CN116502385A - Planar microstrip filter temperature characteristic analysis design method and device and storage medium - Google Patents
Planar microstrip filter temperature characteristic analysis design method and device and storage medium Download PDFInfo
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Abstract
The invention discloses a temperature characteristic analysis design method and device of a planar microstrip filter and a storage medium, wherein the temperature characteristic analysis design method of the planar microstrip filter comprises the steps of obtaining a target index range of the designed planar filter and model parameters of the planar filter, carrying out three-dimensional modeling according to the model parameters of the planar filter to obtain a three-dimensional model, carrying out physical processing according to the three-dimensional model to obtain a physical sample plate, and respectively placing the physical sample plate in a first target temperature range, a second target temperature range and a third target temperature range to obtain corresponding first index performance, second index performance and third index performance; and when the first index performance, the second index performance and the third index performance all meet the target index range, confirming that the current three-dimensional model is a plane filter to be designed. The technical problem that the temperature influences the performance of the microstrip filter is solved.
Description
Technical Field
The invention relates to the technical field of filters, in particular to a temperature characteristic analysis design method and device of a planar microstrip filter and a storage medium.
Background
Along with the rapid development of technology, the microstrip filter is widely applied to the field of wireless communication due to the advantages of small size, good performance, high integration level and the like, and particularly at the front end of a receiver, the performance of the microstrip filter directly influences the performance of the whole receiver.
However, the actual use environment of the microstrip filter is not an ideal constant temperature environment, and may be a high temperature environment or a low temperature environment. In these extreme temperature environments, the performance of the microstrip filter is also affected correspondingly, and especially the frequency band of the microstrip filter is shifted and the insertion loss is changed.
However, in the design of the microstrip filter at present, the performance of the microstrip filter in simulation software and the test data at room temperature are mostly concerned, so that the operational environment of the microstrip filter is greatly limited.
Disclosure of Invention
The invention aims to provide a temperature characteristic analysis design method and device of a planar microstrip filter and a storage medium, which are used for solving the technical problem that the temperature influences the performance of the microstrip filter.
In order to achieve the above object, the present invention provides a method for analyzing and designing temperature characteristics of a planar microstrip filter, the method for analyzing and designing temperature characteristics of a planar microstrip filter includes:
obtaining a target index range of a designed plane filter and model parameters of the plane filter;
performing three-dimensional modeling according to the model parameters of the plane filter to obtain a three-dimensional model;
performing physical processing according to the three-dimensional model to obtain a physical template;
the sample plate is respectively placed in a first target temperature range, a second target temperature range and a third target temperature range to obtain corresponding first index performance, second index performance and third index performance;
and when the first index performance, the second index performance and the third index performance all meet the target index range, confirming that the current three-dimensional model is a plane filter to be designed.
Optionally, the step of placing the sample plate in the first target temperature range, the second target temperature range and the third target temperature range to obtain the corresponding first index performance, second index performance and third index performance includes:
placing the sample plate in a first target temperature range for performance test to obtain first index performance;
if the first index performance meets the target index range, placing the sample plate in a second target temperature range for performance test to obtain second index performance;
and if the second index performance meets the target index range, placing the sample plate in a third target temperature range for performance test to obtain a third index performance.
Optionally, after the step of placing the sample plate in the first target temperature range, the second target temperature range, and the third target temperature range to obtain the corresponding first indicator performance, second indicator performance, and third indicator performance, the method further includes:
and if any one or more of the first index performance, the second index performance and the third index performance does not meet the target index range, returning to execute the acquisition of the target index range of the designed plane filter and the model parameters of the plane filter.
Optionally, when the first index performance, the second index performance, and the third index performance all meet the target index range, the step of determining that the current three-dimensional model is a planar filter to be designed includes:
determining a temperature function according to the first index value, the second index value and the third index value;
correcting model parameters of the three-dimensional model according to the temperature function and the target index range;
resetting the corrected three-dimensional model as the current three-dimensional model;
and confirming that the current three-dimensional model is a plane filter to be designed.
Optionally, the step of determining a temperature function according to the first index value, the second index value, and the third index value includes:
acquiring a first index value and a first temperature characteristic value when the sample plate is in the first target temperature range;
acquiring a second index value and a second temperature characteristic value when the sample plate is in the second target temperature range;
acquiring a third index value and a third temperature characteristic value when the sample plate is in the third target temperature range;
and fitting according to the first index value, the first temperature characteristic value, the second index value, the second temperature characteristic value, the third index value and the third temperature characteristic value to obtain the temperature function.
Optionally, the first index value, the second index value, and the third index value each include a center frequency, an insertion loss, passband ripple, out-of-band rejection, and a voltage standing wave ratio, and the first temperature characteristic value, the second temperature characteristic value, and the third temperature characteristic value each include a frequency temperature coefficient and a high-temperature low-temperature specific temperature.
Optionally, the target targets of the target range include center frequency, insertion loss, passband ripple, out-of-band rejection, and voltage standing wave ratio.
In order to achieve the above object, the present invention also provides a planar microstrip filter temperature characteristic analysis design apparatus, which includes:
the parameter acquisition module is used for acquiring a target index range of the designed plane filter and model parameters of the plane filter;
the modeling module is used for carrying out three-dimensional modeling according to the model parameters of the plane filter so as to obtain a three-dimensional model;
the processing module is used for processing the real object according to the three-dimensional model to obtain a real object sample plate;
the test module is used for respectively placing the sample plate in a first target temperature range, a second target temperature range and a third target temperature range to obtain corresponding first index performance, second index performance and third index performance; and confirming that the current three-dimensional model is a planar filter to be designed when the first index performance, the second index performance and the third index performance all meet the target index range.
In order to achieve the above object, the present invention also proposes a storage medium, which when executed by a processor, causes the processor to execute the planar microstrip filter temperature characteristic analysis design method as described above.
In order to achieve the above object, the present invention also provides a planar microstrip filter temperature characteristic analysis design apparatus, including a memory and a processor, the memory storing a computer program, which when executed by the processor, causes the processor to execute the steps of the planar microstrip filter temperature characteristic analysis design method as described above.
The invention provides a temperature characteristic analysis design method and device of a planar microstrip filter and a storage medium, wherein the temperature characteristic analysis design method of the planar microstrip filter comprises the steps of obtaining a target index range of the designed planar filter and model parameters of the planar filter, carrying out three-dimensional modeling according to the model parameters of the planar filter to obtain a three-dimensional model, carrying out physical processing according to the three-dimensional model to obtain a physical sample plate, and respectively placing the physical sample plate in a first target temperature range, a second target temperature range and a third target temperature range to obtain corresponding first index performance, second index performance and third index performance; and when the first index performance, the second index performance and the third index performance all meet the target index range, confirming that the current three-dimensional model is a plane filter to be designed. According to the invention, through carrying out three-dimensional modeling on the designed planar filter and carrying out physical processing on the three-dimensional model obtained by modeling, and then testing the performance of the planar filter in a plurality of environments, the comprehensive performance of the designed planar filter under various temperature conditions can be ensured to meet the target index range by carrying out test on the physical sample plates under different temperatures, and the planar filter meeting the target index range under various temperature environments is screened out by carrying out physical processing, so that the planar filter determined by the scheme is rarely affected by temperature, the performance stability of the planar filter under various temperatures is ensured, and the technical problem that the performance of the microstrip filter is affected by temperature is solved.
Drawings
The invention is further described below with reference to the drawings and examples;
fig. 1 is a flow chart of a temperature characteristic analysis design method of a planar microstrip filter according to an embodiment.
FIG. 2 is a diagram of an interface diagram of a temperature characteristic analysis design method of a planar microstrip filter according to an embodiment.
Fig. 3 is a flow chart of a temperature characteristic analysis design method of a planar microstrip filter according to an embodiment.
Fig. 4 is a flow chart of a temperature characteristic analysis design method of a planar microstrip filter according to an embodiment.
Fig. 5 is a comparison chart of normal temperature and high temperature test of a design method for analyzing temperature characteristics of a planar microstrip filter according to an embodiment.
Fig. 6 is a comparison chart of normal temperature and low temperature test of a design method for analyzing temperature characteristics of a planar microstrip filter according to an embodiment.
Fig. 7 is a normal temperature test chart of a planar microstrip filter temperature characteristic analysis design apparatus according to an embodiment.
Detailed Description
Reference will now be made in detail to the present embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the accompanying drawings are used to supplement the description of the written description so that one can intuitively and intuitively understand each technical feature and overall technical scheme of the present invention, but not to limit the scope of the present invention.
The invention provides a temperature characteristic analysis design method of a planar microstrip filter, which is used for solving the technical problem that the temperature influences the performance of the microstrip filter.
In one embodiment, as shown in fig. 1, a method for designing a temperature characteristic analysis of a planar microstrip filter, the method for designing a temperature characteristic analysis of a planar microstrip filter includes:
s1, acquiring a target index range of a designed plane filter and model parameters of the plane filter;
the target index range of the plane filter refers to an index requirement of the plane filter which is required to be designed by a user, and the target index range comprises a target index type and a parameter numerical range corresponding to the target index. Optionally, the target index may be one or more of center frequency, insertion loss, passband ripple, out-of-band rejection, and voltage standing wave ratio, where a parameter value range corresponding to the index is set by a user according to needs, for example, when the parameter value range of the center frequency is set to 1HZ-2HZ, the target index range is the center frequency 1HZ-2HZ. Through the parameters, a user can design the planar filter, and the designed planar filter determines a unique designed planar filter through model parameters such as line length, line width, coupling interval size parameters and the like. Therefore, the target index range of the designed planar filter and the model parameters of the planar filter can be directly obtained.
S2, carrying out three-dimensional modeling according to the model parameters of the plane filter to obtain a three-dimensional model;
at this time, three-dimensional modeling is generally performed through model parameters of the plane filter, and the model is obtained through modeling by various modeling software, namely, a three-dimensional model. The modeling software can be software such as filters Solutions, filters Wiz Pro, filterCAD, filterLab and the like. The interactive interface of which may be seen with reference to fig. 2.
S3, performing physical processing according to the three-dimensional model to obtain a physical template;
the three-dimensional model is established according to model parameters, so parameters required by processing can be determined according to the three-dimensional model, and the processing of the sample plate can be realized according to the processing parameters. This process may be implemented by commonly used modeling software, 3D printing software.
S4, respectively placing the sample plate in a first target temperature range, a second target temperature range and a third target temperature range to obtain corresponding first index performance, second index performance and third index performance;
and S5, when the first index performance, the second index performance and the third index performance all meet the target index range, confirming that the current three-dimensional model is a plane filter to be designed.
According to the invention, the designed planar filter is subjected to three-dimensional modeling, the three-dimensional model obtained by modeling is subjected to physical processing, and then the performance of the planar filter in a plurality of environments is tested.
Optionally, after performing three-dimensional modeling according to the model parameters of the plane filter to obtain a three-dimensional model, the method further includes:
the model parameters are adjusted to achieve optimum microstrip filter performance.
In the simulation process of the three-dimensional model obtained by three-dimensional modeling, the three-dimensional model can be finely adjusted by changing model parameters, so that the optimal three-dimensional model of the filter is obtained in a certain range.
Optionally, the step of performing physical processing according to the three-dimensional model to obtain a physical template includes;
according to the three-dimensional model, a practical layout is derived;
the three-dimensional model is a three-dimensional drawing built by modeling software assistance, and the three-dimensional model can be conveniently exported into a real object layout through the drawing export function of the software, wherein the real object layout is actually a two-dimensional template drawing.
And processing the material according to the real object layout to obtain a real object template.
The material may be fabricated by using a 3D printer or the like according to the material layout, and the material template is not different from the product plane filter actually fabricated, but is called a material template because only the sample is fabricated and mass production is not performed. By establishing the sample plate, the subsequent parameter setting and the filter performance test can be facilitated.
In one embodiment, as shown in fig. 3, the step of placing the sample plate in the first target temperature range, the second target temperature range and the third target temperature range to obtain the corresponding first indicator performance, second indicator performance and third indicator performance includes:
s41, placing the sample plate in a first target temperature range for performance test to obtain first index performance;
as shown in fig. 3, the first target temperature range is a normal temperature range, and the first index performance obtained by performing the performance test in this range is a functional performance parameter of the sample plate at normal temperature.
Alternatively, the normal temperature range may be set to any range of more than-40 ℃ and less than 85 ℃.
S42, if the first index performance meets the target index range, placing the sample plate in a second target temperature range for performance test to obtain second index performance;
if the first index performance meets the target index range, the measured first index performance meets the target index range, that is, when the first target temperature range is a normal temperature range, the index requirement of the target index range of the designed plane filter is met. The second target temperature range can be set as a high temperature range, and the second index performance obtained by performance test in the high temperature range is a functional performance parameter of the sample plate at high temperature.
Alternatively, the high temperature range may take a range of greater than or equal to 85 ℃.
And S43, if the second index performance meets the target index range, placing the sample plate in a third target temperature range for performance test to obtain a third index performance.
If the second index performance meets the target index range, that is, the second index performance measured at the moment meets the target index range, that is, when the second target temperature range is a high temperature range, the index requirement of the designed target index range of the plane filter is met, the third target temperature range can be set to be a low temperature range, and the second index performance obtained by performing the performance test in the range is a functional performance parameter of the physical template at a high temperature.
Optionally, the low temperature range is less than or equal to the range of-40 ℃.
Through the embodiment, the first index performance, the second index performance and the third index performance corresponding to the first target temperature range, the second target temperature range and the third target temperature range can be respectively obtained, effective measurement can be realized through the sequential detection, and the next measurement is performed only when the index performance obtained by the last measurement meets the target index range, so that the subsequent continuous invalid measurement during single unsuccessful is avoided, the time and money cost are saved, and the service life loss of the measuring equipment is reduced.
In an embodiment, the step of placing the sample plate in the first target temperature range, the second target temperature range and the third target temperature range to obtain the corresponding first indicator performance, second indicator performance and third indicator performance further includes:
and if any one or more of the first index performance, the second index performance and the third index performance does not meet the target index range, returning to execute the acquisition of the target index range of the designed plane filter and the model parameters of the plane filter.
In the above process, if any one or more of the first index performance, the second index performance and the third index performance does not meet the target index range, returning to execute to acquire the target index range of the designed planar filter and the model parameters of the planar filter specifically means resetting the real dielectric constant and the loss tangent obtained by reverse fitting in simulation software, readjusting the dielectric constant and the loss tangent parameters of the three-dimensional model, then performing simulation, and repeating the executing steps S3-S5 until the simulation result meets the target index requirement, and then confirming that the current three-dimensional model is the planar filter to be designed.
The embodiment can realize that when the index performance obtained by single measurement does not meet the target index range, the target index range of the designed plane filter and the model parameters of the plane filter are returned to be obtained, so that subsequent continuous invalid measurement is avoided when single measurement is unsuccessful, the time and money cost are saved, and the service life loss of the measuring equipment is reduced. And the model is corrected, which is equivalent to the offset of the high and low temperature frequency experiment, so that the offset under the high and low temperature condition can be estimated, the temperature drift characteristic can not be changed, and the range can not be exceeded when the estimated index is estimated. Thereby reducing the number of corrections and enabling faster determination of the model.
In an embodiment, as shown in fig. 4, when the first index performance, the second index performance, and the third index performance all meet the target index range, the step of determining that the three-dimensional model is the planar filter to be designed includes:
s51, determining a temperature function according to the first index value, the second index value and the third index value;
and the temperature function is obtained by fitting according to the first index value, the second index value and the third index value.
S52, correcting model parameters of the three-dimensional model according to the temperature function and the target index range;
s53, resetting the corrected three-dimensional model to be the current three-dimensional model;
s54, confirming that the three-dimensional model is a plane filter to be designed.
The above embodiment can reduce the frequency offset of the designed planar filter by correcting the model parameters of the three-dimensional model through the temperature function and the target index range. The plane filter represented by the corrected three-dimensional model can be more suitable for various temperature change environments.
In one embodiment, the step of determining the temperature function according to the first index value, the second index value, and the third index value includes:
acquiring a first index value and a first temperature characteristic value when the sample plate is in the first target temperature range;
wherein the first index value refers to the index type at the current temperature, and the first temperature characteristic value refers to the index value at the current temperature.
Acquiring a second index value and a second temperature characteristic value when the sample plate is in the second target temperature range;
wherein the second index value refers to the index type at the current temperature, and the second temperature characteristic value refers to the index value at the current temperature.
Acquiring a third index value and a third temperature characteristic value when the sample plate is in the third target temperature range;
and fitting according to the first index value, the first temperature characteristic value, the second index value, the second temperature characteristic value, the third index value and the third temperature characteristic value to obtain the temperature function.
Wherein the third index value refers to the index type at the current temperature, and the third temperature characteristic value refers to the index value at the current temperature.
Based on the above embodiment, the first target temperature range is taken as the normal temperature, the second target temperature range is taken as the low temperature, the third target temperature range is taken as the high temperature, and the normal temperature test data and the high and low temperature test data are compared and analyzed, as shown in fig. 5, 6 and 7, wherein 21 is a normal temperature test curve, 22 is a high temperature test curve, 23 is a low temperature test curve, and according to the temperature test curve, the temperature mainly affects the center frequency and the insertion loss of the microstrip filter. Further, compared with normal temperature measurement and high temperature measurement, the center frequency of the microstrip filter moves towards low frequency, and the insertion loss is slightly increased; and during low-temperature measurement, the center frequency of the microstrip filter moves towards high frequency, and the insertion loss is slightly reduced. Further analysis of the material properties of the ceramic substrate has found that the dielectric constant of the ceramic substrate increases slightly at high temperatures and decreases slightly at low temperatures.
The relation between the dielectric constant and the frequency of the ceramic substrate is:
λ＝λ_0/√(ε_r)
where ε_r is the relative permittivity of transmission and λ0 is the wavelength of electromagnetic waves transmitted in vacuum. It can be seen from the formula that the higher the relative permittivity of the dielectric substrate, the shorter the wavelength of electromagnetic waves transmitted therein.
After the influence of the temperature on the ceramic substrate is clear, the error of the frequency offset is corrected by inputting a large amount of temperature data and electrical property data in a database and fitting a related temperature function.
Through the process, the three-dimensional model can be subjected to modeling correction again, so that the plane filter represented by the three-dimensional model can be more suitable for various temperature change environments, and the frequency band meets the index requirement.
Optionally, the first index value, the second index value, and the third index value each include a center frequency, an insertion loss, passband ripple, out-of-band rejection, and a voltage standing wave ratio, and the first temperature characteristic value, the second temperature characteristic value, and the third temperature characteristic value each include a frequency temperature coefficient and a high-temperature low-temperature specific temperature.
By comprehensively considering the factors, the temperature range of the corrected three-dimensional model can be wider.
In an embodiment, the target targets of the target range include center frequency, insertion loss, passband ripple, out-of-band rejection, and voltage standing wave ratio.
The invention also provides a device for analyzing and designing the temperature characteristics of the planar microstrip filter, as shown in fig. 4, the device for analyzing and designing the temperature characteristics of the planar microstrip filter comprises:
the parameter acquisition module 10 acquires a target index range of the designed planar filter and model parameters of the planar filter;
the modeling module 20 performs three-dimensional modeling according to the model parameters of the plane filter to obtain a three-dimensional model;
a processing module 30 for performing physical processing according to the three-dimensional model to obtain a physical template;
the test module 40 is used for respectively placing the sample plate in a first target temperature range, a second target temperature range and a third target temperature range to obtain corresponding first index performance, second index performance and third index performance; and confirming that the current three-dimensional model is a planar filter to be designed when the first index performance, the second index performance and the third index performance all meet the target index range.
The present invention also proposes a storage medium, which when executed by a processor causes the processor to execute the planar microstrip filter temperature characteristic analysis design method as described above.
It should be noted that, since the storage medium of the present application includes all the steps of the above-mentioned design method for analyzing the temperature characteristics of the planar microstrip filter, the storage medium may also implement all the schemes of the design method for analyzing the temperature characteristics of the planar microstrip filter, and have the same beneficial effects, which are not described herein again.
The temperature characteristic analysis design method of the planar microstrip filter in the embodiment of the method is implemented. The above described apparatus embodiments are merely illustrative, wherein the units illustrated as separate components may or may not be physically separate, i.e. may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art will appreciate that all or some of the steps, systems, and methods disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes both volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as known to those skilled in the art. Computer storage 15 storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. Furthermore, as is well known to those of ordinary skill in the art, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism 20 and may include any information delivery media.
The invention also provides a temperature characteristic analysis design device of the planar microstrip filter, which comprises a memory and a processor, wherein the memory stores a computer program, and the computer program, when executed by the processor, causes the processor to execute the steps of the temperature characteristic analysis design method of the planar microstrip filter.
It should be noted that, since the planar microstrip filter temperature characteristic analysis design device of the present application includes all the steps of the planar microstrip filter temperature characteristic analysis design method, the planar microstrip filter temperature characteristic analysis design device may also implement all the schemes of the planar microstrip filter temperature characteristic analysis design method, and have the same beneficial effects, which are not described herein again.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
Claims (10)
1. The planar microstrip filter temperature characteristic analysis design method is characterized by comprising the following steps of:
obtaining a target index range of a designed plane filter and model parameters of the plane filter;
performing three-dimensional modeling according to the model parameters of the plane filter to obtain a three-dimensional model;
performing physical processing according to the three-dimensional model to obtain a physical template;
the sample plate is respectively placed in a first target temperature range, a second target temperature range and a third target temperature range to obtain corresponding first index performance, second index performance and third index performance;
and when the first index performance, the second index performance and the third index performance all meet the target index range, confirming that the current three-dimensional model is a plane filter to be designed.
2. The method of designing a planar microstrip filter according to claim 1, wherein the step of placing the sample plate in a first target temperature range, a second target temperature range, and a third target temperature range, respectively, to obtain the corresponding first index performance, second index performance, and third index performance comprises:
placing the sample plate in a first target temperature range for performance test to obtain first index performance;
if the first index performance meets the target index range, placing the sample plate in a second target temperature range for performance test to obtain second index performance;
and if the second index performance meets the target index range, placing the sample plate in a third target temperature range for performance test to obtain a third index performance.
3. The method for designing temperature characteristic analysis of planar microstrip filter according to claim 1, wherein after the step of placing the sample plate in the first target temperature range, the second target temperature range and the third target temperature range to obtain the corresponding first index performance, second index performance and third index performance, respectively, the method further comprises:
if any one or more of the first index performance, the second index performance and the third index performance does not meet the target index range, returning to execute the acquisition of the target index range of the designed plane filter and the model parameters of the plane filter;
resetting the corrected three-dimensional model as the current three-dimensional model;
and confirming that the current three-dimensional model is a plane filter to be designed.
4. The method for designing a planar microstrip filter according to claim 1, wherein when the first index performance, the second index performance, and the third index performance all satisfy the target index range, the step of determining that the current three-dimensional model is the planar filter to be designed comprises:
determining a temperature function according to the first index value, the second index value and the third index value;
and correcting model parameters of the three-dimensional model according to the temperature function and the target index range.
5. The planar microstrip filter temperature characteristic analysis design method according to claim 4, wherein said step of determining a temperature function according to said first index value, said second index value, and said third index value comprises:
acquiring a first index value and a first temperature characteristic value when the sample plate is in the first target temperature range;
acquiring a second index value and a second temperature characteristic value when the sample plate is in the second target temperature range;
acquiring a third index value and a third temperature characteristic value when the sample plate is in the third target temperature range;
and fitting according to the first index value, the first temperature characteristic value, the second index value, the second temperature characteristic value, the third index value and the third temperature characteristic value to obtain the temperature function.
6. The planar microstrip filter temperature characteristic analysis design method according to claim 5, wherein said first index value, said second index value, and said third index value each include a center frequency, an insertion loss, passband ripple, out-of-band rejection, and a voltage standing wave ratio, and said first temperature characteristic value, said second temperature characteristic value, and said third temperature characteristic value each include a frequency temperature coefficient, and a high-temperature low-temperature specific temperature.
7. The planar microstrip filter temperature characteristic analysis design method according to claim 1, wherein the target indexes of the target index range include center frequency, insertion loss, passband ripple, out-of-band rejection, and voltage standing wave ratio.
8. The planar microstrip filter temperature characteristic analysis design device is characterized by comprising:
the parameter acquisition module is used for acquiring a target index range of the designed plane filter and model parameters of the plane filter;
the modeling module is used for carrying out three-dimensional modeling according to the model parameters of the plane filter so as to obtain a three-dimensional model;
the processing module is used for processing the real object according to the three-dimensional model to obtain a real object sample plate;
the test module is used for respectively placing the sample plate in a first target temperature range, a second target temperature range and a third target temperature range to obtain corresponding first index performance, second index performance and third index performance; and confirming that the current three-dimensional model is a planar filter to be designed when the first index performance, the second index performance and the third index performance all meet the target index range.
9. A storage medium, characterized in that the computer program, when executed by a processor, causes the processor to perform the planar microstrip filter temperature characteristic analysis design method according to any one of claims 1 to 8.
10. A planar microstrip filter temperature characteristic analysis design apparatus comprising a memory and a processor, the memory storing a computer program which, when executed by the processor, causes the processor to perform the steps of the planar microstrip filter temperature characteristic analysis design method as claimed in any one of claims 1 to 8.
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