CN116259237A - Display panel and display device - Google Patents

Display panel and display device Download PDF

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Publication number
CN116259237A
CN116259237A CN202310167304.6A CN202310167304A CN116259237A CN 116259237 A CN116259237 A CN 116259237A CN 202310167304 A CN202310167304 A CN 202310167304A CN 116259237 A CN116259237 A CN 116259237A
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CN
China
Prior art keywords
touch signal
display
panel
pin
display driving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310167304.6A
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Chinese (zh)
Inventor
罗鸿强
张光均
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN202310167304.6A priority Critical patent/CN116259237A/en
Publication of CN116259237A publication Critical patent/CN116259237A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The application relates to a display panel and a display device. The display panel comprises a first panel part, a bending part and a driving part which are sequentially arranged; the bending part is positioned between the first panel part and the driving part, the first panel part is connected with the bending part, and the bending part is connected with the driving part; the first panel part is at least configured to perform a display function, the driving part is at least configured to drive the first panel part to perform a display function, and the bending part is at least configured to enable the orthographic projection of the driving part on the first panel part to be positioned in the first panel part through bending of the driving part; the driving part is provided with a comprehensive processing chip; the integrated processing chip is internally provided with a touch signal part and a display driving part which are mutually independent; the touch signal portion is configured to receive at least a touch signal from the first panel portion, and the display driving portion is configured to drive the first panel portion to perform a display function.

Description

Display panel and display device
Technical Field
The application relates to the technical field of display, in particular to a display panel and a display device.
Background
In the related art, the Organic Light Emitting Diode (OLED) display technology is used as a post for a new generation of display technology, and has the advantages of wide color gamut, wide viewing angle, high contrast, fast response, low power consumption, suitability for flexible substrates, and the like. Thus, rapid progress has been made. In the development process, the OLED display screen is increasingly applied to touch display products. Thus, there is an increasing demand for performance.
However, the OLED display still has a problem in that the area of the flexible circuit board of the display is large.
Disclosure of Invention
The application provides a display panel and a display device, which are used for solving all or part of the defects in the related art.
According to a first aspect of embodiments of the present application, there is provided a display panel including a first panel section, a bending section, and a driving section arranged in order; the bending part is positioned between the first panel part and the driving part, the first panel part is connected with the bending part, and the bending part is connected with the driving part;
the first panel part is at least configured to perform a display function, the driving part is at least configured to drive the first panel part to perform a display function, and the bending part is at least configured to enable the orthographic projection of the driving part on the first panel part to be positioned in the first panel part through bending of the driving part;
the driving part is provided with a comprehensive processing chip; the integrated processing chip is internally provided with a touch signal part and a display driving part which are mutually independent; the touch signal portion is configured to receive at least a touch signal from the first panel portion, and the display driving portion is configured to drive the first panel portion to perform a display function.
In some embodiments, the driving portion includes a second panel portion and a flexible circuit board; the second panel part is positioned between the bending part and the flexible circuit board, the second panel part is connected with the bending part, and the flexible circuit board is connected with the second panel part;
the integrated processing chip is connected to the second panel part in a binding way.
In some embodiments, the integrated processing chip further comprises a package substrate and contact pins;
the display driving part is positioned on the packaging substrate; the touch signal part is positioned on the display driving part, and the touch signal part is positioned on one side of the display driving part far away from the packaging substrate; the contact pin is positioned on one side of the packaging substrate far away from the touch signal part and the display driving part, and is electrically connected with the touch signal part and the display driving part.
In some embodiments, the contact pin includes a first pin portion and a second pin portion; the first pin portion includes at least two first pins, and the second pin portion includes at least two second pins; the first pin portion surrounds the second pin portion;
the touch signal part is electrically connected with the first pin in the first pin part; the display driving part is electrically connected with the second pin in the second pin part.
In some embodiments, the integrated processing chip further comprises an encapsulation; the packaging part, the touch signal part and the display driving part are positioned on the same side of the packaging substrate and directly cover the touch signal part and the display driving part;
the surface of the encapsulation part, which is far away from the packaging substrate, exposes the surface of the touch signal part, which is far away from the packaging substrate.
In some embodiments, the integrated processing chip further comprises a package substrate and contact pins;
the touch signal part is positioned on the packaging substrate; the display driving part is positioned on the touch signal part, and the display driving part is positioned at one side of the touch signal part far away from the packaging substrate; the contact pin is positioned on one side of the packaging substrate far away from the touch signal part and the display driving part, and is electrically connected with the touch signal part and the display driving part.
In some embodiments, the contact pin includes a first pin portion and a second pin portion; the first pin portion includes at least two first pins, and the second pin portion includes at least two second pins; the first pin portion surrounds the second pin portion;
the display driving part is electrically connected with the first pin in the first pin part; the touch signal part is electrically connected with the second pin in the second pin part.
In some embodiments, the integrated processing chip further comprises an encapsulation; the packaging part, the touch signal part and the display driving part are positioned on the same side of the packaging substrate and directly cover the touch signal part and the display driving part;
the surface of the encapsulation part far away from one side of the encapsulation substrate exposes the surface of the display driving part far away from one side of the encapsulation substrate.
In some embodiments, the integrated processing chip includes a package substrate and contact pins;
the touch signal part and the display driving part are both positioned on the packaging substrate and positioned on the same side of the packaging substrate; the contact pins are located at one side of the packaging substrate away from the touch signal part and the display driving part.
According to a second aspect of embodiments of the present application, there is provided a display device including any one of the display panels described above.
According to the embodiment of the application, the integrated processing chip is of a chip packaging structure, so that the integration level is far better than that of simply arranging the touch signal part and the display driving part close to each other. Therefore, through setting up the integrated processing chip of integrated touch signal portion and display driver, can replace the area that touch signal portion and display driver occupy with the area that integrated processing chip took, simultaneously, avoid the width of driver to widen to, can reduce the area that touch signal portion and display driver took up, and corresponding reduction driver took up, and then, can set up the space for other structures through reducing the area that driver took up. And through setting up the integrated processing chip of integrated touch signal portion and display driver part, can make the comprehensive processing chip is all connected to different wiring to reach the effect that the wiring is gathered in comprehensive processing chip department, and the follow comprehensive processing chip again is gone out, thereby, can avoid the wiring of being connected with touch signal portion electricity and the wiring of being connected with display driver part electricity will be unavoidable the part that exists the intersection, and then, can avoid setting up complicated rete structure and ensure mutual isolation between the different wirings. Meanwhile, the integrated processing chip is internally provided with a touch signal part and a display driving part which are mutually independent, namely, the touch signal part and the display driving part are packaged and integrated together through a chip packaging structure. By the arrangement, the process and the procedure of the touch signal part and the process and procedure of the display driving part can be prevented from being unified, so that the occupied area of the driving part can be reduced, the arrangement of a complex film layer structure is prevented, mutual isolation among different wires is ensured, the cost required by the integrated processing chip is reduced, and the integrated processing chip has higher economical efficiency. Meanwhile, the complexity of the process of installing the integrated processing chip into the driving part is lower than that of the process of installing the touch signal part and the display driving part into the driving part, so that the process yield of installing the integrated processing chip into the driving part can be improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
Fig. 1 is a schematic structural view of a display panel according to an embodiment of the present application;
FIG. 2 is a schematic diagram of an integrated processing chip according to an embodiment of the present application;
FIG. 3 is a top view of an integrated processing chip according to an embodiment of the present application;
FIG. 4 is a bottom view of an integrated processing chip according to an embodiment of the present application;
fig. 5 is a schematic structural view of another display panel according to an embodiment of the present application;
FIG. 6 is a schematic diagram of another integrated processing chip according to an embodiment of the present application;
FIG. 7 is a top view of another integrated processing chip according to an embodiment of the present application;
FIG. 8 is a diagram illustrating a definition of contact pins of an integrated processing chip according to an embodiment of the present application;
FIG. 9 is a schematic diagram of another integrated processing chip according to an embodiment of the present application;
FIG. 10 is a top view of another integrated processing chip according to an embodiment of the present application;
fig. 11 is a diagram illustrating a definition of contact pins of another integrated processing chip according to an embodiment of the present application.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present application as detailed in the accompanying claims.
An embodiment of the present application provides a display panel 10, and fig. 1 shows a schematic structural diagram of the display panel 10. As shown in fig. 1, the display panel 10 includes a first panel portion 11, a bending portion 12, and a driving portion 13, which are sequentially arranged. The bending portion 12 is located between the first panel portion 11 and the driving portion 13, the first panel portion 11 is connected to the bending portion 12, and the bending portion 12 is connected to the driving portion 13.
The first panel 11 is configured to perform at least a display function, the driving portion 13 is configured to drive the first panel 11 to perform at least a display function, and the bending portion 12 is configured to position an orthographic projection of the driving portion 13 on the first panel 11 within the first panel 11 by bending itself.
The driving section 13 is provided with a comprehensive processing chip 14. Fig. 2 shows a schematic diagram of the structure of an integrated processing chip 14. Referring to fig. 2, the integrated processing chip 14 is provided with a touch signal portion 141 and a display driving portion 142 that are independent of each other. The touch signal portion 141 is at least configured to receive a touch signal from the first panel portion 11, and the display driving portion 142 is at least configured to drive the first panel portion 11 to perform a display function.
Since the touch signal portion 141 and the display driving portion 142 are disposed in different portions of the driving portion 13, respectively. Thus, the touch signal portion 141 and the display driving portion 142 that are separately disposed may occupy a larger area as a whole of the touch signal portion 141 and the display driving portion 142. Therefore, when a large occupied area is required for the entire touch signal portion 141 and the display driving portion 142, the area of the driving portion 13 is large, and thus the driving portion 13 with a large area occupies space of other structures, for example, in some cases, the driving portion 13 with a large area occupies space of a battery structure. The touch signal portion 141 is simply disposed close to the display driving portion 142, and although the area of the driving portion 13 can be reduced to some extent, the width X1 of the driving portion 13 is easily widened. The width X1 of the driving portion 13 is widened, and the width X2 of the bending portion 12 is widened. The width X2 of the curved portion 12 is widened to occupy the space of other structures.
Since the width X2 of the bending portion 12 is generally the same as or slightly different from the width X1 of the driving portion 13, the width X2 of the bending portion 12 and the width X1 of the driving portion 13 are denoted by the same width in the example of fig. 1, but the width X2 is actually different from the width X1.
In addition, since the touch signal portion 141 and the display driving portion 142 are disposed in different portions of the driving portion 13, the wiring electrically connected to the touch signal portion 141 and the wiring electrically connected to the display driving portion 142 inevitably have intersecting portions. In the portion where the different wires meet, a multi-layer structure is required to ensure mutual isolation between the different wires because of the need to avoid the problems of insulation and electromagnetic shielding between the wires electrically connected to the touch signal portion 141 and the wires electrically connected to the display driving portion 142.
Meanwhile, there is a great difference between the process of the touch signal portion 141 and the display driving portion 142. If the new single wafer chip is designed to have the effects of the touch signal portion 141 and the display driving portion 142, a more precise process in the touch signal portion 141 and the display driving portion 142 is required to be adopted when manufacturing the new chip, so that the cost of the new chip is higher than that of preparing the touch signal portion 141 and the display driving portion 142 respectively, which is not beneficial to production and manufacturing.
Since the integrated processing chip 14 is a chip package structure, the integration level is far better than simply disposing the touch signal portion 141 and the display driving portion 142 close to each other. Therefore, by providing the integrated processing chip 14 integrating the touch signal portion 141 and the display driving portion 142, the area occupied by the touch signal portion 141 and the display driving portion 142 can be replaced with the area occupied by the integrated processing chip 14, and the width X1 of the driving portion 13 is prevented from being widened, so that the area occupied by the touch signal portion 141 and the display driving portion 142 can be reduced, the area occupied by the driving portion 13 can be correspondingly reduced, and further, a space can be reserved for other configurations by reducing the area occupied by the driving portion 13.
In addition, by arranging the integrated processing chip 14 integrating the touch signal portion 141 and the display driving portion 142, different wirings are connected with the integrated processing chip 14, so that the effect that the wirings are converged at the integrated processing chip 14 and are scattered from the integrated processing chip 14 is achieved, and therefore, the unavoidable crossing portions of the wirings electrically connected with the touch signal portion 141 and the wirings electrically connected with the display driving portion 142 can be avoided, and further, the arrangement of complex film layer structures can be avoided, and mutual isolation between different wirings is ensured.
Meanwhile, the integrated processing chip 14 is provided with the touch signal portion 141 and the display driving portion 142 which are independent of each other, that is, the touch signal portion 141 and the display driving portion 142 are packaged and integrated together through a chip packaging structure. By this arrangement, the process of integrating the touch signal portion 141 and the display driving portion 142 can be avoided, so that the area occupied by the driving portion 13 can be reduced, the complex film structure can be avoided, the mutual isolation between different wires can be ensured, and the cost required by the integrated processing chip 14 can be reduced, so that the integrated processing chip 14 has higher economical efficiency.
Meanwhile, the complexity of the process of installing the integrated processing chip 14 into the driving part 13 is lower than that of the process of installing the touch signal part 141 and the display driving part 142 into the driving part 13, so that the process yield of installing the integrated processing chip 14 into the driving part 13 can be improved.
In some embodiments, fig. 5 shows a schematic structural diagram of another display panel 10. As shown in fig. 1 or 5, the driving part 13 includes a second panel part 131 and a flexible circuit board 132. The second panel portion 131 is located between the bending portion 12 and the flexible circuit board 132, the second panel portion 131 is connected to the bending portion 12, and the flexible circuit board 132 is connected to the second panel portion 131. The integrated processing chip 14 is bonded to the second panel portion 131.
Since the display driving portion 142 is generally connected to the second panel portion 131 in a binding manner, the touch signal portion 141 is disposed on the flexible circuit board 132. And through encapsulating and integrating touch signal portion 141 and display driver 142 in the integrated processing chip to bind integrated processing chip 14 and connect on second panel portion 131, can be when conveniently connecting the wiring electricity to integrated processing chip 14, because flexible circuit board 132 no longer need set up touch signal portion 141, can reduce flexible circuit board 132's area, thereby, can further reduce the area that driver 13 takes up, and then, can set up for other structures through reducing the area that driver 13 takes up and leave the space.
In some embodiments, as shown in fig. 1 or fig. 5, the display panel 10 further includes a display portion 20, a first touch signal line 151, a second touch signal line 152, a display data line 16, a flexible circuit board assembly 17, and a flexible circuit board trace 18.
Specifically, the display section 20 is configured to specifically perform a display function. The first touch signal line 151 and the second touch signal line 152 surround the display portion 20.
The second touch signal line 152 includes a second touch signal line first portion 1521 and a second touch signal line second portion 1522. The first touch signal line 151 and the second touch signal line 152 are configured to receive a touch signal of the display panel 10. The display panel 10 includes a first direction X and a second direction Y perpendicular to each other. The first touch signal line 151 may be configured to receive signals from touch electrodes extending in the first direction X and arranged in the second direction Y. The second touch signal line 152 may be configured to receive signals from touch electrodes extending in the second direction Y and arranged in the first direction X.
Both ends of the display data line 16 are electrically connected to the display portion 20 and the integrated processing chip 14, respectively. The display data line 16 is configured to transmit a driving signal from the integrated processing chip 14 to the first panel section 11.
The flexible circuit board assembly 17 is a variety of electronic devices including resistors disposed on the flexible circuit board 132. It should be noted that the flexible circuit board assembly 17 is merely an example of the electronic device disposed on the flexible circuit board 132, and is merely exemplary, and does not illustrate the actual form and arrangement of the electronic device, which is consistent with the drawings.
The flexible circuit board traces 18 are electrically connected to the flexible circuit board assembly 17, the integrated processing chip 14, and other structures within the display panel 10 that require electrical connection.
In some embodiments, fig. 3 illustrates a top view of the integrated processing chip 14. As shown in fig. 2 and 3, the integrated processing chip 14 further includes a package substrate 143 and contact pins 144.
The display driving part 142 is located on the package substrate 143. The touch signal portion 141 is located on the display driving portion 142, and the touch signal portion 141 is located on a side of the display driving portion 142 away from the package substrate 143. The contact pins 144 are located on a side of the package substrate 143 away from the touch signal portion 141 and the display driving portion 142, and the contact pins 144 are electrically connected to the touch signal portion 141 and the display driving portion 142.
By this arrangement, the area occupied by the integrated processing chip 14 can be further reduced on the basis that the integrated processing chip 14 encapsulates the integrated touch signal portion 141 and the display driving portion 142, so that the area occupied by the driving portion 13 can be further reduced, and further, a space can be reserved for the arrangement of other structures by reducing the area occupied by the driving portion 13.
In some embodiments, as shown in fig. 2, the integrated processing chip 14 also includes bond wires 145. The bonding wire 145 is at least configured to electrically connect the touch signal portion 141 to the contact pin 144, or to electrically connect the display driving portion 142 to the contact pin 144.
In some embodiments, fig. 4 illustrates a bottom view of the integrated processing chip 14. As shown in fig. 2, 4 and 5, the contact pin 144 includes a first pin portion 1441 and a second pin portion 1442. The first pin portion 1441 includes at least two first pins 1443, and the second pin portion 1442 includes at least two second pins 1444. The first pin 1441 surrounds the second pin 1442.
The touch signal portion 141 is electrically connected to a first pin 1443 in the first pin portion 1441. The display driver 142 is electrically connected to a second pin 1444 in the second pin 1442.
In this way, the first pins 1443 electrically connected to the touch signal portion 141 and the second pins 1444 electrically connected to the display driving portion 142 may be symmetrically distributed on both sides of the touch signal portion 141 and the display driving portion 142. Accordingly, the first touch signal line 151 and the second touch signal line 152 can be electrically connected to two sides of the integrated processing chip 14, i.e., the first portion 1521 and the second portion 1522 of the second touch signal line can be electrically connected to two sides of the integrated processing chip, without intersecting the display data line 16 as shown in fig. 1, thereby avoiding the intersection of the first portion 1521 of the second touch signal line and the second portion 1522 of the second touch signal line with the display data line 16, and further avoiding the arrangement of a complex film structure to ensure mutual isolation between different wirings.
In some embodiments, as shown in fig. 2, the integrated processing chip 14 further includes an encapsulation 146. The encapsulation portion 146 and the touch signal portion 141 and the display driving portion 142 are located on the same side of the package substrate 143, and directly cover the touch signal portion 141 and the display driving portion 142.
The surface of the encapsulation portion 146 away from the package substrate 143 exposes the surface of the touch signal portion 141 away from the package substrate 143.
Specifically, the encapsulation portion 146 directly covers not only the touch signal portion 141 and the display driving portion 142, but also the bonding wire 145. Since the touch signal portion 141 and the display driving portion 142 in the present embodiment have a laminated structure, there is only a smaller heat dissipation area under the same heat generation amount, and therefore, there is a higher requirement in terms of heat dissipation. By exposing the surface of the encapsulation portion 146 away from the package substrate 143, the surface of the touch signal portion 141 away from the package substrate 143 can ensure the encapsulation effect of the encapsulation portion 146 and enhance the heat dissipation capability of the integrated processing chip 14, thereby reducing the influence of the stacked structure on the larger heat dissipation requirement.
In some embodiments, fig. 6 shows a schematic structural diagram of another integrated processing chip 14. Fig. 7 shows a top view of a further integrated processing chip 14. As shown in fig. 6 and 7, the integrated processing chip 14 further includes a package substrate 143 and contact pins 144.
The touch signal portion 141 is located on the package substrate 143. The display driving part 142 is located on the touch signal part 141, and the display driving part 142 is located at a side of the touch signal part 141 away from the package substrate 143. The contact pins 144 are located on a side of the package substrate 143 away from the touch signal portion 141 and the display driving portion 142, and the contact pins 144 are electrically connected to the touch signal portion 141 and the display driving portion 142.
By this arrangement, the area occupied by the integrated processing chip 14 can be further reduced on the basis that the integrated processing chip 14 encapsulates the integrated touch signal portion 141 and the display driving portion 142, so that the area occupied by the driving portion 13 can be further reduced, and further, a space can be reserved for the arrangement of other structures by reducing the area occupied by the driving portion 13.
In some embodiments, a bottom view of the integrated processing chip 14 shown in fig. 6 and 7 may be referred to what is shown in fig. 4. As shown in fig. 6 and 7, and referring to what is shown in fig. 4, contact pin 144 includes a first pin portion 1441 and a second pin portion 1442. The first pin portion 1441 includes at least two first pins 1443, and the second pin portion 1442 includes at least two second pins 1444. The first pin 1441 surrounds the second pin 1442.
The display driver 142 is electrically connected to a first pin 1443 in the first pin 1441. The touch signal portion 141 is electrically connected to a second pin 1444 in the second pin portion 1442.
In this configuration, the first pins 1443 electrically connected to the display driving part 142 and the second pins 1444 electrically connected to the touch signal part 141 may be symmetrically distributed on both sides of the touch signal part 141 and the display driving part 142. Accordingly, the first touch signal line 151 and the second touch signal line 152 can be electrically connected to two sides of the integrated processing chip 14, i.e., the first portion 1521 and the second portion 1522 of the second touch signal line can be electrically connected to two sides of the integrated processing chip, without intersecting the display data line 16 as shown in fig. 1, thereby avoiding the intersection of the first portion 1521 of the second touch signal line and the second portion 1522 of the second touch signal line with the display data line 16, and further avoiding the arrangement of a complex film structure to ensure mutual isolation between different wirings.
In some embodiments, as shown in fig. 6, the integrated processing chip 14 further includes an encapsulation 146. The encapsulation portion 146 and the touch signal portion 141 and the display driving portion 142 are located on the same side of the package substrate 143, and directly cover the controlled signal portion 141 and the display driving portion 142.
The surface of the encapsulation portion 146 on the side away from the package substrate 143 exposes the surface of the display driving portion 142 on the side away from the package substrate 143.
Specifically, the encapsulation portion 146 directly covers not only the touch signal portion 141 and the display driving portion 142, but also the bonding wire 145. Since the touch signal portion 141 and the display driving portion 142 in the present embodiment have a laminated structure, there is only a smaller heat dissipation area under the same heat generation amount, and therefore, there is a higher requirement in terms of heat dissipation. By exposing the surface of the encapsulation portion 146 on the side away from the package substrate 143 to the surface of the display driving portion 142 on the side away from the package substrate 143, the heat dissipation capability of the integrated processing chip 14 can be enhanced while ensuring the encapsulation effect of the encapsulation portion 146, and thus, the influence of the stacked structure on the larger heat dissipation requirement can be reduced.
In some embodiments, fig. 8 illustrates a definition of contact pins 144 of the integrated processing chip 14. As shown in fig. 8, the integrated processing chip 14 includes: a power and voltage transformation pin 21, a voltage boost pin 22, a logic and communication pin 23, a display data pin 24, an initialization pin 25, a first touch signal receiving pin 26, a second touch signal receiving pin 27, and a general output pin 28.
The power supply and transformation pin 21, the boost pin 22, the logic and communication pin 23, the first touch signal receiving pin 26 and the second touch signal receiving pin 27 are pins electrically connected with the touch signal portion 141. The display data pin 24, the initialization pin 25, and the general output pin 28 are pins electrically connected to the display driving section 142.
In some embodiments, fig. 9 shows a schematic structural diagram of another integrated processing chip 14. Fig. 10 shows a top view of another integrated processing chip 14. As shown in fig. 9 and 10, the integrated processing chip 14 includes a package substrate 143 and contact pins 144.
The touch signal portion 141 and the display driving portion 142 are both located on the package substrate 143 and located on the same side of the package substrate 143. The contact pins 144 are located on a side of the package substrate 143 away from the touch signal portion 141 and the display driving portion 142.
In some embodiments, fig. 11 illustrates a definition of contact pins 144 of another integrated processing chip 14. As shown in fig. 11, the integrated processing chip 14 includes: a power and voltage transformation pin 21, a voltage boost pin 22, a logic and communication pin 23, a display data pin 24, an initialization pin 25, a first touch signal receiving pin 26, a second touch signal receiving pin 27, and a general output pin 28.
The power supply and transformation pin 21, the boost pin 22, the logic and communication pin 23, the first touch signal receiving pin 26 and the second touch signal receiving pin 27 are pins electrically connected with the touch signal portion 141. The display data pin 24, the initialization pin 25, and the general output pin 28 are pins electrically connected to the display driving section 142.
The present application also provides a display device comprising any of the display panels 10 described above.
The above embodiments of the present application may be complementary to each other without conflict.
It is noted that in the drawings, the size of layers and regions may be exaggerated for clarity of illustration. Moreover, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or intervening layers may be present. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element or intervening layers or elements may be present. In addition, it will be understood that when a layer or element is referred to as being "between" two layers or elements, it can be the only layer between the two layers or elements, or more than one intervening layer or element may also be present. Like reference numerals refer to like elements throughout.
The term "plurality" refers to two or more, unless explicitly defined otherwise.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It is to be understood that the present application is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims (10)

1. The display panel is characterized by comprising a first panel part, a bending part and a driving part which are sequentially arranged; the bending part is positioned between the first panel part and the driving part, the first panel part is connected with the bending part, and the bending part is connected with the driving part;
the first panel part is at least configured to perform a display function, the driving part is at least configured to drive the first panel part to perform a display function, and the bending part is at least configured to enable the orthographic projection of the driving part on the first panel part to be positioned in the first panel part through bending of the driving part;
the driving part is provided with a comprehensive processing chip; the integrated processing chip is internally provided with a touch signal part and a display driving part which are mutually independent; the touch signal portion is configured to receive at least a touch signal from the first panel portion, and the display driving portion is configured to drive the first panel portion to perform a display function.
2. The display panel according to claim 1, wherein the driving part includes a second panel part and a flexible circuit board; the second panel part is positioned between the bending part and the flexible circuit board, the second panel part is connected with the bending part, and the flexible circuit board is connected with the second panel part;
the integrated processing chip is connected to the second panel part in a binding way.
3. The display panel of claim 2, wherein the integrated processing chip further comprises a package substrate and contact pins;
the display driving part is positioned on the packaging substrate; the touch signal part is positioned on the display driving part, and the touch signal part is positioned on one side of the display driving part far away from the packaging substrate; the contact pin is positioned on one side of the packaging substrate far away from the touch signal part and the display driving part, and is electrically connected with the touch signal part and the display driving part.
4. The display panel of claim 3, wherein the contact pin comprises a first pin portion and a second pin portion; the first pin portion includes at least two first pins, and the second pin portion includes at least two second pins; the first pin portion surrounds the second pin portion;
the touch signal part is electrically connected with the first pin in the first pin part; the display driving part is electrically connected with the second pin in the second pin part.
5. The display panel according to claim 3, wherein the integrated processing chip further comprises an encapsulation portion; the packaging part, the touch signal part and the display driving part are positioned on the same side of the packaging substrate and directly cover the touch signal part and the display driving part;
the surface of the encapsulation part, which is far away from the packaging substrate, exposes the surface of the touch signal part, which is far away from the packaging substrate.
6. The display panel of claim 2, wherein the integrated processing chip further comprises a package substrate and contact pins;
the touch signal part is positioned on the packaging substrate; the display driving part is positioned on the touch signal part, and the display driving part is positioned at one side of the touch signal part far away from the packaging substrate; the contact pin is positioned on one side of the packaging substrate far away from the touch signal part and the display driving part, and is electrically connected with the touch signal part and the display driving part.
7. The display panel of claim 6, wherein the contact pin comprises a first pin portion and a second pin portion; the first pin portion includes at least two first pins, and the second pin portion includes at least two second pins; the first pin portion surrounds the second pin portion;
the display driving part is electrically connected with the first pin in the first pin part; the touch signal part is electrically connected with the second pin in the second pin part.
8. The display panel according to claim 6, wherein the integrated processing chip further comprises an encapsulation portion; the packaging part, the touch signal part and the display driving part are positioned on the same side of the packaging substrate and directly cover the touch signal part and the display driving part;
the surface of the encapsulation part far away from one side of the encapsulation substrate exposes the surface of the display driving part far away from one side of the encapsulation substrate.
9. The display panel of claim 1, wherein the integrated processing chip comprises a package substrate and contact pins;
the touch signal part and the display driving part are both positioned on the packaging substrate and positioned on the same side of the packaging substrate; the contact pins are located at one side of the packaging substrate away from the touch signal part and the display driving part.
10. A display device comprising the display panel according to any one of claims 1 to 9.
CN202310167304.6A 2023-02-22 2023-02-22 Display panel and display device Pending CN116259237A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310167304.6A CN116259237A (en) 2023-02-22 2023-02-22 Display panel and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310167304.6A CN116259237A (en) 2023-02-22 2023-02-22 Display panel and display device

Publications (1)

Publication Number Publication Date
CN116259237A true CN116259237A (en) 2023-06-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310167304.6A Pending CN116259237A (en) 2023-02-22 2023-02-22 Display panel and display device

Country Status (1)

Country Link
CN (1) CN116259237A (en)

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