CN116285512A - Organic carrier for slurry, preparation method of organic carrier, conductive slurry and application of conductive slurry - Google Patents
Organic carrier for slurry, preparation method of organic carrier, conductive slurry and application of conductive slurry Download PDFInfo
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- CN116285512A CN116285512A CN202211601171.0A CN202211601171A CN116285512A CN 116285512 A CN116285512 A CN 116285512A CN 202211601171 A CN202211601171 A CN 202211601171A CN 116285512 A CN116285512 A CN 116285512A
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- Prior art keywords
- organic
- slurry
- dispersing agent
- paste
- resin
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- 239000002002 slurry Substances 0.000 title claims abstract description 64
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000002270 dispersing agent Substances 0.000 claims abstract description 66
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 62
- 239000000853 adhesive Substances 0.000 claims abstract description 16
- 230000001070 adhesive effect Effects 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims description 57
- 239000011347 resin Substances 0.000 claims description 57
- 239000003960 organic solvent Substances 0.000 claims description 38
- -1 alcohol ester Chemical class 0.000 claims description 30
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 24
- 239000000843 powder Substances 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 21
- NXQMCAOPTPLPRL-UHFFFAOYSA-N 2-(2-benzoyloxyethoxy)ethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOCCOC(=O)C1=CC=CC=C1 NXQMCAOPTPLPRL-UHFFFAOYSA-N 0.000 claims description 20
- 229920002396 Polyurea Polymers 0.000 claims description 19
- 239000004925 Acrylic resin Substances 0.000 claims description 18
- 229920000178 Acrylic resin Polymers 0.000 claims description 18
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 18
- 229920000570 polyether Polymers 0.000 claims description 18
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 17
- 229920001577 copolymer Polymers 0.000 claims description 17
- 239000011230 binding agent Substances 0.000 claims description 15
- 238000003756 stirring Methods 0.000 claims description 12
- IBLKWZIFZMJLFL-UHFFFAOYSA-N 1-phenoxypropan-2-ol Chemical compound CC(O)COC1=CC=CC=C1 IBLKWZIFZMJLFL-UHFFFAOYSA-N 0.000 claims description 10
- UDSFAEKRVUSQDD-UHFFFAOYSA-N Dimethyl adipate Chemical compound COC(=O)CCCCC(=O)OC UDSFAEKRVUSQDD-UHFFFAOYSA-N 0.000 claims description 10
- 229910019142 PO4 Inorganic materials 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000010452 phosphate Substances 0.000 claims description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 claims description 8
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 7
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 5
- 239000000194 fatty acid Substances 0.000 claims description 5
- 229930195729 fatty acid Natural products 0.000 claims description 5
- 150000004665 fatty acids Chemical class 0.000 claims description 5
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 4
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 claims description 4
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 claims description 4
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 4
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 4
- 239000005642 Oleic acid Substances 0.000 claims description 4
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 4
- 235000021314 Palmitic acid Nutrition 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 229920002301 cellulose acetate Polymers 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 claims description 4
- 229910021485 fumed silica Inorganic materials 0.000 claims description 4
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 4
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 claims description 4
- 229920001778 nylon Polymers 0.000 claims description 4
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 3
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 claims description 3
- 239000005639 Lauric acid Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 claims description 3
- 238000007639 printing Methods 0.000 abstract description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052710 silicon Inorganic materials 0.000 abstract description 5
- 239000010703 silicon Substances 0.000 abstract description 5
- 238000007650 screen-printing Methods 0.000 abstract description 4
- 239000006185 dispersion Substances 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 3
- 238000005245 sintering Methods 0.000 abstract description 3
- 230000009974 thixotropic effect Effects 0.000 abstract description 3
- 238000009736 wetting Methods 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 26
- 239000000203 mixture Substances 0.000 description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- HTUMBQDCCIXGCV-UHFFFAOYSA-N lead oxide Chemical compound [O-2].[Pb+2] HTUMBQDCCIXGCV-UHFFFAOYSA-N 0.000 description 9
- YEXPOXQUZXUXJW-UHFFFAOYSA-N lead(II) oxide Inorganic materials [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 9
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 8
- 229910018068 Li 2 O Inorganic materials 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 8
- 239000002994 raw material Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000004513 sizing Methods 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000006259 organic additive Substances 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 241000233805 Phoenix Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229960000541 cetyl alcohol Drugs 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- JZZIHCLFHIXETF-UHFFFAOYSA-N dimethylsilicon Chemical compound C[Si]C JZZIHCLFHIXETF-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- LQZZUXJYWNFBMV-UHFFFAOYSA-N ethyl butylhexanol Natural products CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- BXWNKGSJHAJOGX-UHFFFAOYSA-N n-hexadecyl alcohol Natural products CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
- C09D125/02—Homopolymers or copolymers of hydrocarbons
- C09D125/04—Homopolymers or copolymers of styrene
- C09D125/08—Copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/04—Thixotropic paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention relates to the technical field of conductive paste. The invention discloses an organic carrier for slurry, a preparation method thereof, conductive slurry and application thereof. The organic carrier for the paste comprises an organic adhesive, an anti-settling thixotropic agent and a dispersing agent, and by adopting the collocation of the specific types of the organic adhesive, the anti-settling thixotropic agent and the dispersing agent, the paste has good printing performance, meets various requirements of narrow line width screen printing at a client production end, simultaneously ensures better dispersion and wetting of the paste, ensures that the paste has optimal thixotropic performance, can ensure that the paste has good printing performance, balances contradiction between paste molding and contact, has small contact resistance with a silicon wafer after sintering, reduces series resistance and improves open circuit voltage Voc.
Description
Technical Field
The invention relates to the technical field of conductive paste, in particular to an organic carrier for paste, a preparation method thereof, conductive paste and application thereof.
Background
The organic carrier of the current slurry mainly comprises resin, solvent and organic additive, wherein the resin mainly comprises acrylic resin, butyl cellulose acetate, ethyl cellulose and polyvinyl butyral 4; common solvents include terpineol, butyl carbitol acetate, diethylene glycol dibutyl ether, diethylene glycol diethyl ether acetate, cetyl alcohol ester, dimethyl nylon acid, tributyl citrate, etc.; the organic additive generally comprises a surfactant (dispersing agent) and an anti-settling thixotropic agent, wherein the surfactant generally comprises span, oleic acid, palmitic acid, phosphate dispersing agent, fatty acid dispersing agent and the like, and the anti-settling thixotropic agent generally comprises phosphate thixotropic agent, polyurea thixotropic agent, fumed silica, dimethylsilicon oil and the like.
In the field of photovoltaic electronic paste, with the continuous breakthrough of new technologies such as IBC/HBC and the like, the grid lines of the IBC/HBC battery are all on the back surface, and the shading is not needed to be considered, so that the grid lines can be designed more flexibly, and the series resistance is reduced. However, since the front surface of the IBC/HBC cell is not shielded by the metal gate line, the current density is large and the contact on the back surface and the external series resistance loss on the gate line are also large. The recombination of the metal contact areas is generally large, so that the smaller the proportion of the contact areas in a certain range (contact resistance loss is sufficiently small), the less the recombination, and thus the higher the Voc. Therefore, new requirements are put forward on IBC/HBC slurry, such as uniform and compact grid lines can be printed through a screen printing plate with a narrow line width, and the contact resistance between the IBC/HBC slurry and a silicon wafer after metallization is ensured to be small while the line width is narrow.
At present, the organic carrier system of the slurry is difficult to meet the use requirement of the novel slurry, and new materials and new systems are required to be redeveloped to match the requirement of the novel process, so that the optimal efficiency is achieved.
Disclosure of Invention
In view of the defects existing in the prior art, the invention aims to provide an organic carrier for slurry, a preparation method thereof, conductive slurry and application thereof.
In a first aspect, the present invention provides an organic carrier for a slurry, comprising an organic binder, an anti-settling thixotropic agent, and a dispersing agent;
wherein the organic binder comprises an organic resin and an organic solvent, and the organic resin comprises at least one of maleic anhydride resin, styrene copolymer, modified acrylic resin, modified butyl cellulose acetate and polyvinyl butyral;
the organic solvent comprises at least one of diethylene glycol dibenzoate, dimethyl adipate, propylene glycol phenyl ether, butyl carbitol, diethylene glycol dibutyl ether, diethylene glycol diethyl ether acetate, alcohol ester twelve, dimethyl nylon acid and ethylene glycol phenyl ether;
the anti-settling thixotropic agent comprises at least one of polypropylene maleic anhydride grafted compound, polyurea thixotropic agent, fumed silica, dimethyl silicone oil, phosphate thixotropic agent and modified polyamide wax;
the dispersing agent comprises at least one of solvent-free polyether system dispersing agent, myristic acid, lauric acid, oleic acid, palmitic acid, phosphate dispersing agent and fatty acid dispersing agent.
Preferably, the mass ratio of the organic binder, the anti-settling thixotropic agent and the dispersing agent for the slurry is (170-220) (1.8-3.6) (2.5-5.5).
Preferably, the mass ratio of the organic resin to the organic solvent is (11-42): 129-160.
In a second aspect, the invention also provides a preparation method of the organic carrier for slurry, which comprises the following steps: and mixing the organic resin, the organic solvent, the anti-settling thixotropic agent and the dispersing agent to obtain the organic carrier for the slurry.
Preferably, the preparation method of the organic carrier for slurry comprises the following steps: heating the organic solvent to 60-100 ℃, stirring for 0.5-1 h, adding the organic resin, heating to 110-130 ℃, continuously stirring for 0.5-2 h, then cooling to 45-55 ℃, adding the anti-settling thixotropic agent and the dispersing agent, and continuously stirring for 0.5-1 h to obtain the organic carrier for the slurry.
In a third aspect, the invention also provides an application of the organic carrier for slurry in preparing conductive slurry.
In a fourth aspect, the invention also provides a conductive paste, which comprises the organic carrier for the paste.
Preferably, the conductive paste further comprises glass powder and metal powder.
Preferably, the conductive paste comprises the following components in percentage by mass: 71-85% of metal powder, 1-7% of glass powder and 14-22% of organic carrier for slurry.
In a fifth aspect, the invention also provides an application of the conductive paste in preparing a solar cell.
Compared with the prior art, the organic carrier for the slurry, the conductive slurry and the application have the following beneficial effects:
the organic carrier for the paste comprises an organic adhesive, an anti-settling thixotropic agent and a dispersing agent, and by adopting the collocation of the specific types of the organic adhesive, the anti-settling thixotropic agent and the dispersing agent, the paste has good printing performance, meets various requirements of narrow line width screen printing at a client production end, simultaneously ensures better dispersion and wetting of the paste, ensures that the paste has optimal thixotropic performance, can ensure that the paste has good printing performance, balances contradiction between paste molding and contact, has small contact resistance with a silicon wafer after sintering, reduces series resistance and improves open circuit voltage Voc.
Detailed Description
The following description of the embodiments of the present invention will be made in detail and with reference to the embodiments of the present invention, but it should be apparent that the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
The embodiment of the application provides an organic carrier for slurry, which comprises an organic adhesive, an anti-settling thixotropic agent and a dispersing agent; wherein the organic adhesive comprises an organic resin and an organic solvent, and the organic resin comprises at least one of maleic anhydride resin, styrene copolymer, modified acrylic resin, modified butyl cellulose acetate and polyvinyl butyral;
the organic solvent comprises at least one of diethylene glycol dibenzoate, dimethyl adipate, propylene glycol phenyl ether, butyl carbitol, diethylene glycol dibutyl ether, diethylene glycol diethyl ether acetate, alcohol ester twelve (also called dodecanol ester), dimethyl nylon acid and ethylene glycol phenyl ether;
the anti-settling thixotropic agent comprises at least one of polypropylene maleic anhydride grafted compound, polyurea thixotropic agent, fumed silica, dimethyl silicone oil, phosphate thixotropic agent and modified polyamide wax;
the dispersing agent comprises at least one of solvent-free polyether system dispersing agent, myristic acid, lauric acid, oleic acid, palmitic acid, phosphate dispersing agent and fatty acid dispersing agent.
Specifically, in some embodiments, the polypropylene maleic anhydride graft compound is purchased from nanzen chemical company, model: POE grafting GMA; polyurea thixotropic agents are purchased from Pick chemistry, model BYK-410; modified polyamide wax is purchased from nanben Kabushiki Kaisha under the model number DISPARON 6700; the solvent-free polyether system dispersant is purchased from Nanyuji chemical Co., ltd., model ED-360; fatty acid dispersants were purchased from phoenix chemical Co., ltd., model ED-120; phosphate dispersants are purchased from disperlon, model: DA-234.
In some embodiments, the mass ratio of the organic binder, the anti-settling thixotropic agent, and the dispersant is (170-220): 1.8-3.6): 2.5-5.5.
In some embodiments, the mass ratio of organic resin to organic solvent is (11-42): 129-160.
The organic carrier for the sizing agent comprises an organic adhesive, an anti-settling thixotropic agent and a dispersing agent, and by adopting the specific types of the organic adhesive, the anti-settling thixotropic agent and the dispersing agent, the sizing agent has good printing performance, meets various requirements of narrow line width screen printing at a client production end, simultaneously ensures that the sizing agent is better in dispersion and wetting, ensures that the sizing agent has optimal thixotropic performance, can ensure that the sizing agent has good printing performance, balances contradiction between sizing agent molding and contact, has small contact resistance with a silicon wafer after sintering, reduces series resistance and improves open circuit voltage Voc.
Based on the same inventive concept, the embodiment of the application also provides a preparation method of the organic carrier for slurry, which comprises the following steps: and mixing the organic resin, the organic solvent, the anti-settling thixotropic agent and the dispersing agent to obtain the organic carrier for the slurry.
In some embodiments, a method of preparing an organic carrier for a slurry includes the steps of: heating the organic solvent to 60-100 ℃, stirring for 0.5-1 h at 300-700 rpm, adding the organic resin, heating to 110-130 ℃, continuously stirring for 0.5-2 h at 600-1000 rpm, then cooling to 45-55 ℃ and adding the anti-settling thixotropic agent and the dispersing agent, and continuously stirring for 0.5-1 h at 1000-1500 rpm to obtain the organic carrier for the slurry.
Based on the same inventive concept, the embodiment of the application also provides an application of the organic carrier for slurry in preparing conductive slurry.
Based on the same inventive concept, the embodiment of the application also provides a conductive paste, which comprises the organic carrier for paste.
In some embodiments, the conductive paste further comprises a glass frit and a metal powder.
In some embodiments, the conductive paste includes the following components by mass: 71-85% of metal powder, 1-7% of glass powder and 14-22% of organic carrier for slurry.
Specifically, the metal split comprises more than one of silver, gold, copper, nickel, aluminum, palladium, chromium, cobalt, tin, lead, zinc, iron, tungsten, magnesium and alloys thereof.
In some embodiments, the glass frit comprises the following components in mass fraction: 49.3 to 59.3 percent of TeO 2 10 to 20 percent of PbO (lead monoxide), 3 to 8 percent of ZnO and 10.6 to 25 percent of Bi 2 O 3 3 to 4 percent of Li 2 O, 1-3% SiO 2 1 to 3 percent of B 2 O 3 。
Based on the same inventive concept, the embodiment of the application also provides an application of the conductive paste in preparing a solar cell.
The organic vehicle for paste, the conductive paste, and the method of preparing the same of the present application are further described in the following specific examples. This section further illustrates the summary of the invention in connection with specific embodiments, but should not be construed as limiting the invention. The technical means employed in the examples are conventional means well known to those skilled in the art, unless specifically stated. Unless specifically stated otherwise, the reagents, methods and apparatus employed in the present invention are those conventional in the art.
Example 1
The embodiment of the application provides an organic carrier for slurry, which comprises the following raw materials in parts by weight: 171 parts of organic binder, 2.4 parts of anti-settling thixotropic agent and 5 parts of dispersing agent by weight;
wherein the organic adhesive comprises organic resin and organic solvent, and the mass ratio of the organic resin to the organic solvent is 21:150;
the organic resin comprises a mixture of maleic anhydride resin, styrene copolymer and modified acrylic resin in a mass ratio of 2:5:3;
the organic solvent comprises a mixture of propylene glycol phenyl ether, dimethyl adipate, alcohol ester twelve and diethylene glycol dibenzoate in a mass ratio of 4:1:3:2;
the anti-settling thixotropic agent comprises a mixture of polypropylene maleic anhydride grafted compound and polyurea thixotropic agent in a mass ratio of 1.1:0.5;
the dispersing agent is a solvent-free polyether system dispersing agent;
wherein, maleic anhydride resin is purchased from Dissman, model maleic anhydride; styrene copolymer purchased from Guangzhou Jia Yuan high molecular Material Co., ltd., model AR-514; modified acrylic resin is purchased from Shanghai Boril chemical Co., ltd., model: BM99; polypropylene maleic anhydride graft compounds were purchased from Nanzhen chemical Co., ltd., model: POE grafting GMA; polyurea thixotropic agents are purchased from Pick chemistry, model BYK-410; the solvent-free polyether system dispersant was purchased from Nanyuji chemical Co., ltd., model ED-360.
The preparation method of the organic carrier for slurry comprises the following steps:
heating the organic solvent to 80 ℃, stirring for 0.5h at 500rpm, adding the organic resin, heating to 120 ℃, continuously stirring for 1h at 800rpm, then cooling to 53 ℃, adding the anti-settling thixotropic agent and the dispersing agent, and continuously stirring for 0.5h at 1200rpm to obtain the organic carrier for the slurry.
The embodiment also provides a conductive paste which comprises the following components in percentage by mass: 78% of aluminum powder, 2% of glass powder and 20% of the organic carrier for slurry prepared in example 1;
wherein, the glass powder comprises the following components in percentage by mass: 56.3% TeO 2 17% PbO, 5% ZnO, 14% Bi 2 O 3 3.7% Li 2 O, 2% SiO 2 2% of B 2 O 3 。
Example 2
The embodiment of the application provides an organic carrier for slurry, which comprises the following raw materials in parts by weight: 171 parts of organic binder, 2.4 parts of anti-settling thixotropic agent and 5 parts of dispersing agent by weight;
wherein the organic adhesive comprises organic resin and organic solvent, and the mass ratio of the organic resin to the organic solvent is 42:129;
the organic resin comprises a mixture of maleic anhydride resin, styrene copolymer and modified acrylic resin in a mass ratio of 2:5:3;
the organic solvent comprises a mixture of propylene glycol phenyl ether, dimethyl adipate, alcohol ester twelve and diethylene glycol dibenzoate in a mass ratio of 4:1:3:2;
the anti-settling thixotropic agent comprises a mixture of polypropylene maleic anhydride grafted compound and polyurea thixotropic agent in a mass ratio of 1.1:0.5;
the dispersing agent is a solvent-free polyether system dispersing agent;
wherein, maleic anhydride resin is purchased from Dissman, model maleic anhydride; styrene copolymer purchased from Guangzhou Jia Yuan high molecular Material Co., ltd., model AR-514; modified acrylic resin is purchased from Shanghai Boril chemical Co., ltd., model: BM99; polypropylene maleic anhydride graft compounds were purchased from Nanzhen chemical Co., ltd., model: POE grafting GMA; polyurea thixotropic agents are purchased from Pick chemistry, model BYK-410; the solvent-free polyether system dispersant was purchased from Nanyuji chemical Co., ltd., model ED-360.
The preparation method of the organic carrier for slurry was the same as in example 1.
The embodiment also provides a conductive paste which comprises the following components in percentage by mass: 78% of aluminum powder, 2% of glass powder and 20% of the organic carrier for slurry prepared in example 2;
wherein, the glass powder comprises the following components in percentage by mass: 56.3% TeO 2 17% PbO, 5% ZnO, 14% Bi 2 O 3 3.7% Li 2 O, 2% SiO 2 2% of B 2 O 3 。
Example 3
The embodiment of the application provides an organic carrier for slurry, which comprises the following raw materials in parts by weight: 171 parts of organic binder, 2.4 parts of anti-settling thixotropic agent and 5 parts of dispersing agent by weight;
wherein the organic adhesive comprises organic resin and organic solvent, and the mass ratio of the organic resin to the organic solvent is 11:160;
the organic resin comprises a mixture of maleic anhydride resin, styrene copolymer and modified acrylic resin in a mass ratio of 2:5:3;
the organic solvent comprises a mixture of propylene glycol phenyl ether, dimethyl adipate, alcohol ester twelve and diethylene glycol dibenzoate in a mass ratio of 4:1:3:2;
the anti-settling thixotropic agent comprises a mixture of polypropylene maleic anhydride grafted compound and polyurea thixotropic agent in a mass ratio of 1.1:0.5;
the dispersing agent is a solvent-free polyether system dispersing agent;
wherein, maleic anhydride resin is purchased from Dissman, model maleic anhydride; styrene copolymer purchased from Guangzhou Jia Yuan high molecular Material Co., ltd., model AR-514; modified acrylic resin is purchased from Shanghai Boril chemical Co., ltd., model: BM99; polypropylene maleic anhydride graft compounds were purchased from Nanzhen chemical Co., ltd., model: POE grafting GMA; polyurea thixotropic agents are purchased from Pick chemistry, model BYK-410; the solvent-free polyether system dispersant was purchased from Nanyuji chemical Co., ltd., model ED-360.
The preparation method of the organic carrier for slurry was the same as in example 1.
The embodiment also provides a conductive paste which comprises the following components in percentage by mass: 78% of aluminum powder, 2% of glass powder and 20% of the organic carrier for slurry prepared in example 3;
wherein, the glass powder comprises the following components in percentage by mass: 56.3% TeO 2 17% PbO, 5% ZnO, 14% Bi 2 O 3 3.7% Li 2 O, 2% SiO 2 2% of B 2 O 3 。
Comparative example 1
The comparative example provides an organic carrier for slurry, which comprises the following raw materials in parts by weight: 171 parts of organic binder, 1.5 parts of anti-settling thixotropic agent and 5 parts of dispersing agent by weight;
wherein the organic adhesive comprises organic resin and organic solvent, and the mass ratio of the organic resin to the organic solvent is 21:150;
the organic resin comprises a mixture of maleic anhydride resin, styrene copolymer and modified acrylic resin in a mass ratio of 2:5:3;
the organic solvent comprises a mixture of propylene glycol phenyl ether, dimethyl adipate, alcohol ester twelve and diethylene glycol dibenzoate in a mass ratio of 4:1:3:2;
the anti-settling thixotropic agent comprises a mixture of polypropylene maleic anhydride grafting compounds and polyurea thixotropic agents in a mass ratio of 1.1:0.5;
the dispersing agent is a solvent-free polyether system dispersing agent;
wherein, maleic anhydride resin is purchased from Dissman, model maleic anhydride; styrene copolymer purchased from Guangzhou Jia Yuan high molecular Material Co., ltd., model AR-514; modified acrylic resin is purchased from Shanghai Boril chemical Co., ltd., model: BM99; polypropylene maleic anhydride graft compounds were purchased from Nanzhen chemical Co., ltd., model: POE grafting GMA; polyurea thixotropic agents are purchased from Pick chemistry, model BYK-410; the solvent-free polyether system dispersant was purchased from Nanyuji chemical Co., ltd., model ED-360.
The preparation method of the organic carrier for slurry was the same as in example 1.
The comparative example also provides a conductive paste comprising the following components in mass percent: 78% of aluminum powder, 2% of glass powder and 20% of the organic carrier for slurry prepared in comparative example 1;
wherein, the glass powder comprises the following components in percentage by mass: 56.3% TeO 2 17% PbO, 5% ZnO, 14% Bi 2 O 3 3.7% Li 2 O, 2% SiO 2 2% of B 2 O 3 。
Comparative example 2
The comparative example provides an organic carrier for slurry, which comprises the following raw materials in parts by weight: 171 parts of organic binder, 4.0 parts of anti-settling thixotropic agent and 5 parts of dispersing agent by weight;
wherein the organic adhesive comprises organic resin and organic solvent, and the mass ratio of the organic resin to the organic solvent is 21:150;
the organic resin comprises a mixture of maleic anhydride resin, styrene copolymer and modified acrylic resin in a mass ratio of 2:5:3;
the organic solvent comprises a mixture of propylene glycol phenyl ether, dimethyl adipate, alcohol ester twelve and diethylene glycol dibenzoate in a mass ratio of 4:1:3:2;
the anti-settling thixotropic agent comprises a mixture of polypropylene maleic anhydride grafted compound and polyurea thixotropic agent in a mass ratio of 1.1:0.5;
the dispersing agent is a solvent-free polyether system dispersing agent;
wherein, maleic anhydride resin is purchased from Dissman, model maleic anhydride; styrene copolymer purchased from Guangzhou Jia Yuan high molecular Material Co., ltd., model AR-514; modified acrylic resin is purchased from Shanghai Boril chemical Co., ltd., model: BM99; polypropylene maleic anhydride graft compounds were purchased from Nanzhen chemical Co., ltd., model: POE grafting GMA; polyurea thixotropic agents are purchased from Pick chemistry, model BYK-410; the solvent-free polyether system dispersant was purchased from Nanyuji chemical Co., ltd., model ED-360.
The preparation method of the organic carrier for slurry was the same as in example 1.
The comparative example also provides a conductive paste comprising the following components in mass percent: 78% of aluminum powder, 2% of glass powder and 20% of the organic carrier for slurry prepared in comparative example 2;
wherein, the glass powder comprises the following components in percentage by mass: 56.3% TeO 2 17% PbO, 5% ZnO, 14% Bi 2 O 3 3.7% Li 2 O, 2% SiO 2 2% of B 2 O 3 。
Comparative example 3
The comparative example provides an organic carrier for slurry, which comprises the following raw materials in parts by weight: 171 parts of organic binder, 2.4 parts of anti-settling thixotropic agent and 2 parts of dispersing agent by weight;
wherein the organic adhesive comprises organic resin and organic solvent, and the mass ratio of the organic resin to the organic solvent is 21:150;
the organic resin comprises a mixture of maleic anhydride resin, styrene copolymer and modified acrylic resin in a mass ratio of 2:5:3;
the organic solvent comprises a mixture of propylene glycol phenyl ether, dimethyl adipate, alcohol ester twelve and diethylene glycol dibenzoate in a mass ratio of 4:1:3:2;
the anti-settling thixotropic agent comprises a mixture of polypropylene maleic anhydride grafted compound and polyurea thixotropic agent in a mass ratio of 1.1:0.5;
the dispersing agent is a solvent-free polyether system dispersing agent;
wherein, maleic anhydride resin is purchased from Dissman, model maleic anhydride; styrene copolymer purchased from Guangzhou Jia Yuan high molecular Material Co., ltd., model AR-514; modified acrylic resin is purchased from Shanghai Boril chemical Co., ltd., model: BM99; polypropylene maleic anhydride graft compounds were purchased from Nanzhen chemical Co., ltd., model: POE grafting GMA; polyurea thixotropic agents are purchased from Pick chemistry, model BYK-410; the solvent-free polyether system dispersant was purchased from Nanyuji chemical Co., ltd., model ED-360.
The preparation method of the organic carrier for slurry was the same as in example 1.
The comparative example also provides a conductive paste comprising the following components in mass percent: 78% of aluminum powder, 2% of glass powder and 20% of the organic carrier for slurry prepared in comparative example 3;
wherein, the glass powder comprises the following components in percentage by mass: 56.3% TeO 2 17% PbO, 5% ZnO, 14% Bi 2 O 3 3.7% Li 2 O, 2% SiO 2 2% of B 2 O 3 。
Comparative example 4
The comparative example provides an organic carrier for slurry, which comprises the following raw materials in parts by weight: 171 parts of organic binder, 2.4 parts of anti-settling thixotropic agent and 7 parts of dispersing agent by weight;
wherein the organic adhesive comprises organic resin and organic solvent, and the mass ratio of the organic resin to the organic solvent is 21:150;
the organic resin comprises a mixture of maleic anhydride resin, styrene copolymer and modified acrylic resin in a mass ratio of 2:5:3;
the organic solvent comprises a mixture of propylene glycol phenyl ether, dimethyl adipate, alcohol ester twelve and diethylene glycol dibenzoate in a mass ratio of 4:1:3:2;
the anti-settling thixotropic agent comprises a mixture of polypropylene maleic anhydride grafted compound and polyurea thixotropic agent in a mass ratio of 1.1:0.5;
the dispersing agent is a solvent-free polyether system dispersing agent;
wherein, maleic anhydride resin is purchased from Dissman, model maleic anhydride; styrene copolymer purchased from Guangzhou Jia Yuan high molecular Material Co., ltd., model AR-514; modified acrylic resin is purchased from Shanghai Boril chemical Co., ltd., model: BM99; polypropylene maleic anhydride graft compounds were purchased from Nanzhen chemical Co., ltd., model: POE grafting GMA; polyurea thixotropic agents are purchased from Pick chemistry, model BYK-410; the solvent-free polyether system dispersant was purchased from Nanyuji chemical Co., ltd., model ED-360.
The preparation method of the organic carrier for slurry was the same as in example 1.
The comparative example also provides a conductive paste comprising the following components in mass percent: 78% of aluminum powder, 2% of glass powder and 20% of the organic carrier for slurry prepared in comparative example 4;
wherein, the glass powder comprises the following components in percentage by mass: 56.3% TeO 2 17% PbO, 5% ZnO, 14% Bi 2 O 3 3.7% Li 2 O, 2% SiO 2 2% of B 2 O 3 。
Performance testing
The electroconductive pastes prepared in examples 1 to 3 and comparative examples 1 to 4 were left for several weeks, and when the conditions of delamination and bottom blocking of the electroconductive pastes were observed, it was found that the electroconductive pastes prepared in comparative examples 1 and 4 exhibited delamination and bottom blocking of the pastes, and the paste stability was unacceptable.
The conductive pastes prepared in examples 1 to 3 and comparative examples 1 to 4 were printed on the IBC cell region, and various performance parameters such as printing performance and efficiency of the aluminum paste were measured, and the results are shown in tables 1 to 2. Among them, comparative examples 2 and 3 have printing defects such as broken grids.
TABLE 1 printing Properties of the conductive pastes prepared in the different examples
TABLE 2 efficiency of conductive pastes prepared in different examples
| Examples | Number of sheets | Eta | Voc | Isc | FF | Rsh | Rs |
| Example 1 | 3000 | 23.501 | 0.6855 | 11.344 | 83.14 | 563.3 | 1.26 |
| Example 2 | 3010 | 23.498 | 0.6853 | 11.344 | 83.11 | 560.1 | 1.27 |
| Example 3 | 3294 | 23.487 | 0.6848 | 11.333 | 83.04 | 559.5 | 1.30 |
| Comparative example 1 | 3288 | 23.468 | 0.6842 | 11.323 | 82.94 | 539.5 | 1.33 |
| Comparative example 2 | 3119 | 23.463 | 0.6843 | 11.326 | 82.90 | 539.4 | 1.39 |
| Comparative example 3 | 3275 | 23.465 | 0.6842 | 11.325 | 82.94 | 538.7 | 1.36 |
| Comparative example 4 | 3135 | 23.466 | 0.6843 | 11.324 | 82.92 | 539.1 | 1.39 |
The electroconductive pastes prepared in examples 1 to 3 and comparative examples 1 to 4 were printed on the regions of IBC cells, and subjected to open circuit voltage (Voc, V), efficiency (Eta,%), fill factor (FF,%), parallel resistance (Rsh, mΩ), series resistance (Rs, mΩ), short circuit current (Isc, a/cm) 2 ) Index properties are shown in table 2. In table 2, the number of IBC cells is the average value of the measured values of the plurality of cells, i.e., the open circuit voltage (Voc), the efficiency (Eta), the short circuit current (Isc), the Fill Factor (FF), the parallel resistance (Rsh), and the series resistance (Rs).
As can be seen from tables 1-2, the conductive paste prepared from the organic carrier prepared by the method has the advantages of good stability, excellent printing performance, narrow line width, small contact resistivity, good contact with a silicon wafer after metallization, less corrosion on a laser grooving position of a battery piece, improved open-circuit voltage, larger FF and highest efficiency.
Further, as can be seen from examples 1 to 3 and comparative examples 1 to 4, the organic binders, anti-settling thixotropic agents, dispersants, and organic resins and organic solvents of different mass ratios among the organic binders affect the properties of the prepared organic vehicle to some extent, wherein example 1 is the best mode and has the best properties.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (10)
1. An organic carrier for slurry is characterized by comprising an organic adhesive, an anti-settling thixotropic agent and a dispersing agent;
wherein the organic binder comprises an organic resin and an organic solvent, and the organic resin comprises at least one of maleic anhydride resin, styrene copolymer, modified acrylic resin, modified butyl cellulose acetate and polyvinyl butyral;
the organic solvent comprises at least one of diethylene glycol dibenzoate, dimethyl adipate, propylene glycol phenyl ether, butyl carbitol, diethylene glycol dibutyl ether, diethylene glycol diethyl ether acetate, alcohol ester twelve, dimethyl nylon acid and ethylene glycol phenyl ether;
the anti-settling thixotropic agent comprises at least one of polypropylene maleic anhydride grafted compound, polyurea thixotropic agent, fumed silica, dimethyl silicone oil, phosphate thixotropic agent and modified polyamide wax;
the dispersing agent comprises at least one of solvent-free polyether system dispersing agent, myristic acid, lauric acid, oleic acid, palmitic acid, phosphate dispersing agent and fatty acid dispersing agent.
2. The organic carrier for slurry according to claim 1, wherein the mass ratio of the organic binder, the anti-settling thixotropic agent and the dispersant is (170-220): 1.8-3.6): 2.5-5.5.
3. The organic vehicle for slurry according to claim 1, wherein the mass ratio of the organic resin to the organic solvent is (11 to 42): 129 to 160.
4. A method for producing the organic vehicle for slurry according to any one of claims 1 to 3, comprising the steps of: and mixing the organic resin, the organic solvent, the anti-settling thixotropic agent and the dispersing agent to obtain the organic carrier for the slurry.
5. The method for preparing an organic vehicle for slurry according to claim 4, comprising the steps of: heating the organic solvent to 60-100 ℃, stirring for 0.5-1 h, adding the organic resin, heating to 110-130 ℃, continuously stirring for 0.5-2 h, then cooling to 45-55 ℃, adding the anti-settling thixotropic agent and the dispersing agent, and continuously stirring for 0.5-1 h to obtain the organic carrier for the slurry.
6. Use of an organic vehicle for paste according to any one of claims 1 to 3 for the preparation of an electroconductive paste.
7. A conductive paste comprising the organic vehicle for paste according to any one of claims 1 to 3.
8. The conductive paste of claim 7, further comprising glass frit and metal powder.
9. The conductive paste according to claim 7, wherein the conductive paste comprises the following components in mass fraction: 71-85% of metal powder, 1-7% of glass powder and 14-22% of organic carrier for slurry.
10. Use of a conductive paste according to any one of claims 7 to 9 in the preparation of a solar cell.
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| CN110517805A (en) * | 2019-08-09 | 2019-11-29 | 江苏国瓷泓源光电科技有限公司 | A kind of organic bond and preparation method for two-sided PERC aluminium paste |
| CN114582544A (en) * | 2022-02-18 | 2022-06-03 | 南通俊丰新材料科技有限公司 | Conductive paste, preparation method and application thereof |
| CN115331865A (en) * | 2022-07-18 | 2022-11-11 | 广州市儒兴科技股份有限公司 | Organic carrier for double-sided PERC aluminum paste and preparation method thereof |
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| CN110517805A (en) * | 2019-08-09 | 2019-11-29 | 江苏国瓷泓源光电科技有限公司 | A kind of organic bond and preparation method for two-sided PERC aluminium paste |
| CN114582544A (en) * | 2022-02-18 | 2022-06-03 | 南通俊丰新材料科技有限公司 | Conductive paste, preparation method and application thereof |
| CN115331865A (en) * | 2022-07-18 | 2022-11-11 | 广州市儒兴科技股份有限公司 | Organic carrier for double-sided PERC aluminum paste and preparation method thereof |
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