CN116489955A - Heat dissipation rack in computer cluster - Google Patents
Heat dissipation rack in computer cluster Download PDFInfo
- Publication number
- CN116489955A CN116489955A CN202310474318.2A CN202310474318A CN116489955A CN 116489955 A CN116489955 A CN 116489955A CN 202310474318 A CN202310474318 A CN 202310474318A CN 116489955 A CN116489955 A CN 116489955A
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- Prior art keywords
- cabinet
- chip
- computer cluster
- class
- heat sink
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 26
- 239000002826 coolant Substances 0.000 claims abstract description 12
- 239000011093 chipboard Substances 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 61
- 238000001816 cooling Methods 0.000 claims description 20
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 241000353097 Molva molva Species 0.000 claims description 2
- 239000004519 grease Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 10
- 238000009423 ventilation Methods 0.000 abstract description 8
- 238000004378 air conditioning Methods 0.000 abstract description 7
- 238000013461 design Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 description 8
- 239000000498 cooling water Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005265 energy consumption Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation cabinet in a computer cluster, which comprises: the computer main board is transversely arranged at the upper half part of the cabinet in two rows at equal intervals; the computer motherboard is provided with a class I chip and a class II chip board card, and the class II chip board card is formed by combining a class II chip and a heat pipe type radiator. According to the computer cluster heat dissipation cabinet, a winter and summer dual-purpose working condition is set; under the working condition in summer, the coolant sequentially passes through the fan coil and each cold plate, and all heat is taken away by the coolant, so that the load of a room heating, ventilation and air conditioning is not influenced; under the working condition in winter, the coolant circulates between the fan coil and the cold plate, the whole load is borne by the cold air introduced outdoors, only pump work and fan work are consumed, the cabinet energy is greatly reduced, meanwhile, the mechanical design is skillfully utilized, the dual-purpose effect in winter and summer is achieved, and the equipment manufacturing cost is reduced.
Description
Technical Field
The invention belongs to the technical field of thermal management, and particularly relates to a heat dissipation cabinet in a computer cluster.
Background
With the development of computer technology in recent years, chip power is higher and higher, and higher requirements are put on efficient thermal management of electronic components in high-power computer equipment. In terms of computer heat dissipation, data center-scale thermal management of computer equipment is of widespread concern, but thermal management of some office room equipment where computer clusters exist is likewise not negligible. In such an office environment, the heat generated by the equipment is generally borne by the heating load of the heating ventilation and air conditioning system, and the heat dissipation scheme of the computer group still uses fans and fins to bring the heat of the main heating components into the indoor air through forced convection, and then the heating ventilation and air conditioning system bears the part of the cooling load in the air. The load of the heating ventilation air conditioner is increased, the comprehensive heat exchange efficiency is low, and the surface temperature of the computer chip cannot be effectively controlled.
Therefore, the invention discloses a liquid-gas dual-channel centralized heat dissipation cabinet for a computer group, which is used for centralized processing of heat generated by the computer group, so that the surface temperature of a chip is reduced, the load of heating ventilation and air conditioning is reduced, the energy utilization efficiency is improved, the comfort level of office workers is improved, and the like.
Disclosure of Invention
To solve the problems set forth in the background art. The invention provides a heat dissipation cabinet in a computer cluster.
In order to achieve the above purpose, the present invention provides the following technical solutions: a heat sink cabinet in a computer cluster, comprising: the cabinet body and the wind channel and the water channel arranged on the side surface of the cabinet body,
a plurality of computer mainboards are arranged in the cabinet body of the cabinet, and are transversely arranged at the upper half part of the cabinet in two rows at equal intervals;
the computer motherboard is provided with a class I chip and a class II chip board card, and the class II chip board card is formed by combining a class II chip and a heat pipe type radiator;
the wind channel consists of a baffle, an outdoor air filter, an outdoor air inlet, an indoor air filter, an indoor air inlet and an air outlet;
the water channel consists of a water inlet, a split tee, a water pump, a fan coil, a converging tee, an A valve, a water outlet, a B valve and pipelines for connecting the components.
In a preferred embodiment of the present invention, a cold plate is disposed on a side of the class i chip, the class i chip uses the cold plate to dissipate heat, and the class ii chip performs air cooling and convection heat dissipation through a heat pipe type radiator and cooling air flow in the cabinet.
In a preferred embodiment of the present invention, the class i chip is in contact with the Leng Banzhi interface, and the interface between the class i chip and the cold plate is coated with a thermally conductive silicone.
In a preferred embodiment of the present invention, the indoor air inlet is disposed at a side of the cabinet, and an indoor air filter is disposed in the indoor air inlet; the outdoor air inlet is arranged on the side face of the cabinet, and an outdoor air filter is arranged in the outdoor air inlet.
In a preferred embodiment of the present invention, a wind deflector is disposed between the indoor air inlet and the outdoor air inlet; the air outlet is arranged on the top surface of the cabinet body.
In a preferred embodiment of the invention, a water pump, a fan coil and a plurality of cold plates are sequentially connected in series between the split tee and the converging tee.
In a preferred embodiment of the invention, a valve B is connected between the split tee and the converging tee; the shunt tee joint is directly connected with the water inlet; and the valve A is connected between the converging three-way outlet and the water outlet.
In a preferred embodiment of the invention, the air conditioner further comprises a temperature sensor, and the fan coil and the water pump can adjust the air speed and the flow in real time according to the temperature sensor.
In a preferred embodiment of the invention, the cooling plates are provided with a plurality of blocks, the cooling plates are connected through the pipeline, and the pipeline is internally provided with a coolant.
In a preferred embodiment of the present invention, the cold plate and the tube radiator are capable of controlling the temperature of the class i and class ii chips to be 40-80 ℃.
The invention solves the defects existing in the background technology, and has the following beneficial effects:
1. according to the computer cluster heat dissipation cabinet, a winter and summer dual-purpose working condition is set; under the working condition in summer, the coolant sequentially passes through the fan coil and each cold plate, and all heat is taken away by the coolant, so that the load of a room heating, ventilation and air conditioning is not influenced; under the working condition in winter, the coolant circulates between the fan coil and the cold plate, the whole load is borne by the cold air introduced outdoors, only the pumping work and the fan work are consumed, and the energy consumption of the cabinet is greatly reduced. Meanwhile, the mechanical design is skillfully utilized, the dual-purpose effect of winter and summer is achieved, and the manufacturing cost of equipment is reduced.
2. The heat dissipation cabinet in the computer cluster is provided with a gas-liquid double-channel heat dissipation mode; according to different integrated forms of chips on a computer main board, a water cooling mode and an air cooling mode are respectively arranged for classified heat dissipation, so that the refrigeration efficiency is greatly improved, and the surface temperature of the chips is further reduced.
3. According to the computer cluster heat dissipation cabinet, through a PID control method, the wind speed of the fan coil is adjusted according to the temperature of the air outlet in the air channel of the cabinet, and the flow of the water pump is adjusted according to the temperature of the water outlet in the liquid channel, so that the energy consumption of equipment is reduced.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
fig. 1 is a schematic structural diagram of a cabinet body of a cabinet according to an embodiment of the invention
Fig. 2 is a schematic diagram of a cabinet body of the cabinet according to an embodiment of the invention
FIG. 3 is a diagram showing the summer conditions of the cabinet body of the cabinet according to an embodiment of the invention
FIG. 4 is a diagram illustrating a winter condition of a cabinet body of a cabinet according to an embodiment of the present invention
FIG. 5 is an enlarged schematic view of a portion of a class I chip and a class II chip of a cabinet according to an embodiment of the invention
In the figure: 1. a cabinet body; 2. a computer motherboard; 3. class I chips; 4. class II chip cards; 41. class II chips; 42. a heat pipe radiator; 5. a cold plate; 6. a fan coil; 7. a baffle; 8. an outdoor air filter; 9. an outdoor air inlet; 10. an indoor air filter; 11. an indoor air inlet; 12. a water inlet; 13. a shunt tee; 14. a water pump; 15. a valve B; 16. a water outlet; 17. a valve A; 18. converging three-way; 19. a pipeline; 21. an air outlet.
Detailed Description
The invention will now be described in further detail with reference to the drawings and examples, which are simplified schematic illustrations of the basic structure of the invention, which are presented only by way of illustration, and thus show only the structures that are relevant to the invention.
A heat sink cabinet in a computer cluster, comprising: the air conditioner comprises a cabinet body 1, and an air channel and a water channel which are arranged on the side surface of the cabinet body 1, wherein the air channel consists of a baffle 7, an outdoor air filter 8, an outdoor air inlet 9, an indoor air filter 10, an indoor air inlet 11 and an air outlet 21; the water channel consists of a water inlet 12, a diversion tee 13, a water pump 14, a fan coil 6, a confluence tee 18, an A valve 17, a water outlet 16, a B valve 15 and a pipeline 19 for connecting the components.
According to the computer cluster heat dissipation cabinet, a winter and summer dual-purpose working condition is set; under the working condition in summer, the coolant sequentially passes through the fan coil 6 and each cold plate 5, and all heat is taken away by the coolant, so that the load of the room heating, ventilation and air conditioning is not influenced; under the working condition in winter, the coolant circulates between the fan coil 6 and the cold plate 5, the whole load is borne by the cold air introduced outdoors, only the pumping work and the fan work are consumed, and the energy consumption of the cabinet is greatly reduced. Meanwhile, the mechanical design is skillfully utilized, the dual-purpose effect of winter and summer is achieved, and the manufacturing cost of equipment is reduced.
A plurality of computer mainboards 2 are arranged in the cabinet body 1 of the cabinet, and the computer mainboards 2 are transversely arranged at the upper half part of the cabinet in two rows vertically and equidistantly; the computer main board 2 is provided with a class I chip 3 and a class II chip board 4, and the class II chip board 4 is formed by combining a class II chip 41 and a heat pipe type radiator 42; the side face of the I-type chip 3 is provided with a cold plate 5, the I-type chip 3 uses the cold plate 5 to dissipate heat, and the II-type chip 41 carries out air cooling convection heat dissipation through a heat pipe type radiator 42 and cooling air flow in the cabinet; the I-type chip 3 is in direct contact with the cold plate 5, and the contact surface of the I-type chip 3 and the cold plate 5 is coated with heat-conducting silicone grease; the cooling plates 5 are connected through a pipeline 19, and a coolant is arranged in the pipeline 19; the cold plate 5 and the tube radiator can control the temperature of the class I chip 3 and the class II chip 41 to be 40-80 ℃.
The indoor air inlet 11 is arranged on the side surface of the cabinet, and the indoor air filter 10 is arranged in the indoor air inlet 11; the outdoor air inlet 9 is arranged on the side surface of the cabinet, and an outdoor air filter 8 is arranged in the outdoor air inlet 9; a wind deflector is arranged between the indoor air inlet 11 and the outdoor air inlet 9; the air outlet 21 is arranged on the top surface of the cabinet body 1.
A water pump 14, a fan coil 6 and a plurality of cold plates 5 are sequentially connected in series between the split tee 13 and the converging tee 18; a valve B15 is connected between the split tee 13 and the converging tee 18; the diversion tee 13 is directly connected with the water inlet 12; an A valve 17 is connected between the outlet of the converging tee 18 and the water outlet 16.
The heat dissipation cabinet in the computer cluster is provided with a gas-liquid double-channel heat dissipation mode; according to different integrated forms of chips on the computer main board 2, a water cooling mode and an air cooling mode are respectively arranged for classified heat dissipation, so that the refrigeration efficiency is greatly improved, and the surface temperature of the chips is further reduced.
The air speed and the flow can be adjusted in real time by the fan coil 6 and the water pump 14 according to the temperature sensor; the computer cluster heat dissipation cabinet is characterized in that the air speed of the fan coil 6 is regulated according to the temperature of an air outlet 21 in an air channel of the cabinet and the flow of the water pump 14 is regulated according to the temperature of a water outlet 16 in a liquid channel by a PID control method, so that the energy consumption of the equipment is reduced.
Example two
On the basis of the implementation one, when the temperature in summer is higher, the operation condition of the invention is shown as the figure
In the air channel, the wind shield is shifted to the position shown in the figure. Indoor air enters from an indoor air inlet 11, is filtered by an indoor air filter 10, is subjected to cooling treatment by a fan coil 6, then exchanges heat with the water cooling plate 5 and air in the cabinet in a convection manner, and is finally discharged from the cabinet into the room through an air outlet 21 to form indoor air circulation;
in the liquid channel, valve A17 is opened and valve B15 is closed. The external chilled water enters a pipeline 19 from a water inlet 12, sequentially passes through a water pump 14, a fan coil 6 and six water cooling plates 5, and flows out from a water outlet 16 to form a water circulation as shown in the figure.
The summer control implementation:
in the air channel, the wind speed of the fan coil 6 is regulated according to the temperature of the air outlet 21; when the class II chip 41 operates with the minimum power, the minimum wind speed of the fan coil 6 can meet the heat dissipation requirement of the class II chip 41; when the power of the class II chip 41 is increased, the temperature of the air outlet 21 is gradually increased, and a signal is fed back to the fan by the air outlet 21 temperature sensor, so that the wind speed of the fan is increased; when the power of the class II chip 41 is reduced, the temperature of the air outlet 21 is gradually reduced, a signal is fed back to the fan coil 6 by the air outlet 21 temperature sensor, the fan wind speed is reduced, and a PID control method is applied until the temperature of the air outlet 21 is controlled within a set range.
The flow of the water pump 14 is regulated according to the temperature of the water outlet 16 in the water channel; when the I-type heat dissipation chip operates at the minimum power, the water pump 14 can meet the heat dissipation requirement by keeping the minimum flow; when the power of the I-type chip 3 is gradually increased, the temperature of the water outlet 16 is gradually increased, and a signal is fed back to the water pump 14 by the water outlet 16 temperature sensor to increase the flow; when the power of the I-type chip 3 is gradually reduced, the temperature of the water outlet 16 is gradually reduced, a signal is fed back to the water feed pump 14 by the temperature sensor of the water outlet 16 to reduce the flow, and a PID control method is applied until the temperature of the water outlet 16 is controlled within a set range.
Example III
On the basis of implementation one, when the temperature of the invention is lower in winter, the running condition is shown as the figure
In the air channel, the wind shield is shifted to the position shown in the figure. Outdoor air enters from an outdoor air inlet 9, is filtered by an outdoor air filter 8, passes through a fan coil 6, exchanges heat with the water cooling plate 5 and air in the cabinet in a convection manner, and is discharged from the cabinet into the room through an air outlet 21 so as to form positive pressure in the room;
in the liquid channel, valve A17 is closed and valve B15 is opened. The cooling water sequentially passes through the fan coil 6 and the six water cooling plates 5 by the water pump 14 to form internal water circulation, and the direction of the cooling water flow is shown in the figure.
All heat sources generate heat which enters the room after being processed by outdoor cold air to approach the room temperature, and the load of heating ventilation and air conditioning is not affected.
Winter control implementation:
in winter, the temperature of cooling water in the pipeline 19 is reduced by heat exchange between the fan coil 6 and outdoor air, the flow of the water pump 14 is set to be a constant value, and the wind speed of the fan coil 6 is regulated according to the temperature of the air outlet 21; when the I-type chip 3 and the II-type chip 41 are in the minimum power operation, the wind speed of the fan coil 6 is set to be the lowest, the flow of the water pump 14 is adjusted to be within the set range of the temperature of the air outlet 21, and the flow of the water pump 14 is set to be a constant value at the moment; when the power of the I-type chip 3 or the II-type chip 41 is increased, the temperature of the air outlet 21 is gradually increased, and the temperature sensor of the air outlet 21 feeds back signals to the fan to increase the wind speed of the fan; when the power of the I-type chip 3 or the II-type chip 41 is reduced, the temperature of the air outlet 21 is gradually reduced, the temperature sensor of the air outlet 21 feeds back a signal to the fan coil 6, the fan wind speed is reduced, and a PID control method is applied until the temperature of the air outlet 21 is controlled within a set range.
The working principle of the invention is as follows:
when the temperature is higher, the wind shield is stirred to the position shown in the figure in the air channel. Indoor air enters from an indoor air inlet 11, is filtered by an indoor air filter 10, is subjected to cooling treatment by a fan coil 6, then exchanges heat with the cold plate 5 and air in the cabinet in a convection manner, and is finally discharged from the cabinet into the room through an air outlet 21 to form indoor air circulation; in the liquid channel, valve A17 is opened and valve B15 is closed. The external chilled water enters a pipeline 19 from a water inlet 12, passes through a water pump 14, a fan coil 6 and a cold plate 5 in sequence, and flows out from a water outlet 16 to form a water circulation as shown in the figure.
At a lower temperature, the wind shield is shifted to the position shown in the figure in the air channel. Outdoor air enters from an outdoor air inlet 9, is filtered by an outdoor air filter 8, passes through a fan coil 6, exchanges heat with the cold plate 5 and air in the cabinet in a convection manner, and is discharged from the cabinet into the room through an air outlet 21 so as to form positive pressure in the room; in the liquid channel, valve A17 is closed and valve B15 is opened. The cooling water sequentially passes through the fan coil 6 and six cold plates 5 by the water pump 14 to form internal water circulation, and the direction of the cooling water flow is shown as the figure
In the description of the present invention, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or an implicit indication of the number of technical features being indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present specification, the terms "one embodiment," "some embodiments," "examples," "specific examples" or "some examples" and the like refer to particular features, structures, materials, or characteristics described in connection with the embodiment or example as being included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that alterations, modifications, substitutions and variations may be made in the above embodiments by those skilled in the art within the scope of the invention.
Claims (10)
1. A heat sink cabinet in a computer cluster, comprising: the cabinet body, and the wind channel and the water channel arranged on the side surface of the cabinet body are characterized in that,
a plurality of computer mainboards are arranged in the cabinet body of the cabinet, and are transversely arranged at the upper half part of the cabinet in two rows at equal intervals;
the computer motherboard is provided with a class I chip and a class II chip board card, and the class II chip board card is formed by combining a class II chip and a heat pipe type radiator;
the wind channel consists of a baffle, an outdoor air filter, an outdoor air inlet, an indoor air filter, an indoor air inlet and an air outlet;
the water channel consists of a water inlet, a split tee, a water pump, a fan coil, a converging tee, an A valve, a water outlet, a B valve and pipelines for connecting the components.
2. A computer cluster heat sink cabinet in accordance with claim 1, wherein: the I-type chip side is provided with the cold plate, I-type chip uses the cold plate heat dissipation, II-type chip carries out forced air cooling convection heat dissipation through heat pipe formula radiator and the interior cooling air current of rack.
3. A computer cluster heat sink cabinet as claimed in claim 2, wherein: the I-type chip is contacted with the Leng Banzhi, and the contact surface of the I-type chip and the cold plate is coated with heat conduction silicone grease.
4. A computer cluster heat sink cabinet in accordance with claim 1, wherein: the indoor air inlet is arranged on the side surface of the cabinet, and an indoor air filter is arranged in the indoor air inlet; the outdoor air inlet is arranged on the side face of the cabinet, and an outdoor air filter is arranged in the outdoor air inlet.
5. A computer cluster heat sink cabinet in accordance with claim 1, wherein: a wind deflector is arranged between the indoor air inlet and the outdoor air inlet; the air outlet is arranged on the top surface of the cabinet body.
6. A computer cluster heat sink cabinet in accordance with claim 1, wherein: and a water pump, a fan coil and a plurality of cold plates are sequentially connected in series between the split tee joint and the converging tee joint.
7. A computer cluster heat sink cabinet in accordance with claim 1, wherein: a valve B is connected between the split tee joint and the converging tee joint; the shunt tee joint is directly connected with the water inlet; and the valve A is connected between the converging three-way outlet and the water outlet.
8. A computer cluster heat sink cabinet in accordance with claim 1, wherein: the air speed and the flow can be adjusted in real time by the fan coil and the water pump according to the temperature sensor.
9. A computer cluster heat sink cabinet as claimed in claim 2, wherein: the cold plates are connected through the pipelines, and a coolant is arranged in the pipelines.
10. A computer cluster heat sink cabinet as claimed in claim 2, wherein: the temperature of the I-type chip and the II-type chip can be controlled between 40 ℃ and 80 ℃ by the cold plate and the tubular radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310474318.2A CN116489955A (en) | 2023-04-28 | 2023-04-28 | Heat dissipation rack in computer cluster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310474318.2A CN116489955A (en) | 2023-04-28 | 2023-04-28 | Heat dissipation rack in computer cluster |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116489955A true CN116489955A (en) | 2023-07-25 |
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ID=87221241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310474318.2A Pending CN116489955A (en) | 2023-04-28 | 2023-04-28 | Heat dissipation rack in computer cluster |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116489955A (en) |
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2023
- 2023-04-28 CN CN202310474318.2A patent/CN116489955A/en active Pending
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