CN116429268A - Staring type infrared detector area array and assembly method - Google Patents
Staring type infrared detector area array and assembly method Download PDFInfo
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- CN116429268A CN116429268A CN202211599100.1A CN202211599100A CN116429268A CN 116429268 A CN116429268 A CN 116429268A CN 202211599100 A CN202211599100 A CN 202211599100A CN 116429268 A CN116429268 A CN 116429268A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/28—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using photoemissive or photovoltaic cells
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/48—Thermography; Techniques using wholly visual means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
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- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/28—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using photoemissive or photovoltaic cells
- G01J2005/283—Array
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/28—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using photoemissive or photovoltaic cells
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- G01J2005/286—Arrangement of conductor therefor
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Abstract
The invention discloses a staring type infrared detector area array and an assembly method, and belongs to the technical field of infrared focal plane detectors. The area array comprises 2 rows and a plurality of columns of staring type infrared detector single modules and a control system which are mechanically spliced, wherein the single modules convert incident infrared radiation signals into electric signals and output the electric signals, and meanwhile, temperature data of the single modules are output; the control system receives the electric signals and temperature data output by each single module in the area array, and controls the temperature of the single module according to the temperature data. By the application of the invention, the staring type infrared detector array with high precision and good thermal matching can be provided.
Description
Technical Field
The invention relates to a staring type infrared detector area array and an assembly method thereof, belonging to the technical field of infrared focal plane detectors.
Background
The spliced ultra-large area array infrared detector is very suitable for continuous detection of various infrared targets due to large area array scale, flexible adjustment of integration time and frame frequency.
From the perspective of a remote sensor system, the infrared camera based on the mechanical splicing focal plane has the advantages of simple system composition, no special requirement on a main optical system, higher noise equivalent temperature difference performance, high image plane splicing precision and the like, so that the infrared large area array focal plane obtained by mechanical splicing is a preferable technical scheme.
There are two general approaches to the staring type infrared detector mechanical splicing technology, one is a die splicing technology based on a flip chip interconnection mode represented by LETI in France, and the other is a module mechanical splicing mode represented by Rockwell in America. The bare chip splicing scheme has the characteristics of high splicing precision and small packaging size; the modular mechanical splice approach is typically used for very large scale gaze detector assemblies, and is more suitable for large optical imaging systems. The module mechanical splicing has the advantages that a single module can be replaced, and a larger-scale area array can be realized.
The detector splice assembly for mechanical splicing of modules is generally composed of a splice substrate and a number of individual modules. The splice substrate provides a mounting interface and mechanical support for each individual module. Each single module is provided with independent external mechanical, thermal and electronic interfaces, and the single modules are arranged on the splicing substrate according to the required splicing form and precision, so that the splicing assembly meeting the array scale requirement is finally obtained.
Since infrared detectors need to operate at low temperatures (e.g., 60K, 77K), differences in thermal expansion coefficients will create large thermal stresses and thermal deformations within the chip. Therefore, the design of the single-module package also considers thermal stress and thermal deformation at low temperature, and avoids the problems of degradation, cracking, defocusing and the like of the detector.
Disclosure of Invention
The invention solves the technical problems that: the method has the advantages that the defects of the prior art are overcome, the staring type infrared detector area array and the assembly method are provided, the temperature of each detector on the area array is monitored, the cold chain is installed and designed, the identification is spliced, the high-precision design and the temperature control of the area array are realized, and the method can be widely applied to spliced type ultra-large area array infrared detectors.
The technical scheme of the invention is as follows:
a staring type infrared detector area array comprises 2 rows, a plurality of columns, a staring type infrared detector single module and a control system, wherein the staring type infrared detector single module is mechanically spliced;
the single module converts an incident infrared radiation signal into an electric signal and outputs the electric signal, and meanwhile, outputs own temperature data;
the control system receives the electric signals and the temperature signals output by each single module in the area array, and controls the temperature of the single module according to the temperature data.
Preferably, the single module comprises a detector chip, a packaging substrate, a flexible belt, a temperature measuring diode and a cold chain;
the detector chip is connected with the flexible belt, and the electric signal generated by the detector chip is output through the flexible belt;
the detector chip is arranged in the packaging substrate, one end of the flexible belt is arranged on one side of the packaging substrate and led out, and other side surfaces of the packaging substrate can be used for splicing other detectors; the cold chain is arranged on the back surface of the packaging substrate; the temperature measuring diode is arranged on the front surface of the packaging substrate and positioned between the detector chip and the flexible belt, and is bonded to the flexible belt through a lead to lead out a temperature signal;
and a splicing mark is arranged in the middle position of the outer sides of the four sides of the photosensitive area on the front side of the detector chip.
Preferably, the control system collects the temperature measuring diode signals in each single module to obtain the temperature distribution of all single modules on the area array, and the temperature of the detector is regulated by the cold chain to ensure that the temperature of all single modules is uniform.
Preferably, the control system collects the temperature measuring diode signals in each single module to obtain the temperature distribution of all the detectors on the area array, and the image is subjected to targeted compensation through the system-level calibration of the image and the temperature of the detectors.
Preferably, the positioning mark is spliced on the back of the detector chip by photoetching and is used for bonding and aligning the detector chip and the packaging substrate.
Preferably, the packaging substrate is made of SiC material, an Invar fixing plate is arranged on one side of the packaging substrate, and the flexible belt is bonded to the Invar fixing plate in a wrapping mode; the back surface and the other side surface of the packaging substrate are embedded with Invar screw sleeves in an adhering mode, the Invar screw sleeves on the back surface serve as cold chain mounting interfaces, and the Invar screw sleeves on the side surfaces are used for clamping the detector.
Preferably, the cold chain of each single module is coupled with an external refrigerator cold head, and the cold chain is fixed by adopting a screw, and an indium sheet is padded on the connecting surface.
Preferably, each single module adopts a three-point supporting mode, three studs are mounted on the back surface of the packaging substrate, and the positions of the single modules are adjusted by adding gaskets on each stud.
A staring type infrared detector area array assembly method comprises the following steps:
(1) Assembling each detector single module in the area array:
photoetching, splicing and positioning marks on the front side and the back side of the detector chip;
bonding the detector chip to the packaging substrate by taking the back mark of the detector chip and the front mark of the packaging substrate as reference patches;
a flexible belt is arranged on the side surface of the detector chip, a temperature measuring diode is adhered between the chip and the flexible belt, the flexible belt is restrained on a fixing plate after wire bonding is completed, and the fixing plate is fixed on a packaging substrate;
mounting the cold chain and the stud on the packaging substrate;
(2) And (5) placing each assembled single module on the spliced substrate.
Preferably, in the step (2), the splicing mark of each single module located on the splicing substrate is measured through a splicing instrument, and if the coplanarity exceeds the requirement of splicing precision, the polished gaskets are placed on the single module studs to be adjusted.
Compared with the prior art, the invention has the advantages that:
(1) According to the invention, the temperature measuring diode is arranged, and the temperature measuring point is arranged at the position closest to the detector chip, so that the working temperature of the detector chip can be reflected relatively truly, and the higher temperature measuring and controlling precision is achieved.
(2) The invention adopts the flexible cold chain as a single module for heat transfer and refrigeration, the cold chain is arranged on the back of the single module, the cold chain is thermally coupled with the cold head of the refrigerator, the temperature uniformity of the spliced detector is ensured, the thermal stress and the thermal deformation of the cold head of the refrigerator are isolated, meanwhile, the flexible cold chain is fixedly arranged by adopting a screw, an indium sheet is filled on a connecting surface, the efficient heat conduction is realized, the cold plate of the traditional refrigerator is eliminated, the quality of the spliced detector array is further reduced, and the vibration and impact resistance is enhanced.
(3) According to the invention, the splicing mark is arranged on the detector chip, so that the positioning precision among the single modules is improved, and the overall splicing precision of the area array is improved.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:
FIG. 1 is a schematic diagram of a single module package of a staring type infrared detector according to an embodiment of the present invention;
FIG. 2 is a schematic view of a 2×3 module splice according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a front splice identification of a staring type infrared detector according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a back side of a single module of a staring type infrared detector according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of an embodiment of a temperature sensing diode mounting position;
FIG. 6 is a schematic diagram of the inter-module positions according to an embodiment of the invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other. The invention will be described in detail below with reference to the drawings in connection with embodiments.
The module mechanical splicing is a mechanical splicing technology for arranging a plurality of detectors on a spliced substrate according to the required splicing form and precision, and finally obtaining a spliced assembly meeting the array scale requirement. The single-module packaging of the detector is the basis for realizing the splicing. The detector single module itself must have the following characteristics:
the device is provided with independent external mechanical, thermal and electronic interfaces;
the splicing mark is provided;
the temperature measuring device has a temperature measuring function;
the clamping operation interface is provided;
has good thermal matching with the detector chip.
The invention provides a staring type infrared detector area array, which comprises 2 rows and 3 columns of staring type infrared detector single modules which are mechanically spliced and a control system;
the single module converts an incident infrared radiation signal into an electric signal and outputs the electric signal, and meanwhile, outputs own temperature data; the control system receives the electric signals and temperature data output by each single module in the area array, and controls the temperature of the single module according to the temperature data.
The single module package design is shown in FIG. 1 and includes a detector chip, a SiC package substrate, invar fixture plate, a platen, invar screw sleeve, invar stud, flex tape, temperature sensing diode, cold chain.
The SiC material is used as the packaging substrate, so that the thermal matching with the silicon readout circuit can be realized, and the thermal deformation and thermal stress are reduced. The probe chip was connected to a flex tape by wire bonding, which was bonded in a wrapped form to an Invar fixture plate on one side of the package substrate and secured with 2 Invar pressure plates and screws. Other three sides of a single module may be used for stitching.
The whole module adopts a three-point supporting mode, and each stud can adjust the inclination of the module in a mode of adding a gasket. Since SiC materials cannot process screw holes, invar nuts are adhesively embedded in the back and side surfaces of the package substrate. The back Invar screw was used as a cold chain mounting interface to cool the detector to operating temperature via the cold chain. The lateral Invar screw sleeve is used for clamping the package.
The difficulty of the cold chain is that it is efficient in heat transfer and that it is unable to stress the detector. The flexible cold chain is made of a metal material with high heat conductivity coefficient and is used for realizing heat conduction, when the cold chain is connected to a cold source, the refrigeration of a single module can be realized, and importantly, the flexible cold chain does not play a supporting role, and no additional stress is applied to the single module, so that the single module is laterally displaced to reduce the splicing precision. In order to achieve a tight 2 x 3 splice and considering process implementation, heat transfer efficiency, temperature uniformity of the single module, the mounting location of the cold chain is selected on the back of the single module. The mounting face size needs to be compatible with heat transfer efficiency and spacing from the back three Invar studs to ensure operational operability.
The flexible cold chain of each single module is coupled with the cold head of the refrigerator, so that the temperature uniformity of the spliced detector is ensured, the thermal stress and the thermal deformation (deformation can occur when the cold head of the refrigerator is cooled) of the cold head of the refrigerator are isolated, and meanwhile, the installation interface of the spliced detector and the refrigerator is simplified. And the mounting is performed by adopting screw fixation, and good heat conduction is ensured on the connecting surface by the indium sheet.
The invention adopts the flexible cold chain to realize the thermal coupling between the spliced detector and the cold head of the refrigerator, cancels the cold plate of the traditional refrigerator, further reduces the quality of the spliced detector and enhances the overall vibration and impact resistance of the area array.
The front of the detector chip is provided with a splicing mark at the middle position of the outer sides of the four sides of the photosensitive area, and the splicing mark is used for aligning among the XY modules in the horizontal plane. The positioning accuracy of the single module is determined by the splicing mark, and parameters such as the distance and the parallelism among the spliced detector modules are determined by the positioning accuracy among the modules. In order to achieve higher splicing accuracy, the invention is provided with splicing marks by photoetching at the position of the front face of the detector chip, which is close to the effective pixel area, as shown in figure 3. The splice mark and the effective pixel area are both on the detector chip, so that compared with the splice mark on the splice substrate, the transfer error can be reduced, and the splice precision is improved.
After the positions of the modules serving as the reference are determined, the theoretical positions of the modules are determined according to the area array splicing requirements (the dotted line in fig. 6), the splicing mark of each module represents the actual position of each module, and the actual position in the horizontal (X, Y) direction is close to the theoretical position as much as possible so as to meet the splicing precision requirements.
When implementing the concatenation, will each single module in proper order fall to the concatenation base plate, at each in single module's the process of falling to the position, carry out X, Y, Z to measuring by the concatenation sign on it by the concatenation appearance. And if the Z-direction coplanarity exceeds the splicing accuracy requirement, grinding the adjusting gasket. If the X, Y relative position deviation exceeds the splicing accuracy requirement, the X, Y position of the single module is precisely adjusted.
And a temperature measuring diode is bonded on the front surface of the SiC packaging substrate to serve as a temperature sensor, and the bonding position is positioned between the detector chip and the flexible belt. The temperature measuring diode on the single module is very important for the spliced ultra-large area array infrared detector:
first, the performance of the detector is closely related to the operating temperature, typically at low temperatures of 80-120K, and requires a stable, uniform temperature. The temperature measuring diode is arranged on the single module, so that the temperature measuring point can be arranged at the position closest to the detector chip, the working temperature of the detector chip is reflected to the greatest extent, and the higher temperature measuring and controlling precision is achieved.
Secondly, in order to realize that the temperature of each module of the whole ultra-large area array infrared detector is as uniform as possible, a control system using the single module is used for collecting all temperature measuring diode signals, so that the temperature distribution of each single module on the ultra-large area array infrared detector is obtained, and a distributed temperature control strategy or a centralized temperature control strategy can be realized by the system. The distributed temperature control can realize the independent control of the temperature of each module, and the temperature of each module is directly regulated to achieve the optimal uniformity. Although the temperature of a single module cannot be independently regulated by the centralized temperature control strategy, the temperature distribution of each module is known, and targeted compensation can be performed on the image through system-level calibration of the image and the temperature of the detector, so that the infrared image can reach better uniformity.
As shown in fig. 5, in order to achieve a better splicing effect (i.e. the minimum gap between the detector chips of each module), the detector chips are very close to the edge of the package substrate in three directions, and signals of the temperature measuring diode are led out through a key alloy wire and a flexible belt, so that the system requirement, the splicing requirement and the process realization are comprehensively considered, and the temperature measuring diode is installed at a position shown in the following diagram. The temperature measuring diode is thus an essential and important component of the control system, and its position, number are also considered and optimized.
Because the electric flexible belt is designed to be led out from one side, and the Invar fixing plate occupies a certain space, the invention is more suitable for three-side splicing to realize 2X N (N is more than or equal to 2) mechanical splicing in a 2X 3 splicing form shown in figure 2 in the application field with higher requirements on the splicing of photosensitive areas between modules such as space optical remote sensing.
A staring type infrared detector area array assembly method comprises the following steps:
(1) Assembling each detector single module in the area array:
the preparation work comprises the steps of preparing a mark and bonding an Invar screw sleeve on a packaging substrate; and photoetching and splicing positioning marks on the front and back sides of the detector chip, wherein the front marks are used for single-module landing splicing, and the back marks are used for patch alignment as shown in fig. 3.
Bonding the detector chip to the packaging substrate by taking the back mark of the detector chip and the front mark of the packaging substrate as reference patches; the chip attaching process is completed by flip-chip interconnection equipment, and the chip and the substrate are positioned and bonded. And the chip back mark and the package substrate front mark are used as references, so that the patch accuracy is ensured.
And installing a flexible belt on the side surface of the detector chip, welding the electric connector before installing the flexible belt, positioning and bonding the flexible belt and the Invar fixing plate during installing, and positioning and bonding the Invar fixing plate and the packaging substrate. And bonding a temperature measuring diode between the detector chip and the flexible belt, and restraining the flexible belt on the fixing plate by adopting a pressing plate after the wire bonding is finished, wherein the pressing plate and the Invar fixing plate are fixed on the packaging substrate through screws.
As shown in fig. 4, the cold chain, studs are mounted onto the package substrate, forming the final single module.
(2) And (5) placing each assembled single module on the spliced substrate.
The above embodiment is a staring type infrared detector array suitable for mechanical splicing, and each detector single module is provided with independent external mechanical, thermal and electronic interfaces. The electrical signals are led out from one side of the single module using a flex with electrical connectors at the ends of the flex. The mechanical interface adopts a three-point supporting mode to meet the requirements of surface type adjustment and structural strength. The back (relative to the photosensitive surface) of the single module is provided with a flexible cold chain, and the other end of the cold chain is connected to a cold source to realize low-temperature refrigeration. A 2 xn mechanical splice can be achieved.
The above examples are only preferred embodiments of the present invention, and ordinary changes and substitutions made by those skilled in the art within the scope of the present invention are intended to be included in the scope of the present invention.
Claims (10)
1. The staring type infrared detector area array is characterized by comprising 2 rows, a plurality of columns, a single module of the staring type infrared detector and a control system, wherein the single module of the staring type infrared detector is mechanically spliced;
the single module converts an incident infrared radiation signal into an electric signal and outputs the electric signal, and meanwhile, outputs own temperature data;
the control system receives the electric signals and the temperature signals output by each single module in the area array, and controls the temperature of the single module according to the temperature data.
2. The staring infrared detector array according to claim 1, wherein the single module comprises a detector chip, a package substrate, a flexible strap, a temperature measuring diode, and a cold chain;
the detector chip is connected with the flexible belt, and the electric signal generated by the detector chip is output through the flexible belt;
the detector chip is arranged in the packaging substrate, one end of the flexible belt is arranged on one side of the packaging substrate and led out, and other side surfaces of the packaging substrate can be used for splicing other detectors; the cold chain is arranged on the back surface of the packaging substrate; the temperature measuring diode is arranged on the front surface of the packaging substrate and positioned between the detector chip and the flexible belt, and is bonded to the flexible belt through a lead to lead out a temperature signal;
and a splicing mark is arranged in the middle position of the outer sides of the four sides of the photosensitive area on the front side of the detector chip.
3. The staring infrared detector array according to claim 2, wherein the control system collects the temperature measurement diode signals in each single module to obtain the temperature distribution of all single modules on the array, and the temperature of the detector is adjusted by the cold chain to make the temperature of all single modules uniform.
4. A staring infrared detector array according to claim 2 wherein the control system collects the temperature diode signals in each single module to obtain the temperature distribution of all detectors on the array, and the targeted compensation is performed on the image by system level calibration of the image and the detector temperature.
5. A staring infrared detector array as claimed in claim 2 wherein alignment marks are lithographically spliced on the back of the detector chip for adhesive alignment between the detector chip and the package substrate.
6. A staring infrared detector array according to claim 2, wherein the package substrate is made of SiC material, an Invar fixing plate is mounted on one side of the package substrate, and the flexible tape is bonded to the Invar fixing plate in a wrapping manner; the back surface and the other side surface of the packaging substrate are embedded with Invar screw sleeves in an adhering mode, the Invar screw sleeves on the back surface serve as cold chain mounting interfaces, and the Invar screw sleeves on the side surfaces are used for clamping the detector.
7. A staring infrared detector array according to claim 2, wherein the cold chain of each single module is coupled to an external cold head of a refrigerator, and indium plates are padded on the connecting surfaces by screw fixation.
8. The staring infrared detector array according to claim 1, wherein each single module adopts a three-point support mode, three studs are mounted on the back surface of the packaging substrate, and each stud adjusts the position of the single module by adding a gasket.
9. The staring type infrared detector area array assembling method is characterized by comprising the following steps of:
(1) Assembling each detector single module in the area array:
photoetching, splicing and positioning marks on the front side and the back side of the detector chip;
bonding the detector chip to the packaging substrate by taking the back mark of the detector chip and the front mark of the packaging substrate as reference patches;
a flexible belt is arranged on the side surface of the detector chip, a temperature measuring diode is adhered between the chip and the flexible belt, the flexible belt is restrained on a fixing plate after wire bonding is completed, and the fixing plate is fixed on a packaging substrate;
mounting the cold chain and the stud on the packaging substrate;
(2) And (5) placing each assembled single module on the spliced substrate.
10. The method for assembling a staring infrared detector array according to claim 9, wherein in the step (2), the splicing mark of each single module located on the splicing substrate is measured by a splicing instrument, and if the coplanarity exceeds the splicing accuracy requirement, the polished gaskets are placed on the single module studs to perform adjustment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211599100.1A CN116429268A (en) | 2022-12-12 | 2022-12-12 | Staring type infrared detector area array and assembly method |
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| CN202211599100.1A CN116429268A (en) | 2022-12-12 | 2022-12-12 | Staring type infrared detector area array and assembly method |
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| CN116429268A true CN116429268A (en) | 2023-07-14 |
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| CN202211599100.1A Pending CN116429268A (en) | 2022-12-12 | 2022-12-12 | Staring type infrared detector area array and assembly method |
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2022
- 2022-12-12 CN CN202211599100.1A patent/CN116429268A/en active Pending
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