CN116390356A - Manufacturing method of double-sided thick copper circuit board and circuit board - Google Patents
Manufacturing method of double-sided thick copper circuit board and circuit board Download PDFInfo
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- CN116390356A CN116390356A CN202310454374.XA CN202310454374A CN116390356A CN 116390356 A CN116390356 A CN 116390356A CN 202310454374 A CN202310454374 A CN 202310454374A CN 116390356 A CN116390356 A CN 116390356A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 85
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 54
- 239000010949 copper Substances 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 88
- 229920005989 resin Polymers 0.000 claims abstract description 69
- 239000011347 resin Substances 0.000 claims abstract description 69
- 239000000463 material Substances 0.000 claims abstract description 55
- 238000000034 method Methods 0.000 claims abstract description 54
- 238000005553 drilling Methods 0.000 claims abstract description 52
- 238000005520 cutting process Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 238000009832 plasma treatment Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 36
- 238000012545 processing Methods 0.000 abstract description 8
- 238000005429 filling process Methods 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 description 34
- 239000002184 metal Substances 0.000 description 34
- 239000011889 copper foil Substances 0.000 description 31
- 238000005530 etching Methods 0.000 description 19
- 238000003475 lamination Methods 0.000 description 8
- 238000007689 inspection Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The application is applicable to the technical field of circuit board manufacturing, and provides a double-sided thick copper circuit board manufacturing method and a circuit board, wherein the double-sided thick copper circuit board manufacturing method comprises the following steps: providing a substrate; drilling the substrate for the first time to form a first hole; filling a resin material in the first hole; performing circuit fabrication on a substrate; drilling a second hole at the first hole to form a second hole, wherein the second hole is coaxially arranged with the first hole, and the diameter of the second hole is larger than that of the first hole; routing processing is carried out on the substrate; the circuit board is manufactured by a manufacturing method of a double-sided thick copper circuit board; according to the method, the quality of the circuit board is improved, the process cost is reduced, and the production efficiency is improved by arranging the two drilling processes and the resin filling process.
Description
Technical Field
The application relates to the technical field of circuit board manufacturing, in particular to a manufacturing method of a double-sided thick copper circuit board and the circuit board.
Background
At present, the aperture forming mode in the printed circuit board industry is generally manufactured by adopting a mechanical drilling mode, and in the process of processing the double-sided thick copper metal base layer by adopting a normal method, drilling is generally performed by adopting a mode of laying a base plate up and down and a backing plate; the double-sided thick copper plate is suspended due to the height difference between the drilling position and the circuit etching position, and when the drill bit drills to the medium layer on the bottom surface, the medium layer cannot be stressed and falls off, so that the medium is removed; meanwhile, the metal of the inner layer cannot be stressed because the metal cannot be contacted with the base plate at the bottom, so that metal scraps protrude out to push the dielectric layer, the falling area of the dielectric layer is increased, and a burr is formed.
Disclosure of Invention
Aiming at the problems, the application provides a manufacturing method of a double-sided thick copper circuit board and the circuit board, which at least solve the problems of medium dropping and flash in the existing double-sided copper circuit board processing process.
The embodiment of the application provides a manufacturing method of a double-sided thick copper circuit board, which comprises the following steps:
providing a substrate;
drilling the substrate for the first time to form a first hole;
filling a resin material in the first hole;
performing circuit fabrication on the substrate;
drilling a second hole at the first hole to form a second hole, wherein the second hole is coaxially arranged with the first hole, and the diameter of the second hole is larger than that of the first hole;
and carrying out routing treatment on the substrate.
In one embodiment, at least one side of the resin material is flush with the surface of the substrate.
In one embodiment, filling the first hole with a resin material includes: a screen plate is covered on one side of the substrate, the screen plate includes a through hole opposite to the first hole, and the resin material enters the first hole through the through hole.
In an embodiment, the diameter of the through hole is smaller than the diameter of the first hole, and the diameter of the first hole is smaller than the diameter of the second hole.
In an embodiment, the diameter of the through hole is 0.4mm + -0.1 mm smaller than the diameter of the first hole, and the diameter of the first hole is 0.4mm + -0.1 mm smaller than the diameter of the second hole.
In one embodiment, in the step of drilling the second time, the drilling machine with a CMK index greater than or equal to 2.0 is used to drill the second time.
In one embodiment, the steps of cutting and forming the substrate include: sequentially carrying out material cutting, pretreatment of lamination, prestack and lamination to obtain the substrate.
In one embodiment, the steps of cutting and forming the substrate include: sequentially carrying out material cutting and prestack;
the manufacturing method of the double-sided thick copper circuit board further comprises a pressing pretreatment before the first hole is filled with the resin material;
the method for manufacturing the double-sided thick copper circuit board further comprises pressing after the first hole is filled with the resin material.
In one embodiment, the method for manufacturing a double-sided thick copper circuit board further includes, before the circuit is formed on the substrate: and sequentially carrying out leveling treatment and plasma treatment on the substrate.
In one embodiment, after the routing process is performed on the substrate, the method for manufacturing a double-sided thick copper circuit board further includes: and testing, shipment inspection and packaging are sequentially carried out on the substrate.
The embodiment of the application also provides a circuit board which is manufactured by the manufacturing method of the double-sided thick copper circuit board.
The method aims at solving the problems of medium dropping and burr occurrence in the existing double-sided copper circuit board processing process, and is characterized in that a first hole is drilled before etching, resin is filled in the first hole, a metal base layer and a medium layer are supported through the resin, compared with the process of directly drilling holes in a substrate, the resistance of a drill bit can be reduced through the resin material, and the problems of medium dropping and burr occurrence caused by the fact that the metal base layer and the medium layer lack of support when a second hole is formed by carrying out second hole drilling after etching are avoided;
this application has improved circuit board quality through setting up twice drilling process and resin filling process, has reduced the process cost, has improved production efficiency, and the practicality is strong.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required for the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a conventional method for fabricating a double-sided thick copper circuit board during drilling.
Fig. 2 is a schematic flow chart of a method for manufacturing a double-sided thick copper circuit board according to an embodiment of the present application.
Fig. 3 is a schematic view of the double-sided thick copper circuit board shown in fig. 2 in the first hole manufacturing method.
FIG. 4 is a schematic diagram of the method for manufacturing the double-sided thick copper circuit board shown in FIG. 2, in which the screen plate covers the substrate.
Fig. 5 is a schematic diagram of a second hole in the method for manufacturing a double-sided thick copper circuit board shown in fig. 2.
The meaning of the labels in the figures is:
100. a circuit board;
10. a substrate; 11. a metal base layer; 12. a dielectric layer; 13. copper foil;
20. a first hole;
30. a second hole;
40. a screen plate; 41. and a through hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings, i.e. embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper," "lower," "left," "right," and the like are used for convenience of description based on the orientation or positional relationship shown in the drawings, and do not denote or imply that the devices or elements in question must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be construed as limiting of the patent. The terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless specifically defined otherwise.
It should be further noted that, in the embodiments of the present application, the same reference numerals denote the same components or the same parts, and for the same parts in the embodiments of the present application, reference numerals may be given to only one of the parts or the parts in the drawings by way of example, and it should be understood that, for other same parts or parts, the reference numerals are equally applicable.
At present, the aperture forming mode in the printed circuit board industry is generally manufactured by adopting a mechanical drilling mode, and in the process of processing the double-sided thick copper metal base layer by adopting a normal method, holes are usually drilled by adopting a mode of backing plates on the upper side and the lower side of a substrate, and the problem that a medium and a burr are formed at the position of a hole opening of the bottom surface of the hole is solved.
Referring to fig. 1, the double-sided thick copper plate has a height difference due to a drilling position and a circuit etching position, a substrate at the drilling position cannot be contacted with a base plate at the bottom, so that the drilling position is suspended and lacks support of the base plate, and when a drill bit drills to a medium layer at the bottom, the medium layer cannot be stressed and falls off due to the lack of support, so that a medium falling condition is formed; meanwhile, the metal base layer of the inner layer at the drill hole position cannot be stressed due to the fact that the metal base layer cannot be contacted with the base plate at the bottom, so that metal scraps protrude out and push away the dielectric layer, the shedding area of the dielectric layer is increased, and a burr is formed.
Therefore, the application provides a manufacturing method of a double-sided thick copper circuit board and the circuit board, wherein first drilling is performed before etching, resin is filled in the first hole, support is provided for a metal base layer and a dielectric layer through the resin, the problem that the metal base layer and the dielectric layer lack support to cause medium dropping and burr when the second hole is formed by performing second drilling after etching is avoided, the quality of the circuit board is improved, the process cost is reduced, and the production efficiency is improved.
For the purpose of illustrating the technical solutions described in this application, reference is made to the following description taken in conjunction with the accompanying drawings and examples.
Referring to fig. 2, in a first embodiment of the present application, a method for manufacturing a double-sided thick copper circuit board is provided, in which a first hole is drilled before etching, and a first hole 20 is filled with a resin, and the resin is used to provide support for a metal base layer 11 and a dielectric layer 12, so as to avoid the problem that the metal base layer 11 and the dielectric layer 12 lack of support during a second hole after etching, and thus the dielectric and the flash are removed, and a plurality of specific embodiments will be provided in the following application.
Referring to fig. 2, an embodiment of the first aspect of the present application proposes a method for manufacturing a double-sided thick copper circuit board, which performs a first drilling operation before etching, fills resin in the first hole 20, and provides support for the metal base layer 11 and the dielectric layer 12 through the resin, so as to avoid the problem of dielectric loss and flash caused by lack of support for the metal base layer 11 and the dielectric layer 12 in the second hole 30 after etching.
It can be understood that, for the double-sided thick copper circuit board with the thickness of the copper foil 13 being greater than or equal to 75 μm, the distance between the dielectric layer 12 and the pad is greater, and the situation of medium and flash drop is more serious, so the manufacturing method of the double-sided thick copper circuit board provided by the embodiment of the first aspect of the application can be applied to the circuit board processing process with the thickness of the copper foil 13 being less than 75 μm, and can also be applied to the circuit board processing process with the thickness of the copper foil 13 being greater than or equal to 75 μm, and has better effects of medium drop and flash drop improvement for the double-sided thick copper circuit board with the thickness of the copper foil 13 being greater than or equal to 75 μm.
The present application will now provide further description of a number of specific embodiments.
Example 1
The manufacturing method of the double-sided thick copper circuit board provided by the embodiment comprises the following steps:
s210: a substrate 10 is provided.
The step is a step of forming the substrate 10, and optionally, the substrate 10 includes a copper foil 13, a dielectric layer 12, a metal base layer 11, a dielectric layer 12 and a copper foil 13 which are sequentially stacked, the structure of the substrate 10 is not limited thereto, and in other embodiments, the substrate 10 may further include a solder resist layer, a glue layer, a glass fiber board, a silk screen layer, and the like, and the substrate 10 may also include a plurality of copper layers, not limited to two copper layers.
Referring to fig. 3, the copper foil 13, which is a conductor of the circuit board 100, is easily adhered to the insulating layer and receives the printed protection layer, and the copper foil 13 can form a circuit pattern after etching; the drilling mode of the upper and lower pad plates is to set pad plates outside the copper foils 13 at two sides of the metal base layer 11, wherein the dielectric layer 12 below the metal base layer 11 is called a bottom dielectric layer, and the copper foils 13 below the bottom dielectric layer are called bottom copper foils.
S220: the substrate 10 is first drilled to form a first hole 20.
In this step, the first hole 20 penetrates the entire substrate 10, that is, if the substrate 10 includes the copper foil 13, the dielectric layer 12, the metal base layer 11, the dielectric layer 12, and the copper foil 13 stacked in this order, the first hole 20 penetrates each of the copper foil 13, the dielectric layer 12, and the metal base layer 11.
In this step, the substrate 10 is not yet subjected to the etching process and is in a copper-containing state of the whole board, i.e. the copper foil 13 is in a complete layered structure in this step, the bottom copper foil at the drilling position can be in contact with the bottom pad, the pad can provide support for the bottom copper foil, and the bottom copper foil provides support for the bottom dielectric layer, so as to ensure that no dielectric loss or flash formation occurs after the first drilling.
S230: the first hole 20 is filled with a resin material.
The step is to perform hole plugging operation on the first hole 20 by using a resin material, wherein the resin material in the step can provide support for the bottom copper foil and the bottom dielectric layer during the subsequent second hole 30, reduce the resistance of a drill bit, prevent impurities from entering the first hole 20 during the subsequent process, effectively prevent circuit signals from being damaged, and maintain the surface of the substrate 10 to be flat; filling the first hole 20 with a resin material can improve the plumpness of the hole, and the resin material has better corrosion resistance than green oil and can better protect the first hole 20.
In the step, filling resin material can be through aluminum sheet plugging or silk screen plugging, or through a vacuum resin plugging machine or other processes.
The resin material can be epoxy resin or other various resin materials, and the resin material specifically should be selected from resin materials with small thermal expansion coefficient and low water absorption rate, and the glass transition temperature and thermal expansion coefficient of the resin material and the dielectric layer 12 should be similar, so as to avoid the occurrence of layered explosion caused by expansion of different degrees after being heated.
S240: the wiring is performed on the substrate 10.
In this step, a circuit may be formed on the substrate 10 through processes such as an outer dry film circuit, an outer etching, a solder resist, a character, etc., that is, a circuit is manufactured on the copper foil 13, and a large board of the circuit board 100 is obtained after this step; in some embodiments, the overflowed resin may also be removed by plasma, drilling, etc. to have the effect of planarizing the substrate 10 before the wiring is formed.
S250: a second drilling is performed at the first hole 20 to form a second hole 30, the second hole 30 being disposed coaxially with the first hole 20 and the second hole 30 having a diameter larger than that of the first hole 20.
In this step, the second hole 30 formed by the second drilling operation covers the first hole 20, and finally only the second hole 30 is left on the substrate 10, specifically, the drill tip of the drill may be coaxially aligned with the first hole 20, and the diameter of the second drilled hole is made to be greater than or equal to the diameter of the first hole 20 to achieve the coverage of the first hole 20 by the second hole 30.
After S240, in S250, the bottom dielectric layer beside the first hole 20 will be in a suspended state, but the resin material in the first hole 20 can provide a certain support for the bottom dielectric layer, and in the second drilling, the resin material in the first hole 20 can be subjected to hole bottom stress, and compared with the resistance of the drill bit when the whole substrate 10 is drilled being the resistance of the metal base layer 11, the resistance of the drill bit in the second drilling is mainly the resistance of the resin material, the resistance is smaller and the generated heat is smaller, thereby being capable of improving the conditions of medium dropping and flash.
It will be appreciated that the second hole 30 obtained after the second drilling operation is the finished hole.
S260: the substrate 10 is subjected to a routing process.
This step is used to cut the substrate 10 as needed, and may be performed using a routing machine or other cutting equipment, and the circuit board 100 is obtained after this step.
It will be appreciated that after S260, testing, quality detection or other steps may also be included.
In this embodiment, the first drilling operation is performed before the etching of the substrate 10, and at this time, the substrate 10 is in a copper-containing state of the whole board because the substrate is not etched yet, and the bottom dielectric layer and the bottom copper foil at the hole site can be contacted with and supported by the bottom pad during the first drilling operation, so that the conditions of dielectric loss and flash are not formed during the first drilling operation; and then the first hole 20 is filled with resin, and the metal base layer 11 and the dielectric layer 12 are supported by the resin, so that the problems of dielectric loss and flash caused by the lack of support of the metal base layer 11 and the dielectric layer 12 in the second hole 30 after etching are solved, the quality of the circuit board 100 is improved, the process cost is reduced, and the production efficiency is improved.
Referring to fig. 4, in an embodiment, before filling the resin material in the first hole 20 in S230, S230 further includes covering the mesh plate 40 on one side of the substrate 10, the mesh plate 40 is specifically covered on the outer side of the copper foil 13 above the metal base layer 11, the mesh plate 40 is provided with the through holes 41 opposite to the first hole 20, and after the mesh plate 40 covers the substrate 10, the through holes 41 are opposite to and communicate with the first hole 20, and the resin material can enter into the first hole 20 through the through holes 41.
In some embodiments, at least one side of the resin material is flush with the surface of the substrate 10, i.e., the resin material may be flush with the surface of the substrate 10 on only one side, or the resin material may be flush with the surface of the substrate 10 on both sides; it will be appreciated that when only one side of the resin material is flush with the surface of the substrate 10, the drill should be driven into the second hole in S250 from the side of the resin material not flush with the substrate 10 so that the side of the resin material flush with the substrate 10 provides support for the bottom dielectric layer and bottom copper foil.
Specifically, the resin material enters the first hole 20 through the through hole 41 of the mesh plate 40 and protrudes from the side of the substrate 10 away from the mesh plate 40, and the portion of the resin material protruding from the first hole 20 can be flush with the bottom copper foil, i.e. the resin material can be in contact with the bottom pad, so as to provide support for the hole site during the second drilling.
In some embodiments, the resin material plugging of the first holes 20 may be performed using a vacuum resin plugging machine, which can reduce holes and bubbles in the resin material.
In some embodiments, after the resin material fills the first hole 20, the first hole 20 may be inspected by an automatic optical inspection apparatus to confirm whether a hole plugging failure exists.
Referring to fig. 4, in some embodiments, the diameter of the through hole 41 is smaller than that of the first hole 20 to reduce flash occurring during the filling of the resin material, thereby reducing the influence on the subsequent grinding process; further, the diameter of the through hole 41 is smaller than the diameter of the first hole 20 by 0.4mm ±0.1mm, and specifically, the difference between the diameter of the first hole 20 and the diameter of the through hole 41 may be 0.3mm, 0.4mm, 0.5mm, or the like.
In some embodiments, in S230, before the screen 40 is covered on one side of the substrate 10, S230 further includes a film-sticking process, in particular, film-sticking on the outer side of the copper foil 13 above the metal base layer 11 to prevent the resin material from overflowing during the filling process; further, after the mesh plate 40 is covered on one side of the substrate 10, S230 further includes a film tearing process for removing the film attached to the outer side of the copper foil 13.
Referring to fig. 5, in some embodiments, the diameter of the first holes 20 is smaller than the diameter of the second holes 30 to avoid resin residue within the second holes 30; further, the diameter of the first hole 20 is 0.4 mm.+ -. 0.1mm smaller than the diameter of the second hole 30, and specifically, the difference between the diameter of the second hole 30 and the diameter of the first hole 20 may be 0.3mm, 0.4mm, 0.5mm, etc.
In some embodiments, in the step of drilling for the second time, that is, in S250, a drilling machine with a CMK index greater than or equal to 2.0 is used to perform drilling for the second time, where the CMK index is a machine capability index, and the greater the CMK index, the better the machining consistency and the higher the precision of the equipment, and the less the error influence of the machining equipment on the machined workpiece; since the second hole 30 needs to cover the first hole 20 to leave only the second hole 30 on the substrate 10 and remove the resin material, the drill tip needs to be aligned with the first hole 20 and coaxial with the first hole 20 during the second drilling operation, and the use of the device with high CMK index can improve the accuracy of the second drilling operation, reduce errors, and better avoid the resin material remaining in the second hole 30.
Referring to fig. 5, in some embodiments, the ratio of the resin material in the region covered by the projection of the drill tip onto the substrate 10 during the second drilling operation is in the range of 94% to 96%, which is positively correlated with the difference in diameter between the first hole 20 and the second hole 30, and which ensures that the drill tip is less resistant during the second drilling operation, thereby avoiding dropping the bottom dielectric layer, improving the dielectric drop, and reducing the formation of burrs.
In one embodiment, in S210, the step of providing the substrate 10 includes sequentially performing the steps of dicing, pre-lamination, and lamination.
In the blanking step, the core board and the metal substrate 10 are cut according to design processing requirements.
In the pre-press treatment step, the metal substrate 10 is treated to increase the bonding force of the metal substrate 10.
In the pre-lamination step, the treatment is performed in accordance with a laminate structure, which in this application includes a copper foil 13, a dielectric layer 12, a metal base layer 11, a dielectric layer 12, and a copper foil 13, which are laminated in this order.
In the lamination step, the copper foil 13 and the dielectric layer 12 are laminated on opposite sides of the metal base layer 11.
In one embodiment, the method of manufacturing a double-sided thick copper circuit board further includes sequentially performing a planarization process and a plasma process on the substrate 10 before S240.
Wherein the flattening process is for grinding off the resin material overflowed on the substrate 10; the plasma treatment is used to further remove the resin material not worn off on the substrate 10.
In one embodiment, in S240, the step of performing the circuit fabrication on the substrate 10 includes sequentially performing the browning process, the drilling process, the edge milling process, the dry film pasting process, the etching process, the outer layer recognition process, the solder mask process, and the character formation process on the substrate 10.
Wherein the browning treatment can increase the roughness of the copper surface of the resin material and the substrate 10 so as to improve the bonding force of the substrate 10; the drilling process is used to form a target hole on the substrate 10, and the target hole may be formed by an X-Ray drilling machine; the edge milling process is used for removing redundant frame scraps of the substrate 10; the outer layer circuit can be obtained after the dry film is coated and the etching treatment; the outer layer identification is used for detecting and confirming whether the outer layer circuit meets the design requirement or not, and the outer layer identification step can be detected through the remembering of automatic optical detection equipment; the solder resist process is used for forming a solder resist layer on the outer layer of the substrate 10; the formation of characters for forming characters such as element numbers on the substrate 10 may be performed by a laser character screen printer or other character screen printing apparatus.
In one embodiment, after S260, the method for manufacturing a double-sided thick copper circuit board further includes sequentially testing, shipment inspection and packaging the substrate 10, wherein the testing step and the shipment inspection step are used for quality inspection of the circuit board 100, for example, detecting information such as appearance and quantity of the circuit board 100 and attaching information labels.
Example two
Referring to fig. 2, the method for manufacturing a double-sided thick copper circuit board according to the present embodiment includes:
s210: providing a substrate 10;
s220: drilling the substrate 10 for the first time to form a first hole 20;
s230: filling the first hole 20 with a resin material;
s240: performing circuit fabrication on the substrate 10;
s250: drilling a second time at the first hole 20 to form a second hole 30, the second hole 30 being coaxially disposed with the first hole 20 and the second hole 30 having a diameter larger than the first hole 20;
s260: the substrate 10 is subjected to a routing process.
Unlike the first embodiment, in S210, the step of providing the substrate 10 includes the steps of dicing and prestack, which are sequentially performed.
After S220 and before S230, the method for manufacturing a double-sided thick copper circuit board further includes a pre-lamination process; after S230, the method for manufacturing a double-sided thick copper circuit board further includes lamination.
In this embodiment, the first hole is drilled before etching, and the first hole 20 is filled with resin, so that the resin provides support for the metal base layer 11 and the dielectric layer 12, and the problem that the metal base layer 11 and the dielectric layer 12 lack support to cause dielectric loss and flash when the second hole 30 is formed by drilling after etching is avoided.
The second aspect of the present invention further provides a circuit board 100, where the circuit board 100 is manufactured by the manufacturing method of the circuit board 100 provided in the first aspect, the circuit board 100 may be a double-sided thick copper circuit board, and the thickness of the copper foil 13 is greater than or equal to 75 μm, and the circuit board 100 may also be other circuit boards; the second hole 30 of the circuit board 100 is not easy to have medium drop and is not easy to form a flash.
The above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.
Claims (10)
1. A method for manufacturing a double-sided thick copper circuit board, comprising:
providing a substrate;
drilling the substrate for the first time to form a first hole;
filling a resin material in the first hole;
performing circuit fabrication on the substrate;
drilling a second hole at the first hole to form a second hole, wherein the second hole is coaxially arranged with the first hole, and the diameter of the second hole is larger than that of the first hole;
and carrying out routing treatment on the substrate.
2. The method of manufacturing a double-sided thick copper circuit board according to claim 1, wherein at least one side of the resin material is flush with the surface of the substrate.
3. The method of manufacturing a double-sided thick copper circuit board according to claim 1, wherein filling the first hole with a resin material comprises: a screen plate is covered on one side of the substrate, the screen plate includes a through hole opposite to the first hole, and the resin material enters the first hole through the through hole.
4. The method of manufacturing a double-sided thick copper circuit board according to claim 3, wherein the diameter of the through hole is smaller than the diameter of the first hole.
5. The method of manufacturing a double-sided thick copper circuit board according to claim 3, wherein the diameter of the through hole is 0.4mm ± 0.1mm smaller than the diameter of the first hole, and the diameter of the first hole is 0.4mm ± 0.1mm smaller than the diameter of the second hole.
6. The method of manufacturing a double-sided thick copper circuit board according to claim 1, wherein in the step of drilling the holes for the second time: and drilling for the second time by using a drilling machine with the CMK index being greater than or equal to 2.0.
7. The method of manufacturing a double-sided thick copper circuit board according to claim 1, wherein the providing a substrate comprises: and sequentially carrying out material cutting, pressing pretreatment, prestack and pressing to obtain the substrate.
8. The method of manufacturing a double-sided thick copper circuit board according to claim 1, wherein the providing a substrate comprises: sequentially carrying out material cutting and prestack;
the manufacturing method of the double-sided thick copper circuit board further comprises a pressing pretreatment before the first hole is filled with the resin material;
the method for manufacturing the double-sided thick copper circuit board further comprises pressing after the first hole is filled with the resin material.
9. The method of manufacturing a double-sided thick copper circuit board according to claim 1, further comprising, prior to the wiring on the substrate: and sequentially carrying out leveling treatment and plasma treatment on the substrate.
10. A circuit board characterized by being manufactured by the double-sided thick copper circuit board manufacturing method according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310454374.XA CN116390356A (en) | 2023-04-24 | 2023-04-24 | Manufacturing method of double-sided thick copper circuit board and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310454374.XA CN116390356A (en) | 2023-04-24 | 2023-04-24 | Manufacturing method of double-sided thick copper circuit board and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116390356A true CN116390356A (en) | 2023-07-04 |
Family
ID=86965691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310454374.XA Pending CN116390356A (en) | 2023-04-24 | 2023-04-24 | Manufacturing method of double-sided thick copper circuit board and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116390356A (en) |
-
2023
- 2023-04-24 CN CN202310454374.XA patent/CN116390356A/en active Pending
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