CN116390364A - Method for repairing residual copper of PCB - Google Patents
Method for repairing residual copper of PCB Download PDFInfo
- Publication number
- CN116390364A CN116390364A CN202310099981.9A CN202310099981A CN116390364A CN 116390364 A CN116390364 A CN 116390364A CN 202310099981 A CN202310099981 A CN 202310099981A CN 116390364 A CN116390364 A CN 116390364A
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- China
- Prior art keywords
- residual copper
- pcb
- thickness
- milling cutter
- copper
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 113
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 111
- 239000010949 copper Substances 0.000 title claims abstract description 111
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000003801 milling Methods 0.000 claims abstract description 39
- 238000000227 grinding Methods 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000002679 ablation Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000003670 easy-to-clean Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a method for repairing residual copper of a PCB, which comprises the following steps: s1: acquiring a local image of the PCB, and locking a position area where the residual copper is located; s2: acquiring the shape and the height of the residual copper; s3: controlling a milling cutter to repair the residual copper; after the PCB is imaged, the height data and the shape data of the residual copper are accurately obtained, the milling cutter is controlled to grind and remove the residual copper according to the height data and the shape data, and then the accurate repair of the PCB is completed, compared with the manual repair, the mechanical precision can be ensured, compared with the laser repair, the substrate of the PCB can be protected from being damaged, and the residual copper is removed more thoroughly by mechanical grinding in the scheme.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board), in particular to a method for repairing residual copper of a PCB.
Background
The PCB is used as a carrier for interconnecting electronic components, and if the precision of design and production does not reach the standard, the electronic components cannot work normally; in the process of manufacturing the PCB, the method comprises a plurality of steps of exposure, development, electroplating, etching and the like, and because of the yield problem of each preparation flow, redundant residual copper can form a conductive circuit and exist in the part of the PCB, so that the conductive condition exists in the originally designed non-communicated position, and the whole PCB is scrapped.
In the prior art, in order to repair the PCB board, the method is generally as follows: acquiring an image of the PCB to obtain a PCB image, and marking an area where residual copper is located on the PCB image through a residual copper detection system; residual copper is repaired and removed in a corresponding area of the position of the PCB by using a tool by a technician, but the method has extremely serious operation requirements on the technician, the PCB substrate is easily damaged by the technician who is not skilled, and the manual operation limitation is particularly prominent along with the arrangement requirement of high precision and high density of the circuit board; the method is characterized in that the method comprises the steps of carrying out laser ablation on residual copper, wherein the accuracy of the method is further improved, however, the thickness of the residual copper is not uniform, the energy of the laser is constant, the ablation time is difficult to control, if the ablation time is too long, the PCB is affected irreversibly, and if the ablation time is too short, the residual copper is easy to clean; therefore, there is a need for a method for repairing residual copper on a PCB, which can maintain repair accuracy without mechanical damage to a PCB substrate during repair.
Disclosure of Invention
In the technology, in the process of removing and repairing residual copper on the surface of a PCB, the limitation of manual repair cannot be broken through, the laser repair scheme cannot accurately remove the residual copper, the laser easily causes the technical problems of substrate damage and incomplete repair, and the invention provides a new solution.
In order to achieve the above purpose, the invention provides a method for repairing residual copper of a PCB, which comprises the following steps:
s1: acquiring a local image of the PCB, and locking a position area where the residual copper is located;
s2: acquiring the shape and the height of the residual copper;
s3: and controlling the milling cutter to repair the residual copper.
In step S1, a standard image of a PCB board is provided, the PCB board is scanned to obtain a comparison image, and the standard image is compared with the comparison image to obtain a location area where the residual copper is located.
As an improvement of the present invention, in step S2, after the shape of the residual copper is obtained by scanning, a first thickness and a second thickness are obtained, and a difference between the first thickness and the second thickness is a value of the height of the residual copper, where:
the first thickness is the thickness of the PCB substrate;
and the second thickness is the thickness of the PCB substrate and the residual copper overlapped.
As an improvement of the present invention, in step S3, a cutting surface of the milling cutter is attached to a surface of the residual copper, and a grinding depth of the milling cutter is a height value of the residual copper.
As an improvement of the present invention, in step S2, after the shape of the residual copper is obtained, calibration is performed on the residual copper shape image to obtain a first distance; in step S3, the face width of the milling cutter is adapted to the first distance.
As an improvement of the present invention, the milling cutter is provided on an XYZ motion platform.
As an improvement of the invention, the rotation parameter of the milling cutter is 100-1000r/min.
The beneficial effects of the invention are as follows: compared with the prior art, the method for repairing the residual copper of the PCB provided by the invention comprises the following steps: s1: acquiring a local image of the PCB, and locking a position area where the residual copper is located; s2: acquiring the shape and the height of the residual copper; s3: controlling a milling cutter to repair the residual copper; after the PCB is imaged, the height data and the shape data of the residual copper are accurately obtained, the milling cutter is controlled to grind and remove the residual copper according to the height data and the shape data, and then the accurate repair of the PCB is completed, compared with the manual repair, the mechanical precision can be ensured, compared with the laser repair, the substrate of the PCB can be protected from being damaged, and the residual copper is removed more thoroughly by mechanical grinding in the scheme.
Drawings
FIG. 1 is a process flow diagram of the present invention.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below with reference to the accompanying drawings.
In the following description, details of selected examples are given to provide a more thorough understanding of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. It should be understood that the detailed description is intended to illustrate the invention, and is not intended to limit the invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.
In the prior art, in order to repair a PCB, the method is as follows: acquiring an image of the PCB to obtain a PCB image, and marking an area where residual copper is located on the PCB image through a residual copper detection system; residual copper is repaired and removed in a corresponding area of the position of the PCB by using a tool by a technician, but the method has extremely serious operation requirements on the technician, the PCB substrate is easily damaged by the technician who is not skilled, and the manual operation limitation is particularly prominent along with the arrangement requirement of high precision and high density of the circuit board; the method is characterized in that the method comprises the steps of carrying out laser ablation on residual copper, wherein the accuracy of the method is further improved, however, the thickness of the residual copper is not uniform, the energy of the laser is constant, the ablation time is difficult to control, if the ablation time is too long, the PCB is affected irreversibly, and if the ablation time is too short, the residual copper is easy to clean; therefore, there is a need for a method for repairing residual copper on a PCB, which can maintain repair accuracy without mechanical damage to a PCB substrate during repair.
Aiming at the technical problems, the application provides a method for repairing residual copper of a PCB, which comprises the following steps:
s1: acquiring a local image of the PCB, and locking a position area where the residual copper is located;
s2: obtaining the shape and the height of the residual copper;
s3: the milling cutter is controlled to repair the residual copper;
it is easy to understand that after the PCB is imaged, the height data and the shape data of the residual copper are obtained, and the milling cutter is controlled to grind and remove the residual copper according to the height data and the shape data, so that the accurate repair of the PCB is finished, compared with the manual repair, the mechanical precision can be ensured, the long-time cultivation of technicians is not needed, the processing speed is higher, and the work is more stable; compared with laser repair, the substrate of the PCB can be protected from being damaged, and the residual copper is removed more thoroughly by mechanical grinding in the scheme.
The residual copper position of the PCB is observed and judged by naked eyes, the requirement on the working proficiency of technicians is high, and technicians with insufficient experience often have omission phenomenon, so as to be an improved embodiment of the invention, in the step S1, a standard image of the PCB is provided, the PCB is scanned to obtain a comparison image, and the standard image is compared with the comparison image to obtain a position area where the residual copper is located; it is easy to understand that the apparatus for scanning the PCB board may be an AOE inspection apparatus, the inspection apparatus automatically scans the PCB board by a camera, collects images, compares the tested solder joints with the standard images of the PCB board in a database, performs image comparison by image processing, inspects defects on the PCB board, and displays residual copper by a display or an automatic mark; by the method, the position of the residual copper on the PCB can be accurately locked, a corresponding residual copper area is obtained, and the shape, size and height parameters of the residual copper are measured, so that data support is provided for milling cutter grinding.
In the prior art, because copper plating thickness processes in the PCB preparation process are different, the situation of uneven thickness of the residual copper formed by imperfect mechanical error processes also occurs, so that the traditional laser repair needs to adjust a laser transmitter to a proper and stable frequency, the output energy is relatively fixed, the effect of the residual copper on receiving corresponding energy to ablate and remove the residual copper can be ensured because the energy reaches a certain value, the situation of excessive ablation cannot be ensured in thickness, and the influence on the base material of the PCB is caused; as an improved embodiment of the present invention, in step S2, after scanning the shape of the copper residue, a first thickness and a second thickness are obtained, wherein the difference between the first thickness and the second thickness is the value of the height of the copper residue, where: the first thickness is the thickness of the PCB substrate; the second thickness is the thickness of the PCB substrate and the residual copper superposed; to better explain the effect of the scheme of the invention, the following is applied to the first thickness and the second thicknessThickness measurement method and distance further explanation: the first laser thickness gauge and the second laser thickness gauge are arranged on the front surface and the back surface of the PCB, and at the moment, the distance between the first laser thickness gauge and the second laser thickness gauge is kept constant and marked as C; the first laser thickness gauge works to obtain the vertical distance A from the first laser thickness gauge to the front surface of the PCB, the second laser thickness gauge works to obtain the vertical distance B from the second laser thickness gauge to the back surface of the PCB, and the first thickness h 1 The calculation formula is as follows: h is a 1 =c- (a+b); obtaining the thickness of the region containing the residual copper by the method, namely the second thickness h 2 The calculation formula of the calculated height value of the residual copper height H is H=h 1 -h 2 The method comprises the steps of carrying out a first treatment on the surface of the The first laser thickness gauge and the second laser thickness gauge are of micron-level precision, and are specifically laser displacement sensors with the model number of M8 or M12 manufactured by Hangzhou eastern measuring instrument science and technology Co-ordinates; therefore, the first thickness and the second thickness are firstly obtained to obtain the height data of the residual copper, and then the accurate grinding is carried out through the milling cutter, so that the accurate removal of the residual copper with different thicknesses is realized, the manual mechanical removal clean characteristic and the laser repair accurate characteristic are compatible, and the PCB is not damaged secondarily.
More specifically, in step S3, the face of the milling cutter is attached to the surface of the residual copper, and the grinding depth of the milling cutter is the height value of the residual copper; it is easy to understand that the milling cutter is rotated to grind the residual copper on the surface of the protruded PCB, and the grinding depth is larger than the height value of the residual copper, so that irreversible damage to the surface of the PCB can be easily caused; the grinding depth is smaller than the height value of the residual copper, so that the residual copper is not thoroughly eliminated, and the hidden danger of short circuit caused by electrical connection continues to exist.
In order to further grind the residual copper clean, as an improved embodiment of the present invention, in step S2, after the shape of the residual copper is obtained, calibration is performed on the shape image formed by the residual copper to obtain a first distance; in step S3, the face radius of the milling cutter is adapted to the first distance; it is easy to understand that after the position and the height value of the residual copper are obtained, the residual copper is ground through the milling cutter, the area of the grinding surface of the milling cutter is close to the calibrated first distance, the grinding of a certain residual copper can be ensured at one time without multiple measurement, correspondingly, in actual production, the milling cutters with multiple groups of specifications are correspondingly customized and equipped, and after the first distance of the residual copper is marked, the milling cutters with similar specifications are selected for grinding the residual copper; specifically, for example, the shape image formed by the residual copper is calibrated, the calibration distance is calculated to obtain a first distance, and if the value of the first distance is 0.3mm, a milling cutter with the specification of 0.3mm is used for grinding, so that the residual copper is removed at one time.
In order to further and better complete the repairing work, as an improved embodiment of the invention, the milling cutter is arranged on the XYZ motion platform; it is easy to understand that the XYZ platform can flexibly move the milling cutter to realize the accurate repair of the PCB, wherein the milling cutter moves in the XY two directions and can accurately position a position area where the residual copper is located, and the milling cutter moves in the Z direction to grind the residual copper so as to finish the repair of the PCB.
As an improved embodiment of the invention, the rotation parameter of the milling cutter is 100-1000r/min; it is understood that if the rotation parameter of the milling cutter is higher than 1000r/min, the substrate of the PCB is affected by the higher contact temperature, and the service life of the milling cutter can be prolonged.
The invention has the advantages that:
1) Compared with manual repair, the method can ensure mechanical precision, does not need to culture technicians for a long time, has higher processing speed and more stable work; compared with laser repair, the method can protect the base material of the PCB from being damaged, and the mechanical grinding in the scheme can remove the residual copper more thoroughly;
2) Firstly, acquiring the first thickness and the second thickness to obtain the height data of the residual copper, and then precisely grinding the residual copper by a milling cutter to realize the precise removal of the residual copper with different thicknesses, so that the method is compatible with the manual mechanical removal clean characteristic and the laser repair precise characteristic, and the PCB is not damaged secondarily;
3) After the position and the height value of the residual copper are obtained, the residual copper is ground through the milling cutter, the area of the grinding surface of the milling cutter is close to the calibrated first distance, and the grinding of a certain residual copper can be ensured at one time.
The above disclosure is only a few specific embodiments of the present invention, but the present invention is not limited thereto, and any changes that can be thought by those skilled in the art should fall within the protection scope of the present invention.
Claims (7)
1. The method for repairing the residual copper of the PCB is characterized by comprising the following steps of:
s1: acquiring a local image of the PCB, and locking a position area where the residual copper is located;
s2: acquiring the shape and the height of the residual copper;
s3: and controlling the milling cutter to repair the residual copper.
2. The method for repairing residual copper on a PCB according to claim 1, wherein in step S1, a standard image of the PCB is provided, the PCB is scanned to obtain a comparison image, and the standard image is compared with the comparison image to obtain a position area where the residual copper is located.
3. The method for repairing residual copper on a PCB according to claim 1, wherein in step S2, the shape of the residual copper is obtained by scanning, and a first thickness and a second thickness are obtained, wherein a difference between the first thickness and the second thickness is a height value of the residual copper, and wherein:
the first thickness is the thickness of the PCB substrate;
and the second thickness is the thickness of the PCB substrate and the residual copper overlapped.
4. The method for repairing residual copper on a PCB according to claim 3, wherein in the step S3, a cutter surface of the milling cutter is attached to the surface of the residual copper, and a grinding depth of the milling cutter is a height value of the residual copper.
5. The method for repairing residual copper on a PCB according to claim 3, wherein in the step S2, after the shape of the residual copper is obtained, calibration is performed on the residual copper shape image to obtain a first distance; in step S3, the face width of the milling cutter is adapted to the first distance.
6. The method for repairing residual copper on a PCB according to claim 3, wherein the milling cutter is arranged on an XYZ motion platform.
7. The method for repairing residual copper on a PCB according to claim 1, wherein the rotation parameter of the milling cutter is 100-1000r/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310099981.9A CN116390364A (en) | 2023-02-06 | 2023-02-06 | Method for repairing residual copper of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310099981.9A CN116390364A (en) | 2023-02-06 | 2023-02-06 | Method for repairing residual copper of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116390364A true CN116390364A (en) | 2023-07-04 |
Family
ID=86960470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310099981.9A Pending CN116390364A (en) | 2023-02-06 | 2023-02-06 | Method for repairing residual copper of PCB |
Country Status (1)
| Country | Link |
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| CN (1) | CN116390364A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4691426A (en) * | 1986-03-05 | 1987-09-08 | Ibm Corporation | Repair of strip conductor on electrical circuit board |
| JPH07131137A (en) * | 1993-10-29 | 1995-05-19 | Hitachi Ltd | Apparatus and method for correcting wiring board |
| CN108990299A (en) * | 2018-07-27 | 2018-12-11 | 广东工业大学 | A kind of laser amendment pcb board defect method based on image detection |
| CN110636707A (en) * | 2019-09-25 | 2019-12-31 | 萍乡市丰达兴线路板制造有限公司 | Method for improving residual copper in half-hole plate of PCB (printed circuit board) |
| CN111867268A (en) * | 2020-07-07 | 2020-10-30 | 深圳市睿达科技有限公司 | Method for repairing PCB (printed Circuit Board) by laser |
| CN113473741A (en) * | 2021-05-31 | 2021-10-01 | 广州广合科技股份有限公司 | Processing method of golden finger lead and circuit board |
| CN215935186U (en) * | 2021-10-20 | 2022-03-01 | 梅州鼎泰电路板有限公司 | Local prosthetic devices of circuit board |
| CN115283733A (en) * | 2022-08-11 | 2022-11-04 | 深圳市欧姆斯科技有限公司 | Be used for automatic repair equipment of printed circuit board product defect |
-
2023
- 2023-02-06 CN CN202310099981.9A patent/CN116390364A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4691426A (en) * | 1986-03-05 | 1987-09-08 | Ibm Corporation | Repair of strip conductor on electrical circuit board |
| JPH07131137A (en) * | 1993-10-29 | 1995-05-19 | Hitachi Ltd | Apparatus and method for correcting wiring board |
| CN108990299A (en) * | 2018-07-27 | 2018-12-11 | 广东工业大学 | A kind of laser amendment pcb board defect method based on image detection |
| CN110636707A (en) * | 2019-09-25 | 2019-12-31 | 萍乡市丰达兴线路板制造有限公司 | Method for improving residual copper in half-hole plate of PCB (printed circuit board) |
| CN111867268A (en) * | 2020-07-07 | 2020-10-30 | 深圳市睿达科技有限公司 | Method for repairing PCB (printed Circuit Board) by laser |
| CN113473741A (en) * | 2021-05-31 | 2021-10-01 | 广州广合科技股份有限公司 | Processing method of golden finger lead and circuit board |
| CN215935186U (en) * | 2021-10-20 | 2022-03-01 | 梅州鼎泰电路板有限公司 | Local prosthetic devices of circuit board |
| CN115283733A (en) * | 2022-08-11 | 2022-11-04 | 深圳市欧姆斯科技有限公司 | Be used for automatic repair equipment of printed circuit board product defect |
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