CN116184484A - Detector device and radiation detection device - Google Patents

Abstract

The present disclosure provides a detector device and a radiation detection apparatus, which may be applied in the technical field of radiation detection. The detector device comprises: the detector assembly is used for receiving rays generated by the ray source and generating an analog signal; the analog circuit module is used for receiving the analog signals and converting the analog signals into digital signals, and is provided with a first surface and a second surface which are oppositely arranged, a first area of the first surface is detachably connected with the detector assembly, and the second surface is suitable for being connected with a target installation position of the detector device; and the digital circuit module is used for receiving the digital signal from the analog circuit module, and the second area of the first surface is detachably connected with the digital circuit module.

Description

Detector device and radiation detection device

Technical Field

The present disclosure relates to the field of radiation detection technology, and more particularly to a detector arrangement and a radiation detection device.

Background

In a related radiation detection technique, a component for receiving radiation generated by a radiation source for signal reception and conversion includes a detector assembly, digital-to-analog circuitry, and control processing circuitry. However, the cable is adopted between the detector assembly and the digital-analog circuit to transmit signals, so that the noise level of the signals is high due to the fact that the signals are easily interfered by the external environment in the transmission process, and errors are large in the signal processing process. In addition, the different parts are connected by adopting cables, so that the structure is large in size, the process is complex, and the production and manufacturing cost is high. And cable junction etc. easily receive environmental factor influence, reduce life.

Disclosure of Invention

In view of the above, the present disclosure provides a detector device and a radiation detection apparatus that can effectively solve the above-described problems and disadvantages of the related art.

According to a first aspect of the present disclosure there is provided a detector arrangement including, but not limited to: the detector assembly is used for receiving rays generated by the ray source and generating an analog signal; an analog circuit module for receiving the analog signal and converting it into a digital signal, the analog circuit module having oppositely disposed first and second surfaces, a first region of the first surface being detachably connected to the detector assembly, the second surface being adapted to be connected to a target mounting location of the detector device; and a digital circuit module for receiving a digital signal from the analog circuit module, the second region of the first surface being detachably connected to the digital circuit module.

In some embodiments of the present disclosure, a first sealing connection is provided at a connection between the analog circuit module and the probe assembly.

In some embodiments of the present disclosure, the detector assembly includes: a module case having a detection unit disposed therein, the module case being provided with an opening toward the first surface; and the packaging body is arranged at the opening of the assembly shell and used for sealing the opening, wherein the packaging body is detachably connected with the first surface.

In some embodiments of the present disclosure, the package is provided with: a first connector for electrically connecting the detection unit with the analog circuit; a mounting hole for detachably connecting the package to the analog circuit module; and a first mounting slot for receiving the first sealing connection, wherein the first mounting slot surrounds the first connector, and the analog circuit module mates with the detector assembly such that the first surface retains the first sealing connection within the first mounting slot.

In some embodiments of the present disclosure, the analog circuit module includes: the data acquisition circuit board comprises a first surface and an analog unit arranged on the opposite side of the first surface; a second connector disposed in a first region of the first surface, the second connector being electrically connected to the analog unit; a third connector disposed in a second region of the first surface, the third connector being electrically connected to the analog unit; and the mounting bottom plate comprises the second surface and a sealing cavity arranged on the opposite side of the second surface, and the opposite side of the first surface is connected with the opposite side of the second surface so that the simulation unit is packaged in the sealing cavity.

In some embodiments of the present disclosure, the analog circuit module further comprises a second sealing connection, wherein a second mounting groove surrounding the sealing cavity is further provided on a second surface opposite side of the mounting base plate, the second sealing connection being adapted to be received within the second mounting groove.

In some embodiments of the present disclosure, the digital circuit module includes: the processing unit is used for receiving the digital signals and processing the digital signals; the communication interface is used for carrying out communication connection with external equipment; a power interface for providing electrical power to the detector device; the shielding shell is coated outside the processing unit and is used for shielding electromagnetic interference; and a fourth connector electrically connected with the processing unit.

In some embodiments of the present disclosure, the second connector and the third connector are configured to: the second connector mates with the first connector to transmit the analog signal to the analog circuit module and the third connector mates with the fourth connector to transmit the digital signal to the digital circuit module when the detector assembly, the analog circuit module, and the digital circuit module are mounted together.

In some embodiments of the present disclosure, a fixing member adapted to mate with the mounting hole is further provided on the data acquisition circuit board to fix the detector assembly to the analog circuit module.

In some embodiments of the present disclosure, the detector assemblies are provided in a plurality, and each detector assembly is mounted to the analog circuit module at a different mounting angle for receiving the radiation; the length direction of each detector assembly is parallel to the rays of the radiation source.

According to a second aspect of embodiments of the present disclosure there is provided a radiation detection apparatus including, but not limited to: a radiation source that generates radiation for detecting a detected object; a detector arrangement as claimed in the above, for receiving radiation generated by the radiation source.

According to the embodiment of the disclosure, the detector assembly, the analog circuit module and the digital circuit module are arranged to be in a detachable connection structure, so that the problem that environmental interference is caused in the signal transmission process caused by cable connection is avoided.

Drawings

The foregoing and other objects, features and advantages of the disclosure will be more apparent from the following description of embodiments of the disclosure with reference to the accompanying drawings, in which:

FIG. 1 schematically illustrates a schematic connection structure of a detector device according to an embodiment of the present disclosure;

FIG. 2 schematically illustrates a side cross-sectional view of a detector device according to an embodiment of the disclosure;

FIG. 3 schematically illustrates a detector assembly of a detector device and a schematic diagram of a digital circuit module detached from an analog circuit module according to an embodiment of the disclosure;

FIG. 4 schematically illustrates a side cross-sectional view of a detector assembly of a detector device according to an embodiment of the disclosure;

fig. 5 schematically illustrates a bottom view of a detector assembly of a detector device according to an embodiment of the disclosure;

FIG. 6 schematically illustrates a side cross-sectional view of an analog circuit module of a detector device, in accordance with an embodiment of the present disclosure;

FIG. 7 schematically illustrates a top view of an analog circuit module of a detector device in accordance with an embodiment of the present disclosure;

FIG. 8 schematically illustrates a top view of an analog circuit module of a detector device according to another embodiment of the disclosure;

FIG. 9 schematically illustrates a side cross-sectional view of a digital circuit module of a detector device in accordance with an embodiment of the present disclosure;

fig. 10 schematically illustrates a signal transmission process diagram of a detector device according to an embodiment of the present disclosure.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is only exemplary and is not intended to limit the scope of the present disclosure. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the present disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the concepts of the present disclosure.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The terms "comprises," "comprising," and/or the like, as used herein, specify the presence of stated features, steps, operations, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, or components.

All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art unless otherwise defined. It should be noted that the terms used herein should be construed to have meanings consistent with the context of the present specification and should not be construed in an idealized or overly formal manner.

In embodiments of the present disclosure, the terms "first region" and "second region" denote two different locations, e.g., on a surface, the first region is a region of a certain location of the surface, and the second region is a region of a different location than the first region.

Embodiments of the present disclosure provide a detector device and a radiation detection apparatus, the detector device including: the detector assembly is used for receiving rays generated by the ray source and generating an analog signal; the analog circuit module is used for receiving the analog signals and converting the analog signals into digital signals, and is provided with a first surface and a second surface which are oppositely arranged, a first area of the first surface is detachably connected with the detector assembly, and the second surface is suitable for being connected with a target installation position of the detector device; and the digital circuit module is used for receiving the digital signal from the analog circuit module, and the second area of the first surface is detachably connected with the digital circuit module. According to the embodiment of the disclosure, the detector assembly, the analog circuit module and the digital circuit module are arranged to be in a detachable connection structure, so that the problem that environmental interference is caused in the signal transmission process caused by cable connection is avoided.

The detector device of the embodiment of the present disclosure is described in detail below with reference to fig. 1 to 10.

The detector device 10 of the presently disclosed embodiment includes a detector assembly 100, an analog circuit module 200, and a digital circuit module 300.

Wherein the detector assembly 100 is configured to receive radiation generated by a radiation source and to generate an analog signal. Specifically, the detector assembly 100 includes a crystal and an optoelectronic device therein for receiving radiation generated by a radiation source and converting the optical signal into an analog signal. The number of detector modules 100 in the detector device 10 may be set to be plural, and the specific number of settings may be adjusted according to actual needs.

The analog circuit module 200 is configured to receive an analog signal generated by the detector assembly 100 and convert the analog signal into a digital signal. An Analog unit of an ADC (Analog-to-Digital Converter) Analog circuit for converting an Analog signal is provided in the Analog circuit block.

The digital circuit module 300 is configured to receive the digital signal from the analog circuit module, collect the digital signal, process the digital signal accordingly, and communicate with the host computer through the communication interface, for example, send data to the host computer, or receive a control instruction sent by the host computer.

In the embodiment of the present disclosure, a vertical plane defining a direction of the detector device toward the ray is a front plane, and in the example of fig. 2, a direction perpendicular to the paper plane of fig. 2 and a direction perpendicular to the horizontal are front planes of the detector device, and a direction parallel to the paper plane of fig. 2 is a side plane.

Fig. 1 schematically illustrates a connection structure diagram of a detector device according to an embodiment of the present disclosure. Fig. 2 schematically illustrates a side cross-sectional view of a detector device according to an embodiment of the present disclosure. The internal structure of the detector device according to the embodiment of the present disclosure will be described in detail with reference to fig. 1 and 2.

As shown in fig. 2, the analog circuit block 200 of the detector device 10 has oppositely disposed first and second surfaces 210, 220. The first surface 210 is an upper side facing surface of the analog circuit module 200, and the second surface 220 is a lower side facing surface of the analog circuit module 200. The first surface 210 may be divided into a plurality of regions including a first region a detachably connected to the detector assembly 100 and a second region B detachably connected to the digital circuit module 300. The second surface 220 is adapted to be coupled to a target mounting location of the detector device 10. In the embodiment of the present disclosure, the first area a and the second area B are disposed on the same side, and since the detector assembly and the digital circuit module have a certain height and are disposed on the same side, the occupied space is saved, so that the area occupied by the whole of the analog detector assembly 100 and the digital circuit module 300 is smaller, and the whole volume of the detector device 10 is smaller. Also, the second surface 220 is connected to a target mounting location of the detector device, which may be a detector arm, for example. The surface of the second surface 220 is provided in a flat shape, facilitating more stable installation at the target installation location.

As shown in fig. 2, a first sealing connection 400 is provided at the connection between the analog circuit module 200 and the probe assembly 100. The material of the first sealing connector 400 may be rubber, polytetrafluoroethylene, or the like, and the embodiment of the present disclosure does not limit the material of the first sealing connector 400. In the embodiment of the present disclosure, since the analog circuit module 200 and the detector assembly 100 are detachably connected, a gap or the like still exists between the connection points of the analog circuit module 200 and the detector assembly 100, so that the connection points are still affected by the environment when the signal is transmitted. Therefore, in order to further reduce the influence of the external environment, for example, to isolate the external air or the like. The first sealing connecting piece 400 is arranged at the connecting position, so that gaps possibly existing can be effectively blocked, packaging is easy, and the influence of external environment on analog signal transmission is further avoided.

According to the embodiment of the disclosure, the detector assembly, the analog circuit module and the digital circuit module are all arranged to be in a modularized structure, are connected in a detachable connection mode, and are not required to be connected by cables, so that the cable connection mode in the related art is omitted, the problem that the environment is disturbed in the signal transmission process when the cables are connected can be effectively avoided, and in addition, the structure can be simplified and the manufacturing cost can be reduced by adopting the detachable connection mode between the assemblies and the modules.

In an embodiment of the present disclosure, as shown in fig. 2, the probe assembly 100 includes an assembly housing 110 and a package 120. Wherein the detection unit 111 is disposed inside the assembly housing 110, and the assembly housing 110 is provided with an opening facing the first surface. The package body 120 is disposed at the opening of the assembly housing 110, and is used for closing the opening, and the package body 120 is detachably connected with the first surface 210.

Fig. 4 schematically illustrates a side cross-sectional view of a detector assembly of a detector device according to an embodiment of the disclosure. Fig. 5 schematically illustrates a bottom view of a probe assembly of a probe device according to an embodiment of the disclosure.

As shown in fig. 4 and 5, a detection unit 111 and a detector board 112 for mounting the detection unit 111 are provided in the module case 110 of the detector module 100, the detection unit 111 including a crystal that converts received radiation into visible light and a photoelectric device that converts visible light into an electric signal. The detector unit 111 is typically a multi-channel array structure, and the signal output terminal is located at an end surface away from the crystal side. In an embodiment of the present disclosure, the detector assembly 100 is used to generate an analog signal for the conversion of received radiation.

In this embodiment, the module housing 110 is further provided with shielding plates and fillers, wherein the shielding plates (not shown) may be disposed on the upper side and the lower side of the detection unit 111 and near the position of the detector plate 112, and the surface of the shielding plates is parallel to the length direction of the detection unit 111, so that other signals in the up-down direction of the detection unit 111 may be shielded, interference of other factors in the environment may be prevented, and meanwhile, the effect of suppressing radiation scattering may be achieved. The filler (not shown) may be, for example, a material for filling the assembly housing 110 provided around the detection unit 111 for fixing the positions of the detection unit 111 and the shielding plate. In the present embodiment, the module case 110 is made of a metal material, and light shielding as well as electromagnetic shielding can be achieved. The assembly housing 110 is provided with openings to facilitate the installation of various structures therein, the openings of the assembly housing 110 being disposed toward the first surface 210 of the analog circuit module 200.

The detector board 112 is used for transmitting an electric signal generated by the detection unit 111, and an input end is located at an end face (an end far from a radiation receiving side) of the detection unit 111, and an output end is connected to a first connector described below, so as to transmit the signal generated by the detection unit 111 to the analog circuit module 200.

The package 120 is disposed at the opening of the assembly housing 110 for closing the opening. The package 120 is removably coupled to the first surface 210 to facilitate the removable coupling of the probe assembly 100 to the analog circuit module.

As shown in fig. 5, the package 120 is provided with a first connector 121, a mounting hole 122, and a first mounting groove 123. Wherein the first connector 121 is used for electrically connecting the detecting unit 111 with the analog circuit module, specifically, in the detector assembly, the detecting unit 111 is mounted on the detector board 112, the detecting unit 111, the detector board 112 and the first connector 121 are electrically connected, and analog signals can be transmitted to the analog circuit module through the first connector 121. In this embodiment, the package body 120 and the assembly housing 110 encapsulate all the components of the probe assembly 100 in the cavity formed by the package body 120 and the assembly housing 110, and are not interfered by other external factors such as environment. The first connector 121 is formed on a side of the package body 120 away from the assembly housing 110, and the first connector 121 is located in a first connector through hole 1211 on the package body 120, so that the first connector 121 is connected with a second connector as described below in a mating manner. The size of the first connector through hole 1211 may be greater than or equal to the outer size of the first connector 121, and smaller than the inner size of the first mounting groove 123. And the shape of the first connector through hole 1211 may be the same shape as the first connector 121 or a different shape.

In an embodiment of the present disclosure, the mounting holes 122 are used to detachably connect the package 120 with the analog circuit module 200. The mounting hole 122 may be, for example, a screw hole, and is internally provided with threads. In an alternative embodiment, the mounting hole may be another hole, so that the fixing of the package body and the analog circuit module may be realized, and the shape and style of the mounting hole are not limited in the embodiment of the present disclosure, so long as the package body and the analog circuit module may be detachably connected.

In an embodiment of the present disclosure, the first mounting groove 123 is for receiving a first sealing connection. Specifically, the first mounting groove 123 is disposed around the first connector 121 to achieve a seal against the first connector 121. In the present embodiment, the first mounting groove 121 is provided in an oval configuration, and the first surface 210 contacts the bottom of the package body 120 when the analog circuit module 200 is mated with the probe assembly 100, so that the first sealing connector 400 is confined within the first mounting groove. In other alternative embodiments of the present disclosure, the first mounting groove may be of other shapes, such as circular, rectangular, etc., wherein the first sealing connector is shaped to mate with the first mounting groove to better achieve a sealing effect on the first connector.

Fig. 6 schematically illustrates a side cross-sectional view of an analog circuit module of a detector device according to an embodiment of the disclosure. Fig. 7 schematically illustrates a top view of an analog circuit module of a detector device according to an embodiment of the disclosure.

In the embodiment of the present disclosure, as shown in fig. 6 and 7, the analog circuit module 200 includes a data acquisition circuit board 230 and a mounting base 240, and a second connector 231 and a third connector 232 provided on the acquisition circuit board 230. For example, the data acquisition circuit board 230 is a circuit board located on the upper side of the analog circuit module 200, and the side of the data acquisition circuit board 230 facing the detector assembly 100 is the first surface 210. An analog unit 260 is disposed on the opposite side of the data acquisition circuit board 230 from the first surface 210. The data acquisition circuit board is used for converting an input analog signal into a digital signal and outputting the digital signal, and the analog unit 260 arranged on the data acquisition circuit board comprises an analog circuit and an ADC chip and is used for processing the input analog signal to generate the digital signal.

In an embodiment of the present disclosure, the second connector 231 is disposed at the first region a of the first surface 210, and the second connector 231 is electrically connected with the analog unit 260. The third connector 232 is disposed in the second region B of the first surface 210, and the third connector 232 is electrically connected to the analog unit 260.

The first area a of the first surface 210 is provided with a second connector 231 and the second connector 231 is adapted to be connected with the first connector 121 and to transmit analog signals generated by the detector assembly to the analog unit 260 for processing. The second region B of the first surface 210 is provided with a third connector 232, the third connector 232 being adapted to be connected with a fourth connector described below and to transmit digital signals generated via the analog unit 260 to the digital circuit module. In the embodiment of the present disclosure, the second connector 231 and the third connector 232 are respectively provided in a plug-in structure with the first connector 121 and the fourth connector, for example, when the detector assembly is connected with the analog circuit module, the first connector communicates with the second connector, and when the digital circuit module is connected with the analog circuit module, the fourth connector communicates with the third connector.

In an embodiment of the present disclosure, the mounting plate 240 is disposed on an opposite side of the data acquisition circuit board 230 from the first surface 210, the mounting plate 240 having a second surface 220 and a sealed cavity 270 disposed on an opposite side of the second surface 220. In an embodiment of the present disclosure, a first surface opposite side of the data acquisition circuit board 230 is connected to a second surface opposite side of the mounting baseplate 240 such that the analog unit 260 is packaged within the sealed cavity 270.

In an embodiment of the present disclosure, a fixing member (not shown) adapted to mate with the mounting hole 122 is further provided on the data acquisition circuit board 230 to fix the probe assembly 100 to the analog circuit module 200. The fixing member may be, for example, a screw or other fixing member, and the form of the fixing member is not limited in the present disclosure.

In the embodiment of the present disclosure, the mounting base plate 240 is used to encapsulate the analog unit 260, and the mounting base plate 240 may be made of, for example, a metal material, and by encapsulating the analog unit 260 in the sealed cavity 270, a shielding effect is achieved, so that the signal is prevented from being interfered by external environmental factors during the transmission process.

In an embodiment of the present disclosure, the analog circuit module 200 further includes a second sealing connection 500, in particular, the second sealing connection 500 is disposed between the data acquisition circuit board 230 and the mounting baseplate 240. For sealing the analog unit 260 and the sealing cavity 270 to reduce interference of the analog unit 260 from external environmental factors.

As shown in fig. 6, a second mounting groove 250 surrounding the sealing cavity 270 is also provided on the opposite side of the second surface of the mounting plate 240, the second mounting groove 250 being adapted to receive the second sealing connection 500. In the present embodiment, the second mounting groove 250 is provided in an oval-shaped structure such that the opposite side of the first surface contacts the opposite side of the second surface when the data acquisition circuit board 230 and the mounting base plate 240 are mounted together, thereby confining the second sealing connector 500 within the second mounting groove. In other alternative embodiments of the present disclosure, the second mounting groove may be of other shapes, such as circular, rectangular, etc., wherein the second sealing connector is shaped to mate with the second mounting groove to better achieve a sealing effect on the analog unit.

According to the embodiment of the disclosure, the sealing cavity is used for sealing the simulation unit and shielding the interference of external electromagnetic factors and the like, and the second sealing connector is used for sealing the whole sealing cavity to achieve the effects of water resistance, dust resistance and the like.

In an alternative embodiment of the present disclosure, the first and second sealing connectors may be provided as a sealant, and the first and second mounting grooves may be further reduced in size or only remain in place, and the sealant is coated on the first and second mounting grooves when mounting is performed, so as to achieve a sealing effect on the first and second connectors and the analog unit.

As shown in fig. 7, the analog circuit module of the present embodiment is provided with a plurality of second connectors 231 for connecting with a plurality of detector modules 100. The detector device 10 may comprise a plurality of detector assemblies 100, each detector assembly 100 being mounted to the analog circuit module 200 at a different mounting angle for receiving radiation, the length direction of each detector assembly 100 being parallel to the radiation of the radiation source. For example, the length direction of the detector assembly on each analog circuit module is parallel to the direction of the radiation, and when each detector assembly is mounted on the analog circuit module, the length direction of the detector assembly is opposite to the radiation source, so that the radiation generated by the radiation source can be better received. As shown in fig. 7, the detector device is fixed by the fixing hole 280 when mounted to the target mounting position. In other alternative embodiments, other fixed forms are possible.

Fig. 8 schematically illustrates a top view of an analog circuit module of a detector device according to another embodiment of the present disclosure.

In another embodiment, as shown in fig. 8, the overall shape of the analog circuit module is different, the first surface on the analog circuit module has a first area a 'in which a plurality of second connectors 231' are disposed and a second area B 'in which a third connector 232' is disposed, wherein the mounting angle of each of the second connectors 231 'of the first area a' on the first surface for mounting the detector assembly is different. When the detector device is installed at the target installation position, the length direction of the detector assembly installed at the second connector 231' points to the ray source, that is, the installation angle of each detector assembly installed at the analog circuit module for receiving rays is different, so as to meet the installation requirements of different positions. The first area A 'is located at a different position than the second area B' so as to meet the installation requirements of the detector device at different installation positions. The detector is fixed to the target mounting position through the fixing hole 280' when being mounted.

Fig. 9 schematically illustrates a side cross-sectional view of a digital circuit module of a detector device according to an embodiment of the disclosure.

As shown in fig. 9, the digital circuit module 300 includes a processing unit 310, a communication interface 320, a power interface 330, a shield case 340, and a fourth connector 350. Wherein, the processing unit 310 is configured to receive and process the digital signal. The processing unit 310 includes a digital circuit 311 and a data control circuit board 312. The communication interface 320 is used for communication connection with an external device, for example, communication connection with an upper computer. The power interface 330 is used to provide power to the detector device. The shielding case 340 is coated on the outside of the processing unit 310 for shielding electromagnetic interference. The fourth connector 350 is electrically connected to the processing unit, and the fourth connector 350 is adapted to be mated with the third connector 232 and transmit the digital signal sent by the third connector 232 to the processing unit 310.

In an alternative embodiment of the disclosure, a third sealing connector may be disposed at a connection between the digital circuit module and the analog circuit module, for sealing the third connector and the fourth connector, so as to improve waterproof and dustproof properties of the connection, and improve environmental adaptability of the detector device.

Fig. 3 schematically illustrates a detector assembly of a detector device and a schematic of a digital circuit module detached from an analog circuit module according to an embodiment of the present disclosure. As shown in fig. 2 and 3, when the detector assembly 100, the analog circuit module 200, and the digital circuit module 300 are to be mounted together, the second connector 231 and the third connector 232 are configured to: the second connector 231 mates with the first connector 121 to transmit analog signals to the analog circuit module, and the third connector 232 mates with the fourth connector 350 to transmit digital signals to the digital circuit module. When the detector assembly 100, the analog circuit module 200 and the digital circuit module 300 are disassembled, the second connector 231 is disconnected from the first connector 121, and the third connector 232 is disconnected from the fourth connector 350, and the second connector 231 and the first connector 121 and the third connector 232 and the fourth connector 350 are respectively provided with pluggable structures, so that the detector assembly is convenient and quick to plug, and efficient installation and replacement are realized.

Fig. 10 schematically illustrates a signal transmission process diagram of a detector device according to an embodiment of the present disclosure.

As shown in fig. 10, when the detector assembly 100, the analog circuit module 200, and the digital circuit module 300 are mounted together to form a detector device, incident radiation 1010 generated from a radiation source is converted to an analog signal 1011 after passing through a detection unit within the detector assembly. For example, the radiation is converted into an electrical signal (i.e., an analog signal) through a physical process after it is incident on a detection unit within the detector assembly. The electrical signal is transmitted through the detector board to a first connector electrically connected thereto and via the first connector and a second connector to an analog signal transmission path 1012 and into the analog circuit module 200 for processing to generate a digital signal, for example, for processing by an analog unit in the analog circuit module 200 to convert the analog signal to a digital signal. The generated digital signal is transmitted to the digital circuit module 300 through the digital signal transmission path 1013. And communicates with the upper computer via a communication interface, etc. In addition, the digital circuit module 300 may also receive a control command sent by the host computer and control an operation parameter of an analog unit in the analog circuit module.

According to the embodiment of the disclosure, the detector assembly, the analog circuit module and the digital circuit module are arranged to be in a detachable connection structure, so that the problem that environmental interference is caused in the signal transmission process caused by cable connection is avoided, the transmission distance of analog signals is reduced, and electronic noise is restrained. By arranging the first sealing connecting piece and the second sealing connecting piece, the sealing of analog signal transmission and the sealing of an analog unit are realized, and the environmental adaptability of the detector device is improved. In addition, the detachable connection mode is adopted between each component and each module, so that the structure can be simplified, and the manufacturing cost is reduced.

In another embodiment of the present disclosure, there is also provided a radiation detection apparatus including a radiation source and a detector device, wherein the radiation source generates radiation for detecting a detected object; the detector arrangement is for receiving radiation generated by a radiation source, the detector arrangement being as described above.

Those skilled in the art will appreciate that the features recited in the various embodiments of the disclosure and/or in the claims may be provided in a variety of combinations and/or combinations, even if such combinations or combinations are not explicitly recited in the disclosure. In particular, the features recited in the various embodiments of the present disclosure and/or the claims may be variously combined and/or combined without departing from the spirit and teachings of the present disclosure. All such combinations and/or combinations fall within the scope of the present disclosure.

The embodiments of the present disclosure are described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Although the embodiments are described above separately, this does not mean that the measures in the embodiments cannot be used advantageously in combination. The scope of the disclosure is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be made by those skilled in the art without departing from the scope of the disclosure, and such alternatives and modifications are intended to fall within the scope of the disclosure.

Claims (11)

1. A detector arrangement, comprising:

the detector assembly is used for receiving rays generated by the ray source and generating an analog signal;

an analog circuit module for receiving the analog signal and converting it into a digital signal, the analog circuit module having oppositely disposed first and second surfaces, a first region of the first surface being detachably connected to the detector assembly, the second surface being adapted to be connected to a target mounting location of the detector device; and

and the digital circuit module is used for receiving the digital signal from the analog circuit module, and the second area of the first surface is detachably connected with the digital circuit module.

2. The detector device according to claim 1, wherein a connection between the analog circuit module and the detector assembly is provided with a first sealing connection.

3. The detector device of claim 2, wherein the detector assembly comprises:

a module case having a detection unit disposed therein, the module case being provided with an opening toward the first surface; and

the packaging body is arranged at the opening of the component shell and is used for sealing the opening,

wherein, the encapsulation body is detachably connected with the first surface.

4. A detector arrangement according to claim 3, wherein the package is provided with:

a first connector for electrically connecting the detection unit with the analog circuit module;

a mounting hole for detachably connecting the package to the analog circuit module; and

a first mounting groove for receiving the first sealing connection,

wherein the first mounting groove surrounds the first connector,

the analog circuit module cooperates with the probe assembly such that the first surface retains the first seal connection within the first mounting groove.

5. The detector arrangement of claim 4, wherein the analog circuit module comprises:

the data acquisition circuit board comprises a first surface and an analog unit arranged on the opposite side of the first surface;

a second connector disposed in a first region of the first surface, the second connector being electrically connected to the analog unit;

a third connector disposed in a second region of the first surface, the third connector being electrically connected to the analog unit; and

the mounting bottom plate comprises the second surface and a sealing cavity arranged on the opposite side of the second surface, and the opposite side of the first surface is connected with the opposite side of the second surface so that the simulation unit is packaged in the sealing cavity.

6. The detector assembly of claim 5, wherein the analog circuit module further comprises a second sealing connection,

wherein, the second surface opposite side of mounting plate still is provided with the second mounting groove that encircles sealed cavity, the second sealing connection piece is suitable for to hold in the second mounting groove.

7. The detector arrangement of claim 6, wherein the digital circuit module comprises:

the processing unit is used for receiving the digital signals and processing the digital signals;

the communication interface is used for carrying out communication connection with external equipment;

a power interface for providing electrical power to the detector device;

the shielding shell is coated outside the processing unit and is used for shielding electromagnetic interference; and

and the fourth connector is electrically connected with the processing unit.

8. The detector device of claim 7, wherein the second connector and the third connector are configured to: when the detector assembly, the analog circuit module and the digital circuit module are mounted together,

the second connector mates with the first connector to transmit the analog signal to the analog circuit module,

the third connector mates with the fourth connector to transmit the digital signal to the digital circuit module.

9. The detector assembly of claim 5, wherein the data acquisition circuit board further includes a fastener adapted to mate with the mounting hole to secure the detector assembly to the analog circuit module.

10. The detector arrangement of claim 1, wherein a plurality of detector assemblies are provided, each of the detector assemblies being mounted to the analog circuit module at a different mounting angle for receiving the radiation;

the length direction of each detector assembly is parallel to the rays of the radiation source.

11. A radiation detection apparatus, comprising:

a radiation source that generates radiation for detecting a detected object;

the detector device of any of claims 1 to 10, for receiving radiation generated by the radiation source.

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