CN116479413A - Chemical nickel plating process and device for obtaining soft chain layer - Google Patents
Chemical nickel plating process and device for obtaining soft chain layer Download PDFInfo
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- CN116479413A CN116479413A CN202310539249.9A CN202310539249A CN116479413A CN 116479413 A CN116479413 A CN 116479413A CN 202310539249 A CN202310539249 A CN 202310539249A CN 116479413 A CN116479413 A CN 116479413A
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- nickel plating
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 248
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 124
- 238000007747 plating Methods 0.000 title claims abstract description 122
- 239000000126 substance Substances 0.000 title claims abstract description 77
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract description 421
- 238000011282 treatment Methods 0.000 claims abstract description 157
- 239000002699 waste material Substances 0.000 claims abstract description 124
- 239000003814 drug Substances 0.000 claims abstract description 69
- 229940079593 drug Drugs 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 105
- 239000002351 wastewater Substances 0.000 claims description 25
- 238000011084 recovery Methods 0.000 claims description 20
- 238000001035 drying Methods 0.000 claims description 14
- 238000005406 washing Methods 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 13
- 238000004140 cleaning Methods 0.000 claims description 11
- 238000007664 blowing Methods 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 10
- 238000002203 pretreatment Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000009826 distribution Methods 0.000 claims description 6
- 239000002243 precursor Substances 0.000 claims description 4
- 238000003860 storage Methods 0.000 claims description 3
- 208000028659 discharge Diseases 0.000 description 86
- 238000011010 flushing procedure Methods 0.000 description 6
- 238000005238 degreasing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000002791 soaking Methods 0.000 description 5
- 230000004913 activation Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 230000003213 activating effect Effects 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1632—Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
Abstract
The invention discloses an electroless nickel plating process for obtaining a soft chain layer, which comprises the following steps: preparing a chemical treatment solution; processing the flexible circuit board before nickel plating; plating nickel on the surface of the flexible circuit board; taking out the flexible circuit board after nickel plating is completed; a nickel plating apparatus includes: the treatment box is provided with a treatment groove and a plurality of liquid medicine tanks, and the flexible circuit board is arranged in the treatment groove; a liquid inlet pipeline assembly connected with the treatment tank and the liquid medicine tank so as to sequentially convey chemical liquid medicines in the liquid medicine tanks into the treatment tank; and the liquid discharge pipeline assembly is connected with the bottom of the treatment tank so as to discharge the waste liquid in the treatment tank. The invention utilizes the matching of the liquid inlet pipeline component and the liquid outlet pipeline component to gradually carry out chemical treatment and chemical nickel plating on the flexible circuit board in the treatment tank for multiple times, and the liquid inlet pipeline component, the liquid outlet pipeline component and the treatment tank are cleaned before and after each chemical treatment, thereby realizing the chemical nickel plating without transportation and mutual interference.
Description
Technical Field
The invention relates to the technical field of flexible circuit board manufacturing, in particular to a chemical nickel plating process and a chemical nickel plating device for obtaining a flexible chain layer.
Background
Electroless nickel plating is to plate a nickel layer on the surface of a flexible circuit board by adopting a chemical reaction mode, and the electroless nickel plating generally needs to perform preliminary treatment on the flexible circuit board and then nickel plating.
The device used in the existing chemical nickel plating process has a multi-chemical-tank combined structure, namely a plurality of treatment tanks and washing tanks are arranged, different chemical treatment liquid medicines are stored in each treatment tank, flexible circuit boards are required to be soaked in the corresponding treatment tanks in sequence for treatment, each flexible circuit board is required to be taken out and moved to the washing tank for washing after the treatment in the treatment tank is completed, and then is transferred to the treatment tank of the next step or is transferred to the treatment tank of the next step after being dried, so that the device of the existing chemical nickel plating process cannot be mutually noninterfered in one treatment tank to finish various chemical treatments and nickel plating.
Disclosure of Invention
The invention aims to provide an electroless nickel plating process and device for obtaining a soft chain layer, which are used for solving the technical problem that electroless nickel plating in the prior art cannot be used for completing various chemical treatments and plating nickel in a treatment tank without mutual interference.
In order to solve the technical problems, the invention specifically provides the following technical scheme:
an electroless nickel plating process for obtaining a soft chain layer comprises the following steps:
A. preparing a chemical treatment solution; proportioning a plurality of precursor processing solutions and nickel plating solutions, and placing the proportioned precursor processing solutions and nickel plating solutions into a nickel plating device for storage;
B. processing the flexible circuit board before nickel plating; the flexible circuit board is arranged in a nickel plating device, a plurality of preamble treatment solutions are sequentially conveyed into the nickel plating device according to the treatment sequence for chemical treatment for a plurality of times, and used waste liquid is discharged after each treatment;
C. plating nickel on the surface of the flexible circuit board; after the pretreatment is finished, evacuating waste liquid generated by the pretreatment in the nickel plating device, then introducing pure water into the nickel plating device for cleaning and evacuating again, and then conveying a nickel plating solution into the nickel plating device, so that the flexible circuit board after the pretreatment reacts with the nickel plating solution to obtain a flexible chain layer for chemical plating of soft nickel;
D. taking out the flexible circuit board after nickel plating is completed; and after chemical nickel plating is finished, discharging waste liquid in the nickel plating device, conveying pure water into the nickel plating device, keeping water drainage, cleaning the nickel-plated flexible circuit board by flowing water, discharging excessive water after cleaning, drying and taking out.
A nickel plating device applied to the chemical nickel plating process comprises:
the treatment box is provided with a treatment groove and a plurality of liquid medicine tanks, and the flexible circuit board is arranged in the treatment groove;
a liquid inlet pipeline assembly connected with the treatment tank and the liquid medicine tank so as to sequentially convey chemical liquid medicines in the liquid medicine tanks into the treatment tank;
a liquid discharge pipeline assembly connected to the bottom of the treatment tank to discharge the waste liquid in the treatment tank;
the liquid inlet pipeline component is matched with the liquid discharge management component to sequentially discharge a plurality of preamble treatment solutions and nickel plating solutions in the liquid medicine tanks into the treatment box according to the treatment sequence, and then sequentially discharge waste liquid generated after the treatment of the preamble treatment solutions and the nickel plating solutions into the treatment box, so that the flexible circuit board is subjected to chemical nickel plating without transfer and mutual interference among treatment steps in the treatment box.
As a preferable scheme of the invention, the liquid inlet pipeline component comprises a main liquid inlet pipe and a plurality of branch liquid inlet pipes connected with the main liquid inlet pipe, each branch liquid inlet pipe is provided with a liquid inlet three-way valve, and the other two ends of each liquid inlet three-way valve are respectively provided with a liquid medicine pipe and a pure water branch pipe;
a main water inlet valve is arranged on the main liquid inlet pipe, a main pure water pipe is arranged at the other end of the main water inlet valve, and a plurality of pure water branch pipes are connected to the main pure water pipe;
wherein each liquid inlet three-way valve controls the conduction state of the corresponding liquid medicine pipe, the pure water branch pipe and the branch liquid inlet pipe so as to control chemical liquid medicine or pure water to enter the treatment tank along the branch liquid inlet pipe and the main liquid inlet pipe;
the main water inlet valve controls the conduction state of the main pure water pipe and the main liquid inlet pipe so as to control pure water to enter the treatment tank along the main liquid inlet pipe.
As a preferred scheme of the invention, the liquid inlet pipeline component comprises a main liquid inlet pipe and a plurality of branch liquid inlet pipes connected with the main liquid inlet pipe, each branch liquid inlet pipe is provided with a liquid inlet through valve, and the other end of each liquid inlet through valve is provided with a liquid medicine pipe;
a main water inlet valve is arranged on the main liquid inlet pipe, and the other end of the main water inlet valve is provided with a main pure water pipe;
each liquid inlet straight-through valve controls the conduction state of the corresponding liquid medicine pipe and the branch liquid inlet pipe so as to control chemical liquid medicine to enter the treatment tank along the branch liquid inlet pipe and the main liquid inlet pipe;
the main water inlet valve controls the conduction state of the main pure water pipe and the main liquid inlet pipe so as to control pure water to enter the treatment tank along the main liquid inlet pipe.
As a preferable scheme of the invention, the liquid discharge pipeline assembly comprises a main liquid discharge pipe, a waste discharge main valve is arranged on the main liquid discharge pipe, and a waste discharge main pipe is arranged at the other end of the waste discharge main valve;
wherein, the waste liquid in the treatment tank is discharged along the main liquid discharge pipe and the waste discharge main pipe.
As a preferable scheme of the invention, the liquid discharge pipeline assembly comprises a main liquid discharge pipe, a plurality of branch liquid discharge pipes are arranged on the main liquid discharge pipe, liquid discharge through valves are arranged on the branch liquid discharge pipes, and a recovery pipe is arranged at the other end of each liquid discharge through valve;
a waste discharge main valve is arranged on the main liquid discharge pipe, and the other end of the waste discharge main valve is provided with a waste discharge main pipe;
wherein, waste liquid of various preamble treatment solutions and nickel plating solution in the treatment tank are discharged by the main liquid discharge pipe and the branch liquid discharge pipes in a classified way by matching with a plurality of liquid discharge straight-through valves;
wherein, the waste water that the washing in the treatment tank produced is through main fluid-discharge tube with the main exhaust pipe discharges.
As a preferred scheme of the invention, the liquid discharge pipeline assembly comprises a main liquid discharge pipe, a plurality of branch liquid discharge pipes are arranged on the main liquid discharge pipe, a liquid discharge three-way valve is arranged on each branch liquid discharge pipe, and the other two ends of each liquid discharge three-way valve are respectively provided with a recovery pipe and a waste discharge branch pipe;
a main waste discharge valve is arranged on the main liquid discharge pipe, a main waste discharge pipe is arranged at the other end of the main waste discharge valve, and a plurality of waste discharge branch pipes are connected to the main waste discharge pipe;
wherein, the waste liquid of various preamble treatment solutions and nickel plating solution in the treatment tank are discharged along a plurality of recovery pipes through the main liquid discharge pipe and a plurality of branch liquid discharge pipes matched with a plurality of liquid discharge three-way valves;
the waste water generated by the water washing in the treatment tank is discharged through the main liquid discharge pipe and the waste discharge main pipe, or is discharged along a plurality of waste discharge branch pipes and the waste discharge main pipe by matching a plurality of liquid discharge three-way valves through the main liquid discharge pipe and a plurality of branch liquid discharge pipes.
As a preferable scheme of the invention, the treatment box is provided with a lifting bearing component, and the lifting bearing component is provided with a drying component;
the lifting bearing assembly is used for fixing the flexible circuit board, so that the flexible circuit board is placed in the processing tank during processing or is moved out of the processing tank during processing liquid medicine replacement;
wherein, the stoving subassembly is when flexible circuit board shifts out the processing groove, dries it.
As a preferable scheme of the invention, the lifting bearing assembly comprises a plurality of hydraulic telescopic rods embedded in the treatment box and a plurality of sealing covers arranged on the hydraulic telescopic rods, wherein the sealing covers are arranged on the notch of the treatment groove, a plurality of hanging rods distributed in a ring shape are arranged at the bottom of the sealing covers, and a plurality of arc clamping plates are arranged on the centrifugal side of each hanging rod at equal intervals;
the flexible circuit board is fixed in a surrounding mode through the arc clamping plates on the hanging rods, and the flexible circuit board is hung in the processing groove through the arc clamping plates on the hanging rods.
As a preferable scheme of the invention, the drying component comprises a large annular air blower and a small annular air blower which are arranged at the bottom of the sealing cover, wherein the diameter of the large annular air blower is larger than the annular distribution diameter of a plurality of hanging rods, and the diameter of the small annular air blower is smaller than the annular distribution diameter of the hanging rods;
the large annular blowing cylinder and the small annular blowing cylinder are of hollow structures, and a plurality of heating holes are formed in the inner wall of the large annular blowing cylinder and the outer wall of the small annular blowing cylinder, so that a plurality of flexible circuit boards on the hanging rods are dried when moving out of the processing groove.
Compared with the prior art, the invention has the following beneficial effects:
the invention utilizes the matching of the liquid inlet pipeline component and the liquid outlet pipeline component to gradually carry out chemical treatment and chemical nickel plating on the flexible circuit board in the treatment tank for multiple times, and the liquid inlet pipeline component, the liquid outlet pipeline component and the treatment tank are cleaned before and after each chemical treatment, thereby realizing the chemical nickel plating without transportation and mutual interference.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It will be apparent to those of ordinary skill in the art that the drawings in the following description are exemplary only and that other implementations can be obtained from the extensions of the drawings provided without inventive effort.
FIG. 1 is a schematic view of a nickel plating apparatus according to an embodiment of the present invention
FIG. 2 is a schematic view of a portion of a liquid inlet pipe assembly of a nickel plating apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic view of a part of a liquid inlet pipeline assembly of a nickel plating apparatus according to a second embodiment of the present invention;
FIG. 4 is a schematic view of a portion of a drain line assembly of a nickel plating apparatus according to a third embodiment of the present invention;
FIG. 5 is a schematic view of a portion of a drain line assembly of a nickel plating apparatus according to a fourth embodiment of the present invention;
FIG. 6 is a schematic view of a portion of a drain line assembly of a nickel plating apparatus according to a fifth embodiment of the present invention;
FIG. 7 is a schematic view of a part of a lifting bearing assembly of a nickel plating apparatus according to an embodiment of the present invention;
fig. 8 is a schematic view of a portion of a drying assembly of a nickel plating apparatus according to an embodiment of the present invention.
Reference numerals in the drawings are respectively as follows:
1-a treatment box; 2-a liquid inlet pipeline assembly; 3-a drain line assembly; 4-lifting the bearing assembly; 5-drying the assembly;
11-a treatment tank; 12-a liquid medicine tank;
21-a main liquid inlet pipe; 22-branch liquid inlet pipe; 23-a liquid inlet three-way valve; 24-a liquid medicine tube; 25-pure water branch pipes; 26-a liquid inlet straight-through valve; 27-a main water inlet valve; 28-a main pure water pipe;
31-a main drain; 32-branch liquid discharge pipes; 33-a liquid discharge three-way valve; 34-a recovery tube; 35-a waste discharge branch pipe; 36-a liquid discharge through valve; 37-a waste discharge main valve; 38-a waste discharging main pipe;
41-a hydraulic telescopic rod; 42-sealing cover; 43-hanging rod; 44-arc-shaped clamping plates;
51-a large annular air blowing barrel; 52-small annular air blowing tube; 53-heating the holes.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention provides an electroless nickel plating process for obtaining a soft chain layer, which comprises the following steps:
A. preparing a chemical treatment solution; proportioning the various pre-treatment solutions and the nickel plating solution, and placing the proportioned various pre-treatment solutions and the nickel plating solution into a liquid medicine tank 12 of a nickel plating device for storage;
wherein the plurality of pre-treatment solutions include degreasing solutions, microetching solutions, prepreg solutions, and activation solutions;
B. processing the flexible circuit board before nickel plating; the flexible circuit board is arranged in a treatment tank 11 of the nickel plating device, a plurality of preamble treatment solutions are sequentially conveyed into the treatment tank 11 of the nickel plating device through a liquid inlet pipeline assembly 2 according to the treatment sequence for chemical treatment for a plurality of times, and used waste liquid is discharged through a liquid discharge pipeline assembly 3 after each treatment;
C. plating nickel on the surface of the flexible circuit board; after the pretreatment is finished, the waste liquid generated by the pretreatment in the treatment tank 11 of the nickel plating device is emptied through the liquid discharge pipeline assembly 3, pure water is introduced into the treatment tank 11 of the nickel plating device through the liquid inlet pipeline assembly 2 to clean and empty again, and then the nickel plating solution is conveyed into the treatment tank 11 of the nickel plating device through the liquid inlet pipeline assembly 2, so that the flexible circuit board after the pretreatment reacts with the nickel plating solution to obtain a flexible chain layer, and the chemical plating of soft nickel is performed;
the flexible chain layer is a nickel layer in columnar arrangement, and the columnar structure of the flexible chain layer can be separated from each other without cracking when the flexible circuit board is bent;
D. taking out the flexible circuit board after nickel plating is completed; and after chemical nickel plating is finished, discharging waste liquid in the nickel plating device, conveying pure water into the nickel plating device, keeping water drainage, cleaning the nickel-plated flexible circuit board by flowing water, discharging excessive water after cleaning, drying and taking out.
As shown in fig. 1, the electroless nickel plating process described above is used to provide a nickel plating apparatus comprising:
the treatment box 1 is provided with a treatment tank 11 and a plurality of liquid medicine tanks 12, and a flexible circuit board is arranged in the treatment tank 11;
a liquid inlet pipeline assembly 2 for connecting the treatment tank 11 and the liquid medicine tank 12 so as to sequentially convey chemical liquid medicine in the plurality of liquid medicine tanks 12 into the treatment tank 11;
a liquid discharge pipe assembly 3 connected to the bottom of the treatment tank 11 to discharge the waste liquid in the treatment tank 11;
wherein, the liquid inlet pipeline component 2 cooperates with the liquid discharge management component 3 to sequentially discharge a plurality of preamble processing solutions and nickel plating solutions in a plurality of liquid medicine tanks 12 into the processing box 1 according to the processing sequence, and then sequentially discharge waste liquid generated after the processing of the plurality of preamble processing solutions and the nickel plating solutions into the processing box 1, so that the flexible circuit board is subjected to chemical nickel plating without transferring and without interference between processing steps in the processing box 1.
The nickel plating device of the embodiment mainly utilizes the liquid inlet pipeline component 2 to sequentially convey a plurality of preamble processing solutions and nickel plating solutions into the processing tank 11, so that the flexible circuit board in the processing tank 11 can be sequentially processed according to the processing sequence, and the waste liquid generated after each processing in the processing tank 11 is discharged through the liquid discharge pipeline component 3, so that the flexible circuit board can finish the mutual noninterference chemical nickel plating in one processing tank 11 without transferring.
Wherein, each kind of preface treatment solution and nickel plating solution is carried to the processing tank 11 through feed liquor pipeline subassembly 2 in accomplish the chemical treatment to the flexible circuit board, and the waste liquid that the processing produced all is discharged through flowing back pipeline subassembly 3.
After the waste liquid is discharged each time, pure water is conveyed into the treatment tank 11 through the liquid inlet pipeline assembly 2 for cleaning, and the cleaned waste water is discharged through the liquid discharge pipeline assembly 3, so that the chemical liquid in the previous step does not influence the treatment effect of the chemical liquid in the subsequent step on the flexible circuit board.
Wherein each of the liquid medicine tanks 12 is provided with a cover so that the corresponding chemical liquid medicine is stored in the liquid medicine tank 12 to avoid evaporation or deterioration.
The main pure water pipe 28 of the liquid inlet pipeline assembly 2 is connected with a pure water supply pipe network between plants, so that pure water can enter the treatment tank 1 through the liquid inlet pipeline assembly 2, and after the flexible circuit board is treated each time, the flexible circuit board can be washed with water and the treatment tank 11 is washed.
The following provides two embodiments to describe in detail the delivery of pure water and chemical solutions by the inlet line assembly 2 into the processing tank 11 for processing flexible circuit boards.
Embodiment one:
as shown in fig. 2, the liquid inlet pipeline assembly 2 comprises a main liquid inlet pipe 21 and a plurality of branch liquid inlet pipes 22 connected with the main liquid inlet pipe 21, wherein each branch liquid inlet pipe 22 is provided with a liquid inlet three-way valve 23, and the other two ends of each liquid inlet three-way valve 23 are respectively provided with a liquid medicine pipe 24 and a pure water branch pipe 25;
a main water inlet valve 27 is arranged on the main liquid inlet pipe 21, a main pure water pipe 28 is arranged at the other end of the main water inlet valve 27, and a plurality of pure water branch pipes 25 are connected to the main pure water pipe 28;
wherein, each liquid inlet three-way valve 23 controls the conduction state of the corresponding liquid medicine pipe 24 and the pure water branch pipe 25 and the branch liquid inlet pipe 22 so as to control the chemical liquid medicine or pure water to enter the treatment tank 11 along the branch liquid inlet pipe 22 and the main liquid inlet pipe 21;
wherein, the water inlet main valve 27 controls the conduction state of the pure water main pipe 28 and the main liquid inlet pipe 21 so as to control pure water to enter the treatment tank 11 along the main liquid inlet pipe 21.
In this embodiment, the degreasing solution, microetching solution, pre-dip solution and activation solution of the pre-treatment solution are controlled by the liquid inlet three-way valve 23, enter the main liquid inlet pipe 21 from the liquid medicine pipe 24 and the branch liquid inlet pipe 22 in the treatment sequence, and enter the treatment tank 11 along the main liquid inlet pipe 21 to treat the flexible circuit board.
After each kind of pre-treatment solution is treated, it is discharged through the liquid discharge pipe assembly 3, and the main pure water pipe 28 conveys pure water into the main liquid inlet pipe 21 through the main water inlet valve 27, so that pure water enters the treatment tank 11 to flush the flexible circuit board and the treatment tank 11, and waste water generated by flushing is discharged through the liquid discharge pipe assembly 3.
Before each pre-treatment solution is treated, each liquid inlet three-way valve 23 controls the pure water branch pipe 25 to be communicated with the branch liquid inlet pipe 22, and seals the liquid medicine pipe 24 and the branch liquid inlet pipe 22, so that pure water passes through the branch liquid inlet pipe 22, and other liquid medicines remained in the branch liquid inlet pipe 22 are flushed into the main liquid inlet pipe 21.
The pure water in the pure water main pipe 28 is introduced into the main liquid inlet pipe 21 through the water inlet main valve 27, and the residual liquid medicine in the main liquid inlet pipe 21 is flushed into the treatment tank 11 and discharged through the liquid discharge pipeline assembly 3, so that the influence on the treatment of the flexible circuit board after mixing is avoided.
After the branch liquid inlet pipe 22 is flushed, the other liquid inlet three-way valves 23 control the pure water branch pipe 25 and the liquid medicine pipe 24 not to be communicated with the branch liquid inlet pipe 22, and only the liquid inlet three-way valve 23 for carrying out the current step is left to control the liquid medicine pipe 24 to be communicated with the branch liquid inlet pipe 22 and convey chemical liquid medicine.
The other liquid medicine remaining in one of the branch liquid inlet pipes 22 is the chemical liquid medicine entering the main liquid inlet pipe 21 from the branch liquid inlet pipe 22 of the previous step, that is, since the plurality of branch liquid inlet pipes 22 are mutually communicated through the main liquid inlet pipe 21, the liquid medicine conveyed in one of the branch liquid inlet pipes 22 is easy to remain in the other branch liquid inlet pipes 22.
Embodiment two:
as shown in fig. 3, the liquid inlet pipeline assembly 2 comprises a main liquid inlet pipe 21 and a plurality of branch liquid inlet pipes 22 connected with the main liquid inlet pipe 21, wherein each branch liquid inlet pipe 22 is provided with a liquid inlet through valve 26, and the other end of each liquid inlet through valve 26 is provided with a liquid medicine pipe 24;
a main water inlet valve 27 is arranged on the main liquid inlet pipe 21, and a main pure water pipe 28 is arranged at the other end of the main water inlet valve 27;
wherein, each liquid inlet straight-through valve 26 controls the conduction state of the corresponding liquid medicine pipe 24 and the branch liquid inlet pipe 22 so as to control the chemical liquid medicine to enter the treatment tank 11 along the branch liquid inlet pipe 22 and the main liquid inlet pipe 21;
wherein, the water inlet main valve 27 controls the conduction state of the pure water main pipe 28 and the main liquid inlet pipe 21 so as to control pure water to enter the treatment tank 11 along the main liquid inlet pipe 21.
In this embodiment, the degreasing solution, microetching solution, pre-dip solution and activation solution of the pre-treatment solution are controlled by the feed-through valve 26, enter the main feed-through pipe 21 from the liquid medicine pipe 24 and the branch feed-through pipe 22 in the treatment order, and enter the treatment tank 11 along the main feed-through pipe 21 to treat the flexible circuit board.
After each kind of pre-treatment solution is treated, it is discharged through the liquid discharge pipe assembly 3, and the main pure water pipe 28 conveys pure water into the main liquid inlet pipe 21 through the main water inlet valve 27, so that pure water enters the treatment tank 11 to flush the flexible circuit board and the treatment tank 11, and waste water generated by flushing is discharged through the liquid discharge pipe assembly 3.
Pure water enters the main liquid inlet pipe 21 from the pure water main pipe 28, and washes the main liquid inlet pipe 21, so that chemical liquid conveyed in the subsequent step is prevented from reacting with liquid remained in the main liquid inlet pipe 21, namely, the influence on the treatment effect of the flexible circuit board is avoided.
Compared with the two:
in the first embodiment, the liquid inlet three-way valve 23 is adopted to control the conveying state of pure water and chemical liquid medicine, and the main water inlet valve 27 and the main pure water pipe 28 are matched to convey pure water for flushing the treatment tank 11, the main liquid inlet pipe 21 and the branch liquid inlet pipe 22 before conveying the liquid medicine, and the treatment tank 11, the main liquid inlet pipe 21 and the branch liquid inlet pipe 22 are flushed again after conveying medicine, so that when the flexible circuit board is treated in a non-transferring way, the chemical liquid medicine treated in the last step is prevented from being remained in the treatment tank 11, the main liquid inlet pipe 21 and the branch liquid inlet pipe 22, thereby avoiding influencing the treatment effect on the flexible circuit board, and being suitable for the nickel plating of the flexible circuit board with high precision and high quality.
In the second embodiment, the liquid feed through valve 26 is adopted to control the chemical liquid delivery state, and the water inlet main valve 27 is adopted to control the pure water delivery state, so that the treatment tank 11 and the main liquid feed pipe 21 are flushed after the liquid is delivered, the residual liquid content in the previous step is effectively reduced, the effect on the treatment of the flexible circuit board is less, the structure is simple, the control is more convenient, and the method is suitable for the nickel plating treatment of the flexible circuit board with low precision requirements and low quality requirements.
Three examples are provided below to explain the discharge treatment of the waste chemical liquid and the cleaning wastewater by the drain line assembly 3 in detail.
Embodiment III:
as shown in fig. 4, the drain line assembly 3 includes a main drain pipe 31, a main waste drain valve 37 is provided on the main drain pipe 31, and a main waste drain pipe 38 is provided at the other end of the main waste drain valve 37;
wherein the waste liquid in the treatment tank 11 is discharged along the main liquid discharge pipe 31 and the main waste discharge pipe 38.
In this embodiment, by controlling the main waste discharge valve 37, the waste liquid generated by processing the flexible circuit board and the waste water generated by cleaning are discharged through the main liquid discharge pipe 31 and the main waste discharge pipe 38, so that the structure is simple, the use is convenient, but the direct mixing discharge pollution is large, and the waste is more.
Embodiment four:
as shown in fig. 5, the drain line assembly 3 includes a main drain pipe 31, a plurality of branch drain pipes 32 are provided on the main drain pipe 31, drain through valves 36 are provided on each branch drain pipe 32, and a recovery pipe 34 is provided on the other end of each drain through valve 36;
a waste discharge main valve 37 is arranged on the main liquid discharge pipe 31, and a waste discharge main pipe 38 is arranged at the other end of the waste discharge main valve 37;
wherein, waste liquid of various preamble treatment solutions and nickel plating solution in the treatment tank 11 are discharged by classification through the main liquid discharge pipe 31 and the plurality of branch liquid discharge pipes 32 in cooperation with the plurality of liquid discharge straight-through valves 36;
the wastewater generated by the washing in the treatment tank 11 is discharged through the main drain pipe 31 and the main waste drain pipe 38.
In this embodiment, the waste liquid generated by the flexible circuit board is discharged through the branch liquid discharge pipe 32 and the recovery pipe 34 by controlling the waste discharge main valve 37 and the liquid discharge through valve 36 so that the waste discharge main valve 37 is closed and the liquid discharge through valve 36 matched with the chemical used in the treatment in this step is opened.
The degreasing solution, the microetching solution, the pre-dip solution and the activating solution correspond to one liquid discharge through valve 36 and the recovery pipe 34 respectively, and the corresponding liquid discharge through valve 36 controls the corresponding recovery pipe 34 to be communicated with the branch liquid discharge pipe 32 to recover the corresponding chemical liquid, so that the chemical liquid can be reused after the concentration is regulated.
When the liquid inlet pipeline assembly 2 in the first embodiment or the second embodiment is used for washing, the liquid outlet straight-through valves 6 are all closed, the waste water discharge main valve 37 is opened, so that waste water generated by washing is discharged along the main liquid outlet pipe 31 and the waste water discharge main pipe 38, and separation and discharge of waste water and waste liquid are realized.
Fifth embodiment:
as shown in fig. 6, the drain line assembly 3 includes a main drain pipe 31, a plurality of branch drain pipes 32 are provided on the main drain pipe 31, a drain three-way valve 33 is provided on each branch drain pipe 32, and recovery pipes 34 and waste discharge branch pipes 35 are respectively provided at the other two ends of each drain three-way valve 33;
a main waste discharge valve 37 is arranged on the main liquid discharge pipe 31, a main waste discharge pipe 38 is arranged at the other end of the main waste discharge valve 37, and a plurality of waste discharge branch pipes 35 are connected to the main waste discharge pipe 38;
wherein, the waste liquid of various pre-treatment solutions and the nickel plating solution in the treatment tank 11 are discharged along a plurality of recovery pipes 34 through a main liquid discharge pipe 31 and a plurality of branch liquid discharge pipes 32 in combination with a plurality of liquid discharge three-way valves 33;
the waste water generated by the washing in the treatment tank 11 is discharged through the main drain pipe 31 and the main drain pipe 38, or is discharged along the plurality of branch drain pipes 35 and the main drain pipe 38 by the main drain pipe 31 and the plurality of branch drain pipes 32 in combination with the plurality of three-way drain valves 33.
In this embodiment, by controlling the waste discharge main valve 37 and the three-way valve 33, the waste discharge main valve 37 is closed and the three-way valve 33 matched with the chemical used in the treatment of this step is connected to the recovery pipe 34 and the branch liquid discharge pipe 32, so that the waste liquid generated in the treatment of the flexible circuit board is discharged through the branch liquid discharge pipe 32 and the recovery pipe 34.
The degreasing solution, the microetching solution, the pre-soaking solution and the activating solution correspond to one liquid discharge three-way valve 33 and the recovery pipe 34 respectively, and the corresponding liquid discharge three-way valve 33 controls the corresponding recovery pipe 34 to be communicated with the branch liquid discharge pipe 32 to recover the corresponding chemical liquid, so that the chemical liquid can be reused after the concentration is regulated.
In the liquid inlet pipeline assembly 2 in the first embodiment or the second embodiment, the plurality of liquid outlet three-way valves 33 control the branch liquid outlet pipe 32 to be communicated with the waste outlet branch pipe 35, and the waste outlet main valve 37 is opened, so that waste water generated by water washing is discharged along the main liquid outlet pipe 31 and the waste outlet main pipe 38, and part of waste water is discharged into the waste outlet main pipe 38 along the branch liquid outlet pipe 32 and the waste outlet branch pipe 35, thereby realizing separation and discharge of waste water and waste liquid.
Since the residual chemical liquid in the branch liquid discharge pipe 32 is discharged from the waste discharge branch pipe 35 by the flushing water, the residual chemical liquid in the branch liquid discharge pipe 32 is not caused, and the waste liquid of the subsequent processing step and the waste liquid of the preceding step are not caused to be mixed when the waste liquid is recovered, i.e., the recovered waste liquid is not affected.
The three are compared with each other:
in the third embodiment, the waste water and the waste liquid are all discharged from the main waste discharging pipe 38 through the main waste discharging valve 37 and the main liquid discharging pipe 31, the structure is simple, the control is convenient, but the corrosiveness of the mixed discharge of the high-concentration waste liquid is stronger, the pollution discharge treatment is difficult, and the raw materials are wasted.
In the fourth embodiment, different waste liquids and waste water are separately discharged through the branch liquid discharge pipe 32 and the liquid discharge through valve 36 in combination with the waste discharge main valve 37, and the waste liquid is recovered through the recovery pipe 34, and the waste water is discharged through the waste discharge main pipe 38, so that the concentration is low, the treatment is easier, and the waste liquid can be recovered and reused, thereby being more environment-friendly.
In the fifth embodiment, different waste liquids and waste water are separately discharged through the branch liquid discharge pipe 32 and the liquid discharge three-way valve 33 in combination with the waste discharge main valve 37, and the waste liquid is recovered through the recovery pipe 34, and the waste water is discharged through the waste discharge main pipe 38, so that the concentration is low, the treatment is easier, the waste liquid can be recovered and reused, the environment is more protected, and furthermore, the branch liquid discharge pipe 32 is flushed after recovering the waste liquid every time, so that the recovered waste liquid can not be polluted, and the recovery quality is higher.
Further, the liquid inlet pipeline assembly 2 in the first embodiment and the liquid outlet pipeline assembly 3 in the fifth embodiment are combined, so that the liquid medicine in the current step is not mixed with the residual liquid of the liquid medicine in the rest steps before and after the liquid medicine is conveyed each time, the waste liquid and the waste water can be separated and discharged each time the waste liquid is discharged and washed, and the waste liquid generated in the current step is not mixed with the residual liquid of the waste liquid generated in the rest steps, thereby realizing high-precision and high-quality chemical treatment nickel plating of the flexible circuit board.
And the liquid medicine conveyed in each step is only mixed with the pure water remained after flushing in the liquid inlet pipeline assembly 2, the substances of the liquid medicine cannot be influenced, only slight influence is generated on the concentration, and the influence can be eliminated by adding the time for soaking the flexible circuit board in a negligible way or by adopting the way.
The recovered waste liquid in each step is only mixed with pure water remaining after flushing in the liquid discharge pipeline assembly 3, the substances of the waste liquid are not affected, only the slight effect on the concentration is generated, the concentration can be neglected, and the concentration can be prepared again during recycling.
In order to realize that the flexible circuit board is not transported to finish chemical nickel plating in the processing box 1, the flexible circuit board processed in the previous step needs to be washed and dried when the chemical liquid is conveyed in the next step, so that the chemical liquid in the current step remained on the flexible circuit board is prevented from influencing the chemical liquid in the next step. The following preferred scheme is provided:
as shown in fig. 7, a lifting bearing component 4 is arranged on the treatment box 1, and a drying component 5 is arranged on the lifting bearing component 4;
the lifting bearing assembly 4 is used for fixing the flexible circuit board, so that the flexible circuit board is placed in the treatment tank 11 during treatment or is moved out of the treatment tank 11 during treatment liquid medicine replacement;
wherein the drying assembly 5 dries the flexible circuit board as it moves out of the processing tank 11.
When the flexible circuit board is processed, the lifting bearing assembly 4 fixes the flexible circuit board and then puts the flexible circuit board into the processing tank 11 for soaking, and after the soaking processing is finished, the liquid discharge pipeline assembly 3 discharges the waste liquid.
Then, the flexible circuit board is washed by the pure water conveyed by the liquid inlet pipeline assembly 2, and the waste water generated by washing is discharged by the liquid outlet pipeline assembly 3, and after washing, the flexible circuit board is lifted by the lifting bearing assembly 4 and dried by the drying assembly 5.
Meanwhile, the liquid inlet pipeline component 2 conveys the liquid medicine processed in the next step into the processing tank 11, the dried flexible circuit board is placed into the processing tank 11 by the lifting bearing component 4 for continuous processing, the flexible circuit board is subjected to non-transferring nickel plating processing, and all the processing steps are not affected.
As shown in fig. 7 and 8, the lifting bearing assembly 4 comprises a plurality of hydraulic telescopic rods 41 embedded in the processing box 1 and a sealing cover 42 arranged on the plurality of hydraulic telescopic rods 41, wherein the sealing cover 42 is arranged on the notch of the processing groove 11 in a covering manner, a plurality of hanging rods 43 distributed in a ring shape are arranged at the bottom of the sealing cover 42, and a plurality of arc clamping plates 44 are arranged on the centrifugal side of each hanging rod 43 at equal intervals;
the flexible circuit board is fixed around by the arc-shaped clamping plates 44 on the hanging rods 43, and the flexible circuit board is hung in the processing groove 11 by the arc-shaped clamping plates 44 on the hanging rods 43.
The flexible circuit board has a bendable property, and then the flexible circuit board can be wound around the plurality of hanging bars 43 and restrained and fixed by the arc-shaped clamping plates 44.
The seal cover 42 enables the flexible circuit board to be in a relatively sealed environment during the soaking process, avoiding the influence of the external environment on the reaction conditions of the chemical process, such as the reaction temperature, etc.
As shown in fig. 8, the drying assembly 5 comprises a large annular air blower 51 and a small annular air blower 52 which are arranged at the bottom of the sealing cover 42, wherein the diameter of the large annular air blower 51 is larger than the annular distribution diameter of the hanging rods 43, and the diameter of the small annular air blower 52 is smaller than the annular distribution diameter of the hanging rods 43;
wherein, the big annular air blower 51 and the small annular air blower 52 are hollow structures, and a plurality of heating holes 53 are arranged on the inner wall of the big annular air blower 51 and the outer wall of the small annular air blower 52, so that the flexible circuit board is dried when moving out of the processing groove 11.
The large annular air blower 51 and the small annular air blower 52 are communicated with an external heating air pump through pipelines, namely the heating air pump pumps high-temperature air into the large annular air blower 51 and the small annular air blower 52, and the temperature is 70-80 ℃.
When the flexible circuit board is soaked, the large annular air blower cylinder 51 and the small annular air blower cylinder 52 are soaked in the treatment tank 11, and then the hot air flow generates bubbles in the chemical liquid in the treatment tank 11 through the heating holes 53, so that the chemical liquid is quickly heated, and the chemical liquid is quickly brought to the corresponding treatment temperature.
And because the air pressure in the large annular air blower cylinder 51 and the small annular air blower cylinder 52 is larger, chemical liquid medicine in the treatment tank 11 cannot enter the large annular air blower cylinder 51 and the small annular air blower cylinder 52 through the heating holes 53, so that the treatment tank can be used normally for a long time.
When the flexible circuit board is dried, the large annular air blower cylinder 51 and the small annular air blower cylinder 52 spray hot air to the surface of the flexible circuit board through the heating holes 53, so that the washed flexible circuit board is dried quickly, and chemical liquid treatment in the next step is not affected.
The above embodiments are only exemplary embodiments of the present application and are not intended to limit the present application, the scope of which is defined by the claims. Various modifications and equivalent arrangements may be made to the present application by those skilled in the art, which modifications and equivalents are also considered to be within the scope of the present application.
Claims (10)
1. An electroless nickel plating process for obtaining a soft chain layer is characterized by comprising the following steps:
A. preparing a chemical treatment solution; proportioning a plurality of precursor processing solutions and nickel plating solutions, and placing the proportioned precursor processing solutions and nickel plating solutions into a nickel plating device for storage;
B. processing the flexible circuit board before nickel plating; the flexible circuit board is arranged in a nickel plating device, a plurality of preamble treatment solutions are sequentially conveyed into the nickel plating device according to the treatment sequence for chemical treatment for a plurality of times, and used waste liquid is discharged after each treatment;
C. plating nickel on the surface of the flexible circuit board; after the pretreatment is finished, evacuating waste liquid generated by the pretreatment in the nickel plating device, then introducing pure water into the nickel plating device for cleaning and evacuating again, and then conveying a nickel plating solution into the nickel plating device, so that the flexible circuit board after the pretreatment reacts with the nickel plating solution to obtain a flexible chain layer for chemical plating of soft nickel;
D. taking out the flexible circuit board after nickel plating is completed; and after chemical nickel plating is finished, discharging waste liquid in the nickel plating device, conveying pure water into the nickel plating device, keeping water drainage, cleaning the nickel-plated flexible circuit board by flowing water, discharging excessive water after cleaning, drying and taking out.
2. A nickel plating apparatus applied to the electroless nickel plating process according to claim 1, comprising:
a processing tank (1) provided with a processing tank (11) and a plurality of liquid medicine tanks (12), wherein a flexible circuit board is arranged in the processing tank (11);
a liquid inlet pipeline assembly (2) which is connected with the treatment tank (11) and the liquid medicine tank (12) and is used for sequentially conveying chemical liquid medicines in the liquid medicine tanks (12) into the treatment tank (11);
a liquid discharge pipeline assembly (3) connected with the bottom of the treatment tank (11) so as to discharge the waste liquid in the treatment tank (11);
the liquid inlet pipeline component (2) is matched with the liquid discharge management component (3) to sequentially discharge a plurality of preamble processing solutions and nickel plating solutions in the liquid medicine tanks (12) into the processing box (1) according to the processing sequence, and then sequentially discharge waste liquid generated after the processing of the preamble processing solutions and the nickel plating solutions into the processing box (1) so that the flexible circuit board can be subjected to chemical nickel plating without transfer and mutual noninterference among processing steps in the processing box (1).
3. A nickel plating apparatus according to claim 2, wherein,
the liquid inlet pipeline assembly (2) comprises a main liquid inlet pipe (21) and a plurality of branch liquid inlet pipes (22) connected with the main liquid inlet pipe (21), each branch liquid inlet pipe (22) is provided with a liquid inlet three-way valve (23), and the other two ends of each liquid inlet three-way valve (23) are respectively provided with a liquid medicine pipe (24) and a pure water branch pipe (25);
a main water inlet valve (27) is arranged on the main liquid inlet pipe (21), a main pure water pipe (28) is arranged at the other end of the main water inlet valve (27), and a plurality of pure water branch pipes (25) are connected to the main pure water pipe (28);
wherein each liquid inlet three-way valve (23) controls the conduction state of the corresponding liquid medicine pipe (24) and the pure water branch pipe (25) and the branch liquid inlet pipe (22) so as to control chemical liquid medicine or pure water to enter the treatment tank (11) along the branch liquid inlet pipe (22) and the main liquid inlet pipe (21);
wherein, the water inlet main valve (27) controls the conduction state of the pure water main pipe (28) and the main liquid inlet pipe (21) so as to control pure water to enter the treatment tank (11) along the main liquid inlet pipe (21).
4. A nickel plating apparatus according to claim 2, wherein,
the liquid inlet pipeline assembly (2) comprises a main liquid inlet pipe (21) and a plurality of branch liquid inlet pipes (22) connected with the main liquid inlet pipe (21), liquid inlet through valves (26) are arranged on each branch liquid inlet pipe (22), and liquid medicine pipes (24) are arranged at the other ends of each liquid inlet through valve (26);
a water inlet main valve (27) is arranged on the main liquid inlet pipe (21), and a pure water main pipe (28) is arranged at the other end of the water inlet main valve (27);
wherein each liquid inlet straight-through valve (26) controls the conduction state of the corresponding liquid medicine pipe (24) and the branch liquid inlet pipe (22) so as to control chemical liquid medicine to enter the treatment tank (11) along the branch liquid inlet pipe (22) and the main liquid inlet pipe (21);
wherein, the water inlet main valve (27) controls the conduction state of the pure water main pipe (28) and the main liquid inlet pipe (21) so as to control pure water to enter the treatment tank (11) along the main liquid inlet pipe (21).
5. A nickel plating apparatus according to any of claims 2-4, wherein,
the liquid discharge pipeline assembly (3) comprises a main liquid discharge pipe (31), a waste discharge main valve (37) is arranged on the main liquid discharge pipe (31), and a waste discharge main pipe (38) is arranged at the other end of the waste discharge main valve (37);
wherein the waste liquid in the treatment tank (11) is discharged along the main liquid discharge pipe (31) and the waste discharge main pipe (38).
6. A nickel plating apparatus according to any of claims 2-4, wherein,
the liquid discharge pipeline assembly (3) comprises a main liquid discharge pipe (31), a plurality of branch liquid discharge pipes (32) are arranged on the main liquid discharge pipe (31), liquid discharge through valves (36) are arranged on the branch liquid discharge pipes (32), and recovery pipes (34) are arranged at the other ends of the liquid discharge through valves (36);
a waste discharge main valve (37) is arranged on the main liquid discharge pipe (31), and a waste discharge main pipe (38) is arranged at the other end of the waste discharge main valve (37);
wherein, waste liquid of various preamble treatment solutions in the treatment tank (11) and nickel plating solution are discharged in a classified manner by the main liquid discharge pipe (31) and the branch liquid discharge pipes (32) in cooperation with the liquid discharge straight-through valves (36);
wherein, the waste water generated by the water washing in the treatment tank (11) is discharged through the main liquid discharge pipe (31) and the waste discharge main pipe (38).
7. A nickel plating apparatus according to any of claims 2-4, wherein,
the liquid discharge pipeline assembly (3) comprises a main liquid discharge pipe (31), a plurality of branch liquid discharge pipes (32) are arranged on the main liquid discharge pipe (31), liquid discharge three-way valves (33) are arranged on each branch liquid discharge pipe (32), and recovery pipes (34) and waste discharge branch pipes (35) are respectively arranged at the other two ends of each liquid discharge three-way valve (33);
a main waste discharge valve (37) is arranged on the main liquid discharge pipe (31), a main waste discharge pipe (38) is arranged at the other end of the main waste discharge valve (37), and a plurality of waste discharge branch pipes (35) are connected to the main waste discharge pipe (38);
wherein the waste liquid of the various pre-treatment solutions in the treatment tank (11) and the nickel plating solution are discharged along the plurality of recovery pipes (34) through the main liquid discharge pipe (31) and the plurality of branch liquid discharge pipes (32) in cooperation with the plurality of liquid discharge three-way valves (33);
wherein, the waste water generated by the water washing in the treatment tank (11) is discharged through the main liquid discharge pipe (31) and the waste discharge main pipe (38), or is discharged along a plurality of waste discharge branch pipes (35) and the waste discharge main pipe (38) by matching a plurality of liquid discharge three-way valves (33) through the main liquid discharge pipe (31) and a plurality of branch liquid discharge pipes (32).
8. A nickel plating apparatus according to claim 2, wherein,
a lifting bearing assembly (4) is arranged on the processing box (1), and a drying assembly (5) is arranged on the lifting bearing assembly (4);
wherein the lifting bearing component (4) is used for fixing the flexible circuit board so that the flexible circuit board is placed in the processing groove (11) during processing or is moved out of the processing groove (11) during processing liquid medicine replacement;
wherein, the drying component (5) dries the flexible circuit board when the flexible circuit board moves out of the processing groove (11).
9. A nickel plating apparatus according to claim 8, wherein,
the lifting bearing assembly (4) comprises a plurality of hydraulic telescopic rods (41) embedded in the treatment box (1) and sealing covers (42) arranged on the plurality of hydraulic telescopic rods (41), the sealing covers (42) are arranged on the notch of the treatment groove (11) in a covering mode, a plurality of hanging rods (43) which are distributed in an annular mode are arranged at the bottom of the sealing covers (42), and a plurality of arc clamping plates (44) are arranged on the centrifugal side of each hanging rod (43) at equal intervals;
the flexible circuit board is fixed in a surrounding mode through the arc-shaped clamping plates (44) on the hanging rods (43), and the flexible circuit board is hung in the processing groove (11) through the arc-shaped clamping plates (44) on the hanging rods (43).
10. A nickel plating apparatus according to claim 9, wherein,
the drying assembly (5) comprises a large annular air blower (51) and a small annular air blower (52) which are arranged at the bottom of the sealing cover (42), the diameter of the large annular air blower (51) is larger than the annular distribution diameter of the hanging rods (43), and the diameter of the small annular air blower (52) is smaller than the annular distribution diameter of the hanging rods (43);
the large annular air blowing barrel (51) and the small annular air blowing barrel (52) are of hollow structures, and a plurality of heating holes (53) are formed in the inner wall of the large annular air blowing barrel (51) and the outer wall of the small annular air blowing barrel (52), so that a plurality of flexible circuit boards on the hanging rods (43) are dried when moving out of the processing groove (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310539249.9A CN116479413A (en) | 2023-05-15 | 2023-05-15 | Chemical nickel plating process and device for obtaining soft chain layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310539249.9A CN116479413A (en) | 2023-05-15 | 2023-05-15 | Chemical nickel plating process and device for obtaining soft chain layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116479413A true CN116479413A (en) | 2023-07-25 |
Family
ID=87223229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310539249.9A Pending CN116479413A (en) | 2023-05-15 | 2023-05-15 | Chemical nickel plating process and device for obtaining soft chain layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116479413A (en) |
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2023
- 2023-05-15 CN CN202310539249.9A patent/CN116479413A/en active Pending
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