CN116258156A - Method and system for acquiring bad board information by identifying two-dimensional code - Google Patents
Method and system for acquiring bad board information by identifying two-dimensional code Download PDFInfo
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- CN116258156A CN116258156A CN202310129573.3A CN202310129573A CN116258156A CN 116258156 A CN116258156 A CN 116258156A CN 202310129573 A CN202310129573 A CN 202310129573A CN 116258156 A CN116258156 A CN 116258156A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/14—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
- G06K7/1404—Methods for optical code recognition
- G06K7/1408—Methods for optical code recognition the method being specifically adapted for the type of code
- G06K7/1417—2D bar codes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K17/00—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations
- G06K17/0022—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations arrangements or provisious for transferring data to distant stations, e.g. from a sensing device
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/06009—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking
- G06K19/06037—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking multi-dimensional coding
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K2007/10524—Hand-held scanners
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
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- General Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Artificial Intelligence (AREA)
- Electromagnetism (AREA)
- General Engineering & Computer Science (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application provides a method and a system for acquiring bad board information by identifying a two-dimensional code, wherein the method comprises the following steps: the manufacturing execution system MES generates an authentication two-dimensional code, and the authentication two-dimensional code and the board edge two-dimensional code of the circuit board to be identified are associated and bound; binding a jig two-dimensional code of the jig with the board edge two-dimensional code by the SMT chip mounter; the solder paste detection machine acquires the bar mark information of the circuit board to be identified, and generates corresponding data information after the bar mark information and the jig two-dimensional code are associated and bound; and storing the data information into a Type4Input folder of the chip mounter, reading the jig two-dimensional code by the chip mounter when the chip mounter is used for mounting the circuit board to be identified, and acquiring corresponding bar mark information through the jig two-dimensional code. The chip mounter is not required to execute bad board mark recognition, and the solder paste detector and subsequent equipment cannot cause data disorder to cause product rejection when in failure.
Description
Technical Field
The application belongs to the field of circuit boards, and particularly relates to a method and a system for acquiring bad board information by identifying two-dimensional codes.
Background
In SMT industry, defective products such as FPC/PCB can exist in the manufacturing process, the part can be marked with X to be used for scrapping the defective board, in order to facilitate the chip mounter to well identify the good board and the defective board, the board is usually made into a bad mark, the defective product bad mark is blacked, and each board bad mark is required to be identified before the chip mounter is used for mounting, so that the blacked defective board is ensured not to be printed. The method has the advantages that the time for identifying the circuit board by the chip mounter is long, and the output of the chip mounter is affected.
Disclosure of Invention
The embodiment of the invention mainly aims to provide a method and a system for acquiring bad board information by identifying two-dimension codes, so that a chip mounter does not need to execute bad board mark identification, production can be performed by only reading two-dimension codes of a jig, the efficiency is improved, and meanwhile, a solder paste detector and subsequent equipment cannot cause product rejection when in failure.
In a first aspect, a method for acquiring bad board information by identifying a two-dimensional code is provided, the method comprising:
the manufacturing execution system MES generates an authentication two-dimensional code, and the authentication two-dimensional code and the board edge two-dimensional code of the circuit board to be identified are associated and bound;
binding a jig two-dimensional code of the jig with the board edge two-dimensional code by the SMT chip mounter;
the solder paste detection machine acquires the bar mark information of the circuit board to be identified, and generates corresponding data information after the bar mark information and the jig two-dimensional code are associated and bound;
and storing the data information into a Type4Input folder of the chip mounter, reading the jig two-dimensional code by the chip mounter when the chip mounter is used for mounting the circuit board to be identified, and acquiring corresponding bar mark information through the jig two-dimensional code.
In one possible implementation manner, the circuit board to be identified includes: flexible circuit board FPC, printed circuit board PCB.
In another possible implementation manner, the SMT chip mounter binds a jig two-dimensional code of a jig with the board edge two-dimensional code, including:
and binding the jig two-dimensional code with the board edge two-dimensional code through a scanning tool.
In another possible implementation, the scanning tool is a scanning gun.
In another possible implementation manner, the binding the jig two-dimensional code and the board edge two-dimensional code through a scanning gun includes:
reading the jig two-dimensional code through the scanning gun;
reading the plate edge two-dimensional code through the scanning gun;
and carrying out association binding on the jig two-dimensional code and the board edge two-dimensional code.
In a second aspect, a system for acquiring bad board information by identifying a two-dimensional code is provided, the system comprising:
the manufacturing execution system is used for generating an authentication two-dimensional code and carrying out association binding on the authentication two-dimensional code and a board edge two-dimensional code of the circuit board to be identified;
the SMT chip mounter is used for binding the two-dimensional code of the jig with the two-dimensional code of the board edge;
the solder paste detector is used for acquiring the bar mark information of the circuit board to be identified, and generating corresponding data information after the bar mark information and the jig two-dimensional code are associated and bound;
and the chip mounter is used for storing the data information into a local Type4Input folder, reading the jig two-dimensional code when the chip of the circuit board to be identified is mounted, and acquiring the corresponding bad mark information through the jig two-dimensional code.
In one possible implementation manner, the circuit board to be identified includes: flexible circuit board FPC, printed circuit board PCB.
In another possible implementation manner, the SMT chip mounter binds a jig two-dimensional code of a jig with the board edge two-dimensional code, including:
and binding the jig two-dimensional code with the board edge two-dimensional code through a scanning tool.
In another possible implementation, the scanning tool is a scanning gun.
In another possible implementation manner, the binding the jig two-dimensional code and the board edge two-dimensional code through a scanning gun includes:
reading the jig two-dimensional code through the scanning gun;
reading the plate edge two-dimensional code through the scanning gun;
and carrying out association binding on the jig two-dimensional code and the board edge two-dimensional code.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments of the present application will be briefly described below.
FIG. 1 is a flowchart of a method for obtaining bad board information by identifying a two-dimensional code according to an embodiment of the present invention;
fig. 2 is a block diagram of a system for acquiring bad board information by identifying a two-dimensional code according to an embodiment of the present invention.
Detailed description of the preferred embodiments
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar modules or modules having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of illustrating the present application and are not to be construed as limiting the invention.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless expressly stated otherwise, as understood by those skilled in the art. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, modules, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, modules, components, and/or groups thereof. It will be understood that when a module is referred to as being "connected" or "coupled" to another module, it can be directly connected or coupled to the other module or intervening modules may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. The term "and/or" as used herein includes all or any module and all combination of one or more of the associated listed items.
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the implementation of the present application will be described in further detail with reference to the accompanying drawings.
The following describes the technical solutions of the present application and the technical solutions of the present application, such as the solution of the above technical problems, in detail with specific embodiments. The following embodiments may be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments. Embodiments of the present application will be described below with reference to the accompanying drawings.
Fig. 1 is a flowchart of a method for obtaining bad board information by identifying a two-dimensional code according to an embodiment of the present invention, where the method includes:
102, binding a jig two-dimensional code of a jig with the board edge two-dimensional code by an SMT chip mounter;
and 104, storing the data information into a Type4Input folder of the chip mounter, reading the jig two-dimensional code by the chip mounter when the chip mounter is used for mounting the circuit board to be identified, and acquiring the corresponding bad mark information through the jig two-dimensional code.
In the embodiment of the invention, MES (Manufacturing Execution System ) for industrial manufacture generates the authentication two-dimensional codes with corresponding quantity according to the jointed board quantity of the circuit board to be identified, and establishes the association relation between the authentication two-dimensional codes and the board edge two-dimensional codes of the circuit to be identified according to the sequence of the jointed boards. When the SMT chip mounter is used for placing the circuit board to be identified into the jig for printing, the two-dimension code of the jig is associated and bound with the two-dimension code of the board edge. The printed circuit board is put into a solder paste detector, the solder paste detector recognizes the bar mark information of the circuit board to be recognized, and meanwhile, the solder paste detector acquires the two-dimensional code of the jig, and because the two-dimensional code of the jig and the two-dimensional code of the board edge have an association relationship, the solder paste detector generates data information by the two-dimensional code of the jig and the bar mark information and stores the data information into a Type4Input folder, when the chip mounter carries out chip mounting on the circuit board, the two-dimensional code of the jig is acquired, and the two-dimensional code of the jig is Input into the Type4Input folder, so that the corresponding bar mark information can be acquired.
Wherein the circuit board to be identified includes but is not limited to: flexible circuit board FPC, printed circuit board PCB.
Wherein, SMT chip mounter binds the tool two-dimensional code of tool with the board limit two-dimensional code, include:
and binding the jig two-dimensional code with the board edge two-dimensional code through a scanning tool.
Wherein, pass through scanning tool will the tool two-dimensional code with the board limit two-dimensional code binds, include:
the scanning tool is a scanning gun.
Wherein, will through the scanning rifle tool two-dimensional code with the board limit two-dimensional code binds, includes:
reading the jig two-dimensional code through the scanning gun;
reading the plate edge two-dimensional code through the scanning gun;
and carrying out association binding on the jig two-dimensional code and the board edge two-dimensional code.
According to the embodiment of the invention, the manufacturing execution system MES generates the authentication two-dimensional code, and the authentication two-dimensional code and the board edge two-dimensional code of the circuit board to be identified are associated and bound; binding a jig two-dimensional code of the jig with the board edge two-dimensional code by the SMT chip mounter; the solder paste detection machine acquires the bar mark information of the circuit board to be identified, and generates corresponding data information after the bar mark information and the jig two-dimensional code are associated and bound; and storing the data information into a Type4Input folder of the chip mounter, reading the jig two-dimensional code by the chip mounter when the chip mounter is used for mounting the circuit board to be identified, and acquiring corresponding bar mark information through the jig two-dimensional code. The chip mounter does not need to execute the action of bad board mark recognition, and can produce only by reading the two-dimensional code of the jig, so that the efficiency is improved, and meanwhile, the solder paste detector and subsequent equipment cannot cause product rejection when in failure.
Fig. 2 is a block diagram of a system for acquiring bad board information by identifying a two-dimensional code according to an embodiment of the present invention, where the system includes:
the manufacturing execution system 201 is used for generating an authentication two-dimensional code and performing association binding on the authentication two-dimensional code and a board edge two-dimensional code of a circuit board to be identified;
the SMT chip mounter 202 is configured to bind a jig two-dimensional code of a jig with the board edge two-dimensional code;
the solder paste detector 203 is configured to obtain the bard mark information of the circuit board to be identified, and generate corresponding data information after performing association binding on the bard mark information and the jig two-dimensional code;
and the chip mounter 204 is configured to store the data information in a local Type4Input folder, read the jig two-dimensional code when the chip of the circuit board to be identified is mounted, and obtain the corresponding bad mark information through the jig two-dimensional code.
In the embodiment of the invention, MES (Manufacturing Execution System ) for industrial manufacture generates the authentication two-dimensional codes with corresponding quantity according to the jointed board quantity of the circuit board to be identified, and establishes the association relation between the authentication two-dimensional codes and the board edge two-dimensional codes of the circuit to be identified according to the sequence of the jointed boards. When the SMT chip mounter is used for placing the circuit board to be identified into the jig for printing, the two-dimension code of the jig is associated and bound with the two-dimension code of the board edge. The printed circuit board is put into a solder paste detector, the solder paste detector recognizes the bar mark information of the circuit board to be recognized, and meanwhile, the solder paste detector acquires the two-dimensional code of the jig, and because the two-dimensional code of the jig and the two-dimensional code of the board edge have an association relationship, the solder paste detector generates data information by the two-dimensional code of the jig and the bar mark information and stores the data information into a Type4Input folder, when the chip mounter carries out chip mounting on the circuit board, the two-dimensional code of the jig is acquired, and the two-dimensional code of the jig is Input into the Type4Input folder, so that the corresponding bar mark information can be acquired.
Wherein the circuit board to be identified includes but is not limited to: flexible circuit board FPC, printed circuit board PCB.
Wherein, SMT chip mounter binds the tool two-dimensional code of tool with the board limit two-dimensional code, include:
and binding the jig two-dimensional code with the board edge two-dimensional code through a scanning tool.
Wherein, pass through scanning tool will the tool two-dimensional code with the board limit two-dimensional code binds, include:
the scanning tool is a scanning gun.
Wherein, will through the scanning rifle tool two-dimensional code with the board limit two-dimensional code binds, includes:
reading the jig two-dimensional code through the scanning gun;
reading the plate edge two-dimensional code through the scanning gun;
and carrying out association binding on the jig two-dimensional code and the board edge two-dimensional code.
According to the embodiment of the invention, the manufacturing execution system MES generates the authentication two-dimensional code, and the authentication two-dimensional code and the board edge two-dimensional code of the circuit board to be identified are associated and bound; binding a jig two-dimensional code of the jig with the board edge two-dimensional code by the SMT chip mounter; the solder paste detection machine acquires the bar mark information of the circuit board to be identified, and generates corresponding data information after the bar mark information and the jig two-dimensional code are associated and bound; and storing the data information into a Type4Input folder of the chip mounter, reading the jig two-dimensional code by the chip mounter when the chip mounter is used for mounting the circuit board to be identified, and acquiring corresponding bar mark information through the jig two-dimensional code. The chip mounter does not need to execute the action of bad board mark recognition, and can produce only by reading the two-dimensional code of the jig, so that the efficiency is improved, and meanwhile, the solder paste detector and subsequent equipment cannot cause product rejection when in failure.
It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, these steps are not necessarily performed in order as indicated by the arrows. The steps are not strictly limited in order and may be performed in other orders, unless explicitly stated herein. Moreover, at least some of the steps in the flowcharts of the figures may include a plurality of sub-steps or stages that are not necessarily performed at the same time, but may be performed at different times, the order of their execution not necessarily being sequential, but may be performed in turn or alternately with other steps or at least a portion of the other steps or stages.
While only a partial implementation of the invention has been described, it should be noted that it will be apparent to those skilled in the art that several modifications and adaptations can be made without departing from the principles of the invention, and such modifications and adaptations should and are intended to be comprehended within the scope of the invention.
Claims (10)
1. A method for obtaining bad board information by identifying a two-dimensional code, the method comprising:
the manufacturing execution system MES generates an authentication two-dimensional code, and the authentication two-dimensional code and the board edge two-dimensional code of the circuit board to be identified are associated and bound;
binding a jig two-dimensional code of the jig with the board edge two-dimensional code by the SMT chip mounter;
the solder paste detection machine acquires the bar mark information of the circuit board to be identified, and generates corresponding data information after the bar mark information and the jig two-dimensional code are associated and bound;
and storing the data information into a Type4Input folder of the chip mounter, reading the jig two-dimensional code by the chip mounter when the chip mounter is used for mounting the circuit board to be identified, and acquiring corresponding bar mark information through the jig two-dimensional code.
2. The method of claim 1, wherein the circuit board to be identified comprises: flexible circuit board FPC, printed circuit board PCB.
3. The method of claim 1, wherein the SMT pick and place machine binds a jig two-dimensional code of a jig with the board edge two-dimensional code, comprising:
and binding the jig two-dimensional code with the board edge two-dimensional code through a scanning tool.
4. A method according to claim 3, wherein the scanning tool is a scanning gun.
5. The method of claim 4, wherein the binding the jig two-dimensional code with the board edge two-dimensional code by a scanning gun comprises:
reading the jig two-dimensional code through the scanning gun;
reading the plate edge two-dimensional code through the scanning gun;
and carrying out association binding on the jig two-dimensional code and the board edge two-dimensional code.
6. A system for obtaining bad board information by identifying a two-dimensional code, the system comprising:
the manufacturing execution system is used for generating an authentication two-dimensional code and carrying out association binding on the authentication two-dimensional code and a board edge two-dimensional code of the circuit board to be identified;
the SMT chip mounter is used for binding the two-dimensional code of the jig with the two-dimensional code of the board edge;
the solder paste detector is used for acquiring the bar mark information of the circuit board to be identified, and generating corresponding data information after the bar mark information and the jig two-dimensional code are associated and bound;
and the chip mounter is used for storing the data information into a local Type4Input folder, reading the jig two-dimensional code when the chip of the circuit board to be identified is mounted, and acquiring the corresponding bad mark information through the jig two-dimensional code.
7. The system of claim 6, wherein the circuit board to be identified comprises: flexible circuit board FPC, printed circuit board PCB.
8. The system of claim 6, wherein the SMT pick & place machine binds a jig two-dimensional code of a jig with the board edge two-dimensional code, comprising:
and binding the jig two-dimensional code with the board edge two-dimensional code through a scanning tool.
9. The system of claim 8, wherein the scanning tool is a scanning gun.
10. The system of claim 9, wherein the binding the jig two-dimensional code with the board edge two-dimensional code by a scanning gun comprises:
reading the jig two-dimensional code through the scanning gun;
reading the plate edge two-dimensional code through the scanning gun;
and carrying out association binding on the jig two-dimensional code and the board edge two-dimensional code.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310129573.3A CN116258156A (en) | 2023-02-16 | 2023-02-16 | Method and system for acquiring bad board information by identifying two-dimensional code |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310129573.3A CN116258156A (en) | 2023-02-16 | 2023-02-16 | Method and system for acquiring bad board information by identifying two-dimensional code |
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| CN116258156A true CN116258156A (en) | 2023-06-13 |
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| CN202310129573.3A Pending CN116258156A (en) | 2023-02-16 | 2023-02-16 | Method and system for acquiring bad board information by identifying two-dimensional code |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117889917A (en) * | 2024-03-13 | 2024-04-16 | 深圳市邦正精密机械有限公司 | MES-based FPC board anti-repayment real-time state monitoring method |
-
2023
- 2023-02-16 CN CN202310129573.3A patent/CN116258156A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117889917A (en) * | 2024-03-13 | 2024-04-16 | 深圳市邦正精密机械有限公司 | MES-based FPC board anti-repayment real-time state monitoring method |
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