CN116137758A

CN116137758A - Temperature measuring circuit board and manufacturing method thereof

Info

Publication number: CN116137758A
Application number: CN202111372088.6A
Authority: CN
Inventors: 徐筱婷; 王艳艳; 沈芾云; 何明展
Original assignee: Avary Holding Shenzhen Co Ltd; Qing Ding Precision Electronics Huaian Co Ltd
Current assignee: Avary Holding Shenzhen Co Ltd; Qing Ding Precision Electronics Huaian Co Ltd
Priority date: 2021-11-18
Filing date: 2021-11-18
Publication date: 2023-05-19

Abstract

A temperature measuring circuit board comprises a substrate layer, a connecting circuit, a temperature measuring circuit, a conductive pad and an embedded conductor. The substrate layer comprises a first slot, a second slot, a third slot, a fourth slot and a fifth slot, wherein the first slot, the second slot and the third slot are arranged on one side of the substrate layer and are communicated with every two adjacent second slots, the first slot is also communicated with the adjacent second slots and the third slot, the fourth slot is arranged on the other side of the substrate layer, the bottom of the fourth slot is inwards concave to form the fifth slot, and the fifth slot is communicated with the second slots. The connecting circuit is arranged in the first slot, the embedded conducting bodies are arranged in the second slot and the fifth slot, the conducting pads are arranged in the third slot, the connecting circuit is electrically communicated with every two adjacent first embedded conducting bodies, the connecting circuit is electrically connected with the adjacent embedded conducting bodies and the conducting pads, and the temperature measuring circuit is arranged in the fourth slot. In addition, the application also provides a manufacturing method of the temperature measuring circuit board.

Description

Temperature measuring circuit board and manufacturing method thereof

Technical Field

The application relates to a temperature measuring circuit board and a manufacturing method thereof.

Background

In general, the temperature measuring circuit board includes a temperature measuring circuit and a conductive pad, the temperature measuring circuit is disposed on the surface of the substrate layer, the conductive pad is disposed on the surface of the temperature measuring circuit, and the number of the conductive pads corresponds to the number of the temperature measuring circuit. However, in order to increase the sensitivity of the whole temperature measuring circuit board, a plurality of temperature measuring circuits are required to be arranged, so that the number of the conductive pads is increased, which is not beneficial to the reduction of the thickness of the temperature measuring circuit board and the improvement of the flatness.

Disclosure of Invention

In order to solve the problems in the background technology, the application provides a manufacturing method of a temperature measuring circuit board.

In addition, the application also provides a temperature measuring circuit board.

A manufacturing method of a temperature measuring circuit board comprises the following steps: the substrate comprises a substrate layer, a plurality of first grooves, a plurality of second grooves and a plurality of third grooves are formed in one side of the substrate layer, the first grooves are communicated with every two adjacent second grooves, and the first grooves are also communicated with the adjacent second grooves and third grooves. The connecting circuit is arranged in the first slot, the first embedded conductor is arranged in the second slot, the conductive pad is arranged in the third slot, the connecting circuit is electrically communicated with every two adjacent first embedded conductors, and the connecting circuit is electrically connected with the adjacent first embedded conductors and the conductive pad. And a fourth slot is formed in the other side of the substrate layer, and the first embedded conducting body corresponds to at least part of the fourth slot.

A temperature measuring circuit is arranged on the inner periphery of the fourth groove; and removing a part of the substrate layer and a part of the temperature measuring circuit corresponding to the first embedded conducting body to form a fifth slot, and arranging a second embedded conducting body in the fifth slot, wherein the second embedded conducting body is electrically connected with the temperature measuring circuit and the first embedded conducting body, so as to obtain the temperature measuring circuit board.

Further, the method further comprises the steps of: the anti-welding layers are respectively arranged on two opposite sides of the base material layer, the anti-welding layers are provided with windows, the anti-welding layers cover the temperature measuring circuit, the first embedded conductor and the connecting circuit, and the conductive pads are exposed out of the windows.

Further, the method further comprises the steps of: and a protective layer is arranged on the conductive pad.

Further, the substrate further includes a first copper foil layer, the first copper foil layer is disposed on a surface of the base material layer, and the manufacturing method of the substrate includes: the first copper foil layer is provided with a first photosensitive pattern, the first photosensitive pattern is provided with a plurality of first holes, a plurality of second holes and a plurality of third holes, the first holes are communicated with every two adjacent second holes, the first holes are also communicated with the second holes and the third holes, and part of the first copper foil layer is exposed out of the bottoms of the first holes, the second holes and the third holes. Removing a part of the first copper foil layer corresponding to the first opening, the second opening and the third opening, so that a part of the substrate layer is exposed at the bottoms of the first opening, the second opening and the third opening respectively, etching a part of the substrate layer exposed at the first opening to form a first slot, etching a part of the substrate layer exposed at the second opening to form a second slot, etching a part of the substrate layer exposed at the third opening to form a third slot, and removing the first photosensitive pattern.

Further, the step of disposing solder masks on two opposite sides of the substrate layer, before the step of disposing solder masks, further includes: and removing the first copper foil layer.

Further, the substrate further includes a second copper foil layer disposed on the other surface of the base material layer, and the manufacturing method further includes: and arranging a second photosensitive pattern on the second copper foil layer, wherein the second photosensitive pattern is provided with a fourth opening. Removing a part of the second copper foil layer corresponding to the fourth opening, exposing a part of the substrate layer at the bottom of the fourth opening, and etching a part of the substrate layer exposed out of the fourth opening to form the fourth slot; and removing the second photosensitive pattern.

Further, the step of "setting a temperature measurement circuit on the inner periphery of the fourth groove" further includes: and arranging a third photosensitive pattern on the second copper foil layer, wherein the third photosensitive pattern is provided with a fifth opening, and the fifth slot is exposed out of the bottom of the fifth opening.

And arranging an electroplating body in the fifth opening, filling part of the electroplating body into the fifth opening to form the second embedded conducting body, and removing the third photosensitive pattern and the second copper foil layer.

A temperature measuring circuit board comprises a substrate layer, a connecting circuit, a temperature measuring circuit, a conductive pad, a first embedded conductor and a second embedded conductor. The substrate layer comprises a plurality of first grooves, a plurality of second grooves, a plurality of third grooves, a fourth groove and a fifth groove, wherein the first grooves, the second grooves and the third grooves are formed in one side of the substrate layer, every two adjacent second grooves are communicated, the first grooves are communicated with the adjacent second grooves and the third grooves, the fourth groove is formed in the other side of the substrate layer, the bottom of the fourth groove is concave to form the fifth groove, and the fifth groove is communicated with the second grooves. The connecting circuit is arranged in the first slot, the first embedded conducting bodies are arranged in the second slot, the conductive pads are arranged in the third slot, every two adjacent first embedded conducting bodies are electrically communicated with each other through the connecting circuit, the connecting circuit is electrically connected with the adjacent first embedded conducting bodies and the conductive pads, the temperature measuring circuit is arranged in the fourth slot, the second embedded conducting bodies are arranged in the fifth slot, and the first embedded conducting bodies are electrically connected with the second embedded conducting bodies.

Further, the temperature measuring circuit, the first embedded conducting body and the connecting circuit are covered by the solder mask, and the conducting pad is exposed out of the window.

Further, the material of the temperature measuring circuit comprises at least one of constantan, nichrome and copper-nickel alloy.

Compared with the prior art, the temperature measuring circuit that this application provided is through setting up first fluting, second fluting and third fluting in substrate layer one side to set up connecting wire, first embedded conductor and conducting pad in first fluting, second fluting and third fluting respectively, then set up the fourth fluting in substrate layer opposite side, and set up the temperature measuring wire in the fourth fluting, set up the fifth fluting on the substrate layer at last, fifth fluting intercommunication fourth fluting and second fluting, and set up the embedded conductor of second in the fifth fluting, this embedded conductor electric connection of this first embedded conductor of this second, thereby make this temperature measuring wire and connecting wire intercommunication. The connecting circuit, the temperature measuring circuit, the first embedded conducting body, the second embedded conducting body and the conducting pad are embedded into the base material layer, so that the overall thickness of the temperature measuring circuit board is reduced, and the flatness of the temperature measuring circuit board is provided.

Drawings

Fig. 1 is a schematic cross-sectional view of a double-sided copper-clad substrate according to an embodiment of the present application.

Fig. 2 is a schematic cross-sectional view of the double-sided copper-clad substrate shown in fig. 1 after a first dry film layer is provided.

Fig. 3 is a schematic cross-sectional view (schematic cross-sectional view along III-III in fig. 4) of the first dry film layer shown in fig. 1 after exposure development.

Fig. 4 is a schematic bottom view of the double-sided copper-clad substrate shown in fig. 3.

Fig. 5 is a schematic cross-sectional view of the first copper foil layer of fig. 3 after being removed.

FIG. 6 is a schematic cross-sectional view of the substrate layer shown in FIG. 5 after a first slot is formed therein.

Fig. 7 is a schematic cross-sectional view of the first slot shown in fig. 6 after the connecting wires are disposed therein.

Fig. 8 is a schematic cross-sectional view of the second copper foil layer shown in fig. 7 after a second dry film layer is disposed thereon.

FIG. 9 is a schematic cross-sectional view of the substrate layer shown in FIG. 8 after a fourth slot is formed therein.

FIG. 10 is a schematic cross-sectional view of the fourth tank shown in FIG. 9 after a temperature measurement circuit is provided inside the fourth tank.

FIG. 11 is a schematic cross-sectional view of the substrate layer shown in FIG. 10 after a fifth slot is formed therein.

Fig. 12 is a schematic cross-sectional view of the fifth slot shown in fig. 11 after the second embedded via is disposed therein.

Fig. 13 is a schematic cross-sectional view of the third dry film layer and the second adhesive layer shown in fig. 12 after being removed.

FIG. 14 is a schematic cross-sectional view of a temperature measurement circuit board according to an embodiment of the present disclosure.

Description of the main reference signs

Temperature measuring circuit board 100

Double-sided copper-clad substrate 10

Substrate layer 11

First copper foil layer 12

Second copper foil layer 13

First dry film layer 14

First adhesive layer 15

Second dry film layer 16

Second bonding layer 17

First photosensitive pattern 21

First opening 211

Second opening 212

Third opening 213

First slot 31

Second slot 32

Third slot 33

Fourth slot 34

Fifth slot 35

Connection line 41

First in-line via 42

Conductive pad 43

Temperature measuring circuit 44

Second embedded via 45

Second photosensitive pattern 51

Fourth opening 511

Third photosensitive pattern 61

Fifth opening 611

Plating body 71

First solder mask layer 81

Second solder mask layer 82

Window 821

The following detailed description will further illustrate the application in conjunction with the above-described figures.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may be present.

Referring to fig. 1 to 14, the present application provides a method for manufacturing a temperature measurement circuit board 100, which includes the steps of:

referring to fig. 1, a double-sided copper-clad substrate 10 is provided, wherein the double-sided copper-clad substrate 10 includes a base material layer 11, a first copper foil layer 12 and a second copper foil layer 13. The first copper foil layer 12 and the second copper foil layer 13 are respectively disposed on two opposite surfaces of the substrate layer 11. In other embodiments of the present application, the first copper foil layer 12 and the second copper foil layer 13 may be omitted.

In this embodiment, the material of the substrate layer 11 includes, but is not limited to, polyimide (PI), polyester resin (Polyethylene terephthalate, PET), polyethylene naphthalate (Polyethylene naphthalate two formic acid glycol ester, PEN), liquid crystal polymer (liquid crystal polymer, LCP), and modified Polyimide (modified Polyimide, MPI).

Referring to fig. 2, a first dry film layer 14 is laminated on the first copper foil layer 12, and a first bonding layer 15 is laminated on the second copper foil layer 13, wherein the first bonding layer 15 helps to protect the second copper foil layer 13 and prevent the second copper foil layer 13 from being damaged due to lamination of the first dry film layer 14.

Referring to fig. 3, the first dry film layer 14 is exposed and developed to form a first photosensitive pattern 21, and the first photosensitive pattern 21 includes a plurality of first openings 211, a plurality of second openings 212 and a plurality of third openings 213. Referring to fig. 4, the first opening 211 is connected to each two adjacent second openings 212, the first opening 211 is also connected to the adjacent second openings 212 and the third openings 213, and a portion of the first copper foil layer 12 is exposed at the bottoms of the first opening 211, the second opening 212 and the third opening 213, respectively.

Referring to fig. 5, the portions of the first copper foil layer 12 corresponding to the first opening 211, the second opening 212 and the third opening 213 are removed by etching with a liquid medicine, so that portions of the substrate layer 11 are exposed at the bottoms of the first opening 211, the second opening 212 and the third opening 213, respectively.

Referring to fig. 6, a portion of the substrate layer 11 exposed in the first opening 211 is etched by plasma to form a first trench 31, a portion of the substrate layer 11 exposed in the second opening 212 is etched to form a second trench 32, and a portion of the substrate layer 11 exposed in the third opening 213 is etched to form a third trench 33. The first slot 31 is connected to each two adjacent second slots 32, the first slot 31 is also connected to the adjacent second slots 32 and third slots 33, and none of the first slot 31, the second slot 32 and the third slot 33 penetrates through the substrate layer 11.

Referring to fig. 7, a connection circuit 41 is disposed in the first slot 31, a first embedded via 42 is disposed in the second slot 32, a conductive pad 43 is disposed in the third slot 33, the connection circuit 41 is electrically connected to each two adjacent first embedded vias 42, and the connection circuit 41 is further electrically connected to the adjacent first embedded vias 42 and the conductive pad 43.

Referring to fig. 7, the first photosensitive pattern 21 and the first attaching layer 15 are removed.

Referring to fig. 8, a second dry film layer 16 is laminated on the second copper foil layer 13, and a second bonding layer 17 is laminated on the first copper foil layer 12.

Referring to fig. 9, the second dry film layer 16 is exposed and developed to form a second photosensitive pattern 51, the second photosensitive pattern 51 has a fourth opening 511, a portion of the second copper foil layer 13 and a portion of the substrate layer 11 corresponding to the fourth opening 511 are removed to form a fourth trench 34, the fourth trench 34 does not penetrate through the substrate layer 11, and the first embedded via 42 corresponds to at least a portion of the fourth trench 34.

Referring to fig. 10, a temperature measuring circuit 44 is disposed on the inner periphery of the fourth slot 34 by sputtering, wherein the temperature measuring circuit 44 is made of one of nichrome, copper-nickel alloy or copper-nickel-manganese alloy, when one end of the temperature measuring circuit 44 contacts the low temperature area and the other end contacts the high temperature area, the temperature measuring circuit 44 can generate resistance change, a plurality of temperature measuring circuits 44 are connected by a connecting circuit 41 to generate considerable resistance change, and then the resistance change can be measured by connecting the conductive pad 43 to a current loop, so that a relationship of temperature change along with resistance change is constructed, and when the temperature is measured later, a corresponding temperature value can be obtained according to the actually measured resistance and the constructed relationship of temperature change along with resistance change. Wherein, the thickness of the temperature measuring circuit 44 is 0.1-12 micrometers.

Referring to fig. 11, a liquid medicine etching is performed to remove the second photosensitive pattern 51, and remove a portion of the temperature measuring circuit 44 and a portion of the substrate layer 11 corresponding to the first embedded via 42 to form a fifth slot 35, wherein the first embedded via 42 is exposed at the bottom of the fifth slot 35.

S12 referring to fig. 12, a third photosensitive pattern 61 is disposed on the second copper foil layer 13, the third photosensitive pattern 61 has a fifth opening 611, and the fifth opening 611 communicates with the fifth slot 35. Referring to fig. 13, an electroplating body 71 is formed in the fifth opening 611 by electroplating, and a portion of the electroplating body 71 fills the fifth slot 35 to form the second embedded via 45, and the third photosensitive pattern 61 and the second bonding layer 17 are removed, and the first copper foil layer 12 and the second copper foil layer 13 are removed. The second embedded via 45 is electrically connected to the first embedded via 42, and the plating body 71 covers a portion of the temperature measurement circuit 44, so that soldering is not required to connect the second embedded via 45 and the temperature measurement circuit 44, which is beneficial to simplifying the manufacturing process and improving the efficiency.

Referring to fig. 14, a first solder mask layer 81 is disposed on one side of the substrate layer 11, the first solder mask layer 81 is filled into the fourth groove 34 to cover the temperature measurement circuit 44, a second solder mask layer 82 is disposed on the other side of the substrate layer 11, the second solder mask layer 82 covers the connection circuit 41 and the first embedded conductive body 42, the second solder mask layer 82 is provided with a window 821, and the conductive pad 43 is exposed out of the window 821 to obtain the temperature measurement circuit board 100.

In this embodiment, the manufacturing method further includes: a protective layer 431 is disposed on the conductive pad 43, wherein the protective layer 431 is made of nickel, gold, etc., and the protective layer 431 is used for preventing the conductive pad 43 from being corroded.

Referring to fig. 14, the present application further provides a temperature measurement circuit board 100, where the temperature measurement circuit board 100 includes a substrate layer 11, a connection circuit 41, a temperature measurement circuit 44, a conductive pad 43, a first embedded via 42 and a second embedded via 45.

The substrate layer 11 includes a plurality of first grooves 31, a plurality of second grooves 32, a plurality of third grooves 33, a fourth groove 34 and a fifth groove 35, the first grooves 31, the second grooves 32 and the third grooves 33 are arranged on one side of the substrate layer 11 and are communicated with every two adjacent second grooves 32, the first grooves 31 are communicated with every two adjacent second grooves 32 and the third grooves 33, the fourth grooves 34 are arranged on the other side of the substrate layer 11, the bottoms of the fourth grooves 34 are concave to form the fifth grooves 35, and the fifth grooves 35 are communicated with the second grooves 32.

The connecting line 41 is disposed in the first slot 31, the first embedded conductive body 42 is disposed in the second slot 32, the conductive pad 43 is disposed in the third slot 33, each two adjacent first embedded conductive bodies 42 are electrically connected to the connecting line 41, the connecting line 41 is electrically connected to the adjacent first embedded conductive bodies 42 and the conductive pad 43, the temperature measuring line 44 is disposed in the fourth slot 34, the second embedded conductive bodies 45 are disposed in the fifth slot 35, and the first embedded conductive bodies 42 are electrically connected to the second embedded conductive bodies 45.

Compared with the prior art, the temperature measuring circuit board 100 provided by the application has the following advantages:

first, by disposing the first slot 31, the second slot 32 and the third slot 33 on one side of the substrate 11, disposing the connecting wire 41, the first embedded conductive body 42 and the conductive pad 43 on the first slot 31, the second slot 32 and the third slot 33 respectively, disposing the fourth slot 34 on the other side of the substrate 11, disposing the temperature measuring wire 44 in the fourth slot 34, disposing the fifth slot on the substrate 11, the fifth slot is communicated with the fourth slot 34 and the second slot 32, and disposing the second embedded conductive body 45 in the fifth slot, the second embedded conductive body 45 is electrically connected with the first embedded conductive body 42, so that the temperature measuring wire 44 is communicated with the connecting wire 41. The connection circuit 41, the temperature measurement circuit 44, the first embedded via 42, the second embedded via 45, and the conductive pad 43 are embedded in the substrate layer 11, so as to reduce the overall thickness of the temperature measurement circuit board 100 and provide the flatness of the temperature measurement circuit board 100.

And (II) by embedding the connection line 41, the first embedded conductor 42, the conductive pad 43, the second embedded conductor 45 and the temperature measurement line 44 in the substrate layer 11, the bonding adhesion force of the connection line 41, the first embedded conductor 42, the conductive pad 43, the second embedded conductor 45 and the temperature measurement line 44 to the substrate layer 11 can be improved, and the risk of detachment of the connection line 41, the first embedded conductor 42, the conductive pad 43, the second embedded conductor 45 and the temperature measurement line 44 from the substrate layer 11 due to excessive bending can be reduced.

Hereinabove, the specific embodiments of the present application are described with reference to the accompanying drawings. However, those of ordinary skill in the art will understand that various changes and substitutions can be made in the specific embodiments of the present application without departing from the spirit and scope of the present application. Such modifications and substitutions are intended to be within the scope of the present application.

Claims

1. The manufacturing method of the temperature measuring circuit board is characterized by comprising the following steps:

providing a substrate, wherein the substrate comprises a substrate layer, one side of the substrate layer is provided with a plurality of first grooves, a plurality of second grooves and a plurality of third grooves, each two adjacent second grooves are communicated with the first grooves, and the first grooves are also communicated with the adjacent second grooves and the third grooves;

a connecting circuit is arranged in the first slot, a first embedded conductor is arranged in the second slot, a conductive pad is arranged in the third slot, the connecting circuit is electrically communicated with every two adjacent first embedded conductors, and the connecting circuit is also electrically connected with the adjacent first embedded conductors and the conductive pad;

a fourth slot is formed in the other side of the substrate layer, and the first embedded conducting body corresponds to at least part of the fourth slot;

a temperature measuring circuit is arranged on the inner periphery of the fourth groove; and

removing a part of the substrate layer and a part of the temperature measuring circuit corresponding to the first embedded conductor to form a fifth slot; and

and a second embedded conducting body is arranged in the fifth slot and is electrically connected with the temperature measuring circuit and the first embedded conducting body to obtain the temperature measuring circuit board.

2. The method of manufacturing of claim 1, further comprising the step of:

the anti-welding layers are respectively arranged on two opposite sides of the base material layer, the anti-welding layers are provided with windows, the anti-welding layers cover the temperature measuring circuit, the first embedded conductor and the connecting circuit, and the conductive pads are exposed out of the windows.

3. The method of manufacturing of claim 2, further comprising the step of:

and a protective layer is arranged on the conductive pad.

4. The method of manufacturing of claim 2, wherein the substrate further comprises a first copper foil layer disposed on a surface of the base material layer, the method of manufacturing the substrate comprising:

a first photosensitive pattern is arranged on the first copper foil layer, the first photosensitive pattern is provided with a plurality of first holes, a plurality of second holes and a plurality of third holes, the first holes are communicated with every two adjacent second holes, the first holes are also communicated with the adjacent second holes and third holes, and part of the first copper foil layer is exposed out of the bottoms of the first holes, the second holes and the third holes;

removing part of the first copper foil layer corresponding to the first opening, the second opening and the third opening, so that part of the substrate layer is exposed at the bottoms of the first opening, the second opening and the third opening respectively; and

etching a part of the substrate layer exposed out of the first opening to form the first slot, etching a part of the substrate layer exposed out of the second opening to form the second slot, and etching a part of the substrate layer exposed out of the third opening to form the third slot; and

and removing the first photosensitive pattern.

5. The method of manufacturing according to claim 4, wherein the step of disposing solder masks on opposite sides of the substrate layer, respectively, further comprises: and removing the first copper foil layer.

6. The method of manufacturing of claim 1, wherein the substrate further comprises a second copper foil layer disposed on the other surface of the substrate layer, the method further comprising:

setting a second photosensitive pattern on the second copper foil layer, wherein the second photosensitive pattern is provided with a fourth opening;

removing a part of the second copper foil layer corresponding to the fourth opening, so that a part of the substrate layer is exposed at the bottom of the fourth opening; and

etching a part of the substrate layer exposed out of the fourth opening to form the fourth slot; and

and removing the second photosensitive pattern.

7. The method of manufacturing according to claim 6, wherein the step of disposing a temperature measuring line on an inner periphery of the fourth groove further comprises:

a third photosensitive pattern is arranged on the second copper foil layer, the third photosensitive pattern is provided with a fifth open hole, and the fifth open slot is exposed out of the bottom of the fifth open hole;

arranging an electroplating body in the fifth open hole, and filling part of the electroplating body into the fifth open hole to form the second embedded through body; and

and removing the third photosensitive pattern and the second copper foil layer.

8. A temperature measuring circuit board is characterized by comprising a substrate layer, a connecting circuit, a temperature measuring circuit, a conductive pad, a first embedded conductor and a second embedded conductor,

the substrate layer comprises a plurality of first grooves, a plurality of second grooves, a plurality of third grooves, a fourth groove and a fifth groove, wherein the first grooves, the second grooves and the third grooves are arranged on one side of the substrate layer and are communicated with each two adjacent second grooves, the first grooves are also communicated with the adjacent second grooves and the third grooves, the fourth groove is arranged on the other side of the substrate layer, the bottom of the fourth groove is inwards concave to form the fifth groove, the fifth groove is communicated with the second grooves,

the connecting circuit is arranged in the first slot, the first embedded conducting bodies are arranged in the second slot, the conductive pads are arranged in the third slot, every two adjacent first embedded conducting bodies are electrically communicated with each other through the connecting circuit, the connecting circuit is electrically connected with the adjacent first embedded conducting bodies and the conductive pads, the temperature measuring circuit is arranged in the fourth slot, the second embedded conducting bodies are arranged in the fifth slot, and the first embedded conducting bodies are electrically connected with the second embedded conducting bodies.

9. The temperature measurement circuit board of claim 8, further comprising a solder mask layer, the solder mask layer being provided with a fenestration, the solder mask layer covering the temperature measurement circuit, the first embedded vias and the connection circuit, the conductive pads being exposed at the fenestration.

10. The circuit board of claim 8, wherein the temperature measurement circuit comprises one of nichrome, cupronickel.