same side of the bearing piece, a gap is formed in the bearing piece, the first reflecting mirror is arranged corresponding to the gap, and the gap is used for reflecting light passing through a surface mounting element; and
the linear array camera is relatively fixed with the position of the reflecting piece, the light inlet of the linear array camera faces the third reflecting mirror, the first reflecting mirror is used for reflecting the reflected light of the surface mounting element to the third reflecting mirror through the second reflecting mirror, and the linear array camera is used for receiving the reflected light of the third reflecting mirror.
2. The image capturing device of claim 1, wherein the carrier includes a base plate and a cover plate detachably connected to the base plate, the cover plate being provided at an edge of the base plate and having the slit, the first mirror being fixed to the base plate through the cover plate; the second reflecting mirror and the third reflecting mirror are respectively fixed on the bottom plate.
3. The image capturing apparatus according to claim 2, wherein the base plate has a reference plane, the first mirror, the second mirror, and the third mirror are respectively disposed obliquely to the reference plane, and an axis direction of the light entrance of the line camera is disposed obliquely to the reference plane; the reference plane is a geometric plane perpendicular to the thickness direction of the base plate.
4. The image capturing device according to claim 3, wherein the carrier includes a holding member detachably connected to the base plate, the holding member is provided at an edge of the base plate and includes holding portions, two mounting portions connected to opposite ends of the holding portions in one-to-one correspondence, and a fastener penetrating the mounting portions, the holding portions have holding surfaces inclined with respect to the reference plane, and the first reflecting mirror is attached to the holding surfaces; the mounting portion comprises a flexible body propped against the bottom plate, the fastening piece is fixedly connected to the bottom plate and used for enabling the bottom plate to squeeze the flexible body so as to respectively adjust the intervals between the two opposite ends of the propping portion and the bottom plate.
5. The image capturing apparatus of claim 4, wherein the cover plate includes an upper cover detachably connected to the adjustment plate and an adjustment plate detachably connected to the bottom plate and covering the abutment; the upper cover is provided with a first groove, the adjusting plate is provided with a second groove, the first groove is communicated with the first groove and is combined to form the gap for reflecting light passing through the surface mounting element, and the adjusting plate is interchangeably arranged on the bottom plate and is used for adjusting the width of the gap; the supporting part further comprises a rotating part arranged at one end of the supporting part, two opposite ends of the supporting part are respectively connected with the two mounting parts in a rotating mode, and the rotating part is used for adjusting the inclination angle of the first reflecting mirror and the bottom plate through the supporting part.
6. The image capturing device of claim 2, wherein the base plate has a boss, the carrier includes a fastener removably attached to the base plate, the fastener has a snap-fit groove, one end of the second mirror is received in the snap-fit groove, and an opposite end of the second mirror is abutted against the boss.
7. The image capturing device according to claim 2, wherein the bottom plate has a first side wall, a second side wall, and a third side wall and a fourth side wall which are disposed opposite to each other and are connected between the first side wall and the second side wall, the first side wall, the second side wall, the third side wall, and the fourth side wall enclose a mounting groove for mounting the third reflecting mirror, and a connection position of any adjacent two of the first side wall, the second side wall, the third side wall, and the fourth side wall is provided with a relief hole.
8. The image capturing apparatus according to any of claims 1 to 7, wherein the image capturing apparatus comprises a linear motor, an output end of the linear motor is fixedly connected to the line camera, and the reflecting member is fixedly connected to the line camera.
9. The image capturing device of claim 8, wherein the image capturing device comprises a mounting bracket and a guide rail, the guide rail and the linear motor are respectively fixedly connected to the mounting bracket, and an output end of the linear motor is in sliding fit with the guide rail.
10. A chip mounter including a head for sucking up the surface mount component and an image pickup device according to any one of claims 1 to 9, said image pickup device being connected to said head, said image pickup device being for moving relative to said head so that said surface mount component corresponds to said slit.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310769473.7A CN116506708B (en) | 2023-06-28 | 2023-06-28 | Image acquisition equipment and chip mounter |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310769473.7A CN116506708B (en) | 2023-06-28 | 2023-06-28 | Image acquisition equipment and chip mounter |
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| CN116506708B CN116506708B (en) | 2023-10-13 |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006105749A (en) * | 2004-10-05 | 2006-04-20 | Shindenshi Corp | Visual inspection device of surface mounting base board |
| CN103235396A (en) * | 2013-04-07 | 2013-08-07 | 西安交通大学 | Multi-degree-of-freedom optical path adjusting system |
| CN204191088U (en) * | 2014-12-03 | 2015-03-04 | 广东工业大学 | Adopt and neglect rink corner camera and many suction nozzles chip mounter of tool IMAQ servicing unit |
| CN106041377A (en) * | 2016-08-12 | 2016-10-26 | 广东省自动化研究所 | Intelligent and compact type welding line visual tracking system |
| CN209248155U (en) * | 2018-05-22 | 2019-08-13 | 中强光电股份有限公司 | Mirror adjustment mechanism and projection arrangement |
| CN212463312U (en) * | 2020-05-26 | 2021-02-02 | 江西易通智能装备制造有限公司 | Shooting device, chip mounter module and chip mounter |
| CN213182281U (en) * | 2020-09-07 | 2021-05-11 | 广州翌贝拓自动化科技有限公司 | Be used for chip mounter flight reflection mechanism of shooing |
| CN115623771A (en) * | 2022-12-16 | 2023-01-17 | 深圳市易通自动化设备有限公司 | Chip mounter and aircraft nose thereof |
| CN219225187U (en) * | 2023-04-07 | 2023-06-20 | 珠海市大道测序生物科技有限公司 | Adjusting device and optical system |
-
2023
- 2023-06-28 CN CN202310769473.7A patent/CN116506708B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006105749A (en) * | 2004-10-05 | 2006-04-20 | Shindenshi Corp | Visual inspection device of surface mounting base board |
| CN103235396A (en) * | 2013-04-07 | 2013-08-07 | 西安交通大学 | Multi-degree-of-freedom optical path adjusting system |
| CN204191088U (en) * | 2014-12-03 | 2015-03-04 | 广东工业大学 | Adopt and neglect rink corner camera and many suction nozzles chip mounter of tool IMAQ servicing unit |
| CN106041377A (en) * | 2016-08-12 | 2016-10-26 | 广东省自动化研究所 | Intelligent and compact type welding line visual tracking system |
| CN209248155U (en) * | 2018-05-22 | 2019-08-13 | 中强光电股份有限公司 | Mirror adjustment mechanism and projection arrangement |
| CN212463312U (en) * | 2020-05-26 | 2021-02-02 | 江西易通智能装备制造有限公司 | Shooting device, chip mounter module and chip mounter |
| CN213182281U (en) * | 2020-09-07 | 2021-05-11 | 广州翌贝拓自动化科技有限公司 | Be used for chip mounter flight reflection mechanism of shooing |
| CN115623771A (en) * | 2022-12-16 | 2023-01-17 | 深圳市易通自动化设备有限公司 | Chip mounter and aircraft nose thereof |
| CN219225187U (en) * | 2023-04-07 | 2023-06-20 | 珠海市大道测序生物科技有限公司 | Adjusting device and optical system |
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|---|---|
| CN116506708B (en) | 2023-10-13 |
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