CN116160061A - Manufacturing method of diamond improved wire - Google Patents
Manufacturing method of diamond improved wire Download PDFInfo
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- CN116160061A CN116160061A CN202310172215.0A CN202310172215A CN116160061A CN 116160061 A CN116160061 A CN 116160061A CN 202310172215 A CN202310172215 A CN 202310172215A CN 116160061 A CN116160061 A CN 116160061A
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- steel wire
- diamond
- adhesive
- wire
- sand
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 61
- 239000010432 diamond Substances 0.000 title claims abstract description 61
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 66
- 239000010959 steel Substances 0.000 claims abstract description 66
- 239000004576 sand Substances 0.000 claims abstract description 43
- 239000000853 adhesive Substances 0.000 claims abstract description 31
- 230000001070 adhesive effect Effects 0.000 claims abstract description 31
- 239000010410 layer Substances 0.000 claims abstract description 26
- 239000012790 adhesive layer Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 238000007664 blowing Methods 0.000 claims abstract description 17
- 239000002245 particle Substances 0.000 claims abstract description 17
- 238000007667 floating Methods 0.000 claims abstract description 11
- 230000008719 thickening Effects 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 9
- 239000011159 matrix material Substances 0.000 claims abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 18
- 238000007747 plating Methods 0.000 claims description 17
- 239000002994 raw material Substances 0.000 claims description 13
- 238000005406 washing Methods 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 10
- 238000007596 consolidation process Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 238000011282 treatment Methods 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- 239000003513 alkali Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 3
- 239000003082 abrasive agent Substances 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 3
- WLQXLCXXAPYDIU-UHFFFAOYSA-L cobalt(2+);disulfamate Chemical compound [Co+2].NS([O-])(=O)=O.NS([O-])(=O)=O WLQXLCXXAPYDIU-UHFFFAOYSA-L 0.000 claims description 3
- 239000012153 distilled water Substances 0.000 claims description 3
- 238000011010 flushing procedure Methods 0.000 claims description 3
- 230000003116 impacting effect Effects 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 238000011068 loading method Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 3
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000007790 scraping Methods 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 abstract description 20
- 230000000694 effects Effects 0.000 abstract 1
- 230000007246 mechanism Effects 0.000 description 12
- 238000009713 electroplating Methods 0.000 description 9
- 239000000843 powder Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000004804 winding Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000001994 activation Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a manufacturing method of a diamond improved wire, which relates to the technical field of cutting wires, and comprises the following steps: selecting a steel wire, sanding, coating an adhesive, sanding, unloading sand, thickening, post-treating, sanding the smooth outer surface of the original steel wire, striking the surface into a pit shape, in the process of sanding on a cutting wire, only adhering diamond particles in the pit, increasing the adhesive surface of the diamond particles and the steel wire, improving the firmness, reducing the overall diameter of the cutting wire after sanding, reducing the size of a cutting edge, enabling the sand and a matrix to have better holding force, and enabling the cutting edge to be small and good in surface smoothness, thereby improving the cutting efficiency by 30 percent, enabling sand to float around a diamond wire bus coated with an adhesive layer by utilizing a gas blowing and floating mode to form a quicksand layer, enabling the sand to be uniformly adhered on the adhesive layer by virtue of an airflow effect, and reducing the damage to a steel wire substrate.
Description
Technical Field
The invention relates to the technical field of cutting lines, in particular to a manufacturing method of a diamond improved line.
Background
The diamond wire saw is composed of a wire bus, a plating metal and diamond. According to cutting requirements, the electroplated diamond wire saw can be manufactured into different diameters and lengths, so that cutting processes such as cutting, squaring and slicing can be performed on silicon rods, sapphires and the like, and through retrieval, a preparation method of an ultra-sharp diamond wire saw and the diamond wire saw are disclosed in patent No. CN110438550B, and the preparation method comprises the steps of diamond surface treatment, steel wire surface cleaning, steel wire surface pretreatment, bare powder attachment, bare powder consolidation, wire winding and the like. The surface treatment of the diamond comprises the substeps of high-temperature sintering, deplating reaction, purification, acid washing, electrified treatment and the like, so that the surface of the diamond becomes rough, the edge angle of the diamond is increased, and the holding force of the diamond on a steel wire is improved; and the surface of the diamond is not plated with nickel any more, but is treated into diamond bare powder by a chemical method, so that the diamond bare powder is easy to deposit on a steel wire matrix, and the bare powder is sanded. Therefore, the diamond wire saw does not have the phenomenon of diamond powder agglomeration, the wire diameter of the diamond wire is smaller, the performance is more stable, and the loss of cut raw materials can be reduced; because the diamond is not wrapped by nickel metal, the problem that the nickel metal is worn and stuck on the surface of the diamond wire during cutting is avoided, and the cutting force is more durable; the second Chinese patent No. CN105014805A discloses a device and a method for manufacturing a diamond wire saw, wherein the device comprises an electroplating mechanism, a sand feeding mechanism and a lifting mechanism, wherein the electroplating mechanism, the sand feeding mechanism and the lifting mechanism are arranged in an electroplating tank, plating solution is arranged in the electroplating tank, an anode and a cathode of the electroplating mechanism are arranged in the plating tank, the sand feeding mechanism is arranged under the electroplating mechanism, the sand feeding mechanism is connected with the lifting mechanism, and the lifting mechanism is driven by a motor; and paying-off wheels and wire winding wheels are respectively arranged on opposite side walls of the electroplating bath, and metal wires enter the electroplating bath through the paying-off wheels and leave the electroplating bath through the wire winding wheels after the processes of pre-plating, sanding and thickening of the metal wires are completed. The three processes of pre-plating, sanding and thickening of the composite plating process are completed in the same groove, and the operation can be repeated, so that equipment used by the composite plating is reduced;
the manufacturing method of the two patents and the existing diamond wires common in the market comprises the steps of uniformly plating a nickel layer on the surface of a smooth steel wire, then embedding tiny particles of diamond on the cutting steel wire by using the nickel layer as an adhesive, thickening the diameter of the cutting wire after the process, increasing the size of a cutting edge, ensuring that the contact area between the nickel layer and the diamond wire is smaller, easily causing the infirm adhesion of the diamond, easily causing the sand grains to fall off, and easily causing the defects of uneven gold sand grains, weak adhesion and bus damage in the sand feeding method.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a manufacturing method of a diamond improvement wire, which solves the problems in the background technology.
In order to achieve the above purpose, the invention is realized by the following technical scheme: a method of making a diamond wire, the steps comprising:
step one: selecting materials, namely selecting corresponding carborundum particles as carborundum raw materials according to the actually required carborundum particle size and the blade height, selecting corresponding steel wires as bus raw materials according to the actually required steel wire diameters, and cleaning the selected carborundum raw materials and the bus raw materials respectively for later use after cleaning;
step two: sanding the steel wire, namely sanding the smooth outer surface of the original steel wire, and impacting the surface into a pit shape through the impact of abrasive materials on the surface of a workpiece, so that the roughness of the surface of the steel wire is improved;
step three: coating an adhesive, namely coating an adhesive solution on a diamond wire bus through a brush roller to form an adhesive layer, scraping off the surface adhesive through a steel wire, so that the adhesive in the pit-shaped inner part of the surface of the steel wire is reserved, and forming the adhesive layer in the pit-shaped inner part of the surface of the steel wire;
step four: sand feeding, namely enabling silicon carbide particles to float around a steel wire bus coated with an adhesive layer in a gas blowing and floating mode to form a quicksand layer, uniformly adhering sand grains in the quicksand layer on the adhesive layer of pits on the surface of a steel wire substrate, and heating and solidifying the steel wire substrate and the sand grains on the surface;
step five: after the sand unloading and loading process is completed, the sand can be unloaded, the substrate is erected and slightly vibrated, and diamond particles which are firmly not adhered to the end face and are not solidified by the adhesive layer are dropped;
step six: thickening, namely adding a consolidation material on the surface of the consolidated steel wire to carry out thickening treatment, wherein the consolidation material is formed by mixing nickel sulfamate, nickel chloride and cobalt sulfamate;
step seven: and (3) post-treatment, namely soaking the electroplated diamond cutter in an acetone solution, then flushing for 5-10 min by using distilled water, taking out, drying, and carrying out moderate heat treatment to further improve the bonding strength of the nickel plating layer and the matrix and improve the hardness of the nickel plating layer.
Preferably, the first step further includes pretreatment of the steel wire, and the pretreatment includes sequential treatments of polishing, alkali washing, acid washing, activation, cleaning and drying, and impurities such as dirt and oxide film on the surface of the steel wire substrate are removed through the procedures of alkali washing, acid washing and the like, so that the binding force between the plating layer and the steel wire is improved.
Preferably, in the fourth step, the sand grains float around the steel wire substrate by using a gas blowing and floating mode, a quicksand layer is formed around the steel wire substrate, and under the blowing of the gas flow, the sand grains in the quicksand layer are contacted with the adhesive in the grooves on the surface of the steel wire substrate, and the sand grains are uniformly adhered on the adhesive layer.
Preferably, in the third step, the brush roller is immersed in the adhesive solution, the adhesive is brushed on the diamond wire bus by rotating the brush roller, the contact degree between the liquid surface of the adhesive solution and the brush roller is controlled by the adhesive solution through the liquid surface automatic control device, and the rotation direction of the brush roller is the same as or opposite to the movement direction of the diamond wire bus.
Preferably, the depth of the brush roller immersed in the binder solution is more than or equal to 2/3 of the diameter of the brush roller, and the rotation speed of the brush roller is 50-200 revolutions per minute.
Preferably, the blowing pressure of the body blowing mode in the fourth step is 100pa-200pa.
Preferably, the grain size of the carborundum sand grains in the first step is 40um-100um.
Preferably, the temperature-rising consolidation in the fourth step is carried out at a temperature of 60-80 ℃.
The invention provides a manufacturing method of a diamond modified wire. The beneficial effects are as follows:
according to the manufacturing method of the diamond modified wire, the smooth outer surface of an original steel wire is subjected to sanding treatment, the surface is impacted into a pit shape, diamond particles are only adhered in the pit in the sand feeding process of a cutting wire, the adhesive surface of the diamond particles and the steel wire is increased, the firmness is improved, the overall diameter of the cutting wire after sand feeding is reduced, the size of a cutting edge is reduced, the sand and a matrix can have better holding force, the cutting edge is small, the surface smoothness is good, the cutting efficiency is improved by 30%, sand grains float around a diamond wire bus coated with an adhesive layer to form a quicksand layer by utilizing a gas blowing floating mode, and the sand grains are uniformly adhered on the adhesive layer by the action of air flow, so that the damage to a steel wire substrate is reduced.
Drawings
FIG. 1 is a schematic flow chart of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, the embodiment of the invention provides a technical scheme: a method of making a diamond wire, the steps comprising:
step one: selecting materials, namely selecting corresponding carborundum particles as carborundum raw materials according to the actually required carborundum particle size and the blade height, selecting corresponding steel wires as bus raw materials according to the actually required steel wire diameters, and cleaning the selected carborundum raw materials and the bus raw materials respectively for later use after cleaning;
step two: sanding the steel wire, namely sanding the smooth outer surface of the original steel wire, and impacting the surface into a pit shape through the impact of abrasive materials on the surface of a workpiece, so that the roughness of the surface of the steel wire is improved;
step three: coating an adhesive, namely coating an adhesive solution on a diamond wire bus through a brush roller to form an adhesive layer, scraping off the surface adhesive through a steel wire, so that the adhesive in the pit-shaped inner part of the surface of the steel wire is reserved, and forming the adhesive layer in the pit-shaped inner part of the surface of the steel wire;
step four: the method comprises the steps of (1) feeding sand, namely floating carborundum particles around a rigid line busbar coated with an adhesive layer in a gas blowing and floating mode to form a quicksand layer, uniformly adhering sand grains in the quicksand layer to the adhesive layer of pits on the surface of a steel wire substrate, and heating and solidifying the steel wire substrate and the sand grains on the surface;
step five: after the sand unloading and loading process is completed, the sand can be unloaded, the substrate is erected and slightly vibrated, and diamond particles which are firmly not adhered to the end face and are not solidified by the adhesive layer are dropped;
step six: thickening, namely adding a consolidation material on the surface of the consolidated steel wire to carry out thickening treatment, wherein the consolidation material is formed by mixing nickel sulfamate, nickel chloride and cobalt sulfamate;
step seven: and (3) post-treatment, namely soaking the electroplated diamond cutter in an acetone solution, then flushing for 5-10 min by using distilled water, taking out, drying, and carrying out moderate heat treatment to further improve the bonding strength of the nickel plating layer and the matrix and improve the hardness of the nickel plating layer.
The first step also comprises pretreatment of the steel wire, and the pretreatment comprises the steps of polishing, alkali washing, acid washing, activating, cleaning and drying, wherein impurities such as dirt and oxide films on the surface of the steel wire matrix are removed through the steps of alkali washing, acid washing and the like, so that the binding force between the plating layer and the steel wire is improved.
And fourthly, floating sand grains around the steel wire substrate by utilizing a gas blowing and floating mode, forming a quicksand layer around the steel wire substrate, and enabling sand grains in the quicksand layer to contact with the adhesive in the grooves on the surface of the steel wire substrate under the blowing of the gas flow, wherein the sand grains are uniformly adhered on the adhesive layer.
The third coating mode is that the brush roller is immersed in the adhesive solution, the adhesive is brushed on the diamond wire bus by the rotation of the brush roller, the contact degree of the liquid level of the adhesive solution and the brush roller is controlled by the adhesive solution through the liquid level automatic control device, and the rotation direction of the brush roller is the same as or opposite to the movement direction of the diamond wire bus.
The depth of the brush roller immersed in the binder solution is more than or equal to 2/3 of the diameter of the brush roller, and the rotation speed of the brush roller is 50-200 rpm.
And in the fourth step, the blowing pressure of the body blowing mode is 100pa-200pa.
The grain size of the carborundum sand grains in the first step is 40-100 um.
And in the fourth step, the temperature rising consolidation is carried out at the temperature of 60-80 ℃.
While the fundamental and principal features of the invention and advantages of the invention have been shown and described, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (8)
1. The manufacturing method of the diamond modified wire is characterized by comprising the following steps of: the steps include the following:
step one: selecting materials, namely selecting corresponding carborundum particles as carborundum raw materials according to the actually required carborundum particle size and the blade height, selecting corresponding steel wires as bus raw materials according to the actually required steel wire diameters, and cleaning the selected carborundum raw materials and the bus raw materials respectively for later use after cleaning;
step two: sanding the steel wire, namely sanding the smooth outer surface of the original steel wire, and impacting the surface into a pit shape through the impact of abrasive materials on the surface of a workpiece, so that the roughness of the surface of the steel wire is improved;
step three: coating an adhesive, namely coating an adhesive solution on a diamond wire bus through a brush roller to form an adhesive layer, scraping off the surface adhesive through a steel wire, so that the adhesive in the pit-shaped inner part of the surface of the steel wire is reserved, and forming the adhesive layer in the pit-shaped inner part of the surface of the steel wire;
step four: sand feeding, namely enabling silicon carbide particles to float around a steel wire bus coated with an adhesive layer in a gas blowing and floating mode to form a quicksand layer, uniformly adhering sand grains in the quicksand layer on the adhesive layer of pits on the surface of a steel wire substrate, and heating and solidifying the steel wire substrate and the sand grains on the surface;
step five: after the sand unloading and loading process is completed, the sand can be unloaded, the substrate is erected and slightly vibrated, and diamond particles which are firmly not adhered to the end face and are not solidified by the adhesive layer are dropped;
step six: thickening, namely adding a consolidation material on the surface of the consolidated steel wire to carry out thickening treatment, wherein the consolidation material is formed by mixing nickel sulfamate, nickel chloride and cobalt sulfamate;
step seven: and (3) post-treatment, namely soaking the electroplated diamond cutter in an acetone solution, then flushing for 5-10 min by using distilled water, taking out, drying, and carrying out moderate heat treatment to further improve the bonding strength of the nickel plating layer and the matrix and improve the hardness of the nickel plating layer.
2. The method for manufacturing the diamond wire according to claim 1, wherein: the first step also comprises pretreatment of the steel wire, and the pretreatment comprises the steps of polishing, alkali washing, acid washing, activating, cleaning and drying, wherein impurities such as dirt and oxide films on the surface of the steel wire matrix are removed through the steps of alkali washing, acid washing and the like, so that the binding force between the plating layer and the steel wire is improved.
3. The method for manufacturing the diamond wire according to claim 1, wherein: and fourthly, floating sand grains around the steel wire substrate by utilizing a gas blowing and floating mode, forming a quicksand layer around the steel wire substrate, and enabling sand grains in the quicksand layer to contact with the adhesive in the grooves on the surface of the steel wire substrate under the blowing of the gas flow, wherein the sand grains are uniformly adhered on the adhesive layer.
4. The method for manufacturing the diamond wire according to claim 1, wherein: the third coating mode is that the brush roller is immersed in the adhesive solution, the adhesive is brushed on the diamond wire bus by the rotation of the brush roller, the contact degree of the liquid level of the adhesive solution and the brush roller is controlled by the adhesive solution through the liquid level automatic control device, and the rotation direction of the brush roller is the same as or opposite to the movement direction of the diamond wire bus.
5. The method for manufacturing the diamond wire according to claim 4, wherein: the depth of the brush roller immersed in the binder solution is more than or equal to 2/3 of the diameter of the brush roller, and the rotation speed of the brush roller is 50-200 rpm.
6. The method for manufacturing the diamond wire according to claim 1, wherein: and in the fourth step, the blowing pressure of the body blowing mode is 100pa-200pa.
7. The method for manufacturing the diamond wire according to claim 1, wherein: the grain size of the carborundum sand grains in the first step is 40-100 um.
8. The method for manufacturing the diamond wire according to claim 1, wherein: and in the fourth step, the temperature rising consolidation is carried out at the temperature of 60-80 ℃.
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| CN202310172215.0A CN116160061A (en) | 2023-02-27 | 2023-02-27 | Manufacturing method of diamond improved wire |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310172215.0A CN116160061A (en) | 2023-02-27 | 2023-02-27 | Manufacturing method of diamond improved wire |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000033535A (en) * | 1998-11-24 | 2000-06-15 | 홍영철 | Diamond electrodeposition wire for cutting brittle material and producing method thereof |
| CN102413983A (en) * | 2009-04-29 | 2012-04-11 | 贝卡尔特公司 | A sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder |
| CN102886569A (en) * | 2011-07-22 | 2013-01-23 | 浙江思博恩新材料科技有限公司 | Pre-treatment method and pre-treatment system for core wire of diamond wire saw |
| CN104018207A (en) * | 2014-05-19 | 2014-09-03 | 山东科技大学 | Preparation and superhigh-pressure processing method for cathode-electrophoresis-resin diamond scroll saw |
| CN205522038U (en) * | 2016-02-22 | 2016-08-31 | 张家港天工机械制造有限公司 | Diamond fretsaw |
| CN106273007A (en) * | 2015-05-22 | 2017-01-04 | 江苏益林金刚石工具有限公司 | A kind of preparation method of combined binder diamond fretsaw |
| CN206277527U (en) * | 2016-10-14 | 2017-06-27 | 浙江鹏展新能源科技有限公司 | Diamond electroplating cutting steel wire |
| CN206870155U (en) * | 2017-06-06 | 2018-01-12 | 杨凌美畅新材料有限公司 | A kind of carbon fiber-based composite plating diamond wire |
| CN109591210A (en) * | 2018-12-29 | 2019-04-09 | 盛利维尔（中国）新材料技术股份有限公司 | A kind of diamond fretsaw and preparation method thereof |
| CN113463154A (en) * | 2021-07-06 | 2021-10-01 | 镇江原轼新型材料有限公司 | Diamond wire sanding method and sanding device |
-
2023
- 2023-02-27 CN CN202310172215.0A patent/CN116160061A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000033535A (en) * | 1998-11-24 | 2000-06-15 | 홍영철 | Diamond electrodeposition wire for cutting brittle material and producing method thereof |
| CN102413983A (en) * | 2009-04-29 | 2012-04-11 | 贝卡尔特公司 | A sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder |
| CN102886569A (en) * | 2011-07-22 | 2013-01-23 | 浙江思博恩新材料科技有限公司 | Pre-treatment method and pre-treatment system for core wire of diamond wire saw |
| CN104018207A (en) * | 2014-05-19 | 2014-09-03 | 山东科技大学 | Preparation and superhigh-pressure processing method for cathode-electrophoresis-resin diamond scroll saw |
| CN106273007A (en) * | 2015-05-22 | 2017-01-04 | 江苏益林金刚石工具有限公司 | A kind of preparation method of combined binder diamond fretsaw |
| CN205522038U (en) * | 2016-02-22 | 2016-08-31 | 张家港天工机械制造有限公司 | Diamond fretsaw |
| CN206277527U (en) * | 2016-10-14 | 2017-06-27 | 浙江鹏展新能源科技有限公司 | Diamond electroplating cutting steel wire |
| CN206870155U (en) * | 2017-06-06 | 2018-01-12 | 杨凌美畅新材料有限公司 | A kind of carbon fiber-based composite plating diamond wire |
| CN109591210A (en) * | 2018-12-29 | 2019-04-09 | 盛利维尔（中国）新材料技术股份有限公司 | A kind of diamond fretsaw and preparation method thereof |
| CN113463154A (en) * | 2021-07-06 | 2021-10-01 | 镇江原轼新型材料有限公司 | Diamond wire sanding method and sanding device |
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