CN116356292A - Heater assembly and vapor deposition equipment - Google Patents
Heater assembly and vapor deposition equipment Download PDFInfo
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- CN116356292A CN116356292A CN202111615369.XA CN202111615369A CN116356292A CN 116356292 A CN116356292 A CN 116356292A CN 202111615369 A CN202111615369 A CN 202111615369A CN 116356292 A CN116356292 A CN 116356292A
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- 238000007740 vapor deposition Methods 0.000 title claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 152
- 238000006073 displacement reaction Methods 0.000 claims abstract description 20
- 238000000429 assembly Methods 0.000 claims abstract description 16
- 230000000712 assembly Effects 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 11
- 238000002955 isolation Methods 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 229910052702 rhenium Inorganic materials 0.000 claims description 6
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 16
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 10
- 229910000691 Re alloy Inorganic materials 0.000 description 5
- DECCZIUVGMLHKQ-UHFFFAOYSA-N rhenium tungsten Chemical compound [W].[Re] DECCZIUVGMLHKQ-UHFFFAOYSA-N 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- UVXCXZBZPFCAAJ-UHFFFAOYSA-N arc-111 Chemical compound C1=C2OCOC2=CC2=C(N(CCN(C)C)C(=O)C3=C4C=C(C(=C3)OC)OC)C4=CN=C21 UVXCXZBZPFCAAJ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Abstract
The invention discloses a heater assembly and vapor deposition equipment, wherein the heater assembly is used for heating a wafer tray in the vapor deposition equipment and comprises the following components: a heating member for heating the wafer tray when a current flows therein; the heating component comprises a plurality of heating arc sections; the plurality of support assemblies comprise at least one support rod, and each support assembly is used for supporting adjacent heating arc sections; the flexible component is connected with one end of the supporting rod, which is far away from the heating arc section, and is used for controlling the displacement and the deformation direction of the heating arc section; and the conducting component is electrically connected with the adjacent heating arc sections and/or the supporting rod and is used for enabling current to flow between the adjacent heating arc sections. The invention can enable current to flow between adjacent heating arc sections along the conducting component, and enable the current flowing through the flexible component to be smaller or even smaller, thereby effectively reducing the temperature of the flexible component and reducing the thermal creep of the flexible component, and further reducing the deformation and displacement of the heating arc sections.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a heater assembly and vapor deposition equipment.
Background
In a vapor deposition (CVD) process, a heater heats a wafer tray placed above the heater to heat wafers in the wafer tray, so that the temperature of the wafers can reach a set process temperature, thereby depositing a thin film on the wafer surface under the action of process gas.
Because tungsten, rhenium and other materials used as heating components are directly processed into annular and integrated heating components, not only is it difficult to find out tungsten-rhenium alloy plates meeting processing requirements, but also waste of materials is caused, and a plurality of heating arc sections obtained by cutting a whole tungsten or rhenium plate are usually formed into the heating components, so that a circuit for supporting and providing current circulation through a supporting component is needed between adjacent heating arc sections. In order to provide the space and flexibility of the thermal expansion deformation of the heating component, the heating component is guided to perform the expansion deformation in the direction required by design, a flexible component is arranged on the supporting component, and the flexible components of the adjacent heating components are connected and fixed through the connecting component; wherein the primary elastic deformation direction of the flexible member is a radial direction such that the heating member is displaced and deformed primarily in a radial direction during thermal expansion.
In the process of heating the wafer tray, the temperature of the heating component is up to 2000-2200 ℃, and heating current flows between adjacent heating arc sections along the supporting component, the flexible component and the connecting component, so that the supporting component, the flexible component and the connecting component are heated by the heat conduction of the heating component and the self current, and the temperature of the heating component is up to about 1000 ℃ and is higher than the high-temperature creep temperature of the material of the heating component. Wherein the flexible part is used as a main deformation part, and creep deformation is most obvious; when the flexible part is subjected to creep deformation, the heating part can be influenced by the deformation of the flexible part to deform and displace in the cooling rebound process, so that the heating part cannot return to the original position. The shape and displacement of the deformed and displaced heating part after the reheating are different from the initial state to a certain extent, and finally the temperature field is changed, so that the process result and the wafer yield are affected. Therefore, it is necessary to change or adjust the structure of the heater.
Disclosure of Invention
The invention aims to provide a heater assembly and vapor deposition equipment, which can enable current to flow between adjacent heating arc sections along a conducting part, and enable the current flowing through a flexible part to be smaller or even smaller, so that the temperature of the flexible part is effectively reduced, and the thermal creep of the flexible part is reduced.
In order to achieve the above purpose, the present invention is realized by the following technical scheme:
a heater assembly for heating a wafer tray in a vapor deposition apparatus, comprising:
a heating member configured to heat the wafer tray when a current flows therein; the heating component comprises a plurality of heating arc sections;
the support assemblies comprise at least one support rod, and each support assembly is used for supporting the adjacent heating arc sections; the flexible component is connected with one end of the supporting rod, which is far away from the heating arc section, and is used for controlling the displacement and the deformation direction of the heating arc section;
and the conducting component is electrically connected with the adjacent heating arc sections and/or the supporting rod and is used for enabling current to flow between the adjacent heating arc sections.
Preferably, each of the support assemblies further comprises: and the connecting component is connected with the flexible component in the same supporting component and is used for limiting the displacement of the flexible component along the circumferential direction of the heating component.
Preferably, the number of the support rods in each support assembly is 1; the conduction component is a first conduction component, and the first conduction component is fixedly connected with the support rod and the adjacent heating arc section respectively.
Preferably, the resistance of the first conductive member is smaller than the sum of the resistances of the support bar, the flexible member, and the connection member in the same support assembly.
Preferably, the number of the flexible parts in each supporting component is 2, two flexible parts are respectively fixedly connected with two side surfaces of one end, far away from the heating arc section, of the supporting rod in the same supporting component, and the two flexible parts are oppositely arranged.
Preferably, each support assembly comprises 2 support rods; and each supporting rod is fixedly connected with the adjacent heating arc sections.
Preferably, the conducting component is a second conducting component, and the second conducting component is fixedly connected with the adjacent heating arc segments.
Preferably, the resistance of the second conductive member is smaller than the sum of the resistances of the support bar, the flexible member, and the connection member in the same support assembly.
Preferably, the conducting component is a third conducting component, and the third conducting component is fixedly connected with all the support rods in the same support assembly.
Preferably, the resistance of the third conductive member is less than the sum of the resistances of the flexible member and the connection member in the same support assembly.
Preferably, the conducting component is a fourth conducting component, and the fourth conducting component is fixedly connected with all the support rods and the adjacent heating arc sections in the same support assembly respectively.
Preferably, the resistance of the fourth conductive member is smaller than the sum of the resistances of the support bar, the flexible member, and the connection member in the same support assembly.
Preferably, the number of the flexible parts and the number of the support rods in each support assembly are the same; each flexible part is fixedly connected with one end, far away from the heating arc section, of one supporting rod in the same supporting assembly correspondingly, and all the flexible parts are oppositely arranged.
Preferably, the heater assembly further comprises: a plurality of isolation components; each isolation part is correspondingly arranged between the support rod and the flexible part so as to insulate the support rod from the flexible part.
Preferably, the heating arc segments are circumferentially spaced apart along the circumference.
Preferably, the flexible component is one or any combination of a U-shaped spring and a plate spring.
Preferably, the conducting component, the supporting rod, the flexible component and the connecting component are made of one or any combination of tungsten, molybdenum and rhenium or alloys thereof.
In another aspect, the present invention also provides a vapor deposition apparatus, including: vapor deposition reaction chambers and heater assemblies as described above; and the heater component is arranged in the vapor deposition reaction cavity.
Compared with the prior art, the invention has at least one of the following advantages:
according to the heater assembly and the vapor deposition equipment provided by the invention, the heating part can be composed of a plurality of heating arc sections, the support rods in the support assembly can support the adjacent heating arc sections, and the flexible part can control the deformation and displacement of the heating arc sections along the radial direction of the heating part.
In the invention, current can flow between adjacent heating arc sections along the conducting component, and can also flow between adjacent heating arc sections along the supporting rod, the flexible component and the connecting component in the same supporting component. Because the resistance of the passage where the conducting component is located is smaller than that of the passage where the flexible component is located, the current flowing through the conducting component is larger, and the current flowing through the flexible component is smaller, so that the heat on the flexible component caused by the current is smaller, the temperature of the flexible component can be effectively reduced, the thermal creep of the flexible component is reduced, and the deformation and displacement of the heating arc section are reduced.
According to the invention, the support rod and the flexible component can be insulated by arranging the isolation component, so that current cannot flow to the flexible component through the support rod, and further, the current cannot flow between adjacent heating arc sections along the support rod, the flexible component and the connecting component in the same support assembly, so that the temperature of the flexible component is reduced. At the same time, the isolating component can also reduce the thermal conductivity between the support rod and the flexible component, thereby further reducing the temperature of the flexible component.
Drawings
FIG. 1 is a schematic view of a heater assembly according to a first embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a heater assembly according to a second embodiment of the present invention;
fig. 3 is a schematic structural diagram of a heater assembly according to a third embodiment of the present invention.
Detailed Description
The heater assembly and vapor deposition apparatus according to the present invention will be described in further detail with reference to the accompanying drawings and detailed description. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for the purpose of facilitating and clearly aiding in the description of embodiments of the invention. For a better understanding of the invention with objects, features and advantages, refer to the drawings. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the invention to the extent that any modifications, changes in the proportions, or adjustments of the sizes of structures, proportions, or otherwise, used in the practice of the invention, are included in the spirit and scope of the invention which is otherwise, without departing from the spirit or essential characteristics thereof.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Example 1
Referring to fig. 1, the present embodiment provides a heater assembly for heating a wafer tray 100 in a vapor deposition apparatus, comprising: a heating member 110 for heating the wafer tray 100 when a current flows therein; the heating part 110 comprises a plurality of heating arc sections 111; a plurality of support assemblies 120, each support assembly 120 including at least one support rod 121 for supporting adjacent heating arc segments 111; a flexible member 122 connected to one end of the support rod 121 away from the heating arc section 111, for controlling the displacement and deformation direction of the heating arc section 111; and a conductive member 131 electrically connected to the adjacent heating arc segments 111 and/or the support rod 121, for allowing current to flow between the adjacent heating arc segments 111.
With continued reference to fig. 1, the heating arc segments 111 are circumferentially spaced apart.
Specifically, in this embodiment, the heating member 110 has a circular ring shape, which corresponds to the shape of the wafer tray 100, so as to uniformly heat the wafer tray 100, thereby uniformly heating the wafers in the wafer tray 100. The heating element 110 is typically fabricated from a high temperature resistant material (e.g., tungsten, molybdenum, and rhenium or alloys thereof, etc.); taking the example of preparing the tungsten-rhenium alloy material, if the tungsten-rhenium alloy material is directly processed into a circular and integrated heating component, it is difficult to find a tungsten-rhenium alloy plate material meeting the processing requirement, and the material is wasted, so that the heating component 110 is generally composed of a plurality of heating arc segments 111 cut out of the same tungsten-rhenium alloy plate material, so as to reduce the processing difficulty of the heating component 110 and improve the utilization rate of the prepared material, but the invention is not limited thereto.
With continued reference to fig. 1, the number of support rods 121 in each of the support assemblies 120 is 1; the conducting component is a first conducting component 131, and the first conducting component 131 is fixedly connected with the supporting rod 121 and the adjacent heating arc section 111 respectively.
Specifically, in the present embodiment, the number of the support assemblies 120 is the same as the number of the heating arc segments 111; because each supporting component 120 includes only 1 supporting rod 121, one end of the supporting rod 121 near the heating arc segment 111 may be fixedly connected to the lower side of the first conducting component 131, and two ends of the upper side of the first conducting component 131 may be respectively and fixedly connected to the adjacent heating arc segment 111, that is, the first conducting component 131 is located between the supporting rod 121 and the heating arc segment 111, so that the supporting rod 121 may support the adjacent heating arc segment 111 through the first conducting component 131. Preferably, the support rod 121 is fixedly connected to the middle portion of the lower side of the first conductive member 131, so that the first conductive member 131 is uniformly stressed, and the support rod 121 can stably support the adjacent heating arc segments 111, but the invention is not limited thereto.
In yet another embodiment, the first conductive member 131 may be located above the heating arc segment 111; and two ends of the lower side of the first conducting member 131 may be fixedly connected to the adjacent heating arc segments 111, and the middle of the lower side of the first conducting member 131 may be fixedly connected to the support rod 121, but the invention is not limited thereto.
With continued reference to fig. 1, the number of the flexible members 122 in each supporting assembly 120 is 2, two of the flexible members 122 are respectively fixedly connected with two side surfaces of one end of the supporting rod 121, which is far away from the heating arc section 111, in the same supporting assembly, and the two flexible members 122 are oppositely arranged.
It will be appreciated that in some other embodiments, each of the support assemblies 120 further comprises: the connecting part 123 is connected with the flexible part 122 in the same supporting assembly, and the connecting part 123 is fixed on a water cooling plate horizontally arranged in the vapor deposition device (the water cooling plate and the vapor deposition device cavity are indirectly fixed and positioned below a heat insulating plate at the lowest layer of the heating part) and is used as a final fixing part of the flexible part 122.
In some embodiments, the flexible member 122 is one or any combination of a U-shaped spring and a leaf spring.
Specifically, in the present embodiment, in the same supporting assembly 120, each flexible member 122 may be disposed below one heating arc section 111 correspondingly, so as to control the deformation and displacement of the supporting rod 121 along the radial direction of the heating member 110, thereby controlling the deformation and displacement of the heating arc section 111 along the radial direction of the heating member 110; meanwhile, the connection member 123 serves as a final fixing member of the flexible member 122. When the heating arc section 111 is heated to generate thermal creep along the radial direction, the flexible component 122 can deform along with the heating arc section, but the flexible component 122 has better elasticity, and can be restored to the original position when the temperature is reduced, so that the heating arc section 111 is driven to return to the original position, and the drift of the treatment effect under the same process condition is prevented. Preferably, the flexible member 122 is a U-shaped spring, but the invention is not limited thereto.
With continued reference to fig. 1, the conductive member, the support rod 121, the flexible member 122, and the connecting member 123 are made of one or any combination of tungsten, molybdenum, and rhenium or their alloys.
It will be appreciated that in some other embodiments, the resistance of the first conductive member 131 is less than the sum of the resistances of the support rod 121, the flexible member 122, and the connection member 131 in the same support assembly.
Specifically, in this embodiment, since the materials of the first conductive member 131, the support rod 121, the flexible member 122, and the connecting member 123 have conductive properties, the heating current can flow not only between the adjacent heating arc segments 111 along the first conductive member 131, but also between the adjacent heating arc segments 111 along the first path formed by one support rod 121, two flexible members 122, and the connecting member 123 in the same support assembly 120. More specifically, since the resistance of the first conductive member 131 is smaller than the resistance of the first path, the current flowing through the first conductive member 131 is larger, and the current flowing through the support rod 121, the flexible member 122 and the connecting member 123 is smaller, so that the heat on the flexible member 122 caused by the current is smaller, the temperature of the flexible member 122 can be effectively reduced, the thermal creep of the flexible member 122 is reduced, and when the temperature is reduced, the flexible member 122 can be restored to the original position, thereby reducing the deformation and displacement of the heating arc section 111, but the invention is not limited thereto.
With continued reference to fig. 1, the heater assembly further includes: a plurality of isolation members 140; each of the isolation members 140 is disposed between the support rod 121 and the flexible member 122, respectively, to insulate the support rod 121 from the flexible member 122.
Specifically, in this embodiment, the isolation member 140 may be made of a heat insulating material resistant to high temperature, so as to reduce the thermal conductivity between the support rod 121 and the flexible member 122, thereby further reducing the temperature of the flexible member 122, reducing the thermal creep thereof, and further reducing the deformation and displacement of the heating member 110. In addition, since the isolating member 140 has an insulating property, when the isolating member 140 is provided between the support rod 121 and the flexible member 122, current cannot flow to the flexible member 122 and the connecting member 123 through the support rod 121, and at this time, the first conductive member 131 may have only a conductive property, and there is no requirement for the resistance thereof. Preferably, the material of the isolation member 140 is ceramic, but the invention is not limited thereto.
Example two
Referring to fig. 2, the difference from the first embodiment is that each support assembly 120 includes 2 support rods 121; and each supporting rod 121 is fixedly connected to the adjacent heating arc section 111.
With continued reference to fig. 2, the number of the flexible parts 122 and the support rods 121 in each of the support assemblies 120 is the same; each flexible component 122 is fixedly connected to one end of one support rod 121, which is far away from the heating arc section 111, in the same support assembly, and all the flexible components 122 are oppositely arranged.
Specifically, in the present embodiment, in the same supporting component 120, each supporting rod 121 may be fixedly connected to one heating arc segment 111 of the adjacent heating arc segments 111, so that two supporting rods 121 stably support the adjacent heating arc segments 111. The number of the flexible members 122 in each supporting component 120 is two, and each flexible member 122 is correspondingly disposed below one heating arc section 111 and is fixedly connected to a side surface of a supporting rod 121 supporting the heating arc section 111, so as to control the deformation and displacement of the supporting rod 121 and the heating arc section 111 along the radial direction of the heating component 110, but the invention is not limited thereto.
With continued reference to fig. 2, the conducting member is a second conducting member 132, and the second conducting member 132 is fixedly connected to the adjacent heating arc segments 111.
It will be appreciated that in some other embodiments, the resistance of the second conductive member 132 is less than the sum of the resistances of the support rod 121, the flexible member 122, and the connecting member 123 in the same support assembly.
Specifically, in this embodiment, the second conducting member 132 may be located above the heating arc 111; and two ends of the lower side of the second conducting member 132 are respectively and fixedly connected with the adjacent heating arc segments 111, so that current can flow between the adjacent heating arc segments 111 along the second conducting member 132. In addition, the current can also flow between the adjacent heating arcs 111 along the second path formed by the two support rods 121, the two flexible members 122 and the connecting members 123 in the same support assembly 120. More specifically, since the resistance of the second conductive member 132 is smaller than the resistance of the second path, the current flowing through the second conductive member 132 is larger, and the current flowing through the support rod 121, the flexible member 122 and the connecting member 123 is smaller, so that the heat on the flexible member 122 caused by the current is smaller, the temperature of the flexible member 122 can be effectively reduced, the thermal creep of the flexible member can be reduced, and the deformation and displacement of the heating arc section 111 can be further reduced, but the invention is not limited thereto.
Example III
Referring to fig. 3, the difference from the second embodiment is that the conducting member is a third conducting member 133, and the third conducting member 133 is fixedly connected to all the support rods 121 in the same support assembly.
It will be appreciated that in some other embodiments, the resistance of the third conductive member 133 is less than the sum of the resistances of the flexible member 122 and the connecting member 123 in the same support assembly.
Specifically, in this embodiment, the third conducting member 133 may be disposed between the two support rods 121 of the same support assembly 120, so that the current may flow between the adjacent heating arc segments 111 along a third path formed by the third conducting member 133 and the two support rods 121 of the corresponding support assembly 120. In addition, the current can also flow between the adjacent heating arcs 111 along the second path formed by the two support rods 121, the two flexible members 122 and the connecting members 123 in the same support assembly 120. Since the resistance of the third conductive member 133 is smaller than the sum of the resistances of all the flexible members 122 and the connecting members 123 in the same supporting assembly 120, the resistance on the third path is smaller than the resistance on the second path, and the current flowing through the third conductive member 133 and the supporting rod 121 is larger, and the current flowing through the flexible members 122 and the connecting members 123 is smaller, so that the heat caused by the current on the flexible members 122 is smaller, the temperature of the flexible members 122 can be effectively reduced, the thermal creep of the flexible members can be reduced, and the deformation and displacement of the heating arc section 111 can be reduced.
Example IV
The difference from the second embodiment is that the conducting component is a fourth conducting component, and the fourth conducting component is fixedly connected with all the support rods 121 and the adjacent heating arc segments 111 in the same support assembly respectively.
In some other embodiments, the resistance of the fourth conductive member is less than the sum of the resistances of the support rod 121, the flexible member 122, and the connection member 123 in the same support assembly.
Specifically, in this embodiment, the fourth conductive member may be located between the heating arc section 111 and the support rod 121, and two ends of the upper side of the fourth conductive member may be fixedly connected to adjacent heating arc sections 111 respectively, and the lower side of the fourth conductive member may be fixedly connected to all support rods 121 in the same support assembly 120, so that the support rod 121 supports adjacent heating arc sections 111 through the fourth conductive member, and meanwhile, current may flow between adjacent heating arc sections 111 along the fourth conductive member. In addition, the current may also flow between the adjacent heating arc segments 111 along a fourth path formed by the fourth conductive member, the two support rods 121 corresponding to the support assembly 120, the two flexible members 122, and the connecting member 123. Because the resistance of the fourth conductive member is smaller than the resistance of the fourth path, the current flowing through the fourth conductive member is larger, and the current flowing through the support rod 121, the flexible member 122 and the connecting member 123 is smaller, so that the heat on the flexible member 122 caused by the current is smaller, the temperature of the flexible member 122 can be effectively reduced, the thermal creep of the flexible member can be reduced, and the deformation and displacement of the heating arc section 111 can be reduced.
In another aspect, the present embodiment further provides a vapor deposition apparatus, including: vapor deposition reaction chambers and heater assemblies as described above; and the heater component is arranged in the vapor deposition reaction cavity.
In summary, the present embodiment provides a heater assembly and a vapor deposition apparatus, where the heating component may be composed of a plurality of heating arc segments; the support rods in each support assembly can support adjacent heating arc sections, and the flexible component can control the deformation and displacement of the heating arc sections along the radial direction of the heating component; the conducting component electrically connected with the adjacent heating arc sections and/or the supporting rods can enable current to flow between the adjacent heating arc sections so as to heat the wafer tray. In this embodiment, the current not only can flow between the adjacent heating arc segments along the conducting component, but also can flow between the adjacent heating arc segments along the supporting rod, the flexible component and the connecting component in the same supporting component; because the resistance of the passage where the conducting component is located is smaller than that of the passage where the flexible component is located, the current flowing through the conducting component is larger, and the current flowing through the flexible component is smaller, so that the heat on the flexible component caused by the current is smaller, the temperature of the flexible component can be effectively reduced, the thermal creep of the flexible component is reduced, and the deformation and displacement of the heating arc section are reduced. In the embodiment, the isolation part is arranged to insulate the support rod from the flexible part, so that current cannot flow to the flexible part through the support rod, and further, the current cannot flow between adjacent heating arc sections along the support rod, the flexible part and the connecting part in the same support assembly, so that the temperature of the flexible part is reduced; at the same time, the isolating component can also reduce the thermal conductivity between the support rod and the flexible component, thereby further reducing the temperature of the flexible component.
While the present invention has been described in detail through the foregoing description of the preferred embodiment, it should be understood that the foregoing description is not to be considered as limiting the invention. Many modifications and substitutions of the present invention will become apparent to those of ordinary skill in the art upon reading the foregoing. Accordingly, the scope of the invention should be limited only by the attached claims.
Claims (18)
1. A heater assembly for heating a wafer tray in a vapor deposition apparatus, comprising:
a heating member configured to heat the wafer tray when a current flows therein; the heating component comprises a plurality of heating arc sections;
the support assemblies comprise at least one support rod, and each support assembly is used for supporting the adjacent heating arc sections; the flexible component is connected with one end of the supporting rod, which is far away from the heating arc section, and is used for controlling the displacement and the deformation direction of the heating arc section;
and the conducting component is electrically connected with the adjacent heating arc sections and/or the supporting rod and is used for enabling current to flow between the adjacent heating arc sections.
2. The heater assembly of claim 1, wherein each of said support assemblies further comprises: and the connecting component is connected with the flexible component in the same supporting component and is used for limiting the displacement of the flexible component along the circumferential direction of the heating component.
3. The heater assembly of claim 2, wherein the number of support rods in each of said support assemblies is 1; the conduction component is a first conduction component, and the first conduction component is fixedly connected with the support rod and the adjacent heating arc section respectively.
4. A heater assembly according to claim 3, wherein the resistance of the first conductive member is less than the sum of the resistances of the support rod, the flexible member and the connecting member in the same support assembly.
5. A heater assembly according to claim 3, wherein the number of said flexible members in each of said support assemblies is 2, two of said flexible members are fixedly connected to the two sides of one end of said support rod remote from said heating arc section in the same support assembly, and the two of said flexible members are disposed opposite each other.
6. The heater assembly of claim 2, wherein each of said support assemblies includes 2 of said support rods therein; and each supporting rod is fixedly connected with the adjacent heating arc sections.
7. The heater assembly of claim 6, wherein said conductive member is a second conductive member fixedly connected to adjacent said heating arcs.
8. The heater assembly of claim 7, wherein the resistance of said second conductive member is less than the sum of the resistances of said support rod, said flexible member and said connecting member in the same support assembly.
9. The heater assembly of claim 6, wherein said conductive member is a third conductive member fixedly connected to all of said support rods in the same support assembly.
10. The heater assembly of claim 9, wherein the resistance of the third conductive member is less than the sum of the resistances of the flexible member and the connecting member in the same support assembly.
11. The heater assembly of claim 6, wherein said conductive member is a fourth conductive member fixedly connected to all of said support rods and adjacent said heating arcs in the same support assembly, respectively.
12. The heater assembly of claim 11, wherein the resistance of said fourth conductive member is less than the sum of the resistances of said support rod, said flexible member and said connecting member in the same support assembly.
13. The heater assembly of claim 6, wherein the number of said flexible members and said support rods in each of said support assemblies is the same; each flexible part is fixedly connected with one end, far away from the heating arc section, of one supporting rod in the same supporting assembly correspondingly, and all the flexible parts are oppositely arranged.
14. The heater assembly of claim 1, further comprising: a plurality of isolation components; each isolation part is correspondingly arranged between the support rod and the flexible part so as to insulate the support rod from the flexible part.
15. The heater assembly of claim 1, wherein said heating arcs are circumferentially spaced apart.
16. The heater assembly of claim 1, wherein the flexible member is one or any combination of a U-shaped spring and a leaf spring.
17. The heater assembly of claim 2, wherein the material of the conductive member, the support rod, the flexible member, and the connecting member is one or any combination of tungsten, molybdenum, and rhenium, or alloys thereof.
18. A vapor deposition apparatus, comprising: a vapor deposition reaction chamber and a heater assembly as claimed in any one of claims 1 to 17; and the heater component is arranged in the vapor deposition reaction cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111615369.XA CN116356292A (en) | 2021-12-27 | 2021-12-27 | Heater assembly and vapor deposition equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111615369.XA CN116356292A (en) | 2021-12-27 | 2021-12-27 | Heater assembly and vapor deposition equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116356292A true CN116356292A (en) | 2023-06-30 |
Family
ID=86928831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111615369.XA Pending CN116356292A (en) | 2021-12-27 | 2021-12-27 | Heater assembly and vapor deposition equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116356292A (en) |
-
2021
- 2021-12-27 CN CN202111615369.XA patent/CN116356292A/en active Pending
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