CN116461028B - Epoxy heat conduction glue solidification processingequipment - Google Patents
Epoxy heat conduction glue solidification processingequipment Download PDFInfo
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- CN116461028B CN116461028B CN202310371866.2A CN202310371866A CN116461028B CN 116461028 B CN116461028 B CN 116461028B CN 202310371866 A CN202310371866 A CN 202310371866A CN 116461028 B CN116461028 B CN 116461028B
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- 239000004593 Epoxy Substances 0.000 title claims abstract description 46
- 239000003292 glue Substances 0.000 title claims abstract description 33
- 238000007711 solidification Methods 0.000 title abstract description 13
- 230000008023 solidification Effects 0.000 title abstract description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 47
- 238000001816 cooling Methods 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000002918 waste heat Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 238000007599 discharging Methods 0.000 claims description 26
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 4
- 230000008569 process Effects 0.000 abstract description 11
- 239000002699 waste material Substances 0.000 abstract description 4
- 230000002457 bidirectional effect Effects 0.000 description 6
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 3
- 235000017491 Bambusa tulda Nutrition 0.000 description 3
- 241001330002 Bambuseae Species 0.000 description 3
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 3
- 239000011425 bamboo Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/38—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Abstract
The application relates to the technical field of solidification of heat-conducting glue, in particular to an epoxy heat-conducting glue solidification processing device; comprises a fixing frame; the upper end face of the fixing frame is provided with a disc, the middle part of the disc is provided with a through hole, the upper end of the disc is provided with a segmented heating and solidifying mechanism, the front side of the solidifying mechanism is provided with a conveying mechanism for feeding, and the right side of the solidifying mechanism is provided with a cooling mechanism for slowly cooling by utilizing the waste heat of the solidifying mechanism; the application solves the problems that the temperature of the epoxy heat-conducting glue is constant in the high-temperature curing process of the epoxy heat-conducting glue, the epoxy heat-conducting glue is heated too fast and is easy to crack, the heat utilization rate is low in the high-temperature curing process, the resource waste is caused and the like in the high-temperature curing process of the epoxy heat-conducting glue which is poured into the current rectifier bridge.
Description
Technical Field
The application relates to the technical field of solidification of heat-conducting glue, in particular to an epoxy heat-conducting glue solidification processing device.
Background
The epoxy heat-conducting adhesive is applied to circuit board manufacture, automobile wire harness manufacture, precision connectors, other electronic products and the like; if epoxy is injected into the epoxy heat-conducting glue of the rectifier bridge, the product is sealed and can not be disassembled; when the rectifier bridge operates, the epoxy heat-conducting adhesive can effectively dissipate heat, and the influence of heat on the rectifier bridge is reduced.
The existing curing process of the epoxy heat-conducting adhesive has two types of normal-temperature curing type and high-temperature curing type, the normal-temperature curing is easy to operate, but the curing time is long, and the efficiency is influenced, so that the epoxy heat-conducting adhesive is cured by high-temperature illumination in a high-temperature curing mode, and the curing efficiency and the permeability are improved.
The current rectifier bridge is filled with the epoxy heat-conducting glue and then is cured at a high temperature, and the current rectifier bridge is cured at a high temperature, so that the temperature of the epoxy heat-conducting glue is raised too fast to enable the epoxy heat-conducting glue to be cured rapidly outside and cured slowly inside when the rectifier bridge filled with the epoxy heat-conducting glue is subjected to high-temperature illumination, and the epoxy heat-conducting glue is cracked.
2. The heat utilization rate of the existing epoxy heat-conducting adhesive in the high-temperature curing process is low, so that resource waste is caused.
Disclosure of Invention
In view of the above problems, the embodiment of the application provides an epoxy heat-conducting adhesive curing processing device, which aims to solve the technical problems that in the related art, the temperature of the existing epoxy heat-conducting adhesive is constant in the high-temperature curing process, the epoxy heat-conducting adhesive is heated too fast, cracking is easy to occur, the heat utilization rate in the high-temperature curing process is low, and resource waste is caused.
In order to achieve the above object, the embodiment of the present application provides the following technical solutions:
the embodiment of the application provides an epoxy heat-conducting adhesive curing processing device, which comprises a fixing frame; the upper end face of mount install the disc, the through-hole has been seted up at the disc middle part, the upper end of disc is provided with the solidification mechanism of segmentation heating solidification, the front side of solidification mechanism is provided with the conveying mechanism who is used for the pay-off, the right side of solidification mechanism sets up the cooling mechanism that utilizes solidification mechanism waste heat to slowly cool down.
As the preferred scheme, curing mechanism include the urceolus, the front side of urceolus is provided with the feed inlet, the right side upper portion of urceolus is provided with the discharge gate, feed inlet and discharge gate all run through to the inner tube inner chamber, and feed inlet and the discharge gate position in the urceolus outside all are provided with the unit that opens and shuts, the up end of disc is provided with the urceolus, the inside of urceolus is provided with the inner tube, the inner tube inner chamber evenly is provided with the ring piece along its axial direction, and the ring piece is connected through riser, and riser and through-hole inner wall connection No. one, the inside discharge unit that is used for discharging the rectifier bridge that is provided with of inner tube, the through-hole position of terminal surface installs the hot-blast air heater to the inner tube inside under the disc, the upper end of urceolus is provided with the heat conduction unit.
As the preferred scheme, the row material unit include the annular plate, the up end normal running fit installation annular plate of ring piece, and annular plate and riser sliding fit are connected through No. two risers between a plurality of annular plates, along its circumference direction evenly offered type groove on the annular plate, be located the type inslot of annular plate of below and be provided with the mounting No. one, be provided with No. two mountings in the type inslot of other annular plates, the inside propelling movement piece that is used for transferring the rectifier bridge that is provided with of inner tube.
As the preferred scheme, a mounting include a spout, be close to type inslot of annular plate of disc has seted up a spout, pass through pressure spring cooperation slidable mounting briquetting in the spout, the opposite face of two briquetting in same type inslot and keep away from annular plate axle center one side be the inclined plane.
As the preferred scheme, no. two mounting include the notch, a notch has respectively been seted up on two inside walls that type inslot portion of the annular plate of briquetting top is relative, the notch sets up the conflict piece, and the conflict piece is V-arrangement structure, the middle part of conflict piece is rotated with the annular plate through the torsional spring cooperation and is connected.
As the preferred scheme, the propelling movement piece include the square groove, square groove has all been seted up on the right side of ring piece, the inside of square groove all is provided with the push pedal, the left side of push pedal is provided with a connecting plate jointly, and connecting plate and inner tube sliding fit, the cylinder is installed through the fixing base to the lower terminal surface of disc, the flexible end of cylinder extends to the inner tube inside and is connected with the push pedal that is located the below, cylinder flexible section and disc sliding fit.
As the preferred scheme, the heat conduction unit include the apron, the up end of urceolus is provided with the apron, the lower terminal surface of apron is provided with the support column, the junction of support column and apron is convex structure, the up end of inner tube is provided with the section of thick bamboo post, the up end of section of thick bamboo post is the arc surface, leave the passageway of gas flow between section of thick bamboo post and urceolus inner wall, apron and the support column, be provided with on the support column and be used for ejecting the discharging piece of rectifier bridge from the discharge gate.
As the preferred scheme, cooling mechanism include the support frame, the right side of discharge gate is provided with the support frame, the up end front and back symmetry of support frame is provided with respectively and is provided with a fixed plate, sets up the conveyer belt between the fixed plate, is provided with the baffle between two fixed plates, and the baffle is the U type structure of falling, rectangular block is installed to the up end of baffle, and the rectangular block is hollow structure, the air vent has evenly been seted up to the horizontal segment of baffle, and air vent and rectangular block inner chamber intercommunication, be provided with the intake pipe between rectangular block and the urceolus, and an intake pipe one end rectangular block inner chamber intercommunication, the intake pipe other end and the inside intercommunication of urceolus.
As the preferred scheme, the unit that opens and shuts include the fixed block, feed inlet top and discharge gate top all are provided with the fixed block, have seted up No. two spouts on the fixed block, sliding mounting has the arc in No. two spouts, the lower terminal surface rotation of fixed block and arc is installed a screw rod, the fixed block up end is installed and is connected No. two motors with a screw rod transmission.
As the preferred scheme, the discharging piece include template, template is installed to the one side that is close to the discharge gate of support column, rotates between the two vertical sections of template and installs bi-directional screw, no. one motor is installed to the up end of apron, no. one motor passes through gear train and bi-directional screw transmission and is connected.
The curing mechanism provided by the embodiment of the application has at least one of the following technical effects that the rectifier bridge filled with the epoxy heat-conducting glue is sequentially moved upwards through the discharging unit, and meanwhile, the rectifier bridge is moved upwards to be heated and cured through the principle that the density of hot air is small and floating upwards while the temperature of the hot air blown by the hot air is not changed, so that the epoxy heat-conducting glue is stably cured, and the curing quality of the epoxy heat-conducting glue is ensured.
2. The heat conducting unit provided by the application guides the discharge of the inner part of the inner cylinder, realizes the exchange flow of internal hot gas, and simultaneously performs preheating and reutilization through the air inlet pipe by the cooling mechanism, thereby improving the utilization rate of force and heat and reducing the resource waste.
3. The cooling mechanism provided by the application is used for leading the waste heat in the inner cylinder into the rectangular block through the air inlet pipe and blowing the waste heat to the rectifier bridge through the vent hole, so that the stable cooling of the rectifier bridge after the rectifier bridge is moved out is realized, the direct contact with the external air is avoided, and the epoxy heat-conducting adhesive after the curing is cracked due to the large temperature difference.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present application, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of the main structure of the present application (a cut-out conveying mechanism and a cooling mechanism).
Fig. 2 is a cross-sectional view of fig. 1.
Fig. 3 is a schematic view of a part of the structure of the discharging unit of the present application.
Fig. 4 is an enlarged view of the structure at a in fig. 1.
Fig. 5 is a schematic structural diagram of a first fixing unit according to the present application.
Fig. 6 is a schematic structural diagram of a second fixing unit according to the present application.
Reference numerals
1. A fixing frame; 2. a disc; 3. a curing mechanism; 30. an outer cylinder; 31. an inner cylinder; 32. a ring block; 33. a heat air blower; 5. a discharging unit; 50. an annular plate; 51. type grooves; 52. a first fixing piece; 520. a first chute; 521. briquetting; 53. a second fixing piece; 530. a notch; 531. a collision block; 54. a pushing member; 540. a square groove; 541. a push plate; 542. a connecting plate; 543. a cylinder; 6. a heat conduction unit; 60. a cover plate; 61. a support column; 62. a cylinder column; 4. a cooling mechanism; 40. a support frame; 41. a fixing plate; 42. a conveyor belt; 43. a baffle; 44. rectangular blocks; 45. an air inlet pipe; 7. an opening and closing unit; 70. a fixed block; 71. an arc-shaped plate; 72. a first screw; 73. a motor II; 8. a discharging piece; 80. templates; 81. a bidirectional screw; 82. a motor I.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
As shown in fig. 1, an epoxy heat-conducting adhesive curing processing device comprises a fixing frame 1; the upper end face of mount 1 install disc 2, the through-hole has been seted up at disc 2 middle part, the upper end of disc 2 is provided with segmentation heating solidification's curing mechanism 3, the front side of curing mechanism 3 is provided with the conveying mechanism who is used for the pay-off, the right side of curing mechanism 3 sets up the cooling mechanism 4 that utilizes curing mechanism 3 waste heat to slowly cool down.
As shown in fig. 1, fig. 2 and fig. 3, the curing mechanism 3 includes the urceolus 30, the front side of urceolus 30 is provided with the feed inlet, the right side upper portion of urceolus 30 is provided with the discharge gate, feed inlet and discharge gate all run through to the inner tube 31 inner chamber, and feed inlet and discharge gate position outside urceolus 30 all are provided with the unit 7 that opens and shuts, the up end of disc 2 is provided with urceolus 30, the inside of urceolus 30 is provided with inner tube 31, inner tube 31 inner chamber evenly is provided with ring piece 32 along its axial direction, and ring piece 32 is connected through riser, and riser and through-hole inner wall connection, the inside row of being provided with of inner tube 31 is used for discharging the discharge unit 5 of rectifier bridge, the through-hole position of disc 2 lower extreme face installs the inside hot-blast ware 33 that blows hot-blast of inner tube 31, the upper end of urceolus 30 is provided with heat conduction unit 6.
As shown in fig. 1 and fig. 4, the opening and closing unit 7 includes a fixed block 70, a fixed block 70 is disposed above the feed inlet and above the discharge outlet, a second chute is formed on the fixed block 70, an arc plate 71 is slidably mounted in the second chute, a first screw 72 is rotatably mounted on the lower end surfaces of the fixed block 70 and the arc plate 71, and a second motor 73 in transmission connection with the first screw 72 is mounted on the upper end surface of the fixed block 70.
During specific work, the conveying mechanism carries the rectifier bridge that annotates the epoxy heat-conducting glue to the feed inlet, the one end that is close to the feed inlet at conveying mechanism is installed to the external inductor, the external inductor receives information transfer and is external receiving module, external receiving module control No. two motor 73 operations, no. two motor 73 drives screw rod 72 rotation, make arc 71 upwards move open the feed inlet and feed, open the discharge gate and move the rectifier bridge after solidifying to cooling mechanism 4 simultaneously, heat conduction unit 6 is with the inside waste heat input cooling mechanism 4 of inner tube 31, remove after slowly cooling with the rectifier bridge, then concentrate to collect the processing to the rectifier bridge that finishes, and the rectifier bridge that gets into from the feed inlet can reach the discharge mechanism and divide the warm heating solidification to shift out again, and after feeding and the ejection of compact are accomplished at every turn, the unit 7 that opens and shuts and avoid heat loss with feed inlet and discharge gate closure, influence heating quality.
As shown in fig. 3, 5 and 6, the discharging unit 5 includes an annular plate 50, the annular plate 50 is mounted on the upper end surface of the annular block 32 in a rotating fit manner, the annular plate 50 is slidably matched with a first vertical plate, a plurality of annular plates 50 are connected through a second vertical plate, type grooves 51 are uniformly formed in the annular plate 50 along the circumferential direction of the annular plate 50, a first fixing piece 52 is arranged in the type groove 51 of the lowermost annular plate 50, a second fixing piece 53 is arranged in the type grooves 51 of the other annular plates 50, and pushing pieces 54 for transferring the rectifier bridge are arranged inside the inner cylinder 31.
As shown in fig. 3 and 5, the first fixing member 52 includes a first sliding groove 520, a first sliding groove 520 is formed in a groove 51 of the annular plate 50 near the disc 2, pressing blocks 521 are slidably mounted in the first sliding groove 520 by means of compression springs, and opposite surfaces of the two pressing blocks 521 in the same groove 51 and a side far from the axis of the annular plate 50 are inclined surfaces.
As shown in fig. 2, the heat conducting unit 6 includes a cover plate 60, a cover plate 60 is disposed on an upper end surface of the outer cylinder 30, a support column 61 is disposed on a lower end surface of the cover plate 60, a joint of the support column 61 and the cover plate 60 is in a circular arc structure, a cylinder column 62 is disposed on an upper end surface of the inner cylinder 31, an arc surface is disposed on an upper end surface of the cylinder column 62, a gas flow channel is reserved between the cylinder column 62 and an inner wall of the outer cylinder 30, the cover plate 60 and the support column 61, and a discharging member 8 for pushing out the rectifier bridge from a discharging port is disposed on the support column 61.
During specific operation, the rectifier bridge can be attached to the ring block 32 and slide to the first fixing piece 52 through the conveying mechanism in the process of entering the feed inlet, meanwhile, the pressing block 521 can be extruded, the pressing block 521 slides towards the inside of the chute, the pressing spring is compressed at the moment, after the rectifier bridge is abutted against the inner wall of the type groove 51, the pressing block 521 is extruded and fixed to the electrified groove under the action of the pressing spring, the external motor is arranged inside the cylinder column 62 and drives the annular plates 50 to rotate through the external gear, the rectifier bridge at the position of the feed inlet moves the pushing piece 54, the rectifier bridge can be moved to the annular plate 50 at the next layer by the pushing piece 54, and because the air heater 33 is arranged below the disc 2, hot air can be blown upwards, and can float upwards under the hot air density, so that the air temperature at the upper part is higher than the air temperature at the lower part, the curing quality of epoxy heat conducting glue on the rectifier bridge is realized, the air heater 33 continuously conveys hot air, part of the hot air floats upwards and blows to the channel between the circular arc section between the support column 61 and the cover plate 60 and the circular arc surface of the cylinder column 62 to the outer cylinder 30 and the outer cylinder 31, and the cooling and stable cooling of the rectifier bridge is realized after the cooling by utilizing the residual heat of the cooling mechanism.
As shown in fig. 2 and 3, the pushing member 54 includes a square groove 540, the right side of the ring block 32 is provided with the square groove 540, the inside of the square groove 540 is provided with a pushing plate 541, the left side of the pushing plate 541 is provided with a connecting plate 542, the connecting plate 542 is in sliding fit with the inner cylinder 31, the lower end surface of the disc 2 is provided with an air cylinder 543 through a fixing seat, the telescopic end of the air cylinder 543 extends into the inner cylinder 31 and is connected with the pushing plate 541 located below, and the telescopic section of the air cylinder 543 is in sliding fit with the disc 2.
As shown in fig. 3 and 6, the second fixing member 53 includes a notch 530, two opposite inner walls of the groove 51 of the annular plate 50 above the pressing block 521 are respectively provided with a notch 530, the notch 530 is provided with an abutting block 531, the abutting block 531 is in a V-shaped structure, and the middle part of the abutting block 531 is rotationally connected with the annular plate 50 through torsion spring matching.
When the rectifier bridge works specifically, after the rectifier bridge moves to the square groove 540, the air cylinder 543 runs to push the push plate 541 below to move upwards, other push plates 541 synchronously move upwards through the connecting plate 542, the rectifier bridge is pushed out of the current groove 51 and moves into the groove 51 of the upper annular plate 50, the rectifier bridge can be abutted against one section of the abutting block 531 in the moving process, so that the rectifier bridge can be rotated to be far away from the rectifier bridge, the abutting block 531 rotates towards the direction of the rectifier bridge under the action of the torsion spring after the rectifier bridge is separated from the abutting block 531, meanwhile, the air cylinder 543 pulls the push plate 541 to move downwards to reset, the rectifier bridge at the moment can be attached to the lower part of the abutting block 531, and meanwhile, the side part of the abutting block 531 is extruded with the side wall of the rectifier bridge, so that the stability of the rectifier bridge can be improved.
As shown in fig. 2 and 3, the discharging part 8 comprises a template 80, a template 80 is installed on one side, close to the discharging hole, of the supporting column 61, a bidirectional screw 81 is rotatably installed between two vertical sections of the template 80, a long plate is arranged on the bidirectional screw 81, a first motor 82 is installed on the upper end face of the cover plate 60, and the first motor 82 is in transmission connection with the bidirectional screw 81 through a gear set.
When the device is specifically operated, the material opening and closing unit 7 can open the material outlet when feeding, the motor 82 drives the bidirectional screw rod 81 to rotate through the gear set, the bidirectional screw rod 81 drives the long plate to move left and right in a reciprocating manner, and the long plate can push the rectifier bridge on the right side to move to the cooling mechanism 4 to cool stably in the rightward moving process.
As shown in fig. 2 and 3, the cooling mechanism 4 includes a support frame 40, the right side of the discharge port is provided with the support frame 40, the front and back symmetry of the up end of the support frame 40 is provided with a fixed plate 41 respectively, a conveyer belt 42 is provided between the fixed plates 41, a baffle 43 is provided between the two fixed plates 41, and the baffle 43 is of an inverted U-shaped structure, a rectangular block 44 is installed on the up end of the baffle, and the rectangular block 44 is of a hollow structure, the horizontal section of the baffle 43 is uniformly provided with vent holes, and the vent holes are communicated with the inner cavity of the rectangular block 44, an air inlet pipe 45 is provided between the rectangular block 44 and the outer cylinder 30, one end of the air inlet pipe 45 is communicated with the inner cavity of the rectangular block 44, and the other end of the air inlet pipe 45 is communicated with the inner cavity of the outer cylinder 30.
During specific work, the discharging part 8 pushes the rectifier bridge onto the conveying belt 42, at this moment, the conveying belt 42 can drive the rectifier bridge to move to the right through the baffle 43, in the moving process in the moving baffle 43, waste heat inside the outer cylinder 30 enters the rectangular block 44 through the air inlet pipe 45 and is blown to the rectifier bridge through the vent hole, and as the hot air blown out from the vent hole is in an open environment, the temperature of the hot air is reduced faster, so that the rectifier bridge is enabled to continue to transition from high temperature to normal temperature, the direct contact to normal temperature environment is avoided, the temperature difference is reduced, the epoxy heat-conducting adhesive is cracked, and the use of the epoxy heat-conducting adhesive is affected.
When the epoxy heat-conducting glue is cured, the rectifier bridge filled with the epoxy heat-conducting glue moves to the inside of the inner cylinder 31 through the conveying mechanism and is limited through the first fixing piece 52, then the annular plate 50 rotates to enable the rectifier bridge at the position of the feed inlet to rotate to the position of the pushing piece 54, the pushing piece pushes the rectifier bridge upwards to reach the annular block at the upper layer and is limited and fixed through the second fixing piece 53, the air heater 33 blows hot air upwards, the heat density is small, the upper temperature is higher than the lower temperature, the epoxy heat-conducting glue in the rectifier bridge is heated and cured in a temperature-dividing mode, the curing quality of the epoxy heat-conducting glue is guaranteed, the cured rectifier bridge is pushed to move to the cooling mechanism 4 from the discharge hole through the discharging piece 8 to be cooled stably, the epoxy heat-conducting glue just cured is prevented from being directly contacted with external air, the temperature difference is large, the cured epoxy heat-conducting glue is prevented from cracking, and continuous curing processing of the epoxy heat-conducting glue in the rectifier bridges is realized.
In the description of the present application, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present application; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.
Furthermore, the terms "first," "second," "first," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "first", "second", "first", "second" may include at least one such feature, either explicitly or implicitly. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "connected," "mounted," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
The embodiments of the present application are all preferred embodiments of the present application, and are not intended to limit the scope of the present application; all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.
Claims (6)
1. An epoxy heat-conducting adhesive curing processing device comprises a fixing frame (1); the method is characterized in that: the upper end face of the fixing frame (1) is provided with a disc (2), the middle part of the disc (2) is provided with a through hole, the upper end of the disc (2) is provided with a segmented heating and solidifying mechanism (3), the front side of the solidifying mechanism (3) is provided with a conveying mechanism for feeding, and the right side of the solidifying mechanism (3) is provided with a cooling mechanism (4) for slowly cooling by utilizing the waste heat of the solidifying mechanism (3); wherein:
the curing mechanism (3) comprises an outer cylinder (30), the upper end face of the disc (2) is provided with the outer cylinder (30), the inner part of the outer cylinder (30) is provided with an inner cylinder (31), the inner cavity of the inner cylinder (31) is uniformly provided with a ring block (32) along the axial direction of the inner cylinder, the ring block (32) is connected with the inner wall of a through hole through a first vertical plate, a discharging unit (5) for discharging a rectifier bridge is arranged in the inner cylinder (31), a heat-conducting unit (6) is arranged at the position of the through hole of the lower end face of the disc (2), the front side of the outer cylinder (30) is provided with a feeding hole, the upper part of the right side of the outer cylinder (30) is provided with a discharging hole, the feeding hole and the discharging hole penetrate through the inner cavity of the inner cylinder (31), and the feeding hole and the discharging hole on the outer side of the outer cylinder (30) are provided with an opening and closing unit (7);
the discharging unit (5) comprises an annular plate (50), the upper end face of the annular block (32) is in running fit with the annular plate (50), the annular plate (50) is in sliding fit with a first vertical plate, a plurality of annular plates (50) are connected through a second vertical plate, type grooves (51) are uniformly formed in the annular plate (50) along the circumferential direction of the annular plate, first fixing pieces (52) are arranged in type grooves (51) of the annular plate (50) located at the lowest position, second fixing pieces (53) are arranged in type grooves (51) of other annular plates (50), and pushing pieces (54) for transferring a rectifier bridge are arranged inside the inner cylinder (31);
the heat conduction unit (6) comprises a cover plate (60), the upper end face of the outer cylinder (30) is provided with the cover plate (60), the lower end face of the cover plate (60) is provided with a support column (61), the joint of the support column (61) and the cover plate (60) is of a circular arc structure, the upper end face of the inner cylinder (31) is provided with a cylinder column (62), the upper end face of the cylinder column (62) is of a circular arc surface, a gas flowing channel is reserved between the cylinder column (62) and the inner wall of the outer cylinder (30), the cover plate (60) and the support column (61), and the support column (61) is provided with a discharging piece (8) for pushing out a rectifier bridge from a discharging hole;
the cooling mechanism (4) include support frame (40), the right side of discharge gate is provided with support frame (40), the up end front and back symmetry of support frame (40) is provided with respectively and is provided with fixed plate (41), set up conveyer belt (42) between fixed plate (41), be provided with baffle (43) between two fixed plates (41), and baffle (43) are the U-shaped structure of falling, rectangular piece (44) are installed to the up end of baffle, and rectangular piece (44) are hollow structure, the air vent has evenly been seted up to the horizontal segment of baffle (43), and air vent and rectangular piece (44) inner chamber intercommunication, be provided with intake pipe (45) between rectangular piece (44) and urceolus (30), and intake pipe (45) one end rectangular piece (44) inner chamber intercommunication, the other end and urceolus (30) inside intercommunication of intake pipe (45).
2. The epoxy heat-conducting glue curing processing device according to claim 1, wherein: the first fixing piece (52) comprises a first sliding groove (520), the first sliding groove (520) is formed in a type groove (51) close to the annular plate (50) of the disc (2), pressing blocks (521) are slidably installed in the first sliding groove (520) through pressure spring matching, and inclined surfaces are arranged on opposite surfaces of the two pressing blocks (521) in the same type groove (51) and far away from the axis of the annular plate (50).
3. The epoxy heat-conducting glue curing processing device according to claim 2, wherein: the second fixing piece (53) comprises a notch (530), two opposite inner walls of a type groove (51) of the annular plate (50) above the pressing block (521) are respectively provided with a notch (530), the notch (530) is provided with a supporting block (531), the supporting block (531) is of a V-shaped structure, and the middle part of the supporting block (531) is in rotary connection with the annular plate (50) through torsion spring matching.
4. The epoxy heat-conducting glue curing processing device according to claim 1, wherein: push piece (54) include square groove (540), square groove (540) have all been seted up on the right side of ring piece (32), the inside of square groove (540) all is provided with push pedal (541), the left side of push pedal (541) is provided with a connecting plate (542) jointly, and connecting plate (542) and inner tube (31) sliding fit, cylinder (543) are installed through the fixing base to the lower terminal surface of disc (2), the flexible end of cylinder (543) extends to inner tube (31) inside and is connected with push pedal (541) that are located the below, flexible section of cylinder (543) and disc (2) sliding fit.
5. The epoxy heat-conducting glue curing processing device according to claim 1, wherein: the opening and closing unit (7) comprises a fixed block (70), the upper part of the feeding hole and the upper part of the discharging hole are respectively provided with a fixed block (70), a second chute is formed in the fixed block (70), an arc-shaped plate (71) is slidably arranged in the second chute, a first screw (72) is rotatably arranged on the lower end face of the fixed block (70) and the lower end face of the arc-shaped plate (71), and a second motor (73) machine in transmission connection with the first screw (72) is arranged on the upper end face of the fixed block (70).
6. The epoxy heat-conducting glue curing processing device according to claim 1, wherein: the discharging piece (8) comprises a template (80), one side, close to a discharging hole, of the supporting column (61) is provided with a template (80), a two-way screw (81) is rotatably arranged between two vertical sections of the template (80), a first motor (82) is arranged on the upper end face of the cover plate (60), and the first motor (82) is in transmission connection with the two-way screw (81) through a gear set.
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| CN116461028A (en) | 2023-07-21 |
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