CN116387195A - Dispensing type die bonder and die bonding method - Google Patents

Dispensing type die bonder and die bonding method Download PDF

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Publication number
CN116387195A
CN116387195A CN202310263584.0A CN202310263584A CN116387195A CN 116387195 A CN116387195 A CN 116387195A CN 202310263584 A CN202310263584 A CN 202310263584A CN 116387195 A CN116387195 A CN 116387195A
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dispensing
die
clamping jaw
position information
bonding
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CN202310263584.0A
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何祥
黄道平
刘少君
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South China University of Technology SCUT
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South China University of Technology SCUT
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Priority to CN202310263584.0A priority Critical patent/CN116387195A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Die Bonding (AREA)

Abstract

The invention discloses a dispensing type die bonder and a die bonding method, wherein the die bonder comprises a conveying track, a feeding mechanism, a dispensing mechanism and a die picking mechanism, wherein the die bonding mechanism, a discharging mechanism, a clamping jaw conveying mechanism, a driving motor and a pneumatic device; the clamping jaw carrying mechanism is arranged on one side of the carrying track; the conveying track extends along the x-axis direction, and the feeding mechanism, the dispensing mechanism, the crystal taking mechanism, the crystal fixing mechanism and the discharging mechanism are sequentially arranged along the conveying track. All stations are sequentially arranged along the carrying track in the x direction, the vision positioning mechanism mainly plays a role in assisting in positioning other mechanical mechanisms, and the accuracy of the chip position to be picked and the accuracy of chip placement are guaranteed by guaranteeing the accuracy of the dispensing position, so that the die bonding accuracy is improved.

Description

Dispensing type die bonder and die bonding method
Technical Field
The invention relates to the technical field of die bonding equipment, in particular to a dispensing die bonder and a die bonding method.
Technical Field
The semiconductor industry in China is rapidly developing, and the packaging technology is an important link affecting the development of the semiconductor industry. The advantages and disadvantages of the packaging technology of the semiconductor are critical competitive factors, and compared with most semiconductor mechanical equipment in the market, the die bonder has obvious advantages of die bonding precision, speed, stability and the like.
The existing fixing mode is to attach the chip by heating the frame, firstly heating the carrying rail carrier, then blowing through the nitrogen supply mechanism, isolating the frame from oxygen to prevent the frame from oxidization, melting the surface material of the frame at high temperature, and attaching the chip to the frame. And the blowing cost of the nitrogen supply mechanism is higher, and the heating mode can damage some devices so that the service life of the machine is reduced.
In the conventional die bonder die bonding process, chips on a wafer are generally fixed at die bonding positions (CN 202210772025.8) on a substrate or a material sheet through a rocker arm and a suction nozzle, firstly, the rocker arm drives the suction nozzle to move downwards to suck the chips on the wafer, then, the rocker arm swings and drives the suction nozzle to rotate (the rocker arm swings to drive the suction nozzle to rotate and simultaneously, the suction nozzle also makes ascending motion), the chips are sent to the upper part of the material sheet, and then, the rocker arm drives the suction nozzle to move downwards to fix the chips on the material sheet; generally, the swing time of the rocker arm is between 150ms and 250ms, and when the chip is sucked or fixed on the material sheet, the suction nozzle needs to stop for tens of milliseconds or even tens of milliseconds, so that the swing time of the rocker arm can be prolonged, and each time one chip is fixed, the suction nozzle needs to go through once stopping, sucking the chip and once stopping to fix the chip on the material sheet, thus affecting the die bonding efficiency, and the die bonding speed can not be ensured.
Disclosure of Invention
Aiming at the defects, the invention provides a dispensing type die bonder and a die bonding method, and the bonding of the wafer is firmer by dispensing on the bonding pad of the material sheet, so that the die bonding quality is improved. On the other hand, the invention adopts a double-dispensing mechanism to dispense glue, and the die bonding speed is also improved. And the dispensing type die bonder can be used in various fields such as LEDs, ICs and the like.
The invention is realized at least by one of the following technical schemes.
A dispensing type die bonder comprises a carrying track, a feeding mechanism, a dispensing mechanism, a die picking mechanism, a die bonding mechanism, a discharging mechanism, a clamping jaw carrying mechanism, a driving motor and a pneumatic device; the clamping jaw carrying mechanism is arranged on one side of the carrying track; the transport track extends along x axis direction, along the transport track follow set gradually feed mechanism, point gum machine constructs, get brilliant mechanism, solid brilliant mechanism, discharge mechanism, point gum machine constructs and solid brilliant mechanism is located and is listed on the transport track, gets brilliant mechanism and is located one side of transport track.
Further, the feeding mechanism comprises a material frame for placing the material sheets, a material absorber and a metal sensor positioned at the starting end of the conveying track, one end of the material absorber is used for taking materials from the material frame, the other end of the material absorber is connected with the pneumatic device, the material absorber is positioned right above the material frame when initialized, the material absorber is parallel to the material frame, and the material absorber sucks materials downwards.
Further, the material sheet is a raw material of the die bonder, the material sheet is provided with n rows of m rows of bonding pads, the n rows of bonding pads are arranged along the x direction, the m rows of bonding pads are arranged along the y direction, wherein m is more than or equal to 1, n is more than or equal to 1, and n and m are natural numbers.
Further, the dispensing mechanism comprises a dispensing device and a dispensing vision device positioned below the dispensing device, and the dispensing vision device comprises a first camera positioned above the carrying track; the dispensing mechanism is connected with the driving motor;
the dispensing mechanism further comprises a dispensing limiting plate arranged on the carrying track, and the dispensing device is arranged on the carrying track in parallel corresponding to the dispensing limiting plate and is smaller than the material sheet in length.
Further, the dispensing device comprises a dispensing arm, a triaxial manipulator driving the dispensing arm to move, a dispensing needle, a syringe and a dispensing needle, wherein the syringe is arranged at the tail end of the syringe, the syringe is arranged at the free end of the dispensing arm, and the triaxial manipulator is connected with a driving motor.
Further, the clamping jaw carrying mechanism comprises four clamping jaws which are connected with the linear motor, and the clamping jaws are driven by the linear motor to move on the screw rod so as to drive the material sheets to reach each station; the first clamping jaw drives the material sheet to move from the feeding mechanism to the dispensing mechanism, the second clamping jaw drives the material sheet to move from the dispensing mechanism to the die bonding mechanism, and the third clamping jaw and the fourth clamping jaw drive the material sheet to move from the die bonding mechanism to the discharging mechanism.
Further, the crystal taking mechanism comprises a crystal round platform device, a thimble device positioned below the crystal round platform device and a crystal taking vision device positioned above the crystal round platform device; the crystal taking vision device comprises a second camera, and the thimble device and the crystal taking vision device are positioned on the same straight line; the wafer table device comprises a wafer disc, and a blue film containing chips is covered on the wafer disc; the crystal taking vision device, the crystal table device and the thimble device are all connected with the driving motor.
Further, the die bonding mechanism comprises a welding head device, a die bonding vision device and a die bonding limiting plate arranged on the carrying track, wherein the die bonding limiting plate limits the welding head to move and limit; the die bonding vision device comprises a third camera, the third camera is arranged right above the carrying track and is aligned to a die bonding limiting plate on the carrying track, the welding head device comprises a welding head, a replaceable suction nozzle arranged at the tail end of the welding head and a triaxial manipulator for driving the welding head to move, and the welding head device and the die bonding vision device are connected with a driving motor.
Further, the discharging mechanism comprises a discharging box, an electromagnetic valve and a mechanical shaft for controlling the movement of the discharging box; the electromagnetic valve is connected with the pneumatic device and controls the clamping and the loosening of the material box; the mechanical shaft is connected with a driving motor.
The die bonding method for realizing the dispensing die bonder comprises the following steps:
(1) The material sucking device of the feeding mechanism sucks the material sheets in the material frame and places the material sheets on the carrying track under the action of the pneumatic device;
(2) The first clamping jaw of the clamping jaw carrying mechanism pushes the material sheet back to the initial positioning position for initial position adjustment;
(3) The driving motor controls the first clamping jaw to pull the material sheet to the dispensing mechanism for processing;
(4) The first camera of the dispensing vision device shoots and obtains the position information of the bonding pad on the material taking sheet, the position information of the bonding pad is sent to the computer, the computer processes the position information and sends the position information to the dispensing mechanism for dispensing, and the position information of the bonding pad is the position information about to be dispensed;
(5) The three-axis manipulator for controlling dispensing by the driving motor performs dispensing on all the welding disc position information positions;
(6) The driving motor controls the first clamping jaw and the second clamping jaw of the clamping jaw carrying mechanism to change clamps, the second clamping jaw clamps the material sheet to be sent to the die bonding mechanism, and the first clamping jaw returns to the initial position to prepare for the next wheel clamping piece;
(7) Taking a second camera of the wafer visual device to photograph and identify a wafer disc on the wafer table device so as to acquire the position information of the chip, sending the position information to a computer, processing the position information by the computer and sending the position information to the wafer table device, enabling the wafer table device to drive a track of the wafer disc in the x and y directions to slide, enabling the wafer disc to reach a position given by the computer, and jacking the chip by a lower thimble device;
(8) Shooting a material sheet which reaches the lower part of the die bonding mechanism by a third camera of the die bonding vision device, obtaining die bonding position information, sending the die bonding position information to a computer, sending the processed target position information to a welding head device by the computer, and carrying out welding sheet at the position where the target position information is to be welded by the welding head;
(9) The driving motor is used for controlling the triaxial manipulator of the welding head, adjusting the position information of the welding head, taking a chip from the chip position information and carrying out welding chip when the chip reaches the die bonding position information;
(10) The motor drive controls the third clamping jaw to move the material sheet, and the steps (7) to (9) are repeated until the dispensing positions on each row of bonding pads of the material sheet are bonded with chips;
(11) The fourth clamping jaw of the clamping jaw carrying mechanism pulls the material sheet with the finished welding sheet to the discharging mechanism.
Compared with the prior art, the beneficial effects of the method are as follows:
in the die bonder, the dispensing bonding scheme is mainly adopted, firstly, the material sheet positioning station can ensure that the material sheet can accurately reach each subsequent station, when reaching the dispensing position, accurate position information can be provided under the auxiliary effect of a dispensing vision positioning system so as to supply a dispensing mechanical shaft to accurately reach a welding disc for dispensing, and the dispensing precision is doubly ensured. The invention also adopts a four-clamping-jaw carrying mechanism which is controlled by the linear motor, and can quickly and accurately reach each station. At the die bonding station, the mechanical shaft of the welding head drives the suction nozzle to move, chips are taken out of the wafer through the cooperation of the ejector pins from the wafer disc, and the chips are conveyed to the bonding pads of the material sheets. The bonding pads are generally distributed in a matrix on the material sheet, the suction nozzles are used for carrying out bonding pads in units of rows, after one row is completed, the material sheet is driven by the clamping jaw to move forwards by one unit to carry out bonding pads in the next row, therefore, the bonding head mainly moves in the y direction and the z direction, the wafer disc seat is provided with the ejector pins, when the bonding head suction nozzle reaches the upper part of a chip, the bonding head and the ejector pins are lifted at the same time, the bonding head is not contacted with a wafer to adopt synchronous lifting action, so that the wafer is prevented from being crushed, the wafer fixing quality is greatly improved, the movement of the bonding head is carried out in the y direction and the z direction in a reciprocating cycle mode, a traditional swing arm is not needed, and the suction nozzle is responsible for matching the ejector pins of the wafer disc to suck the ejected wafer and attach the wafer to the bonding pad, so that the die fixing time is saved, and the die fixing efficiency is improved.
In general, through the precision of dispensing, the accuracy of clamping jaw movement and the accuracy of welding head pick-and-place piece are improved, and die bonding accuracy is greatly improved.
Drawings
FIG. 1 is a schematic diagram of a die bonder according to an embodiment of the present disclosure;
FIG. 2 is a schematic view of a web according to an embodiment of the present application;
fig. 3 is a schematic diagram of a dispensing structure and a dispensing visual positioning mechanism according to a first embodiment of the present application;
FIG. 4 is a schematic view of a thimble mechanism according to an embodiment of the present disclosure;
FIG. 5 is a schematic view of a wafer table according to a first embodiment of the present disclosure;
FIG. 6 is a schematic diagram of a bonding tool according to an embodiment of the present application;
fig. 7 is a schematic diagram of a crystal taking visual positioning mechanism and a crystal fixing visual positioning mechanism according to an embodiment of the present application.
Detailed Description
For the purpose of making the technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings, and the described embodiments are only some embodiments of the present invention, but not all examples. Based on the examples herein, other embodiments are within the scope of the present invention as would be appreciated by one of ordinary skill in the art without undue burden.
The dispensing type die bonder in the embodiment shown in fig. 1 to 7 comprises a conveying track, a feeding mechanism, a dispensing mechanism, a die picking mechanism, a die bonding mechanism, a discharging mechanism, a clamping jaw conveying mechanism, a driving motor and a pneumatic device;
the clamping jaw carrying mechanism is arranged on one side of the carrying track; the transport track extends along x-axis direction, along the transport track from setting gradually feed mechanism, point gum machine constructs, get brilliant mechanism, solid brilliant mechanism, discharge mechanism, feed mechanism installs directly over the initial part of the left end of transport track, and point gum machine constructs and is located between feed mechanism and the solid brilliant mechanism, and on the transport track, solid brilliant mechanism installs in the point gum machine right side, with get brilliant mechanism's central line perpendicular to track, get brilliant mechanism and be located the opposite side of transport track, be located the both sides of transport track with clamping jaw transport mechanism respectively. The discharging mechanism is positioned at the extreme end of the carrying track.
Corresponding carrying rails extend along the x-axis direction, and a feeding station, a tablet positioning station, a dispensing station, a crystal taking station, a crystal fixing station and a discharging station are sequentially arranged along the carrying rails. The raw materials are material sheets and wafer chips, the clamping jaw carrying mechanism is used as a carrying tool for the raw materials of the die bonder, and can clamp the material sheets to sequentially pass through the dispensing station, the die bonder station and the discharging station.
All stations are arranged in sequence along the carrying rail 2.
The feeding mechanism 1 comprises a material frame for placing a material sheet 13, a material absorber 12 and a metal sensor 11 positioned at the starting end of the conveying track 2, wherein one end of the material absorber 12 is used for taking materials from the material frame, the other end of the material absorber 12 is connected with a pneumatic device, the material absorber 12 is positioned right above the material frame when initialized, the material absorber 12 is parallel to the material frame, and the material absorber 12 absorbs materials downwards. The pneumatic device comprises an air supply machine and an air pipe.
As shown in the web 13 of FIG. 2, n rows of pads 14 are distributed on the web, n rows of pads 14 are arranged along the x direction, and m rows of pads 14 are arranged along the y direction, wherein m is greater than or equal to 1, n and m are both natural numbers, and the distance between the rows of the web is called a unit distance and is the step distance of movement of the clamping jaw.
The clamping jaw carrying mechanism 8 is used as a carrying tool for raw materials of the die bonder, and can clamp the material sheet to sequentially pass through a material sheet positioning station, a dispensing station, a die bonder station and a discharging station.
The feeding mechanism 1 mainly aims at sucking the material sheets 13 from the material frame and placing the material sheets on the conveying track 2. The feeding mechanism mainly comprises a material frame, a material absorber 12 and a metal sensor 11, wherein the free end of the material absorber 12 is used for taking materials from the material frame, one end of the material absorber 12 is connected with a pneumatic device, the material absorber 12 is positioned right above the material frame when being initialized, the material absorber 12 is parallel to the material frame, and the material absorber 12 finishes the material absorbing action downwards.
The clamping jaw carrying mechanism 8 arranged on the carrying track mainly acts to drive the material sheet 13 to move on the carrying track 2, and the clamping jaw carrying mechanism 8 consists of four clamping jaws and is driven by a linear motor to move on a screw rod to drive the material sheet 13 to reach each station. The first clamping jaw drives the material sheet 13 to arrive at the dispensing station from the material sheet positioning station, the second clamping jaw drives the material sheet to arrive at the die bonding station from the dispensing station, and the third clamping jaw and the fourth clamping jaw drive the material sheet to arrive at the discharging station from the die bonding station.
As a preferred embodiment, the dispensing mechanism 4 includes two identical dispensing devices and a dispensing vision device 3, the dispensing vision device 3 is mounted at the lowest part of the free ends of the dispensing devices, and the free ends are located at a certain height above the carrying rail 2; the dispensing vision device 3 comprises a first camera 17 positioned above the carrying track 2, the first camera 17 is opposite to the carrying track 2, and the material sheet 13 below the dispensing mechanism 4 is photographed, so that the position information of the bonding pad 14 is obtained and used for dispensing by the dispensing mechanism 4. The dispensing mechanism 4 further comprises a dispensing limiting plate arranged on the carrying rail 2, and the two dispensing devices are arranged on the carrying rail 2 in parallel corresponding to the two dispensing limiting plates, and the length of the two dispensing devices is smaller than that of the material sheet 13. The dispensing mechanism 4 is connected with and controlled by the driving motor.
As a preferred embodiment, the dispensing mechanism 4 is located above the track, and is mainly used for dispensing the bonding pads 14 of the material sheet 13, the dispensing position on the track is provided with dispensing limiting plates, the lower parts of the two dispensing mechanisms 4 are respectively provided with a dispensing limiting plate for limiting the movement of the dispensing needle 16, and the two dispensing limiting plates are parallelly arranged on the track and have a length smaller than that of the material sheet 13.
The dispensing mechanism 4 comprises a dispensing arm, a triaxial manipulator 15 driving the dispensing arm to move, a dispensing needle 16 and an injector, and the dispensing mechanism is provided with a dispensing vision device 3. The manipulator mainly controls the dispensing arm to move in the x, y and z directions, and the three-axis linkage can ensure that the dispensing needle 16 accurately reaches the position of the bonding pad 14.
The dispensing vision device 3 comprises a first camera 17, the camera lens being parallel to the track. The main function of the device is to take a picture of the material sheet 13, identify the position information of the bonding pad 14, and provide accurate bonding pad position information for a mechanical shaft. The three-axis mechanical arm 15 and the dispensing vision device 3 are connected with and controlled by the motor in a driving way.
The bonding tool assembly included in the die attach mechanism is shown in fig. 6 and is primarily intended to complete the die attach to the bond pads 14. The die bonding vision device 5 is mounted above the carrying rail 2, and the die picking vision device 6 is mounted on the same mounting base 30, and comprises a second camera 28 and a third camera 29, and the movement in the y direction is completed through a sliding component at 31. The function of the device is to take a picture of the material sheet 13 of the die bonding station and identify the position information of the bonding pads 14 which are already glued. The bonding tool device moves to and from the die bonding station and the die picking station, comprises a replaceable suction nozzle 24, is arranged at the tail end of the bonding tool device through a connecting rod 25, and further comprises a height sensor 26 for measuring the stroke of the bonding tool and a motor 27 for controlling the bonding tool to move in the z direction.
The wafer table device 9 shown in fig. 5 and the ejector pin device 10 shown in fig. 4, and the above wafer taking vision device 6, wherein the wafer table device is ring-shaped, the ejector pin device is fixed in the middle, the wafer table moves with the wafer disc chip until the chip to be taken moves to the upper part of the ejector pin for ejection, and the wafer table device mainly has the function of completing the feeding of the wafer chip, and the second camera 28 of the wafer taking vision device 6 photographs the chip to provide accurate chip position information.
The wafer table device 9 comprises a wafer disc 22, a blue film containing the chip is covered on the wafer disc 22, the wafer taking vision device 6 is arranged right above the wafer table device 9, and the thimble device 10 is arranged right below the wafer table device 9 and is positioned on the same straight line with the wafer taking vision device 6.
As a preferred embodiment, the wafer table device 9 further comprises a movable track 23 in the x direction and a movable track 21 in the y direction, the wafer table is moved to indirectly control the movement of the wafer disc 22 in the x and y directions, the control chip is moved on the ejector device 10, when the wafer is taken, the ejector pins 19 pierce the blue film on the wafer disc 22 from the ejector pin caps 20, and the ejector pins are mounted on the base 18.
The discharging mechanism 7 comprises a discharging box, an electromagnetic valve and a mechanical shaft for controlling the movement of the discharging box; the electromagnetic valve is connected with the pneumatic device and controls the clamping and the loosening of the material box.
The die bonding method for the dispensing die bonder is realized and comprises the following steps:
(1) At the loading station, the material absorber 12 sucks the material sheets 13 in the material frame and places the material sheets on the carrying track 2 under the action of a pneumatic device.
(2) The first jaw of the jaw handling mechanism 8 will push the web back to the web positioning station for initial position adjustment. To ensure the accuracy of the initial position, the latter position is based on this position.
(3) The linear motor controlling the movement of the clamping jaw will control the first clamping jaw to clamp the web 13 to the dispensing station.
(4) The first camera 17 of the dispensing vision device 3 will take a picture and acquire the position information of the bonding pad 14 on the web 13, and send the position information of the bonding pad 14 to the computer, and the computer processes the position information and sends the position information to the dispensing mechanism 4 for dispensing. The positional information of the bonding pad 14 is the positional information about to be dispensed.
(5) The driving motor controls the dispensing triaxial manipulator 15 to move in the x, y and z directions, and the position information of the bonding pad 14 identified by the camera is dispensed. The clamping jaw drives the material sheet 13 to move a unit distance after all the points of a certain row are glued.
(6) The driving motor is used for controlling the first clamping jaw and the second clamping jaw to change clamping, and the second clamping jaw is used for clamping the material sheet and conveying the material sheet to the die bonding station. And the first jaw returns to the web positioning station ready for the next round of clamping.
(7) The second camera 28 of the wafer taking vision device 6 photographs and identifies the wafer disc on the wafer table device 9 to obtain the position information of the chip, and sends the position information to the computer, the computer processes the position information and sends the position information to the wafer table device, the wafer table device drives the wafer disc to slide along the tracks in the x and y directions, so that the chip is driven to move above the ejector pin device 10, and the ejector pin device 10 ejects the chip. The blue film on the crystal disc 22 is attached to the thimble cap 20 of the thimble device 10, the thimble 19 is controlled by the motor to be jacked up, the blue film above the thimble cap 20 is pierced, and the chip at the chip position information is peeled from the blue film.
(8) The third camera 29 of the die bonding vision device 5 photographs the material sheet which has reached the lower part of the die bonding mechanism, obtains die bonding position information of the bonding pad 14 which has been subjected to die bonding in the step 5, and sends the die bonding position information to the computer, the computer sends the processed target position information to the welding head device, the welding head goes to the target position information to carry out welding sheet, and the target position information is the position information of the welding sheet to be welded; the die bonding position information is the position information of the to-be-welded soldering lug.
(9) The driving motor controls the welding head triaxial manipulator, adjusts the position of the welding head, takes a chip from the chip position information in the seventh step and reaches the die bonding position information in the eighth step to weld the chip.
(10) And (3) the motor drive controls the third clamping jaw to move the material sheet 13, and the steps (7), (8) and (9) are repeated until the dispensing positions on each row of bonding pads 14 of the material sheet 13 of the die bonding station are attached with chips.
(11) The fourth clamping jaw pulls the material sheet 13 with the welded sheet to the discharging mechanism 7, and the discharging mechanism 7 finishes discharging.
The above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. The dispensing type die bonder is characterized by comprising a conveying track, a feeding mechanism, a dispensing mechanism, a die picking mechanism, a die bonding mechanism, a discharging mechanism, a clamping jaw conveying mechanism, a driving motor and a pneumatic device; the clamping jaw carrying mechanism is arranged on one side of the carrying track; the transport track extends along x axis direction, along the transport track follow set gradually feed mechanism, point gum machine constructs, get brilliant mechanism, solid brilliant mechanism, discharge mechanism, point gum machine constructs and solid brilliant mechanism is located and is listed on the transport track, gets brilliant mechanism and is located one side of transport track.
2. The dispensing die bonder according to claim 1, wherein the feeding mechanism comprises a material frame for placing the material sheets, a material suction device and a metal sensor positioned at the starting end of the conveying track, one end of the material suction device is used for taking materials from the material frame, the other end of the material suction device is connected with the pneumatic device, the material suction device is positioned right above the material frame when being initialized, the material suction device is parallel to the material frame, and the material suction device sucks materials downwards.
3. The dispensing die bonder according to claim 2, wherein the web is a raw material of the die bonder, the web is provided with n rows of m rows of bonding pads, the n rows of bonding pads are arranged in the x direction, the m rows of bonding pads are arranged in the y direction, wherein m is greater than or equal to 1, n is greater than or equal to 1, and n and m are both natural numbers.
4. The dispensing die bonder as claimed in claim 1, wherein the dispensing mechanism comprises a dispensing device, a dispensing vision device positioned below the dispensing device, the dispensing vision device comprising a first camera positioned above the handling rail; the dispensing mechanism is connected with the driving motor;
the dispensing mechanism further comprises a dispensing limiting plate arranged on the carrying track, and the dispensing device is arranged on the carrying track in parallel corresponding to the dispensing limiting plate and is smaller than the material sheet in length.
5. The dispensing die bonder of claim 4, wherein the dispensing device comprises a dispensing arm, a triaxial manipulator driving the dispensing arm to move, a dispensing needle, a syringe, and a dispensing needle mounted at the end of the syringe, the syringe mounted at the free end of the dispensing arm, and the triaxial manipulator connected to the driving motor.
6. The dispensing die bonder according to claim 1, wherein the clamping jaw carrying mechanism comprises four clamping jaws which are connected with a linear motor, and are driven by the linear motor, and the clamping jaws are displaced on a screw rod to drive a material sheet to reach each station; the first clamping jaw drives the material sheet to move from the feeding mechanism to the dispensing mechanism, the second clamping jaw drives the material sheet to move from the dispensing mechanism to the die bonding mechanism, and the third clamping jaw and the fourth clamping jaw drive the material sheet to move from the die bonding mechanism to the discharging mechanism.
7. The dispensing die bonder as claimed in claim 1, wherein the die-picking mechanism comprises a wafer table device, a thimble device positioned below the wafer table device, and a die-picking vision device positioned above the wafer table device; the crystal taking vision device comprises a second camera, and the thimble device and the crystal taking vision device are positioned on the same straight line; the wafer table device comprises a wafer disc, and a blue film containing chips is covered on the wafer disc; the crystal taking vision device, the crystal table device and the thimble device are all connected with the driving motor.
8. The dispensing die bonder of claim 1, wherein the die bonding mechanism comprises a bonding head device, a die bonding vision device and a die bonding limiting plate mounted on a carrying track, wherein the die bonding limiting plate limits the movement limit of the bonding head; the die bonding vision device comprises a third camera, the third camera is arranged right above the carrying track and is aligned to a die bonding limiting plate on the carrying track, the welding head device comprises a welding head, a replaceable suction nozzle arranged at the tail end of the welding head and a triaxial manipulator for driving the welding head to move, and the welding head device and the die bonding vision device are connected with a driving motor.
9. The dispensing die bonder as claimed in claim 1, wherein the discharging mechanism comprises a discharging box, an electromagnetic valve and a mechanical shaft for controlling the movement of the box; the electromagnetic valve is connected with the pneumatic device and controls the clamping and the loosening of the material box; the mechanical shaft is connected with a driving motor.
10. The die bonding method for realizing the dispensing die bonder according to any one of claims 1 to 9, comprising the steps of:
(1) The material sucking device of the feeding mechanism sucks the material sheets in the material frame and places the material sheets on the carrying track under the action of the pneumatic device;
(2) The first clamping jaw of the clamping jaw carrying mechanism pushes the material sheet back to the initial positioning position for initial position adjustment;
(3) The driving motor controls the first clamping jaw to pull the material sheet to the dispensing mechanism for processing;
(4) The first camera of the dispensing vision device shoots and obtains the position information of the bonding pad on the material taking sheet, the position information of the bonding pad is sent to the computer, the computer processes the position information and sends the position information to the dispensing mechanism for dispensing, and the position information of the bonding pad is the position information about to be dispensed;
(5) The three-axis manipulator for controlling dispensing by the driving motor performs dispensing on all the welding disc position information positions;
(6) The driving motor controls the first clamping jaw and the second clamping jaw of the clamping jaw carrying mechanism to change clamps, the second clamping jaw clamps the material sheet to be sent to the die bonding mechanism, and the first clamping jaw returns to the initial position to prepare for the next wheel clamping piece;
(7) Taking a second camera of the wafer visual device to photograph and identify a wafer disc on the wafer table device so as to acquire the position information of the chip, sending the position information to a computer, processing the position information by the computer and sending the position information to the wafer table device, enabling the wafer table device to drive a track of the wafer disc in the x and y directions to slide, enabling the wafer disc to reach a position given by the computer, and jacking the chip by a lower thimble device;
(8) Shooting a material sheet which reaches the lower part of the die bonding mechanism by a third camera of the die bonding vision device, obtaining die bonding position information, sending the die bonding position information to a computer, sending the processed target position information to a welding head device by the computer, and carrying out welding sheet at the position where the target position information is to be welded by the welding head;
(9) The driving motor is used for controlling the triaxial manipulator of the welding head, adjusting the position information of the welding head, taking a chip from the chip position information and carrying out welding chip when the chip reaches the die bonding position information;
(10) The motor drive controls the third clamping jaw to move the material sheet, and the steps (7) to (9) are repeated until the dispensing positions on each row of bonding pads of the material sheet are bonded with chips;
(11) The fourth clamping jaw of the clamping jaw carrying mechanism pulls the material sheet with the finished welding sheet to the discharging mechanism.
CN202310263584.0A 2023-03-17 2023-03-17 Dispensing type die bonder and die bonding method Pending CN116387195A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310263584.0A CN116387195A (en) 2023-03-17 2023-03-17 Dispensing type die bonder and die bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310263584.0A CN116387195A (en) 2023-03-17 2023-03-17 Dispensing type die bonder and die bonding method

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117059519A (en) * 2023-08-09 2023-11-14 广东省航瑞智能科技有限公司 Multifunctional chip assembly integrated machine
CN117427841A (en) * 2023-12-20 2024-01-23 常州铭赛机器人科技股份有限公司 Dispensing equipment and dispensing operation method
CN117936443A (en) * 2024-03-22 2024-04-26 深圳新控半导体技术有限公司 Full-automatic die bonding equipment
CN117976595A (en) * 2024-04-02 2024-05-03 珠海市硅酷科技有限公司 Die bonding device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117059519A (en) * 2023-08-09 2023-11-14 广东省航瑞智能科技有限公司 Multifunctional chip assembly integrated machine
CN117059519B (en) * 2023-08-09 2024-04-26 广东省航瑞智能科技有限公司 Multifunctional chip assembly integrated machine
CN117427841A (en) * 2023-12-20 2024-01-23 常州铭赛机器人科技股份有限公司 Dispensing equipment and dispensing operation method
CN117427841B (en) * 2023-12-20 2024-03-08 常州铭赛机器人科技股份有限公司 Dispensing equipment and dispensing operation method
CN117936443A (en) * 2024-03-22 2024-04-26 深圳新控半导体技术有限公司 Full-automatic die bonding equipment
CN117976595A (en) * 2024-04-02 2024-05-03 珠海市硅酷科技有限公司 Die bonding device

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