CN116426089A - Epoxy resin-based high-electrical-strength composite insulating material, and preparation method and application thereof - Google Patents
Epoxy resin-based high-electrical-strength composite insulating material, and preparation method and application thereof Download PDFInfo
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- CN116426089A CN116426089A CN202310436894.8A CN202310436894A CN116426089A CN 116426089 A CN116426089 A CN 116426089A CN 202310436894 A CN202310436894 A CN 202310436894A CN 116426089 A CN116426089 A CN 116426089A
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- Prior art keywords
- epoxy resin
- filler
- electrical
- insulating material
- based high
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 49
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 49
- 239000002131 composite material Substances 0.000 title claims abstract description 48
- 239000011810 insulating material Substances 0.000 title claims abstract description 41
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000000945 filler Substances 0.000 claims abstract description 42
- 239000011159 matrix material Substances 0.000 claims abstract description 25
- 239000007788 liquid Substances 0.000 claims abstract description 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 15
- 238000002156 mixing Methods 0.000 claims abstract description 11
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims abstract description 9
- 239000011259 mixed solution Substances 0.000 claims description 11
- 150000003384 small molecules Chemical class 0.000 claims description 10
- 239000012774 insulation material Substances 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 5
- 125000005336 allyloxy group Chemical group 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 4
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 4
- 238000009849 vacuum degassing Methods 0.000 claims description 4
- 238000005303 weighing Methods 0.000 claims description 4
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical group CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 3
- TWWAWPHAOPTQEU-UHFFFAOYSA-N 4-methyl-2-benzofuran-1,3-dione Chemical group CC1=CC=CC2=C1C(=O)OC2=O TWWAWPHAOPTQEU-UHFFFAOYSA-N 0.000 claims description 3
- 239000011256 inorganic filler Substances 0.000 abstract description 13
- 229910003475 inorganic filler Inorganic materials 0.000 abstract description 13
- 230000000052 comparative effect Effects 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 5
- 239000003607 modifier Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Abstract
The invention provides an epoxy resin-based high-electrical-strength composite insulating material, and a preparation method and application thereof, and belongs to the technical field of insulating materials. The invention is composed of an epoxy resin matrix and an organic micromolecular filler; according to the weight portion, the epoxy resin matrix comprises 100 portions of liquid epoxy resin, 80 portions of liquid curing agent and 1 portion of liquid accelerator, 0.19 to 5.6 portions of organic micromolecular filler is adopted to replace the traditional inorganic filler, and the composite insulating material with good compatibility with the matrix, low filler content and high electrical strength is obtained by blending the organic micromolecular filler with the epoxy resin matrix.
Description
Technical Field
The invention relates to the technical field of insulating materials, in particular to an epoxy resin-based high-electrical-strength composite insulating material, a preparation method thereof and application of the composite insulating material in power equipment, in particular to application of the composite insulating material in dry transformers, basin-type insulators and bushings.
Background
The epoxy resin has excellent electrical insulation performance and is widely applied to electric equipment such as dry transformers, basin-type insulators, bushings and the like. The epoxy resin with high electrical strength is beneficial to reducing the design difficulty of an electrical insulation structure and saving the economic cost, and is a key for developing high-voltage-class power equipment. The prior researches show that the electric strength of the epoxy resin matrix composite insulating material can be improved by adding a proper amount of micro-or nano-inorganic filler into the epoxy resin matrix. Common inorganic fillers include silica, alumina, magnesia, titania and the like. However, most inorganic filler particles exhibit hydrophilic surfaces, while epoxy matrix molecules exhibit hydrophobic surfaces, so that the compatibility of the inorganic filler with the epoxy matrix is poor. In general, the inorganic filler may be first surface-modified with a surface modifier such as a silane coupling agent, thereby improving the compatibility between the inorganic filler and the epoxy resin matrix. However, the amount of surface modifier and the method of use have been difficult, and too little or too much surface modifier is not only detrimental to improving the compatibility of the inorganic filler with the polymer matrix, but even reduces the electrical strength of the composite insulation material. In addition, in order to obtain higher electrical strength, the inorganic filler content in the composite insulating material is usually high, which increases the viscosity of the epoxy resin-based composite insulating material mixed solution before molding, and is unfavorable for casting and processing of the composite insulating material.
Disclosure of Invention
In view of the above, in order to solve the technical problems that in the prior art, the compatibility of inorganic filler and epoxy resin matrix is poor, the surface modifier is not beneficial to improving the compatibility of the inorganic filler and polymer matrix, even the electrical strength of the composite insulating material is reduced, the processing difficulty of the epoxy resin-based composite material is caused by high content of the inorganic filler, and the like, the invention provides an epoxy resin-based high-electrical-strength composite insulating material, which adopts organic micromolecular filler to replace the traditional inorganic filler, and has good compatibility with the matrix, low filler content and high electrical strength.
In order to achieve the above purpose, the present invention provides the following technical solutions:
an epoxy resin-based high-electrical-strength composite insulating material is composed of an epoxy resin matrix and an organic micromolecular filler;
the epoxy resin matrix comprises 100 parts by weight of liquid epoxy resin, 80 parts by weight of liquid curing agent and 1 part by weight of liquid accelerator;
the weight portion of the organic micromolecular filler is 0.19-5.6 portions.
Preferably, the organic small molecule filler is 1.9-5.6 parts by weight.
Preferably, the organic small molecule filler is 5.6 parts by weight.
Preferably, the organic small molecule filler is allyloxy polyoxyethylene ether.
Preferably, the liquid curing agent is methyl phthalic anhydride.
Preferably, the accelerator is 2,4, 6-tris (dimethylaminomethyl) phenol.
On the other hand, the invention provides a preparation method of the epoxy resin-based high-electrical-strength composite insulating material, and the composite insulating material is obtained by blending the organic micromolecular filler with the epoxy resin matrix.
Preferably, the method specifically comprises the following steps:
1) Weighing the liquid epoxy resin, the liquid curing agent, the accelerator and the organic micromolecular filler for standby;
2) Mixing epoxy resin and small organic molecules at 50-60 ℃ for 10-15 minutes, adding a curing agent and an accelerator, and continuously mixing for 20-30 minutes at 50-60 ℃;
3) And (3) carrying out vacuum degassing on the mixed solution obtained in the step (2) for 15-30 minutes, injecting the mixed solution into a mould, pre-solidifying for 3-5 hours at 80-90 ℃, and then post-solidifying for 7-9 hours at 110-130 ℃, and cooling the mould to room temperature to obtain the epoxy resin-based high-electric composite insulating material.
In still another aspect, the invention also provides an application of the composite insulating material or the composite insulating material prepared by the preparation method in electric equipment.
Preferably, the electrical equipment comprises a dry transformer, a basin insulator and a bushing.
Compared with the prior art, the invention has the following beneficial effects:
according to the epoxy resin-based high-electrical-strength composite insulating material, the allyloxy polyoxyethylene ether is adopted as the organic micromolecular filler, and the organic micromolecular filler has similar functional groups (such as hydroxyl groups) with epoxy resin matrix molecules, so that the organic micromolecular filler has good compatibility with the epoxy resin matrix;
the filler content is low, the electrical strength is high, the viscosity of the epoxy resin-based composite insulating material mixed solution before molding is hardly influenced, and the casting molding of the composite insulating material is facilitated;
the epoxy resin-based composite insulating material with high electrical strength is beneficial to reducing the design difficulty and the production cost of electric equipment such as a dry type transformer, a basin-type insulator and the like.
Drawings
FIG. 1 is a graph showing the relationship between the electrical strength and the filler content in examples 1 to 5 and comparative examples 1 to 3.
Detailed Description
The invention provides an epoxy resin-based high-electrical-strength composite insulating material, which consists of an epoxy resin matrix and an organic micromolecular filler;
the epoxy resin matrix comprises 100 parts by weight of liquid epoxy resin, 80 parts by weight of liquid curing agent and 1 part by weight of liquid accelerator;
the weight part of the organic small molecule filler is 0.19-5.6 parts, preferably 1.9-5.6 parts, and more preferably 5.6 parts.
In the invention, the organic micromolecular filler is preferably allyloxy polyoxyethylene ether which has similar functional groups (such as hydroxyl groups) with the epoxy resin matrix molecules, so that the organic micromolecular filler has good compatibility with the epoxy resin matrix.
In the present invention, the liquid curing agent is methyl phthalic anhydride.
In the present invention, the accelerator is 2,4, 6-tris (dimethylaminomethyl) phenol.
The invention also provides a preparation method of the epoxy resin-based high-electrical-strength composite insulating material, which is characterized in that the epoxy resin-based high-electrical-strength composite insulating material is obtained by blending an organic micromolecular filler and an epoxy matrix.
The method specifically comprises the following steps:
1) Weighing the liquid epoxy resin, the liquid curing agent, the accelerator and the organic micromolecular filler for standby;
2) Mixing epoxy resin and small organic molecules at 50-60 ℃ for 10-15 minutes, adding a curing agent and an accelerator, and continuously mixing for 20-30 minutes at 50-60 ℃;
3) And (3) carrying out vacuum degassing on the mixed solution obtained in the step (2) for 15-30 minutes, injecting the mixed solution into a mould, pre-solidifying for 3-5 hours at 80-90 ℃, and then post-solidifying for 7-9 hours at 110-130 ℃, and cooling the mould to room temperature to obtain the epoxy resin-based high-electric composite insulating material.
In still another aspect, the invention also provides an application of the composite insulating material or the composite insulating material prepared by the preparation method in electric equipment.
In the present invention, the power equipment includes a dry-type transformer, a basin-type insulator, and a bushing.
The composite insulating material disclosed by the invention is beneficial to reducing the design difficulty and the production cost of electric equipment such as a dry-type transformer, a basin-type insulator and the like.
The technical scheme of the invention is clearly and specifically described below with reference to specific embodiments.
In view of the small temperature and time difference in the preparation method, values near the end values were selected for experiments.
Example 1
1) Weighing 100g of liquid epoxy resin, 80g of liquid curing agent, 1g of accelerator and 0.19g of organic micromolecular filler according to parts by weight;
2) Mixing liquid epoxy resin and organic micromolecular filler for 12 minutes at 56 ℃, adding a liquid curing agent and an accelerator, and continuously mixing for 30 minutes at 55 ℃ to obtain a mixed solution;
3) And (3) carrying out vacuum degassing on the mixed solution obtained in the step (2) for 20 minutes, injecting the mixed solution into a mould, pre-curing for 4 hours at 85 ℃, and then post-curing for 8 hours at 120 ℃, and cooling the mould to room temperature to obtain the epoxy resin-based high-electric composite insulating material.
Example 2
The difference from example 1 is that the weight of the organic small molecule filler is 0.95g.
Example 3
The difference from example 1 is that the weight of the organic small molecule filler is 1.9g.
Example 4
The difference from example 1 is that the weight of the organic small molecule filler is 2.8g.
Example 5
The difference from example 1 is that the weight of the organic small molecule filler is 5.6g.
Comparative example 1
The preparation method is the same as in example 1, except that no small organic molecule filler is added.
Comparative example 2
The preparation method is the same as in example 1, except that the filler is nano silica (average particle diameter 40 nm) and the weight is 1.9g.
Comparative example 3
The preparation method is the same as in example 1, except that the filler is nano silica (average particle diameter 40 nm) and the weight is 5.6g.
The composite insulating materials prepared in examples 1 to 5 and comparative examples 1 to 3 were placed between the ball-ball electrodes for ac electric strength test, and the electrode system was immersed in an insulating oil, and the obtained electric strength and filler content were higher than those of the pure epoxy resin (i.e., comparative example 1) and the epoxy/silica composite insulating materials (i.e., comparative examples 2 and 3) as shown in fig. 1. The electrical strength of the composite insulation material of example 5 was highest, 11% improvement over comparative example 1. The composite insulation material of example 3, which has the same filler content, has an electrical strength improved by 11.7% as compared to comparative example 2. The composite insulation material of example 5, which has the same filler content, has an electrical strength improved by 17.5% as compared to comparative example 3.
The above is only a preferred embodiment of the present invention; the scope of the invention is not limited in this respect. Any person skilled in the art, within the technical scope of the present disclosure, may apply to the present invention, and the technical solution and the improvement thereof are all covered by the protection scope of the present invention.
Claims (9)
1. An epoxy resin-based high-electrical-strength composite insulating material is characterized by comprising an epoxy resin matrix and an organic micromolecular filler;
the epoxy resin matrix comprises 100 parts by weight of liquid epoxy resin, 80 parts by weight of liquid curing agent and 1 part by weight of liquid accelerator;
the weight part of the organic micromolecular filler is 0.19-5.6 parts.
2. The epoxy resin-based high-electrical-strength composite insulating material according to claim 1, wherein the organic small molecule filler is 1.9-5.6 parts by weight.
3. The epoxy resin-based high-electrical-strength composite insulating material according to claim 1, wherein the organic small-molecule filler is 5.6 parts by weight.
4. The epoxy resin-based high-electrical-strength composite insulating material according to claim 1, wherein the small organic molecule filler is allyloxy polyoxyethylene ether.
5. The epoxy resin-based high electrical strength composite insulation material of claim 1, wherein the liquid curing agent is methyl phthalic anhydride.
6. An epoxy-based high electrical strength composite insulation material according to any of claims 1-5, wherein the accelerator is 2,4, 6-tris (dimethylaminomethyl) phenol.
7. The method for preparing the epoxy resin-based high-electrical-strength composite insulating material according to any one of claims 1 to 6, comprising the following steps:
1) Weighing the liquid epoxy resin, the liquid curing agent, the accelerator and the organic micromolecular filler for standby;
2) Mixing epoxy resin and small organic molecules at 50-60 ℃ for 10-15 minutes, adding a curing agent and an accelerator, and continuously mixing for 20-30 minutes at 50-60 ℃;
3) And (3) carrying out vacuum degassing on the mixed solution obtained in the step (2) for 15-30 minutes, injecting the mixed solution into a mould, pre-solidifying for 3-5 hours at 80-90 ℃, and then post-solidifying for 7-9 hours at 110-130 ℃, and cooling the mould to room temperature to obtain the epoxy resin-based high-electric composite insulating material.
8. Use of a composite insulation material according to any one of claims 1-6 or a composite insulation material prepared by the preparation method according to claim 7 in electrical equipment.
9. The use of claim 8, wherein the electrical equipment comprises a dry transformer, a basin insulator, and a bushing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310436894.8A CN116426089A (en) | 2023-04-23 | 2023-04-23 | Epoxy resin-based high-electrical-strength composite insulating material, and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310436894.8A CN116426089A (en) | 2023-04-23 | 2023-04-23 | Epoxy resin-based high-electrical-strength composite insulating material, and preparation method and application thereof |
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| Publication Number | Publication Date |
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| CN116426089A true CN116426089A (en) | 2023-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310436894.8A Pending CN116426089A (en) | 2023-04-23 | 2023-04-23 | Epoxy resin-based high-electrical-strength composite insulating material, and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116426089A (en) |
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2023
- 2023-04-23 CN CN202310436894.8A patent/CN116426089A/en active Pending
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