CN116367408A

CN116367408A - Three-dimensional circuit board, manufacturing method thereof and probe card

Info

Publication number: CN116367408A
Application number: CN202111628746.3A
Authority: CN
Inventors: 周敏杰; 黄萌祺; 高端环; 黄悦真
Original assignee: Industrial Technology Research Institute ITRI
Current assignee: Industrial Technology Research Institute ITRI
Priority date: 2021-12-28
Filing date: 2021-12-28
Publication date: 2023-06-30

Abstract

The present disclosure provides a three-dimensional circuit board, a method of manufacturing the same, and a probe card. The three-dimensional circuit board comprises a ceramic substrate and a plurality of circuits. The ceramic substrate includes a first plane, a second plane, a third plane between the first plane and the second plane, a first side connecting the first plane and the second plane, and a second side connecting the first plane and the third plane and opposite to the first side. The first height of the first side is greater than the second height of the second side. The lines are embedded on the first plane of the ceramic substrate in a separated mode, and extend along the first side face to be embedded on the second plane. The three-dimensional circuit board and the manufacturing method thereof have the advantages of simple manufacture and low cost, and can effectively avoid crosstalk interference. The probe card can effectively avoid the collision between the probe and the three-dimensional circuit board or the printed circuit board in the test process, and has good test stability.

Description

Three-dimensional circuit board, manufacturing method thereof and probe card

Technical Field

The disclosure relates to a circuit board and a manufacturing method thereof, and more particularly to a three-dimensional circuit board and a manufacturing method thereof, and a probe card using the three-dimensional circuit board.

Background

The circuit transfer board of the conventional probe card mostly uses a Multi-layered printed circuit board or a Multi-layered ceramic circuit board (MLCC, multi-Layer Ceramic Capacitor). The multilayer printed circuit board generally uses a polymer material (such as Epoxy) which has a large thermal expansion coefficient and is not easily applied to a thermal shock resistance test environment and a high-density probe card of a chip for a vehicle. The multilayer ceramic circuit board has the following technical bottlenecks: 1. ) And sintering the silver paste screen printing technology and the metal paste at high temperature to manufacture metal circuits on the ceramic substrate. However, the metal circuit has a deviation between the size and the position of the circuit caused by high-temperature sintering, such as about 5% to 14% of position accuracy error, so that the vertical conduction offset of the circuit of the stacked and co-fired multilayer ceramic circuit is larger in the future, and the line width and line distance accuracy cannot be controlled. In addition, during the fabrication process, the silver paste via filling process must be performed by increasing the pitch to avoid short circuits caused by overfill paste overflow, but this reduces the internal interconnect density. 2. ) Because the size and the line width of circuit elements are smaller and smaller, the current minimum line width of silver paste screen printing with high Wen Houmo (the metal film thickness is more than 10 microns) can only reach more than 50 microns, and the requirements of the high-frequency and high-density probe card industry line width below 30 microns are not met. 3. ) The metal paste sintering technology must use high temperature sintering with the temperature of 800 ℃ to 900 ℃ and the process time of more than 1 hour to remove high molecules such as silver paste or copper paste, and has good metal conductivity. However, long-time sintering at high temperature is an energy-consuming industry, and metal flatness is susceptible to slurry uniformity. 4. ) The screen printing is limited to only print circuits on a plane, so the existing multilayer ceramic circuit board still can only be in the form of a two-dimensional plane circuit board. 5. ) Every time a wafer to be tested is replaced, the required probe card, the required multi-layer ceramic circuit board and the required screen plate and jig for manufacturing must be redesigned and manufactured. However, the probe card is a small number of diversified products, and each design number is only ten, so that the cost of the high-precision multilayer ceramic circuit board used for the probe card is quite high.

Disclosure of Invention

The present disclosure provides a three-dimensional circuit board and a manufacturing method thereof, which have advantages of simple manufacturing and low cost, and each line is separated from each other without interlacing, so as to effectively avoid crosstalk interference (crosstalk).

The disclosure provides a probe card, which comprises the three-dimensional circuit board, can effectively avoid the collision between a probe and the three-dimensional circuit board or the printed circuit board in the test process, and has good test stability.

According to an embodiment of the present disclosure, a three-dimensional circuit board includes a ceramic substrate and a plurality of traces. The ceramic substrate includes a first plane, a second plane, a third plane between the first plane and the second plane, a first side connecting the first plane and the second plane, and a second side connecting the first plane and the third plane and opposite to the first side. The first height of the first side surface is larger than the second height of the second side surface, and the third plane and the second side surface form a groove. The lines are embedded on the first plane of the ceramic substrate in a separated mode, and extend along the first side face to be embedded on the second plane. In addition, the arrangement density of the circuits on the first plane is greater than that on the second plane.

The manufacturing method of the three-dimensional circuit board comprises the following steps. A ceramic substrate is provided. The ceramic substrate includes a first plane, a second plane, a third plane between the first plane and the second plane, a first side connecting the first plane and the second plane, and a second side connecting the first plane and the third plane and opposite to the first side. The first height of the first side surface is larger than the second height of the second side surface, and the third plane and the second side surface form a groove. A laser process is performed to form a plurality of grooves separated from each other on the ceramic substrate. The trenches extend from the first plane of the ceramic substrate along the first side onto the second plane, and trace metal is present in each trench. And performing an electroplating procedure, namely electroplating to form a plurality of circuits embedded in the first plane, the first side surface and the second plane by taking the trace metal as an electroplating seed layer.

The probe card comprises the three-dimensional circuit board, the printed circuit board and the probe structure. The printed circuit board is configured on a second plane of the three-dimensional circuit board and is electrically connected with the circuit. The probe structure includes a cantilever and a needle. The cantilever includes a fixed end and a free end. The fixed end is configured on the first plane and connected with the circuit. The needle is connected with the free end, and an air gap is arranged between the cantilever and the third plane.

Based on the above, in the design of the three-dimensional circuit board of the disclosure, each circuit is disposed on the first plane, the first side surface and the second plane of the ceramic substrate separately from each other, and the ceramic substrate includes a second side surface opposite to the first side surface and lower than the first side surface in height. Therefore, the ceramic substrate can complete the conduction of the circuits on the upper surface and the lower surface without any drilling process. Furthermore, when the probe structure is arranged on the three-dimensional circuit board to form the probe card, the arrangement of the second side surface can avoid the collision between the probe structure and the three-dimensional circuit board or the printed circuit board in the test process, so that the probe card has good test stability. In addition, the manufacturing method of the three-dimensional circuit board disclosed by the invention is characterized in that trace metal is generated by the laser ceramic substrate to serve as an electroplating seed layer of a subsequent electroplating process, so that a plurality of circuits separated from each other are formed. Therefore, the three-dimensional circuit board and the manufacturing method thereof have the advantages of simple manufacture and low cost, and all the circuits are separated from each other without interleaving, so that crosstalk interference can be effectively avoided.

Drawings

FIG. 1A is a schematic perspective view of a three-dimensional circuit board according to an embodiment of the present disclosure;

FIG. 1B is a schematic perspective view of the three-dimensional circuit board of FIG. 1A from another perspective;

FIG. 1C is a schematic perspective cross-sectional view of the three-dimensional circuit board of FIG. 1A;

fig. 2A to 2C are schematic perspective views of a method for manufacturing a three-dimensional circuit board according to an embodiment of the disclosure;

FIG. 3 is a schematic side view of a three-dimensional circuit board according to another embodiment of the present disclosure;

FIG. 4 is a schematic side view of a probe card according to an embodiment of the disclosure;

fig. 5 is a schematic side view of a probe card according to another embodiment of the disclosure.

[ reference numerals description ]:

10a, 10b: a probe card;

100a, 100c, 100d: a three-dimensional circuit board;

110a, 110c, 110d: a ceramic substrate;

111a, 111c, 111d: a first plane;

112a, 112c, 112d: a second plane;

113a, 113c, 113d: a first side;

114a: a third plane;

115a, 115c, 115d: a second side;

116a: a groove;

122: a line;

123: a first end;

125: a second end;

200: a printed circuit board;

300: a probe structure;

310: a cantilever;

312: a fixed end;

314: a free end;

320: a needle;

400: a connecting piece;

a: an air gap;

c: a receiving groove;

d: an electronic component;

e: thickness;

h1: a first height;

h2: a second height;

and H3: a third height;

l: a groove;

t: a horizontal distance;

w: line width.

Detailed Description

Reference will now be made in detail to the exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. It should be noted that the same reference numerals are used throughout the drawings and the description to refer to the same or like parts.

Fig. 1A is a schematic perspective view of a three-dimensional circuit board according to an embodiment of the present disclosure. Fig. 1B is a schematic perspective view of the three-dimensional circuit board of fig. 1A at another view angle. Fig. 1C is a schematic perspective cross-sectional view of the three-dimensional circuit board of fig. 1A. Referring to fig. 1A, fig. 1B, and fig. 1C, in the present embodiment, the three-dimensional circuit board 100a includes a ceramic substrate 110a and a plurality of wires 122. The ceramic substrate 110a includes a first plane 111a, a second plane 112a, a third plane 114a between the first plane 111a and the second plane 112a, a first side 113a connecting the first plane 111a and the second plane 112a, and a second side 115a connecting the first plane 111a and the third plane 114a and opposite to the first side 113 a. The first height H1 of the first side 113a is greater than the second height H2 of the second side 115a. In one embodiment, the second height H2 is at least greater than 150 microns. The wires 122 are embedded on the first plane 111a of the ceramic substrate 110a separately from each other, and extend along the first side 113a to be embedded on the second plane 112 a.

Furthermore, the ceramic substrate 110a of the present embodiment further includes a recess 116a, wherein a bottom surface of the recess 116a is the third plane 114a, and a sidewall of the recess 116a is the second side surface 115a. That is, the groove 116a does not penetrate the ceramic substrate 110a, and the third plane 114a and the second side 115a form the groove 116a. The material of the ceramic substrate 110a is, for example, metal oxide, metal nitride, silicon carbide, or a combination thereof, wherein the metal oxide is, for example, aluminum oxide or zirconium oxide, the metal nitride is, for example, aluminum nitride, and the combination thereof is, for example, aluminum oxide material containing about 5% zirconium oxide, but is not limited thereto. In one embodiment, the ceramic substrate 110a includes 0.1% to 5% yttrium element by weight.

Furthermore, the circuit 122 of the present embodiment includes a first end 123 and a second end 125. The first end 123 of the wire 122 is located on the first plane 111a and the second end 125 of the wire 122 is located on the second plane 112a, wherein the second end 125 of the wire 122 is adapted to be in contact with an external element. In one embodiment, the first end 123 of the trace 122 has a horizontal distance T from the second side 115a of the ceramic substrate 110a, and the horizontal distance T is equal to 0 or less than 100 micrometers. In the present embodiment, the first end 123 of the circuit 1122 extends from the first plane 111a to the first side 113a and the second plane 112a in a fan-shaped manner or in parallel, and the second end 125 of the circuit 122 is adapted to be in contact with an external device to form an electrical connection. In one embodiment, the arrangement density of the traces 122 on the first plane 111a may be greater than the arrangement density on the second plane 112a, such that the three-dimensional circuit board 100a may be considered as a circuit pitch board (space transformer). In addition, the line width W of the line 122 in the present embodiment is, for example, between 10 micrometers and 65 micrometers.

In the prior art, the multilayer ceramic sintered circuit board walks in each circuit layer due to the distance-expanding circuit, so that space staggering among the circuits is unavoidable, and signal interference is caused. However, in the present embodiment, since the wires 122 on the ceramic substrate 110a are separated from each other and there is no space for interleaving, signal interference between the wires 122 can be greatly reduced. Therefore, the three-dimensional circuit board 100a of the present embodiment can effectively avoid crosstalk interference.

In addition, in the process of the three-dimensional circuit board 100a, referring to fig. 2A and fig. 2B, first, a ceramic substrate 110a is provided. The ceramic substrate 110a includes a first plane 111a, a second plane 112a, a third plane 114a between the first plane 111a and the second plane 112a, a first side 113a connecting the first plane 111a and the second plane 112a, and a second side 115a connecting the first plane 111a and the third plane 114a and opposite to the first side 113 a. Wherein the first height H1 of the first side 113a is greater than the second height H2 of the second side 115a. More specifically, the ceramic substrate 110a includes a recess 116a, wherein a bottom surface of the recess 116a is the third plane 114a, and a sidewall of the recess 116a is the second side surface 115a. That is, the third plane 114a and the second side 115a form a groove 116a.

Next, please refer to fig. 2C, the CAD drawing of the three-dimensional circuit board is assembled into a three-dimensional laser system, and is aligned and overlapped with the precisely processed three-dimensional ceramic substrate 110a. Next, a laser process is performed to form a plurality of trenches L separated from each other on the ceramic substrate 110a, wherein the trenches L extend from the first plane 111a of the ceramic substrate 110a along the first side 113a to the second plane 112a, and a trace amount of metal is present in each trench L. More specifically, performing the laser process includes irradiating green laser light on the ceramic substrate 110a, wherein the wavelength of the green laser light is 532 nm, for example, and the focused spot size (spot size) of the laser beam is 10 μm, for example. The green laser beam is directly irradiated on the surface of the ceramic substrate 110a to perform the circuit patterning definition and the material excitation treatment, so that the manufacturing cost of the screen plate or the photomask in the prior art can be effectively saved. In addition, since the ceramic substrate 110a of the present embodiment contains a trace amount of metal, for example, 0.1% to 5% by weight of yttrium element, which is present in the ceramic substrate 110a in a metal element or oxide state, the yttrium element is exposed after the ceramic substrate 110a is laser patterned.

Finally, referring to fig. 2C again, an electroplating process is performed, and a trace metal is used as an electroplating seed layer to form a plurality of lines 122 embedded in the first plane 111a, the first side 113a and the second plane 112 a. That is, the present embodiment can combine the surface treatment technique and the metallization technique to deposit metal on the circuit region after laser patterning to fabricate the circuit 122. Here, the plating process is, for example, electroless copper plating, which deposits copper metal in the trenches L of the ceramic substrate 110a to form metal microstructures, and then further deposits electroless silver metal for copper structure protection to form the lines 122 separated from each other.

Since the ceramic laser metallization technology is a low-temperature rapid process, and the position and line width of the line 122 can be precisely controlled by laser light, the minimum line width W of the line 122 can be less than 65 microns, the position accuracy can be controlled to be less than +/-10 microns, the requirements of miniaturization of the wafer element size and development of high-frequency modules in the future can be met, and the ceramic laser metallization technology has high energy-saving benefit. The adopted metals are copper and silver, and the low skin effect loss is achieved by the method, so that the technical advantages of high signal transmission speed, high position accuracy of the circuit 122, simplified process, low cost and the like can be achieved.

Briefly, the three-dimensional circuit board 100a of the present embodiment is manufactured by combining laser patterning and high-selectivity metallization technology to manufacture precise three-dimensional metal lines 122 on the surface of the ceramic substrate 110a, thereby forming the three-dimensional circuit board 100a. Therefore, the process of the present embodiment does not need a photomask, the process can be more flexible and can be rapidly manufactured, the development time can be shortened, and the process tool cost is low, so that the manufacturing cost of the whole three-dimensional circuit board 100a of the present embodiment is low. That is, the method for manufacturing the three-dimensional circuit board 100a of the present embodiment belongs to a low-temperature process, can make the position accuracy of the circuit 122 high, and has the advantages of simple process, high yield, low cost, and the like. Furthermore, the lines 122 formed in the present embodiment are not staggered, so that signal crosstalk interference can be effectively reduced. In addition, compared with the prior art that the high-precision fine circuit cannot be manufactured due to thermal expansion and contraction, the present embodiment can directly perform three-dimensional circuit wiring on the appearance of the ceramic substrate 110a by laser induced metallization, and can manufacture the high-precision fine circuit 122, thereby meeting the requirement of the high-density three-dimensional circuit board 100a (the space between each circuit is less than or equal to 20 μm).

Fig. 3 is a schematic side view of a three-dimensional circuit board according to another embodiment of the present disclosure. Referring to fig. 1C and fig. 3, the three-dimensional circuit board 100C of the present embodiment is similar to the three-dimensional circuit board 100a of fig. 1C, but it is noted that in the present embodiment, the three-dimensional circuit board 100C further includes an electronic component D, and at least one of the first plane 111C, the second plane 112C, and the first side 113C connecting the first plane 111C and the second plane 112C of the ceramic substrate 110C includes a receiving groove C, wherein the electronic component D is disposed in the receiving groove C. In the present embodiment, as shown in fig. 3, the second plane 112C includes a receiving groove C, and the electronic device D is disposed on the second plane 112C and electrically connected to the circuit 122 disposed in the receiving groove C. The electronic device D is, for example, an active device or a passive device. Since the three-dimensional circuit board 100c of the present embodiment is provided with the electronic component D, signal down conversion or processing can be performed, and loss or distortion of the high-frequency signal due to long-distance transmission can be avoided. In addition, the horizontal distance between the first end 123 of the line 122 and the second side 115c of the ceramic substrate 110c in this embodiment is 0, that is, the first end 123 of the line 122 is aligned with the second side 115c of the ceramic substrate 110 c.

Fig. 4 is a schematic side view of a probe card according to an embodiment of the disclosure. Referring to fig. 4, in the present embodiment, the probe card 10a includes the three-dimensional circuit board 100a, the printed circuit board 200 and the probe structure 300. The printed circuit board 200 is disposed on the second plane 112a of the three-dimensional circuit board 100a, and is electrically connected to the circuit 122 through the connection element 4Q 0. The connecting member 4Q0 is, for example, solder, but not limited thereto. Probe structure 300 includes cantilever 310 and needle 320. Cantilever 310 is rectangular in cross-section and includes a fixed end 312 and a free end 314. The fixed end 312 is disposed on the first plane 111a and connects to the circuit 122. Needle 320 is connected to free end 314 with air gap a between cantilever 310 and third plane 114 a.

Further, as shown in fig. 4, the cantilever 310 of the probe structure 300 on the first plane 111a is most protruded from the second side 115a to be suspended except for being connected to the line 122. That is, due to the design of the recess 116a in the three-dimensional circuit board 100a, the cantilever 310 of the probe structure 300 can directly contact the line 122 located on the first plane 111a, so that the process of the probe card 10a can be effectively simplified without passing through a metal pillar. In one embodiment, the second height H2 of the second side 115a of the ceramic substrate 110a is greater than the thickness E of the cantilever 310 plus the third height H3 of the needle 320, i.e., H2 > E+H2, wherein the second height H2 is at least greater than 150 microns and the third height H3 is at least less than 100 microns. Therefore, the assembly of the probe structure 300 and the three-dimensional circuit board 100a of the present embodiment does not require a base, and the process of the probe card 10a can be effectively simplified.

In short, since the second height H2 of the second side 115a of the ceramic substrate 110a of the present embodiment is greater than the third height H3 of the needle 320 plus the thickness E of the cantilever 310, the probe structure 300 is not collided with the three-dimensional circuit board 100a or the printed circuit board 200 during the testing process. In addition, since the circuits 122 are disposed on the first plane 111a, the first side 113a and the second plane 112a of the ceramic substrate 110a separately from each other, the ceramic substrate 110a can complete the circuit conduction on the upper and lower surfaces without any drilling process, and the circuit pitch can be extended to connect with the printed circuit board 200.

Fig. 5 is a schematic side view of a probe card according to another embodiment of the disclosure. Referring to fig. 4 and 5, the probe card 10b of the present embodiment is similar to the probe card 10a of fig. 5, but it is noted that in the present embodiment, the three-dimensional circuit board 100D further includes an electronic component D, and at least one of the first plane 111D, the second plane 112D, and the first side 113D connecting the first plane 111D and the second plane 112D of the ceramic substrate 110D includes a receiving slot C, and the electronic component D is disposed in the receiving slot C. Here, the second plane 112D includes a receiving groove C, and the electronic component D is disposed on the second plane 112D and electrically connected to the circuit 122 disposed in the receiving groove C. The electronic device D is, for example, an active device or a passive device. In addition, the horizontal distance between the first end 123 of the line 122 and the second side 115d of the ceramic substrate 110d in the present embodiment is 0, that is, the first end 123 of the line 122 is aligned with the second side 115d of the ceramic substrate 110 d.

In short, along with the requirements of the high-frequency circuit or the high-speed operation circuit, when the signal is transmitted from the IC terminal to the probe card 10b, the signal must be down-converted or processed in a short distance, so that the electronic device D (such as an active device or a passive device) can be adhered to the second plane 112D (or the first plane 111D or the first side 113D) of the three-dimensional circuit board 100D at the receiving slot C, so that the signal can be down-converted or processed in the shortest distance, and the loss or distortion caused by long-distance transmission of the high-frequency signal is avoided.

In summary, in the design of the three-dimensional circuit board of the disclosure, each circuit is disposed on the first plane, the first side surface and the second plane of the ceramic substrate separately from each other, and the ceramic substrate includes a second side surface opposite to the first side surface and having a height lower than that of the first side surface. Therefore, the ceramic substrate can complete the conduction of the circuits on the upper surface and the lower surface without any drilling process. Furthermore, when the probe structure is arranged on the three-dimensional circuit board to form the probe card, the arrangement of the second side surface can avoid the collision between the probe structure and the three-dimensional circuit board or the printed circuit board in the test process, so that the probe card has good test stability. In addition, the manufacturing method of the three-dimensional circuit board disclosed by the invention is characterized in that trace metal is generated by the laser ceramic substrate to serve as an electroplating seed layer of a subsequent electroplating process, so that a plurality of circuits separated from each other are formed. Therefore, the three-dimensional circuit board and the manufacturing method thereof have the advantages of simple manufacture and low cost, and all the circuits are separated from each other without interleaving, so that crosstalk interference can be effectively avoided.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present disclosure, and not for limiting the same; although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A three-dimensional circuit board, comprising:

a ceramic substrate comprising a first plane, a second plane, a third plane located between the first plane and the second plane, a first side connecting the first plane and the second plane, and a second side connecting the first plane and the third plane and opposite to the first side, wherein a first height of the first side is greater than a second height of the second side, and the third plane and the second side form a groove; and

a plurality of lines embedded on the first plane of the ceramic substrate in a mutually separated manner and extending along the first side face to be embedded on the second plane;

the arrangement density of the plurality of lines on the first plane is greater than the arrangement density of the plurality of lines on the second plane.

2. The three-dimensional circuit board of claim 1, wherein each of the plurality of lines includes a first end and a second end, the first end lying on the first plane and the second end lying on the second plane, the first end having a horizontal distance from the second side, and the horizontal distance being equal to 0 or less than 100 microns.

3. The three-dimensional circuit board of claim 1, wherein the second height is greater than 150 microns.

4. The three-dimensional circuit board of claim 1, wherein a linewidth of each of the plurality of lines is between 10 microns and 65 microns.

5. The three-dimensional circuit board of claim 1, wherein the ceramic substrate comprises 0.1% to 5% yttrium element by weight percent.

6. The three-dimensional circuit board of claim 1, further comprising:

and the electronic element is arranged in the accommodating groove.

7. The manufacturing method of the three-dimensional circuit board is characterized by comprising the following steps of:

providing a ceramic substrate comprising a first plane, a second plane, a third plane located between the first plane and the second plane, a first side connecting the first plane and the second plane, and a second side connecting the first plane and the third plane and opposite to the first side, wherein the first side has a first height greater than a second height of the second side, and the third plane and the second side form a groove;

performing a laser process to form a plurality of trenches on the ceramic substrate that are separated from each other, wherein the plurality of trenches extend from the first plane of the ceramic substrate along the first side onto the second plane, and a trace amount of metal is present in each of the plurality of trenches; and

and performing an electroplating procedure, namely electroplating to form a plurality of circuits embedded in the first plane, the first side surface and the second plane by taking the trace metal as an electroplating seed layer.

8. The method of claim 7, wherein the trace metal comprises 0.1% to 5% yttrium by weight.

9. The method of claim 7, wherein performing the laser process includes irradiating green laser light onto the ceramic substrate.

10. The method of claim 7, wherein each of the plurality of lines has a line width of 10 microns to 65 microns.

11. A probe card, comprising:

a three-dimensional circuit board using the three-dimensional circuit board according to any one of claims 1 to 6;

the printed circuit board is configured on the second plane of the three-dimensional circuit board and is electrically connected with the plurality of circuits; and

the probe structure comprises a cantilever and a needle head, wherein the cantilever comprises a fixed end and a free end, the fixed end is configured on the first plane and is connected with the circuits, the needle head is connected with the free end, and an air gap is formed between the cantilever and the third plane.

12. The probe card of claim 11, wherein the second height of the second side of the ceramic substrate is greater than the thickness of the cantilever plus a third height of the needle.

13. The probe card of claim 12, wherein the third height is less than 100 microns.