CN116120887A - Organosilicon adhesive composition containing antistatic agent compound and adhesive tape - Google Patents
Organosilicon adhesive composition containing antistatic agent compound and adhesive tape Download PDFInfo
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- CN116120887A CN116120887A CN202211563300.1A CN202211563300A CN116120887A CN 116120887 A CN116120887 A CN 116120887A CN 202211563300 A CN202211563300 A CN 202211563300A CN 116120887 A CN116120887 A CN 116120887A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to the technical field of organosilicon pressure-sensitive adhesives, in particular to an organosilicon adhesive composition containing an antistatic agent compound and an adhesive tape. The adhesive composition comprises an addition curing type organic silicon pressure-sensitive adhesive component, an antistatic agent compound for a reactive organic silicon pressure-sensitive adhesive and a solvent. The addition curing type organic silicon pressure-sensitive adhesive component comprises polyvinyl polysiloxane, hydrogen-containing polysiloxane, an adhesion promoter, a platinum catalyst and an inhibitor. The antistatic organic silicon pressure-sensitive adhesive tape is prepared by controlling the mass parts of the addition curing organic silicon pressure-sensitive adhesive component and the adhesive composition. Unlike available antistatic organosilicon pressure sensitive adhesive tape, the antistatic organosilicon pressure sensitive adhesive tape of the present invention has no need of coating antistatic primer layer on the base material, and has high light transmittance and simple coating process.
Description
Technical Field
The invention relates to the technical field of organosilicon pressure-sensitive adhesives, in particular to an organosilicon adhesive composition containing an antistatic agent compound and an adhesive tape.
Background
With the rapid development of electronic products, in order to prevent the surface of the products from being damaged by physical impact which may occur during the process of transporting, storing, and assembling the products, the surface of electronic devices such as display screens and the like are largely protected from scratch and cleanliness by using a protective film. Since these protective films are usually formed with an organosilicon pressure-sensitive adhesive layer on the surface of polyethylene terephthalate PET, then attached to the display surface; because of the insulation property of the organic silicon material, a large electrostatic voltage is generated during peeling to break down the adhered object, so that defects appear on the device or the display screen, and in addition, the existence of static electricity can also become a source for adsorbing dust or potential safety hazards. For the organosilicon protective film pressure-sensitive adhesive, two solutions are generally adopted, namely, coating polythiophene antistatic liquid on a PET substrate of the protective film to form an antistatic coating; secondly, conductive substances such as carbon black, metal oxide, carbon nano tubes and the like are added into the pressure-sensitive adhesive formula, as shown in invention patent CN109016769A and CN 109913142A. However, the former cannot achieve a satisfactory antistatic effect, the pressure-sensitive adhesive has a higher surface resistance and a higher film tearing voltage; the poor compatibility of the latter with silicone formulations can lead to severe reduction in pressure-sensitive adhesive clarity and is unsuitable for pressure-sensitive adhesive tape applications on optical device surfaces.
In order to solve the problems, the invention provides an organic silica gel adhesive composition containing an antistatic agent compound and an adhesive tape.
Disclosure of Invention
The invention aims to provide an organic silica gel adhesive composition containing an antistatic agent compound and an adhesive tape, so as to solve the problems in the prior art.
In order to solve the technical problems, the invention provides the following technical scheme: an organosilicon adhesive composition containing antistatic agent compound and adhesive tape.
An silicone adhesive composition containing an antistatic compound, the adhesive composition comprising: addition curing type organic silicon pressure-sensitive adhesive component, antistatic agent compound and solvent; the addition curing type organic silicon pressure-sensitive adhesive component comprises polyvinyl polysiloxane, hydrogen-containing polysiloxane, an adhesion promoter, a platinum catalyst and an inhibitor.
More preferably, the silicone adhesive composition comprises the following components: 100 parts by mass of an addition curing type organic silicon pressure-sensitive adhesive component, 0.01-20 parts by mass of an antistatic agent compound and 100-200 parts by mass of a solvent.
More optimally, the mass ratio of the polyvinyl polysiloxane to the tackifying resin to the crosslinking agent to the adhesion promoter to the platinum catalyst to the inhibitor is 100:0-100:0.1-10:0.1-5:0.1-10.
More optimally, the polyvinyl polysiloxane can be selected from any one or more of SPS-8057, SPS-3125, SPS-8067 and SPS-1001 of Zhejiang Rumex, DY-V401, DY-V411 and DY-V421 of Shandong Dayixiao chemical industry Co., ltd, DOWSIL7687 and DOWSIL 7686 of Dow;
the tackifying resin can be selected from methyl vinyl MQ silicon resin, such as any one or more of DY-VMQ101, DY-VMQ102, DY-VMQ103 and the like of Shandong Dayi chemical industry Co., ltd, or the tackifying resin can be not added according to the requirement.
The cross-linking agent is hydrogen-containing polysiloxane, and can be selected from any one or more of terminal hydrogen-containing polydiorganosiloxane, side hydrogen-containing polydiorganosiloxane, terminal hydrogen-containing polydiorganosiloxane, such as DOWSIL7028, DOWSIL 5084 and DOWSIL7387 of Dow company, RH-LHC-3, RH-H502, RH-H503, RH-H510, RH-H512, RH-H3, RH-H33, RH-H57, RH-H802 and RH-H86 of Zhejiang Runner New material science and technology Co-Ltd;
the adhesion promoter can be selected from one or more of syl-off-297 and M97-A, M A, or the adhesion promoter can be not added according to the requirement.
The platinum catalyst may be any one or more of commonly used Kadster catalyst such as syl-off-4000, CAT-PL-56, and CSAT-F1.
The inhibitor can be selected from any one or more of alkynol-type silicon hydrogen inhibitor such as 2-methyl-3-butyn-2-ol, 1-ethynyl cyclohexanol and 2-propyn-1-ol.
More preferably, the solvent is any one or more of ethyl acetate, butyl acetate, petroleum ether, toluene, xylene, m-xylene and butanone.
More preferably, the antistatic compound has the following structural formula:
and/or
More preferably, in the structural formula,
a. b and c are natural numbers, wherein a is more than or equal to 100 and more than or equal to 1, b is more than or equal to 100 and more than or equal to 1, and c is more than or equal to 100 and more than or equal to 1;
m and n are natural numbers, wherein m is more than or equal to 10 and more than or equal to 1, n is more than or equal to 10 and more than or equal to 1;
x is bivalent saturated alkyl, and has a structural general formula of C q H 2q Q is a natural number, and q is more than or equal to 10 and more than or equal to 1;
y is bivalent saturated alkyl, and has a structural general formula of C i H 2i I is an integer, and is more than or equal to 10 and more than or equal to 0;
R 1 、R 2 、R 3 and R4 is a monovalent saturated alkyl structure of the general formula-C p H 2p+1 P is a natural number, and p is more than or equal to 10 and more than or equal to 1.
R 5 、R 6 、R 7 And R is 8 Is any one of hydrogen atom and monovalent saturated alkyl structure, and has a general structural formula of-C t H 2t+1 T is an integer, and 10 is more than or equal to t is more than or equal to 0.
A protective film adhesive tape comprising a protective film, an organosilicon adhesive composition containing an antistatic agent compound, a PET substrate; the protective film is bonded to the PET substrate by an organosilicon adhesive composition containing an antistatic agent compound.
More preferably, the PET substrate is optical grade, and the film thickness of the substrate is 5-100 micrometers; the thickness of the silicone adhesive composition containing the antistatic agent compound is 2-50 micrometers.
More optimally, the preparation method of the protective film adhesive tape comprises the following steps: and directly coating the organic silica gel adhesive composition containing the antistatic agent compound on a PET substrate, wherein the curing temperature is 100-180 ℃, the curing time is 1-5min, and the protective film is attached to the surface of the cured organic silica pressure-sensitive adhesive to obtain the protective film adhesive tape.
The preparation method of the antistatic agent compound for the reactive organic silica gel adhesive comprises the following steps: the method comprises the following steps:
step S1: polysiloxane preparation reactions containing halocarbyl and polyvinyl groups
Mixing terminal haloalkyl methyl dialkoxysilane, terminal hydroxyl vinyl polysiloxane and an acid catalyst, slowly heating to 50-100 ℃, preserving heat for 2-48h, and slowly vacuumizing to remove low boiling point for 2-8h, wherein the molar ratio of the terminal haloalkyl methyl dialkoxysilane to the terminal hydroxyl vinyl polysiloxane is 1:1-1:20, and the addition amount of the acid catalyst is 1% -10% of the total mass of the reaction substance; replacing the reaction system to normal pressure by nitrogen, adding hexamethyldisiloxane, carrying out heat preservation reaction for 2-48h, slowly vacuumizing to remove low boiling point for 2-8h, and filtering to remove a solid acid catalyst to obtain a polysiloxane intermediate containing both halogenated hydrocarbon groups and polyvinyl groups;
step S2: quaternization of organic amines and halohydrocarbon polysiloxanes
Mixing the intermediate, organic amine and solvent, wherein the molar ratio of amine group to halogenated hydrocarbon group is 1:1-1.5:1, slowly heating to 50-150 ℃, reacting for 2-48 hours at a temperature, and slowly distilling under reduced pressure to recover the organic amine and solvent to obtain yellow viscous liquid, namely polysiloxane intermediate containing quaternary ammonium salt and polyvinyl;
step S3: substitution synthesis reaction of fluorine-containing lithium salt and quaternary ammonium polysiloxane
Adding the intermediate, lithium bis (polyfluoroalkyl) sulfonyl imide and water into a reaction kettle, wherein the molar ratio of the lithium bis (polyfluoroalkyl) sulfonyl imide to the quaternary ammonium salt is 1:1-1.5:1, and stirring and reacting for 1-48 h at the temperature of 10-80 ℃; cooling the crude intermediate to room temperature, adding an extraction solvent, uniformly mixing, adding the mixed solution into a pear-shaped separating funnel, severely oscillating, uniformly mixing, separating the solution, and taking the lower layer; adding water and lower layer substances into a pear-shaped separating funnel, vigorously oscillating and uniformly mixing, separating liquid, taking the lower layer, and repeating the extraction operation for 2 times; in the temperature range of 20-150 ℃, decompressing and rotary evaporating, slowly removing solvent and water to obtain yellowish transparent liquid, namely the target product: antistatic compounds for reactive silicone adhesives.
Compared with the prior art, the invention has the following beneficial effects:
(1) The invention provides an organic silica gel adhesive composition and an adhesive tape containing an antistatic agent compound, wherein the main chain of the antistatic agent compound is polydiorganosiloxane, so that the adhesive composition has excellent compatibility with the organic silica gel adhesive composition, and the transparency of the adhesive is prevented from being deteriorated in the use process. The side chain of the antistatic agent compound contains a negative and positive double-ion antistatic agent structure, so that an antistatic function of the organic silica gel adhesive can be endowed; meanwhile, the side chain of the compound also contains a vinyl functional group structure, can perform chemical crosslinking reaction with the organic silica gel adhesive composition, improves the durability and compatibility of the antistatic agent, and avoids chemical pollution of the pressure-sensitive adhesive to the surface to be protected.
Unlike available antistatic organosilicon pressure sensitive adhesive film, the present invention has no need of coating antistatic primer layer on the base material, and the organosilicon pressure sensitive adhesive layer may be coated directly on the base material, and the organosilicon pressure sensitive adhesive film has no color and high transparency, and has light transmittance up to 90% or higher, so that the present coating process may be simplified greatly.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
fig. 1 is a schematic view of the protective film tape structure of the present invention.
FIG. 2 is a drawing of H of antistatic compound A for reactive silicone pressure-sensitive adhesive prepared in example 1 of the present invention 1 NMR spectra.
FIG. 3 is a drawing of H of antistatic compound B for reactive silicone pressure-sensitive adhesive prepared in example 2 of the present invention 1 NMR spectra.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Synthesis example 1: preparation of antistatic Compound A
Step S1: 6.1g of gamma-chloropropyl methyldimethoxy silane (chemical reagent, purchased from Aba Ding Gongsi) and 59.3g of hydroxyl end-capped methyl vinyl silicone oil (provided by Wuxi city, all-standing technology Co., ltd., vinyl content of 7.4%) are put into a reaction kettle, stirring is started and uniformly mixed, 2.8g of acid resin catalyst YKCH8501 (provided by Tianjin allowed resin technology Co., ltd.) is added, the temperature is slowly increased to 80 ℃, the reaction is carried out for 30 hours under heat preservation, and then vacuum pumping is slowly carried out for removing low boiling for 8 hours; the reaction system was replaced with nitrogen to normal pressure, and hexamethyldisiloxane (chemical reagent, purchased from Ara Ding Gongsi) was added in an amount of 4.7g, followed by thermal insulation reaction for 24 hours, and then the reaction system was slowly evacuated to remove low boiling point for 6 hours, and the solid acid catalyst was removed by suction filtration through a Buchner funnel to obtain a chloropropyl vinyl silicone oil intermediate.
Step S2: trin-propylamine (chemical reagent, purchased from Aba Ding Gongsi) and 80.0g of N, N-dimethylformamide (chemical reagent, purchased from Aba Ding Gongsi) are added into the intermediate, stirring is started, the mixture is uniformly mixed, the temperature is slowly increased to 110 ℃, the temperature is kept for 20 hours, the reaction is carried out, and then the tri-N-propylamine and the N, N-dimethylformamide are slowly distilled under reduced pressure to recover yellow viscous liquid.
Step S3: 9.0g of lithium bistrifluoromethylsulfonylimide (with the trade name of HQ115, purchased from 3M company) and 125g of water are added into the liquid product obtained in the step S2, stirring is started, the mixture is uniformly mixed, the temperature is slowly increased to 40 ℃, and stirring reaction is kept for 24 hours; cooling the reactant intermediate to room temperature, adding 125g of methylene dichloride (chemical reagent, purchased from Aba Ding Gongsi), uniformly mixing, adding the mixed solution into a separating funnel, vigorously oscillating and uniformly mixing, separating the solution, and taking the lower layer; adding 125g of water and lower layer substances into a pear-shaped separating funnel, vigorously oscillating and uniformly mixing, separating liquid, taking the lower layer, and repeating the extraction operation for 2 times; and slowly decompressing and rotating to evaporate at 110 ℃ to slowly remove the solvent and water to obtain yellowish transparent liquid, namely the antistatic agent compound A which is the target product.
Synthesis example 2: preparation of antistatic Compound B
Step S1: 7.7g of gamma-chloropropyl methyldimethoxy silane (chemical reagent, purchased from Aba Ding Gongsi) and 57.9g of hydroxyl end-capped methyl vinyl silicone oil (provided by Wuxi city, all-standing technology Co., ltd., vinyl content of 4.8%) are put into a reaction kettle, stirring is started and uniformly mixed, 3.1g of acid resin catalyst YKCH8501 (provided by Tianjin allowed resin technology Co., ltd.) is added, the temperature is slowly increased to 75 ℃, the reaction is carried out for 35 hours under heat preservation, and then vacuum pumping and low boiling removal are carried out for 8 hours; the reaction system was replaced with nitrogen to normal pressure, 5.9g of hexamethyldisiloxane (chemical reagent, purchased from Aba Ding Gongsi) was added, the reaction was carried out for 24 hours with heat preservation, vacuum was slowly applied to remove low boiling point for 6 hours, and the solid acid catalyst was removed by suction filtration through a Buchner funnel to obtain a chloropropyl vinyl silicone oil intermediate.
Step S2: 3.3g of N-methylpyrrole (chemical reagent, purchased from Aba Ding Gongsi) and 100.0g of N, N-dimethylformamide (chemical reagent, purchased from Aba Ding Gongsi) are added into the intermediate, stirring is started, the mixture is uniformly mixed, the temperature is slowly increased to 90 ℃, the temperature is kept for reaction for 40 hours, and then the N-methylpyrrole and the N, N-dimethylformamide are slowly distilled under reduced pressure to obtain yellow viscous liquid.
Step S3: adding 11.0g of lithium bistrifluoromethylsulfonylimide (with the trade name of HQ115, purchased from 3M company) and 150g of water into the liquid product obtained in the step S2, stirring and uniformly mixing, slowly heating to 40 ℃, and keeping stirring for reaction for 24 hours; after the reactant intermediate is cooled to room temperature, 150g of methylene dichloride (chemical reagent, purchased from Aba Ding Gongsi) is added and mixed uniformly, then the mixed solution is added into a separating funnel, mixed uniformly by intense shaking, separated, and the lower layer is taken; 150g of water and lower layer substances are added into a pear-shaped separating funnel, the mixture is mixed evenly by intense vibration, liquid is separated, the lower layer is taken out, and the extraction operation is repeated for 2 times; and slowly decompressing and rotating to evaporate at 110 ℃ to slowly remove the solvent and water to obtain yellowish transparent liquid, namely the antistatic agent compound B which is the target product.
Examples
The antistatic agent compounds for reactive silicone pressure-sensitive adhesives provided in synthesis examples 1, 2 and 3 were used to prepare silicone adhesive compositions having the following formulations:
sample 1 | |
|
|
Sample 5 | Comparative example 1 | Comparative example 2 | |
SPS-8067 | 80 | 80 | 80 | 80 | 80 | 80 | 80 |
DY-V421-1300 | 50 | 50 | 50 | 50 | 50 | 50 | 50 |
RH-H503 | 3.1 | 3.1 | 3.1 | 3.1 | 3.1 | 3.1 | 3.1 |
1-ethynyl cyclohexanol | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 |
CAT-PL-56 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 |
M92A | 0.8 | 0.8 | 0.8 | 0.8 | 0.8 | 0.8 | 0.6 |
Antistatic agent Compound A | 4.5 | 9.0 | 0 | 0 | 0 | 0 | 0 |
Antistatic |
0 | 0 | 4.5 | 9.0 | 12 | 0 | 0 |
|
0 | 0 | 0 | 0 | 0 | 0 | 4.5 |
Xylene (P) | 100.0 | 100.0 | 100.0 | 100.0 | 100.0 | 100.0 | 100.0 |
Toluene (toluene) | 100.0 | 100.0 | 100.0 | 100.0 | 100.0 | 100.0 | 100.0 |
Weighing polyvinyl polysiloxane resin SPS-8067 and DY-V421-1300, hydrogen polysiloxane cross-linking agent RH-H503, inhibitor 1-ethynyl cyclohexanol, adhesion promoter M92A, solvent and antistatic agent compound for reactive organic silica gel adhesive in a plastic bottle according to the formula and the dosage shown in the table, screwing the bottle cap, and then placing the bottle cap on a roller for glue rolling for 1H at room temperature; adding a platinum catalyst CAT-PL-56, screwing the bottle cap, and then placing the bottle cap on a roller to continue rolling for 1h at room temperature; the PET optical film is 25 mu m, an adjustable wet film coater Proceq is adopted for blade coating, the gap between the knife and the slit is adjusted, and the thickness of the cured adhesive film is 12 mu m; placing the wet adhesive film into an electric heating forced air drying oven at 150 ℃, curing for 1min, taking out, and attaching the adhesive surface to the release surface of a fluorine release film FS-050T (purchased from Wanchun phototechnology Co., ltd.) on the adhesive surface; samples 1 to 7 of protective film adhesive tapes were prepared.
The experimental operations of the above preparation examples of the adhesive and the protective film tape sample were repeated, and comparative example 1 of the protective film tape sample was prepared without adding the antistatic agent compound for the reactive silicone adhesive, under the other conditions.
Preparation example of the adhesive and protective film tape samples experimental procedure described above was repeated, and the reactive silicone adhesive was replaced with antistatic agent FC4400 (purchased from 3M company) using antistatic agent compound, with the other conditions unchanged, to prepare protective film tape sample comparative example 2.
Experiment:
and carrying out characterization evaluation on the prepared protective film adhesive tape sample:
the protective film sample is placed in an analysis and test environment with the temperature of 23 ℃ and the humidity of 50% RH, and after standing for 24 hours, the protective film is subjected to light transmittance and haze test by adopting a light transmittance and haze tester by referring to standard ASTM D1003-21 Standard test method for haze and light transmittance of transparent plastics.
Antistatic properties were evaluated by testing the rubber surface resistance. After the curing of the protective film sample is finished, the protective film sample is placed in an analysis and test environment with the temperature of 23 ℃ and the humidity of 50% RH, and the protective film sample is kept stand for 24 hours to carry out surface resistance test and evaluation work. The release film on the surface of each protective film tape was torn off, and the surface resistivity was measured with a Trek Model 152 surface resistance tester.
Selecting a PET plate with the thickness of 125 mu m and the surface not subjected to any treatment for carrying out a film tearing electrostatic pressure test; after the curing of the protective film sample is finished, placing the protective film sample into an analysis and test environment with the temperature of 23 ℃ and the humidity of 50% RH, standing for 24 hours, tearing off a release film, and attaching the exposed adhesive surface to a TAC plate; the protective film tape was peeled at a constant speed at a peeling speed of 30m/min and a peeling angle of 180 °, and the electrostatic pressure of the peeled film at the time of tearing the adhesive surface was measured by ESD Module Machine manufactured by Korean MILAE ENGINEERING company, and the maximum value was recorded.
After the curing of the protective film sample is finished, placing the protective film sample into an analysis and test environment with the temperature of 23 ℃ and the humidity of 50% RH, standing for 24 hours, tearing off a release film, and attaching the exposed adhesive surface to a clean glass plate; then placing the mixture into a constant temperature and constant humidity test box with the temperature of 60 ℃ and the relative humidity of 90 percent, and standing the mixture for 5 days; after the test is finished, taking out a glass plate sample attached with the protective film, standing for 24 hours in an analysis and test environment with the temperature of 23 ℃ and the humidity of 50% RH, tearing the protective film, observing the pollution condition of the glass surface by naked eyes, and judging the ageing resistance of the protective film sample under the conditions of high temperature and high humidity and the pollution condition of the protective film sample to a base material by using the pollution condition of the glass surface; according to the contamination of the glass surface, it was rated as 3 grades:
(1) evaluation of the complete absence of contamination of the glass surface was-
(2) Have a slight contamination rating of X
(3) The significant severe contamination was rated as X
(4) Evaluation of peel Strength
A304 mirror stainless steel SUS plate with the surface roughness of 50+/-2.5 nm is selected, and 180 is carried out according to the principle and method introduced in GB/T2792-2014 test method for adhesive tape peel strength. Peel strength test.
The results of the performance tests are shown in the following table:
conclusion: as can be seen from the table, the organic silica gel adhesive composition and the adhesive tape containing the antistatic agent compound provided by the invention adopt the antistatic agent with a special structure, and the structure of the double-ion antistatic agent is grafted on the organic silicon structure, so that the compatibility with the organic silicon pressure-sensitive adhesive is good, the surface resistance of the organic silicon pressure-sensitive adhesive can be obviously reduced, and the transparency of the organic silicon pressure-sensitive adhesive is not influenced; moreover, the vinyl functional group contained in the adhesive can perform hydrosilylation reaction with the organosilicon pressure-sensitive adhesive, and cannot cause deterioration of high-temperature and high-humidity aging resistance. The traditional antistatic agent has poor compatibility with the components of the organic silicon pressure-sensitive adhesive and no chemical reaction sites, so that the traditional antistatic agent is difficult to uniformly distribute in the organic silicon adhesive film, cannot reduce the surface resistance, can cause poor high-temperature and high-humidity aging resistance and cannot be applied to antistatic treatment of the organic silicon pressure-sensitive adhesive. And most importantly, the organic silica gel adhesive composition and the adhesive tape containing the antistatic agent compound disclosed by the invention adopt a one-time coating process, and the antistatic primer coating is not required to be coated on the adhesive tape base in advance, so that the existing coating process can be greatly simplified, and the product yield can be improved.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. An silicone adhesive composition comprising an antistatic compound, characterized in that: the silicone adhesive composition comprises: addition curing type organosilicon pressure-sensitive adhesive component, antistatic agent compound and solvent for reactive organosilicon pressure-sensitive adhesive; the addition curing type organosilicon pressure-sensitive adhesive component comprises polyvinyl polysiloxane, tackifying resin, a cross-linking agent, an adhesion promoter, a platinum catalyst and an inhibitor.
2. The silicone adhesive composition containing an antistatic compound as set forth in claim 1, wherein: the silicone adhesive composition comprises the following components: 100 parts by mass of an addition curing type organosilicon pressure-sensitive adhesive component, 0.01-20 parts by mass of an antistatic compound for a reactive organosilicon pressure-sensitive adhesive and 100-200 parts by mass of a solvent.
3. The silicone adhesive composition containing an antistatic compound as set forth in claim 1, wherein: the mass ratio of the polyvinyl polysiloxane to the tackifying resin to the crosslinking agent to the adhesion promoter to the platinum catalyst to the inhibitor is 100:0-100:0.1-10:0-10:0.1-5:0.1-10;
the tackifying resin is methyl vinyl MQ silicon resin; the cross-linking agent is hydrogen-containing polysiloxane, and the hydrogen-containing polysiloxane is any one or more of terminal hydrogen-containing polydiorganosiloxane, side hydrogen-containing polydiorganosiloxane and terminal hydrogen-containing and side hydrogen-containing polydiorganosiloxane; the platinum catalyst is a Karster catalyst; the inhibitor is an alkynol hydrosilylation inhibitor, and the alkynol hydrosilylation inhibitor is any one or more of 2-methyl-3-butyn-2-ol, 1-ethynyl cyclohexanol and 2-propyn-1-ol.
4. The silicone adhesive composition containing an antistatic compound as set forth in claim 2, wherein: the solvent is one or more of ethyl acetate, butyl acetate, petroleum ether, toluene, xylene, m-xylene and butanone.
5. The silicone adhesive composition containing an antistatic compound as set forth in claim 1, wherein: the antistatic compound has the following structural formula:
and/or
In the structural formula, the structural formula is shown in the specification,
a. b and c are natural numbers, wherein a is more than or equal to 100 and more than or equal to 1, b is more than or equal to 100 and more than or equal to 1, and c is more than or equal to 100 and more than or equal to 1;
m and n are natural numbers, wherein m is more than or equal to 10 and more than or equal to 1, n is more than or equal to 10 and more than or equal to 1;
x is bivalent saturated alkyl, and has a structural general formula of C q H 2q Q is a natural number, and q is more than or equal to 10 and more than or equal to 1;
y is bivalent saturated alkyl, and has a structural general formula of C i H 2i I is an integer, and is more than or equal to 10 and more than or equal to 0;
R 1 、R 2 、R 3 and R is 4 Is a monovalent saturated alkyl structure, and has a general structural formula of-C p H 2p+1 P is a natural number, and p is more than or equal to 10 and more than or equal to 1;
R 5 、R 6 、R 7 and R is 8 Is any one of hydrogen atom and monovalent saturated alkyl structure, and has a general structural formula of-C t H 2t+1 T is an integer, and 10 is more than or equal to t is more than or equal to 0.
6. A protective film tape, characterized in that: the adhesive tape comprises a protective film, an organic silica gel adhesive composition containing an antistatic agent compound and a PET (polyethylene terephthalate) substrate; the protective film is bonded to the PET substrate by an organosilicon adhesive composition containing an antistatic agent compound.
7. The protective film tape of claim 1, wherein: the PET substrate is of optical grade, and the film thickness of the substrate is 5-100 micrometers; the thickness of the silicone adhesive composition containing the antistatic agent compound is 2-50 micrometers.
8. The protective film tape of claim 7, wherein: the preparation method of the protective film adhesive tape comprises the following steps: and directly coating the organic silica gel adhesive composition containing the antistatic agent compound on a PET substrate, wherein the curing temperature is 100-180 ℃, the curing time is 1-5min, and the protective film is attached to the surface of the cured organic silica pressure-sensitive adhesive to obtain the protective film adhesive tape.
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