CN116454079B - High-performance load point power supply - Google Patents

High-performance load point power supply Download PDF

Info

Publication number
CN116454079B
CN116454079B CN202310306968.6A CN202310306968A CN116454079B CN 116454079 B CN116454079 B CN 116454079B CN 202310306968 A CN202310306968 A CN 202310306968A CN 116454079 B CN116454079 B CN 116454079B
Authority
CN
China
Prior art keywords
circuit
voltage
output
pwm controller
tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202310306968.6A
Other languages
Chinese (zh)
Other versions
CN116454079A (en
Inventor
籍祥
高成
江敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianhang Changying Jiangsu Technology Co ltd
Original Assignee
Tianhang Changying Jiangsu Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianhang Changying Jiangsu Technology Co ltd filed Critical Tianhang Changying Jiangsu Technology Co ltd
Priority to CN202310306968.6A priority Critical patent/CN116454079B/en
Publication of CN116454079A publication Critical patent/CN116454079A/en
Application granted granted Critical
Publication of CN116454079B publication Critical patent/CN116454079B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
    • H02M3/158—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
    • H02M3/1582—Buck-boost converters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/08—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
    • H02M1/088—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters for the simultaneous control of series or parallel connected semiconductor devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
    • Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

Abstract

The invention provides a high-performance load point power supply, which comprises a PWM controller, an input filter circuit, a power conversion circuit and an output filter circuit which are sequentially connected, wherein the PWM controller is connected with the power conversion circuit, the output end of the output filter circuit is connected with the PWM controller through a sampling comparison circuit, the PWM controller samples the voltage of the output end, a COMP end level is formed through an error amplifier, saw-tooth waves generated by a PWM comparator in the PWM controller are intercepted by the level, and gate driving signals of a switching tube and a follow-up tube which are connected with the rear end of the PWM comparator are formed, so that the energy transferred to the output end from the input end is controlled. The invention adopts the LTCC process substrate and thick film mixed integration process to assemble, adopts the 133 pin LGA packaging structure formed by fully sealing and packaging the ceramic substrate and the metal tube shell, and has the characteristics of small volume, high integration level and light weight.

Description

High-performance load point power supply
Technical Field
The present invention relates to a power supply, and more particularly, to a high performance point-of-load power supply.
Background
The DC/DC converter is used as a core device in the electronic equipment and provides power for all functional circuits of the whole system. Along with the development of the power supply mode of the whole system from centralized power supply to distributed power supply, a light-weight, high-performance and high-reliability load point power supply becomes the development trend of the current DC/DC converter. In particular to the aerospace application of the airborne, missile-borne, ship-borne, satellite-borne and the like in the military field, and has huge application requirements.
LTM4613 is used as a load point power supply designed by the United states Dunt company, the input voltage range is 5V-36V, the output voltage is 3.3V-15V, the output current of 8A can be continuously provided, and space-saving heat resistance enhanced 15mmx15mmx4.32mmLGA sealing devices are adopted to realize high-density load point adjustment. The high-precision voltage is mainly provided for a digital circuit, an FPGA control circuit, a main board, a CPU, communication, storage and the like in a complete machine system.
In addition, in process realization, a PCB is mostly adopted as a carrier, and the epoxy resin plastic package structure has the quality grade of industrial grade or commercial grade, so that the application requirements of the high-reliability fields such as aviation, aerospace and the like can not be met.
Disclosure of Invention
The invention provides a high-performance load point power supply, which solves the problem of replacement of LTM4613 and adopts the following technical scheme:
the high-performance load point power supply comprises a PWM controller, and an input filter circuit, a power conversion circuit and an output filter circuit which are sequentially connected, wherein the input filter circuit changes the pulsating direct current voltage at an input end into smooth direct current voltage, and the smooth output voltage at an output end is obtained through the output filter circuit after the direct current voltage is reduced to an output voltage set value through the power conversion circuit; the PWM controller is connected with the power conversion circuit, the output end of the output filter circuit is connected with the PWM controller through the sampling comparison circuit, the PWM controller samples the voltage of the output end, a COMP end level is formed through the error amplifier, sawtooth waves generated by a PWM comparator in the PWM controller are intercepted by the level, gate driving signals of a switching tube and a freewheel tube in the power conversion circuit connected with the rear end of the PWM comparator are formed, and accordingly energy transmitted to the output end from the input end is controlled.
The high-performance load point power supply is provided with a plurality of pins, the PWM controller is provided with a plurality of ports, the pins are indirectly connected with the ports through a main circuit and a peripheral circuit or directly connected with the ports, the input filter circuit, the power conversion circuit, the output filter circuit and the sampling comparison circuit belong to the main circuit, and the main circuit further comprises a RUN enabling circuit, a soft start/output voltage tracking setting circuit and a Powergood function indication circuit which are connected with the PWM controller.
The power conversion circuit comprises a switching tube Q1 and a freewheel tube Q2 which are MOS tubes, the switching tube Q1 is connected with an input filter circuit, the connection part of the switching tube Q1 and the freewheel tube Q2 is connected with a PWM comparator through a switching tube driving circuit, and the connection part is connected with an output end VOUT pin through an output filter circuit.
The sampling comparison circuit comprises R11 and an output sampling resistor RFB, wherein a VFB port of the PWM controller is connected with a VFB pin, the extracted R11 is an upper voltage dividing resistor, the upper voltage dividing resistor is connected with a VOUT port of the PWM controller, and the VOUT port is connected with an external output sampling resistor RFB set by a high-performance load point power supply.
The high-performance load point power supply selects a topological structure of the synchronous rectification buck DC-DC converter, and the control of output voltage is realized by adjusting the duty ratio; the input filter circuit adopts an LC filter circuit, and the cut-off frequency is 71.43KHz; the output filter circuit is characterized in that a low-height high-current patch inductor is selected, and two parallel low-ESR ceramic output capacitors are selected; the instantaneous current stress of the switching tube Q1 and the instantaneous current stress of the freewheel tube Q2 are the same.
The PWM controller comprises a current type PWM control circuit, an integrated power tube, a protection circuit and a control function circuit; the current type PWM control circuit comprises a reference circuit, an error amplifier, a slope compensation circuit, a PWM comparator, a driving circuit and an oscillator connected with the driving circuit, which are sequentially connected; the driving circuit is connected with the integrated power tube; the protection circuit comprises an overcurrent protection circuit and an undervoltage protection circuit which are connected with the driving circuit, and also comprises a short-circuit protection circuit which is connected with the slope compensation circuit; the control function circuit comprises an enabling circuit, a PGOOD circuit and a TRACK control circuit, wherein the enabling circuit and the PGOOD circuit are connected with the driving circuit, and the TRACK control circuit is connected with the short-circuit protection circuit.
The error amplifier is composed of two-stage differential operational amplifiers, the input adopts source-stage negative feedback, namely, the output end voltage is sampled, the fed back output end voltage is compared with the reference voltage, and the output end voltage is converted into output current.
The driving circuit carries out logic operation on a PWM modulation signal input by the PWM comparator, a current limiting control signal input by the protection circuit, an OSC signal input by the oscillator and input signals of various control function circuits, and generates a control signal for driving the integrated power tube and a signal integrating the conduction time of the power tube.
The high-performance load point power supply is characterized in that a substrate of the high-performance load point power supply adopts an LTCC substrate, 6 layers of substrates and 7 layers of wiring are arranged, a large-area metallization mode is adopted for a power chip substrate and an inner conductor, a porous design is adopted for electric connection of an upper layer and a lower layer, a gold paste printing process is adopted for a circuit control part, a platinum silver paste printing process is adopted for a power part, and manufacturing of the substrate is completed by a multilayer printing technology.
The high-performance load point power supply is developed in a domestic way aiming at LTM4613 of foreign Lingte company. In circuit design, a non-isolated synchronous Buck topological structure is adopted, a control chip is an independent design and domestic current sheet, and the device selection of a main circuit is from domestic manufacturers with long-term stable supply capacity. In the process implementation, an LTCC process substrate and thick film hybrid integration process are adopted for assembly, and a 133-pin LGA packaging structure formed by fully sealing and packaging a ceramic substrate and a metal tube shell is adopted. Compared with LTM4613, the product has the characteristics of small volume, high integration level and light weight, and has complete coverage of functions, equivalent performance, identical package size and identical pin definition, can realize pin-to-pin replacement application, and has identical typical application circuit. The circuit belongs to a hybrid integrated circuit, is controlled according to the grade H of the national army standard, can meet the test requirement of the hybrid integrated circuit general Specification of military electronic components GJB2438B-2017, and is a high-reliability and long-service-life load point power supply.
Drawings
FIG. 1a is a dimensional view of the high performance point-of-load power supply;
FIG. 1b is a bottom view of the appearance of the high performance point-of-load power supply;
FIG. 1c is an apparent top view of the high performance point-of-load power supply;
FIG. 2 is a schematic diagram of the LTM 4613;
FIG. 3 is a functional block diagram of the high performance point-of-load power supply;
FIG. 4 is a circuit diagram of the high performance point-of-load power supply;
FIG. 5a is a topological structure diagram of a synchronous rectification buck DC-DC converter;
FIG. 5b is a diagram of a synchronous rectification buck DC-DC tank equivalent circuit;
FIG. 5c is a synchronous rectification buck DC-DC freewheel equivalent circuit diagram;
FIG. 6 is a schematic diagram of a PWM controller design;
FIG. 7 is a schematic diagram of a feedback compensation circuit;
FIG. 8 is a process flow diagram of the high performance point-of-load power supply;
FIG. 9 is a component diagram of the high performance point-of-load power supply;
FIG. 10 is a partial LTCC substrate print;
FIG. 11 is a schematic diagram of an assembly flow of the high performance point-of-load power supply;
FIG. 12 is a graphical illustration of a comparison of the high performance point-of-load power supply versus inlet product efficiency curve;
FIG. 13 is a schematic diagram of the high performance point-of-load power supply output ripple voltage;
FIG. 14 is a graph of a dynamic response waveform of the high performance point-of-load power supply;
fig. 15 is a waveform diagram of a switch node SW of the high performance point-of-load power supply.
Detailed Description
As shown in fig. 1 a-1 c, the high performance point-of-load power supply is 15mm x4.32mmLGA package in size. The pin port that it includes is: VIN, VD, PGND, VOUT, INTVcc, PLLIN, TRACK/SS, RUN, COMP, MPGM, f SET ，MARG0，MARG1，DRVcc，VFB，PGOOD，SGND，FCB。
The high performance point-of-load power supply is used to replace the LTM4613, and the process line characteristics adopted by the product are analyzed by performing anatomical analysis on the LTM4613, and the extracted schematic diagram is shown in FIG. 2.
As shown in FIG. 3, the high-performance load point power supply provided by the invention comprises a PWM controller, a power conversion circuit, an output filter circuit, a sampling comparison circuit, a RUN (RUN enable) circuit, an input filter circuit, a soft start/output voltage tracking setting circuit and a Powergood function indication circuit.
The input direct-current power supply sequentially passes through an input filter circuit, a power conversion circuit and an output filter circuit and then outputs, the output filter circuit is connected with the PWM controller through a sampling comparison circuit, the input filter circuit changes the pulsating direct-current voltage into a smooth direct-current voltage, and the smooth output voltage is obtained through the output filter circuit after the direct-current voltage is reduced to an output voltage set value through the power conversion circuit.
The PWM controller is connected with the power conversion circuit, the sampling comparison circuit is connected with the PWM controller, the sampling comparison circuit consists of an upper voltage dividing resistor R11 and a lower voltage dividing resistor which is set outside, the upper voltage dividing resistor R11 is connected to a VFB pin, and the lower voltage dividing resistor R FB The PWM controller performs the feedback regulation function of the circuit by recognizing the VFB pin voltage, as determined by the output voltage set point.
The PWM controller is connected with a Powergood function indicating circuit, the Powergood function indicating circuit is realized through an externally configured pull-up resistor and mainly plays a role in indicating normal operation of output terminal voltage, the circuit is used for monitoring whether the output voltage is within +/-10% of normal output, and if the output voltage is out of range, the Powergood pin level is forced to be pulled down.
The PWM controller is also connected with a RUN enabling circuit and a soft start/output voltage tracking setting circuit. The RUN enabling circuit is realized by a voltage stabilizing diode which is grounded by 5.1V through an RUN pin.
The high-performance load point power supply adopts surface-mounted LGA packaging, can continuously provide up to 8A output current only by adopting high-capacity external input and output capacitors, and has the functions of enabling, programmable soft start, overvoltage and undervoltage protection and good indication of the power supply.
As shown in fig. 4, the high-performance load point power supply is parsed inwards through external pins, and further comprises a control circuit and a main circuit, wherein the main circuit is used for controlling the switching process of the whole converter, and comprises a power conversion circuit, an output filter circuit, a sampling comparison circuit, a RUN enabling circuit, an input filter circuit, a soft start/output voltage tracking setting circuit and a PowerGood function indicating circuit, the control circuit is divided into a main control chip and a peripheral circuit thereof, and the main control chip is a PWM controller.
The main control chip U1 is a core of a control circuit, provides all control functions required by Buck topologies such as power tube grid driving, voltage and current feedback loops, switching frequency adjustment, loop compensation and the like, and comprises the following ports: VRNG1, VFB2, COMP3, SGND4, MARG15, MARG06, FSET7, VREFIN8, VREFOUT9, MPGM10, TRACK/SS11, PLLFLLTR 12, PLLIN13, VIN14, VINSNS15, ZVm16, Z117, Z218, INFvcc19, DRVCC20, BG21, PGND22, sense-23, sense+24, SW25, TG26, BOOST27, Z028, FCB29, RUN30, VON31 and PGOOD32, the ports being connected by a main circuit or directly to external power pins. Among them, the direct connection is as follows: MARG15, MARG06, MPGM10, TRACK/SS11, PLLIN13, PGOOD32, each port implements the function of the corresponding pin. For example, the main circuit is connected to an external power supply pin: PGND22, sense-23 are directly grounded, corresponding to SGND of the power pins.
The main circuit adopts a non-isolated synchronous Buck topological structure, and the method is as follows:
the power conversion circuit: the circuit comprises a main power MOS tube Q1 and a follow current MOS tube Q2, wherein the Q1 is connected with an input filter circuit, a TG26 port and a Q2, and the Q2 is connected with a BG21 port, the Q1 and the ground. The Q1 and the Q2 are connected, the connection part of the Q1 and the Q2 is connected with a switching tube driving circuit, the switching tube driving circuit comprises R2, C5 and D2, the sensor+24 and SW25 ports are connected with a BOOST27 port through C5 and R2 and connected with a DRVCC20 port through C5 and D2, and the DRVCC20 port is connected to a DRVcc pin. And the ports of the sense+24 and the SW25 are also connected with a VOUT pin, and a noise suppression circuit, an output filter circuit and an output energy storage circuit are arranged between the junction of the Q1 and the Q2 and the VOUT pin.
The noise suppression circuit: the noise suppression circuit comprises R13, C6 and C11, wherein after the R13 and the C11 are connected in series, the R13 and the C11 are connected in parallel with the C6, and the noise suppression circuit is connected in parallel with Q2.
The output filter circuit: including C12, C13, connected in front of VOUT pin.
The output tank circuit: including the L1 connection located in front of VOUT pin. The output filter circuit and the output tank circuit may be considered as an output filter tank circuit in parallel with the noise suppression circuit.
The input filter circuit: VIN14, VINSNS15 are connected with the VIN pin through input filter circuit, and input filter circuit is provided with L2, C3, R1, and wherein VIN is input DC power supply, and power supply gets into from VIN, is provided with grounded C2 between L2, R1, L2, R1 in proper order, and the R1 rear end is provided with grounded C3.
The RUN enable circuit: RUN30 is connected with RUN pin, RUN end is connected with D1, D1 is enable end regulator tube.
R8, C9, C10, C9, R8 are connected in series and then connected with C10 in parallel, one end of each of the C9 and C10 is connected with a COMP3 port, and the R8, C9 and C10 form a voltage feedback compensation circuit.
The sampling comparison circuit comprises R11 and RFB, wherein a VFB2 port is connected with a VFB pin, and R11 is an upper voltage dividing resistor. The upper voltage dividing resistor is connected with the VOUT port of the PWM controller, and the VOUT port is connected with an external output sampling resistor RFB set by a high-performance load point power supply.
The peripheral circuit comprises circuit connection of the periphery of the main control chip U1, and is specifically as follows:
VRNG1, ZVm16, INFvcc19, Z028, VON31 port are connected with INTTCC pin, wherein, R9, R10 constitute overcurrent protection circuit, C4 is the voltage stabilizing capacitor of the power supply end of control chip internal circuit, R3, R4 are used for controlling the chip dead time.
The SGND4 port is connected to the SGND pin.
FSET7 and PLLFLLTR 12 ports are connected with FSET pins, wherein R7 is a switching frequency setting resistor, and R5, C7 and C8 form a compensation circuit of an internal phase-locked loop low-pass filter.
R6 is connected between ports of VREFIN8 and VREFOUT9, and R6 is a positive input resistor of the error amplifier of the control chip.
The FCB29 port is connected with the FCB pin, and R14 is the pull-down resistor of the FCB pin.
As shown in fig. 5a to 5c, the operating principle of the high-performance load point power supply selects a topology structure of the synchronous rectification buck DC-DC converter so as to meet the technical index requirements of the product for wide-range input and low ripple noise.
Vin is a power input end, the PWM controller drives a switching tube M1 and a freewheel tube M2, when the switching tube is turned on, the freewheel tube is turned off, and the input end charges an output inductor L and an output capacitor C through the switching tube and provides energy for a load; neglecting the conduction voltage drop of M1, the voltage drop at two ends of the inductor is V in -V O The inductance current increases linearly with a rising slope of (V in -V O ) Charging time t of inductor on The method comprises the following steps:
t on＝ DT(1)
where D is the duty cycle.
When the switching tube M1 is turned off, the follow current tube M2 is turned on, and the current in the inductor cannot be suddenly changed, so that the energy stored in the inductor forms a loop through the follow current tube to provide energy for the load, and meanwhile, the output capacitor also provides energy for the load. At this time, the voltage drop on the inductor is-Vo, the inductor current is reduced, and the falling slope is-V O L, discharge time t of inductor off The method comprises the following steps:
t off＝ (1-D)T(2)
according to the principle of volt-second balance, i.e. the variation of inductor current in one period is 0, then
It follows that control of the output voltage can be achieved by adjusting the duty cycle.
In the high-performance load point power supply, the corresponding main circuit parameters are designed as follows:
(1) Input filter circuit design
The LC filter circuit design is adopted, wherein the design of the input capacitor needs to fully consider the capability of absorbing the pulse peak of the front-stage circuit and the requirement of the input ripple voltage, and the product is used for outputting the voltage according to the typical output voltage V O At 12V, output current I o 8A, efficiency η of 90%, input voltage V i At 36V, a typical switching frequency f is 600KHz, input voltage ripple DeltaV i The input capacitance was calculated to be 10 mV:
in order to improve the ripple suppression effect under a wide range of input voltage, a high-frequency inductor of 0.5 mu H/20%/8.5A and an input filter capacitor of X7R/1 mu F/10%/50V are selected to form an LC filter circuit at an input end under the permission of layout design so as to attenuate noise. The cut-off frequency of the filter is:
the design thinking also considers that when a user uses the filter, the input end can form a pi-type filter by only arranging a plurality of small ceramic decoupling electricity (about 10 uF), so that the noise transmitted from low input to EMI can be effectively restrained, the space is saved for the user when the circuit is designed, and the efficiency is improved.
(2) Design of output inductance
Because the load current of the product is large, the inductor is required to be unsaturated under various temperature environments on the premise of stable operation, and the smaller and better the DC equivalent resistance is from the viewpoint of efficiency. The circuit is ensured to work in an inductance current continuous working mode (CCM), and the calculation formula of the required filter inductance is as follows:
setting the ripple rate r=0.4 of the circuit according to experience, the ripple current Δi L＝ 0.4i o =3.2a, the input voltage maximum is 36V, the nominal operating frequency f=600 KHz. When V is O When=3.3v, the inductance takes a minimum value of 1.2 μh, when V O When the inductance is 12V, the maximum value of the inductance is 5.7 muh, and the low-height high-current patch inductance is determined and selected in consideration of the size requirement and the current stress derating, wherein the inductance is 2.2 muh, and the maximum current is 14A.
(3) Design of output capacitor
The selection of the output capacitance depends on the output voltage and ripple voltage requirements. The output voltage is 15V at maximum, and the withstand voltage of the capacitor is selected to be 50V in consideration of the deration. According to the technical index that the full-load ripple is 50mV, calculating the capacitance:
calculating equivalent series resistance:
to satisfy R ESR <R ESR(MAX) It is necessary that a plurality of capacitors are connected in parallel, and the ripple of the output voltage is mainly determined by the ESR of the capacitors. Finally, two parallel X7R/4.7. Mu.F/10%/50V low ESR ceramic capacitors were chosen.
(4) Design of power MOS tube
The MOS tube is selected mainly by considering the driving voltage and the on-resistance R DS(on) And gate charge Q g At V i ＝36V，V O ＝15V，I o Under operating conditions of =8a, f=600 khz, l=2.2 muh,the inductance peak current can be obtained through the working principle calculation of the BUCK circuit
V that switch tube Q1 needs to bear DS ＝36V，I o When=8a, instantaneous maximum current stress I PK = 9.736a, the freewheel Q2 instantaneous current stress is the same as the switching tube. In consideration of derating design and efficiency, a power tube of 40V/40A/5.5mΩ/9.8nC is finally selected.
Through analysis of foreign products, a PWM controller is designed autonomously, a 0.25-um BCD process flow sheet is adopted, and a flow sheet foundry is CSMC (tin-free bloom). The input voltage range is 3.3V-40V, the reference voltage is 0.6V, the dead time is 40ns, and the device has the short-circuit protection function, the rapid transient response, the good tracking of a power supply, the margin adjustment, the output overvoltage protection function and the like, and the working frequency is 600KHz. All the functions required for the power converter can be realized.
As shown in fig. 6, the PWM controller includes a current-type PWM control circuit, an integrated power tube, a protection circuit, and a control function circuit. The current type PWM control circuit is connected with the integrated power tube, the protection circuit is connected with the current type PWM control circuit, and the control function circuit is connected with the current type PWM control circuit and the protection circuit.
1) The current-type PWM control circuit includes: a reference circuit 1, an error amplifier 2, a slope compensation circuit 3, an oscillator 4, a PWM comparator 5, and a drive circuit 6. The reference circuit 1, the error amplifier 2, the slope compensation circuit 3, the PWM comparator 5 and the driving circuit 6 are connected in sequence, and the oscillator 4 is connected with the driving circuit 6.
Voltage reference circuit 1: in the design of a DC/DC chip, the reference voltage of the error amplifier and the reference voltages of other modules are generated by a band-gap reference voltage module, so that the accuracy of the band-gap reference voltage directly determines the accuracy of the chip. The function of the module is to generate zero temperature band gap reference voltage and zero temperature coefficient current, and provide bias current and reference voltage for comparison for other modules.
Error amplifier 2: the error amplifier is composed of two-stage differential operational amplifiers, the input adopts source-stage negative feedback, so that transconductance Gm is not influenced by input MOS, better linearity is obtained, the current mirror adopts a Casecode structure, the output impedance of the current mirror is increased, a high-precision current source is obtained, the gain of the error amplifier is increased, and the stability of a loop is improved. The feedback voltage FB is compared with the reference voltage and converted into an output current.
Slope compensation circuit 3: and the slope generating and summing circuit eliminates subharmonic oscillation phenomenon possibly occurring during peak current mode control.
Oscillator 4: and generating a clock period signal with fixed frequency, providing a periodic trigger signal for an RS latch circuit in control logic in a PWM mode, and setting different working frequencies by connecting different levels through an external FREQ pin.
PWM comparator 5: and comparing the slope compensation voltage signal with the EA output voltage to generate a PWM modulation signal, and controlling the turn-off of the power tube.
Drive circuit 6: the PWM modulation signal, the current limiting control signal, the OSC signal and the input signals of various control function circuits are subjected to logic operation to generate a control signal for driving the integrated power tube and a signal for driving the conduction time of the power tube.
2) Integrated power tube
The power supply comprises a switching tube Q3 and a freewheel tube Q4, and the driving circuit 6 is connected with the power tube 7. At V i ＝36V，V O ＝15V，I o Under the conditions of 8A, f=600 khz and l=2.2μh, the inductance peak current position 9.376a can be obtained by calculation according to the reference formula (10), so that the high-voltage BCD current sheet process is selected, the withstand voltage of the power tube can reach 40V, and the overcurrent capacity of the power tube needs to reach 20A.
3) The protection circuit includes: an overcurrent protection circuit 8, a short-circuit protection circuit 9 and an undervoltage protection circuit 10. The over-current protection circuit 8 and the under-voltage protection circuit 10 are connected with the driving circuit 6, and the short-circuit protection circuit 9 is connected with the slope compensation circuit 3.
Overcurrent protection circuit 8: the function of the module is to control whether the chip circuit works or not according to the change of the power supply voltage. When the power supply voltage is higher than 2.8V, starting a subsequent circuit to work; when the power supply voltage is lower than 2.5V, the subsequent circuit is turned off.
Short-circuit protection circuit 9: when the FB voltage is lower than 0.3V, the working frequency of the chip is reduced to 1/4 of the normal working frequency, so that the excessive inductance current is prevented, the inductance current is stabilized, and the inductance is protected.
Undervoltage protection circuit 10: and detecting the current of the power tube, and generating a control signal for turning off the power tube when the current reaches a set threshold (the threshold is 20% of the current when the chip works in the discontinuous mode).
4) Control function circuit: an enable circuit 11, a TRACK control circuit 12, and a PGOOD circuit 13. The enabling circuit 11 and the PGOOD circuit 13 are connected with the driving circuit 6, and the TRACK control circuit 12 is connected with the short-circuit protection circuit 9.
Enabling circuit 11: the system is enabled to operate normally when the RUN pin voltage is higher than 1.25V, otherwise the system will be turned off.
TRACK control circuit 12: the output tracking function is enabled when the TRACK pin voltage is below 0.57V, while the TRACK voltage is below 0.18V or connected to SVIN can turn the chip off completely when the RUN pin is connected low. The pin is a soft start pin.
PGOOD circuit 13: this module determines whether VOUT is within + 10% of the normal output by comparing FB voltage to two reference voltages (0.54 v,0.66 v), if so, the PGOOD pin will be tied to high with an external resistor, otherwise an internal open drain pull-down device will tie the PGOOD pin to low.
The feedback loop compensation circuit shown in FIG. 7 controls the chip to pass through V FB The pins sample the voltage of the output end, and through the error amplifier, the COMP end level is formed, and the level intercepts sawtooth waves generated in the chip to form grid driving signals of the switching tube and the follow-up tube, so that the energy transferred from the input end to the output end is controlled.
Since the reference voltage of the chip is 0.6V, the sampling resistor R is output FB Can be calculated byAnd (3) out:
according to the circuit characteristics, a II-type compensation network loop design is adopted, namely R8, C10 and C9 are added at the output end of the error amplifier, and the transfer function of the error amplifier circuit is deduced through calculation as follows:
wherein Vo(s) is the output signal, vc(s) is the signal output by the output end of the error amplifier, g m Is the transconductance, omega of the error amplifier 1 Is a zero point omega 2 Is a pole. In a typical mode of operation, i.e. V i ＝24V，V O ＝12V，f＝600KHz，L＝2.2μH，C OUT =10μf, esr≡100deg.mΩ, resulting in a pole ω of the power transfer function 2 And zero point omega 1 Is that
Substituted into (13) to obtain R 8 ＝10KΩ，C 9 ＝100pF，C 10 =1000 pF. The configuration of the zero point and the pole point widens the system bandwidth and improves the transient response speed.
Further, in the under-voltage locking circuit, when the logic circuit is higher than 2.8V in design, the RUN pin is enabled to start the subsequent circuit to work; when the power supply voltage is lower than 2.5V, the RUN pin is disabled, and the subsequent circuit is turned off. By utilizing the characteristic, only a 5.1V voltage stabilizing diode is connected to the ground at the RUN pin of the module, so that circuits and ESD voltages inside the RUN are protected.
Further, in the overcurrent protection circuit, the control chip is provided with a current limiting module, and when the current of the power tube reaches a set threshold, a control signal for turning off the power tube is generated. When the peripheral circuit of the controller is designed, two resistors R9 and R10 are set as voltage dividing resistors of INTTCC and are provided for the Vrng pin for setting the current limiting point of the module. Calculated r9=3.48kΩ, r10=18.2kΩ, and the limiting point was 14A.
As shown in the process flow of fig. 8, the technical difficulty of the present invention is that the product module has the characteristics of small volume, high integration level, high efficiency and high power density, and the maximum power conversion of 120W is realized in the volume of 15mm×15mm×4.32mm, firstly, the power circuit and the control circuit must be reasonably arranged in a small space, and secondly, the limitation and the requirement of the substrate manufacturing process and the limitation and the requirement of the production and assembly process must be considered. And analyzing the design structure of foreign products, combining the realization level of domestic technology, determining to adopt LTCC substrates and thick film hybrid integration technology for assembly, and adopting ceramic substrates and metal tube shells for full-sealing encapsulation.
(1) Structural design
Uniformly distributing power devices in the circuit; the design of the large-current conductor in the circuit is as short and wide as possible, so that the wiring resistance of the large-current conductor is reduced, and a better heat dissipation effect is achieved; meanwhile, the power ground wire and the control ground wire are arranged separately, so that coupling interference is prevented, and the design of electromagnetic compatibility is better considered. The component distribution diagram is shown in fig. 9.
(2) Substrate design
Because the power circuit is a power circuit, a plurality of conductors can not improve the integration level by reducing the line width, so that the substrate needs to utilize an LTCC process to distribute the circuit in the substrate in order to meet the heat dissipation and volume requirements of the product, a multilayer wiring and packaging integrated structure is realized, and the volume and the weight are further reduced. The LTCC substrate adopted by the base plate is made of DuPont green ceramic chips, in the process of designing the substrate by the LTCC process, 6 layers of substrates, 7 layers of wiring are adopted, the power chip substrate and the inner layer conductor adopt a large-area metallization mode, the heat dissipation area is increased, the electric connection of the upper layer and the lower layer adopts a porous design, and the heat resistance of a large current path is reduced. The circuit control part adopts a gold paste printing process, the power part adopts a platinum silver paste printing process, and the substrate manufacturing is completed by a multilayer printing technology. The back bonding pad of the manufactured substrate adopts a platinum-silver conductor, and the back bonding pad can effectively prevent the bonding pad from being oxidized by sputtering a gold layer, so that good welding performance is ensured. A partial LTCC substrate print is shown in fig. 10.
(3) Assembly process design
The product is realized by adopting a thick film hybrid circuit process, the substrate is manufactured by adopting an LTCC process, and the shell is a kovar metal shell. The substrate and the shell are welded by adopting gold soldering pieces, an internal MOS power tube, a resistor, a capacitor and an inductor are connected with the substrate by adopting a reflow soldering process, a bare chip U1 is connected, a voltage stabilizing tube D1 and a diode D2 are bonded by adopting H20E conductive adhesive, and U1, D1 and D2 are welded by adopting 2.0mil gold wire; and the shell and the cover plate are sealed by adopting parallel seal welding. The assembly flow is schematically shown in FIG. 11.
Gold wire bonding is a key process for the assembly of the circuit. Because the product belongs to a high-power device and has large transmission current, a gold wire ball welding process is adopted. Because the number of bonding pads on the chip is large, the gaps are small, the arrangement of the gold wires obtained by pressure welding is compact, and the gold wires are distributed in an upper-lower double-layer manner, the automatic pressure welding machine is adopted to bond the U1 port of the chip, the total number of the chips is 2.0mil gold wires, and 100% destructive tension test and visual inspection are required after the pressure welding is finished to ensure the assembly quality.
(4) Packaging process design
Control of the moisture content is a critical process for the circuit package. The circuit is manufactured in a trial mode according to the general standard of the GJB2438B-2017 hybrid integrated circuit, the water vapor content requirement is less than 5000ppm, and the water vapor content requirement is met by prolonging the curing time and the vacuum baking time of the component bonding material and strictly controlling the dew point in a glove box to be less than-55 ℃.
The encapsulation process directly influences the air tightness of the circuit, and parallel seal welding is also a key process of the product. During parallel sealing, a large amount of heat is rapidly transferred to the gold-tin solder at the joint of the frame and the substrate through the frame, and the gold-tin solder is easily melted due to heat accumulation, so that the air tightness of a circuit is affected; by optimizing the parallel soldering process parameters, the heat output of the package is controlled, so that the upper cover plate is melted, and the lower solder is not allowed to be melted. Meanwhile, the substrate adopts a metal with strong adhesive force as a priming layer, and then the upper part is sintered with a layer of metal as a blocking layer, so that the air tightness of the package is effectively ensured.
Experimental results:
3 samples are assembled, a test platform is built, and a three-temperature full-parameter test is carried out on the module, wherein test data are shown in table 1. Is close to the parameter index of the LTM4613 manual.
Table 13 full parameter test of only samples
(1) Efficiency curve test
The power loss of the synchronous rectification buck DC-DC converter is mainly concentrated on the conduction loss of a switching tube and a follow-up tube, and the loss of a direct current inductor and an input-output capacitor, and is theoretically calculated under a typical working mode, namely V i ＝24V，V O ＝12V，I O The efficiency at=8a is:
substituting η=94.8% and the curve of the measured efficiency and the output current is shown in fig. 12. The measured value is close to the theoretical value.
Fig. 12 shows the efficiency curves of the product and the inlet device of the patent under different input voltage, output voltage and load changes, and the change trend is consistent, and when the load current is 1A-8A, the product efficiency is close to the efficiency of the LTM4613, and the difference between the two is very small. However, when the load is 0A-1A, the efficiency is a certain difference, and the maximum difference is about 8 percent.
The chip used in the product is purely independently researched and developed, and has a certain difference from foreign chips in structure, internal components, process and the like, and in addition, the inductance inside the module is different from foreign products, so that the possibility of causing the problems is also presented.
(2) Output ripple test
The ripple peak value of the output voltage can be calculated by the following formula when the circuit works in the continuous working mode:
calculated, theoretical 25.7mV, the measured waveform is shown in FIG. 13.
(3) Dynamic load response test
The instantaneous change of the load causes the fluctuation of the output voltage, and V is set i ＝24V，V O ＝12V，I O The peak deviation of the measured output voltage is 200mV, which meets the index requirement and has good transient performance, as shown in figure 14, due to the periodical change between 0A and 4A.
(4) Switch node waveform testing
FIG. 15 shows the input voltage V i ＝36V，V O Under the condition of 18V, the waveform is tested by the node SW of the switching tube and the follow-up tube, the waveform is complete and undistorted, the duty ratio is 50%, and the voltage jitter peak suppression effect caused by reverse conduction of the follow-up tube is good.
The circuit product is controlled from design, assembly, encapsulation, test and the like according to the H level specified by GJB2438B-2017 general Specification for hybrid integrated circuits. The reliability test shows that the product is shown in table 2, and can meet the requirement of the high-reliability application field on the examination of components.
Table 2 reliability test verification
/>
The high-performance load point power supply provided by the patent is a miniaturized, efficient and high-current DC/DC converter based on an LTCC technology, and the project is especially suitable for miniaturized application no matter in the fields of military use and civil use, especially in the fields of national defense high reliability such as aviation, aerospace and the like, and has large equipment amount of the whole machine system and very wide application requirements and prospects.
The main technical indexes of the high-performance load point power supply provided by the invention are as follows:
(1) The input voltage range is 5V-36 VDC, and the nominal voltage is 24V;
(2) The output voltage range is 3.3V-15 VDC, and the nominal voltage is 12V;
(3) Output current is 8A;
(4) Efficiency: more than or equal to 90 percent;
(5) Switching frequency: 600KHz (typical);
(6) Input ripple noise: 10mVp-p;
(7) Output ripple noise: less than or equal to 50mVp-p;
(8) Load adjustment rate: 1.5% (typical);
(9) The output voltage error is not more than 2%;
(10) Packaging form: the LTCC ceramic substrate and the metal tube shell are packaged in a full-sealed LGA;
(11) External dimensions: 15 mm. Times.15 mm. Times.4.32 mm, see FIG. 1;
(12) Working temperature range: -55-125 ℃;
(13) And (3) the following functions: enabling, programmable soft start, overvoltage and undervoltage protection and good indication of power supply;
(14) Execution standard: GJB2438B-2017, hybrid integrated circuit general Specification;
(15) Reference to foreign product model: LTM4613, capable of implementing a foot-to-foot replacement application;
the high-performance load point power supply provided by the invention has the following characteristics:
(1) Principle design: and determining a main circuit topology structure by referring to foreign product manuals, and combining the domestic chip design capability and the current sheet process level, and realizing the circuit functions and technical indexes of foreign products by forward circuit design.
(2) The process is realized: in order to realize the characteristics of low voltage, high current, high power density and reliability, the manufacturing of the substrate is determined to adopt a multilayer ceramic process, a kovar gold-plated shell is mainly used in the manufacturing of the substrate, a bare chip and a chip component are mainly used in the manufacturing of the substrate, the component is assembled by adopting a thick film hybrid integrated circuit process, the packaging is realized by adopting a parallel sealing process, and finally, the metal ceramic full-sealed packaging structure is formed.
(3) Designing a control chip: and determining the chip size, the layout and the pin layout bonding diagram, determining the final state according to the simulation result, and finishing the streaming of the main controller with the domestic cooperative streaming manufacturer.
(4) And (3) assembling and testing: and analyzing product characteristics, carrying out parameter design and model selection on key parts and important parts, strictly controlling key procedures, completing sample assembly, and simultaneously designing and manufacturing a special fixture to complete three-temperature full-parameter test of the sample.

Claims (7)

1. A high performance point-of-load power supply, characterized by: the PWM controller is connected with an input filter circuit, a power conversion circuit and an output filter circuit in sequence, wherein the input filter circuit changes the pulsating direct current voltage at an input end into smooth direct current voltage, and the smooth output voltage at an output end is obtained through the output filter circuit after the direct current voltage is reduced to an output voltage set value through the power conversion circuit; the output end of the output filter circuit is connected with the PWM controller through a sampling comparison circuit, the PWM controller samples the voltage of the output end, a COMP end level is formed through an error amplifier, sawtooth waves generated by a PWM comparator in the PWM controller are intercepted by the level, gate driving signals of a switching tube and a freewheel tube in the power conversion circuit connected with the rear end of the PWM comparator are formed, and accordingly energy transmitted to the output end from the input end is controlled; the high-performance load point power supply comprises a substrate, a power chip substrate, an inner conductor, a circuit control part, a power chip substrate and a power chip substrate, wherein the substrate of the high-performance load point power supply adopts an LTCC substrate and is provided with 6 layers of substrates and 7 layers of wiring, the power chip substrate and the inner conductor adopt a large-area metallization mode, the upper layer and the lower layer are electrically connected through a porous design, the circuit control part adopts a gold paste printing process, the power part adopts a platinum silver paste printing process, and the manufacturing of the substrate is completed through a multilayer printing technology;
the PWM controller comprises a current type PWM control circuit, an integrated power tube, a protection circuit and a control function circuit; the current type PWM control circuit comprises a voltage reference circuit, an error amplifier, a slope compensation circuit, a PWM comparator, a driving circuit and an oscillator connected with the driving circuit, which are sequentially connected;
the voltage reference circuit is used for generating zero-temperature band gap reference voltage and zero-temperature coefficient current and providing bias current and reference voltage for comparison for other modules; the error amplifier compares the feedback voltage (FB) with a reference voltage and converts the feedback voltage (FB) into an output current; the slope compensation circuit is used for eliminating subharmonic oscillation phenomenon occurring during peak current mode control; the oscillator is used for generating clock period signals with fixed frequency, providing periodic trigger signals for an RS latch circuit in the control logic in a PWM mode, and setting different working frequencies by connecting different levels through an external FREQ pin; the PWM comparator generates a PWM modulation signal by comparing the slope compensation voltage signal and the output voltage of the EA pin, and controls the turn-off of the power tube; the driving circuit is used for generating a control signal for driving the integrated power tube and a signal for controlling the on time of the power tube;
the driving circuit is connected with the integrated power tube; the protection circuit comprises an overcurrent protection circuit and an undervoltage protection circuit which are connected with the driving circuit, and also comprises a short-circuit protection circuit which is connected with the slope compensation circuit;
the overcurrent protection circuit controls whether the chip circuit works or not according to the change of the power supply voltage; when the power supply voltage is higher than 2.8V, starting a subsequent circuit to work; when the power supply voltage is lower than 2.5V, the subsequent circuit is turned off; the short-circuit protection circuit is used for reducing the working frequency of the chip to 1/4 of the normal working frequency when the feedback voltage (FB) is lower than 0.3V, preventing the excessive inductance current, stabilizing the inductance current and protecting the inductance; the undervoltage protection circuit is used for detecting the current of the power tube, and generating a control signal for turning off the power tube when the current reaches a set threshold;
the control function circuit comprises an enabling circuit, a PGOOD circuit and a TRACK control circuit, wherein the enabling circuit and the PGOOD circuit are connected with the driving circuit, and the TRACK control circuit is connected with the short-circuit protection circuit; the enabling circuit and the PGOOD circuit are connected with the driving circuit, and the TRACK control circuit is connected with the short-circuit protection circuit; the enabling circuit controls the system to work normally when the RUN pin voltage is higher than 1.25V, otherwise the system is turned off; the TRACK control circuit is used for allowing the output tracking function to work when the voltage of the TRACK pin is lower than 0.57V, and simultaneously, when the RUN pin is connected lower than 1.25V, the voltage of the TRACK pin is lower than 0.18V or connected to the SVIN pin, the chip can be thoroughly turned off, and the pin is a soft start pin; the PGOOD circuit determines if the VOUT pin is within + 10% of the normal output by comparing the feedback voltage (FB) to two reference voltages, if so, the PGOOD pin will be tied to a high level by an external resistor, otherwise, an internal open drain pull-down device will tie the PGOOD pin to a low level.
2. The high performance point-of-load power supply of claim 1, wherein: the high-performance load point power supply is provided with a plurality of pins, the PWM controller is provided with a plurality of ports, the pins are indirectly connected with the ports through a main circuit and a peripheral circuit or directly connected with the ports, the input filter circuit, the power conversion circuit, the output filter circuit and the sampling comparison circuit belong to the main circuit, and the main circuit further comprises a RUN pin enabling circuit, a soft start/output voltage tracking setting circuit and a Powergood function indicating circuit which are connected with the PWM controller.
3. The high performance point-of-load power supply of claim 1, wherein: the power conversion circuit comprises a main power MOS tube (Q1) and a follow current MOS tube (Q2), wherein the main power MOS tube (Q1) is connected with an input filter circuit, a TG (26) port of the PWM controller and the follow current MOS tube (Q2), and the follow current MOS tube (Q2) is connected with a BG (21) port of the PWM controller, the main power MOS tube (Q1) and the ground; the switching tube driving circuit comprises a resistor (R2), a capacitor (C5) and a diode (D2), wherein the sensor+ (24) and SW (25) ports of the PWM controller are connected with a BOOST (27) port of the PWM controller through the capacitor (C5) and the resistor (R2), the DRVCC (20) port of the PWM controller is connected with the capacitor (C5) and the diode (D2), the DRVCC (20) port of the PWM controller is connected to a DRVcc pin, the sensor+ (24) and SW (25) ports of the PWM controller are also connected with a VOUT pin of the PWM controller, a noise suppression circuit, an output filter circuit and an output energy storage circuit are arranged between the junction of the PWM controller and the VOUT pin of the PWM controller, and the junction of the PWM controller and the PWM controller is connected with the output end of the PWM controller through the output filter circuit.
4. The high performance point-of-load power supply of claim 2, wherein: the sampling comparison circuit is connected with the PWM controller, the sampling comparison circuit is composed of an upper voltage dividing resistor (R11) and an externally set lower voltage dividing resistor, the upper voltage dividing resistor (R11) is connected to a VFB pin, the lower voltage dividing resistor is determined by an output voltage set value, the PWM controller completes a feedback regulation function of the circuit by identifying the voltage of the VFB pin, the sampling comparison circuit further comprises an output sampling Resistor (RFB), wherein a VFB port of the PWM controller is connected with the VFB pin, the led-out upper voltage dividing resistor (R11) is an upper voltage dividing resistor, the upper voltage dividing resistor is connected with a VOUT port of the PWM controller, and the VOUT port is connected with an externally set output sampling Resistor (RFB) set by a high-performance load point power supply.
5. A high performance point-of-load power supply according to claim 3, characterized in that: the high-performance load point power supply selects a topological structure of the synchronous rectification buck DC-DC converter, and the control of output voltage is realized by adjusting the duty ratio; the input filter circuit adopts an LC filter circuit, and the cut-off frequency is 71.43KHz; the output filter circuit is characterized in that a low-height high-current patch inductor is selected, and two parallel low-ESR ceramic output capacitors are selected; the instantaneous current stress of the main power MOS tube (Q1) is the same as that of the follow current MOS tube (Q2);
wherein Vin is a power input end, a PWM controller drives a switching tube (M1) and a freewheel tube (M2), when the switching tube is turned on, the freewheel tube is turned off, and the input end charges an output inductor (L) and an output capacitor (C) through the switching tube and provides energy for a load; neglecting the conduction voltage drop of the switching tube (M1), the voltage drop at the two ends of the inductor is V in -V O The inductance current increases linearly with a rising slope of (V in -V O ) Charging time t of inductor on The method comprises the following steps:
t on = DT （1）
wherein D is the duty cycle; t represents a cycle time;
when the switch tube (M1) is turned off, the freewheel tube (M2) is turned on, and energy stored in the inductor forms a loop through the freewheel tube to provide energy for the load, and meanwhile, the output capacitor also provides energy for the load; the voltage drop across the inductor is-V O The inductance current decreases with a slope of-V O L, discharge time t of inductor off The method comprises the following steps:
t off =(1-D)T （2）
according to the principle of volt-second balance, i.e. the variation of inductor current in one period is 0, then
，
Control of the output voltage can be achieved by adjusting the duty cycle.
6. The high performance point-of-load power supply of claim 1, wherein: the error amplifier is composed of two-stage differential operational amplifiers, the input adopts source-stage negative feedback, namely, the output end voltage is sampled, the fed back output end voltage is compared with the reference voltage, and the output end voltage is converted into output current.
7. The high performance point-of-load power supply of claim 1, wherein: the driving circuit carries out logic operation on a PWM modulation signal input by the PWM comparator, a current limiting control signal input by the protection circuit, an OSC signal input by the oscillator and input signals of various control function circuits, and generates a control signal for driving the integrated power tube and a signal integrating the conduction time of the power tube.
CN202310306968.6A 2023-03-27 2023-03-27 High-performance load point power supply Active CN116454079B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310306968.6A CN116454079B (en) 2023-03-27 2023-03-27 High-performance load point power supply

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310306968.6A CN116454079B (en) 2023-03-27 2023-03-27 High-performance load point power supply

Publications (2)

Publication Number Publication Date
CN116454079A CN116454079A (en) 2023-07-18
CN116454079B true CN116454079B (en) 2023-12-26

Family

ID=87131306

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310306968.6A Active CN116454079B (en) 2023-03-27 2023-03-27 High-performance load point power supply

Country Status (1)

Country Link
CN (1) CN116454079B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2822024Y (en) * 2005-08-24 2006-09-27 上海新华电子设备有限公司 DC/DC power module with low voltage regulation rate and negative regulation rate
CN103166482A (en) * 2011-12-17 2013-06-19 西安恒飞电子科技有限公司 Communication power source with multiple protection functions
CN104617778A (en) * 2015-02-10 2015-05-13 兰州空间技术物理研究所 Low-current output high-voltage power supply circuit wide in input voltage range and high in load regulation rate
CN106026624A (en) * 2016-05-11 2016-10-12 成都中微电微波技术有限公司 Stabilized switching power supply circuit system
CN106341038A (en) * 2015-05-22 2017-01-18 无锡矽瑞微电子股份有限公司 Constant voltage output switching power supply device with high power factor and control method thereof
CN115346952A (en) * 2022-10-18 2022-11-15 合肥圣达电子科技实业有限公司 Packaging structure for high-power large-current device and preparation method thereof
CN115346974A (en) * 2022-08-10 2022-11-15 西安微电子技术研究所 Multi-substrate stacking structure of anti-irradiation load point power supply and assembling method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2822024Y (en) * 2005-08-24 2006-09-27 上海新华电子设备有限公司 DC/DC power module with low voltage regulation rate and negative regulation rate
CN103166482A (en) * 2011-12-17 2013-06-19 西安恒飞电子科技有限公司 Communication power source with multiple protection functions
CN104617778A (en) * 2015-02-10 2015-05-13 兰州空间技术物理研究所 Low-current output high-voltage power supply circuit wide in input voltage range and high in load regulation rate
CN106341038A (en) * 2015-05-22 2017-01-18 无锡矽瑞微电子股份有限公司 Constant voltage output switching power supply device with high power factor and control method thereof
CN106026624A (en) * 2016-05-11 2016-10-12 成都中微电微波技术有限公司 Stabilized switching power supply circuit system
CN115346974A (en) * 2022-08-10 2022-11-15 西安微电子技术研究所 Multi-substrate stacking structure of anti-irradiation load point power supply and assembling method thereof
CN115346952A (en) * 2022-10-18 2022-11-15 合肥圣达电子科技实业有限公司 Packaging structure for high-power large-current device and preparation method thereof

Also Published As

Publication number Publication date
CN116454079A (en) 2023-07-18

Similar Documents

Publication Publication Date Title
US11557962B2 (en) Chip embedded power converters
CN110383661B (en) Chip embedded power converter
US9627972B2 (en) Power converter package structure and method
CN101548252B (en) Power converter with hysteretic control
Zhu et al. Voltage-lift-type cuk converters: topology and analysis
Meneses et al. Grid-connected forward microinverter with primary-parallel secondary-series transformer
US9144125B2 (en) AC-DC power converter
Shi et al. Mode-selectable high-efficiency low-quiescent-current synchronous buck DC–DC converter
CN106411141B (en) A kind of fixed frequency, fixed pulse width, the high voltage direct current source circuit for inputting amplitude adjustment control
US10063149B2 (en) Multi-phase switching power converter module stack
CN104617771A (en) Switching power converter system and control method thereof
Vračar et al. Active-clamped flyback DC-DC converter in an 800V application: Design notes and control aspects
CN116454079B (en) High-performance load point power supply
US11621254B2 (en) Power supply system
CN114944748B (en) Constant frequency control circuit and method for constant on-time control mode converter
Kularatna Modern component families and circuit block design
CN210273831U (en) Ceramic wafer type power converter
Zhang et al. A 20MHz monolithic DC-DC converter manufactured with the first commercially viable silicon magnetics technology
Navamani et al. Design and Component Analysis of High Gain Quadratic Boost Converters with fault diagnosis and remedial measure
Lentz A Modified Boost Converter with Reduced Input Current Ripple
Zhang Fault logic circuit design of switching power supply based on soft reference circuit module
CN216900771U (en) Power supply conversion circuit of online monitoring device for insulator running state on contact network
CN214850940U (en) Direct current booster circuit
CN209593259U (en) A kind of inverse-excitation type DC-DC power source device
Wang et al. Forward and flyback converter that can realize secondary BOOST or BUCK function

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant