CN116483184A - Heat dissipation method and device of server and server - Google Patents
Heat dissipation method and device of server and server Download PDFInfo
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- CN116483184A CN116483184A CN202310436346.5A CN202310436346A CN116483184A CN 116483184 A CN116483184 A CN 116483184A CN 202310436346 A CN202310436346 A CN 202310436346A CN 116483184 A CN116483184 A CN 116483184A
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Abstract
The embodiment of the application provides a heat dissipation method of a server, a heat dissipation device and the server. The method comprises the following steps: under the condition that the power-on detection of the server passes, determining target heat dissipation parameters of target equipment based on the received equipment information of the target equipment, wherein the target heat dissipation parameters comprise relevant parameters of heat dissipation strategies of the target equipment and relevant parameters of temperatures of the target equipment, and the target equipment is equipment of the server; updating the initial heat dissipation parameters of the target equipment into corresponding target heat dissipation parameters; the method comprises the steps of determining the target rotating speed of corresponding heat dissipation equipment based on target heat dissipation parameters and heat dissipation strategies of the target equipment, and controlling the heat dissipation equipment corresponding to the target equipment to dissipate heat based on the target rotating speed, so that the problems of large noise and poor performance of a server caused by large fluctuation of the rotating speed of a fan in the process of dissipating heat of the server in the related art are solved.
Description
Technical Field
The embodiment of the application relates to the field of computers, in particular to a heat dissipation method and device of a server, a computer readable storage medium and the server.
Background
CPU (central processing unit, central Processing Unit, abbreviated as CPU) and PCIE (high-speed serial computer expansion bus standard, peripheral Component Interconnect Express, abbreviated as PCIE) devices, that is, PCIE devices generally include GPU (graphics processor, graphic Processing Unit, abbreviated as GPU), RAID (redundant array of independent disks, redundant Array of Independent Disks, abbreviated as RAID), NIC (network adapter, network Interface Card, abbreviated as NIC), NVME (nonvolatile memory, non-Volatile Memory Express, abbreviated as NVME), SSD (solid state disk, solid State Drive, abbreviated as SSD), and an overtemperature problem easily occurs during operation.
In server heat dissipation, different manufacturers and different types of CPUs generally correspond to different Tjmax parameters (maximum tolerance temperature), so for heat dissipation of the CPU, the prior art generally adjusts the SetPoint point of the CPU (threshold for triggering heat dissipation) adaptively, but the proportional parameter, the integral parameter and the differential parameter in PID control are not adjusted adaptively, that is, default values are adopted for the proportional parameter, the integral parameter and the differential parameter, so that the problems of large fluctuation of the fan rotation speed, large noise, poor equipment performance of the server and high power consumption are generated. In addition, for heat dissipation of PCIE devices, in the related art, when PCIE devices trigger an over-temperature fault, the proportional parameter, the integral parameter, and the derivative parameter are modified to modify the corresponding fan rotation speed, which causes a sudden increase in the rotation speed of the fan, so that the noise of the server is larger and the performance is worse due to the increase in the rotation speed of the fan.
Therefore, there is a need for a heat dissipation solution that can adaptively adjust a server, so that the fan rotation speed of the server fluctuates less and the noise is less, and the device performance and the power consumption of the server are better.
Disclosure of Invention
The embodiment of the application provides a heat dissipation method of a server, a heat dissipation device, a computer readable storage medium and the server, which are used for at least solving the problems of larger noise and poor performance of the server caused by larger fluctuation of the rotating speed of a fan in the process of dissipating heat of the server in the related technology.
According to one embodiment of the present application, there is provided a heat dissipation method of a server, including: determining a target heat dissipation parameter of target equipment based on the received equipment information of the target equipment under the condition that the power-on detection of the server passes, wherein the target heat dissipation parameter comprises a relevant parameter of a heat dissipation strategy of the target equipment and a relevant parameter of the temperature of the target equipment, and the target equipment is equipment of the server; updating the initial heat dissipation parameters of the target equipment into the corresponding target heat dissipation parameters; and determining a target rotating speed of the corresponding heat dissipation device based on the target heat dissipation parameter of the target device and the heat dissipation strategy, and controlling the heat dissipation device corresponding to the target device to dissipate heat based on the target rotating speed.
In one exemplary embodiment, determining a target rotational speed of a corresponding heat sink device based on the target heat sink parameter of the target device and the heat sink policy includes: determining the maximum value of the current temperature information of a plurality of target devices in a target device group to obtain maximum temperature information, wherein the target device group comprises a plurality of target devices with the same type information; and determining the target rotating speed of the heat dissipation device corresponding to each target device in the target device group based on the maximum temperature information, the target heat dissipation parameter and the heat dissipation strategy.
In an exemplary embodiment, when the heat dissipation policy of the target device includes a PID heat dissipation policy and an interval matching heat dissipation policy, and the target heat dissipation parameter includes a PID parameter and a temperature interval corresponding to the interval matching heat dissipation policy, determining, based on the maximum temperature information, the target heat dissipation parameter, and the heat dissipation policy, the target rotation speed of the heat dissipation device corresponding to each target device in the target device group includes: determining a first target rotating speed of the corresponding heat dissipation equipment based on the maximum temperature information, the PID parameters and the PID heat dissipation strategy; determining the temperature interval matched with the maximum temperature information to obtain a target temperature interval, and determining the rotating speed of the heat radiation equipment corresponding to the target temperature interval as a second target rotating speed; and determining the maximum value of the first target rotating speed and the second target rotating speed as the target rotating speed of the heat dissipation device corresponding to each target device in the target device group.
In one exemplary embodiment, determining a target heat dissipation parameter of a target device based on received device information of the target device includes: and searching the target heat dissipation parameters of the target equipment from a heat dissipation parameter table based on the received equipment information and position information of the target equipment, wherein the heat dissipation parameter table is a table formed by equipment information of the equipment, the heat dissipation strategy, the target heat dissipation parameters and corresponding information of the heat dissipation equipment, the position information is used for representing the position information of the equipment in a case of the server, and the target equipment is one or more of a plurality of pieces of equipment.
In an exemplary embodiment, after the server is powered on and before the power-on detection of the server passes, the heat dissipation method further includes: determining an initial rotating speed of the heat dissipation device corresponding to the target device based on the current temperature information of the air inlet of the target device and a corresponding target temperature curve, wherein the target temperature curve is a curve formed by the current temperature information of the air inlet of the target device and the initial rotating speed of the heat dissipation device; and controlling the heat dissipation equipment corresponding to the target equipment, and performing heat dissipation based on the initial rotating speed.
In an exemplary embodiment, in a case where the target device is a GPU device, after controlling the heat dissipating device corresponding to the target device to dissipate heat based on the initial rotation speed, before determining the target rotation speed of the corresponding heat dissipating device based on the target heat dissipating parameter of the target device and the heat dissipating policy, the heat dissipating method further includes: determining a basic rotating speed of the heat dissipation device corresponding to the GPU device based on the current temperature information of the air inlet of the GPU device and a corresponding GPU temperature curve, wherein the GPU temperature curve is a curve formed by the current temperature information of the air inlet of the GPU device and the basic rotating speed of the heat dissipation device; and controlling the heat dissipation equipment corresponding to the GPU equipment, and performing heat dissipation based on the basic rotating speed.
In one exemplary embodiment, the device includes CPU, GPU, RAID, NIC, NVME and SSD, the PID parameters include a proportional parameter, an integral parameter, and a derivative parameter, the heat sink device is a fan, and the relevant parameters of the temperature of the target device include a maximum withstand temperature of the target device and a temperature threshold, the temperature threshold being a difference between the maximum withstand temperature and a predetermined threshold.
According to another embodiment of the present application, there is provided a heat dissipating device of a server, including: a first determining unit, configured to determine, based on the received device information of the target device, a target heat dissipation parameter of the target device, where the target heat dissipation parameter includes a parameter related to a heat dissipation policy of the target device and a parameter related to a temperature of the target device, and the target device is a device of the server, where the power-on detection of the server passes; the updating unit is used for updating the initial heat dissipation parameters of the target equipment into the corresponding target heat dissipation parameters; the first control unit is used for determining a target rotating speed of the corresponding heat dissipation device based on the target heat dissipation parameter of the target device and the heat dissipation strategy, and controlling the heat dissipation device corresponding to the target device to dissipate heat based on the target rotating speed.
According to a further embodiment of the present application, there is also provided a computer readable storage medium having stored therein a computer program, wherein the computer program is arranged to execute the steps of any one of the embodiments of the method of heat dissipation of a server when run.
According to still another embodiment of the present application, there is also provided a server including: a baseboard management controller, wherein the baseboard management controller comprises a heat dissipation device of a server, and the heat dissipation device is used for implementing any one of the heat dissipation methods of the server; and the equipment is in communication connection with the baseboard management controller.
According to the method and the device, before the target device does not report the overtemperature warning, namely under the condition that the power-on detection of the server passes, the initial heat dissipation parameter of the target device is updated to be the determined target heat dissipation parameter, then the target rotation speed of the corresponding heat dissipation device is determined based on the target heat dissipation parameter and the heat dissipation strategy of the target device, the target device is controlled to operate according to the target rotation speed so as to dissipate heat of the server, so that after the power-on detection of the server passes, the corresponding heat dissipation device of the target device can operate at a reasonable target rotation speed, but not after the target device reports the overtemperature warning, the target rotation speed of the heat dissipation device is determined, so that the determined target rotation speed of the heat dissipation device is stable and does not generate large fluctuation, and the problems of large fan rotation speed fluctuation, large noise and poor performance of the server in the heat dissipation process of the server in the related technology are solved.
Drawings
FIG. 1 is a block diagram of the hardware architecture of a server according to an embodiment of the present application;
FIG. 2 is a flow chart of a method of dissipating heat from a server according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a heat dissipating device of a server according to an embodiment of the present application.
Detailed Description
Embodiments of the present application will be described in detail below with reference to the accompanying drawings in conjunction with the embodiments.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.
The method embodiments provided in the embodiments of the present application may be performed in a server or similar computing device. Taking the operation on a server as an example, fig. 1 is a block diagram of a hardware structure of a server according to a heat dissipation method of the server in an embodiment of the present application. As shown in fig. 1, a server may include one or more (only one is shown in fig. 1) processors 102 (the processor 102 may include, but is not limited to, a microprocessor MCU or a processing device such as a programmable logic device FPGA) and a memory 104 for storing data, where the server may further include a transmission device 106 for communication functions and an input-output device 108. It will be appreciated by those skilled in the art that the structure shown in fig. 1 is merely illustrative, and is not intended to limit the structure of the server described above. For example, the server may also include more or fewer components than shown in FIG. 1, or have a different configuration than shown in FIG. 1.
The memory 104 may be used to store a computer program, for example, a software program of application software and a module, such as a computer program corresponding to a heat dissipation method of a server in the embodiment of the present application, and the processor 102 executes the computer program stored in the memory 104, thereby performing various functional applications and data processing, that is, implementing the above-mentioned method. Memory 104 may include high-speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 104 may further include memory remotely located relative to the processor 102, which may be connected to the mobile terminal via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The transmission device 106 is used to receive or transmit data via a network. Specific examples of the network described above may include a wireless network provided by a communication provider of the mobile terminal. In one example, the transmission device 106 includes a network adapter (Network Interface Controller, simply referred to as NIC) that can connect to other network devices through a base station to communicate with the internet. In one example, the transmission device 106 may be a Radio Frequency (RF) module, which is configured to communicate with the internet wirelessly.
In this embodiment, a heat dissipation method of a server running on a server is provided, and fig. 2 is a flowchart of a heat dissipation method of a server according to an embodiment of the present application, as shown in fig. 2, where the flowchart includes the following steps:
step S202, when the power-on detection of the server passes, determining a target heat dissipation parameter of the target device based on the received device information of the target device, wherein the target heat dissipation parameter comprises a relevant parameter of a heat dissipation strategy of the target device and a relevant parameter of a temperature of the target device, and the target device is a device of the server;
in the actual application process, after the server is started (i.e. after the server is powered on), the server enters a BIOS POST stage, i.e. the server enters a power-on detection stage. Typically, the BIOS will send device information to the BMC (baseboard management controller) if the BIOS POST phase detection passes.
Specifically, the Device information of the target Device may be a Vendor ID (Vendor ID), a Device ID (Device ID), a Sub-Vendor ID (Sub-Vendor ID), or a Sub-Device ID (Sub-Vendor ID) of the target Device.
In the step S202, the heat dissipation policy may be a PID heat dissipation policy, a section matching heat dissipation policy, or a PID heat dissipation policy and a section matching heat dissipation policy. The PID heat dissipation strategy adopts a PID calculation method to calculate the PWM value of heat dissipation equipment (a fan), so as to adjust the target rotating speed of the heat dissipation equipment and further dissipate heat of the target equipment; the interval matching heat dissipation strategy is a heat dissipation strategy corresponding to different rotation speeds of different heat dissipation devices in different temperature intervals, and can also be called as a linear heat dissipation strategy. In the actual application process, the heat dissipation policy corresponding to each target device may be the same, or may be different.
Specifically, the target heat dissipation parameter includes a parameter related to a heat dissipation policy of the target device, and specifically may be a PID heat dissipation parameter, a partition of each temperature interval of the interval matching heat dissipation policy, a rotation speed of the corresponding heat dissipation device, and so on; the above-mentioned parameters related to the temperature of the target device may specifically be the maximum tolerance temperature of the target device and a temperature threshold (i.e. the difference between the maximum tolerance temperature of the target device and a predetermined threshold, i.e. referred to as SetPoint). In the practical application process, for the target device, for example, CPU, GPU, RAID, NIC, NVME, SSD, when the current temperature reaches the maximum tolerance temperature, an overtemperature alarm is sent out or the main frequency is reduced.
Step S204, updating the initial heat dissipation parameter of the target equipment into the corresponding target heat dissipation parameter;
in the actual application process, under the condition that the target heat dissipation parameter of the target equipment is not determined based on the equipment information of the target equipment, the initial heat dissipation parameter of the target equipment is not updated, namely the target rotation speed of the corresponding heat dissipation equipment can be determined based on the initial heat dissipation parameter of the target equipment and the heat dissipation strategy. In addition, the initial heat dissipation parameter may also be referred to as a default heat dissipation parameter, that is, the initial heat dissipation parameter and the target heat dissipation parameter are the same.
Under the condition that a plurality of target devices exist, the initial heat dissipation parameters of the corresponding target devices can be updated one by one in a polling mode.
In addition, in order to avoid wasting resources and reduce the calculation amount of the server, under the condition that the power-on detection of the server passes, the target device in the server can be updated only once until the server is powered down. After the server is powered on next time, step S202 and step S204 may be performed again to achieve adaptive updating of the heat dissipation parameters of the target device.
Step S206, determining a target rotation speed of the corresponding heat dissipating device based on the target heat dissipating parameter of the target device and the heat dissipating policy, and controlling the heat dissipating device corresponding to the target device to dissipate heat based on the target rotation speed.
For some large servers, the number of the corresponding heat dissipation devices may be multiple, so that the corresponding heat dissipation devices of each target device may be different.
Through the steps, firstly, receiving equipment information of target equipment under the condition that power-on detection of a server passes, and determining target heat dissipation parameters of the target equipment based on the received equipment information of the target equipment; then, updating the initial heat dissipation parameters of the target equipment into corresponding target heat dissipation parameters; and finally, determining the target rotating speed of the heat dissipation device corresponding to the target device based on the target heat dissipation parameter and the heat dissipation strategy of the target device, and controlling the heat dissipation device corresponding to the target device to operate at the target rotating speed so as to dissipate heat of the target device. In the scheme, before the target device does not report the overtemperature warning, namely under the condition that the power-on detection of the server passes, the initial heat dissipation parameter of the target device is updated to be the determined target heat dissipation parameter, then the target rotation speed of the corresponding heat dissipation device is determined based on the target heat dissipation parameter of the target device and the heat dissipation strategy, and the target device is controlled to operate according to the target rotation speed so as to dissipate heat of the server, so that after the power-on detection of the server passes, the corresponding heat dissipation device of the target device can operate at a reasonable target rotation speed, but not after the target device reports the overtemperature warning, the target rotation speed of the heat dissipation device is determined, so that the determined target rotation speed of the heat dissipation device is stable and does not generate large fluctuation, and the problems of large fan rotation speed fluctuation, large noise and poor performance of the server in the process of radiating the server in the related technology are solved.
The execution sequence of step S202, step S204 and step S206 may be interchanged, i.e. step S204 may be executed first, then step S202 may be executed, and finally step S206 may be executed.
In order to avoid the reduction of the running speed of each target device in the server, or reduce the main frequency and the like, and avoid the reduction of the overall performance of the server, the heat dissipation method of the application determines a more reasonable target rotating speed before the target device is overtemperature warned, and controls the corresponding heat dissipation device to dissipate heat according to the target rotating speed, so that the whole heat dissipation device is ensured, the rotating speed corresponding to the heat dissipation device is always stable, larger fluctuation cannot occur, and the overall noise of the server is ensured to be smaller, and the overall performance is better.
In some implementation procedures, the step S206 may also be implemented through the step S2061 and the step S2062. In particular, the method comprises the steps of,
step S2061: determining the maximum value of the current temperature information of a plurality of target devices in a target device group to obtain maximum temperature information, wherein the target device group comprises a plurality of target devices with the same type information;
step S2062: and determining the target rotation speed of the heat dissipation device corresponding to each target device in the target device group based on the maximum temperature information, the target heat dissipation parameter and the heat dissipation strategy.
In the scheme, if a plurality of target devices of the same type exist in the server, namely, a plurality of target devices with the same type information exist, the target rotation speed of the heat dissipation device corresponding to the target device is determined based on the maximum temperature (maximum temperature information) of the plurality of target devices of the same type, the target heat dissipation parameters and the heat dissipation strategy, so that the determined target rotation speed is reasonable, the difference between the rotation speed of the heat dissipation device after the target device reports the over-temperature fault and the target rotation speed is further ensured to be smaller, namely, the rotation speed fluctuation of the heat dissipation device is further ensured to be smaller, and the noise of the server is further ensured to be smaller and the performance is better.
In order to further ensure that the rotation speed fluctuation of the heat dissipation device is smaller, and further ensure that the noise of the server is smaller and the performance is better, for a target device comprising both a PID heat dissipation policy and an interval matching heat dissipation policy, and when the target heat dissipation parameter comprises a PID parameter and a temperature interval corresponding to the interval matching heat dissipation policy, determining the target rotation speed of the heat dissipation device corresponding to each target device in the target device group based on the maximum temperature information, the target heat dissipation parameter and the heat dissipation policy comprises: determining a first target rotating speed of the corresponding heat dissipation device based on the maximum temperature information, the PID parameters and the PID heat dissipation strategy, namely determining the first target rotating speed of the heat dissipation device corresponding to each target device in the target device group based on the maximum temperature information, the PID parameters in the target heat dissipation parameters and a calculation formula corresponding to the PID heat dissipation strategy; determining the temperature interval matched with the maximum temperature information to obtain a target temperature interval, and determining the rotating speed of the heat radiating equipment corresponding to the target temperature interval as a second target rotating speed, namely after the maximum temperature information is obtained, carrying out one-by-one matching based on the maximum temperature information and the temperature interval in an interval matching heat radiating strategy, so as to obtain the temperature information currently matched with the maximum temperature information, and further obtaining the second target rotating speed of the heat radiating equipment corresponding to each target equipment in the target equipment group; and determining the maximum value of the first target rotating speed and the second target rotating speed as the target rotating speed of the heat dissipating device corresponding to each target device in the target device group, so that the rotating speeds of the heat dissipating devices corresponding to each target device in the target device group can be provided before the target devices in the target device group report the overtemperature warning, and the corresponding rotating speeds of the heat dissipating devices can not be suddenly increased after the target devices send the overtemperature warning, thereby further ensuring that the fluctuation of the heat dissipating devices is smaller.
In an embodiment of the present application, the step S202 may be further implemented by the following steps: and searching the target heat dissipation parameter of the target device from a heat dissipation parameter table based on the received device information and position information of the target device, wherein the heat dissipation parameter table is a table formed by device information of the device, the heat dissipation strategy, the target heat dissipation parameter and corresponding information of the heat dissipation device, the position information is used for representing the position information of the device in a case of the server, and the target device is one or more of the devices. In this embodiment, under the condition that the power-on detection of the server passes, the corresponding target heat dissipation parameter is determined based on the received device information and the position information of the target device, so that it is ensured that the target heat dissipation parameter can be determined more accurately.
In an actual application process, generally, one server corresponds to a plurality of heat dissipation devices, so in order to obtain the heat dissipation devices corresponding to the target devices more simply and accurately, relevant information of the heat dissipation devices corresponding to the target devices, for example, device information, position information, model information and the like of the corresponding heat dissipation devices can be enumerated in the heat dissipation parameter table.
In an actual application process, after the server is powered on and before the power-on detection of the server passes, at this time, the baseboard management controller, i.e., the BMC, does not receive the device information and/or the position information of the target device yet and does not acquire the current temperature of the target device yet, so in order to further control the corresponding heat dissipating device to start dissipating heat from the target device, and further ensure that the difference between the target rotation speed determined later and the initial rotation speed of the heat dissipating device in the power-on detection stage of the server (after the server is powered on and before the power-on detection of the server passes), in one embodiment of the present invention, after the server is powered on and before the power-on detection of the server passes, the initial rotation speed of the heat dissipating device corresponding to the target device is determined based on the current temperature information of the air inlet of the target device and a corresponding target temperature curve, where the target temperature curve is a curve formed by the current temperature information of the air inlet of the target device and the initial rotation speed of the heat dissipating device; and controlling the heat dissipation device corresponding to the target device, and dissipating heat based on the initial rotation speed.
In some embodiments, the heat dissipation method of the server of the present application may further include step S208 and step S209. Specifically, step S208, when the target device is a GPU device, of controlling the heat dissipating device corresponding to the target device, performing heat dissipation based on the initial rotation speed, and determining a basic rotation speed of the heat dissipating device corresponding to the GPU device based on current temperature information of an air inlet of the GPU device and a corresponding GPU temperature curve, where the GPU temperature curve is a curve formed by the current temperature information of the air inlet of the GPU device and the basic rotation speed of the heat dissipating device; step S209, controlling the heat dissipation device corresponding to the GPU device to dissipate heat based on the basic rotation speed, so as to further improve the basic rotation speed, i.e. reduce the difference between the initial rotation speed, the basic rotation speed and the target rotation speed of the heat dissipation device corresponding to the GPU device, further ensure that the rotation speed fluctuation of the heat dissipation device corresponding to the GPU device is smaller, and further ensure that the overall noise of the server is smaller and the performance is better.
In a specific implementation process, different heat dissipation curves (a target temperature curve and a GPU temperature curve) can be switched through self-adaption of different equipment types or by using an ipmtool command, so that the heat dissipation requirement is met.
In a specific embodiment of the present application, the device includes CPU, GPU, RAID, NIC, NVME and SSD, the PID parameter includes a proportional parameter, an integral parameter, and a derivative parameter, the heat dissipating device is a fan, and the relevant parameter of the temperature of the target device includes a maximum tolerance temperature of the target device and a temperature threshold, and the temperature threshold is a difference between the maximum tolerance temperature and a predetermined threshold. Specifically, the temperature threshold is used for radiating heat under the condition of over-temperature to the target equipment when the current temperature of the target equipment is higher than the temperature threshold.
In another specific embodiment of the present application, the predetermined threshold may be 20 ℃, that is, the temperature threshold is a difference between the maximum tolerance temperature and 20 ℃.
The device in the application is a device on a server, and the target device is a device that receives device information and/or location information.
In the practical application process, when the target devices of the same type but different types are mixed, for example, a plurality of NVME hard disks of different types are mixed. Because the NVME hard disks of different capacities or different manufacturers have different frequency reducing temperatures or heating speeds, the set point points (temperature thresholds) and the maximum tolerance temperatures corresponding to the NVME hard disks of different capacities or different manufacturers are also different. In order to prevent the mixed insertion of the NVME hard disks from overtemperature or alarm, when the NVME hard disks are subjected to heat dissipation, the smallest one of the set point points in the NVME hard disks with different types is selected as a target set point for starting to cool down, and the largest one of the NVME hard disks with different signals is taken as a target maximum tolerance temperature. If there are any points for which the target SetPoint point and/or the target maximum withstand temperature is not determined, a default SetPoint point is used. When the NVME hard disk is mixed, the current temperature is greater than the target SetPoint point, and then the NVME hard disk is further cooled.
From the description of the above embodiments, it will be clear to a person skilled in the art that the method according to the above embodiments may be implemented by means of software plus the necessary general hardware platform, but of course also by means of hardware, but in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art in the form of a software product stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk), including several instructions for causing a terminal device (which may be a mobile phone, a computer, a server, or a network device, etc.) to perform the method of the embodiments of the present application.
The embodiment of the application also provides a heat dissipation device of the server, and the heat dissipation device of the server can be used for executing the heat dissipation method for the server. The device is used for realizing the above embodiments and preferred embodiments, and is not described in detail. As used below, the term "module" may be a combination of software and/or hardware that implements a predetermined function. While the means described in the following embodiments are preferably implemented in software, implementation in hardware, or a combination of software and hardware, is also possible and contemplated.
The following describes a heat dissipation device of a server provided in an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a heat dissipating device of a server according to an embodiment of the present application. As shown in fig. 3, the heat dissipating device includes:
a first determining unit 32, configured to determine, based on the received device information of the target device, a target heat dissipation parameter of the target device, where the target heat dissipation parameter includes a parameter related to a heat dissipation policy of the target device and a parameter related to a temperature of the target device, and the target device is a device of the server, where the power-on detection of the server passes;
in the actual application process, after the server is started (i.e. after the server is powered on), the server enters a BIOS POST stage, i.e. the server enters a power-on detection stage. Typically, the BIOS will send device information to the BMC (baseboard management controller) if the BIOS POST phase detection passes.
Specifically, the Device information of the target Device may be a Vendor ID (Vendor ID), a Device ID (Device ID), a Sub-Vendor ID (Sub-Vendor ID), or a Sub-Device ID (Sub-Vendor ID) of the target Device.
In the first determining unit, the heat dissipation policy may be a PID heat dissipation policy, a section matching heat dissipation policy, or a PID heat dissipation policy and a section matching heat dissipation policy. The PID heat dissipation strategy adopts a PID calculation method to calculate the PWM value of heat dissipation equipment (a fan), so as to adjust the target rotating speed of the heat dissipation equipment and further dissipate heat of the target equipment; the interval matching heat dissipation strategy is a heat dissipation strategy corresponding to different rotation speeds of different heat dissipation devices in different temperature intervals, and can also be called as a linear heat dissipation strategy. In the actual application process, the heat dissipation policy corresponding to each target device may be the same, or may be different.
Specifically, the target heat dissipation parameter includes a parameter related to a heat dissipation policy of the target device, and specifically may be a PID heat dissipation parameter, a partition of each temperature interval of the interval matching heat dissipation policy, a rotation speed of the corresponding heat dissipation device, and so on; the above-mentioned parameters related to the temperature of the target device may specifically be the maximum tolerance temperature of the target device and a temperature threshold (i.e. the difference between the maximum tolerance temperature of the target device and a predetermined threshold, i.e. referred to as SetPoint). In the practical application process, for the target device, for example, CPU, GPU, RAID, NIC, NVME, SSD, when the current temperature reaches the maximum tolerance temperature, an overtemperature alarm is sent out or the main frequency is reduced.
An updating unit 34, configured to update an initial heat dissipation parameter of the target device to a corresponding target heat dissipation parameter;
in the actual application process, under the condition that the target heat dissipation parameter of the target equipment is not determined based on the equipment information of the target equipment, the initial heat dissipation parameter of the target equipment is not updated, namely the target rotation speed of the corresponding heat dissipation equipment can be determined based on the initial heat dissipation parameter of the target equipment and the heat dissipation strategy. In addition, the initial heat dissipation parameter may also be referred to as a default heat dissipation parameter, that is, the initial heat dissipation parameter and the target heat dissipation parameter are the same.
Under the condition that a plurality of target devices exist, the initial heat dissipation parameters of the corresponding target devices can be updated one by one in a polling mode.
In addition, in order to avoid wasting resources and reduce the calculation amount of the server, under the condition that the power-on detection of the server passes, the target device in the server can be updated only once until the server is powered down. After the server is powered on next time, the first determining unit and the updating unit can be passed through again, so that the heat dissipation parameters of the target device can be updated adaptively.
The first control unit 36 is configured to determine a target rotation speed of a corresponding heat dissipating device based on the target heat dissipating parameter of the target device and the heat dissipating policy, and control the heat dissipating device corresponding to the target device to dissipate heat based on the target rotation speed.
For some large servers, the number of the corresponding heat dissipation devices may be multiple, so that the corresponding heat dissipation devices of each target device may be different.
Through the steps, a first determining unit is used for receiving equipment information of target equipment under the condition that power-on detection of a server passes, and determining target heat dissipation parameters of the target equipment based on the received equipment information of the target equipment; the updating unit is used for updating the initial heat dissipation parameters of the target equipment into the corresponding target heat dissipation parameters; the first control unit is used for determining a target rotating speed of the heat dissipation device corresponding to the target device based on the target heat dissipation parameter and the heat dissipation strategy of the target device, and controlling the heat dissipation device corresponding to the target device to operate at the target rotating speed so as to dissipate heat of the target device. In the scheme, before the target device does not report the overtemperature warning, namely under the condition that the power-on detection of the server passes, the initial heat dissipation parameter of the target device is updated to be the determined target heat dissipation parameter, then the target rotation speed of the corresponding heat dissipation device is determined based on the target heat dissipation parameter of the target device and the heat dissipation strategy, and the target device is controlled to operate according to the target rotation speed so as to dissipate heat of the server, so that after the power-on detection of the server passes, the corresponding heat dissipation device of the target device can operate at a reasonable target rotation speed, but not after the target device reports the overtemperature warning, the target rotation speed of the heat dissipation device is determined, so that the determined target rotation speed of the heat dissipation device is stable and does not generate large fluctuation, and the problems of large fan rotation speed fluctuation, large noise and poor performance of the server in the process of radiating the server in the related technology are solved.
In order to avoid the reduction of the running speed of each target device in the server, or reduce the main frequency and the like, and avoid the reduction of the overall performance of the server, the heat dissipation method of the application determines a more reasonable target rotating speed before the target device is overtemperature warned, and controls the corresponding heat dissipation device to dissipate heat according to the target rotating speed, so that the whole heat dissipation device is ensured, the rotating speed corresponding to the heat dissipation device is always stable, larger fluctuation cannot occur, and the overall noise of the server is ensured to be smaller, and the overall performance is better.
In some implementation processes, the first control unit includes a first determining module and a second determining module, where the first determining module is configured to determine a maximum value of current temperature information of a plurality of target devices in a target device group, to obtain maximum temperature information, and the target device group includes a plurality of target devices with the same type information; the second determining module is configured to determine the target rotation speed of the heat dissipating device corresponding to each of the target devices in the target device group based on the maximum temperature information, the target heat dissipating parameter, and the heat dissipating policy. In the scheme, if a plurality of target devices of the same type exist in the server, namely, a plurality of target devices with the same type information exist, the target rotation speed of the heat dissipation device corresponding to the target device is determined based on the maximum temperature (maximum temperature information) of the plurality of target devices of the same type, the target heat dissipation parameters and the heat dissipation strategy, so that the determined target rotation speed is reasonable, the difference between the rotation speed of the heat dissipation device after the target device reports the over-temperature fault and the target rotation speed is further ensured to be smaller, namely, the rotation speed fluctuation of the heat dissipation device is further ensured to be smaller, and the noise of the server is further ensured to be smaller and the performance is better.
In order to further ensure that the rotation speed fluctuation of the heat dissipation device is smaller, and further ensure that the noise of the server is smaller and the performance is better, for the target device comprising both the PID heat dissipation strategy and the interval matching heat dissipation strategy, and in the case that the target heat dissipation parameter comprises the PID parameter and the temperature interval corresponding to the interval matching heat dissipation strategy, the second determining module comprises a first determining sub-module, a second determining sub-module and a third determining sub-module, wherein the second determining module is used for determining the first target rotation speed of the corresponding heat dissipation device based on the maximum temperature information, the PID parameter and the PID heat dissipation strategy, namely determining the first target rotation speed of the heat dissipation device corresponding to each target device in the target device group based on the maximum temperature information, the PID parameter in the target heat dissipation parameter and a calculation formula corresponding to the PID heat dissipation strategy; the second determining submodule is used for determining the temperature interval matched with the maximum temperature information to obtain a target temperature interval, determining the rotating speed of the heat radiating equipment corresponding to the target temperature interval as a second target rotating speed, namely after the maximum temperature information is obtained, carrying out one-by-one matching on the temperature interval in a heat radiating strategy based on the maximum temperature information and interval matching so as to obtain temperature information matched with the maximum temperature information at present, and further obtaining the second target rotating speed of the heat radiating equipment corresponding to each target equipment in the target equipment group; the third determining submodule is configured to determine a maximum value of the first target rotation speed and the second target rotation speed as the target rotation speed of the heat dissipating device corresponding to each target device in the target device group, so that before the target device in the target device group does not report an overtemperature warning, the rotation speed of the heat dissipating device corresponding to each target device in the target device group can be provided, and subsequently after the target device sends the overtemperature warning, the rotation speed of the corresponding heat dissipating device does not increase suddenly, and further, the fluctuation of the heat dissipating device is ensured to be smaller.
In an embodiment of the present application, the first determining unit includes a searching module, configured to search, based on the received device information and location information of the target device, the target heat dissipation parameter of the target device from a heat dissipation parameter table, where the heat dissipation parameter table is a table formed by device information of a device, the heat dissipation policy, the target heat dissipation parameter, and information of the corresponding heat dissipation device, and the location information is used to characterize location information of the device in a chassis of the server, where the target device is one or more of a plurality of the devices. In this embodiment, under the condition that the power-on detection of the server passes, the corresponding target heat dissipation parameter is determined based on the received device information and the position information of the target device, so that it is ensured that the target heat dissipation parameter can be determined more accurately.
In an actual application process, generally, one server corresponds to a plurality of heat dissipation devices, so in order to obtain the heat dissipation devices corresponding to the target devices more simply and accurately, relevant information of the heat dissipation devices corresponding to the target devices, for example, device information, position information, model information and the like of the corresponding heat dissipation devices can be enumerated in the heat dissipation parameter table.
In an actual application process, after the server is powered on and before the power-on detection of the server passes, at this time, the baseboard management controller, that is, the BMC, has not received the device information and/or the position information of the target device and has not obtained the current temperature of the target device, so in order to further control the corresponding heat dissipation device to start dissipating heat from the target device, and further ensure that the difference between the target rotation speed determined later and the initial rotation speed of the heat dissipation device in the power-on detection stage of the server (after the server is powered on and before the power-on detection of the server passes) is smaller, in one embodiment of the present application, the heat dissipation device further includes a second determining unit and a second control unit, where the second determining unit is configured to determine, based on the current temperature information of the air inlet of the target device and the corresponding target temperature curve, that is the initial rotation speed curve of the heat dissipation device formed by the current temperature information of the target device and the initial rotation speed of the air inlet of the heat dissipation device; the second control unit is configured to control the heat dissipating device corresponding to the target device, and dissipate heat based on the initial rotation speed.
In some embodiments, the heat dissipating device of the server of the present application further includes a third determining unit and a third control unit, where the third determining unit is configured to, when the target device is a GPU device, determine, after controlling the heat dissipating device corresponding to the target device to dissipate heat based on the initial rotational speed, a base rotational speed of the heat dissipating device corresponding to the GPU device based on current temperature information of an air inlet of the GPU device and a corresponding GPU temperature curve, where the GPU temperature curve is a curve formed by the current temperature information of the air inlet of the GPU device and the base rotational speed of the heat dissipating device; the third control unit is used for controlling the heat dissipation device corresponding to the GPU device to dissipate heat based on the basic rotating speed, so that the basic rotating speed is further improved, namely, the difference value between the initial rotating speed, the basic rotating speed and the target rotating speed of the heat dissipation device corresponding to the GPU device is reduced, the fluctuation of the rotating speed of the heat dissipation device corresponding to the GPU device is further ensured to be smaller, and the overall noise of the server is further ensured to be smaller and the performance of the server is further ensured to be better.
In a specific implementation process, different heat dissipation curves (a target temperature curve and a GPU temperature curve) can be switched through self-adaption of different equipment types or by using an ipmtool command, so that the heat dissipation requirement is met.
In a specific embodiment of the present application, the device includes CPU, GPU, RAID, NIC, NVME and SSD, the PID parameter includes a proportional parameter, an integral parameter, and a derivative parameter, the heat dissipating device is a fan, and the relevant parameter of the temperature of the target device includes a maximum tolerance temperature of the target device and a temperature threshold, and the temperature threshold is a difference between the maximum tolerance temperature and a predetermined threshold. Specifically, the temperature threshold is used for radiating heat under the condition of over-temperature to the target equipment when the current temperature of the target equipment is higher than the temperature threshold.
In another specific embodiment of the present application, the predetermined threshold may be 20 ℃, that is, the temperature threshold is a difference between the maximum tolerance temperature and 20 ℃.
The device in the application is a device on a server, and the target device is a device that receives device information and/or location information.
In the practical application process, when the target devices of the same type but different types are mixed, for example, a plurality of NVME hard disks of different types are mixed. Because the NVME hard disks of different capacities or different manufacturers have different frequency reducing temperatures or heating speeds, the set point points (temperature thresholds) and the maximum tolerance temperatures corresponding to the NVME hard disks of different capacities or different manufacturers are also different. In order to prevent the mixed insertion of the NVME hard disks from overtemperature or alarm, when the NVME hard disks are subjected to heat dissipation, the smallest one of the set point points in the NVME hard disks with different types is selected as a target set point for starting to cool down, and the largest one of the NVME hard disks with different signals is taken as a target maximum tolerance temperature. If there are any points for which the target SetPoint point and/or the target maximum withstand temperature is not determined, a default SetPoint point is used. When the NVME hard disk is mixed, the current temperature is greater than the target SetPoint point, and then the NVME hard disk is further cooled.
It should be noted that each of the above units or modules may be implemented by software or hardware, and for the latter, may be implemented by, but not limited to: the units or modules are all located in the same processor; alternatively, each of the units or modules described above may be located in a different processor in any combination.
Embodiments of the present application also provide a computer readable storage medium having a computer program stored therein, wherein the computer program is configured to perform the steps of any of the method embodiments described above when run.
In one exemplary embodiment, the computer readable storage medium may include, but is not limited to: a usb disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a removable hard disk, a magnetic disk, or an optical disk, or other various media capable of storing a computer program.
Embodiments of the present application also provide an electronic device comprising a memory having stored therein a computer program and a processor arranged to run the computer program to perform the steps of any of the method embodiments described above.
The embodiment of the application also provides a server, which comprises the baseboard management controller and the equipment. Wherein, the substrate management controller includes a heat dissipation device of a server, for implementing any one of the heat dissipation methods of the server; the device is communicatively coupled to the baseboard management controller.
The server comprises a baseboard management controller and equipment. Wherein, the substrate management controller includes a heat dissipation device of a server, for implementing any one of the heat dissipation methods of the server; the device is communicatively coupled to the baseboard management controller. In the above heat dissipation method, before the target device does not report the overtemperature warning, that is, under the condition that the power-on detection of the server passes, the initial heat dissipation parameter of the target device is updated to the determined target heat dissipation parameter, then the target rotation speed of the corresponding heat dissipation device is determined based on the target heat dissipation parameter of the target device and the heat dissipation strategy, and the target device is controlled to operate according to the target rotation speed so as to dissipate heat of the server, so that after the power-on detection of the server passes, the corresponding heat dissipation device of the target device can operate at a reasonable target rotation speed, instead of determining the target rotation speed of the heat dissipation device after the target device reports the overtemperature warning, thereby ensuring that the determined target rotation speed of the heat dissipation device is stable and does not generate large fluctuation, and further solving the problems of large noise and poor performance of the server caused by large rotation speed fluctuation of the fan in the process of radiating the server in the related technology.
In an exemplary embodiment, the electronic device may further include a transmission device connected to the processor, and an input/output device connected to the processor.
Specific examples in this embodiment may refer to the examples described in the foregoing embodiments and the exemplary implementation, and this embodiment is not described herein.
It will be appreciated by those skilled in the art that the modules or steps of the application described above may be implemented in a general purpose computing device, they may be concentrated on a single computing device, or distributed across a network of computing devices, they may be implemented in program code executable by computing devices, so that they may be stored in a storage device for execution by computing devices, and in some cases, the steps shown or described may be performed in a different order than that shown or described herein, or they may be separately fabricated into individual integrated circuit modules, or multiple modules or steps of them may be fabricated into a single integrated circuit module. Thus, the present application is not limited to any specific combination of hardware and software.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the principles of the present application should be included in the protection scope of the present application.
Claims (10)
1. A method for dissipating heat of a server, comprising:
determining a target heat dissipation parameter of target equipment based on the received equipment information of the target equipment under the condition that the power-on detection of the server passes, wherein the target heat dissipation parameter comprises a relevant parameter of a heat dissipation strategy of the target equipment and a relevant parameter of the temperature of the target equipment, and the target equipment is equipment of the server;
updating the initial heat dissipation parameters of the target equipment into the corresponding target heat dissipation parameters;
and determining a target rotating speed of the corresponding heat dissipation device based on the target heat dissipation parameter of the target device and the heat dissipation strategy, and controlling the heat dissipation device corresponding to the target device to dissipate heat based on the target rotating speed.
2. The heat dissipation method of claim 1, wherein determining a target rotational speed of a corresponding heat dissipation device based on the target heat dissipation parameter of the target device and the heat dissipation policy comprises:
Determining the maximum value of the current temperature information of a plurality of target devices in a target device group to obtain maximum temperature information, wherein the target device group comprises a plurality of target devices with the same type information;
and determining the target rotating speed of the heat dissipation device corresponding to each target device in the target device group based on the maximum temperature information, the target heat dissipation parameter and the heat dissipation strategy.
3. The method of claim 2, wherein, in the case where the heat dissipation policy of the target device includes a PID heat dissipation policy and an interval-matched heat dissipation policy, and the target heat dissipation parameter includes a PID parameter and a temperature interval corresponding to the interval-matched heat dissipation policy,
determining the target rotation speed of the heat dissipation device corresponding to each target device in the target device group based on the maximum temperature information, the target heat dissipation parameter and the heat dissipation policy, including:
determining a first target rotating speed of the corresponding heat dissipation equipment based on the maximum temperature information, the PID parameters and the PID heat dissipation strategy;
determining the temperature interval matched with the maximum temperature information to obtain a target temperature interval, and determining the rotating speed of the heat radiation equipment corresponding to the target temperature interval as a second target rotating speed;
And determining the maximum value of the first target rotating speed and the second target rotating speed as the target rotating speed of the heat dissipation device corresponding to each target device in the target device group.
4. The heat dissipation method according to claim 1, wherein determining the target heat dissipation parameter of the target device based on the received device information of the target device comprises:
and searching the target heat dissipation parameters of the target equipment from a heat dissipation parameter table based on the received equipment information and position information of the target equipment, wherein the heat dissipation parameter table is a table formed by equipment information of the equipment, the heat dissipation strategy, the target heat dissipation parameters and corresponding information of the heat dissipation equipment, the position information is used for representing the position information of the equipment in a case of the server, and the target equipment is one or more of a plurality of pieces of equipment.
5. The heat dissipation method of claim 1, wherein after power-up of the server and before power-up detection of the server passes, the heat dissipation method further comprises:
determining an initial rotating speed of the heat dissipation device corresponding to the target device based on the current temperature information of the air inlet of the target device and a corresponding target temperature curve, wherein the target temperature curve is a curve formed by the current temperature information of the air inlet of the target device and the initial rotating speed of the heat dissipation device;
And controlling the heat dissipation equipment corresponding to the target equipment, and performing heat dissipation based on the initial rotating speed.
6. The heat dissipation method according to claim 5, wherein, in a case where the target device is a GPU device, after controlling the heat dissipation device corresponding to the target device to dissipate heat based on the initial rotation speed, before determining a target rotation speed of the corresponding heat dissipation device based on the target heat dissipation parameter of the target device and the heat dissipation policy, the heat dissipation method further comprises:
determining a basic rotating speed of the heat dissipation device corresponding to the GPU device based on the current temperature information of the air inlet of the GPU device and a corresponding GPU temperature curve, wherein the GPU temperature curve is a curve formed by the current temperature information of the air inlet of the GPU device and the basic rotating speed of the heat dissipation device;
and controlling the heat dissipation equipment corresponding to the GPU equipment, and performing heat dissipation based on the basic rotating speed.
7. The heat dissipation method according to any one of claims 1 to 6, wherein the device includes CPU, GPU, RAID, NIC, NVME and SSD, the PID parameters include a proportional parameter, an integral parameter, and a derivative parameter, the heat dissipation device is a fan, and the relevant parameters of the temperature of the target device include a maximum withstand temperature of the target device and a temperature threshold value, which is a difference between the maximum withstand temperature and a predetermined threshold value.
8. A heat sink for a server, comprising:
a first determining unit, configured to determine, based on the received device information of the target device, a target heat dissipation parameter of the target device, where the target heat dissipation parameter includes a parameter related to a heat dissipation policy of the target device and a parameter related to a temperature of the target device, and the target device is a device of the server, where the power-on detection of the server passes;
the updating unit is used for updating the initial heat dissipation parameters of the target equipment into the corresponding target heat dissipation parameters;
the first control unit is used for determining a target rotating speed of the corresponding heat dissipation device based on the target heat dissipation parameter of the target device and the heat dissipation strategy, and controlling the heat dissipation device corresponding to the target device to dissipate heat based on the target rotating speed.
9. A computer readable storage medium, characterized in that a computer program is stored in the computer readable storage medium, wherein the computer program, when being executed by a processor, implements the steps of the method according to any of the claims 1 to 7.
10. A server, comprising:
A baseboard management controller comprising a heat sink of a server for implementing the steps of the method of any one of claims 1 to 7;
and the equipment is in communication connection with the baseboard management controller.
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| CN202310436346.5A CN116483184A (en) | 2023-04-21 | 2023-04-21 | Heat dissipation method and device of server and server |
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| CN202310436346.5A CN116483184A (en) | 2023-04-21 | 2023-04-21 | Heat dissipation method and device of server and server |
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