CN116313224A - Nickel-coated copper slurry composition, nickel-coated copper slurry, electrode and photovoltaic heterojunction battery - Google Patents
Nickel-coated copper slurry composition, nickel-coated copper slurry, electrode and photovoltaic heterojunction battery Download PDFInfo
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- CN116313224A CN116313224A CN202310354085.2A CN202310354085A CN116313224A CN 116313224 A CN116313224 A CN 116313224A CN 202310354085 A CN202310354085 A CN 202310354085A CN 116313224 A CN116313224 A CN 116313224A
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 314
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 163
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 157
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 110
- 239000010949 copper Substances 0.000 title claims abstract description 110
- 239000002002 slurry Substances 0.000 title claims abstract description 104
- 239000000203 mixture Substances 0.000 title claims abstract description 62
- 239000002952 polymeric resin Substances 0.000 claims abstract description 41
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 39
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 17
- 239000011230 binding agent Substances 0.000 claims description 16
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 13
- 239000003960 organic solvent Substances 0.000 claims description 13
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 9
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 6
- 229920000128 polypyrrole Polymers 0.000 claims description 5
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 4
- 229920000767 polyaniline Polymers 0.000 claims description 4
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 3
- 239000002671 adjuvant Substances 0.000 claims description 3
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 229920000123 polythiophene Polymers 0.000 claims description 3
- 229940116411 terpineol Drugs 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 abstract description 11
- 238000007254 oxidation reaction Methods 0.000 abstract description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 25
- 229910052709 silver Inorganic materials 0.000 description 20
- 239000004332 silver Substances 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- -1 diformate Chemical compound 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Sustainable Development (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Dispersion Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Sustainable Energy (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
Abstract
The invention relates to the technical field of batteries, in particular to a nickel-copper-clad slurry composition, a nickel-copper-clad slurry, an electrode and a photovoltaic heterojunction battery, wherein the nickel-copper-clad slurry composition comprises or is prepared from the nickel-copper-clad slurry composition. The nickel-coated copper slurry composition comprises 80-93 parts by weight of nickel-coated copper powder, 2-15 parts by weight of conductive polymer resin and 2-10 parts by weight of auxiliary agent, wherein 100 parts by weight of the nickel-coated copper slurry composition is taken as a reference. The nickel-coated copper slurry composition can improve conductivity and reduce cost; the nickel-coated copper slurry has better conductivity, higher oxidation resistance and lower cost, and has better industrialization prospect; the electrode prepared from the nickel-coated copper slurry has lower resistivity and lower cost; the photovoltaic heterojunction battery comprising the electrode has the characteristics of lower resistivity and lower cost.
Description
Technical Field
The invention relates to the technical field of batteries, in particular to a nickel-copper-clad slurry composition, a nickel-copper-clad slurry, an electrode and a photovoltaic heterojunction battery, wherein the nickel-copper-clad slurry composition comprises or is prepared from the nickel-copper-clad slurry composition.
Background
HJT cell is amorphous silicon film heterojunction cell, is heterojunction formed by two different semiconductor materials, HJT is to deposit amorphous silicon film on crystalline silicon, combines the advantages of crystalline silicon cell and film cell, has high conversion efficiency, low process temperature, low attenuation rate, double-sided power generation, simplified equipment process flow, large cost reduction and synergy space, and has wide prospect, thus being the development direction of new generation cell technology.
Heterojunction slurry in the current market is mainly divided into silver slurry, silver coated copper slurry and copper slurry. The silver paste has the advantages of simple process, optimal electrical performance and stability, and highest cost, and is the most mature mass production scheme in the current market. The conductivity and various performances of the silver-coated copper paste are close to those of the silver paste, the cost is superior to that of the pure silver paste, and the silver-coated copper paste is a technical scheme for reducing the cost which is mainly promoted in the market at present, but the compactness of silver coated on the surface of copper powder, easy oxidation of copper and continuous silver reduction can lead to the problem that the coating layer becomes thinner and the reliability risk is reduced, and the price of the silver-coated copper paste is still higher at present, so that the cost reduction requirement is still urgent. Copper paste is the least costly and copper is the metal with conductivity inferior to silver, but copper is easily oxidized, resulting in a decrease in electrical properties, which is an important reason why copper paste is not industrialized in this field.
In addition, the existing heterojunction low-temperature slurry generally adopts polymer resin as a binding phase, the resin shrinks in the curing process to reduce the distance between the powder bodies to form a conductive network, and meanwhile, the polymer resin coats the powder bodies and wets the base material to generate good adhesive force, but the resin coats the powder bodies too well and can influence the conductivity of the slurry, so that the adhesive force and the conductivity of the slurry need to be balanced better.
Therefore, it is important to invent a photovoltaic heterojunction cell with lower resistivity and lower cost.
Disclosure of Invention
The invention aims to overcome the problems in the prior art and provide a nickel-coated copper slurry composition, a nickel-coated copper slurry comprising the nickel-coated copper slurry composition or prepared from the nickel-coated copper slurry composition, an electrode and a photovoltaic heterojunction battery. The nickel-coated copper slurry composition comprises nickel-coated copper powder and conductive polymer resin, so that the conductivity can be improved and the cost can be reduced; the nickel-coated copper slurry composition or the nickel-coated copper slurry prepared from the nickel-coated copper slurry composition has better conductive performance, higher oxidation resistance and lower cost, and has better industrialized prospect; the electrode prepared from the nickel-coated copper slurry has lower resistivity and lower cost; the photovoltaic heterojunction battery comprising the electrode has the characteristics of lower resistivity and lower cost.
The invention provides a nickel-coated copper slurry composition, which comprises nickel-coated copper powder, conductive polymer resin and an auxiliary agent, wherein the nickel-coated copper powder is 80-93 parts by weight, the conductive polymer resin is 2-15 parts by weight and the auxiliary agent is 2-10 parts by weight based on 100 parts by weight of the nickel-coated copper slurry composition.
In one example, the ratio of the weight of the nickel-coated copper powder to the weight of the conductive polymer resin is (6-30): 1.
In one example, the nickel-coated copper powder is a spherical powder, and the average particle size of the nickel-coated copper powder is 1-3 μm.
In one example, the tap density of the nickel-coated copper powder is 2-5g/cm 2 。
In one example, the weight content of nickel element is 5-30wt%, based on the total weight of the nickel-coated copper powder.
In one example, the conductive polymer resin is selected from one or more of polypyrrole, polythiophene, polyaniline, and polyphenylacetylene.
In one example, the adjuvant includes an organic binder, an organic solvent, and a curing agent.
In one example, the organic binder is selected from one or more of bisphenol a type epoxy resin, bisphenol F type epoxy resin, phenolic epoxy resin, and hydrogenated epoxy resin.
In one example, the organic solvent is selected from one or more of diethylene glycol butyl ether acetate, 1,4 butanediol diglycidyl ether, diformate, and terpineol.
In one example, the curing agent is selected from one or more of hexafluoroantimonate cationic curing agents, ultrafine dicyandiamide, diaminodiphenyl sulfone, and boron trifluoride-amine complexes.
In one example, the organic binder is 1 to 5 parts by weight, the organic solvent is 0.5 to 5 parts by weight, and the curing agent is 0.1 to 0.5 parts by weight, based on 100 parts by weight of the nickel-coated copper paste composition.
In one example, the nickel-coated copper powder is 85-90 parts by weight, the conductive polymer resin is 5-10 parts by weight, and the auxiliary agent is 4-8 parts by weight based on 100 parts by weight of the nickel-coated copper slurry composition.
In a second aspect, the invention provides a nickel-copper-clad slurry, which comprises or is prepared from the nickel-copper-clad slurry composition of the first aspect.
In one example, the resistivity of the nickel-clad copper slurry is less than 10uΩ·cm.
In one example, the nickel-coated copper paste has a resistivity of less than 10%.
According to a third aspect of the invention, there is provided an electrode prepared from the nickel-coated copper paste according to the second aspect.
A fourth aspect of the invention provides a photovoltaic heterojunction cell comprising an electrode according to the third aspect.
Through the technical scheme, compared with the prior art, the invention has at least the following advantages:
(1) The nickel-coated copper slurry composition comprises nickel-coated copper powder and conductive polymer resin, so that the conductivity can be improved and the cost can be reduced;
(2) The nickel-coated copper slurry has good conductivity;
(3) The nickel-coated copper slurry has high oxidation resistance;
(4) The nickel-coated copper slurry has low cost;
(5) The electrode has low resistivity and low resistivity change rate;
(6) The electrode has low cost;
(7) The photovoltaic heterojunction battery has low resistivity and low resistance change rate;
(8) The photovoltaic heterojunction battery has low cost.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Detailed Description
The following describes specific embodiments of the present invention in detail. It should be understood that the detailed description and specific examples, while indicating and illustrating the invention, are not intended to limit the invention.
The invention provides a nickel-coated copper slurry composition, which comprises nickel-coated copper powder, conductive polymer resin and an auxiliary agent, wherein the nickel-coated copper powder is 80-93 parts by weight, the conductive polymer resin is 2-15 parts by weight and the auxiliary agent is 2-10 parts by weight based on 100 parts by weight of the nickel-coated copper slurry composition.
In the present invention, by introducing nickel-coated copper powder and conductive polymer resin into the nickel-coated copper paste composition, it has been possible to achieve better conductivity, higher oxidation resistance and lower cost than the prior art by the nickel-coated copper paste including the nickel-coated copper paste composition or the nickel-coated copper paste prepared from the nickel-coated copper paste composition. In order to further enhance the effect, one or more of the technical features may be further preferred.
The nickel-coated copper slurry composition may include nickel-coated copper powder, a conductive polymer resin, and an auxiliary agent. The coating of the nickel layer in the nickel-coated copper powder is denser and more uniform than the coating of the silver-coated copper in the prior art, so that the oxidation resistance of the nickel-coated copper slurry is improved, the cost of the nickel-coated copper slurry is reduced, meanwhile, the conductive polymer resin is introduced into the nickel-coated copper slurry composition, and the nickel-coated copper slurry can be solidified to form a conductive network channel, so that the conductivity of the nickel-coated copper slurry is improved, and the effects of good conductivity, high oxidation resistance and low cost of the nickel-coated copper slurry are realized.
The nickel-coated copper powder is 80-93 parts by weight (for example, 80 parts by weight, 81 parts by weight, 82 parts by weight, 83 parts by weight, 84 parts by weight, 85 parts by weight, 86 parts by weight, 87 parts by weight, 88 parts by weight, 89 parts by weight, 90 parts by weight, 91 parts by weight, 92 parts by weight, 93 parts by weight) based on 100 parts by weight of the nickel-coated copper slurry composition, the conductive polymer resin is 2-15 parts by weight (for example, 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight, 6 parts by weight, 7 parts by weight, 8 parts by weight, 9 parts by weight, 10 parts by weight, 11 parts by weight, 12 parts by weight, 13 parts by weight, 14 parts by weight, 15 parts by weight), and the auxiliary agent is 2-10 parts by weight (for example, 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight, 6 parts by weight, 7 parts by weight, 8 parts by weight, 9 parts by weight, 10 parts by weight).
In one example, the nickel-coated copper powder is 85-90 parts by weight, the conductive polymer resin is 5-10 parts by weight, and the auxiliary agent is 4-8 parts by weight based on 100 parts by weight of the nickel-coated copper slurry composition.
In one example, the ratio of the weight of the nickel-coated copper powder to the weight of the conductive polymer resin is (6-30): 1 (e.g., 6:1, 10:1, 15:1, 20:1, 25:1, 30:1). In the nickel-coated copper paste composition, the relative amount of the conductive polymer resin is increased, so that the conductive performance of the nickel-coated copper paste can be improved, and therefore, the purposes of balancing the conductive performance and reducing the cost can be achieved by limiting the weight ratio of the nickel-coated copper powder to the weight of the conductive polymer resin within the specific range, so that the nickel-coated copper paste has the characteristics of good conductive performance and low cost.
In one example, the ratio of the weight of the nickel-coated copper powder to the weight of the conductive polymer resin is (8.5-18): 1.
In one example, the nickel-coated copper powder is a spherical powder.
In one example, the nickel-coated copper powder has an average particle size of 1-3 μm (e.g., 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm). The average particle size may be measured using a laser particle sizer.
In one example, the nickel-coated copper powder has an average particle size of 2-2.5 μm.
According to a specific embodiment, the tap density of the nickel-coated copper powder is 2-5g/cm 2 (e.g., 2 g/cm) 2 、2.5g/cm 2 、3g/cm 2 、3.5g/cm 2 、4g/cm 2 、4.5g/cm 2 、5g/cm 2 )。
In one example, the nickel-coated copper powder is tappedDensity of 2.5-3g/cm 2 。
According to a specific embodiment, the weight content of nickel element is 5-30wt% (e.g., 5wt%, 10wt%, 15wt%, 20wt%, 25wt%, 30 wt%) based on the total weight of the nickel-coated copper powder. The coating property of the surface of the copper powder can be improved by limiting the weight content of the nickel element in the nickel-coated copper powder, so that the oxidation resistance is improved and the requirement of resistance is met.
In one example, the weight content of nickel element is 10-20wt%, based on the total weight of the nickel-coated copper powder.
In the present invention, the conductive polymer resin has conductivity. The conductive polymer resin can be used for coating relative powder in the nickel-coated copper slurry, wetting a base material to generate adhesive force, and can be used as a conductive agent to form a conductive network so as to improve the conductivity of the nickel-coated copper slurry.
In one example, the conductive polymer resin may be selected from one or more of polypyrrole, polythiophene, polyaniline, and polyphenylacetylene.
In one example, the conductive polymer resin is polypyrrole.
In one example, the adjuvant includes an organic binder, an organic solvent, and a curing agent.
In the invention, the organic binder is used as a binding phase, and can also coat the powder and moisten the base material to generate adhesive force, so that the organic binder is cooperated with the conductive polymer resin to further improve the adhesive force of the nickel-coated copper slurry.
According to a specific embodiment, the organic binder is 1 to 5 parts by weight (e.g., 1 part by weight, 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight) based on 100 parts by weight of the nickel-coated copper slurry composition.
In one example, the organic binder is 2-4 parts by weight based on 100 parts by weight of the nickel copper clad slurry composition.
In one example, the organic binder is selected from one or more of bisphenol a type epoxy resin, bisphenol F type epoxy resin, phenolic epoxy resin, and hydrogenated epoxy resin.
According to a specific embodiment, the organic solvent is 0.5 to 5 parts by weight (e.g., 0.5 parts by weight, 1 part by weight, 1.5 parts by weight, 2 parts by weight, 2.5 parts by weight, 3 parts by weight, 3.5 parts by weight, 4 parts by weight, 4.5 parts by weight, 5 parts by weight) based on 100 parts by weight of the nickel copper clad slurry composition.
In one example, the organic solvent is 1-2 parts by weight based on 100 parts by weight of the nickel copper clad slurry composition.
In one example, the organic solvent is selected from one or more of diethylene glycol butyl ether acetate, 1,4 butanediol diglycidyl ether, diformate, and terpineol.
According to a specific embodiment, the curing agent is 0.1 to 0.5 parts by weight (e.g., 0.1 parts by weight, 0.2 parts by weight, 0.3 parts by weight, 0.4 parts by weight, 0.5 parts by weight) based on 100 parts by weight of the nickel-coated copper slurry composition.
In one example, the curing agent is 0.2 to 0.4 parts by weight based on 100 parts by weight of the nickel copper clad slurry composition.
In one example, the curing agent is selected from one or more of hexafluoroantimonate cationic curing agents, ultrafine dicyandiamide, diaminodiphenyl sulfone, and boron trifluoride-amine complexes.
In one example, the nickel-coated copper paste composition comprises 80-93 parts by weight of the nickel-coated copper powder, 2-15 parts by weight of the conductive polymer resin, 1-5 parts by weight of the organic binder, 0.5-5 parts by weight of the organic solvent, and 0.1-0.5 parts by weight of the curing agent.
According to the nickel-coated copper slurry composition, the components are matched in a specific proportion, so that the nickel-coated copper slurry comprising the nickel-coated copper slurry composition or the nickel-coated copper slurry prepared from the nickel-coated copper slurry composition has the conductivity, the requirement of an electrode on the nickel-coated copper slurry can be met, and the effects of balancing the conductivity and reducing the cost are achieved.
In one example, the nickel-coated copper paste composition comprises 85-90 parts by weight of the nickel-coated copper powder, 5-10 parts by weight of the conductive polymer resin, 2-4 parts by weight of the organic binder, 1-2 parts by weight of the organic solvent, and 0.2-0.4 part by weight of the curing agent.
In a second aspect, the invention provides a nickel-copper-clad slurry, which comprises or is prepared from the nickel-copper-clad slurry composition of the first aspect.
The nickel-coated copper slurry can be prepared by a conventional preparation process.
The nickel-coated copper paste can be applied to an electrode. The electrode requires that the resistivity of the nickel-coated copper paste be less than 10uΩ·cm (e.g., 9.5uΩ·cm, 9uΩ·cm, 8uΩ·cm, 7uΩ·cm, 6uΩ·cm, 5uΩ·cm, 4uΩ·cm, 3uΩ·cm, 2uΩ·cm, 1uΩ·cm), and/or that the resistivity of the nickel-coated copper paste be less than 10% (e.g., 9.5%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, 0.5%).
When the resistivity and/or the resistivity change rate of the nickel-coated copper slurry are controlled within a certain range, the conductivity of the nickel-coated copper slurry can be improved, and the cost is reduced. When the resistivity of the nickel-coated copper slurry is higher than 10uΩ·cm, the power loss of the electrode is higher, and the conversion efficiency of the battery is affected. When the resistivity change rate of the nickel-coated copper paste is higher than 10%, the oxidation resistance of the electrode is low.
In one example, the resistivity of the nickel-clad copper slurry is less than 8uΩ·cm.
In one example, the nickel-coated copper paste has a resistivity of less than 8%.
The nickel-coated copper slurry is prepared from the nickel-coated copper slurry composition or the nickel-coated copper slurry composition, and the resistivity and/or the resistivity change rate of the nickel-coated copper slurry are controlled in a certain range, so that the nickel-coated copper slurry meets the requirement of an electrode on conductivity.
According to a third aspect of the invention, there is provided an electrode prepared from the nickel-coated copper paste according to the second aspect.
The material and the structure of the electrode nickel-coated copper-coated slurry can be carried out according to the mode in the field, and the effects of low resistivity, low resistivity change rate and low cost can be realized.
The electrode is prepared from the nickel-coated copper slurry, so that the conductivity of the electrode is improved, and the cost is reduced.
A fourth aspect of the invention provides a photovoltaic heterojunction cell comprising an electrode according to the third aspect.
The materials and structures of the photovoltaic heterojunction battery except the electrode can be carried out according to the mode in the field, and the effects of low resistivity, low resistivity change rate and low cost can be achieved.
The electrode is used for improving the conductivity of the photovoltaic heterojunction battery and reducing the cost.
The present invention will be described in detail by examples. The described embodiments of the invention are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The following examples illustrate the nickel copper clad slurry compositions of the present invention.
Example 1
Nickel coated copper powder: 90 parts by weight, an average particle diameter of 2 μm and a tap density of 2.5g/cm 2 The weight content of nickel element is 10wt%;
conductive polymer resin: 6 parts by weight of polypyrrole;
auxiliary agent: the total weight of the organic binder is 2 parts (1 part of phenolic resin, 1 part of bisphenol A epoxy resin), 1.7 parts of organic solvent (diethylene glycol butyl ether acetate) and 0.3 part of curing agent (hexafluoroantimonate cationic curing agent).
Example 2 group
This example is for explaining the influence of changing the weight parts of the conductive polymer resin.
Example 2a
This example was conducted with reference to example 1 except that the weight parts of the conductive polymer resin were adjusted to 10, specifically referring to table 1.
Example 2b
This example was conducted with reference to example 1 except that the weight part of the conductive polymer resin was adjusted to 3, specifically referring to table 1.
Example 2c
This example was conducted with reference to example 1 except that the weight parts of the conductive polymer resin was adjusted to 15, specifically referring to table 1.
Example 3
This example was conducted with reference to example 1, except that the specific selection of the conductive polymer resin was adjusted to polyaniline, see specifically table 1.
Example 4 group
This set of examples is intended to illustrate the effect of varying the parts by weight of nickel-coated copper powder.
Example 4a
This example was conducted with reference to example 1 except that the weight parts of nickel-coated copper powder were adjusted to 85, see specifically table 1.
Example 4b
This example was conducted with reference to example 1 except that the weight parts of nickel-coated copper powder were adjusted to 80, see specifically table 1.
Example 5 group
This set of examples is intended to illustrate the effect of varying the weight content of nickel element in nickel-coated copper powder.
Example 5a
This example was conducted with reference to example 1, except that the weight content of nickel element in the nickel-coated copper powder was adjusted to 20wt%, with specific reference to table 1.
Example 5b
This example was conducted with reference to example 1, except that the weight content of nickel element in the nickel-coated copper powder was adjusted to 5wt%, with specific reference to table 1.
Example 6
This example was conducted with reference to example 1, except that the tap density of the nickel-coated copper powder was adjusted to 5g/cm 2 See in particular table 1.
Example 7
This example was conducted with reference to example 1, except that the average particle size of the nickel-coated copper powder was adjusted to 3 μm, see specifically table 1.
TABLE 1
Comparative example 1
Reference example 1 was made, except that the conductive polymer resin was replaced with the same parts by weight of organic binder.
Comparative example 2
Reference to comparative example 1 was conducted except that the nickel-coated copper powder was replaced with the same weight part of silver powder, and the average particle diameter of the silver powder was 2 μm and tap density was 2.5g/cm 2 The silver content by weight of the silver powder was 92wt%.
Comparative example 3
Reference to comparative example 1 was made except that the nickel-coated copper powder was replaced with the same weight part of silver-coated copper powder, the average particle diameter of the silver-coated copper powder was 2. Mu.m, and the tap density was 2.5g/cm 2 The weight content of silver in the silver-coated copper powder is 10wt%.
Preparation example
The nickel-coated copper slurry compositions of the examples and the comparative examples were subjected to a planetary stirring and three-roll grinding process to prepare nickel-coated copper slurries. And (3) printing the prepared nickel-coated copper slurry by using a 480-mesh screen, wherein the screen is provided with 23 mu m openings, solidifying the slurry for 7min at 200 ℃, and cooling to room temperature.
Test case
1. Resistivity test
The resistance R of the silver paste was measured with a multimeter, the thickness h and the width D of the silver paste were measured with a 3D microscope, and the formula p=r×s/L (S is the cross-sectional area of the silver wire and L is the length of the silver wire) was calculated by the resistivity.
2. Resistance change rate test
Testing initial resistance R with multimeter 0 Resistance R after loop measurement 1 。
Rate of change in resistance= (R 1 -R 0 )/R 0 *100％。
3. Cost calculation
The metal price is calculated with reference to the metal net of the Yangtze river of China on the same day, the silver price is calculated with 5300 yuan/kg, the copper price is calculated with 68 yuan/kg, and the nickel price is calculated with 213 yuan/kg.
The results are shown in Table 2.
TABLE 2
As can be seen from table 2, the nickel-coated copper paste of the examples has low resistivity, low resistivity change rate and low cost, and it is described that the nickel-coated copper paste composition includes the nickel-coated copper paste composition or the nickel-coated copper paste prepared from the nickel-coated copper paste composition has the effects of good conductivity, high oxidation resistance and low cost.
By comparing the embodiment 1 with the comparative example 2 and the comparative example 3, the cost of the nickel-coated copper paste is obviously reduced, and meanwhile, the resistivity and the resistivity change rate are lower, which indicates that the nickel-coated copper paste has good conductivity and oxidation resistance while the cost is obviously reduced.
By comparing the example 1 with the comparative example 1, the conductivity of the nickel-coated copper paste of the invention is obviously improved, which indicates that the conductive polymer resin is introduced to improve the conductivity of the nickel-coated copper paste.
The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited thereto. Within the scope of the technical idea of the invention, a number of simple variants of the technical solution of the invention are possible, including combinations of the individual technical features in any other suitable way, which simple variants and combinations should likewise be regarded as being disclosed by the invention, all falling within the scope of protection of the invention.
Claims (10)
1. The nickel-coated copper slurry composition is characterized by comprising nickel-coated copper powder, conductive polymer resin and an auxiliary agent, wherein the nickel-coated copper powder is 80-93 parts by weight, the conductive polymer resin is 2-15 parts by weight and the auxiliary agent is 2-10 parts by weight based on 100 parts by weight of the nickel-coated copper slurry composition.
2. The nickel copper-clad slurry composition according to claim 1, wherein the ratio of the weight of the nickel copper-clad powder to the weight of the conductive polymer resin is (6-30): 1.
3. The nickel-coated copper slurry composition according to claim 1, wherein the nickel-coated copper powder is a spherical powder having an average particle size of 1-3 μm;
and/or the tap density of the nickel-coated copper powder is 2-5g/cm 2 ；
And/or, based on the total weight of the nickel-coated copper powder, the weight content of the nickel element is 5-30wt%.
4. The nickel copper clad slurry composition according to claim 1, wherein the conductive polymer resin is selected from one or more of polypyrrole, polythiophene, polyaniline, and polyphenylacetylene.
5. The nickel copper clad slurry composition of claim 1 wherein the adjuvant comprises an organic binder, an organic solvent, and a curing agent;
and/or the organic binder is selected from one or more of bisphenol a type epoxy resin, bisphenol F type epoxy resin, phenolic epoxy resin and hydrogenated epoxy resin;
and/or the organic solvent is selected from one or more of diethylene glycol butyl ether acetate, 1,4 butanediol diglycidyl ether, diformate and terpineol;
and/or the curing agent is selected from one or more of hexafluoroantimonate cationic curing agents, superfine dicyandiamide, diaminodiphenyl sulfone and boron trifluoride-amine complex;
and/or, based on 100 weight parts of the nickel-coated copper slurry composition, 1-5 weight parts of the organic binder, 0.5-5 weight parts of the organic solvent and 0.1-0.5 weight part of the curing agent.
6. The nickel-coated copper slurry composition according to claim 1, wherein the nickel-coated copper powder is 85-90 parts by weight, the conductive polymer resin is 5-10 parts by weight, and the auxiliary agent is 4-8 parts by weight, based on 100 parts by weight of the nickel-coated copper slurry composition.
7. A nickel-copper clad slurry, characterized in that the nickel-copper clad slurry comprises or is prepared from the nickel-copper clad slurry composition according to any one of claims 1-6.
8. The nickel-copper clad slurry according to claim 7, wherein the resistivity of the nickel-copper clad slurry is less than 10uΩ -cm, and/or the resistivity of the nickel-copper clad slurry is less than 10%.
9. An electrode prepared from the nickel-coated copper slurry of claim 7 or 8.
10. A photovoltaic heterojunction cell characterized in that it comprises the electrode of claim 9.
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| CN108281761A (en) * | 2018-01-08 | 2018-07-13 | 悟墨（上海）智能科技有限公司 | A kind of nanocarbon/metal conducing composite material and its application |
| US20190292418A1 (en) * | 2016-07-15 | 2019-09-26 | E I Du Pont De Nemours And Company | Electrically conductive adhesives |
| CN112521886A (en) * | 2020-12-14 | 2021-03-19 | 西南科技大学 | Preparation and use methods of novel adhesive capable of being peeled and disassembled as required |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190292418A1 (en) * | 2016-07-15 | 2019-09-26 | E I Du Pont De Nemours And Company | Electrically conductive adhesives |
| CN108281761A (en) * | 2018-01-08 | 2018-07-13 | 悟墨（上海）智能科技有限公司 | A kind of nanocarbon/metal conducing composite material and its application |
| CN112521886A (en) * | 2020-12-14 | 2021-03-19 | 西南科技大学 | Preparation and use methods of novel adhesive capable of being peeled and disassembled as required |
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