CN116130903B - Sub-millimeter wave waveguide flange based on gap waveguide - Google Patents
Sub-millimeter wave waveguide flange based on gap waveguide Download PDFInfo
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- CN116130903B CN116130903B CN202310251762.8A CN202310251762A CN116130903B CN 116130903 B CN116130903 B CN 116130903B CN 202310251762 A CN202310251762 A CN 202310251762A CN 116130903 B CN116130903 B CN 116130903B
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- 230000000737 periodic effect Effects 0.000 claims abstract description 43
- 230000000149 penetrating effect Effects 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 22
- 229910052710 silicon Inorganic materials 0.000 claims description 22
- 239000010703 silicon Substances 0.000 claims description 22
- 238000005516 engineering process Methods 0.000 abstract description 10
- 235000001674 Agaricus brunnescens Nutrition 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- -1 5014 Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/04—Fixed joints
- H01P1/042—Hollow waveguide joints
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/088—Stacked transmission lines
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- Waveguides (AREA)
- Waveguide Connection Structure (AREA)
Abstract
The invention provides a sub-millimeter wave waveguide flange based on a gap waveguide, which comprises a first waveguide and a second waveguide; the first waveguide is fixedly connected with the second waveguide; the middle part of the first waveguide is provided with a first through hole penetrating through the first waveguide; the middle part of the second waveguide is provided with a second through hole penetrating through the second waveguide and communicated with the first through hole; a plurality of first stop bands which are sequentially and fixedly connected are arranged between the first waveguide and the second waveguide; the first stop bands are used for limiting electromagnetic wave leakage in the first through holes and the second through holes; each first stop band comprises a plurality of mushroom-type periodic structures; the mushroom-shaped periodic structures are sequentially arranged along the circumferential direction of the first through hole; the mushroom type periodic structure is arranged at the joint of the waveguide and the waveguide by utilizing the gap waveguide technology, so that electromagnetic wave energy leakage caused by an air gap generated by a machining error is avoided, and PIM generated by a waveguide flange is restrained; the waveguide flange has the advantages of light weight, low profile and good sealing property.
Description
Technical Field
The invention belongs to the technical field of electromagnetic fields and microwaves, and particularly relates to a sub-millimeter wave waveguide flange based on a gap waveguide.
Background
With the rapid development and application of communication technology, in a wireless communication system, voice and data information required to pass through within a fixed bandwidth is increasingly increased, and the limited spectrum resources have a great challenge to the capability of the system to transmit information. In order to ensure the quality and efficiency of the transmitted information, the quality of the information transmission path needs to be improved, and the interference and influence of external factors on the system are reduced. If there is no good mechanical connection between two or more metal devices, the metal connection will loosen, resulting in Passive Intermodulation (PIM) on the metal surface due to oxidation, corrosion, etc., thereby affecting the information transmitted by the system. The common microwave transmission mode is waveguide transmission, and the design of a connector-waveguide flange between waveguides is very important to improve the quality of system transmission information.
When two flanges are connected, the traditional waveguide flange has a plurality of air gaps which are difficult to avoid, so that energy can leak in the transmission process, the overall performance of the system is affected, and especially the influence on extremely high frequency bands such as millimeter waves, terahertz and the like and frequency bands above is serious. At present, a strict surface treatment process, high-pressure connection and the like are adopted to inhibit PIM generated by a waveguide flange, but higher time and manufacturing cost are caused. For the energy leakage caused by the gap between the two waveguide flanges, the advantage of no electrical contact of the gap waveguide technology is realized, and the leakage of the energy in the unexpected gap is prevented. Gap waveguide technology is widely used in microwave and millimeter wave applications such as ideal magnetic conductor (PerfectMagneticConductor, PMC) packaging, passive self-packaging gap waveguide circuits, antennas, low passive intermodulation connections, and non-contact waveguide flanges (ContactlessWaveguide Flange, CWF), among others.
For the non-contact waveguide flange structure based on the gap waveguide technology, the biggest advantage is that even if an air gap exists between two flanges, an electromagnetic band gap structure (ElectromagneticBandGap, EBG) formed by the gap waveguide technology can limit electromagnetic waves from leaking from the air gap between the two waveguide flanges, so that PIM is reduced, and the performance of the whole communication system is improved. Currently, the EBG structure used by most researchers is a metal column, which is not dominant in size and weight, and in order to achieve the above light weight and compact waveguide flange design, a new waveguide flange structure needs to be developed.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a sub-millimeter wave waveguide flange based on a gap waveguide.
The invention provides a sub-millimeter wave waveguide flange based on a gap waveguide, which comprises a first waveguide and a second waveguide; the first waveguide is fixedly connected with the second waveguide; the middle part of the first waveguide is provided with a first through hole penetrating through the first waveguide; the middle part of the second waveguide is provided with a second through hole penetrating through the second waveguide and communicated with the first through hole; a plurality of first stop bands which are sequentially and fixedly connected are arranged between the first waveguide and the second waveguide; the plurality of first stop bands are used for limiting electromagnetic wave leakage in the first through holes and the second through holes;
each first stop band comprises a plurality of mushroom-type periodic structures; a plurality of mushroom-shaped periodic structures are sequentially arranged along the circumferential direction of the first through hole; the mushroom-type periodic structure comprises an air gap, a metal patch, a high-resistance silicon substrate and a plurality of metal columns;
the air gap and the high-resistance silicon substrate are both rectangular column structures; the air gap is positioned at the top of the high-resistance silicon substrate; a third through hole penetrating through the air gap is formed in the middle of the air gap; the metal patch is positioned in the third through hole and positioned at the top of the high-resistance silicon substrate; the metal columns are positioned in the high-resistance silicon substrate; the axial direction of each metal column is perpendicular to the plane where the bottom of the metal patch is located.
Further, the first waveguide comprises a first upper waveguide and a first lower waveguide which are fixedly connected; a first upper groove is formed in the first upper waveguide; a first lower groove is formed in the first lower waveguide; the first upper groove and the first lower groove constitute the first through hole.
Further, the second waveguide comprises a second upper waveguide and a second lower waveguide which are fixedly connected; a second upper groove is formed in the second upper waveguide; a second lower groove is formed in the second lower waveguide; the second upper groove and the second lower groove form the second through hole.
Further, a plurality of second stop bands which are positioned at two sides of the first through hole and are fixedly connected in sequence are arranged at the joint of the first upper waveguide and the first lower waveguide; each of the second stop bands includes a plurality of the mushroom-type periodic structures; the mushroom-type periodic structures are sequentially arranged along the axial direction of the first through hole.
Further, a plurality of third stop bands which are positioned at two sides of the second through hole and are fixedly connected in sequence are arranged at the joint of the second upper waveguide and the second lower waveguide; each of the third stop bands comprises a plurality of mushroom-type periodic structures; the mushroom-type periodic structures are sequentially arranged along the axial direction of the second through hole.
Further, the first stop band is fixedly connected with the first waveguide; and a third groove matched with the first stop band is formed in the side surface, close to the first stop band, of the second waveguide.
Further, the first upper waveguide and the first lower waveguide are fixedly connected through a plurality of first metal pins.
Further, the second upper waveguide and the second lower waveguide are fixedly connected through a plurality of first metal pins.
Further, a plurality of connecting lugs are arranged on the side surface, close to the first stop band, of the second waveguide; the first waveguide is provided with a connecting groove matched with each connecting lug; each connecting lug is fixedly connected with the corresponding connecting groove through a second metal pin.
Further, the plurality of mushroom-type periodic structures are single-sided mushroom-type periodic structures.
The invention provides a sub-millimeter wave waveguide flange based on a gap waveguide, which comprises a first waveguide and a second waveguide; the first waveguide is fixedly connected with the second waveguide; the middle part of the first waveguide is provided with a first through hole penetrating through the first waveguide; the middle part of the second waveguide is provided with a second through hole penetrating through the second waveguide and communicated with the first through hole; a plurality of first stop bands which are sequentially and fixedly connected are arranged between the first waveguide and the second waveguide; the plurality of first stop bands are used for limiting electromagnetic wave leakage in the first through holes and the second through holes; each first stop band comprises a plurality of mushroom-type periodic structures; a plurality of mushroom-shaped periodic structures are sequentially arranged along the circumferential direction of the first through hole; the mushroom-type periodic structure comprises an air gap, a metal patch, a high-resistance silicon substrate and a plurality of metal columns; the air gap and the high-resistance silicon substrate are both rectangular column structures; the air gap is positioned at the top of the high-resistance silicon substrate; a third through hole penetrating through the air gap is formed in the middle of the air gap; the metal patch is positioned in the third through hole and positioned at the top of the high-resistance silicon substrate; the metal columns are positioned in the high-resistance silicon substrate; the axial direction of each metal column is perpendicular to the plane where the bottom of the metal patch is located. The mushroom type periodic structure is arranged at the joint of the waveguide and the waveguide by utilizing the gap waveguide technology, so that electromagnetic wave energy leakage caused by an air gap generated by a machining error is avoided, and PIM generated by a waveguide flange is restrained; the waveguide flange has the advantages of light weight, low profile and good sealing property.
Drawings
In order to more clearly illustrate the technical solutions of the present invention, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a block diagram of a sub-millimeter wave waveguide flange based on a gap waveguide according to an embodiment of the present invention;
FIG. 2 is a side view of a second waveguide provided by an embodiment of the present invention;
fig. 3 is an exploded view of a sub-millimeter wave waveguide flange based on a gap waveguide according to an embodiment of the present invention;
FIG. 4 is a block diagram of a second waveguide provided by an embodiment of the present invention;
fig. 5 is an overall diagram of a sub-millimeter wave waveguide flange based on a gap waveguide according to an embodiment of the present invention;
FIG. 6 is an overall view of a second waveguide provided by an embodiment of the present invention;
FIG. 7 is a diagram showing a structure of a mushroom-type periodic structure according to an embodiment of the present invention;
FIG. 8 is a top view of a mushroom-type periodic structure according to an embodiment of the present invention;
fig. 9 is a diagram of simulation results of a submillimeter wave waveguide and flange structure based on a gap waveguide technology according to an embodiment of the present invention.
The device comprises a first waveguide, a first upper waveguide, 1011, a first upper groove, 102, a first lower waveguide, 1021, a first lower groove, 103 and a connecting groove, wherein the first waveguide is a first waveguide, 101, a first upper waveguide, 1011, a first upper groove, 102, a first lower waveguide, 1021, a first lower groove, 103 and a connecting groove; 2. a second waveguide, 201, a second upper waveguide, 2011, a second upper groove, 202, a second lower waveguide, 2021, a second lower groove, 203, a third groove, 204, and a connecting ear; 3. a first through hole; 4. a second through hole; 5. the first stop band, 501, mushroom type periodic structures, 5011, air gaps, 5012, metal patches, 5013, high-resistance silicon substrates, 5014, metal columns, 5015 and third through holes; 6. a second stop band; 7. a third stop band; 8. a first metal pin; 9. a second metal pin.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1, an embodiment of the present invention provides a sub-millimeter wave waveguide flange based on a gap waveguide, which includes a first waveguide 1 and a second waveguide 2; the first waveguide 1 is fixedly connected with the second waveguide 2; the middle part of the first waveguide 1 is provided with a first through hole 3 penetrating through the first waveguide 1; the middle part of the second waveguide 2 is provided with a second through hole 4 which penetrates through the second waveguide 2 and is communicated with the first through hole 3; a plurality of first stop bands 5 which are fixedly connected in sequence are arranged between the first waveguide 1 and the second waveguide 2; the plurality of first stop bands 5 are used to limit electromagnetic wave leakage in the first through holes 3 and the second through holes 4.
As shown in fig. 7 and 8, each first stop band 5 includes a plurality of mushroom-type periodic structures 501; the plurality of mushroom-type periodic structures 501 are sequentially arranged along the circumferential direction of the first through hole 3; the mushroom-type periodic structure 501 includes an air gap 5011, a metal patch 5012, a high resistance silicon substrate 5013, and a plurality of metal posts 5014.
The air gap 5011 and the high-resistance silicon substrate 5013 are both rectangular column structures; the air gap 5011 is located on top of the high resistance silicon substrate 5013; a third through hole 5015 penetrating the air gap 5011 is provided in the middle of the air gap 5011; the metal patch 5012 is located inside the third through hole 5015 and on top of the high resistance silicon substrate 5013; a plurality of metal posts 5014 are positioned inside the high resistance silicon substrate 5013; the axial direction of each metal post 5014 is perpendicular to the plane in which the bottom of the metal patch 5012 lies.
Illustratively, as shown in fig. 4 and 5, the first waveguide 1 includes a first upper waveguide 101 and a first lower waveguide 102 fixedly connected; a first upper groove 1011 is formed on the first upper waveguide 101; the first lower waveguide 102 is provided with a first lower groove 1021; the first upper groove 1011 and the first lower groove 1021 constitute the first through hole 3. As shown in fig. 2 and 6, the second waveguide 2 includes a second upper waveguide 201 and a second lower waveguide 202 fixedly connected; the second upper waveguide 201 is provided with a second upper groove 2011; a second lower groove 2021 is formed on the second lower waveguide 202; the second upper groove 2011 and the second lower groove 2021 constitute the second through hole 4. Electromagnetic waves sequentially propagate in the first through hole 3 and the second through hole 4, the first stop band 5 prevents electromagnetic wave energy from leaking at the joint of the first waveguide 1 and the second waveguide 2, and PIM generated by the waveguide flange is restrained.
Illustratively, a plurality of sequentially fixedly connected second stop bands 6 positioned at two sides of the first through hole 3 are arranged at the joint of the first upper waveguide 101 and the first lower waveguide 102; each second stop band 6 comprises a plurality of mushroom-type periodic structures 501; the plurality of mushroom-type periodic structures 501 are sequentially arranged along the axial direction of the first through hole 3. A plurality of third stop bands 7 which are positioned at two sides of the second through hole 4 and are fixedly connected in sequence are arranged at the joint of the second upper waveguide 201 and the second lower waveguide 202; each third stop band 7 comprises a plurality of mushroom-type periodic structures 501; the plurality of mushroom-type periodic structures 501 are sequentially arranged along the axial direction of the second through-holes 4. The second stop band 6 prevents electromagnetic wave energy from leaking at the joint of the first upper waveguide 101 and the first lower waveguide 102, and inhibits PIM generated by the waveguide flange; the third stop band 7 prevents leakage of electromagnetic wave energy at the junction of the second upper waveguide 201 and the second lower waveguide 202, and suppresses PIM generated by the waveguide flange.
Illustratively, as shown in fig. 3, the first stop band 5 is fixedly connected to the first waveguide 1; the side of the second waveguide 2 near the first stop band 5 is provided with a third groove 203 matching the first stop band 5. The first stop band 5 is embedded in the third groove 203 to form a complete mushroom-type electromagnetic bandgap structure. The working frequency of the 140GHz-210GHz waveguide flange based on the gap waveguide technology can be designed into millimeter wave and terahertz frequency bands, and the substrate of the mushroom-type periodic structure 501 can be made of different materials.
Illustratively, as shown in fig. 3, the first upper waveguide 101 and the first lower waveguide 102 are fixedly connected by a plurality of first metal pins 8. The second upper waveguide 201 and the second lower waveguide 202 are fixedly connected by a plurality of first metal pins 8. The side surface of the second waveguide 2, which is close to the first stop band 5, is provided with a plurality of connecting lugs 204; the first waveguide 1 is provided with a connecting groove 103 matched with each connecting lug 204; each connecting lug 204 is fixedly connected with the corresponding connecting groove 103 through the second metal pin 9.
Illustratively, the plurality of mushroom-type periodic structures 501 are each a single-sided mushroom-type periodic structure. The plurality of mushroom-shaped periodic structures 501 at the connection position of the first upper waveguide 101 and the first lower waveguide 102 may be double-sided mushroom-shaped periodic structures; also, the plurality of mushroom-type periodic structures 501 at the junction of the second upper waveguide 201 and the second lower waveguide 202 may be double-sided mushroom-type periodic structures.
Illustratively, as shown in fig. 2 and 3, the mushroom-type periodic structure 501 therein: the size of the air gap 5011 is (in order of X, Y, Z): 0.15mm by 0.025mm, the dimensions of the high resistance silicon substrate 5013 are: 0.15mm, the dimensions of the metal patch 5012 are: 0.1mm 0.003mm, radius and height of four metal posts 5014: 0.01mm 0.15mm.
Wherein a1=1.20 mm, a2=2.125 mm, a3=0.625 mm, a4=0.50 mm, b=3.00 mm, b1=1.65 mm, b2=0.45 mm, b3=0.50 mm, c=4.60 mm, c1=2.275 mm, c2=1.10 mm, h1=1.00 mm, h2=0.70 mm, h3=0.10 mm, h4=0.20 mm, r1=0.1 mm, r2=0.05 mm.
As shown in fig. 9, simulation results of a sub-millimeter wave waveguide and a flange structure based on a gap waveguide technology are shown (in order to simulate assembly in reality, a gap of 25um is provided between a first waveguide and a second waveguide to simulate an error, and the simulation results are obtained). In the embodiment, the waveguide connector can realize normal transmission of electromagnetic waves in the frequency range of 140GHz-210GHz under the condition of 25um gaps.
The invention has been described in detail in connection with the specific embodiments and exemplary examples thereof, but such description is not to be construed as limiting the invention. It will be understood by those skilled in the art that various equivalent substitutions, modifications or improvements may be made to the technical solution of the present invention and its embodiments without departing from the spirit and scope of the present invention, and these fall within the scope of the present invention. The scope of the invention is defined by the appended claims.
Claims (6)
1. A sub-millimeter wave waveguide flange based on a gap waveguide, which is characterized by comprising a first waveguide (1) and a second waveguide (2); the first waveguide (1) is fixedly connected with the second waveguide (2); the middle part of the first waveguide (1) is provided with a first through hole (3) penetrating through the first waveguide (1); the middle part of the second waveguide (2) is provided with a second through hole (4) penetrating through the second waveguide (2) and communicated with the first through hole (3); a plurality of first stop bands (5) which are fixedly connected in sequence are arranged between the first waveguide (1) and the second waveguide (2); the plurality of first stop bands (5) are used for limiting electromagnetic wave leakage in the first through holes (3) and the second through holes (4);
each of the first stop bands (5) comprises a plurality of mushroom-type periodic structures (501); a plurality of mushroom-shaped periodic structures (501) are sequentially arranged along the circumferential direction of the first through hole (3); the mushroom-type periodic structure (501) comprises an air gap (5011), a metal patch (5012), a high-resistance silicon substrate (5013) and a plurality of metal posts (5014);
the air gap (5011) and the high-resistance silicon substrate (5013) are both rectangular column structures; -the air gap (5011) is located on top of the high resistance silicon substrate (5013); a third through hole (5015) penetrating through the air gap (5011) is arranged in the middle of the air gap (5011); the metal patch (5012) is positioned inside the third through hole (5015) and on the top of the high-resistance silicon substrate (5013); a plurality of the metal posts (5014) are positioned inside the high-resistance silicon substrate (5013); the axial direction of each metal column (5014) is perpendicular to the plane of the bottom of the metal patch (5012);
the first waveguide (1) comprises a first upper waveguide (101) and a first lower waveguide (102) which are fixedly connected; a first upper groove (1011) is formed in the first upper waveguide (101); a first lower groove (1021) is formed in the first lower waveguide (102); the first upper groove (1011) and the first lower groove (1021) constitute the first through hole (3);
the second waveguide (2) comprises a second upper waveguide (201) and a second lower waveguide (202) which are fixedly connected; a second upper groove (2011) is formed in the second upper waveguide (201); a second lower groove (2021) is formed in the second lower waveguide (202); the second upper groove (2011) and the second lower groove (2021) form the second through hole (4);
a plurality of second stop bands (6) which are positioned at two sides of the first through hole (3) and are fixedly connected in sequence are arranged at the joint of the first upper waveguide (101) and the first lower waveguide (102); -each of said second stop bands (6) comprises a plurality of said mushroom-type periodic structures (501); a plurality of mushroom-shaped periodic structures (501) are sequentially arranged along the axial direction of the first through hole (3);
a plurality of third stop bands (7) which are positioned at two sides of the second through hole (4) and are fixedly connected in sequence are arranged at the joint of the second upper waveguide (201) and the second lower waveguide (202); -each of said third stop bands (7) comprises a plurality of said mushroom-type periodic structures (501); a plurality of mushroom-shaped periodic structures (501) are sequentially arranged along the axial direction of the second through hole (4).
2. The gap waveguide-based sub-millimeter wave waveguide flange according to claim 1, characterized in that the first stop band (5) is fixedly connected to the first waveguide (1); and a third groove (203) matched with the first stop band (5) is formed in the side surface, close to the first stop band (5), of the second waveguide (2).
3. The gap waveguide-based sub-millimeter wave waveguide flange according to claim 1, characterized in that the first upper waveguide (101) and the first lower waveguide (102) are fixedly connected by a plurality of first metal pins (8).
4. The gap waveguide-based sub-millimeter wave waveguide flange according to claim 1, characterized in that the second upper waveguide (201) and the second lower waveguide (202) are fixedly connected by a plurality of first metal pins (8).
5. The gap waveguide-based sub-millimeter wave waveguide flange according to claim 1, characterized in that the second waveguide (2) is provided with a plurality of connection lugs (204) on the side close to the first stop band (5); a connecting groove (103) matched with each connecting lug (204) is formed in the first waveguide (1); each connecting lug (204) is fixedly connected with the corresponding connecting groove (103) through a second metal pin (9).
6. The gap waveguide-based sub-millimeter wave waveguide flange according to claim 1, wherein a plurality of the mushroom-type periodic structures (501) are each a single-sided mushroom-type periodic structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310251762.8A CN116130903B (en) | 2023-03-16 | 2023-03-16 | Sub-millimeter wave waveguide flange based on gap waveguide |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310251762.8A CN116130903B (en) | 2023-03-16 | 2023-03-16 | Sub-millimeter wave waveguide flange based on gap waveguide |
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| Publication Number | Publication Date |
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| CN116130903A CN116130903A (en) | 2023-05-16 |
| CN116130903B true CN116130903B (en) | 2023-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310251762.8A Active CN116130903B (en) | 2023-03-16 | 2023-03-16 | Sub-millimeter wave waveguide flange based on gap waveguide |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104488134A (en) * | 2012-06-18 | 2015-04-01 | 加普韦夫斯公司 | Gap waveguide structures for thz applications |
| CN206878146U (en) * | 2017-05-23 | 2018-01-12 | 星展测控科技股份有限公司 | The gapless waveguide junction of contact |
| CN108666717A (en) * | 2018-03-28 | 2018-10-16 | 西安空间无线电技术研究所 | A kind of non-contact type low passive intermodulation waveguide connection structure and design method |
| CN111509337A (en) * | 2020-06-04 | 2020-08-07 | 盛纬伦(深圳)通信技术有限公司 | Waveguide interface structure for preventing electromagnetic wave signal leakage |
| CN114597612A (en) * | 2022-03-10 | 2022-06-07 | 中国电子科技集团公司第四十一研究所 | Flange and terahertz waveguide connecting piece based on electromagnetic band gap structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150008994A1 (en) * | 2012-01-12 | 2015-01-08 | Nec Corporation | Interface apparatus |
-
2023
- 2023-03-16 CN CN202310251762.8A patent/CN116130903B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104488134A (en) * | 2012-06-18 | 2015-04-01 | 加普韦夫斯公司 | Gap waveguide structures for thz applications |
| CN206878146U (en) * | 2017-05-23 | 2018-01-12 | 星展测控科技股份有限公司 | The gapless waveguide junction of contact |
| CN108666717A (en) * | 2018-03-28 | 2018-10-16 | 西安空间无线电技术研究所 | A kind of non-contact type low passive intermodulation waveguide connection structure and design method |
| CN111509337A (en) * | 2020-06-04 | 2020-08-07 | 盛纬伦(深圳)通信技术有限公司 | Waveguide interface structure for preventing electromagnetic wave signal leakage |
| CN114597612A (en) * | 2022-03-10 | 2022-06-07 | 中国电子科技集团公司第四十一研究所 | Flange and terahertz waveguide connecting piece based on electromagnetic band gap structure |
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| CN116130903A (en) | 2023-05-16 |
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