CN116490969A

CN116490969A - Radiating plate, electronic assembly and terminal

Info

Publication number: CN116490969A
Application number: CN202180072557.4A
Authority: CN
Inventors: 万军平; 崔培华
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-11-24
Filing date: 2021-11-24
Publication date: 2023-07-25
Also published as: WO2023092326A1

Abstract

Provided are a heat dissipation plate, an electronic component and a terminal. The cooling plate is provided with a liquid inlet and a cavity, and the refrigerating fluid flows in the cavity after entering the cooling plate. The cavity comprises a slow flow area and a main heat dissipation area, the liquid inlet is communicated with the slow flow area, the slow flow area is communicated with the main heat dissipation area, and the refrigerating fluid sequentially flows through the liquid inlet, the slow flow area and the main heat dissipation area. After the flow of the refrigerant liquid to the slow flow area, the flow velocity of the refrigerant liquid is reduced and the flow rate tends to be stable when the refrigerant liquid flows out of the slow flow area from the liquid flow port of the slow flow area. The cooling liquid has less scouring to the main heat dissipation area, so that the scouring corrosion of the main heat dissipation area is slight, and the service life of the heat dissipation plate is prolonged.

Description

Radiating plate, electronic assembly and terminal

Technical Field

The application relates to the technical field of electronic component structures, in particular to a heat dissipation plate, an electronic component and a terminal.

Background

With the development of intelligent vehicles, the automatic driving function of the vehicle is also more and more perfect. The controller is an important vehicle-mounted electronic device, and can judge and analyze according to road condition information acquired by a vehicle-mounted laser radar, a millimeter wave radar, a vehicle-mounted camera or the like, and then give a driving instruction. The controller includes the heating device, and in the course of the work, the heating device can produce the heat, needs to distribute away the heat of heating device to guarantee the normal operating condition of heating device. As the application of the controller in the vehicle is more and more abundant, the functions and the application of the controller are continuously expanded, and the performance is improved. Therefore, how to quickly dissipate heat of the controller becomes a technical problem to be solved.

Disclosure of Invention

The application provides a heating panel, electronic component and terminal to promote radiating effect and the life of heating panel, further, electronic component can two-sided overall arrangement heating device, overall arrangement two-sided heating panel correspondingly, can also reduce the area that electronic component occupy.

In a first aspect, the present application provides a heat sink, such as a liquid cooled panel. The heat dissipation plate is provided with a liquid inlet and a cavity, wherein the cavity can be formed into a flow channel of refrigerating fluid, and the refrigerating fluid flows in the cavity after entering the heat dissipation plate from the liquid inlet. The cavity comprises a slow flow area and a main heat dissipation area, wherein the liquid inlet is communicated with the slow flow area, the slow flow area is provided with a liquid flow port, and the liquid flow port is communicated with the main heat dissipation area. The slow flow area is communicated with the main heat dissipation area. That is, after the refrigerant liquid enters the cavity from the liquid inlet, the refrigerant liquid enters the slow flow area first, and then the refrigerant liquid entering the slow flow area flows from the liquid outlet to the main heat dissipation area.

Therefore, the application provides a heating panel, through set up the slow flow district on the heating panel, after the refrigerating fluid flows through the slow flow district, the velocity of flow of the refrigerating fluid that flows from the mouth reduces and the flow tends to stabilize. The refrigerating fluid can flow to the main heat dissipation area relatively at low speed and stably, so that a more stable and uniform heat dissipation effect on the heating device is achieved. Meanwhile, due to the buffer function of the slow flow area, the scouring of the main heat dissipation area by the refrigerating fluid is small, so that the scouring corrosion of the main heat dissipation area is slight, and the service life of the heat dissipation plate is prolonged.

The heat dissipation plate comprises a refrigerating fluid, and the refrigerating fluid is positioned in the cavity. In this scheme, be favorable to utilizing above-mentioned refrigerant liquid to promote the radiating effect of heating panel.

In a specific technical solution, the refrigerant liquid may be water, oil or refrigerant, which is not limited in this application.

The main heat dissipation area of the heat dissipation plate is specifically provided with the heat dissipation fins, so that the heat dissipation capacity of the main heat dissipation area is further improved, and the heat dissipation effect of the main heat dissipation area is better.

The heat dissipating plate may include a plurality of heat dissipating fins, and may be provided in a region other than the main heat dissipating region. In addition, the shapes of the different heat dissipation fins can be the same or different, and the application is not limited to the shape.

The specific structure of the slow flow area is not limited, and in one technical scheme, the slow flow area is provided with a first buffer port, and the first buffer port and the liquid inlet are arranged in a staggered manner. Through this first buffer mouth and feed liquor mouth looks mistake setting, realized slowing down the velocity of flow of refrigerant liquid to realized more even radiating effect.

In a specific technical scheme, the slow flow area comprises a first slow flow structure, and the liquid inlet is directly connected with the first slow flow structure, namely, the refrigerating liquid can sequentially flow through the liquid inlet and the first slow flow structure. The first buffer port is arranged on the first slow flow structure, the refrigerating fluid can flow out of the first slow flow structure from the first buffer port, and the refrigerating fluid can flow to the main heat dissipation area through the fluid port.

In one implementation manner, the first flow-retarding structure includes a retaining wall, which is specifically perpendicular to the flow direction of the refrigerant liquid of the liquid inlet, or the retaining wall is perpendicular to the extending direction of the liquid inlet. In this scheme, the refrigerant liquid gets into first slow flow structure from the inlet, directly dashes above-mentioned barricade.

Specifically, the first buffering structure may be provided with at least two first buffering openings, so that the refrigerant liquid is split in the first buffering structure and flows out from each first buffering opening at a lower speed.

The buffer area may further have a second buffer port, which may be specifically set in error with the liquid inlet, or may further be set opposite to the liquid inlet, which is not limited in this application. The second buffer port may be provided in an area between the liquid inlet port and the first buffer port, or the second buffer port may be further provided between the first buffer port and the liquid flow port. The position of the second buffer port relative to the first buffer port is not limited in the present application.

In one implementation manner, the slow flow region includes at least two stages of slow flow structures, so as to promote a slow flow effect. For example, the slow flow region may further include a second slow flow structure disposed on a side of the first slow flow structure away from the liquid inlet, and the second slow flow structure is communicated with the first buffer port, and the second buffer port is disposed on the second slow flow structure. That is, the refrigerant fluid flows out of the first buffer structure and then flows to the second buffer structure through the first buffer port. The second buffer port and the first buffer port are arranged in a staggered manner. According to the scheme, at least two stages of slow flow of the refrigerating fluid can be realized, the slow flow effect is good, the flow speed of the refrigerating fluid flowing into the main heat dissipation area is further slow and uniform, and therefore the heat dissipation effect and the service life of the main heat dissipation area are further improved.

The second slow flow structure can comprise a second buffer port, so that the flow speed of the refrigerating fluid flowing out of the second slow flow structure is low, the refrigerating fluid can be stored in the second slow flow structure, and then flows out of the second slow flow structure at a stable speed and flows to the main radiating area.

The number of main heat dissipation areas included in the heat dissipation plate is not limited. For example, the heat sink may be made to include at least two primary heat sinks and the slow flow region may include at least two fluid ports. The main heat dissipation areas are connected with the liquid outlets in a one-to-one correspondence manner. In the scheme, the heat dissipation capacity of each main heat dissipation area is more consistent, and the heat dissipation areas have better heat dissipation effect. In a specific embodiment, the main heat dissipation area of the heat dissipation plate can be connected with the heat generation devices arranged on the circuit board in a one-to-one correspondence manner. So as to facilitate the heat dissipation of the heat generating device of the circuit board.

The heat sink has a first wall for connection to a heat generating device, and the first wall may be considered as a wall surface on which the heat sink actually operates. Specifically, one side of the first wall is connected with a heating device, and the other side is connected with a heat dissipation fin. The heat dissipation fins are connected to the first wall so that heat can be dissipated at the heat dissipation fins, and therefore the heat dissipation effect of the heat dissipation plate is further improved.

The heat dissipation plate further comprises an auxiliary heat dissipation area, and the auxiliary heat dissipation area is arranged on the periphery of the heat dissipation area. The baffle wall between the main heat dissipation area and the auxiliary heat dissipation area is provided with an opening, so that the opening can be communicated with the main heat dissipation area and the auxiliary heat dissipation area. After the cooling liquid enters the main heat dissipation area to dissipate heat of the heating device, the cooling liquid flows from the opening to the auxiliary heat dissipation area to dissipate heat of the area corresponding to the auxiliary heat dissipation area, so that the heat dissipation effect of the electronic component is improved.

The heat dissipation plate further comprises a second wall, the second wall is arranged opposite to the first wall, and the distance between the edge of the opening facing the second wall and the first wall is smaller than the distance between the wall surface of the heat dissipation fin facing the second wall and the first wall. When the heat dissipation plate is in a use state, the first wall is positioned above the second wall, and the scheme can ensure that at least part of structures of the heat dissipation fins are immersed in the refrigerating fluid, and then the refrigerating fluid can flow from the opening of the baffle wall to the auxiliary heat dissipation area. The scheme can ensure that the heat radiating fins radiate heat through the refrigerating fluid.

In another aspect, the first wall has a boss, and the heat dissipating fin is connected to the boss. In this technical scheme, the distance between the edge of the opening facing the second wall and the first wall is smaller than the distance between the wall surface of the boss facing the second wall and the first wall. In the same way, when the heat dissipation plate is in a use state, the whole heat dissipation fin can be immersed in the refrigerating fluid by the scheme, and the heat dissipation effect of the heat dissipation fin is improved. In addition, this scheme can also make boss and refrigerating fluid contact for the refrigerating fluid can take away the heat of first wall, is favorable to promoting the radiating effect of first wall.

The number of the openings is not limited, and the blocking wall may include a plurality of openings to facilitate the flow of the refrigerant fluid between the main heat dissipation area and the auxiliary heat dissipation area.

In a second aspect, the present application further provides an electronic assembly including a circuit board, a first heat-generating device, and the heat dissipation plate of the first aspect. The circuit board comprises a first side surface and a second side surface which are opposite to each other, and the first heating device is arranged on the first side surface of the circuit board. The heat dissipation plate comprises a first heat dissipation plate, wherein the first heat dissipation plate is arranged on one side, away from the circuit board, of the first heat generation device and is used for dissipating heat of the first heat generation device. In this technical scheme, because the radiating effect of heating panel is good to and life is longer, thereby promote electronic component heat dissipation ability and life.

In one embodiment, the electronic component may further include a second heat generating device, where the second heat generating device is disposed on the second side of the circuit board. The heat dissipation plate further comprises a second heat dissipation plate, and the second heat dissipation plate is arranged on one side, away from the circuit board, of the second heat generation device and is used for dissipating heat of the second heat generation device. In this application technical scheme, the both sides of circuit board are provided with first heating panel and second heating panel respectively for the both sides of circuit board can all set up the heating device. The scheme can improve the integration level of the heating device of the circuit board so as to reduce the area of the circuit board. The electronic component occupies a small area, so that the electronic component in the embodiment of the application can be conveniently installed. In terms of course, the solution allows to double the power of the electronic assembly, while the area of the circuit board of the electronic assembly remains constant.

When the heat dissipation plate is specifically arranged, the main heat dissipation area of the first heat dissipation plate is in heat conduction connection with the first heating device, and the main heat dissipation area of the second heat dissipation plate is in heat conduction connection with the second heating device. In this embodiment, the heat dissipation effect of the electronic component is improved by utilizing the main heat dissipation area to dissipate heat of the heat generating device.

The cavity of the first heat dissipation plate is connected in series with the cavity of the second heat dissipation plate, that is, the first heat dissipation plate is connected in series with the second heat dissipation plate. The refrigerating fluid flows through the first radiating plate and the second radiating plate in sequence. In the embodiment of the application, no matter the first radiating plate and the second radiating plate are connected in series or in parallel, the work of the two radiating plates can be realized by only using one group of refrigerating devices, so that the volume of the electronic component is reduced.

When the electronic component is specifically assembled, a first heat conduction layer is connected between the first heating device and the first heat dissipation plate, and a second heat conduction layer is connected between the second heating device and the second heat dissipation plate. So as to improve the heat conduction efficiency between the first heating device and the first heat dissipation plate and the heat conduction efficiency between the second heating device and the second heat dissipation plate.

Specifically, the first heat conduction layer and the second heat conduction layer can be heat conduction glue or heat conduction foam, so that the heat conduction foam has heat conduction and elasticity, the contact area between the heat dissipation plate and the metal base is favorably improved, and the heat dissipation effect is improved. For the specific materials of the first heat conducting layer and the second heat conducting layer, the application is not limited, and for example, the material with higher heat dissipation efficiency such as the phase change material layer, the carbon fiber layer, the graphite layer, the copper layer or the aluminum layer can be used. The material of the first heat conducting layer and the material of the second heat conducting layer may be the same or different, which is not limited in this application.

In order to mount the first heat generating device, the electronic assembly may further include a first sub-circuit board and a first bracket, and the first heat generating device may be mounted on the circuit board through the first sub-circuit board. Specifically, the first heating device is mounted on a first sub-circuit board, the first sub-circuit board is mounted on a first bracket, the first bracket is mounted on a first side surface of the circuit board, and the first heating device is connected with the circuit board through a connector. The heating device is mounted on the circuit board in the scheme with high strength, can adapt to scenes such as vibration and the like, and is favorable for improving the stability of the electronic component. In addition, in the scheme, the first heating device and the second heating device are respectively connected with the circuit board through the connector, so that the heating devices can be modularized, and the electronic assembly is easy to upgrade.

When the first support and the circuit board are specifically installed, the first support and the circuit board can be sequentially connected by using the first connecting piece, and the second connecting piece is sequentially connected with the circuit board and the first support. In a specific implementation manner, the first connecting piece may be a connecting piece, and the second connecting piece may also be a connecting piece, so that the connection operation is convenient, and detachable connection can be realized. When the first connecting piece and the second connecting piece are specifically installed, the extending shaft of the first connecting piece and the extending shaft of the second connecting piece can be arranged in a staggered mode. The first support installation strength of being favorable to promoting promotes electronic component's structural stability.

In addition, the electronic assembly may further include a second sub-circuit board and a second bracket, the second heat generating device being mounted to the circuit board through the second sub-circuit board. Specifically, the second heating device is mounted on a second sub-circuit board, the second sub-circuit board is mounted on a second bracket, the second bracket is mounted on a second side surface of the circuit board, and the second heating device is connected with the circuit board through a connector.

When the first bracket and the second bracket are specifically installed, the first bracket, the circuit board and the second bracket can be sequentially stacked, the third connecting piece is sequentially connected with the first bracket, the circuit board and the second bracket, and the fourth connecting piece is sequentially connected with the second bracket, the circuit board and the first bracket. In addition, the extending shaft of the third connecting piece is staggered with the extending shaft of the fourth connecting piece. This scheme can connect three parts of first support, circuit board and second support from both sides, and two connecting pieces looks mistake sets up, and consequently the installation intensity of first support and second support is stronger, is favorable to promoting electronic component's stability.

The specific structure of the electronic component is not limited, and for example, the electronic component may be a controller. The chip in the controller is the heating device, and the calorific capacity is higher, uses the electronic component among the this application technical scheme, is favorable to promoting the radiating effect of controller, promotes the integrated level of controller.

The number of layers of the circuit board and the number of layers of the heat dissipation plate included in the above-described electronic component are not limited. Specifically, the electronic component includes an N-layer circuit board, and the heat dissipation plate includes an n+1-layer heat dissipation plate. The N layers of circuit boards are stacked, a layer of heat dissipation plate is arranged between any two adjacent layers of circuit boards, and N is a positive integer greater than or equal to 2. In this scheme, a plurality of circuit boards and a heat dissipation plate may be stacked to reduce the area of each circuit board.

In a third aspect, the present application further provides an electronic assembly including a circuit board, a first heat generating device, a second heat generating device, and a heat dissipating plate. The circuit board comprises a first side surface and a second side surface which are opposite to each other, the first heating device is arranged on the first side surface of the circuit board, and the second heating device is arranged on the second side surface of the circuit board. The heat dissipation plate comprises a first heat dissipation plate and a second heat dissipation plate, wherein the first heat dissipation plate is arranged on one side of the first heat generation device, which is away from the circuit board, and is used for dissipating heat of the first heat generation device; the second heat dissipation plate is arranged on one side, away from the circuit board, of the second heat dissipation device and is used for dissipating heat of the second heat dissipation device. In this application technical scheme, the both sides of circuit board are provided with first heating panel and second heating panel respectively for the both sides of circuit board can all set up the heating device. The scheme can improve the integration level of the heating device of the circuit board so as to reduce the area of the circuit board. The electronic component occupies a small area, so that the electronic component in the embodiment of the application can be conveniently installed. In terms of course, the solution allows to double the power of the electronic assembly, while the area of the circuit board of the electronic assembly remains constant.

When the first support and the circuit board are specifically installed, the first support and the circuit board can be sequentially connected by using the first connecting piece, and the second connecting piece is sequentially connected with the circuit board and the first support. In a specific implementation manner, the first connecting piece may be a screw, and the second connecting piece may also be a screw, so that the connection operation is convenient, and detachable connection can be realized. When the first connecting piece and the second connecting piece are specifically installed, the extending shaft of the first connecting piece and the extending shaft of the second connecting piece can be arranged in a staggered mode. The first support installation strength of being favorable to promoting promotes electronic component's structural stability.

In a fourth aspect, the present application further provides a terminal. The terminal comprising at least one electronic component of the second or third aspect described above. Generally, the terminal is sensitive to the area of the electronic component, and has relatively strong accommodating capacity to the thickness of the electronic component, so that the area occupied by the electronic component mounted on the terminal in the embodiment of the application is small, and the computing power of the electronic component of the terminal is improved.

The specific type of the above terminal is not limited, and may be, for example, a vehicle, an aircraft, a ship, a server, a computer, or the like. In particular, when the terminal is a vehicle, the electronic component may be a vehicle controller, which is beneficial to reducing the space required for installing the vehicle controller, and in addition, the automatic control capability of the vehicle may be improved.

Drawings

FIG. 1 is a schematic side view of an electronic assembly according to an embodiment of the present application;

FIG. 2 is a schematic diagram of another side structure of an electronic assembly according to an embodiment of the present application;

FIG. 3 is a schematic top view illustrating an internal structure of a heat dissipating plate according to an embodiment of the present disclosure;

FIG. 4 is a schematic top view illustrating another internal structure of a heat dissipating plate according to an embodiment of the present disclosure;

FIG. 5 is a schematic side sectional view of a heat dissipating plate according to an embodiment of the present application;

FIG. 6 is a schematic side sectional view of another embodiment of a heat dissipating plate;

FIG. 7 is a schematic diagram showing another side sectional structure of a heat dissipating plate according to an embodiment of the present application;

FIG. 8 is a schematic diagram of another configuration of an electronic assembly according to an embodiment of the present application;

FIG. 9 is a schematic diagram of another configuration of an electronic assembly in an embodiment of the present application;

fig. 10 is a schematic diagram of another structure of an electronic component in an embodiment of the present application.

Reference numerals:

1-a circuit board; 11-a first side;

12-a second side; 2-a first heat generating device;

3-a second heat generating device; 4-a heat dissipation plate;

41-a first heat dissipation plate; 42-a second heat sink;

43-cavity; 44-liquid inlet;

45-slow flow area; 451-fluid port;

452-a first slow flow structure; 4521-first buffer port;

4522-retaining wall; 453-a second slow flow structure;

4531-second buffer port; 46-a primary heat dissipation area;

461-heat dissipating fins; 47-a first wall;

471-boss; 48-a second wall;

49-an auxiliary heat dissipation area; 491-opening;

410-retaining wall; 51-a first thermally conductive layer;

52-a second thermally conductive layer; 61-a first sub-circuit board;

62-a second sub-circuit board; 71-a first scaffold;

72-a second scaffold; 81-a first connector;

82-a second connector; 83-a third connector;

84-fourth connection.

Detailed Description

For convenience in understanding, the embodiment of the application provides a heat dissipation plate, an electronic component and a terminal. In the following, an application scenario is described, and electronic control functions have been applied in various fields, and the electronic control functions need to implement a control process by using a controller, which may be understood as an electronic component having a chip. The chip generates a lot of heat during operation, and therefore, the heat dissipation capability of the controller has an important effect on the performance of the controller. As intelligent control technology is mature, the operation capability of the controller is gradually improved, and the number of chips that the controller needs to integrate is also increased. Accordingly, in order to ensure the normal operation of the controller, the heat dissipation structure integrated with the controller needs to be increased. In the prior art, as the number of chips and heat dissipation structures in a controller increases, the area of the controller is also larger and larger, so that a larger area of space is required to install the controller when the controller is actually applied. Many terminals at present have strong intelligent control functions, particularly automatic driving functions of vehicles and the like, and the functions of corresponding controllers are more and more abundant. However, the terminal has a limited installation space and is sensitive to the controller footprint. For this reason, this application provides a heating panel, electronic component and terminal to promote radiating effect and the life of heating panel, reduce the area that electronic component occupy.

Embodiments of the present application will be described in detail below with reference to the accompanying drawings. The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include, for example, "one or more" such forms of expression, unless the context clearly indicates to the contrary.

Reference in the specification to "one embodiment" or "a particular embodiment" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the application. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.

Fig. 1 is a schematic structural diagram of an electronic component according to an embodiment of the present application, as shown in fig. 1, in an embodiment of the present application, the electronic component includes a circuit board 1, a first heat generating device 2, a second heat generating device 3, and a heat dissipating plate. The circuit board 1 includes a first side 11 and a second side 12 opposite to each other, that is, two surfaces of the circuit board 1, one of which is the first side 11 and the other of which is the second side 12. The first heat generating device 2 is disposed on the first side 11 of the circuit board 1, and the second heat generating device 3 is disposed on the second side 12 of the circuit board 1. The heat dissipation plate includes a first heat dissipation plate 41 and a second heat dissipation plate 42, where the first heat dissipation plate 41 is disposed on a side of the first heat generation device 2 away from the circuit board 1, and the first heat dissipation plate 41 is in heat conduction connection with the first heat generation device 2, so that the first heat dissipation plate 41 is used for dissipating heat for the first heat generation device 2. The second heat dissipation plate 42 is disposed on a side of the second heat generation device 3 away from the circuit board 1, and the second heat dissipation plate 42 is in heat conduction connection with the second heat generation device 3, so that the second heat dissipation plate 42 is used for dissipating heat for the second heat generation device 3.

In this technical scheme, the both sides of circuit board 1 are provided with first heating panel 41 and second heating panel 42 respectively for the both sides of circuit board 1 can all set up the heating element. The scheme can improve the integration level of the heating device of the circuit board 1 so as to reduce the area of the circuit board 1. Compared with the prior art, the same number of heating devices can reduce the area of the circuit board 1, so that the occupied area of the electronic component is smaller, and the electronic component in the embodiment of the application is convenient to install. In terms of course, in the case that the area of the circuit board 1 of the electronic component is kept constant, the solution can be used to provide heating devices, such as chips, on both sides of the circuit board 1, respectively, so that the power of the electronic component can be doubled.

In a specific embodiment, the number of the first heat generating devices 2 disposed on the first side 11 of the circuit board 1 is not limited, for example, one first heat generating device 2 may be disposed, and two or more first heat generating devices 2 may be disposed. When at least two first heat generating devices 2 are provided on the first side 11 of the circuit board 1, all the first heat generating devices 2 may be radiated by one first heat radiating plate 41. Also, the number of the second heat generating devices 3 provided on the second side 12 of the circuit board 1 is not limited, and for example, one second heat generating device 3 may be provided, and two or more second heat generating devices 3 may be provided. When at least two second heat generating devices 3 are provided on the second side 12 of the circuit board 1, all the second heat generating devices 3 may be radiated by one second radiation plate 42.

It should be noted that the specific type of the first heat generating device 2 is not limited, and the first heat generating device 2 refers to an electronic device that generates a larger amount of heat during operation, or refers to an electronic device that needs to use a heat dissipating plate to dissipate heat, for example, the first heat generating device 2 is a chip. Also, the specific type of the second heat generating device 3 is not limited, and the first heat generating device 2 refers to an electronic device having a large heat generation amount during operation, or refers to an electronic device that needs to use a heat dissipation plate to dissipate heat, for example, the second heat generating device 3 is a chip.

The first heat dissipation plate 41 is in heat conduction connection with the first heat generating device 2, which means that heat conduction can be achieved therebetween. In a specific embodiment, the first heat dissipating plate 41 may be directly connected to the first heat generating device 2 in contact for conducting heat, as shown in fig. 1. Alternatively, referring to fig. 2, which is another schematic side structure of the electronic component in the embodiment of the present application, a first heat conducting layer 51 may be further disposed between the first heat dissipating plate 41 and the first heat generating device 2, and the first heat conducting layer 51 is used for transferring heat of the first heat generating device 2 to the first heat dissipating plate 41, as shown in fig. 2. The first heat conducting layer 51 may be an elastic material layer, so that the first heat dissipating plate 41 and the first heat generating device 2 are connected more tightly, thereby improving heat transfer efficiency and heat dissipation effect of the electronic component.

Also, the second heat dissipating plate 42 is thermally connected to the second heat generating device 3, which means that heat can be conducted therebetween. In a specific embodiment, the second heat dissipating plate 42 may be directly connected to the second heat generating device 3 in contact for conducting heat, as shown in fig. 1. Alternatively, a second heat conducting layer 52 may be disposed between the second heat dissipating plate 42 and the second heat generating device 3, and the second heat conducting layer 52 is used to transfer heat of the second heat generating device 3 to the second heat dissipating plate 42, as shown in fig. 2. The second heat conducting layer 52 may be an elastic material layer, so that the second heat dissipating plate 42 and the second heat generating device 3 are connected more tightly, thereby improving heat transfer efficiency and heat dissipation effect of the electronic component.

In a specific embodiment, the elastic material layer may include heat-conducting glue or heat-conducting foam, which has heat conductivity and elasticity, and is favorable for improving the contact area between the heat dissipation plate and the metal base and improving the heat dissipation effect.

For the specific materials of the first heat conducting layer and the second heat conducting layer, the application is not limited, and for example, the material with higher heat dissipation efficiency such as the phase change material layer, the carbon fiber layer, the graphite layer, the copper layer or the aluminum layer can be used. The material of the first heat conducting layer and the material of the second heat conducting layer may be the same or different, which is not limited in this application.

Fig. 3 is a schematic top view of the internal structure of the heat dissipating plate according to the embodiment of the present application, and as shown in fig. 3, the structure may be understood as a bottom portion of the heat dissipating plate, and the heat dissipating plate may further include a cover portion (not shown), where the bottom portion and the cover portion are bonded (e.g. welded together, or integrally formed) to form the heat dissipating plate. The structure and shape of the cover portion are not limited in the embodiment of the present application. In a specific embodiment, the specific type of the heat dissipating plate may be a liquid cooling plate, which has a cavity 43, and the cavity 43 is formed as a flow passage of the cooling liquid. That is, the refrigerant liquid may flow in the radiator to radiate heat to the first and second heat generating devices 2 and 3 on the circuit board 1. The specific material of the refrigerating fluid is not limited, and the refrigerating fluid can be water specifically, so that the cost is low. In this embodiment, the heat dissipation plate is a liquid cooling plate, so that the heat dissipation effect is better, and the heat dissipation capability of the electronic component is improved.

In a specific embodiment, the refrigerant liquid may be water or oil, for example, a fluorinated liquid or mineral oil, and the material of the refrigerant liquid is not limited in this application.

The refrigerant liquid passages between the first heat dissipation plate 41 and the second heat dissipation plate 42 may be connected in parallel or in series. Specifically, the first heat dissipation plate 41 may be considered to have a first cavity for carrying the refrigerant liquid. The second heat dissipation plate 42 has a second cavity, and the second cavity is also used for carrying the refrigerant liquid. When the first heat dissipation plate 41 and the second heat dissipation plate 42 are specifically provided, the first cavity and the second cavity can be connected in parallel, and in this scheme, the refrigerant liquid flows in the first cavity and the second cavity independently, so that the heat dissipation effect of the heat dissipation plate can be improved. Alternatively, the first and second chambers may be connected in series, and the refrigerant fluid flows through the first and second chambers in sequence, that is, the refrigerant fluid flows into the first heat dissipation plate 41 and then flows into the second heat dissipation plate 42. The first heat dissipation plate 41 and the second heat dissipation plate 42 are connected in series or in parallel, so that only one refrigerating fluid driving device is needed, and the driving of the refrigerating fluid in the two heat dissipation plates can be realized.

In the specific embodiment, as shown in fig. 3, the heat dissipation plate includes a liquid inlet 44 and a cavity 43, and the cavity 43 includes a slow flow area 45 and a main heat dissipation area 46. The liquid inlet 44 is the total inlet of the cooling liquid into the cavity 43 of the cooling plate. The liquid inlet 44 communicates with the slow flow region 45, and the slow flow region 45 has a liquid outlet 451. After entering the cavity 43 of the heat dissipation plate from the liquid inlet 44, the refrigerating fluid enters the slow flow area 45 for slow flow. The flow rate of the refrigerant liquid entering the liquid inlet 44 is fast, and the flow rate is unstable, and by arranging the slow flow area on the heat dissipation plate, the flow rate of the refrigerant liquid flowing out from the liquid outlet 451 is reduced and the flow rate tends to be stable after the refrigerant liquid flows through the slow flow area 45. The liquid outlet 451 of the slow flow region 45 is communicated with the main heat dissipation region 46, so that the cooling liquid can flow to the main heat dissipation region 46 relatively at a low speed and stably, thereby achieving a more stable and uniform heat dissipation effect on the heat generating device. Meanwhile, due to the buffer function of the slow flow area, the scouring of the main heat dissipation area 46 by the refrigerating fluid is small, so that the scouring corrosion of the main heat dissipation area 46 is slight, and the service life of the heat dissipation plate is prolonged.

It should be noted that, "connected" in the embodiments of the present application refers to that the refrigerant liquid can circulate between the two. For example, a and B may be in communication, or a and B may be directly connected, and the refrigerant fluid may flow between a and B. Alternatively, a and B may be connected by C, and the refrigerant may flow between A, C and B. That is, the refrigerant fluid may flow through A, C and B in sequence, or the refrigerant fluid may flow through B, C and a in sequence.

When the heat dissipating plate according to the embodiment of the present application is used, one main heat dissipating area 46 may be made to correspond to one heat generating device, or one main heat dissipating area 46 may be made to correspond to at least two heat generating devices. For example, two heat generating devices are disposed along the refrigerant flow direction of the main heat dissipating area 46, and the main heat dissipating area 46 may cover the two heat generating devices to dissipate heat for the two heat generating devices at the same time.

With continued reference to fig. 3, in a specific embodiment, the heat dissipation fins 461 are disposed on the main heat dissipation area 46 of the heat dissipation plate, so that the heat dissipation capability of the main heat dissipation area 46 can be further improved, and the heat dissipation effect of the main heat dissipation area 46 is better.

In a specific embodiment, the material strength of the slow flow region 45 is strong, for example, die-cast aluminum with the material of YL102 (duralumin 102) has strong anti-scouring capability. Therefore, even if the flow rate of the refrigerant liquid entering through the liquid inlet 44 is large, the damage of the slow flow region 45 caused by the flushing of the refrigerant liquid can be reduced. The heat dissipation fins 461 of the main heat dissipation area 46 may be made of aluminum alloy or pure aluminum with good heat conduction effect.

In a specific embodiment, the heat dissipation plate may include a plurality of heat dissipation fins, and the shapes of the plurality of heat dissipation fins may be the same or different. Specifically, the above-mentioned shape may refer to a three-dimensional shape of the entire heat dissipating fin, including a size, a length, a thickness, and the like. In addition, in the embodiment of the application, other areas besides the main heat dissipation area may be provided with heat dissipation fins. The shape of the heat dissipation fins in different areas may be different, and of course, the shape of the heat dissipation fins in different areas may be the same.

With continued reference to fig. 3, in a specific embodiment, the buffer area 45 has a first buffer port 4521, and the first buffer port 4521 and the liquid inlet 44 are disposed in a staggered manner. In this embodiment, through this first buffer mouth and feed liquor mouth looks mistake setting, realized slowing down the velocity of flow of refrigerant liquid to realized more even radiating effect.

Specifically, the buffer area 45 may include a first buffer structure 452. The first flow retarding structure 452 is directly connected to the liquid inlet 44, and the refrigerant liquid flows into the first flow retarding structure 452 directly after entering the heat dissipating plate from the liquid inlet 44. The first buffer port 4521 is disposed in the first slow flow structure 452, the first buffer port 4521 is disposed in a staggered manner with respect to the liquid inlet 44, and the first buffer port 4521 is in communication with the liquid outlet 451.

The first flow buffering structure 452 specifically includes a retaining wall 4522, and the first buffering opening 4521 is disposed on the retaining wall 4522. The refrigerant fluid enters the first buffer structure 452 from the fluid inlet 44, directly washes the retaining wall 4522, and then flows out from the first buffer opening 4521. The retaining wall 4522 is provided with at least two first buffer openings 4521, and the refrigerant liquid is split and flows out of the first buffer openings 4521 at a low speed.

In addition, the slow flow region may further have a second buffer port, where the second buffer port may specifically correspond to the liquid inlet or be set in a staggered manner. For example, both the second buffer port and the first buffer port may be provided in the first buffer structure. Or, the slow flow area can also comprise at least two stages of slow flow structures, and the refrigerating fluid sequentially flows through each stage of slow flow structures so as to improve the slow flow effect. For example, the at least two-stage slow flow structure includes a first slow flow structure and a second slow flow structure, and the refrigerant liquid sequentially enters the first slow flow structure and the second slow flow structure. Can make first buffer port set up in first slow flow structure, the second buffer port sets up in second slow flow structure, at this moment, can make second buffer port and first buffer port looks mistake and set up to promote the slow flow effect in slow flow district.

With continued reference to fig. 3, in a specific embodiment, the heat dissipation plate may further include a second slow flow structure 453, where the second slow flow structure 453 is disposed on a side of the first slow flow structure 452 facing away from the liquid inlet 44, and the second slow flow structure 453 is in communication with the first buffer port 4521. That is, after the refrigerant liquid enters the first buffer structure 452 from the liquid inlet 44, the refrigerant liquid flows through the first buffer opening 4521 and then flows to the second buffer structure 453. The second buffer structure 453 has a second buffer port 4531, and the second buffer port 4531 is offset from the first buffer port 4521. The second buffer port 4531 may be directly connected with the main heat dissipation region 46. The scheme can realize two-stage slow flow of the refrigerating fluid, so that the slow flow effect is good, the flow speed of the refrigerating fluid flowing into the main heat dissipation area 46 is slow and uniform, and the service life of the main heat dissipation area 46 is prolonged.

When the second slow flow structure 453 is specifically provided, the second slow flow structure 453 may have a second buffer port 4531, so that the flow rate of the refrigerant flowing out of the second slow flow structure 453 is slower, the refrigerant may be stored in the second slow flow structure 453, and then flows out of the second slow flow structure 453 at a more stable speed to the main heat dissipation area 46.

Of course, in other embodiments, the buffer area may further include three or four or more buffer structures, where buffer ports are disposed in a staggered manner, which is not specifically described herein.

With continued reference to fig. 3, the heat dissipation plate may include at least two main heat dissipation areas 46, and the slow flow area 45 may include at least two liquid flow openings 451, where the main heat dissipation areas 46 are in one-to-one correspondence with the liquid flow openings 451. That is, the respective main heat dissipation areas 46 are arranged in parallel, and flow out from the second slow flow structure 453 directly into the respective main heat dissipation areas 46. The heat dissipation capacity of each main heat dissipation area 46 in this scheme is more consistent, and has better heat dissipation effect. In a specific embodiment, the main heat dissipation area 46 of the heat dissipation plate may be connected to the heat generating devices of the circuit board 1 in a one-to-one correspondence manner. So as to facilitate heat dissipation from the heat generating devices of the circuit board 1. Specifically, the main heat dissipation area 46 of the first heat dissipation plate 41 may be a first main heat dissipation area 46, and the first main heat dissipation area 46 is in a one-to-one heat conduction connection with the first heat generating device 2. Similarly, the main heat dissipation area 46 of the second heat dissipation plate 42 may be a second main heat dissipation area 46, where the second main heat dissipation area 46 is in one-to-one heat conduction connection with the second heat dissipation device 3. When the second flow buffering structure 453 has one second buffering port 4531, the second buffering port 4531 may be connected to each flow port 451 to achieve a split flow, so that the refrigerant fluid uniformly flows to the respective main heat dissipation areas 46.

The heat dissipation plate provided in the embodiments of the present application may be applied to an electronic component, for example, the electronic component may include a first heat generating device and the first heat dissipation plate. Alternatively, the electronic component includes a plurality of heat generating devices and a plurality of heat dissipating plates, such as including the first heat generating device, the second heat generating device, the first heat dissipating plate, and the second heat dissipating plate described above. The number of the heating devices and the heat dissipation plates is not limited.

In a specific embodiment, the specific structures of the first heat dissipation plate 41 and the second heat dissipation plate 42 may be the same or different in the same electronic component. Taking the example in which the first heat sink 41 and the second heat sink 42 are connected in series, the first heat sink 41 may have the first flow delaying structure 452 and the second flow delaying structure 453. That is, as shown in fig. 3, the specific structure of the first heat dissipation plate 41 is that the refrigerant liquid enters the first cavity of the first heat dissipation plate 41 from the liquid inlet 44. The retaining wall 4522 of the first flow-retarding structure 452 is opposite to the liquid inlet 44, and the retaining wall 4522 has a first buffer opening 4521, wherein the liquid inlet 44 is offset from the first buffer opening 4521. The second slow flow structure 453 is disposed on a side of the first slow flow structure 452 away from the liquid inlet 44, that is, the refrigerant liquid flows from the first buffer port 4521 into the second slow flow structure 453. The second buffer structure 453 has a second buffer port 4531, the second buffer port 4531 is disposed offset from the first buffer port 4521, and the second buffer port 4531 communicates with the main heat dissipation region 46. In a specific embodiment, the velocity of the refrigerant fluid at the inlet 44 is less than the velocity at the first buffer port 4521 and less than the velocity at the second buffer port 4531 due to the first and second flow-retarding structures 452, 453. The first heat dissipation plate 41 includes two first main heat dissipation areas 46, the second flow buffering structure 453 has a second buffering opening 4531, and the second buffering opening 4531 is connected with the two liquid flow openings 451, so that the flow distribution can be realized, and the refrigerant liquid can uniformly flow to the two main heat dissipation areas 46. In this embodiment, the cooling liquid flows to the first heat dissipation plate 41 and then to the second heat dissipation plate 42, so that the structure of the buffer area 45 of the first heat dissipation plate 41 is complicated, as shown in fig. 3. Fig. 4 is a schematic top view illustrating another internal structure of a heat dissipating plate according to an embodiment of the present application. The structure is understood to be the bottom of the heat sink, which may also include a cover (not shown) that are joined together (e.g., welded together, or integrally formed) to form the heat sink. The structure and shape of the cover portion are not limited in the embodiment of the present application. The refrigerant liquid of the second heat dissipation plate 42 flows out from the first heat dissipation plate 41 at a relatively slow and uniform flow rate, so that the structure of the slow flow region 45 of the second heat dissipation plate 42 can be relatively simple, as shown in fig. 4. Optionally, in the heat dissipation plate shown in fig. 4, lengths of different heat dissipation fins may be the same or different, and a heat dissipation fin with a longer length may partition the main heat dissipation area into two sub-main heat dissipation areas, for example, a 5 th heat dissipation fin with a longer length from bottom to top in fig. 4, and optionally, in a case that the cover portion and the bottom portion are combined together, the 5 th heat dissipation fin may be abutted to the cover portion, so that the main heat dissipation area may be partitioned into an upper sub-main heat dissipation area and a lower sub-main heat dissipation area, so that a heat dissipation effect may be further improved.

Fig. 5 is a schematic side sectional structure of a heat dissipating plate according to an embodiment of the present application, and as shown in fig. 5, the heat dissipating plate has a first wall 47 and a second wall 48 opposite to each other, where the first wall 47 is used for connecting with a heat generating device, that is, one side of the first wall 47 is connected with the heat generating device. When the heat dissipation fin 461 is specifically provided, the heat dissipation fin 461 is connected to the other side of the first wall 47, that is, the outside of the first wall 47 is connected to a heat generating device. The inner side of the first wall 47 is connected to the heat dissipation fins 461. So that heat can be dissipated at the heat dissipation fins 461, and the heat dissipation effect of the heat dissipation plate is improved. Alternatively, the second wall 48 may be a cover portion of the heat dissipation plate, and may be a metal plate.

In a specific embodiment, when the heat dissipating plate has at least two main heat dissipating areas 46, a blocking wall 410 may be disposed between adjacent main heat dissipating areas 46 to separate the adjacent main heat dissipating areas 46. Of course, the blocking wall 410 may have a fluid outlet, so that the refrigerant fluid between the adjacent main heat dissipation areas 46 may flow as shown in fig. 3. Alternatively, in another embodiment, two ends of the heat dissipation fins 461 between the adjacent main heat dissipation areas 46 may be respectively connected to the first wall 47 and the second wall 48, so as to divide between the different main heat dissipation areas 46.

Referring to fig. 3 and 4, in a further embodiment, the heat dissipation plate 4 further includes an auxiliary heat dissipation area 49, and the auxiliary heat dissipation area 49 is disposed at a peripheral side of the main heat dissipation area 46. The auxiliary heat dissipation area 49 can be used for dissipating heat of electronic devices other than the main heat-generating device of the circuit board 1, so as to prolong the service life of the electronic assembly. The baffle 410 between the primary heat sink 46 and the secondary heat sink 49 has an opening 491, which opening 491 communicates between the primary heat sink 46 and the secondary heat sink 49, allowing refrigerant fluid to flow from the primary heat sink 46 to the secondary heat sink 49. Therefore, after the cooling liquid enters the main heat dissipation area 46 to dissipate heat of the heat-generating device, the cooling liquid flows from the opening 491 of the blocking wall 410 to the auxiliary heat dissipation area 49 for dissipating heat of the corresponding area of the auxiliary heat dissipation area 49, so as to enhance the heat dissipation effect of the electronic component.

The form or shape of the opening is not limited, and may be, for example, an open hole, a slit, or a slit, as long as the liquid can flow. In addition, the number of the openings is not limited, and the baffle wall can be provided with a plurality of openings so as to improve the flowing effect of the refrigerating fluid between the main heat dissipation area and the auxiliary heat dissipation area.

In one embodiment, as shown in fig. 5, the heat dissipation fin 461 is connected to the first wall 47, the blocking wall 410 is connected to the second wall 48, and the opening 491 is disposed on a side of the blocking wall 410 facing the first wall 47. In the case of providing the opening 491 specifically, the distance a between the edge of the opening 491 facing the second wall 48 and the first wall 47 may be smaller than the distance b between the wall surface of the heat radiating fin 461 facing the second wall 48 and the first wall 47. In the use state of the heat dissipation plate in this embodiment, the first wall 47 is located above the second wall 48, for example, the second heat dissipation plate 42 in the embodiment shown in fig. 1. Under the effect of gravity, the cooling liquid is located in the lower part of the main heat dissipation area 46, flows along the second wall 48, and if air is present in the cavity 43 of the heat dissipation plate, the air is located between the first wall 47 and the cooling liquid. This embodiment ensures that at least part of the structure of the heat sink fins 461 is immersed in the cooling liquid before the cooling liquid flows from the opening 491 of the baffle 410 to the auxiliary heat sink area 49. This arrangement ensures that the heat dissipation fins 46 dissipate heat through the refrigerant fluid.

Fig. 6 is a schematic side sectional view of another heat dissipating plate according to an embodiment of the present application. In another embodiment, as shown in fig. 6, the heat dissipation fins 461 are connected to the first wall 47, the blocking wall 410 is connected to the second wall 48, and the opening 491 is disposed on the side of the blocking wall 410 facing the first wall 47. The first wall 47 has a boss 471, and the heat dissipation fin 461 is connected to the boss 471. The projection of the second opening 491 on the side wall of the boss 471 is located entirely on the side wall of the boss 471. In other words, the distance a between the bottom wall of the second opening 491 facing the second wall 48 and the first wall 47 is smaller than the distance c between the wall surface of the boss 471 facing the second wall 48 and the first wall 47. Also, in the use state of the heat dissipation plate in this embodiment, the first wall 47 is located above the second wall 48, for example, the second heat dissipation plate 42 in the embodiment shown in fig. 1. Under the effect of gravity, the cooling liquid is located in the lower part of the main heat dissipation area 46, flows along the second wall 48, and if air is present in the cavity 43 of the heat dissipation plate, the air is located between the first wall 47 and the cooling liquid. According to the scheme, the whole length of the heat dissipation fins 461 can be immersed in the refrigerating fluid, namely, the liquid level of the refrigerating fluid can exceed the length of the illustrated heat dissipation fins, for example, the liquid level of the refrigerating fluid can be as high as a boss, so that the heat dissipation effect of the heat dissipation fins 461 is improved. In addition, this scheme can also make boss 471 also contact with the refrigerant liquid for the refrigerant liquid can take away the heat of first wall 47, is favorable to promoting the radiating effect of first wall 47.

Fig. 7 is a schematic side sectional view of another embodiment of a heat dissipating plate. In another embodiment, as shown in fig. 7, the heat dissipation fins 461 are connected to the first wall 47, the baffle wall 410 is also connected to the first wall 47, and the opening 491 is disposed on the side of the baffle wall 410 facing the second wall 48. In the use state of the heat dissipation plate in this embodiment, the second wall 48 is located above the first wall 47, for example, the first heat dissipation plate 41 in the embodiment shown in fig. 1. Under the influence of gravity, the cooling liquid is located in the lower part of the main heat dissipation area 46, flows along the first wall 47, and if air is present in the cavity 43 of the heat dissipation plate, the air is located between the second wall 48 and the cooling liquid. In the case where the opening 491 is provided specifically, the distance a between the bottom wall of the opening 491 facing the second wall 48 and the first wall 47 may be smaller than the distance d between the wall surface of the heat radiating fin 461 facing the second wall 48 and the second wall 48. Therefore, the liquid level of the refrigerating fluid can be higher than the heat dissipation fins, and the scheme can enable the whole heat dissipation fins 461 to be immersed in the refrigerating fluid, so that the heat dissipation effect of the heat dissipation fins 461 is improved.

Fig. 8 is another schematic structural diagram of an electronic assembly according to an embodiment of the present application, as shown in fig. 8, in an embodiment, the electronic assembly further includes a first sub-circuit board 61 and a first bracket 71, and the first heat generating device 2 is mounted on the circuit board 1 through the first sub-circuit board 61. Specifically, the first sub-circuit board 61 is located on a side of the first heat generating device 2 facing away from the first heat dissipating plate 41. The first heat generating device 2 is mounted on the first sub-circuit board 61, the first sub-circuit board 61 is mounted on the first bracket 71, and the first bracket 71 is mounted on the first side 11 of the circuit board 1. The first sub-circuit board 61 and the circuit board 1 are each provided with a connector through which the first heat generating device 2 and the circuit board 1 are connected when the first bracket 71 is mounted to the first side 11 of the circuit board 1. In an alternative embodiment, the first sub-circuit board 61 has a first connector, and the first heat generating device 2 is connected to the first connector through the first sub-circuit board, and the circuit board 1 has a second connector, and the first connector is mated with the second connector. When the first sub-circuit board is mounted on the circuit board, the first connector is connected with the second connector, thereby realizing connection of the first heat generating device 2 with the circuit board 1. The first bracket 71 is disposed between the first sub-circuit board 61 and the circuit board 1. Therefore, the heating device in the scheme is strong in strength of being mounted on the circuit board 1, can adapt to scenes such as vibration, and is beneficial to prolonging the service life of the electronic component. In addition, in the scheme, the first heating device 2 is connected with the circuit board 1 through the connector, so that the heating device can be modularized, and the electronic assembly is easy to upgrade.

With continued reference to fig. 8, in an alternative embodiment, when the first bracket 71 is specifically mounted to the circuit board 1, the first connector 81 may be first used to sequentially connect the first bracket 71 to the circuit board 1, and the second connector 82 may be used to sequentially connect the circuit board 1 to the first bracket 71. When the first connector 81 and the second connector 82 are specifically mounted, the extending axis of the first connector 81 and the extending axis of the second connector 82 may be offset from each other. The mounting strength of the first bracket 71 is improved, and the structural stability of the electronic component is improved.

In an alternative embodiment, the first connecting member 81 may be a screw, and the second connecting member 82 may be a screw. The scheme utilizes the screw to connect the first bracket 71 and the circuit board 1, and is favorable for realizing the detachable connection of the first bracket 71 and the circuit board 1. Or the connecting piece in the embodiment of the application can also be a thumbtack and the like, and the embodiment of the application does not limit the type of the connecting piece.

Fig. 9 is a schematic structural diagram of another electronic component in the embodiment of the present application, as shown in fig. 9, in another embodiment, the electronic component further includes a first sub-circuit board 61, a second sub-circuit board 62, a first bracket 71 and a second bracket 72, where the first heat generating device 2 is mounted on the circuit board 1 through the first sub-circuit board 61, and the second heat generating device 3 is mounted on the circuit board 1 through the second sub-circuit board 62. Specifically, the first sub-circuit board 61 is located on a side of the first heat generating device 2 facing away from the first heat dissipating plate 41. The second sub-circuit board 62 is located at a side of the second heat generating device 3 facing away from the second heat dissipation plate 42. The first heat generating device 2 is mounted on the first sub-circuit board 61, the first sub-circuit board 61 is mounted on the first bracket 71, and the first bracket 71 is mounted on the first side 11 of the circuit board 1. The first heat generating device 2 and the circuit board 1 are each provided with a connector through which the first heat generating device 2 and the circuit board 1 are connected when the first bracket 71 is mounted on the first side 11 of the circuit board 1. Similarly, the second heat generating device 3 is mounted on the second sub-circuit board 62, the second sub-circuit board 62 is mounted on the second bracket 72, and the second bracket 72 is mounted on the second side 12 of the circuit board 1. The second heat generating device 3 and the circuit board 1 are provided with connectors, and when the second bracket 72 is mounted on the second side 12 of the circuit board 1, the second heat generating device 3 and the circuit board 1 are connected by the connectors. The first bracket 71 is disposed between the first sub-circuit board 61 and the circuit board 1, and the second bracket 72 is disposed between the second sub-circuit board 62 and the circuit board 1. Therefore, the heating device in the scheme is strong in strength of being mounted on the circuit board 1, can adapt to scenes such as vibration, and is beneficial to prolonging the service life of the electronic component. In addition, in the scheme, the first heating device 2 and the second heating device 3 are respectively connected with the circuit board 1 through connectors, so that the heating devices can be modularized, and the electronic assembly is easy to upgrade.

When the sub first sub circuit board 61, the second sub circuit board 62, the first bracket 71 and the second bracket 72 are mounted, the first bracket 71, the circuit board 1 and the second bracket 72 may be sequentially stacked, the third connector 83 sequentially connects the first bracket 71, the circuit board 1 and the second bracket 72, and the fourth connector 84 sequentially connects the second bracket 72, the circuit board 1 and the first bracket 71. That is, the third connector 83 is inserted into the first bracket 71, the circuit board 1, and the second bracket 72 in this order from the side of the first side 11 of the circuit board 1; the fourth connector 84 is inserted into the second bracket 72, the circuit board 1, and the first bracket 71 in this order from the side of the second side 12 of the circuit board 1. In addition, when the third connector 83 and the fourth connector 84 are specifically mounted, the extension axis of the third connector 83 and the extension axis of the fourth connector 84 may be offset from each other. This scheme can connect first support 71, circuit board 1 and second support 72 from both sides, and two connecting pieces looks mistake and set up, and consequently the installation intensity of first support 71 and second support 72 is stronger, is favorable to promoting electronic component's life.

In an alternative solution, the third connecting member 83 may be a screw, and the fourth connecting member 84 may be a screw, so as to facilitate the mounting and dismounting operations.

In a specific embodiment, the direction in which the two connectors are arranged in a staggered manner is not limited, and for example, as shown in fig. 8, the two connectors may be arranged in a direction away from the first heat generating device 2. Alternatively, the two connection members may be arranged in parallel at the same distance from the first heat generating device 2 to reduce the areas of the first and second brackets 71 and 72, which is advantageous in achieving miniaturization of the electronic component.

In a specific embodiment, the electronic component may be a controller. The chip in the controller is the heating device, and the calorific capacity is higher, uses the electronic component among the this application technical scheme, is favorable to promoting the radiating effect of controller, promotes the integrated level of controller.

In particular, the controller may be an in-vehicle controller. The electronic component has smaller area, is favorable for mounting the vehicle-mounted controller on a vehicle with smaller space, reduces the vehicle area occupied by the vehicle-mounted controller, has stronger calculation force and is favorable for improving the automatic control capability of the vehicle.

Fig. 10 is another schematic structural diagram of an electronic component in an embodiment of the present application, as shown in fig. 10, in an embodiment, the electronic component includes N layers of circuit boards 1, the heat dissipation board includes n+1 layers of heat dissipation boards, and N is a positive integer greater than or equal to 2. The N layers of circuit boards 1 are stacked, and a heat dissipation plate is arranged between any two adjacent layers of circuit boards 1. The scheme can realize the lamination arrangement of the electronic components, and can enable two adjacent layers of circuit boards 1 to share the same radiating plate. This solution is advantageous for further reducing the area of the circuit board 1 of the electronic component, facilitating the mounting of the above-mentioned electronic component. The electronic component shown in fig. 10 has N equal to 2, but N may be other number, which is not limited in this application. The number of the emitting devices of each layer of the circuit board is not limited in this application.

It should be noted that, in the specific embodiment, the number of circuit boards 1 in each layer of the circuit board 1 is not limited, for example, each layer of the circuit board 1 may include one circuit board 1, or may include two or more circuit boards 1, which is not limited in this application. Of course, in a specific embodiment, the number of heat dissipation plates in each layer of heat dissipation plate is not limited, for example, each layer of heat dissipation plate may include one heat dissipation plate, or may include two or more heat dissipation plates, which is not limited in this application.

Based on the same inventive concept, the present application also provides a terminal comprising at least one electronic component according to any of the above embodiments. Generally, the terminal is sensitive to the area of the electronic component, and has relatively strong accommodating capacity to the thickness of the electronic component, so that the area occupied by the electronic component mounted on the terminal in the embodiment of the application is small, and the computing power of the electronic component of the terminal is improved.

The vehicle may be a passenger car or a commercial car, which is not limited in this application. The electronic component may be provided in a passenger position or a trunk position of the vehicle. The electronic assembly may be used to control modules such as the autopilot or the media of the vehicle.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to cover such modifications and variations.

Claims

The heat dissipation plate is characterized by comprising a liquid inlet and a cavity, wherein the cavity is used for forming a flow channel of refrigerating liquid; the cavity comprises a slow flow area and a main heat dissipation area, the slow flow area is communicated with the liquid inlet and the main heat dissipation area, and the slow flow area is used for slowing down the flow speed of the refrigerating fluid.
The heat dissipating plate of claim 1, wherein said slow flow region has a first buffer port, said first buffer port being offset from said liquid inlet.
The heat dissipating plate of claim 2, wherein said buffer area further has a second buffer port, said second buffer port being offset from said liquid inlet port; or alternatively, the process may be performed,

The second buffer port is arranged corresponding to the liquid inlet.
A heat dissipating plate according to any one of claims 1 to 3, comprising at least two main heat dissipating areas, wherein the slow flow area has at least two liquid flow ports, and the main heat dissipating areas are connected to the liquid flow ports in a one-to-one correspondence.
A heat dissipating plate according to any one of claims 1 to 4, wherein said main heat dissipating area is provided with heat dissipating fins.
The heat dissipating plate of claim 5, wherein said heat dissipating plate has a first wall, and both sides of said first wall are respectively connected to a heat generating device and said heat dissipating fin.
The heat sink of claim 6, further comprising an auxiliary heat sink disposed on a perimeter of the primary heat sink, wherein a baffle between the primary heat sink and the auxiliary heat sink has an opening communicating the primary heat sink and the auxiliary heat sink.
The heat dissipating plate of claim 7, wherein the number of said openings is plural.
The heat dissipating plate according to any one of claims 1 to 8, wherein the heat dissipating plate includes a plurality of heat dissipating fins, and different heat dissipating fins have the same or different shapes.
The heat dissipating plate according to any one of claims 1 to 9, further comprising a refrigerant liquid, the refrigerant liquid being located in the cavity.
The heat dissipating plate of claim 10, wherein said refrigerant liquid is water or oil.
An electronic component comprising a circuit board, a first heat-generating device, and the heat-dissipating plate according to any one of claims 1 to 11, wherein:

the circuit board comprises a first side surface and a second side surface which are opposite to each other; the first heat-generating device is arranged on the first side face, and the first heat-radiating plate is arranged on one side, away from the circuit board, of the first heat-generating device and used for radiating heat for the first heat-generating device.
The electronic assembly of claim 12, further comprising a second heat-generating device, the heat-dissipating plate comprising a second heat-dissipating plate, the second heat-generating device disposed on the second side of the circuit board; the second heat dissipation plate is arranged on one side, away from the circuit board, of the second heat generation device and is used for dissipating heat of the second heat generation device.
The electronic assembly of claim 13, wherein the primary heat dissipation area of the first heat dissipation plate is in thermally conductive connection with the first heat generation device and the primary heat dissipation area of the second heat dissipation plate is in thermally conductive connection with the second heat generation device.
The electronic component of claim 13 or 14, wherein the cavity of the first heat sink is connected in series with the cavity of the second heat sink, and the refrigerant fluid flows through the first heat sink and the second heat sink in sequence.
The electronic component of any one of claims 13-15, wherein a first heat conductive layer is connected between the first heat generating device and the first heat dissipating plate, and a second heat conductive layer is connected between the second heat generating device and the second heat dissipating plate.
The electronic assembly of claim 16, wherein,

the first heat conduction layer is a phase change material layer, a carbon fiber layer, a graphite layer, a copper layer or an aluminum layer; or alternatively

The second heat conduction layer is a phase change material layer, a carbon fiber layer, a graphite layer, a copper layer or an aluminum layer.
The electronic assembly of any of claims 13-17, further comprising a first sub-circuit board and a first bracket, the first heating device mounted to the first sub-circuit board, the first sub-circuit board mounted to the first bracket, the first bracket mounted to the first side of the circuit board, the first heating device connected to the circuit board by a connector.
The electronic assembly of claim 18, wherein a first connector connects the first bracket and the circuit board in sequence and a second connector connects the circuit board and the first bracket in sequence; the extending shaft of the first connecting piece is staggered with the extending shaft of the second connecting piece.
The electronic assembly of claim 18 or 19, further comprising a second sub-circuit board and a second bracket, the second heat generating device mounted to the second sub-circuit board, the second sub-circuit board mounted to the second bracket, the second bracket mounted to the second side of the circuit board, the second heat generating device connected to the circuit board by a connector.
The electronic assembly of claim 20, wherein the first bracket, the circuit board, and the second bracket are stacked in sequence, a third connector connects the first bracket, the circuit board, and the second bracket in sequence, and a fourth connector connects the second bracket, the circuit board, and the first bracket in sequence; the extension shaft of the third connecting piece is staggered with the extension shaft of the fourth connecting piece.
An electronic assembly according to any one of claims 12 to 21, wherein the electronic assembly is a controller.
The electronic component according to any one of claims 12 to 22, comprising N layers of the circuit boards, and n+1 layers of the heat dissipation plates, wherein N layers of the circuit boards are stacked, one layer of the heat dissipation plate is provided between any adjacent two layers of the circuit boards, and N is a positive integer of 2 or more.
An electronic assembly is characterized by comprising a circuit board, a first heating device, a second heating device and a heat dissipation plate, wherein the heat dissipation plate comprises a first heat dissipation plate and a second heat dissipation plate, and the circuit board comprises a first side surface and a second side surface which are opposite; the first heating device is arranged on the first side face, the second heating device is arranged on the second side face, and the first heat dissipation plate is arranged on one side, away from the circuit board, of the first heating device and is used for dissipating heat of the first heating device; the second heat dissipation plate is arranged on one side, away from the circuit board, of the second heat generation device and is used for dissipating heat of the second heat generation device.
The electronic assembly of claim 24, further comprising a first sub-circuit board and a first bracket, the first heating device mounted to the first sub-circuit board, the first sub-circuit board mounted to the first bracket, the first bracket mounted to the first side of the circuit board, the first heating device connected to the circuit board by a connector.
The electronic assembly of claim 25, wherein a first connector connects the first bracket and the circuit board in sequence and a second connector connects the circuit board and the first bracket in sequence; the extending shaft of the first connecting piece is staggered with the extending shaft of the second connecting piece.
The electronic assembly of claim 25 or 26, further comprising a second sub-circuit board and a second bracket, the second heat generating device mounted to the second sub-circuit board, the second sub-circuit board mounted to the second bracket, the second bracket mounted to the second side of the circuit board, the second heat generating device connected to the circuit board by a connector.
The electronic assembly of claim 27, wherein the first bracket, the circuit board, and the second bracket are stacked in sequence, a third connector connects the first bracket, the circuit board, and the second bracket in sequence, and a fourth connector connects the second bracket, the circuit board, and the first bracket in sequence; the extension shaft of the third connecting piece is staggered with the extension shaft of the fourth connecting piece.
An electronic assembly according to any one of claims 24 to 28, wherein the electronic assembly is a controller.
The electronic component according to any one of claims 24 to 29, comprising N layers of the circuit boards, and n+1 layers of the heat dissipation plates, wherein N layers of the circuit boards are stacked, one layer of the heat dissipation plate is provided between any adjacent two layers of the circuit boards, and N is a positive integer of 2 or more.
A terminal comprising at least one electronic assembly according to any one of claims 12 to 23; or alternatively, the process may be performed,

an electronic assembly comprising at least one of the electronic components of any of claims 24-30.
The terminal of claim 31, wherein the terminal is a vehicle.