CN116133314A - Wire-electricity combined backboard system - Google Patents
Wire-electricity combined backboard system Download PDFInfo
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- CN116133314A CN116133314A CN202211090388.XA CN202211090388A CN116133314A CN 116133314 A CN116133314 A CN 116133314A CN 202211090388 A CN202211090388 A CN 202211090388A CN 116133314 A CN116133314 A CN 116133314A
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- 238000010586 diagram Methods 0.000 description 11
- 238000013461 design Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000004891 communication Methods 0.000 description 5
- 230000008054 signal transmission Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 3
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/18—Construction of rack or frame
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Abstract
The invention relates to a wire-electricity combined backboard system, which comprises the following components: a frame on which a cable assembly is mounted, the cable assembly including a high-speed connector for transmitting high-speed signals; the electric backboard component comprises an electric backboard, the electric backboard is installed on the frame, a medium-low speed signal connector and a power connector are installed on the electric backboard, the medium-low speed signal connector is used for transmitting medium-low speed signals, and the power connector is used for transmitting power. Because the cable assembly is arranged on the frame, the high-speed connector in the cable assembly can transmit high-speed signals, the problem that the transmission performance and the link length of a single electric backboard are limited is solved, the electric backboard assembly is arranged on the frame, the medium-low speed signal connector and the power connector on the electric backboard can respectively transmit medium-low speed signals and power, the cable assembly is not required to transmit the medium-low speed signals and the power, and the connection routing algorithm and the wiring complexity of the wire backboard can be reduced.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a wire-electricity combined backboard system.
Background
At present, the cross capacity of communication system equipment is increased, the transmission rate is improved, the length of a transmission link is correspondingly increased, and high requirements are put on the design of a backboard.
In the related art, the materials and the processing technology of the common printed backboard (PCB) sometimes cannot meet the design requirement of the backboard, the cable is applied due to lower loss, the cable backboard has complex connection relation, the wiring design and the processing requirement are higher, and the higher design and processing requirements are also provided for the connector and the structural frame.
Accordingly, there is a need to design a new wire-bonded backplane system to overcome the above-described problems.
Disclosure of Invention
The embodiment of the invention provides a wire-electricity combined backboard system, which aims to solve the technical problems that a single PCB electric backboard in the related art is limited in high-speed signal transmission performance and link length, a wire backboard connection routing algorithm and wiring are complex, and the like.
In a first aspect, a wire-bonded backplane system is provided, comprising: a frame on which a cable assembly is mounted, the cable assembly including a high-speed connector for transmitting high-speed signals; the electric backboard component comprises an electric backboard, the electric backboard is installed on the frame, a medium-low speed signal connector and a power connector are installed on the electric backboard, the medium-low speed signal connector is used for transmitting medium-low speed signals, and the power connector is used for transmitting power.
In some embodiments, the frame is provided with a plurality of through holes in which the high speed connectors are mounted; the frame is provided with a groove, and the electric backboard is arranged in the groove.
In some embodiments, the frame is provided with a riveting hole, the electric backboard is fixedly provided with a pressing riveting shaft, and the pressing riveting shaft is pressed and riveted to the riveting hole; the installation depth of the electric backboard on the frame is adjusted through the depth of the riveting hole and the height of the riveting shaft.
In some embodiments, the frame has a first service bay, a switch bay, and a second service bay, the first service bay and the second service bay being located on opposite sides of the switch bay, respectively; the high-speed connectors are arranged in the first service panel, the exchange panel and the second service panel, the high-speed connectors are connected with cables, and the high-speed connectors in the first service panel are communicated with the high-speed connectors in the second service panel through the high-speed connectors in the exchange panel and the cables.
In some embodiments, the first service disk area and the second service disk area are both provided with the medium-low speed signal connector and the power connector; and a main control panel is arranged between the first service panel and the second service panel, and the main control panel is also provided with the medium-low speed signal connector and the power connector.
In some embodiments, the cables and the electrical back plate assembly are distributed on opposite sides of the frame.
In some embodiments, the high-speed connectors in the first service bay, the switching bay and the second service bay are all arranged according to an array, and the high-speed connectors in the switching bay are arranged vertically to the high-speed connectors in the first service bay, and the high-speed connectors in the switching bay are arranged vertically to the high-speed connectors in the second service bay; and the differential logarithm of all high-speed connectors in the switch fabric is equal to the sum of the differential logarithms of all high-speed connectors in the first service fabric and the second service fabric.
In some embodiments, each column of the first service disk area includes at least four high-speed connectors, which are respectively arranged in order into a first upper high-speed connector, a second upper high-speed connector, a third upper high-speed connector and a fourth upper high-speed connector; each column of the second service disk area at least comprises four high-speed connectors, and the four high-speed connectors are respectively arranged into a first lower high-speed connector, a second lower high-speed connector, a third lower high-speed connector and a fourth lower high-speed connector in sequence; each column of the exchange disk area at least comprises four high-speed connectors which are respectively arranged into a first exchange connector, a second exchange connector, a third exchange connector and a fourth exchange connector in sequence; the first upper high-speed connector, the third upper high-speed connector, the first lower high-speed connector, and the third lower high-speed connector are all docked to the first switch connector and the second switch connector; the second upper high-speed connector, the fourth upper high-speed connector, the second lower high-speed connector, and the fourth lower high-speed connector are all docked to the third switch connector and the fourth switch connector.
In some embodiments, the electrical back plate comprises at least two separate pieces, and the at least two separate pieces are detachably connected.
In some embodiments, the frame comprises at least two frames that are assembled together.
The technical scheme provided by the invention has the beneficial effects that:
the embodiment of the invention provides a cable combined backboard system, because a cable component is arranged on a frame, a high-speed connector in the cable component can transmit high-speed signals, the problem that the transmission performance and the link length of a single electric backboard are limited is solved, the frame is provided with the electric backboard component, a medium-low speed signal connector and a power connector on the electric backboard can respectively transmit medium-low speed signals and power, the cable component is not required to transmit the medium-low speed signals and the power, the complexity of a routing algorithm and wiring of the connection of the cable backboard can be reduced, the integrated installation of the cable backboard and the electric backboard is realized, and a backboard interconnection technical solution is provided for high-speed, high-density and high-capacity communication system equipment.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a wire-electrical composite backboard system according to an embodiment of the invention;
fig. 2 is a schematic perspective view of another view angle of a wire-electrical combined back plate system according to an embodiment of the present invention;
FIG. 3 is a schematic side view of a wire-bonded back-plane system according to an embodiment of the present invention;
fig. 4 is a schematic perspective view of a frame according to an embodiment of the present invention;
FIG. 5 is a schematic side view of a frame according to an embodiment of the present invention;
fig. 6 is a schematic perspective view of an electrical back plate assembly according to an embodiment of the present invention;
FIG. 7 is a schematic side view of an electrical back plate assembly according to an embodiment of the present invention;
fig. 8 is a schematic perspective view of a cable assembly according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of a high-speed connector of a service disk area according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a high-speed connector of a switch disk provided in an embodiment of the present invention;
fig. 11 is a schematic perspective view of a riveting shaft according to an embodiment of the present invention;
FIG. 12 is a schematic perspective view of another frame according to an embodiment of the present invention;
FIG. 13 is a schematic perspective view of another electrical back plate assembly according to an embodiment of the present invention;
fig. 14 is a schematic structural diagram of another wire-assembled back plate system according to an embodiment of the present invention;
fig. 15 is a schematic structural diagram of yet another wire-assembled back plate system according to an embodiment of the present invention;
FIG. 16 is a schematic perspective view of a frame according to another embodiment of the present invention;
FIG. 17 is a schematic perspective view of another electrical back plate assembly according to an embodiment of the present invention;
FIG. 18 is a schematic perspective view of a frame according to an embodiment of the present invention;
FIG. 19 is a schematic perspective view of an electrical back plate assembly according to an embodiment of the present invention;
fig. 20 is a schematic structural diagram of yet another wire-assembled back plate system according to an embodiment of the present invention;
FIG. 21 is a schematic view of a functional front partition of a frame according to an embodiment of the present invention;
fig. 22 is a schematic diagram of a front connector layout of a wire-bonded backplane system according to an embodiment of the present disclosure;
fig. 23 is a schematic layout diagram of a high-speed connector in a column of a first service disk area according to an embodiment of the present invention;
FIG. 24 is a schematic diagram illustrating a layout of a high-speed connector in a column of switch fabric according to an embodiment of the present invention;
fig. 25 is a schematic layout diagram of a high-speed connector in a row of a second service disk area according to an embodiment of the present invention;
FIG. 26 is a schematic view of a functional front partition of another frame provided in an embodiment of the present invention;
fig. 27 is a schematic diagram of a front connector layout of another wire-electrical-composite-backplane system according to an embodiment of the present disclosure.
In the figure: 1. a frame; 11. a first service bay; 12. exchanging the disk area; 13. a second service disk area; 14. a groove; 15. a main control disk area; 2. a cable assembly; 21. a high-speed connector; 22. a cable; 3. an electrical backplate assembly; 31. an electrical back plate; 311. pressing and riveting the shaft; 312. a power supply connection terminal; 32. a medium-low speed signal connector; 33. a power connector.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The embodiment of the invention provides a wire-electricity combined backboard system which can solve the technical problems that a single PCB electric backboard in the related art is limited in high-speed signal transmission performance and link length, a wire backboard connection routing algorithm and wiring are complex, and the like.
Referring to fig. 1 to 3, a back plane system for wire bonding according to an embodiment of the present invention may include: a frame 1, on which a cable assembly 2 is mounted, the cable assembly 2 includes a high-speed connector 21 for transmitting high-speed signals, the high-speed connector 21 may be connected with a cable 22, wherein the high-speed connector 21 may be mounted on a certain side of the frame 1 or may penetrate through the frame 1; and an electrical back plate assembly 3, which may include an electrical back plate 31, the electrical back plate 31 being mounted to the frame 1, wherein the electrical back plate 31 may be mounted to the frame 1 by fixing bolts, or may be fixed to the frame 1 by other means; the electric backboard 31 is provided with a medium-low speed signal connector 32 and a power connector 33, wherein the medium-low speed signal connector 32 is used for transmitting medium-low speed signals, the power connector 33 is used for transmitting power, and the electric backboard 31 can be a printed PCB; the high-speed signal, the medium-low-speed signal and the power supply in the wire-electricity combined backboard system can be connected and transmitted through the cable assembly 2 and the electric backboard assembly 3 respectively.
In this embodiment, since the cable assembly 2 is installed on the frame 1, the high-speed connector 21 in the cable assembly 2 can transmit high-speed signals, so as to solve the problem that the high-speed signal transmission performance and the link length of a single electric backboard 31 are limited, and the electric backboard assembly 3 is installed on the frame 1, the medium-low speed signal connector 32 and the power connector 33 on the electric backboard 31 can respectively transmit medium-low speed signals and power, the cable assembly 2 is not required to transmit medium-low speed signals and power, the number of the connectors in the cable assembly 2 and the cables 22 can be reduced, and further the complexity of the connection routing algorithm and the wiring of the cable backboard is reduced, so that the integrated installation of the cable backboard and the electric backboard 31 is realized, and a backboard interconnection technical solution is provided for high-speed, high-density and high-capacity communication system equipment.
Further, the frame 1 may have a front side and a back side, the cable assembly 2 may be mounted to the back side of the frame 1, and the electrical back plate assembly 3 is preferably mounted to the front side of the frame 1, such that the layout of the cable assembly 2 does not affect the electrical back plate assembly 3.
Referring to fig. 4 and 5, in some embodiments, the frame 1 may be provided with a plurality of through holes, the high-speed connector 21 is installed in the through holes, the through holes penetrate front and back of the frame 1, so that after the high-speed connector 21 is inserted into the through holes, the front end of the high-speed connector 21 may be used for inserting a tray, the rear end of the high-speed connector 21 may be connected with the cable 22, and the structure of the through holes is adapted to the structure of the high-speed connector 21; the frame 1 may be provided with a groove 14, and the electric backboard 31 is installed in the groove 14, so that the position of the electric backboard 31 in the front-back, up-down or left-right direction can be limited by the groove 14, and the front surface of the electric backboard 31 can be kept substantially flush with the front surface of the frame 1 after the electric backboard 31 is installed on the frame 1, or the depth of the groove 14 and the thickness of the electric backboard 31 can be set as required to adjust the positional relationship between the high-speed connector 21 installed on the frame 1 and the connector installed on the electric backboard 31 in the depth direction.
The groove 14 is preferably provided on the front surface of the frame 1, however, in other embodiments, the groove 14 may be provided on the back surface of the frame 1, and then a corresponding groove may be formed in the frame 1 to allow the connector on the back plate 31 to pass through. In other embodiments, the electrical back plate 31 may be directly mounted on the surface of the frame 1 without providing a groove in the frame 1, as required.
Referring to fig. 6 and 7, in some alternative embodiments, a rivet hole may be formed in the frame 1, and a press-riveting shaft 311 may be correspondingly fixed on the electric back plate 31, where the press-riveting shaft 311 may be press-riveted in the rivet hole when the electric back plate 31 is mounted on the frame 1; the mounting depth of the electric backboard 31 on the frame 1 can be adjusted by the depth of the rivet hole and the height of the rivet shaft 311. That is, when the clinching shaft 311 is clinched in the frame 1, the height of the clinching shaft 311 may be designed and calculated in advance with the front surface of the frame 1 as a reference, so that the depth direction mounting dimension H of the electrical back plate assembly 3 in the frame 1 is not affected by the thickness tolerance of the electrical back plate 31. Meanwhile, the installation position of the electric backboard 31 in the depth direction of the frame 1 can be adjusted through the depth of the riveting hole on the frame 1 and the height dimension of the riveting shaft 311, so that the position relation between the connector on the electric backboard 31 and the connector on the frame 1 in the depth direction is ensured.
As shown in fig. 11, preferably, threads may be provided on both the clinch shaft 311 and the clinch hole to provide clinch connection strength. The electrical back plate 31 may also be provided with power connection terminals 312.
Referring to fig. 1, 4 and 8, in some embodiments, the frame 1 has a first service bay 11, a switch bay 12 and a second service bay 13, where the first service bay 11 and the second service bay 13 are located on opposite sides of the switch bay 12, respectively, and in this embodiment, the first service bay 11, the switch bay 12 and the second service bay 13 are illustrated as being arranged in a vertical direction, and the first service bay is located in an upper area, the switch bay 12 is located in a middle area, and the second service bay 13 is located in a lower area; the first service bay 11, the exchange bay 12 and the second service bay 13 are all provided with the high-speed connectors 21, each high-speed connector 21 is connected with a cable 22, and the high-speed connectors 21 in the first service bay 11 are communicated with the high-speed connectors 21 in the second service bay 13 through the high-speed connectors 21 in the exchange bay 12 and the cables 22. That is, the high-speed connector 21 in the switching tray 12 can play a role of switching, the high-speed connector 21 in the first service tray 11 is electrically connected with the high-speed connector 21 in the second service tray 13, the first service tray 11 and the second service tray 13 are used for plugging service trays, and the switching tray 12 is used for plugging the switching trays, so as to realize high-speed signal cross interconnection transmission between the switching trays and the service trays.
Referring to fig. 1, in some alternative embodiments, the first service bay 11 and the second service bay 13 are further provided with the medium-low speed signal connector 32 and the power connector 33; and a main control panel 15 is further disposed between the first service panel 11 and the second service panel 13, and the main control panel 15 is also provided with the medium-low speed signal connector 32 and the power connector 33, so as to realize medium-low speed signal transmission and power transmission. The main control panel 15 may be disposed between the exchange panel 12 and the first service panel 11, and between the exchange panel 12 and the second service panel 13; alternatively, two switch bays 12 may be disposed in the middle of the frame 1, and the master bay 15 may be disposed between the two switch bays 12 (see fig. 14 to 17), or in other positions. Preferably, as shown in fig. 1, the cables 22 and the electrical back plate assembly 3 are distributed on opposite sides of the frame 1. One of which is provided on the front side of the frame 1 and the other of which is provided on the back side of the frame 1.
Further, referring to fig. 22 to 25, the high-speed connectors 21 in the first service area 11, the switch area 12 and the second service area 13 are all arranged according to an array, and the high-speed connectors 21 in the switch area 12 are arranged perpendicular to the high-speed connectors 21 in the first service area 11, the high-speed connectors 21 in the switch area 12 are arranged perpendicular to the high-speed connectors 21 in the second service area 13, in this embodiment, the high-speed connectors 21 in the first service area 11 and the second service area 13 are arranged vertically, the high-speed connectors 21 in the switch area 12 are arranged horizontally, so that the high-speed connectors 21 in the first service area 11 are perpendicular to the high-speed connectors 21 in the switch area 12, that is, the first service area 11 and the second service area 13 are both vertical plug-in service areas for connection with a plurality of vertical plug-in service boards, and the switch area 12 is a horizontal plug-in switch area 12 for connection with a plurality of horizontal plug-in switches; and the differential pair number of all the high-speed connectors 21 in the switch board 12 is equal to the sum of the differential pair numbers of all the high-speed connectors 21 in the first service board 11 and the second service board 13, so as to ensure that the differential pair numbers of the high-speed connectors 21 in the first service board 11 and the second service board 13 can be correspondingly connected with the differential pair numbers of the high-speed connectors 21 in the switch board 12. And the connectors in the main control disc area 15 can also be horizontally inserted and used for being connected with a plurality of horizontally inserted main control discs, and each functional area consists of a wire and an electric backboard 31 to form an integrated backboard.
As shown in fig. 1 and 2, the cables 22 in the cable assembly 2 may preferably be designed to meet the high-speed signal transmission between service trays and switch trays, as well as process routing requirements, by special wire routing relationships. After the array, the high-speed connectors 21 in the first service disk area 11, the second service disk area 13 and the switch disk area 12 may be arranged in a plurality of rows and a plurality of columns, where each column of the first service disk area 11 includes at least four high-speed connectors 21, and the first high-speed connector 21, the second high-speed connector 21, the third high-speed connector 21 and the fourth high-speed connector 21 are respectively arranged in order from top to bottom; each column of the second service disk area 13 includes at least four high-speed connectors 21, which are sequentially arranged from top to bottom into a first lower high-speed connector 21, a second lower high-speed connector 21, a third lower high-speed connector 21, and a fourth lower high-speed connector 21; each column of the switch board 12 also includes at least four high-speed connectors 21, which are arranged in order from top to bottom as a first switch connector, a second switch connector, a third switch connector, and a fourth switch connector, respectively; the first upper high-speed connector 21, the third upper high-speed connector 21, the first lower high-speed connector 21 and the third lower high-speed connector 21 are all docked to the first and second switch connectors; the second upper high-speed connector 21, the fourth upper high-speed connector 21, the second lower high-speed connector 21 and the fourth lower high-speed connector 21 are all docked to the third and fourth switch connectors. I.e. each high-speed connector 21 of the first service bay 11 and each high-speed connector 21 of the second service bay 13 are connected to corresponding high-speed connectors 21 in the switching bay 12, and cross-connect is used to avoid intertwining between the cables 22.
The connector selection, cable 22 interconnection routing algorithm design and specific embodiments of each column of cable assemblies 2 are described as follows (see fig. 21-27, where fig. 26-27 are another configuration of a wire-bonded backplane system):
(1) The number of switch boards, service boards, and the model number (differential logarithm) of the high-speed connector 21 are first determined according to the requirements of the device cross capacity, the structure, and the like. The front main control disc of the frame 1 is distributed up and down, n vertical plug-in service discs (n columns) are arranged in the left-right direction of the upper/lower service disc areas (namely the first service disc area 11 and the second service disc area 13), and m horizontal plug-in exchange discs (m rows) are arranged in the up-down direction of the middle exchange disc area 12.
(2) The high-speed connector 21 is laid out as follows: the number of high-speed connectors 21 arranged in the width direction of the frame 1 of the transverse plug tray is the same as that of the upper/lower vertical plug service trays, namely, n high-speed connectors 21 (n columns) are arranged in the horizontal direction of each transverse plug tray, thus the whole integrated backboard is divided into n columns along the width direction, as shown in fig. 22 or fig. 27, u p×q (differential pair number, q is even number) type high-speed cable connectors, m p×r (differential pair number) type high-speed cable connectors and u p×q (differential pair) type high-speed cable connectors are respectively arranged in three functional areas from top to bottom in each column, and 2×n×u×p×q=n×p×r (preferably m=u, then r=2q, namely, the service tray high-speed connectors 21 are p×q type, and the switch tray high-speed connectors 21 are p×2q type, as shown in fig. 9 and fig. 10); the service bay high-speed connector 21 and the switch bay 12/control bay high-speed connector 21 are disposed perpendicular to each other. Of course, in other embodiments, other types of high-speed connectors 21 may be selected.
(3) As shown in fig. 21 to 22, taking m=u, selecting p×q type for the service tray high-speed connector 21, selecting p×2q type for the switch tray high-speed connector 21, taking a vertical column of high-speed connector 21 layout, forming a Wafer (i.e. terminal plate) row by p differential pairs of any high-speed connector 21 in the column of service tray region (i.e. each Wafer row contains p differential signal pairs), and q Wafer rows by each high-speed connector 21 in the service tray region; one column of p differential pairs of any high-speed connector 21 on the switch board forms a Wafer column (i.e., each Wafer column contains p differential signal pairs), and each high-speed connector 21 on the switch board contains 2q Wafer columns.
(4) As shown in fig. 22, the service tray is vertically inserted, the connectors Wafer are horizontally arranged, the switching tray is horizontally inserted, and the connectors Wafer are vertically arranged. As shown in fig. 23 to 25, taking a column as an example, m p×q connectors on the upper vertical plug-in service tray are numbered 1, 2, …, m up and down, m p×q connectors on the lower vertical plug-in service tray are numbered 1, 2, …, m up and down, each connector contains q transverse Wafer, q transverse Wafer of each of the upper and lower 1 to m connectors is numbered up and down 11, 12, …, 1q up, 21 up, 22, …, 2q up, …, m1 up, m2, …, mq up, m p×2q connectors of each of the m horizontal plug-in switching trays in a column are numbered up and down, m is switched 2, …, m is switched from left to right, each of the number bit connectors contains 2q column vertical Wafer, and each number bit connector is numbered 2q column vertical Wafer 1, 2, q, q+1, q, …, q.
(5) Dividing any high-speed connector 21 of each service disk into two Wafer groups according to rows, namely, the groups i and ii are respectively marked from top to bottom, and q/2 rows (q is generally even), namely, the first q/2 rows (upper 11, upper 12, … and upper 1) q/2 ) For group i, the last q/2 rows (upper 1 q/2+1 、1 q/2+2 …, upper 1 q) is set ii, upper service bay connector to upper and lower Wafer sets are respectively denoted upper 1 ⅰ 1 on ⅱ Upper 2 ⅰ Upper 2 ⅱ The lower service area connector to the upper and lower Wafer groups are respectively denoted as lower 1, … ⅰ Lower 1 ⅱ Lower 2 ⅰ Lower 2 ⅱ …; each of the high-speed connectors 21 of each switch tray is divided into four Wafer groups, i, ii, iii, iv from left to right, q/2 columns of each group, the switch tray area 12 being up and the first connector Wafer group from left to right being 1 Ⅰ 、1 Ⅱ 、1 Ⅲ 、1 Ⅳ The second connector Wafer group is recorded as 2 from left to right Ⅰ 、2 Ⅱ 、2 Ⅲ 、2 Ⅳ ，…。
(6) The two rows of Wafer groups of each service tray high-speed connector 21 are respectively mated with a column of Wafer groups of different two switch tray connectors in sequence. For ease of description, p=6, q=6, m=u=8 are taken as examples, q/2=3, u/2=4, 11 to 13 rows above the service area (i.e. 1 above) ⅰ Group), upper 14 to upper 16 rows (i.e. upper 1 ⅱ Groups) corresponding to 6-4 columns (i.e. 2) of switch 2, respectively Ⅱ Group), 6-4 columns of switch 1 (i.e. 1 Ⅱ Group), 51-53 rows above the service area (i.e. 5 above ⅰ Group) and upper 54-upper 56 rows (i.e. upper 5) ⅱ Groups) respectively correspond to 3-1 columns of switch 2 (i.e. 2 Ⅰ Group), 3-1 columns of switch 1 (i.e. 1 Ⅰ Group), 11-13 rows below the service area (i.e. lower 1 ⅰ Group), lower 14-lower 16 rows (i.e. lower 1 ⅱ Groups) respectively correspond to 12 to 10 columns of switch 2 (i.e., lower 2 Ⅳ Group), 12-10 columns of exchange 1 (i.e. lower 1 Ⅳ Group), under the service area, 51-53 rows (i.e. under 5) ⅰ Group) and lower 54-lower 56 rows (i.e. lower 5 ⅱ Groups) corresponding to 9-7 columns of switch 2 (i.e. 2 Ⅲ Group), 9-7 columns of switch 1 (i.e. 1 Ⅲ A group); likewise, the upper 21 to upper 23 rows and upper 24 to upper 26 rows correspond to the 6 to 4 columns of the switch 4 and the switch 3, respectively, the upper 61 to upper 63 rows and upper 64 to upper 66 rows correspond to the 3 to 1 columns of the switch 4 and the switch 3, respectively, the lower 21 to lower 23 rows and lower 24 to lower 26 rows correspond to the 12 to 10 columns of the switch 4 and the switch 3, respectively, the upper 61 to upper 63 rows and upper 64 to upper 66 rows correspond to the 9 to 7 columns of the switch 4 and the switch 3, …, respectively, and according to this rule, the upper 1/lower 1 and upper 5/lower 5 high speed connectors 21 correspond to the switch 2 and the switch 1 connectors, the upper 2/lower 2 and upper 6/lower 6 connectors correspond to the switch 4 and the switch 3 connectors, the upper 3/lower 3 and upper 7/lower 7 connectors correspond to the switch 6 and the switch 5 connectors, and the upper 4/lower 4 and upper 8/lower 8 connectors correspond to the switch 8 and the switch 7 connectors.
Further, referring to fig. 13, 15 and 19, the electrical back plate 31 may include at least two separate pieces, and the at least two separate pieces may be detachably connected to each other. That is, the electrical back plate 31 may be divided into a plurality of split forms according to the functional requirements, and the respective split designs are interconnected with the respective medium-low speed signal connector 32 and power connector 33. So configured, the electrical backplate 31 can be sized as desired.
In some embodiments, referring to fig. 12, 18, 20, the frame 1 may include at least two frames assembled together. The number of the frames can be two, three or more.
The wire-electricity combined backboard system provided by the embodiment of the invention can solve the problem of the wire backboard interconnection routing relation through the model and the number selection algorithm of the high-speed connector 21, can be designed in a series manner, and can meet the application requirements of different machine disc configurations and different capacities.
In the description of the present invention, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present invention. Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
It should be noted that in the present invention, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is only a specific embodiment of the invention to enable those skilled in the art to understand or practice the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A wire-bonded backplane system, comprising:
a frame (1), on which frame (1) a cable assembly (2) is mounted, the cable assembly (2) comprising a high-speed connector (21) for transmitting high-speed signals;
an electrical back plate assembly (3) comprising an electrical back plate (31), the electrical back plate (31) is mounted on the frame (1), and a medium-low speed signal connector (32) and a power connector (33) are mounted on the electrical back plate (31), the medium-low speed signal connector (32) is used for transmitting medium-low speed signals, and the power connector (33) is used for transmitting power.
2. The wire-bonded backplane system of claim 1, wherein:
the frame (1) is provided with a plurality of through holes, and the high-speed connector (21) is installed in the through holes;
the frame (1) is provided with a groove (14), and the electric backboard (31) is arranged in the groove (14).
3. The wire-bonded backplane system of claim 2, wherein:
a riveting hole is formed in the frame (1), a pressing riveting shaft (311) is fixedly arranged on the electric backboard (31), and the pressing riveting shaft (311) is pressed and riveted to the riveting hole;
the installation depth of the electric backboard (31) on the frame (1) is adjusted through the depth of the riveting hole and the height of the riveting shaft (311).
4. The wire-bonded backplane system of claim 1, wherein:
the frame (1) is provided with a first service area (11), a switching area (12) and a second service area (13), wherein the first service area (11) and the second service area (13) are respectively positioned on two opposite sides of the switching area (12);
the high-speed connector (21) is installed in the first service area (11), the exchange area (12) and the second service area (13), the high-speed connector (21) is connected with a cable (22), and the high-speed connector (21) in the first service area (11) is communicated with the high-speed connector (21) in the second service area (13) through the high-speed connector (21) in the exchange area (12) and the cable (22).
5. The wire-bonded backplane system of claim 4, wherein:
the first service disc area (11) and the second service disc area (13) are internally provided with the medium-low speed signal connector (32) and the power connector (33);
a main control disc area (15) is further arranged between the first service disc area (11) and the second service disc area (13), and the main control disc area (15) is also provided with the medium-low speed signal connector (32) and the power connector (33).
6. The wire-bonded backplane system of claim 4, wherein: the cables (22) and the electric backboard components (3) are distributed on two opposite sides of the frame (1).
7. The wire-bonded backplane system of claim 4, wherein:
the high-speed connectors (21) in the first service area (11), the exchange area (12) and the second service area (13) are all arranged according to an array, the high-speed connectors (21) in the exchange area (12) are vertically arranged with the high-speed connectors (21) in the first service area (11), and the high-speed connectors (21) in the exchange area (12) are vertically arranged with the high-speed connectors (21) in the second service area (13);
and the differential logarithm of all high-speed connectors (21) within the switching fabric (12) is equal to the sum of the differential logarithms of all high-speed connectors (21) within the first service fabric (11) and the second service fabric (13).
8. The wire-bonded backplane system of claim 7, wherein:
each column of the first service disk area (11) at least comprises four high-speed connectors (21), and the four high-speed connectors are respectively arranged into a first upper high-speed connector (21), a second upper high-speed connector (21), a third upper high-speed connector (21) and a fourth upper high-speed connector (21) in sequence;
each column of the second service disk area (13) at least comprises four high-speed connectors (21), and the four high-speed connectors are respectively arranged into a first lower high-speed connector (21), a second lower high-speed connector (21), a third lower high-speed connector (21) and a fourth lower high-speed connector (21) in sequence;
each column of the exchange panel (12) comprises at least four high-speed connectors (21) which are respectively arranged into a first exchange connector, a second exchange connector, a third exchange connector and a fourth exchange connector in sequence;
-the first upper high-speed connector (21), the third upper high-speed connector (21), the first lower high-speed connector (21) and the third lower high-speed connector (21) are all docked to the first and second exchange connectors;
the second upper high-speed connector (21), the fourth upper high-speed connector (21), the second lower high-speed connector (21) and the fourth lower high-speed connector (21) are all docked to the third and fourth switch connectors.
9. The wire-bonded backplane system of claim 1, wherein:
the electric backboard (31) comprises at least two split bodies, and the at least two split bodies are detachably connected.
10. The wire-bonded backplane system of claim 1, wherein:
the frame (1) comprises at least two frames which are assembled together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211090388.XA CN116133314A (en) | 2022-09-07 | 2022-09-07 | Wire-electricity combined backboard system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211090388.XA CN116133314A (en) | 2022-09-07 | 2022-09-07 | Wire-electricity combined backboard system |
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| Publication Number | Publication Date |
|---|---|
| CN116133314A true CN116133314A (en) | 2023-05-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211090388.XA Pending CN116133314A (en) | 2022-09-07 | 2022-09-07 | Wire-electricity combined backboard system |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307142A (en) * | 2011-08-19 | 2012-01-04 | 中兴通讯股份有限公司 | Back plate system |
| WO2015081506A1 (en) * | 2013-12-04 | 2015-06-11 | 华为技术有限公司 | Interconnection system for communications device |
| CN104717862A (en) * | 2013-12-11 | 2015-06-17 | 泰科电子公司 | Cable backplane system |
| US20210091491A1 (en) * | 2019-09-25 | 2021-03-25 | Advanced-Connectek Inc. | Dual-row cable structure |
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2022
- 2022-09-07 CN CN202211090388.XA patent/CN116133314A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307142A (en) * | 2011-08-19 | 2012-01-04 | 中兴通讯股份有限公司 | Back plate system |
| WO2015081506A1 (en) * | 2013-12-04 | 2015-06-11 | 华为技术有限公司 | Interconnection system for communications device |
| CN104717862A (en) * | 2013-12-11 | 2015-06-17 | 泰科电子公司 | Cable backplane system |
| US20210091491A1 (en) * | 2019-09-25 | 2021-03-25 | Advanced-Connectek Inc. | Dual-row cable structure |
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