CN116406090B - Production process of aluminum-based copper-clad aluminum foil plate - Google Patents
Production process of aluminum-based copper-clad aluminum foil plate Download PDFInfo
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- CN116406090B CN116406090B CN202310542229.7A CN202310542229A CN116406090B CN 116406090 B CN116406090 B CN 116406090B CN 202310542229 A CN202310542229 A CN 202310542229A CN 116406090 B CN116406090 B CN 116406090B
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 147
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 147
- 239000011888 foil Substances 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000011889 copper foil Substances 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000011248 coating agent Substances 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- 238000007599 discharging Methods 0.000 claims abstract description 6
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000000016 photochemical curing Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims abstract description 3
- 238000004381 surface treatment Methods 0.000 claims abstract description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 27
- 238000001723 curing Methods 0.000 claims description 27
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 17
- 239000005011 phenolic resin Substances 0.000 claims description 17
- 229920001568 phenolic resin Polymers 0.000 claims description 17
- 239000004925 Acrylic resin Substances 0.000 claims description 15
- 229920000178 Acrylic resin Polymers 0.000 claims description 15
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 15
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 12
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 12
- 239000002270 dispersing agent Substances 0.000 claims description 11
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 11
- 239000002994 raw material Substances 0.000 claims description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 5
- -1 alicyclic amine Chemical class 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011863 silicon-based powder Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 14
- 238000002360 preparation method Methods 0.000 abstract description 6
- 239000000976 ink Substances 0.000 description 36
- 239000000463 material Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical group NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000003851 corona treatment Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 241001154287 Hucho taimen Species 0.000 description 1
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The invention provides a production process of an aluminum-based copper-clad aluminum foil plate, which comprises the following steps: (1) Respectively placing the aluminum foil and the copper foil into a thermosetting ink coating machine through a discharging machine to prevent deviation; (2) Respectively coating thermosetting ink on the front surfaces of the aluminum foil and the copper foil through a thermosetting ink coating machine; (3) Surface treatment is carried out on the upper surface and the lower surface of the aluminum substrate; (4) pressing the aluminum substrate, the aluminum foil and the copper foil; (5) And coating UV ink or non-vulcanized resin glue on the aluminum foil surface of the laminated aluminum substrate, and photo-curing to obtain the aluminum-based copper-clad aluminum foil plate. The preparation process is simple, and the prepared aluminum-based copper-clad aluminum foil plate has excellent heat conduction performance, good heat dissipation performance, difficult layering and high stability.
Description
Technical Field
The invention belongs to the technical field of circuit boards, and particularly relates to a production process of an aluminum-based copper-clad aluminum foil plate.
Background
The aluminum-based copper-clad plate consists of three parts, namely copper foil, an insulating bonding layer and an aluminum plate, wherein the copper material has good electric conduction and heat conduction properties, but has high specific gravity and high price, and is used as a circuit layer; aluminum materials have low specific gravity and low price, but generally have conductive properties as metal substrates. The aluminum-based copper-clad plate combines the advantages of the copper material and the aluminum material, the surface of the power device is attached to the circuit layer, heat generated during the operation of the device is quickly transferred to the metal base layer through the insulating layer, and then the heat is transferred out through the metal base layer, so that the heat dissipation of the device is realized, and the aluminum-based copper-clad plate can be widely used for manufacturing printed circuits in the industries of automobiles, motorcycles, televisions, electronic components and the like.
With the development of electronic technology, high-integration power devices have raised requirements on electrical conductivity, thermal conductivity and reliability of packaging structure materials, and the performance of corresponding aluminum-based copper-clad plates also needs to be further improved. Patent CN 103009701A discloses an aluminum-copper composite board and a preparation method thereof, comprising a copper plate as a base layer, a first aluminum plate and a second aluminum plate as a cladding layer, wherein the first aluminum plate and the second aluminum plate are sequentially compounded on the copper plate, the thickness of the first aluminum plate and the thickness of the second aluminum plate are the same, and the sum of the thickness of the first aluminum plate and the thickness of the second aluminum plate is equal to the thickness of the copper plate. And compounding the first aluminum plate and the second aluminum plate with the thickness equal to the thickness of the copper plate on the copper plate through secondary explosion welding. The preparation method of the invention has high cost and certain danger. Patent CN 105128454B discloses a double-sided aluminum-based copper-clad plate for an LED lamp, the copper-clad plate comprises an aluminum base layer, a first insulating layer and a second insulating layer which are respectively arranged on two sides of the aluminum base layer, a first copper foil layer which is arranged on the first insulating layer and far away from one side of the aluminum base layer, a second copper foil layer which is arranged on the second insulating layer and far away from one side of the aluminum base layer, and a circuit pattern is formed on the first copper foil layer and the second copper foil layer; a plurality of exposed arc-shaped connecting through holes are formed in the circumferential side edge of the copper-clad plate, copper plating is performed on the insulating inner wall of the connecting through holes after a third insulating layer is arranged on the inner wall of the connecting through holes, and the copper-clad plate is used for electrically connecting the first copper foil layer and the second copper foil layer. The invention sets the through holes for the electrical connection of the upper and lower layer circuits on the circumferential side edge of the copper-clad plate and exposes the through holes, and the quality of the product is difficult to control in actual production.
The existing aluminum-based copper-clad plate production process has the problems of low efficiency and high cost, and the heat dissipation performance and mechanical property of the product cannot be adapted to the development trend of the electronic industry, so the invention provides a production process of an aluminum-based copper-clad aluminum foil plate, which solves the problems.
Disclosure of Invention
In order to solve the problems, the invention provides a production process of an aluminum-based copper-clad aluminum foil plate, and the production process provided by the invention has the advantages of high production efficiency and lower production cost, and the prepared aluminum-based copper-clad aluminum foil plate has high heat dissipation, good conductivity and high stability.
In order to achieve the above object, the present invention provides the following technical solutions:
the first aspect of the invention provides a production process of an aluminum-based copper-clad aluminum foil plate, which comprises the following steps:
(1) Respectively placing the aluminum foil and the copper foil into a thermosetting ink coating machine through a discharging machine to prevent deviation;
(2) Respectively coating thermosetting ink on the front surfaces of the aluminum foil and the copper foil through a thermosetting ink coating machine;
(3) Surface treatment is carried out on the upper surface and the lower surface of the aluminum substrate;
(4) Pressing the aluminum substrate, the aluminum foil and the copper foil;
(5) And coating UV ink or non-vulcanized resin glue on the aluminum foil surface of the laminated aluminum substrate, and photo-curing to obtain the aluminum-based copper-clad aluminum foil plate.
The aluminum-based copper-clad aluminum foil plate is produced by the equipment such as the discharging mechanism, the thermosetting ink coating machine, the UV coating machine, the hot press, the cutting machine and the like.
In order to improve the heat dissipation of the aluminum-based copper-clad aluminum foil sheet, in a preferred embodiment, the thickness of the aluminum substrate is 600 to 1800 μm, the thickness of the copper foil is 10 to 40 μm, and the thickness of the aluminum foil is 10 to 100 μm. Preferably, the thickness of the aluminum substrate is 1000 μm, the thickness of the copper foil is 15 μm, and the thickness of the aluminum foil is 25 μm.
In a preferred embodiment, the thickness of the thermosetting ink applied in step (2) is 10 to 200 μm; in order to improve the adhesive force and the peeling strength of the aluminum-based copper-clad aluminum foil sheet, it is preferable that the thickness of the thermosetting ink coated in the step (2) is 80 μm.
In a preferred embodiment, the thermosetting ink in the step (2) is composed of the following raw materials in parts by weight: 20-40 parts of phenolic resin, 70-90 parts of bisphenol A type epoxy resin, 10-30 parts of acrylic resin, 5-10 parts of curing agent, 1-3 parts of silane coupling agent, 3-5 parts of dispersing agent and 35-55 parts of filler.
Preferably, the weight ratio of the phenolic resin to the bisphenol A type epoxy resin to the acrylic resin is (1-2): 3-5): 1. Further preferably, the weight ratio of phenolic resin, bisphenol A epoxy resin, and acrylic resin is 1.5:4:1.
Preferably, the curing agent is a cycloaliphatic amine curing agent.
Preferably, the silane coupling agent is a silane coupling agent kh560. Purchased from south Beijing forward chemical industry.
In the actual production process, the inventor finds that the adhesive force and the peeling strength of the thermosetting ink and the heat dissipation performance of the aluminum-based copper-clad aluminum foil plate can be improved by compounding the phenolic resin, the bisphenol A epoxy resin and the acrylic resin in the system of the invention. The inventor discovers that the weight ratio of phenolic resin, bisphenol A epoxy resin and acrylic resin is (1-2): (3-5): 1 reaches the highest adhesive force and peeling strength on the surface of the insulating layer when the insulating layer is used in the system. The inventors hypothesize that the epoxy resin forms a crosslinked network structure by combining the epoxy curing agent and the silane coupling agent with the resin. Meanwhile, the silane coupling agent can improve the dispersibility of the filler and the compatibility in the polymer, and active groups in the system can form stable chemical bonds with the alicyclic amine curing agent, so that the stability of the system is improved, the adhesive force and the peeling strength of the cured ink are enhanced, and the heat dissipation performance of the aluminum-based copper-clad aluminum foil plate is ensured.
Further preferably, the curing agent is a cycloaliphatic diamine curing agent.
Further preferably, the curing agent is 5-amino-1, 3-trimethylcyclohexylmethylamine.
Further preferably, the curing agent is 5-amino-1, 3-trimethylcyclohexylmethylamine, a mixture of cis and trans; purchased from merck 118184.
The inventor finds that the 5-amino-1, 3-trimethylcyclohexylmethylamine is selected, the overall performance of the product is higher, but different isomers are selected to generate different effects, the 5-amino-1, 3-trimethylcyclohexylmethylamine is selected to be a mixture of cis and trans, the inventor guesses that the curing agent has six-membered rings in the molecular structure, meanwhile, different isomers are added, the network structure three-dimensional of the system is increased after the curing agent is combined with resin, and the heat dissipation and mechanical properties are improved.
Preferably, the dispersing agent is a dispersing agent SP-32500, purchased from Shanghai hucho taimen.
Preferably, the UV ink is purchased from TZ-3000W1, guangxi Tech New Material technologies Co.
Preferably, the filler is selected from one or more of aluminum oxide, magnesium oxide, zinc oxide, aluminum nitride, boron nitride, silicon carbide and silicon micropowder.
Preferably, the filler is selected from silicon carbide. Purchased from merck 378097.
The inventor finds that the type and the filling amount of the filler influence the heat dissipation performance of the aluminum-based copper-clad aluminum foil plate, in the system of the application, the heat dissipation performance of the product is better by adding silicon carbide, and the amount of the phenolic resin cannot be higher than that of the bisphenol A epoxy resin, otherwise, the conductivity is reduced. Silicon carbide has high heat conductivity, and meanwhile, the crystal form of the silicon carbide forms a heat conducting framework in the system, and a compact heat conducting network is formed with resin in space, so that heat circulation is facilitated. According to the invention, by reasonably blending the addition amounts of the resin and the filler, the peeling strength is improved, and the problem of low peeling strength when the heat conductivity coefficient of the material is larger is solved.
In order to further improve the performance of the product, preferably, the thermosetting ink in the step (2) is composed of the following raw materials in parts by weight: 30 parts of phenolic resin, 80 parts of bisphenol A epoxy resin, 20 parts of acrylic resin, 7 parts of curing agent, 2 parts of silane coupling agent, 4 parts of dispersing agent and 46 parts of filler.
In order to improve the mechanical properties of the product, in a preferred embodiment, the copper foil has a mass per unit area of 53.+ -. 5%, g/m 2 The method comprises the steps of carrying out a first treatment on the surface of the The elongation is more than or equal to 3%; the density of the aluminum foil is 2.7g/cm 3 Tensile strength 210Rm/MPa, and elongation 2%. Purchased from the fei keside crystal.
Preferably, the upper and lower surfaces of the aluminum substrate are subjected to corona treatment.
The conditions of the corona treatment are that
The invention provides an aluminum-based copper-clad aluminum foil plate prepared by the preparation process, which comprises an aluminum substrate, wherein a copper foil is arranged above the aluminum substrate, and an aluminum foil is arranged below the aluminum substrate; a thermosetting ink layer is arranged between the aluminum substrate and the copper foil; a thermosetting ink layer is arranged between the aluminum substrate and the aluminum foil; and the other side of the aluminum foil is provided with a UV ink layer.
The third aspect of the invention provides application of the aluminum-based copper-clad aluminum foil plate. Preferably, the applications include, but are not limited to, applications in the preparation of printed circuit boards, or applications in the remaining electronics industry.
Compared with the prior art, the invention has the advantages that:
1. the invention uses a series of equipment to produce the aluminum-based copper-clad aluminum foil plate, and has the advantages of high production efficiency, lower production cost, high product quality and stable quality in the process flow.
2. The novel thermosetting ink is used, and phenolic resin, bisphenol A epoxy resin and acrylic resin are compounded in the system, so that the adhesive force and the peeling strength of the thermosetting ink and the heat dissipation performance of the aluminum-based copper-clad aluminum foil plate can be improved. The inventor discovers that the weight ratio of phenolic resin, bisphenol A epoxy resin and acrylic resin is (1-2): (3-5): 1 reaches the highest adhesive force and peeling strength on the surface of the insulating layer when the insulating layer is used in the system.
3. The curing agent of the invention adopts alicyclic amine curing agent, when the curing agent is 5-amino-1, 3-trimethyl cyclohexylamine, the curing agent adopts a mixture of cis and trans, the effect is optimal, and the heat dissipation and mechanical properties are improved.
4. In the system, the silicon carbide is added, so that the heat dissipation performance of the product is better, the peeling strength is improved by reasonably adjusting the addition amount of the resin and the filler, and the problem of low peeling strength when the heat conductivity coefficient of the material is larger is solved.
Drawings
FIG. 1 is a flow chart of a process for producing an aluminum-based copper-clad aluminum foil sheet;
FIG. 2 is a schematic structural view of an aluminum-based copper-clad aluminum foil plate prepared in example 1;
in the figure, 1, an aluminum substrate; 2. copper foil; 3. aluminum foil; 4. a thermosetting ink layer; 5. a UV ink layer.
Detailed Description
The following description of the technical solutions in the embodiments of the present invention will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
As shown in fig. 1-2, the embodiment provides a production process of an aluminum-based copper-clad aluminum foil plate, which comprises the following steps:
(1) Discharging: respectively placing the aluminum foil and the copper foil into a thermosetting ink coating machine through a discharging machine to prevent deviation; wherein the thickness of the copper foil is 15 μm, and the thickness of the aluminum foil is 25 μm.
(2) Coating thermosetting ink: respectively coating thermosetting ink on the front surfaces of the aluminum foil and the copper foil through a thermosetting ink coating machine; the thermosetting ink comprises the following raw materials in parts by weight: 30 parts of phenolic resin, 80 parts of bisphenol A epoxy resin, 20 parts of acrylic resin, 7 parts of curing agent, 2 parts of silane coupling agent, 4 parts of dispersing agent and 46 parts of silicon carbide; the thickness of the coated thermosetting ink was 80. Mu.m.
(3) Carrying out corona treatment on the upper surface and the lower surface of the aluminum substrate; the thickness of the aluminum substrate was 1000 μm.
(4) Pressing the aluminum substrate, the aluminum foil and the copper foil;
(5) And coating UV ink on the aluminum foil surface of the laminated aluminum substrate and photo-curing to obtain the aluminum-based copper-clad aluminum foil plate. And cut according to the required size using a cutting machine.
The aluminum-based copper-clad aluminum foil plate prepared in the embodiment is shown in fig. 2, and comprises an aluminum substrate 1, wherein a copper foil 2 is arranged above the aluminum substrate 1, and an aluminum foil 3 is arranged below the aluminum substrate 1; a thermosetting ink layer 4 is arranged between the aluminum substrate 1 and the copper foil 2; a thermosetting ink layer 4 is arranged between the aluminum substrate 1 and the aluminum foil 3; the other side of the aluminum foil 3 is provided with a UV ink layer 5.
Example 2
This embodiment differs from embodiment 1 in that: the thermosetting ink comprises the following raw materials in parts by weight: 20 parts of phenolic resin, 90 parts of bisphenol A type epoxy resin, 20 parts of acrylic resin, 7 parts of curing agent, 2 parts of silane coupling agent, 4 parts of dispersing agent and 46 parts of silicon carbide.
Example 3
The differences between this embodiment and embodiment 1 are: the filler is zinc oxide; the curing agent is 3309 curing agent, which is purchased from Yangzhou Zhongjiang materials technology Co.
Example 4
This embodiment differs from embodiment 1 in that: the thermosetting ink comprises the following raw materials in parts by weight: 60 parts of phenolic resin, 40 parts of bisphenol A epoxy resin, 30 parts of acrylic resin, 7 parts of curing agent, 2 parts of silane coupling agent, 4 parts of dispersing agent and 46 parts of silicon carbide;
example 5
This embodiment differs from embodiment 1 in that: the thermosetting ink comprises the following raw materials in parts by weight: 40 parts of phenolic resin, 90 parts of bisphenol A epoxy resin, 7 parts of curing agent, 2 parts of silane coupling agent, 4 parts of dispersing agent, 30 parts of silicon carbide and 16 parts of magnesium oxide.
Example 6
This embodiment differs from embodiment 1 in that: the thermosetting ink comprises the following raw materials in parts by weight: 30 parts of phenolic resin, 80 parts of bisphenol A epoxy resin, 20 parts of acrylic resin, 3 parts of curing agent, 1 part of silane coupling agent, 2 parts of dispersing agent and 60 parts of silicon carbide; the thickness of the coated thermosetting ink was 8. Mu.m.
Performance testing
1. The peel strength of the thermosetting inks used in the production processes of examples 1 to 6 was measured with reference to IPC-TM-650, and the adhesion of the thermosetting inks used in the production processes of examples 1 to 6 was measured with reference to GB 9286-98; the results are shown in Table 1.
2. The thermal conductivity of the aluminum-based copper-clad aluminum foil sheets prepared in examples 1 to 6 was measured with reference to ASTM D54705, and the results are shown in table 1.
TABLE 1 Performance test results
The results show that the aluminum-based copper-clad aluminum foil plate prepared by the production process has excellent heat conduction performance, good heat dissipation performance, difficult layering and high stability; the preparation process of the invention is simple and is convenient for popularization and application.
While the foregoing is directed to the preferred embodiments of the present invention, it will be appreciated by those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present invention, and such modifications and adaptations are intended to be comprehended within the scope of the present invention.
Claims (7)
1. The production process of the aluminum-based copper-clad aluminum foil plate is characterized by comprising the following steps of:
(1) Respectively placing the aluminum foil and the copper foil into a thermosetting ink coating machine through a discharging machine to prevent deviation;
(2) Respectively coating thermosetting ink on the front surfaces of the aluminum foil and the copper foil through a thermosetting ink coating machine;
(3) Surface treatment is carried out on the upper surface and the lower surface of the aluminum substrate;
(4) Pressing the aluminum substrate, the aluminum foil and the copper foil;
(5) Coating UV ink or non-vulcanized resin glue on the aluminum foil surface of the laminated aluminum substrate and photo-curing to obtain an aluminum-based copper-clad aluminum foil plate;
the thickness of the thermosetting ink coated in the step (2) is 10-200 mu m;
the thermosetting ink in the step (2) is prepared from the following raw materials in parts by weight: 20-40 parts of phenolic resin, 70-90 parts of bisphenol A epoxy resin, 10-30 parts of acrylic resin, 5-10 parts of curing agent, 1-3 parts of silane coupling agent, 3-5 parts of dispersing agent and 35-55 parts of filler;
the weight ratio of the phenolic resin to the bisphenol A epoxy resin to the acrylic resin is (1-2): 3-5): 1.
2. The process for producing an aluminum-based copper-clad aluminum foil plate according to claim 1, wherein the thickness of the aluminum substrate is 600-1800 μm, the thickness of the copper foil is 10-40 μm, and the thickness of the aluminum foil is 10-100 μm.
3. The process for producing an aluminum-based copper-clad aluminum foil plate according to claim 1, wherein the filler is one or more selected from the group consisting of aluminum oxide, magnesium oxide, zinc oxide, aluminum nitride, boron nitride, silicon carbide, and fine silicon powder.
4. The process for producing an aluminum-based copper-clad aluminum foil plate according to claim 1, wherein the curing agent is an alicyclic amine curing agent; the silane coupling agent is silane coupling agent kh560.
5. The production process of the aluminum-based copper-clad aluminum foil plate, as claimed in claim 1, is characterized in that the thermosetting ink in the step (2) is composed of the following raw materials in parts by weight: 30 parts of phenolic resin, 80 parts of bisphenol A epoxy resin, 20 parts of acrylic resin, 7 parts of curing agent, 2 parts of silane coupling agent, 4 parts of dispersing agent and 46 parts of filler.
6. The aluminum-based copper-clad aluminum foil plate manufactured by the manufacturing process according to any one of claims 1 to 5.
7. The use of the aluminum-based copper-clad aluminum foil sheet of claim 6.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310542229.7A CN116406090B (en) | 2023-05-15 | 2023-05-15 | Production process of aluminum-based copper-clad aluminum foil plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310542229.7A CN116406090B (en) | 2023-05-15 | 2023-05-15 | Production process of aluminum-based copper-clad aluminum foil plate |
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| CN116406090A CN116406090A (en) | 2023-07-07 |
| CN116406090B true CN116406090B (en) | 2024-02-02 |
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| CN202310542229.7A Active CN116406090B (en) | 2023-05-15 | 2023-05-15 | Production process of aluminum-based copper-clad aluminum foil plate |
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| CN210745648U (en) * | 2019-08-30 | 2020-06-12 | 珠海宏正科技有限公司 | Heat-conducting anti-bending flexible aluminum substrate structure |
| CN115734468A (en) * | 2022-12-10 | 2023-03-03 | 台山市科伟电子科技有限公司 | Novel aluminum-based double-sided aluminum foil-clad plate and manufacturing process thereof |
| CN116102995A (en) * | 2022-12-13 | 2023-05-12 | 广东东溢新材料科技有限公司 | Epoxy modified acrylic ester adhesive and preparation method thereof |
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| JPH0818224A (en) * | 1994-06-30 | 1996-01-19 | Hitachi Ltd | Adhesive for additive solder and manufacture of printed board using it |
| JP2010044998A (en) * | 2008-08-18 | 2010-02-25 | Sekisui Chem Co Ltd | Insulating sheet, and laminated structural body |
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| CN115734468A (en) * | 2022-12-10 | 2023-03-03 | 台山市科伟电子科技有限公司 | Novel aluminum-based double-sided aluminum foil-clad plate and manufacturing process thereof |
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| CN116406090A (en) | 2023-07-07 |
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