CN116169053A - Die bonding equipment and die bonding method - Google Patents
Die bonding equipment and die bonding method Download PDFInfo
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- CN116169053A CN116169053A CN202211639852.6A CN202211639852A CN116169053A CN 116169053 A CN116169053 A CN 116169053A CN 202211639852 A CN202211639852 A CN 202211639852A CN 116169053 A CN116169053 A CN 116169053A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60277—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the use of conductive adhesives
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- Die Bonding (AREA)
Abstract
The invention discloses a die bonding device and a die bonding method, comprising the following steps: a lead frame conveying device, on which a lead frame is conveyed along the x direction; the feeding device is positioned at one end of the lead frame conveying device; the dispensing device is arranged above the lead frame conveying device; a chip supply device located at the side of the lead frame conveying device; the mounting device moves between the lead frame conveying device and the chip supply device so as to grasp and mount the chip on the lead frame; and the blanking device is positioned at the other end of the lead frame conveying device. The invention has compact structure, and the lead frame finishes the dispensing process and the mounting process while being conveyed along the x direction on the lead frame conveying device, so that the whole process keeps the lead frame in a stable state, avoids the occurrence of dispensing and mounting errors, and improves the die bonding effect.
Description
Technical Field
The invention belongs to the technical field of chip die bonding, and particularly relates to die bonding equipment and a die bonding method.
Background
The die bonding equipment sucks the chips on the wafer from the die supply position through the suction nozzle, then moves the chips to the die bonding position on the lead frame, and precisely installs the chips on the lead frame to realize die bonding. The wafer is arranged in the wafer ring, the chip is ejected out through the wafer taking mechanism, and the suction nozzle sucks and moves the chip. The lead frame is transported to the mounting position by a transport mechanism. And pushing the lead frame after die bonding into a material box, and blanking.
Chinese patent CN111370350a discloses a die bonder comprising a stand; a dispensing device; a dispensing shifting mechanism; a feeding mechanism; a die bonding swing arm device; a crystal supply platform; a die bonding shifting mechanism; and, a receiving mechanism; the die-bonding swing arm device comprises a rotating frame, a plurality of die-bonding swing arms, a lifter and a die-bonding motor, and suction nozzles are arranged on each die-bonding swing arm; the dispensing device comprises a plurality of dispensing modules. However, this scheme has led to whole confession brilliant platform, solid brilliant swing arm device structure complicacy, whole equipment occupation space are big owing to adopted solid brilliant swing arm device to the support of waiting to paste and have carried out switching-over and connection operation between the point gum process and the mounting process, lead to follow-up mounting precision to become poor easily.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art.
Therefore, the invention provides the die bonding equipment and the die bonding method, and the die bonding equipment has the advantages that the die bonding equipment is compact in structure, the dispensing process and the mounting process of the lead frame are completed in the unidirectional conveying process, and the dispensing and mounting precision is improved.
According to an embodiment of the invention, a die bonding apparatus includes: a lead frame conveying device, on which a lead frame is conveyed along the x direction; the feeding device is positioned at one end of the lead frame conveying device and is used for connecting the lead frame to the lead frame conveying device; the dispensing device is positioned above the lead frame conveying device and is used for dispensing the lead frame; the chip supply device is positioned on the side surface of the lead frame conveying device and is used for conveying and expanding wafers and jacking up the chips on the wafers; the mounting device moves between the lead frame conveying device and the chip supply device so as to grasp and mount the chip on the lead frame; and the blanking device is positioned at the other end of the lead frame conveying device and is used for connecting the lead frame out of the lead frame conveying device.
The die bonding device has the beneficial effects that the die bonding device is compact in structure, the two ends of the lead frame conveying device are respectively provided with the feeding device and the discharging device, the side surface of the lead frame conveying device is provided with the chip supply device, the upper space is provided with the glue dispensing device and the mounting device, the whole die bonding device is in a cuboid structure, the space is reasonably utilized, and the compactness is good; the lead frame finishes the dispensing process and the mounting process while being conveyed along the x direction on the lead frame conveying device, the whole process keeps the lead frame in a stable state, and only the position and the angle of the chip are required to be adjusted, so that the dispensing and mounting errors are avoided, and the die bonding effect is improved.
According to one embodiment of the present invention, the lead frame transporting apparatus includes: the base is arranged on the platform; the conveying rail is arranged on the base, a dispensing area, a mounting area and a discharging area are arranged on the conveying rail, a first adsorption assembly is arranged in the dispensing area, a second adsorption assembly and a heating assembly are arranged in the mounting area, and the lead frame moves out of the conveying rail from the discharging area; a drive assembly mounted on the conveyor rail; the clamping jaw assembly is arranged on one side of the conveying track, clamps the lead frame, and is in transmission connection with the driving assembly so as to drive the clamping jaw assembly to move along the direction of the conveying track through the driving assembly.
According to one embodiment of the present invention, the feeding device includes: a cabinet body; the Y-direction moving mechanism is arranged in the cabinet body; the Z-direction moving mechanism is arranged on the Y-direction moving mechanism and can drive the Z-direction moving mechanism to move along the Y direction; the feeding device is provided with two feeding modes, namely a first feeding mode and a second feeding mode, wherein the first feeding mode is used when the lead frames are stacked in the material box, and the second feeding mode is used when a release layer is arranged between the stacked lead frames which are adjacent up and down; in a first feeding mode, a clamping component is arranged on the Z-direction moving mechanism, the Z-direction moving mechanism drives the clamping component to move along the Z direction, the clamping component clamps a material box, a pushing component is arranged on one side of the clamping component, and the pushing component pushes a lead frame in the material box; under the second type material loading mode, install on the Z to mobile mechanism and absorb the subassembly, Z to mobile mechanism drives absorb the subassembly along Z to the motion, the internal material basket bottom plate that is equipped with of cabinet, the material basket bottom plate is located and absorbs the subassembly below, one side fixedly connected with waste material box of material basket bottom plate, opposite side fixedly connected with transport bottom plate, material basket bottom plate, waste material box and transport bottom plate can dismantle with the cabinet body and be connected.
According to one embodiment of the present invention, the dispensing device includes: the dispensing bracket is arranged on the platform; the visual component is arranged on one side of the dispensing bracket and used for identifying the working position on the lead frame; the two dispensing components are arranged on the dispensing support, the two dispensing components are located on two sides of the vision component, after the vision component performs position identification on the lead frame, the dispensing components perform dispensing on the lead frame, the two dispensing components perform dispensing on different working areas respectively, and the two dispensing components perform dispensing simultaneously.
According to an embodiment of the present invention, the chip supply apparatus includes: the wafer blanking mechanism is used for grabbing and taking out the wafer from the wafer box; the wafer position adjusting mechanism is used for driving the wafer to adjust the position along the y direction, the x direction and the circumferential direction; the wafer expanding mechanism is arranged on the wafer position adjusting mechanism and is used for stretching a wafer film on a wafer to expand the distance between adjacent chips; the chip ejection device is positioned below the crystal expanding mechanism and is used for ejecting the chip from the wafer film.
According to one embodiment of the present invention, the wafer blanking mechanism includes: the wafer box is arranged on the lifting mechanism, a plurality of wafers are stacked in the wafer box, and the lifting mechanism drives the wafer box to lift; the picking and placing mechanism is positioned on one side of the wafer expanding mechanism and is used for grabbing the wafer and moving between the wafer box and the wafer expanding mechanism.
According to one embodiment of the present invention, the wafer position adjustment mechanism includes: a y-direction moving mechanism; the X-direction moving mechanism is arranged on the Y-direction moving mechanism and drives the X-direction moving mechanism to move along the Y direction; the circumferential rotating mechanism is arranged on the x-direction moving mechanism, the x-direction moving mechanism drives the circumferential rotating mechanism to move along the x-direction, the crystal expanding mechanism is arranged on the circumferential rotating mechanism, and the circumferential rotating mechanism drives the crystal expanding mechanism to rotate in the circumferential direction.
According to one embodiment of the present invention, when wafers of different sizes are processed, a corresponding-size wafer expanding mechanism is replaced, and the wafer expanding mechanism includes: the jacking ring is detachably connected with the circumferential rotating mechanism; the wafer mounting mechanism is arranged on the jacking ring, a wafer is mounted in the wafer mounting mechanism, and the size of the wafer mounting mechanism is matched with wafers with different sizes; the driving unit is positioned on the side surface of the wafer mounting mechanism, can be close to or far away from the wafer mounting mechanism and is used for driving the wafer mounting mechanism to be close to or far away from the jacking ring; the upper surface of jacking ring is provided with annular arch, wafer installation mechanism is located the bellied outside of annular, wafer installation mechanism is when being close to the jacking ring, the wafer membrane on the wafer is by the bellied jack-up of annular.
According to one embodiment of the present invention, the chip ejection device includes: lifting the mounting seat; the lifting assembly is arranged on the lifting mounting seat; the ejection assembly is arranged on the lifting assembly, the lifting assembly drives the ejection assembly to perform lifting motion so as to be close to or far away from the wafer film, the ejection assembly is provided with a housing assembly and a thimble arranged in the housing assembly, negative pressure is arranged in the housing assembly so as to downwards adsorb the wafer film, and the thimble can move upwards and protrude out of the housing assembly so as to upwards eject the chip.
According to one embodiment of the present invention, the mounting apparatus includes: the mounting head is mounted on the mounting head moving mechanism, the mounting head moving mechanism drives the mounting head to move in the xyz direction, and the mounting head can adsorb the chip and drive the chip to rotate so as to adjust the angle of the chip on the xy plane; and the visual detection assembly is positioned on one side of the conveying track facing the wafer.
According to one embodiment of the invention, the visual inspection assembly comprises: a base; a visual detector mounted on the base; the reflecting mirror surface is arranged opposite to the lens of the visual detector and is obliquely arranged upwards; and the moving mechanism is arranged on the conveying track and connected with the reflecting mirror surface so as to drive the reflecting mirror surface to move towards the lens of the visual detector.
According to one embodiment of the present invention, the mounting head moving mechanism includes: a composite base; the x-direction movement assembly is arranged on the composite base; the y-direction movement assembly is connected with the x-direction movement assembly and drives the y-direction movement assembly to move along the x-direction; the mounting device comprises a z-direction moving component, wherein a mounting head is mounted on the z-direction moving component, one part of the z-direction moving component is mounted on the x-direction moving component, the other part of the z-direction moving component is mounted on the y-direction moving component, the y-direction moving component drives the mounting head to move along the y-direction, and the z-direction moving component drives the mounting head to move along the z-direction; the damping device is arranged on the composite base, and the motion direction of the damping device is opposite to that of the y-direction motion assembly.
According to an embodiment of the present invention, the mounting head includes: the second mounting seat is provided with a rotary driving assembly; the third mounting installation seat is connected with the second mounting installation seat in a sliding manner along the vertical direction; the mounting head assembly is vertically arranged and rotatably mounted on the third mounting seat, and is in transmission connection with the rotary driving assembly, and the mounting head assembly can move along the axial direction and the circumferential direction; the second mounting installation seat is arranged on the first mounting installation seat, the relative position between the second mounting installation seat and the first mounting installation seat can be finely adjusted, the first mounting installation seat is arranged on the mounting head moving mechanism, and the relative position between the first mounting installation seat and the mounting head moving mechanism can be finely adjusted.
According to one embodiment of the present invention, the discharging device includes: a housing; the material box guide mechanism is arranged in the shell and is internally provided with a vertical channel used for guiding and conveying the material box provided with the lead frame; the blanking mechanism is located in the shell, the blanking mechanism comprises a material box lifting unit, a material box receiving unit and a pushing unit, the material box lifting unit receives the material box in the vertical channel, the material box receiving unit and the pushing unit are located on two sides of the material box guiding mechanism respectively, the pushing unit is used for pushing the received material box into the material box receiving unit, and the material box receiving unit continuously supports and guides the material box in the pushing process.
According to one embodiment of the invention, a die bonding method, which uses the die bonding equipment to perform die bonding, comprises the following steps: s1, a feeding device continuously supplies lead frames to a lead frame conveying device, the lead frame conveying device conveys the lead frames towards the direction of a blanking device, and a chip supply device continuously supplies chips to a mounting device; s2, dispensing the mounting position on the lead frame by using a dispensing device; s3, the mounting device grabs the chip and mounts the chip on the mounting position of the lead frame; s4, the blanking device is used for plugging the attached lead frame out.
According to one embodiment of the present invention, the specific process of continuously supplying chips to the mounting device by the chip supply device in S1 is as follows: s11, performing a wafer expanding operation on the wafer by using the chip supply device to increase the spacing between adjacent chips; s12, the chip supply device adjusts the position and the angle of the wafer to align the chip with the mounting position; s13, the chip is jacked up upwards by the chip supply device so as to be convenient for the mounting device to grasp.
According to one embodiment of the invention, the specific process of S2 dispensing is as follows: s21, partitioning the lead frame, and dividing the mounting position on the lead frame into an upper area and a lower area; s22, visually detecting the mounting position by using a visual component, and then dispensing the mounting position on the lead frame by using two dispensing components; s23, the two dispensing assemblies are a first dispensing assembly and a second dispensing assembly respectively, the upper area is dispensed by the first dispensing assembly, the lower area is dispensed by the second dispensing assembly, and the adhesive dispensing of the first dispensing assembly and the second dispensing assembly is completed at the mounting position of the middle line or two lines on the lead frame.
According to one embodiment of the present invention, in S3, after the mounting device grabs the chip, the visual detection component detects the chip angle, and if the chip angle deviates, the mounting device calibrates the chip angle and then mounts the chip on the mounting position of the lead frame.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
The foregoing and/or additional aspects and advantages of the present invention will become apparent and may be readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic structural view of the feeding device of the present invention in a first feeding mode;
FIG. 3 is a schematic structural view of the feeding device of the present invention in a second feeding mode;
fig. 4 is a schematic diagram of a loading state of the loading device in a first loading mode;
fig. 5 is a second schematic diagram of a loading state of the loading device in the first loading mode;
fig. 6 is a third schematic diagram of a loading state of the loading device in the first loading mode;
fig. 7 is a schematic diagram of a loading state of the loading device in the first loading mode;
FIG. 8 is a schematic diagram of a loading state of the loading device in a second loading mode;
Fig. 9 is a schematic view of a lead frame conveying device according to the present invention;
fig. 10 is a top view of the lead frame transporting apparatus of the present invention;
fig. 11 is a schematic diagram of a second structure of the lead frame conveying device of the present invention;
FIG. 12 is a schematic view of a dispensing device according to the present invention;
FIG. 13 is a schematic view of the Y-direction moving mechanism, X-direction moving mechanism and Z-direction moving mechanism of the present invention;
FIG. 14 is a schematic view of the Y-direction moving mechanism of the present invention;
FIG. 15 is a schematic view of the Z-direction moving mechanism of the present invention;
FIG. 16 is a schematic view of a chip supply apparatus and a mounting apparatus of the present invention;
FIG. 17 is a schematic view of a chip supply apparatus of the present invention;
FIG. 18 is a schematic view of a wafer position adjustment mechanism of the present invention;
FIG. 19 is a schematic diagram of a die-expanding mechanism according to the present invention;
FIG. 20 is a schematic view of the mounting location of the chip ejector of the present invention;
FIG. 21 is a schematic view of a chip ejection device according to the present invention;
FIG. 22 is a schematic view of the internal cross-sectional structure of the housing assembly of the present invention;
FIG. 23 is a schematic view of a mounting apparatus of the present invention;
fig. 24 is a schematic structural view of the mounting head moving mechanism of the present invention;
fig. 25 is a schematic view showing a bottom view of the mounting head of the present invention;
fig. 26 is a schematic top view of the mounting head of the present invention;
Fig. 27 is a schematic sectional structure of the mounting head of the present invention;
FIG. 28 is a schematic view of the position of the visual inspection assembly of the present invention;
FIG. 29 is a front view of the visual inspection assembly of the present invention;
FIG. 30 is a schematic perspective view of a visual inspection assembly of the present invention;
FIG. 31 is a schematic illustration of a stretched ejection of a wafer film according to the present invention;
FIG. 32 is a schematic view of a blanking apparatus of the present invention;
FIG. 33 is an internal schematic view of the blanking apparatus of the present invention;
FIG. 34 is a schematic view of the working principle of the blanking device of the present invention;
FIG. 35 is a schematic diagram of a leadframe partition in accordance with an embodiment of the invention;
FIG. 36 is a second schematic view of a leadframe partition in accordance with an embodiment of the present invention;
fig. 37 is a schematic view of a lead frame section in an embodiment of the invention.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The die bonding apparatus according to the embodiment of the present invention is specifically described below with reference to the accompanying drawings.
As shown in fig. 1 to 37, a die bonding apparatus according to an embodiment of the present invention includes: the device comprises a lead frame conveying device 50, a feeding device 10, a glue dispensing device 01, a chip supply device 30, a mounting device 70 and a blanking device 20, wherein the lead frame is conveyed on the lead frame conveying device 50 along the x direction; the feeding device 10 is positioned at one end of the lead frame conveying device 50, and the feeding device 10 is used for connecting the lead frame to the lead frame conveying device 50; the dispensing device 01 is positioned above the lead frame conveying device 50 and is used for dispensing the lead frame; the chip supply device 30 is located at a side of the lead frame conveying device 50, and the chip supply device 30 is used for conveying and expanding a wafer and jacking up chips on the wafer; the mounting device 70 moves between the lead frame transporting device 50 and the chip supplying device 30 to grasp and mount the chip on the lead frame; the blanking device 20 is located at the other end of the lead frame conveying device 50, and the blanking device 20 is used for plugging the lead frame out of the lead frame conveying device 50.
The invention has the beneficial effects that the structure is compact, the two ends of the lead frame conveying device 50 are respectively provided with the feeding device 10 and the discharging device 20, the side surface of the lead frame conveying device 50 is provided with the chip supply device 30, the upper space is provided with the glue dispensing device 01 and the mounting device 70, and the whole die bonding equipment has a cuboid structure, so that the space is reasonably utilized and the compactness is good; the lead frame is conveyed along the x direction on the lead frame conveying device 50 and simultaneously completes the dispensing process and the mounting process, the whole process keeps the lead frame in a stable state, and only the position and the angle of the chip are required to be adjusted, so that the dispensing and mounting errors are avoided, and the die bonding effect is improved.
As shown in fig. 2 to 8, the invention provides a feeding device 10, which comprises a cabinet body, a Y-direction moving mechanism 11 and a Z-direction moving mechanism 12, wherein the Y-direction moving mechanism 11 is arranged in the cabinet body; the Z-direction moving mechanism 12 is arranged on the Y-direction moving mechanism 11, and the Y-direction moving mechanism 11 can drive the Z-direction moving mechanism 12 to move along the Y direction; the feeding device 10 has two feeding modes, namely a first feeding mode and a second feeding mode, wherein the first feeding mode is used when the lead frames are stacked in the material box, the second feeding mode is used when a release layer is arranged between the stacked lead frames which are adjacent up and down, and the release layer is an independent body which is convenient for separating up and down objects such as release paper, a film, a release film or tissue paper.
In the first feeding mode, a clamping component 13 is mounted on the Z-direction moving mechanism 12, the Z-direction moving mechanism 12 drives the clamping component 13 to move along the Z direction, the clamping component 13 clamps the material box, a pushing component 14 is arranged on one side of the clamping component 13, and the pushing component 14 pushes the lead frame in the material box.
Under the second feeding mode, the suction component 15 is installed on the Z-direction moving mechanism 12, the Z-direction moving mechanism 12 drives the suction component 15 to move along the Z direction, the material basket bottom plate 16 is installed in the cabinet body, the material basket bottom plate 16 is located below the suction component 15, one side of the material basket bottom plate 16 is fixedly connected with the waste box 17, the other side is fixedly connected with the conveying bottom plate 18, and the material basket bottom plate 16, the waste box 17 and the conveying bottom plate 18 are detachably connected with the cabinet body.
According to the feeding device 10, when the lead frames are stacked in the material box and the release layer is arranged between the stacked lead frames, the first feeding mode is used, the second feeding mode is used, the Y-direction moving mechanism 11 and the Z-direction moving mechanism 12 are shared in the two feeding modes, two sets of the Y-direction moving mechanism 11 and the Z-direction moving mechanism 12 are not required to be arranged, occupied space is reduced, the structure is simplified, the part utilization rate is improved, and when the two modes are switched, only the material basket bottom plate 16, the waste box 17 and the conveying bottom plate 18 are required to be installed or detached, the installation and replacement modes are simple, and the installation and the maintenance are convenient.
One side of the Y-direction moving assembly is provided with a bin assembly 19, the bin assembly 19 comprises a bin conveying mechanism 191 and a bin supporting plate 192, the bin supporting plate 192 is located above the bin conveying mechanism 191, the bin conveying mechanism 191 is installed in the cabinet body, the bin conveying mechanism 191 comprises two bin conveying rails, the distance between the two bin conveying rails is adjustable to adapt to bins with different lengths or widths, the bin supporting plate 192 is used for placing empty bins, and after a lead frame in the bin is pushed out by the pushing assembly 14, the clamping assembly 13 places the empty bins on the bin supporting plate 192.
When the feeding device 10 is used for feeding, the method comprises the following steps:
s1, judging which feeding mode is used according to the state of a lead frame;
s2, if the lead frames are stacked in the material box, a first feeding mode is adopted, the clamping component 13 clamps the material box, the material pushing component 14 pushes the lead frames in the material box, referring to fig. 13 to 16, in the first feeding mode, the material box with the lead frames is placed on the material box conveying mechanism 191, the material box conveying mechanism 191 conveys the material box to one side of the Y-direction moving mechanism 11, the clamping component 13 clamps the material box, the Y-direction moving mechanism 11 and the Z-direction moving mechanism 12 drive the clamping component 13 to transfer the material box, the material box is transferred to one side of the material pushing component 14, the material pushing component 14 pushes the lead frames in the material box, after all pushing of the lead frames in the material box is completed, the Y-direction moving mechanism 11 and the Z-direction moving mechanism 12 drive the clamping component 13 to place the empty material box on the material box 192, then the material box is released by the clamping component 13, the Y-direction moving mechanism 11 and the Z-direction moving mechanism 12 drive the clamping component 13 to one side of the material box conveying mechanism to clamp the material box, the material box 192 is placed on the material box 192 after the material box is placed on the empty material box in sequence, and the material box is placed on the empty material box 192 after the material box is repeatedly pushed;
S3, if the release layers are laminated on the basket bottom plate 16 and the release layers are arranged between the upper and lower adjacent lead frames, adopting a second feeding mode, sucking the release layers on the lead frames by the sucking component 15 and conveying the release layers to the waste box 17, sucking and conveying the lead frames by the sucking component 15 to the conveying bottom plate 18, and conveying the lead frames by the conveying mechanism for feeding; referring to fig. 17, step S3 specifically includes: s31, driving the suction assembly 15 to move through the Y-direction moving mechanism 11 and the Z-direction moving mechanism 12, and enabling the suction assembly 15 to move to the position above the basket bottom plate 16, wherein the suction assembly 15 moves downwards and sucks the release layer on the lead frame; s32, the suction assembly 15 moves upwards and moves to the position above the waste box 17, and then the release layer is placed in the waste box 17; s33, the suction assembly 15 moves to the position above the basket bottom plate 16, the suction assembly 15 moves downwards to suck the lead frame, the lead frame is moved to the position above the conveying bottom plate 18, and then the suction assembly 15 places the lead frame on the conveying bottom plate 18; s34, pushing the lead frame by the pushing assembly 14, and feeding the lead frame.
The invention integrates two functions of feeding the material box and feeding the workpiece stacking, and the two feeding modes share a part of structures, namely the same Y-direction moving mechanism 11 and Z-direction moving mechanism 12, and two sets of Y-direction moving mechanisms 11 and Z-direction moving mechanisms 12 are not required to be arranged, so that the occupied space is reduced, the structure is simplified, the utilization rate of parts is improved, the cost is saved, and the installation and the maintenance are convenient.
As shown in fig. 9 to 11, the present invention provides a lead frame conveying apparatus 50 including a base 501, a conveying rail 502, a driving assembly 53, and a jaw assembly 54; the conveying track 502 is arranged on the base 501, a dispensing area 510, a mounting area 520 and a discharging area 550 are arranged on the conveying track 502, the dispensing area 510 is provided with a first adsorption component 51, the mounting area 520 is provided with a second adsorption component 52 and a heating component, and the lead frame moves out of the conveying track 502 from the discharging area 550; the drive assembly 53 is mounted on the conveyor track 502; the clamping jaw assembly 54 is arranged on one side of the conveying track 502, the clamping jaw assembly 54 clamps the lead frame, and the clamping jaw assembly 54 is in transmission connection with the driving assembly 53 so as to drive the clamping jaw assembly 54 to move along the direction of the conveying track 502 through the driving assembly 53. The driving component 53 in this embodiment is a synchronous belt mechanism.
Compared with the prior art, the invention has the following beneficial effects: according to the lead frame conveying device 50, when the lead frame pre-coated with liquid glue is used, the tooling is adsorbed through the tooling adsorption assembly, then the tooling is subjected to dispensing, then the die attach is performed, when the dicing tape with the adhesive layer is used, the dicing tape lead frame is heated through the tooling heating assembly, so that the adhesive layer is melted to be sticky, then the die attach is performed, replacement equipment according to the two lead frames is not needed, compatibility is good, equipment replacement time is saved, and production efficiency is improved.
The first adsorption assembly 51 comprises a first tool adsorption plate 511, a plurality of first adsorption holes are formed in the first tool adsorption plate 511, and the first adsorption holes are connected with a first vacuum generator. The second adsorption component 52 includes second frock adsorption plate 521, and heating component includes first hot plate 522, second hot plate 523, first heating spare, second heating spare and third heating spare, and first hot plate 522 and second hot plate 523 set up the left and right sides at second frock adsorption plate 521, and first heating spare links to each other with first hot plate 522, and second heating spare links to each other with second hot plate 523, and third heating spare links to each other with second frock adsorption plate 521, is equipped with a plurality of second adsorption orifices on the second frock adsorption plate 521, and a plurality of second adsorption orifices all link to each other with second vacuum generator. When the conveyed lead frame is a dicing tape with an adhesive layer, the lead frame is firstly conveyed to a first heating plate 522 for preheating so that the adhesive layer is melted to have certain viscosity, then conveyed to a second tooling adsorption plate 521 for adsorption positioning, die mounting is carried out, then conveyed to a second heating plate 523 for further heating so that the die and the adhesive layer are further adhered, and then conveyed to a pushing assembly 55 for pushing the lead frame with the die out of the conveying track 502.
The leadframe conveyor 50 also includes a side pushing assembly 56, the side pushing assembly 56 being capable of pushing the leadframe in a direction toward the conveyor rail 502 to bring the leadframe into abutment with the conveyor rail 502.
Install the bottom plate on the delivery track 502, install supporting component on the bottom plate, supporting component supports lead frame, supporting component and bottom plate swing joint, supporting component can carry out position control along delivery track width direction, specific supporting component includes bracing piece 5021 and support connecting block 5022, support connecting block 5022 is the magnet piece, be provided with on the bottom plate with support connecting block 5022 complex adjustment tank 5023, in order to follow delivery track width direction to support connecting block 5022 and adjust tank 5023 sliding connection, bracing piece 5021 is connected through the mode that the magnetism was inhaled with support connecting block 5022. When the clamping jaw assembly conveys the lead frame, the supporting rod 5021 supports the lead frame, and the position of the supporting rod 5021 is adjusted by adjusting the position of the supporting connecting block 5022.
The leadframe conveying apparatus 50 further includes a pushing assembly 55, where the pushing assembly 55 is located in the discharging area 550, and after the die attach is completed, the pushing assembly 55 pushes the leadframe with the die out of the conveying track 502.
The lead frame conveying device 50 of the invention has the beneficial effects that:
the die bonding device can be compatible with a lead frame using precoated liquid glue and a die bonding device using a cutting tape (daf tape) with an adhesive layer, does not need to replace equipment according to the two lead frames, has good compatibility, saves equipment replacement time and improves production efficiency.
The clamping jaw assembly 54 clamps the lead frame and drives the lead frame to move in the direction of the conveying track 502, so that the lead frame conveying precision is high, and in the process of conveying the lead frame, the lead frame is not easy to shift due to external force, and the stability of lead frame conveying is better.
The side pushing assembly 56 is arranged, when the lead frame enters the conveying track 502, the lead frame is pushed laterally, the lead frame is propped against the side face of the conveying track 502, the clamping jaw assembly 54 is convenient to clamp the lead frame, the clamping jaw assembly 54 is effectively prevented from being clamped empty, the lead frame can enter the track at a correct position, and the lead frame is prevented from being inclined.
As shown in fig. 12 to 15, a dispensing device 01 according to an embodiment of the present invention includes a dispensing bracket 1, a vision component 2, and two dispensing components 3, wherein the vision component 2 is mounted on one side of the dispensing bracket 1, and the vision component 2 identifies a working position on a lead frame; two glue dispensing components 3 are arranged on the glue dispensing bracket 1, the two glue dispensing components 3 are positioned on two sides of the visual component 2, after the visual component 2 performs position identification on the lead frame, the glue dispensing components 3 perform glue dispensing on the lead frame, and the two glue dispensing components 3 share one visual component 2.
According to the dispensing device 01, the two dispensing assemblies 3 share the visual assembly 2, the visual assemblies 2 alternately perform visual detection on the working areas of the target positions of the two dispensing assemblies 3, the time for the visual detection assemblies to wait for dispensing of the dispensing assemblies 3 is effectively reduced, the utilization rate of the visual assemblies 2 is improved, the two dispensing assemblies 3 can simultaneously perform dispensing, the dispensing efficiency is improved, and the two dispensing assemblies 3 share the visual assembly 2, so that the cost can be saved, and the dispensing period is shortened.
The dispensing assembly 3 according to the embodiment of the present invention includes: the dispensing mounting frame 31, the Y-direction moving mechanism 32, the Z-direction moving mechanism 33 and the X-direction moving mechanism 34, wherein the Y-direction moving mechanism 32 is arranged on the dispensing mounting frame 31; the Z-direction moving mechanism 33 is arranged on the dispensing mounting frame 31; the X-direction moving mechanism 34 is connected with the Y-direction moving mechanism 32 to drive the X-direction moving mechanism 34 to move along the Y-direction, the X-direction moving mechanism 34 is connected with the Z-direction moving mechanism 33 to drive the X-direction moving mechanism 34 to move along the Z-direction, and the X-direction moving mechanism 34 can move along the Y-direction relative to the Z-direction moving mechanism 33, and the X-direction moving mechanism 34 is provided with a glue mounting mechanism 37.
In this embodiment, the dispensing mechanism 37 is mounted on the X-direction moving mechanism 34, the X-direction moving mechanism 34 can drive the dispensing mechanism 37 to move along the X-direction, the whole of the X-direction moving mechanism 34 can move along the Y-direction in the Y-direction moving mechanism 32, and the X-direction moving mechanism 34 can move along the Z-direction, so that the dispensing mechanism 37 can move in three directions X, Y and Z, and the Z-direction moving mechanism 33 is mounted on the dispensing mounting frame 31, when the dispensing mechanism 37 moves, the whole of the Y-direction moving mechanism 32 and the Z-direction moving mechanism 33 cannot move along with the dispensing mechanism 37, and compared with the existing three-axis dispensing mechanism 37, two of the three moving mechanisms of the X, Y and Z can move along with the dispensing mechanism 37, in this embodiment, only the X-direction moving mechanism 34 is required to move along with the dispensing mechanism 37, and the whole of the Y-direction moving mechanism 32 and the Z-direction moving mechanism 33 cannot move along with the dispensing mechanism 37, thus effectively reducing the weight and improving the moving speed and accuracy of the movement.
According to one embodiment of the present invention, the Y-direction moving mechanism 32 includes a Y-direction bracket 321 fixedly mounted on the dispensing mounting frame 31, a Y-direction driving member 322 and a Y-direction sliding rail assembly 323 are mounted on the Y-direction bracket 321, the Y-direction driving member 322 is fixedly mounted on the Y-direction bracket 321, a Y-direction moving plate is mounted on a power output end of the Y-direction driving member 322, the Y-direction moving plate is connected with a sliding block in the Y-direction sliding rail assembly 323 to move along the Y-direction, and the X-direction moving mechanism is mounted on the Y-direction moving plate.
According to one embodiment of the present invention, the Z-moving mechanism 33 includes a Z-mounting plate 331, a Z-driving member 332 and a Z-sliding rail assembly 333, wherein the Z-mounting plate 331 is fixedly mounted on one side of the dispensing mounting frame 31, the Z-driving member 332 is mounted on the Z-mounting plate 331, a Z-moving plate 336 is mounted at a power output end of the Z-driving member 332, and the Z-moving plate 336 is connected with the Z-sliding rail assembly 333.
According to one embodiment of the present invention, the X-direction moving mechanism 34 is connected to the Z-direction moving mechanism 33 by a Y-direction connecting assembly including a Y-direction guide 35, the Y-direction guide 35 being mounted on the Z-direction moving mechanism 33, and the X-direction moving mechanism 34 being slidably connected to the Y-direction guide 35.
Specifically, the X-direction moving mechanism 34 is connected to the Y-direction guide 35 by two rolling members 36, the two rolling members 36 are mounted on the X-direction moving mechanism 34, the two rolling members 36 are respectively located on the upper and lower sides of the Y-direction guide 35, and the two rolling members 36 roll on the Y-direction guide 35 in the Y-direction. In this embodiment, the Z-direction driving member 332 drives the Z-direction moving plate 336 to slide up and down along the Z-direction sliding rail assembly 333, and the Y-direction guiding member 35 is fixedly connected to the Z-direction moving plate 336, so that the Z-direction moving plate 336 drives the Y-direction guiding member 35 to move up and down, the Y-direction guiding member 35 is located between the up and down positions of the two rolling members 36, and the Y-direction guiding member 35 drives the two rolling members 36 to move up and down, and the two rolling members 36 are connected to the X-direction moving mechanism 34, so that the two rolling members 36 drive the X-direction moving mechanism 34 to move up and down.
In this embodiment, the X-direction moving mechanism 34 is connected to the Z-direction moving mechanism 33 through the Y-direction connecting component, so that the Z-direction moving mechanism 33 can drive the X-direction moving mechanism 34 to move along the Z-direction, and the X-direction moving mechanism 34 is slidably connected to the Y-direction guiding member 35 through the two rolling members 36, that is, the two rolling members 36 can roll along the Y-direction relative to the Y-direction guiding member 35, and the two rolling members 36 are respectively located on the upper and lower sides of the Y-direction guiding member 35.
Further, an elastic piece 334 is provided on the Z-direction mounting plate 331, the elastic piece 334 is provided at the left and right ends of the Z-direction mounting plate 331, the elastic piece 334 is provided along the Z-direction, a spring mover 335 is mounted on the elastic piece 334, the elastic piece 334 provides elastic force for the spring mover 335, and the spring mover 335 is connected with the Z-direction moving plate 336.
In this embodiment, the elastic member 334 is a constant force spring, the power is installed on the constant force spring to move up and down along with the compression and extension of the constant force spring, the constant force spring provides upward supporting force for the spring mover 335 and the Z-direction moving plate 336, when the device is suddenly powered off, the two constant force springs support the Z-direction installation plate 331, so that the Z-direction moving plate 336 and other components installed thereon are prevented from falling together and being damaged, the falling damage of the Z-direction moving plate 336 and other components installed thereon is effectively avoided, and the supporting force of the two constant force springs on the Z-direction moving plate 336 balances the load of the Z-direction moving plate 336 on the Z-direction driving member, so that the operation of the Z-direction driving member is more stable.
The dispensing device 01 has the beneficial effects that:
through two some subassembly 3 common vision subassembly 2 of gluing, the detection speed of vision subassembly 2 is greater than the point and glues the speed, and visual detection subassembly can carry out visual detection to the work area of two 3 target positions of some subassembly departments of gluing in turn, and two some subassembly 3 can carry out the point simultaneously and glue, improves the point and glues efficiency.
Through a visual component 2 of two point gum assemblies 3 sharing, for the current visual detection that a point gum assembly 3 is equipped with, reduced the quantity that sets up visual component 2, effectively reduced the cost, reduced the space that occupies, reduced the assembly degree of difficulty of point gum device 01, improved installation effectiveness.
Through the setting of Y to coupling assembling, Z to moving mechanism 33 can drive X to moving mechanism 34 along Z to X to moving mechanism 34 can move along Y to relative Z to moving mechanism 33, when dispensing mechanism 37 moves along Y, Z to moving mechanism 33 along with dispensing mechanism 37 does not move, has alleviateed the weight of removal, has improved moving speed and accuracy.
As shown in fig. 16 to 22, the chip supply apparatus 30 according to the embodiment of the present invention includes: the wafer position adjusting mechanism is arranged on the platform 40 and is used for driving the wafer to carry out position adjustment along the y direction, the x direction and the circumferential direction; the wafer expanding mechanism 48 is installed on the wafer position adjusting mechanism, and the wafer expanding mechanism 48 is used for stretching a wafer film on a wafer to enlarge the distance between adjacent chips; the chip ejection device 47 is mounted on the platform 40, the chip ejection device 47 is positioned below the die expanding mechanism 48, and the chip ejection device 47 is used for ejecting the chip from the wafer film; the wafer blanking mechanism is mounted on the platform 40, and is used for grabbing wafers with chips from the wafer box 401 to the wafer expanding mechanism 48 or grabbing wafers without chips from the wafer expanding mechanism 48 to the wafer box 401.
That is, the wafer blanking mechanism mainly supplies and offloads the whole wafer, the wafer with the chips is taken out from the wafer box 401, the wafer is sent back into the wafer box 401 after the chips on the wafer are mounted, the wafer is reciprocated until the wafers in the wafer box 401 are mounted, circulation can be achieved after the new wafer box 401 is replaced, the wafers are placed on the expanding mechanism 48, the expanding mechanism 48 stretches the wafer film, the chip spacing on the wafer film is enlarged, so that the chip ejection device 47 is convenient for ejecting the chips, and the wafer position adjusting mechanism is mainly used for adjusting the positions of the wafer on the expanding mechanism 48 and the wafer expanding mechanism 48, so that the chips are aligned with the chip ejection device 47, and simultaneously, the chips on the wafer are aligned with the mounting positions of the chips on the lead frame, so that the chip ejection device 47 is convenient for ejecting the chips.
The wafer position adjustment mechanism includes: a y-direction moving mechanism 44, an x-direction moving mechanism 45 and a circumferential rotating mechanism 46, the y-direction moving mechanism 44 being mounted on the platform 40; the x-direction moving mechanism 45 is arranged on the y-direction moving mechanism 44, and the y-direction moving mechanism 44 drives the x-direction moving mechanism 45 to move along the y-direction; the circumferential rotation mechanism 46 is mounted on the x-direction moving mechanism 45, the x-direction moving mechanism 45 drives the circumferential rotation mechanism 46 to move along the x-direction, the crystal expanding mechanism 48 is mounted on the circumferential rotation mechanism 46, and the circumferential rotation mechanism 46 drives the crystal expanding mechanism 48 to rotate in the circumferential direction.
In other words, the y-direction moving mechanism 44 and the x-direction moving mechanism 45 in the wafer position adjusting mechanism are mainly used for adjusting the positions of the chips on the horizontal plane, when one chip above the chip ejecting device 47 is gripped away for mounting, the other chip needs to be moved above the chip ejecting device 47 through the combined action of the y-direction moving mechanism 44 and the x-direction moving mechanism 45, the circumferential rotating mechanism 46 is used for controlling the rotation angle of the chip, the chip is generally square, the chip and the lead frame need to keep corresponding angles to complete mounting, and the angle of the chip can be adjusted through the circumferential rotating mechanism 46.
The crystal expanding mechanism 48 is mounted on the circumferential rotation mechanism 46, and the crystal expanding mechanism 48 includes: the jacking ring 482, the wafer mounting mechanism and the driving unit 489, wherein the jacking ring 482 is detachably connected with the circumferential rotation mechanism 46; the wafer mounting mechanism is arranged on the jacking ring 482, a wafer is mounted in the wafer mounting mechanism, the size of the wafer mounting mechanism is matched with wafers with different sizes, and the wafer mounting mechanism with corresponding sizes is replaced when the wafers with different sizes are processed; the active unit 489 is located at a side of the wafer mounting mechanism, the active unit 489 can be close to or far away from the wafer mounting mechanism, the active unit 489 is used for driving the wafer mounting mechanism to be close to or far away from the lifting ring 482, the active unit 489 and the wafer mounting mechanism are located on the same horizontal plane, and the active unit 489 can be close to or far away from the wafer mounting mechanism along a direction pointing to a center of a circle of the wafer mounting mechanism, and a movement direction of the active unit 489 in the embodiment of the wafer mounting mechanism is a y direction.
In other words, the wafer expanding mechanism 48 is detachably disposed on the circumferential rotation mechanism 46, the size of the wafer mounting mechanism on the wafer expanding mechanism 48 corresponds to the size of the wafer, when the processed wafer changes in size, the corresponding lifting ring 482 and the wafer mounting mechanism can be directly replaced, and the driving unit 489 can disconnect the transmission relationship with the wafer mounting mechanism, so that the lifting ring 482 and the wafer mounting mechanism can be replaced conveniently, and the driving unit 489 does not need to be replaced and rewiring because the driving unit 489 does not need to be replaced, and the electrical components do not need to be reset and error compensated because the electrical components are not replaced, so that the wafer mounting mechanism can be put into use immediately after replacement.
The chip ejection device 47 includes: the lifting mounting seat 471, the lifting assembly 472 and the ejection assembly 473, wherein the lifting mounting seat 471 is mounted on the platform 40, a wafer film is arranged above the platform 40, and a plurality of chips are placed on the wafer film; the lifting assembly 472 is arranged on the lifting mounting seat 471; the ejector component 473 is mounted on the lifting component 472, the lifting component 472 drives the ejector component 473 to perform lifting motion so as to be close to or far away from the wafer film, the ejector component 473 is provided with a housing component 47314 and a thimble 47313 arranged in the housing component 47314, negative pressure is arranged in the housing component 47314 so as to adsorb the wafer film downwards, and the thimble 47313 can move upwards and protrude out of the housing component 47314 so as to eject the chip upwards.
The blanking mechanism on the wafer comprises: the wafer box 401 and the picking and placing mechanism 42 are arranged on the platform 40, the lifting mechanism 41 is arranged on one side of the wafer expanding mechanism 48; the wafer cassette 401 is mounted on the lifting mechanism 41, a plurality of wafers are stacked in the wafer cassette 401, and the lifting mechanism 41 drives the wafer cassette 401 to move up and down; the pick-and-place mechanism 42 is mounted on the platform 40, the pick-and-place mechanism 42 is located at one side of the wafer expanding mechanism 48, and the pick-and-place mechanism 42 is used for grabbing wafers and moving between the wafer box 401 and the wafer expanding mechanism 48.
That is, the lifting mechanism 41 can drive the wafer cassette 401 to move up and down, after the first wafer is removed by the picking and placing mechanism 42 and processed, the picking and placing mechanism 42 replaces the first wafer in the wafer cassette 401, and then the lifting mechanism 41 drives the wafer cassette 401 to lift up, so that the picking and placing mechanism 42 picks up the second wafer, and the process is repeated until all wafers in the wafer cassette 401 are processed.
As shown in fig. 28 to 30, the visual inspection assembly 58 includes: a base 521, a visual detector 522, a mirror face 523, and a moving mechanism 524, the base 521 being provided on the conveying rail 502, and the conveying rail 502 being conveyed with a lead frame; the visual detector 522 is mounted on the base 521; the mirror face 523 is disposed opposite to the lens of the visual detector 522, and the mirror face 523 is disposed obliquely upward; a moving mechanism 524 is mounted on the conveying rail 502, the moving mechanism 524 being connected to the mirror face 523 to drive the mirror face 523 to move toward the lens of the visual detector 522, wherein the visual detector 522 is a visual camera.
Imaging of the chip absorbed by the chip suction nozzle 722 is reflected through the reflecting mirror 523, the imaging in the reflecting mirror 523 is shot by the visual detector 522 to perform visual detection, whether the position and the angle of the chip absorbed by the suction nozzle 722 are qualified or not is detected, the position precision of the chip attached to the lead frame is improved, the reflecting mirror 523 is driven to move close to or far away from the visual detector 522 through the moving mechanism 524, the position of the reflecting mirror 523 is adjusted according to the precision requirements of different products, the adjusting mode is simple and reliable, the position of the visual detector 522 does not need to be moved, and the detection precision of the visual detector 522 cannot be influenced.
The moving mechanism 524 comprises a mounting seat 525, a guide rail 526 and a locking piece 527, wherein the guide rail 526 is mounted on the mounting seat 525, a sliding piece is connected to the guide rail 526, and the reflecting mirror 523 is mounted on the sliding piece; a locking member 527 is coupled to the mount 525, and the locking member 527 is coupled to or in contact with the slider to lock the position of the slider. Two photoelectric switches 5218 are arranged on the mounting seat 525 along the direction of the guide rail 526, and a light blocking piece matched with the photoelectric switches 5218 is fixedly connected to the sliding piece. The slider includes a light source mounting plate 528, and the light source mounting plate 528 links to each other with guide rail 526 to guide the removal of light source mounting plate 528 through guide rail 526, and the mirror 523 is installed on light source mounting plate 528, and light source mounting plate 528 below is equipped with the support piece 529 that supports light source mounting plate 528, and support piece 529 is fixed connection with mount pad 525.
Retaining member 527 includes bolt 5210, nut 5211, retaining block 5212 and stopper 5213, bolt 5210 and guide rail 526 parallel arrangement, and with mount pad 525 threaded connection, the nut 5211 sets up in the one end of bolt 5210, stopper 5213 and slider fixed connection, retaining block 5212 suit is on bolt 5210, retaining block 5212 and bolt 5210 sliding fit to make retaining block 5212 can follow bolt 5210 and slide, retaining block 5212 can offset with stopper 5213, in order to restrict the removal of stopper 5213 and slider. The end face of the locking block 5212 far away from the nut 5211 is provided with a waist-shaped hole, and the waist-shaped hole penetrates through the end face of the locking block 5212 close to the nut 5211. The locking member 527 includes a first locking portion 5215 and a second locking portion 5216, the first locking portion 5215 and the second locking portion 5216 are fixedly connected or integrally formed, the first locking portion 5215 is cylindrical in shape, a kidney-shaped hole is formed in the first locking portion 5215 and the second locking portion 5216, and the diameter of the first locking portion 5215 is larger than the width of the second locking portion 5216. The limiting block 5213 is provided with a groove 5217, and the locking block 5212 is in sliding fit with the groove 5217.
The base 521 is provided with a lens holding block 5220, the lens holding block 5220 is provided with a middle hole for a camera lens to pass through, one end of the lens holding block 5220 is provided with a notch communicated with the middle hole, and the lens holding block 5220 is provided with a screw for adjusting the width of the notch. The lens enclasping block 5220 is provided with a bar hole, and the base 521 is provided with a screw for fixing the lens alarm block, and the screw can move in the bar hole to adjust the position of the lens enclasping block 5220.
In order to facilitate shooting in S4, the conveying track 502 is further provided with a mounting plate 59, two light sources 591 are arranged on the mounting plate, and the irradiation positions of the light sources 591 are adjustable, so that irradiation on a chip is ensured, and shooting effect is ensured.
The visual detection component 58 is arranged on one side of the conveying track 502 to carry out visual detection on chip mounting, so that the chip mounting accuracy is higher, the distance between the reflecting mirror and the visual detector 581 can be adjusted according to the requirements of different product accuracy by arranging the visual detector 581 and the reflecting mirror surface 582 with adjustable positions, the position of the visual detector 581 is not required to be adjusted, the use is convenient, the adjustment mode is simple and reliable, the visual detector 581 and the reflecting mirror surface 582 are arranged on the side surface of the conveying track 502, the space can be saved, the installation is convenient, and the visual detector 581 and other components are prevented from interfering with each other.
As shown in fig. 23 to 27, the chip mounter according to an embodiment of the present invention includes: the mounting head moving mechanism 73 and the mounting head 71, wherein the mounting head moving mechanism 73 is provided with a damping device 77, and the damping device 77 can reciprocate along the y direction so as to counteract vibration generated when the mounting head moving mechanism 73 works; the mounting head 71 is mounted on a mounting head moving mechanism 73, and the mounting head moving mechanism 73 drives the mounting head 71 to move in the xyz direction, and the mounting head 71 can adsorb the chip and drive the chip to rotate to adjust the angle of the chip on the xy plane.
The chip is adsorbed by the mounting head 71, and then the chip is driven to rotate by the mounting head 71, so that the chip is aligned with the lead frame, mounting deviation is avoided, the mounting head moving mechanism 73 controls the mounting head 71 to carry out reciprocating mounting movement, and the vibration generated by the movement is counteracted by the damping device 77, so that the service life is prolonged, the adverse effect of the vibration on the mounting process is avoided, and the mounting precision and the mounting effect are improved.
The mounting head moving mechanism 73 according to the embodiment of the present invention includes: the composite base 78, the x-direction moving component 74, the y-direction moving component 75, the z-direction moving component 76 and the shock absorbing device 77, and the x-direction moving component 74 is arranged on the composite base 78; the y-direction movement assembly 75 is connected with the x-direction movement assembly 74, and the x-direction movement assembly 74 drives the y-direction movement assembly 75 to move along the x-direction; the mounting head is mounted on the z-direction moving component 76, one part of the z-direction moving component 76 is mounted on the x-direction moving component 74, the other part of the z-direction moving component 76 is mounted on the y-direction moving component 75, the y-direction moving component 75 drives the mounting head to move along the y-direction, and the z-direction moving component 76 drives the mounting head to move along the z-direction; the damper 77 is mounted on a composite base 78, the damper 77 being opposite to the direction of motion of the y-motion assembly 75.
That is, the z-direction moving component 76 in the present embodiment is simultaneously installed on the x-direction moving component 74 and the y-direction moving component 75, and the y-direction moving component 75 and the z-direction moving component 76 simultaneously drive the mounting head to move, so as to realize the decoupling function. In addition, in this embodiment, the y-direction moving component 75 needs to grab the chip from the waiting area onto the lead frame, the y-direction moving distance is long, the x-direction moving component 74 is used for fine adjustment of the x-direction mounting position of the chip, so that the x-direction moving distance is short, on the other hand, the z-direction movement is difficult to cause offset on the xy plane of the chip, so that the moving direction of the damping device 77 is opposite to that of the y-direction moving component 75, and the damping device 77 is mainly used for counteracting the vibration generated by the y-direction moving component 75.
The mounting head moving mechanism 73 is simple and compact in structure, the x-direction moving assembly 74, the y-direction moving assembly 75 and the z-direction moving assembly 76 act together to drive the mounting head to move in the xyz three-dimensional direction, automatic and accurate movement in the three-dimensional space is achieved when a chip is mounted, the shock absorbing device 77 is arranged, the moving direction of the shock absorbing device 77 is designed to be opposite to the moving direction of the y-direction moving assembly 75, and the shock absorbing device 77 can offset shock, so that the stability of the chip conveying process and the mounting process is improved.
The mounting head 71 according to the embodiment of the present invention includes: the second mounting seat 712, the third mounting seat 715 and the mounting head assembly, wherein the second mounting seat 712 is provided with a rotary driving assembly; the third mounting mount 715 is slidably connected to the second mounting mount 712 in the vertical direction; the mounting head assembly is vertically arranged, the mounting head assembly is rotatably arranged on the third mounting seat 715, the mounting head assembly is in transmission connection with the rotary driving assembly, and the mounting head assembly can axially and circumferentially move.
That is, through the sliding connection relationship between the third mounting seat 715 and the second mounting seat 712 along the vertical direction, the mounting head assembly on the third mounting seat 715 can perform the linear motion along the vertical direction, so that the hard contact can be avoided during mounting, and meanwhile, the chip can be driven to perform the up-down micro motion, so that the accurate control of the mounting pressure is realized, and on the other hand, the mounting head assembly is driven to rotate by the rotary driving assembly, and the chip is driven to rotate by the mounting head assembly, so that the alignment with the lead frame before the chip mounting is ensured, and the mounting precision and the mounting effect are improved.
According to one embodiment of the present invention, the second mounting mount 712 is mounted on the first mounting mount 711, the relative position between the second mounting mount 712 and the first mounting mount 711 can be fine-tuned, the first mounting mount 711 is mounted on the z-axis support 761 of the head moving mechanism 73, and the relative position between the first mounting mount 711 and the head moving mechanism 73 can be fine-tuned.
According to one embodiment of the present invention, a mounting head assembly includes: a rotation shaft 720, a suction nozzle stem 721, a suction nozzle 722 and a micro joint 723, wherein the rotation shaft 720 is rotatably provided in the third mounting base 715, and the rotation shaft 720 is a hollow member; one end of the nozzle lever 721 communicates with one end of the rotation shaft 720; the suction nozzle 722 is mounted at the other end of the suction nozzle stem 721; a micro joint 723 is mounted on the other end of the rotation shaft 720.
In other words, a negative pressure device is connected to one end of the micro joint 723, and the rotation shaft 720, the nozzle stem 721, and the nozzle 722 are hollow, and the micro joint 723 is connected to a negative pressure, so that the nozzle 722 can suck the chip.
Further, the rotary drive assembly includes: a servo motor 713 and a timing belt mechanism 714, the servo motor 713 being mounted on the second mounting mount 712; one end of the timing belt mechanism 714 is connected to an output end of the servo motor 713, and the other end of the timing belt mechanism 714 is connected to the rotation shaft 720.
Further, an angular ball bearing 726 is provided between the rotation shaft 720 and the third mounting mount 715. The angular ball bearing 726 may bear both radial and axial loads. And the position of the servo motor 713 on the second mounting mount 712 can be adjusted to function as a tension timing belt mechanism 714.
That is, the rotation shaft 720 is rotatably connected to the third mounting base 715, and the servo motor 713 drives the rotation shaft 720 to rotate through the timing belt mechanism 714, so as to achieve the purpose of adjusting the angle of the chip.
According to one embodiment of the present invention, the second mounting seat 712 is mounted with a resistance-free air cylinder 719, and an output end of the resistance-free air cylinder 719 is connected to the third mounting seat 715, and the resistance-free air cylinder 719 drives the third mounting seat 715 to move in a vertical direction.
In this embodiment, the third mounting seat 715 can be finely adjusted along the vertical direction under the driving of the non-resistance cylinder 719, so that the third mounting seat 715 can be pressed down to provide stable mounting pressure, and the movable range of the third mounting seat 715 in the vertical direction is smaller and the transmission of the synchronous belt mechanism 714 is not affected.
On the basis, the lower end of the third mounting seat 715 is provided with a containing cavity, a constant force spring 718 is arranged in the containing cavity, the upper end of the constant force spring 718 is propped against the third mounting seat 715, and the lower end of the constant force spring 718 is arranged on the second mounting seat 712. The constant force spring 718 can effectively support the third mounting seat 715, so that the third mounting seat 715 is prevented from directly falling down to collide under the condition of power failure. The second mounting seat 712 is further provided with a limiting piece 727 for limiting the lower limit of the movement of the third mounting seat 715.
According to one embodiment of the present invention, the second mounting base 712 is provided with a voice coil motor stator 716, the third mounting base 715 is provided with a voice coil motor rotor 717, a cooling cover 725 is provided above the voice coil motor stator 716, the voice coil motor stator 716 and the voice coil motor rotor 717 cooperate to form a voice coil motor, a brass sheet is provided between the voice coil motor stator 716 and the cooling cover 725, and the cooling cover 725 has an air inlet for air to enter the voice coil motor.
The gas gets into voice coil motor stator 716 and voice coil motor runner 717 through cooling cover 725 and directly cools off voice coil motor, utilizes voice coil motor to drive the third and pastes dress mount pad 715 and move down, and the stroke of voice coil motor is 1mm in this application, can carry out accurate control to the chip when pasting, can avoid chip and lead frame to produce hard contact, causes the product damage.
According to one embodiment of the present invention, the third mounting seat 715 is slidably connected to the second mounting seat 712 through the roller guide rail 724, and the oil baffle 728 is installed under the second mounting seat 712, and the oil baffle 728 is located directly under the roller guide rail 724. The oil baffle 728 can prevent the lubricant from dripping on the roller guide rail 724, thereby ensuring the mounting quality.
In operation, the suction nozzle 722 first adsorbs the chip, the servo motor 713 starts to work according to the position of the lead frame, the rotation angle of the chip is adjusted to align the chip with the lead frame, then the mounting head moving mechanism 73 moves the chip to the position just above the lead frame by 1mm, the voice coil motor drives the chip to move downwards by 1mm and finish bonding with the lead frame, and then the non-resistance cylinder 719 presses downwards, so that stable bonding pressure is provided, and bonding is finally finished.
As shown in fig. 24 to 32, the mounted lead frame is placed in a magazine for blanking, and the blanking device 20 according to the embodiment of the present invention includes: the automatic feeding device comprises a shell, a material box guiding mechanism 21 and a blanking mechanism 22, wherein the material box guiding mechanism 21 is arranged on a base 221 in the shell, and a vertical channel is arranged in the material box guiding mechanism 21 and is used for guiding and conveying the material box; the blanking mechanism 22 is located in the shell, the blanking mechanism 22 comprises a material box lifting unit 222, a material box receiving unit 224 and a pushing unit 223, the material box lifting unit 222 receives the material box in the vertical channel, the material box receiving unit 224 and the pushing unit 223 are located on two sides of the material box guiding mechanism 21 respectively, the pushing unit 223 is used for pushing the received material box into the material box receiving unit 224, and the material box receiving unit 224 continuously supports and guides the material box in the pushing process.
The vertical conveying device is reliable and compact in structure, the vertically-falling material box is guided through the vertical channel in the material box guiding mechanism 21, the falling position of the material box is kept unchanged during vertical conveying, and meanwhile, the periphery of the material box is guided by the vertical channel in the conveying process from top to bottom, so that the material box is kept in a stable state during the conveying process; the pushing unit 223 pushes the cartridges in the vertical channel into the cartridge receiving unit 224 one by one, and the vertical channel buffers the cartridges, so that stacking phenomenon during discharging is avoided.
The blanking is performed by the above-mentioned blanking device 20, including the following steps,
step one: the material box guiding mechanism 21 and the blanking mechanism 22 are adjusted according to the size of the material box;
step two: the plurality of cartridges sequentially enter vertical channels on the cartridge guide mechanism 21, and the vertical channels guide and convey the cartridges from top to bottom;
step three: when the lowest magazine is supported by the magazine lifting unit 222, the magazine guide mechanism 21 fixes the magazine above the lowest magazine;
step four: the pushing unit 223 pushes the lowermost cartridge into the cartridge receiving unit 224 and then resets;
step five: steps three and four are repeated to push the cartridges one by one into the cartridge receiving unit 224.
As shown in fig. 14, the movement of the first cartridge is shown, the first cartridge is first in the first position a, then moved to the second position B, then pushed into the third position C, the first cartridge is moved into the fourth position D when the second cartridge is moved into the position C, the second cartridge is moved into the fourth position D when the third cartridge is moved into the position C, the first cartridge is moved into the fifth position E, and finally removed by a worker or machine.
The invention can adjust according to the size and the falling position of the material box, thereby adapting to the material boxes with different sizes, improving the applicability, the material pushing unit 223 pushes the material boxes into the material box receiving unit 224 one by one, and the material box guiding mechanism 21 fixes the rest material boxes for buffering, thereby ensuring the orderly blanking.
The invention also provides a die bonding method, which adopts the die bonding equipment to carry out die bonding, and comprises the following steps:
s1, a feeding device 10 continuously supplies lead frames to a lead frame conveying device 50, the lead frame conveying device 50 conveys the lead frames towards a direction of a blanking device 20, and a chip supply device 30 continuously supplies chips to a mounting device 70;
s2, dispensing the mounting position on the lead frame by the dispensing device 01;
S3, the mounting device 70 grabs the chip and mounts the chip on a mounting position of the lead frame;
and S4, the blanking device 20 is used for plugging out the attached lead frame.
On the basis, the specific process of continuously supplying chips to the mounting device 70 by the chip supply device 30 in S1 is as follows:
s11, performing a wafer expanding operation on the wafer by the chip supply device 30 to increase the interval between adjacent chips;
s12, the chip supply device 30 adjusts the position and the angle of the wafer to align the chip with the mounting position;
s13, the chip supply device 30 lifts up the chip so that the mounting device 70 can grasp the chip.
As shown in fig. 31, when the chip supply device 30 of the present invention is used to supply chips, the method includes the steps of:
step one: determining the size of a wafer to be supplied, and placing the corresponding wafer box 401 on a lifting mechanism 41 in a wafer blanking mechanism according to the size of the wafer;
step two: mounting a corresponding wafer mounting mechanism on the wafer position adjusting mechanism on the wafer expanding mechanism 48 according to the size of the wafer;
step three: the picking and placing mechanism 42 in the wafer blanking mechanism grabs and places the wafer in the wafer box 401 on the wafer expanding mechanism 48, namely between the pressing plate base 484 and the pressing plate 485 on the wafer expanding mechanism 48;
Step four: the wafer film is stretched by the crystal expanding mechanism 48, so that the interval between chips on the wafer film is increased; that is, the active unit 489 approaches the wafer mounting mechanism and completes transmission connection with the wafer mounting mechanism, then, the wafer film on the wafer is heated by blowing air, so as to soften the wafer film, then, the active unit 489 drives the wafer on the wafer mounting mechanism to be downward close to the lifting ring 482, and the wafer film on the wafer is simultaneously subjected to blocking action upwards by the annular bulge 4821 of the lifting ring 482 and stretching action downwards by the wafer ring, so that the wafer film is stretched from inside to outside, and the distance between two adjacent wafers on the wafer film is enlarged;
step five: the wafer position adjusting mechanism moves the chip to the position right above the chip ejection device 47, and simultaneously adjusts the angle of the chip, the chip ejection device 47 sucks the wafer film downwards and simultaneously ejects the chip upwards so as to facilitate the chip to be taken away, and the steps are repeated until all the chips on the wafer are taken away;
step six: the wafer position adjusting mechanism is reset, and the wafer blanking mechanism grabs the wafer back into the wafer box 401;
step seven: the lifting mechanism 41 is lifted, another wafer is lifted to the position of the previous wafer, and the steps three to six are repeated until all the wafers in the wafer cassette 401 are completely supplied.
On the basis, the specific process of S2 dispensing is as follows:
s21, partitioning the lead frame, and dividing the mounting position on the lead frame into an upper area and a lower area;
s22, visually detecting the mounting position by the visual component 2, and then dispensing the mounting position on the lead frame by the two dispensing components 3;
s23, two dispensing assemblies 3 are respectively a first dispensing assembly 3 and a second dispensing assembly 3, the upper area is dispensed by the first dispensing assembly 3, the lower area is dispensed by the second dispensing assembly 3, and the mounting positions of the middle row or two rows on the lead frame are jointly completed by the first dispensing assembly 3 and the second dispensing assembly 3.
Preferably, when the vision component 2 performs vision detection on the working area, the vision detection is performed on the working areas of the upper area and the lower area alternately, after the vision component 2 performs vision detection on the working area of the upper area, the first dispensing component 3 performs dispensing on the working area of the upper area, and meanwhile, the vision component 2 performs vision detection on the working area of the lower area, after detection is completed, the second dispensing component 3 performs dispensing on the working area of the lower area, and dispensing is sequentially and circularly completed.
Preferably, the number of columns of the working area on the lead frame is set to be m, the lead frame is divided into a left area and a right area when being divided into areas, the number of columns of the left area and the right area is equal when m is even, and the left area is one more column than the right area when m is odd. When the lead frame is divided into areas, the number of the working areas of each column is n+1/2 in the upper area of the left area, the number of the working areas of each column is n-1/2 in the lower area of the left area, the number of the working areas of each column is n-1/2 in the upper area of the right area, the number of the working areas of each column is n+1/2 in the lower area of the right area, and the number of the working areas of each column is the same as the number of the working areas of the lower area when n is even.
Preferably, when the vision assembly 2 performs vision inspection on the working area, the vision assembly 2 performs inspection starting from each column of middle positions, and then performs vision inspection alternately on the working areas of the upper area and the lower area.
In this embodiment, the order in which the vision component 2 performs the photographing detection is: when the left area is photographed and detected, when the number of lines n is odd, photographing is firstly performed from the middle-most working area, when the number of lines n is even, photographing is firstly performed from the bottom-most working area in the upper area of the column, then photographing is performed on one bottom-most working area in the lower area of the column, then photographing is performed on the first bottom-most working area in the upper area of the column, then photographing is performed on the first bottom-most working area in the lower area of the column, then photographing is performed on the second bottom-most working area in the upper area of the column, then photographing is performed on the second bottom-most working area in the lower area of the column, and alternate photographing detection is performed on the upper area and the lower area in sequence.
When the right area is photographed and detected, when n is an odd number, photographing is firstly performed from the middle working area, when n is an even number, photographing is performed from the uppermost working area in the lower area of the row, then photographing is performed on the uppermost working area of the upper area of the row, photographing is performed on the first lower working area of the uppermost area in the lower area of the row, photographing is performed on the first lower working area of the uppermost area of the upper area of the row, photographing is performed on the second lower working area of the uppermost area of the lower area of the row, photographing is performed on the second lower working area of the uppermost area of the upper area of the row, and alternate photographing detection is performed on the upper area and the lower area in sequence.
Referring to fig. 35, when the number of rows of the working area on the lead frame is 6 and the number of columns is 10, both the number of rows and the number of columns are even, the area above the straight line p is the upper area, the area below the straight line p is the lower area, the area to the left of the straight line q is the left area, and the area to the right of the straight line q is the right area.
Referring to fig. 36, when the number of rows of the working area on the lead frame is 3 and the number of columns is 10, the left part of the straight line s is the left area, the right part is the right area, the upper part is above the straight line L in the left area, the lower part is below the straight line L in the right area, the upper part is above the straight line p, and the lower part is below the straight line p.
Referring to fig. 37, when the number of rows of the working area on the lead frame is 5 and the number of columns is 9, the left part of the straight line k is the left area, the right part is the right area, the upper part is above the straight line i in the left area, the lower part is below the straight line i in the right area, the upper part is above the straight line j, and the lower part is below the straight line j.
After the vision component 2 shoots and detects the working area, the dispensing component 3 dispenses the working area, the two dispensing components 3 respectively dispense the glue in the upper area and the lower area, and the two dispensing components 3 dispense the glue simultaneously, so that the dispensing efficiency is improved, after each vision component 2 shoots one working area, the dispensing component 3 dispenses the glue to the working area, and meanwhile, the vision component 2 shoots and detects the next working area when the dispensing component 3 dispenses the glue, the time is saved, and the dispensing period is effectively shortened.
In this embodiment, the upper region is dispensed by the right dispensing component 3, the lower region is dispensed by the left dispensing component 3, and the two dispensing components 3 simultaneously dispense, and when dispensing, the two dispensing components 3 simultaneously dispense the upper region and the lower region of each row, and then the next row of dispensing is performed after dispensing is completed.
On this basis, in S3, after the mounting device 70 grabs the chip, the visual detection component 58 detects the chip angle, and if the chip angle deviates, the mounting device 70 drives the chip to rotate, so that the chip angle is calibrated, and then the chip is mounted on the mounting position of the lead frame.
Specifically, jacking up good chips on a wafer and grabbing up the chips from the wafer; the wafer film is sucked downwards when the chip is jacked upwards, the mode of grabbing the chip is negative pressure adsorption, the chip and the wafer film can be separated as far as possible when the chip is jacked, the chip is adsorbed by the suction nozzle 722, the chip cannot be damaged by negative pressure adsorption, and meanwhile, the offset of the chip at the moment can be reduced. Performing visual calibration and compensation on the angle of the chip; the picked chip is shot from bottom to top, the angle difference between the edge outline of the chip and the outline of the chip mounting position on the lead frame is calculated, the angle difference is compensated by adjusting the angle of the chip, the chip cannot be shot continuously from the upper side after being adsorbed due to the small size of the chip, and the offset chip can be compensated by adopting a shooting mode from the lower side of the chip. And moving the chip to the lead frame for chip mounting.
The die bonding method has a compact structure, can realize full-flow automatic die bonding operation of the lead frame and the chip, can relocate and calibrate the chip before mounting, and effectively improves die bonding efficiency and die bonding precision.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.
Claims (18)
1. A die bonding apparatus, comprising:
a lead frame conveying device (50), wherein the lead frame conveying device (50) conveys the lead frames along the x direction;
the feeding device (10) is positioned at one end of the lead frame conveying device (50), and the feeding device (10) is used for connecting the lead frame to the lead frame conveying device (50);
the dispensing device (01) is positioned above the lead frame conveying device (50) and is used for dispensing the lead frame;
the chip supply device (30), the said chip supply device (30) locates at the side of the said lead frame conveying appliance (50), the said chip supply device (30) is used for carrying and expanding the crystal wafer, and jack up the chip on the crystal wafer;
a mounting device (70), wherein the mounting device (70) moves between the lead frame conveying device (50) and the chip supplying device (30) so as to grasp and mount the chip on the lead frame;
and the blanking device (20) is positioned at the other end of the lead frame conveying device (50), and the blanking device (20) is used for plugging the lead frame out of the lead frame conveying device (50).
2. The die bonding apparatus according to claim 1, wherein the lead frame transporting device (50) includes:
a base (501), the base (501) being mounted on a platform (40);
the conveying track (502), the conveying track (502) is arranged on the base (501), a dispensing area (510), a mounting area (520) and a discharging area (550) are arranged on the conveying track (502), the dispensing area (510) is provided with a first adsorption component (51), the mounting area (520) is provided with a second adsorption component (52) and a heating component, and the lead frame moves out of the conveying track (502) from the discharging area (550);
-a drive assembly (53), the drive assembly (53) being mounted on the conveyor track (502);
the clamping jaw assembly (54), clamping jaw assembly (54) are installed one side of conveying track (502), clamping jaw assembly (54) clamp the lead frame, clamping jaw assembly (54) are connected with driving assembly (53) in a transmission mode, and clamping jaw assembly (54) is driven to move along the direction of conveying track (502) through driving assembly (53).
3. The die bonding apparatus according to claim 2, wherein the loading device (10) comprises:
a cabinet body;
the Y-direction moving mechanism (11), and the Y-direction moving mechanism (11) is arranged in the cabinet body;
The Z-direction moving mechanism (12), the Z-direction moving mechanism (12) is arranged on the Y-direction moving mechanism (11), and the Y-direction moving mechanism (11) can drive the Z-direction moving mechanism (12) to move along the Y direction;
the feeding device (10) is provided with two feeding modes, namely a first feeding mode and a second feeding mode, wherein the first feeding mode is used when the lead frames are stacked in the material box, and the second feeding mode is used when a release layer is arranged between the stacked lead frames which are adjacent up and down;
in a first feeding mode, a clamping component (13) is arranged on the Z-direction moving mechanism (12), the Z-direction moving mechanism (12) drives the clamping component (13) to move along the Z direction, the clamping component (13) clamps a material box, a pushing component (14) is arranged on one side of the clamping component (13), and the pushing component (14) pushes a lead frame in the material box;
under the second type material loading mode, install on Z to mobile mechanism (12) and absorb subassembly (15), Z to mobile mechanism (12) drive absorb subassembly (15) along Z to the motion, be equipped with in the cabinet body and install basket bottom plate (16), basket bottom plate (16) are located and absorb subassembly (15) below, one side fixedly connected with waste box (17) of basket bottom plate (16), opposite side fixedly connected with transport bottom plate (18), basket bottom plate (16), waste box (17) and transport bottom plate (18) can dismantle with the cabinet body and be connected.
4. The die bonding apparatus according to claim 2, wherein the dispensing device (01) comprises:
the dispensing bracket (1), the dispensing bracket (1) is installed on the platform (40);
the visual component (2) is arranged on one side of the dispensing bracket (1), and the visual component (2) identifies the working position on the lead frame;
two glue dispensing components (3), two glue dispensing components (3) are arranged on a glue dispensing support (1), two glue dispensing components (3) are arranged on two sides of a visual component (2), after the visual component (2) performs position identification on a lead frame, the glue dispensing components (3) perform glue dispensing on the lead frame, the two glue dispensing components (3) perform glue dispensing on different working areas respectively, and the two glue dispensing components (3) perform glue dispensing simultaneously.
5. The die bonding apparatus according to claim 1, wherein the chip supply device (30) includes:
the wafer blanking mechanism is used for grabbing wafers from the wafer box (401);
the wafer position adjusting mechanism is used for driving the wafer to adjust the position along the y direction, the x direction and the circumferential direction;
the wafer expanding mechanism (48), the wafer expanding mechanism (48) is arranged on the wafer position adjusting mechanism, and the wafer expanding mechanism (48) is used for stretching a wafer film on a wafer to enlarge the distance between adjacent chips;
The chip ejection device (47), the chip ejection device (47) is located below the crystal expanding mechanism (48), and the chip ejection device (47) is used for ejecting chips from the wafer film.
6. The die bonding apparatus of claim 5, wherein the on-wafer blanking mechanism comprises:
the wafer box (401) is installed on the lifting mechanism (41), a plurality of wafers are stacked in the wafer box (401), and the lifting mechanism (41) drives the wafer box (401) to move in a lifting mode;
the wafer picking and placing mechanism (42), the picking and placing mechanism (42) is located on one side of the wafer expanding mechanism (48), and the picking and placing mechanism (42) is used for grabbing the wafer and moving between the wafer box (401) and the wafer expanding mechanism (48).
7. The die bonding apparatus according to claim 5, wherein the wafer position adjustment mechanism comprises:
a y-direction moving mechanism (44);
the X-direction moving mechanism (45), the X-direction moving mechanism (45) is arranged on the Y-direction moving mechanism (44), and the Y-direction moving mechanism (44) drives the X-direction moving mechanism (45) to move along the Y-direction;
the crystal growth device comprises a circumferential rotating mechanism (46), wherein the circumferential rotating mechanism (46) is arranged on an x-direction moving mechanism (45), the x-direction moving mechanism (45) drives the circumferential rotating mechanism (46) to move along the x-direction, a crystal growth mechanism (48) is arranged on the circumferential rotating mechanism (46), and the circumferential rotating mechanism (46) drives the crystal growth mechanism (48) to rotate in the circumferential direction.
8. The die bonding apparatus according to claim 7, wherein the die expanding mechanism (48) of the corresponding size is replaced when wafers of different sizes are processed, the die expanding mechanism (48) comprising:
the jacking ring (482) is detachably connected with the circumferential rotating mechanism (46);
the wafer mounting mechanism is arranged on the jacking ring (482), a wafer is mounted in the wafer mounting mechanism, and the size of the wafer mounting mechanism is matched with wafers with different sizes;
an active unit (489), wherein the active unit (489) is positioned on the side surface of the wafer mounting mechanism, the active unit (489) can be close to or far away from the wafer mounting mechanism, and the active unit (489) is used for driving the wafer mounting mechanism to be close to or far away from the jacking ring (482);
the upper surface of jacking ring (482) is provided with annular protrusion (4821), wafer installation mechanism is located the outside of annular protrusion (4821), wafer installation mechanism is when being close to jacking ring (482), the wafer membrane on the wafer is by annular protrusion (4821) jack-up.
9. The die bonding apparatus according to claim 5, wherein the chip ejection device (47) includes:
A lifting mounting seat (471);
a lifting assembly (472), the lifting assembly (472) being disposed on the lifting mount (471);
the ejector assembly (473), the ejector assembly (473) is installed on the lifting assembly (472), the lifting assembly (472) drives the ejector assembly (473) to carry out lifting motion so as to be close to or far away from the wafer film, the ejector assembly (473) is provided with a housing assembly (47314) and an ejector pin (47313) arranged in the housing assembly (47314), negative pressure is arranged in the housing assembly (47314) so as to downwards adsorb the wafer film, and the ejector pin (47313) can upwards move and protrude out of the housing assembly (47314) so as to upwards eject the chip.
10. The die bonding apparatus according to claim 2, wherein the mounting device (70) includes:
the mounting head (71), the mounting head (71) is arranged on a mounting head moving mechanism (73), the mounting head moving mechanism (73) drives the mounting head (71) to move in the xyz direction, and the mounting head (71) can adsorb a chip and drive the chip to rotate so as to adjust the angle of the chip on an xy plane;
and a visual inspection assembly (58), wherein the visual inspection assembly (58) is positioned on one side of the conveying track (502) facing the wafer.
11. The die bonding apparatus of claim 10, wherein the vision inspection assembly (58) comprises:
a base (521);
-a visual detector (522), the visual detector (522) being mounted on the base (521);
a mirror surface (523), the mirror surface (523) being disposed opposite to the lens of the visual detector (522), the mirror surface (523) being disposed obliquely upward;
and a moving mechanism (524), the moving mechanism (524) being mounted on the conveying track (502), the moving mechanism (524) being connected to the mirror surface (523) to drive the mirror surface (523) to move toward the lens of the visual detector (522).
12. The die bonding apparatus according to claim 10, wherein the mounting head moving mechanism (73) includes:
a composite base (78);
-an x-direction motion assembly (74), the x-direction motion assembly (74) being mounted on the composite base (78);
the y-direction movement assembly (75), the y-direction movement assembly (75) is connected with the x-direction movement assembly (74), and the x-direction movement assembly (74) drives the y-direction movement assembly (75) to move along the x-direction;
a z-direction moving assembly (76), wherein a mounting head is mounted on the z-direction moving assembly (76), one part of the z-direction moving assembly (76) is mounted on the x-direction moving assembly (74), the other part of the z-direction moving assembly (76) is mounted on the y-direction moving assembly (75), the y-direction moving assembly (75) drives the mounting head to move along the y-direction, and the z-direction moving assembly (76) drives the mounting head to move along the z-direction;
The damping device (77) is mounted on the composite base (78), and the damping device (77) and the y-direction motion assembly (75) move in opposite directions.
13. The die bonding apparatus according to claim 10, wherein the mounting head (71) includes:
a second mounting mount (712), the second mounting mount (712) having a rotary drive assembly disposed thereon;
a third mounting seat (715), wherein the third mounting seat (715) is connected with the second mounting seat (712) in a sliding manner along the vertical direction;
the mounting head assembly is vertically arranged and rotatably mounted on the third mounting seat (715), and is in transmission connection with the rotary driving assembly, and the mounting head assembly can move along the axial direction and the circumferential direction of the mounting head assembly;
the second mounting installation seat (712) is installed on the first mounting installation seat (711), the relative position between the second mounting installation seat (712) and the first mounting installation seat (711) can be finely adjusted, the first mounting installation seat (711) is installed on the mounting head moving mechanism (73), and the relative position between the first mounting installation seat (711) and the mounting head moving mechanism (73) can be finely adjusted.
14. The die bonding apparatus according to claim 1, wherein the blanking device (20) comprises:
a housing;
the material box guiding mechanism (21), the material box guiding mechanism (21) is arranged in the shell, a vertical channel is arranged in the material box guiding mechanism (21), and the vertical channel is used for guiding and conveying the material box with the lead frame;
the blanking mechanism (22), blanking mechanism (22) are located in the casing, blanking mechanism (22) include magazine elevating unit (222), magazine receiving unit (224) and pushing unit (223), magazine elevating unit (222) receive the magazine in the vertical passageway, magazine receiving unit (224) with pushing unit (223) are located respectively magazine guiding mechanism (21) both sides, pushing unit (223) are used for with the received magazine is pushed into magazine receiving unit (224) the magazine is pushed in-process, magazine receiving unit (224) is right the magazine is kept supporting and is led.
15. A die bonding method, characterized in that the die bonding is performed by using the die bonding apparatus according to any one of claims 1 to 14, comprising the steps of:
s1, a feeding device (10) continuously supplies lead frames to a lead frame conveying device (50), the lead frame conveying device (50) conveys the lead frames towards a direction of a blanking device (20), and a chip supplying device (30) continuously supplies chips to a mounting device (70);
S2, dispensing the mounting position on the lead frame by using a dispensing device (01);
s3, the chip is grasped by a mounting device (70), and the chip is mounted on a mounting position of the lead frame;
s4, the blanking device (20) is used for plugging out the attached lead frame.
16. The die bonding method according to claim 15, wherein the specific process of continuously supplying chips to the mounting device (70) by the chip supply device (30) in S1 is as follows:
s11, performing a wafer expanding operation on a wafer by a chip supply device (30) to increase the interval between adjacent chips;
s12, the chip supply device (30) adjusts the position and the angle of the wafer to align the chip with the mounting position;
s13, the chip supply device (30) jacks up the chip so as to facilitate grabbing by the mounting device (70).
17. The die bonding method according to claim 15, wherein the specific process of dispensing S2 is:
s21, partitioning the lead frame, and dividing the mounting position on the lead frame into an upper area and a lower area;
s22, visually detecting the mounting position by a visual component (2), and then dispensing the mounting position on the lead frame by two dispensing components (3);
s23, two dispensing assemblies (3) are respectively a first dispensing assembly (3) and a second dispensing assembly (3), the upper area is dispensed by the first dispensing assembly (3), the lower area is dispensed by the second dispensing assembly (3), and the mounting positions of the middle row or two rows on the lead frame are jointly completed by the first dispensing assembly (3) and the second dispensing assembly (3).
18. The die bonding method according to claim 15, wherein in S3, after the die is gripped by the mounting device (70), the die angle is detected by the visual detection module (58), and if the die angle is deviated, the die angle is calibrated by the mounting device (70), and then the die is mounted on the mounting position of the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211639852.6A CN116169053A (en) | 2022-12-20 | 2022-12-20 | Die bonding equipment and die bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211639852.6A CN116169053A (en) | 2022-12-20 | 2022-12-20 | Die bonding equipment and die bonding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116169053A true CN116169053A (en) | 2023-05-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211639852.6A Pending CN116169053A (en) | 2022-12-20 | 2022-12-20 | Die bonding equipment and die bonding method |
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| Country | Link |
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| CN (1) | CN116169053A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117650083A (en) * | 2023-12-15 | 2024-03-05 | 马丁科瑞半导体(浙江)有限公司 | High-precision semiconductor chip loader |
| CN117684234A (en) * | 2023-11-21 | 2024-03-12 | 珠海全润科技有限公司 | Positioning adjusting device and positioning adjusting method for electroplating mold |
| CN117936443A (en) * | 2024-03-22 | 2024-04-26 | 深圳新控半导体技术有限公司 | Full-automatic die bonding equipment |
-
2022
- 2022-12-20 CN CN202211639852.6A patent/CN116169053A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117684234A (en) * | 2023-11-21 | 2024-03-12 | 珠海全润科技有限公司 | Positioning adjusting device and positioning adjusting method for electroplating mold |
| CN117650083A (en) * | 2023-12-15 | 2024-03-05 | 马丁科瑞半导体(浙江)有限公司 | High-precision semiconductor chip loader |
| CN117936443A (en) * | 2024-03-22 | 2024-04-26 | 深圳新控半导体技术有限公司 | Full-automatic die bonding equipment |
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