CN116117015A

CN116117015A - Electronic component forming process

Info

Publication number: CN116117015A
Application number: CN202211572093.6A
Authority: CN
Inventors: 翟保利; 冯嘉; ***
Original assignee: Dongguan Guanjia Electronic Equipment Co Ltd
Current assignee: Dongguan Guanjia Electronic Equipment Co Ltd
Priority date: 2022-12-08
Filing date: 2022-12-08
Publication date: 2023-05-16

Abstract

The invention relates to the technical field of nonstandard automation, in particular to an electronic element forming process, which comprises a turntable device, a feeding device, a correction device, a forming device, a shaping device, a pin sleeve device, a ring clamp device and a blanking device, wherein a plurality of clamping assemblies are arranged on the turntable device in a surrounding manner, the clamping assemblies are used for clamping and fixing electronic elements, and the turntable device is used for driving the clamping assemblies and the clamped electronic elements to rotate and drive; the feeding device is used for grabbing and placing the electronic element into the clamping assembly; the correction device is used for centering and correcting the electronic element clamped by the clamping assembly; the molding device is used for bending and molding pins of the electronic element clamped by the clamping assembly; the shaping device bends and shapes the bent pins. The utility model provides a current manual work shaping degree of difficulty height of bending, the sleeve pipe degree of difficulty is high scheduling problem, has realized comprehensive automation, and structural accuracy is high, uses manpower sparingly, and production efficiency is high.

Description

Electronic component forming process

Technical Field

The invention relates to the technical field of nonstandard automation, in particular to a molding process of an electronic element.

Background

Automation technology is widely used in industry, agriculture, military, scientific research, transportation, commerce, medical, services, and households. By adopting the automation technology, people can be liberated from heavy physical labor, partial mental labor and severe and dangerous working environments, the organ functions of the people can be expanded, the labor productivity is greatly improved, and the ability of the people to know and reform the world is enhanced. Large-scale complete equipment, also known as automation equipment, in an automation system. Refers to a process in which a machine or device automatically operates or controls in accordance with a prescribed program or instruction without human intervention.

In the production process of the electronic element diode, the sleeve is sleeved outside, the pins are bent and formed into the specified shape, the existing process is mostly completed through manual operation, the pins are bent through the jig, the efficiency is low in the bending process, the manual operation cost is high, and the forming precision is difficult to master.

Disclosure of Invention

In order to solve the problems, the invention provides the electronic element forming process which solves the problems of high difficulty in manual bending and forming, high sleeve difficulty and the like in the prior art, realizes comprehensive automation, has high structural precision, saves manpower and has high production efficiency.

The technical scheme adopted by the invention is as follows: the electronic component forming process comprises a turntable device, a feeding device, a correction device, a forming device, a shaping device, a pin sleeve device, a ring clamping device and a blanking device, wherein a plurality of clamping assemblies are arranged on the turntable device in a surrounding mode, the clamping assemblies are used for clamping and fixing electronic components, and the turntable device is used for driving the clamping assemblies and the clamped electronic components to rotate and drive; the feeding device is used for grabbing and placing the electronic element into the clamping assembly; the correcting device is used for centering and correcting the electronic element clamped by the clamping assembly; the molding device is used for bending and molding pins of the electronic element clamped by the clamping assembly; the shaping device bends and shapes the bent pins; the pin sleeve device is used for sleeving the sleeve on the shaped pin; the ring clamp device is used for clamping the sleeve on the pin and sleeving the sleeve in place; the blanking device is used for grabbing and blanking the formed and sleeved electronic element from the clamping assembly;

The forming device comprises a forming support frame, a forming lifting assembly, a forming clamping assembly, a first rolling forming assembly and a second rolling forming assembly, wherein the forming lifting assembly comprises a forming lifting driving module arranged on the forming support frame and a forming lifting bracket arranged on the driving end of the forming lifting driving module; the forming clamping assembly comprises a positioning module which is arranged on the forming lifting bracket, is positioned at two sides of the forming clamping assembly and is used for positioning pins of the electronic element, and clamping claws which are connected with the forming clamping assembly and are used for clamping and fixing two ends of the electronic element, wherein the positioning module is used for positioning one side of the pins of the electronic element; the first roll forming assembly is arranged on the forming lifting bracket and is positioned at one side of the forming clamping assembly, and is provided with a first press roll which is used for roll forming the clamping claw and one pin positioned by the positioning module; the second roll forming assembly is arranged on one side of the forming lifting bracket, which is far away from the first roll forming assembly, and is provided with a second press roll which is used for roll forming the clamping claw and the other pin positioned by the positioning module;

The shaping device is symmetrically provided with two groups of pins for shaping the electronic component, and comprises a shaping bracket, a shaping pushing cylinder arranged on the shaping bracket, a shaping sliding plate connected with the shaping pushing cylinder and a shaping module arranged on the shaping sliding plate, wherein the shaping module comprises a first shaping cylinder, a shaping connecting rod connected with the first shaping cylinder and a shaping block connected with the shaping connecting rod, the shaping block is provided with a shaping groove, one side of the shaping groove is provided with a bending connecting rod, the bending connecting rod is connected with a second shaping cylinder, the shaping groove is used for shaping the pins of the electronic component, and the second shaping cylinder is used for driving the bending connecting rod to bend the pins on the shaping groove;

the bending forming process comprises the following steps:

s1, the electronic element is grabbed by the feeding device, the grabbed electronic element is horizontally placed to the clamping assembly in a remote mode, and the clamping assembly clamps and fixes the electronic element;

s2, the turntable device rotates and drives the clamping assembly and the electronic element to rotate and convey to the correction device, and the correction device corrects the electronic element on the clamping assembly in a centered manner;

S3, continuously rotating the turntable device and driving the corrected electronic element to be conveyed to a forming device, driving the forming clamping assembly to clamp two ends of the electronic element by the forming lifting assembly, positioning pins, and carrying out roll forming through pins at two ends of the first roll forming assembly and the second roll forming assembly after positioning;

s4, continuously rotating the turntable device, driving the electronic element formed by the pins to be conveyed to the forming device, positioning the formed pins by the forming device through the forming groove, and driving the bending connecting rod to press the pins onto the forming groove under the action of the second forming cylinder after positioning, so as to realize secondary bending forming;

s5, continuously rotating the turntable device, driving the electronic element of the secondary bending and shaping pin to be conveyed to the pin sleeve device, and sleeving the pin sleeve device into a sleeve for the secondary bending and shaping pin;

s6, continuously rotating the turntable device, driving the electronic element with the pins sleeved in the sleeve to be conveyed to the ring clamp device, and clamping and pressing the sleeve to the pins by the ring clamp device;

and S7, continuously rotating the turntable device, driving the electronic element with the sleeve on the pin pressed in place to be conveyed to the blanking device, and grabbing and blanking the electronic element by the blanking device.

The turntable device comprises a turntable driving module, a disc connected with the turntable driving module and an open clamp driving assembly positioned at the lower side of the disc and used for driving the clamp assembly to open clamp;

the clamping assembly comprises a clamping base, a clamping connecting rod arranged on the clamping base and a fixed clamping jaw connected to the clamping connecting rod, wherein the clamping driving assembly comprises a clamping driving cylinder, and the clamping driving cylinder is used for driving the clamping connecting rod to drive the fixed clamping jaw to clamp.

The feeding device comprises a linear cylinder, a first transfer assembly and a second transfer assembly which are connected with the linear cylinder, and a rotary positioning assembly for positioning electronic elements;

the technical scheme is further improved that the first transfer assembly comprises a first lifting air cylinder, a first rotary air cylinder connected with the first lifting air cylinder and a first air claw connected with the first rotary air cylinder, the linear air cylinder is used for driving the first transfer assembly to drive the electronic element to transfer, and the first rotary air cylinder is used for driving the electronic element clamped by the first air claw to be overturned and put into the rotary positioning assembly;

The technical scheme is further improved that the second transfer assembly comprises a second lifting cylinder and a second air claw connected with the second lifting cylinder, and the second air claw is used for grabbing and putting the electronic element on the rotary positioning assembly into the clamping assembly;

the rotary positioning assembly comprises a second rotary cylinder and a third air claw connected with the second rotary cylinder, wherein the third air claw is used for clamping an electronic component, and the second rotary cylinder is used for driving the third air claw to rotate and can drive the electronic component to rotate.

The correction device comprises a correction support, a correction lifting cylinder arranged on the correction support and two groups of correction clamping cylinders symmetrically connected to two sides of the correction lifting cylinder, wherein the correction clamping cylinders are connected with correction clamping jaws, and the two groups of correction clamping cylinders are used for driving the correction clamping jaws to center and correct electronic elements.

The forming lifting bracket comprises a base plate connected with a forming lifting driving module and a T-shaped plate which is adjustably arranged on the base plate, wherein the forming clamping assembly and the first rolling forming assembly are both arranged on the base plate, and the second rolling forming assembly is arranged on one side of the T-shaped plate;

The technical scheme is further improved that the T-shaped plate is provided with a main shaft hole for connecting a substrate and an adjusting pull groove, the adjusting pull groove is arc-shaped, and the T-shaped plate is arranged on the substrate in an adjustable manner by taking the main shaft hole as the center through the adjusting pull groove;

the technical scheme is further improved that the positioning module is a positioning plate arranged on two sides of the forming clamping assembly, the positioning plate extends towards the forming clamping assembly to form a positioning block, the positioning block is provided with a positioning shaft pin, and the positioning shaft pin is provided with a positioning needle;

the clamping claw is an L-shaped clamping claw, the L-shaped clamping claw comprises a clamping surface and a positioning surface, the clamping surface is used for clamping and fixing the end face of the electronic element, the positioning needle is used for positioning a pin on one side of the electronic element, and the positioning surface is used for positioning the pin on the other side of the electronic element.

The technical scheme is further improved that the first roll forming assembly is provided with a first roll driving cylinder and a first roll pressing block connected with the first roll driving cylinder, the first roll pressing block is installed on the first roll pressing block, a first roll pressing groove is formed in the outer diameter of the first roll pressing block, the first roll pressing block is provided with a first adjusting shaft, and the first roll pressing block is adjustably installed on the first roll pressing block through the first adjusting shaft;

The technical scheme is further improved that the second rolling forming assembly is provided with a second rolling driving cylinder and a second rolling block connected with the second rolling driving cylinder, the second rolling block is installed on the second rolling block, and the second rolling driving cylinder is obliquely installed on the forming lifting bracket;

the improvement of the scheme is that the outer diameter of the second press roller is provided with a second roller groove, the second press roller is provided with a second adjusting shaft, and the second press roller is adjustably arranged on a second roller pressing block through the second adjusting shaft.

The pin sleeve device comprises a sleeve discharging assembly, a sleeve guiding assembly, a sleeve driving assembly, a sleeve positioning assembly, a sleeving assembly and a cutting assembly, wherein the sleeve guiding assembly is used for guiding sleeve positioning, the sleeve driving assembly is used for driving the sleeve to discharge, the sleeve positioning assembly is used for clamping and positioning the sleeve, the sleeving assembly is used for clamping and sleeving the sleeve to a pin, and the cutting assembly is used for cutting the sleeve;

the sleeve discharging assembly is positioned above the sleeve guiding assembly and used for discharging the sleeve into the sleeve guiding assembly, the sleeve driving assembly comprises a driving wheel and a driven wheel, a gap is reserved between the driving wheel and the driven wheel, the driving wheel is connected with a driving motor, and the driving motor is used for driving the driving wheel and synchronously driving the driven wheel to convey the sleeve on the gap;

The sleeve positioning assembly comprises a positioning shaft sleeve positioned below the gap and sleeve clamping jaws, wherein the sleeve clamping jaws are used for clamping and positioning a sleeve led out of the positioning shaft sleeve, the cutting assembly is positioned above the sleeve positioning assembly and provided with a cutter, and the cutter is used for cutting the sleeve led out of the positioning shaft sleeve;

the telescopic assembly comprises a telescopic lifting cylinder and a telescopic clamping jaw connected with the telescopic lifting cylinder, wherein the telescopic clamping jaw is used for clamping and sleeving the cut sleeve to the pin.

The ring clamp device comprises a ring clamp bracket, a first ring clamp lifting cylinder, a second ring clamp lifting cylinder and a ring clamp air claw, wherein the first ring clamp lifting cylinder is installed on the ring clamp bracket, the second ring clamp lifting cylinder is connected with the first ring clamp lifting cylinder, the ring clamp air claw is connected with a pipe clamp claw, a first pipe clamp groove and a second pipe clamp groove are formed in the pipe clamp claw, a first pipe clamp fixing ring is installed in the first pipe clamp groove, and a second pipe clamp fixing ring is installed in the second pipe clamp groove;

the technical proposal is further improved that the ring air clamping claw is used for driving the pipe pressing clamping claw to drive the first pipe pressing groove and the second pipe pressing groove to clamp two pins of the electronic element, and the sleeve is pressed under the action of the first pipe pressing fixing ring and the second pipe pressing fixing ring;

The further improvement to above-mentioned scheme does, unloader includes the unloading support, installs the unloading sharp module at the unloading support, installs the unloading lifting module at unloading sharp module and installs the unloading at unloading lifting module snatchs the subassembly, the unloading snatchs the subassembly and is used for snatching electronic component unloading on the clamping component.

The beneficial effects of the invention are as follows:

compared with the existing electronic element pin bending molding, the invention adopts full automation, the feeding device feeds the electronic element to the clamping element, the clamping assembly on the turntable clamps the electronic element and rotates and transmits the electronic element under the action of the turntable device, the correction device corrects the position of the electronic element in the middle, the pin is bent and molded to a designated shape through the molding device after correction, the pin is bent and molded for the second time through the molding device, the sleeve is sleeved on the pin through the pin sleeve device after positioning, the sleeve is clamped through the ring clamping device, and finally the electronic element is discharged. The whole process is completed by full automation without manual operation, so that the problems of high difficulty in the conventional manual bending and forming process, high difficulty in the sleeve and the like are solved, comprehensive automation is realized, the structural precision is high, the manpower is saved, and the production efficiency is high. The electronic component clamping device comprises a turntable device, a feeding device, a correction device, a forming device, a pin sleeve device, a ring clamp device and a discharging device, wherein a plurality of clamping assemblies are arranged on the turntable device in a surrounding mode, the clamping assemblies are used for clamping and fixing the electronic component, and the turntable device is used for driving the clamping assemblies and the clamped electronic component to rotate and drive; the feeding device is used for grabbing and placing the electronic element into the clamping assembly; the correcting device is used for centering and correcting the electronic element clamped by the clamping assembly; the molding device is used for bending and molding pins of the electronic element clamped by the clamping assembly; the shaping device bends and shapes the bent pins; the pin sleeve device is used for sleeving the sleeve on the shaped pin; the ring clamp device is used for clamping the sleeve on the pin and sleeving the sleeve in place; the blanking device is used for grabbing and blanking the formed electronic element and the sleeve from the clamping assembly. The whole process is fully automatic, labor is saved, manual interference is not needed, and the degree of automation is high.

The forming device comprises a forming support frame, a forming lifting assembly, a forming clamping assembly, a first rolling forming assembly and a second rolling forming assembly, wherein the forming lifting assembly comprises a forming lifting driving module arranged on the forming support frame and a forming lifting bracket arranged on the driving end of the forming lifting driving module; the forming clamping assembly comprises a positioning module which is arranged on the forming lifting bracket, is positioned at two sides of the forming clamping assembly and is used for positioning pins of the electronic element, and clamping claws which are connected with the forming clamping assembly and are used for clamping and fixing two ends of the electronic element, wherein the positioning module is used for positioning one side of the pins of the electronic element; the first roll forming assembly is arranged on the forming lifting bracket and is positioned at one side of the forming clamping assembly, and is provided with a first press roll which is used for roll forming the clamping claw and one pin positioned by the positioning module; the second roll forming assembly is arranged on one side of the forming lifting support, far away from the first roll forming assembly, and is provided with a second press roller used for roll forming the clamping claw and the other pin positioned by the positioning module. Diode both ends and pin are fixed and the location through shaping clamping assembly in the shaping in-process, carry out the roll forming through the roll forming subassembly of two sets of diode both ends after the location, and the shaping fixed subassembly is pressed from both sides electronic component tightly fixedly at this in-process, has guaranteed the fashioned stability of structure, has solved current high to electronic component pin shaping degree of difficulty, especially dysmorphism pin shaping, realizes automatic pin shaping, and shaping is effectual, and structural accuracy is high. The whole shaping process is, shaping fixed subassembly is rotatory to shaping clamping assembly below under the carousel effect, drives shaping lifting support and descends under the effect of shaping lifting drive module, and the pin that the locating module was to electronic component both ends is fixed a position when descending to appointed position, and shaping clamping assembly drive gripper simultaneously fixes a position electronic component's both ends and pin, and then locating module and gripper cooperation have fixed a position the both sides of pin, carry out the roll-in shaping to the pin at both ends under the effect of two sets of roll-in shaping subassemblies after the location, have realized the pin shaping of full automatization.

The bending forming process comprises the following steps: s1, the electronic element is grabbed by the feeding device, the grabbed electronic element is horizontally placed to the clamping assembly in a remote mode, and the clamping assembly clamps and fixes the electronic element; s2, the turntable device rotates and drives the clamping assembly and the electronic element to rotate and convey to the correction device, and the correction device corrects the electronic element on the clamping assembly in a centered manner; s3, continuously rotating the turntable device and driving the corrected electronic element to be conveyed to a forming device, driving the forming clamping assembly to clamp two ends of the electronic element by the forming lifting assembly, positioning pins, and carrying out roll forming through pins at two ends of the first roll forming assembly and the second roll forming assembly after positioning; s4, continuously rotating the turntable device, driving the electronic element formed by the pins to be conveyed to the forming device, positioning the formed pins by the forming device through the forming groove, and driving the bending connecting rod to press the pins onto the forming groove under the action of the second forming cylinder after positioning, so as to realize secondary bending forming; s5, continuously rotating the turntable device, driving the electronic element of the secondary bending and shaping pin to be conveyed to the pin sleeve device, and sleeving the pin sleeve device into a sleeve for the secondary bending and shaping pin; s6, continuously rotating the turntable device, driving the electronic element with the pins sleeved in the sleeve to be conveyed to the ring clamp device, and clamping and pressing the sleeve to the pins by the ring clamp device; and S7, continuously rotating the turntable device, driving the electronic element with the sleeve on the pin pressed in place to be conveyed to the blanking device, and grabbing and blanking the electronic element by the blanking device. The steps are adopted to realize the full-automatic electronic element pin forming, shaping and sleeving, the whole process is high in automation degree, manual interference is not needed, and the production efficiency is high.

Drawings

FIG. 1 is a schematic perspective view of a molding apparatus of the present invention;

FIG. 2 is a schematic perspective view of the molding apparatus of FIG. 1 from another perspective;

FIG. 3 is a schematic perspective view of a turntable assembly of the molding apparatus of FIG. 1;

FIG. 4 is a schematic perspective view of a loading device of the molding apparatus of FIG. 1;

FIG. 5 is a schematic perspective view of a calibration device of the molding apparatus of FIG. 1;

FIG. 6 is a schematic perspective view of a molding apparatus of the molding apparatus of FIG. 1;

FIG. 7 is a schematic view of a portion of the molding apparatus of FIG. 6;

FIG. 8 is a schematic view of a portion of the molding apparatus of FIG. 6 from another perspective;

FIG. 9 is a schematic view of a first roll forming assembly of the forming apparatus of FIG. 6;

FIG. 10 is a schematic view of a second roll forming assembly of the forming apparatus of FIG. 6;

FIG. 11 is a schematic perspective view of a sizing device of the molding apparatus of FIG. 1;

FIG. 12 is a schematic view of a portion of the shaping device of FIG. 11;

FIG. 13 is a schematic perspective view of a pin bushing apparatus of the molding apparatus of FIG. 1;

FIG. 14 is an enlarged schematic view of FIG. 13A;

FIG. 15 is a schematic perspective view of a ring binder device of the molding apparatus of FIG. 1;

FIG. 16 is a schematic perspective view of a blanking apparatus of the molding apparatus of FIG. 1;

FIG. 17 is a schematic flow chart of the molding process of the present invention.

Reference numerals illustrate: the turntable device 1, the clamping assembly 11, the clamping base 111, the clamping connecting rod 112, the fixed clamping jaw 113, the turntable driving module 12, the disc 13, the clamping opening driving assembly 14 and the clamping opening driving cylinder 141;

the feeding device 2, the linear cylinder 21, the first transfer component 22, the first lifting cylinder 221, the first rotary cylinder 222, the first air claw 223, the second transfer component 23, the second lifting cylinder 231, the second air claw 232, the rotary positioning component 24, the second rotary cylinder 241, the third air claw 242,

The correction device 3, the correction bracket 31, the correction lifting cylinder 32, the correction clamping cylinder 33 and the correction clamping jaw 34;

the molding device 4, the molding support 41, the molding lifting assembly 42, the lifting driving module 421, the molding lifting support 422, the base plate 4221, the T-shaped plate 4222, the molding clamping assembly 43, the positioning module 431, the positioning plate 4311, the positioning block 4312, the positioning shaft pin 4313, the positioning needle 4314, the clamping claw 432, the clamping surface 4321, the positioning surface 4322, the first roll molding assembly 44, the first press roll 441, the first roll driving cylinder 442, the first roll pressing block 443, the first roll groove 444, the first adjusting shaft 445, the second roll molding assembly 45, the second press roll 451, the second roll driving cylinder 452, the second roll pressing block 453, the second roll groove 454, and the second adjusting shaft 455;

The shaping device 5, the shaping bracket 51, the shaping pushing cylinder 52, the shaping sliding plate 53, the shaping module 54, the first shaping cylinder 541, the shaping connecting rod 542, the shaping block 543, the shaping slot 544, the shaping slot 545, the bending connecting rod 546 and the second shaping cylinder 547;

pin sleeve device 6, sleeve discharging assembly 61, sleeve guiding assembly 62, sleeve driving assembly 63, driving wheel 631, driven wheel 632, driving motor 633, sleeve positioning assembly 64, positioning sleeve 641, sleeve clamping jaw 642, sleeving assembly 65, sleeving lifting cylinder 651, sleeving clamping jaw 652, and cutting assembly 66;

the ring clamp device 7, the ring clamp bracket 71, the first ring clamp lifting cylinder 72, the second ring clamp lifting cylinder 73, the ring clamp air claw 74, the pipe clamp claw 75, the first pipe clamp groove 751 and the second pipe clamp groove 752;

the blanking device 8, a blanking bracket 81, a blanking linear module 82, a blanking lifting module 83 and a blanking grabbing module 84.

Detailed Description

In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

As shown in fig. 1 to 17, in one embodiment of the present invention, the pin bending process includes the steps of: s1, the electronic element is grabbed by the feeding device, the grabbed electronic element is horizontally placed to the clamping assembly in a remote mode, and the clamping assembly clamps and fixes the electronic element; s2, the turntable device rotates and drives the clamping assembly and the electronic element to rotate and convey to the correction device, and the correction device corrects the electronic element on the clamping assembly in a centered manner; s3, continuously rotating the turntable device and driving the corrected electronic element to be conveyed to a forming device, driving the forming clamping assembly to clamp two ends of the electronic element by the forming lifting assembly, positioning pins, and carrying out roll forming through pins at two ends of the first roll forming assembly and the second roll forming assembly after positioning; s4, continuously rotating the turntable device, driving the electronic element formed by the pins to be conveyed to the forming device, positioning the formed pins by the forming device through the forming groove, and driving the bending connecting rod to press the pins onto the forming groove under the action of the second forming cylinder after positioning, so as to realize secondary bending forming; s5, continuously rotating the turntable device, driving the electronic element of the secondary bending and shaping pin to be conveyed to the pin sleeve device, and sleeving the pin sleeve device into a sleeve for the secondary bending and shaping pin; s6, continuously rotating the turntable device, driving the electronic element with the pins sleeved in the sleeve to be conveyed to the ring clamp device, and clamping and pressing the sleeve to the pins by the ring clamp device; and S7, continuously rotating the turntable device, driving the electronic element with the sleeve on the pin pressed in place to be conveyed to the blanking device, and grabbing and blanking the electronic element by the blanking device. The steps are adopted to realize the full-automatic electronic element pin forming, shaping and sleeving, the whole process is high in automation degree, manual interference is not needed, and the production efficiency is high.

As shown in fig. 1 to 16, the molding equipment for realizing the above embodiment is provided with a turntable device 1, a feeding device 2, a correction device 3, a molding device 4, a shaping device 5, a pin sleeve device 6, a ring clamping device 7 and a blanking device 8, wherein a plurality of clamping assemblies 11 are arranged on the turntable device 1 in a surrounding manner, the clamping assemblies 11 are used for clamping and fixing electronic components, and the turntable device 1 is used for driving the clamping assemblies 11 and the clamped electronic components to rotate and drive; the feeding device 2 is used for grabbing and placing the electronic components into the clamping assembly 11; the correcting device 3 is used for centering and correcting the electronic component clamped by the clamping assembly 11; the molding device 4 is used for bending and molding pins of the electronic component clamped by the clamping assembly 11; the shaping device 5 bends and shapes the bent pins; the pin sleeve device 6 is used for sleeving the shaped pins with sleeves; the ring clamping device 7 is used for clamping the sleeve on the pin and sleeving the sleeve in place; the blanking device 8 is used for grabbing and blanking the formed and sleeved electronic components from the clamping assembly 11.

Referring to fig. 3, a further modification of the above embodiment is that the turntable device 1 includes a turntable driving module 12, a disk 13 connected to the turntable driving module 12, and an open clamp driving assembly 14 located at the lower side of the disk 13 and used for driving the clamp assembly 11 to open clamp; the rotary disc driving module 12 drives the disc 13 to rotate, and the clamping assembly 11 is driven to rotate during rotation, so that the electronic components are conveyed.

In a further improvement of the above embodiment, the clamping assembly 11 includes a clamping base 111, a clamping link 112 mounted on the clamping base 111, and a fixed clamping jaw 113 connected to the clamping link 112, the open clamp driving assembly 14 includes an open clamp driving cylinder 141, the open clamp driving cylinder 141 is used for driving the clamping link 112 to drive the fixed clamping jaw 113 to open clamp, and the open clamp driving cylinder 141 drives the clamping link 112 to drive the fixed clamping jaw 113 to open clamp, so as to be used for releasing the electronic component clamped by the electronic component.

As shown in fig. 4, a further improvement of the above embodiment is that the feeding device 2 includes a linear cylinder 21, a first transfer assembly 22 and a second transfer assembly 23 connected to the linear cylinder 21, and a rotational positioning assembly 24 for positioning electronic components; in the feeding process, the first transfer assembly 22 and the second transfer assembly 23 are driven to work alternately through the linear cylinder 21, so that automatic feeding is realized.

In a further improvement of the above embodiment, the first transferring assembly 22 includes a first lifting cylinder 221, a first rotating cylinder 222 connected to the first lifting cylinder 221, and a first air claw 223 connected to the first rotating cylinder 222, where the linear cylinder 21 is used to drive the first transferring assembly 22 to transfer electronic components, and the first rotating cylinder 222 is used to drive the electronic components clamped by the first air claw 223 to flip and put into the rotating positioning assembly 24; the second transfer assembly 23 comprises a second lifting cylinder 231 and a second air claw 232 connected with the second lifting cylinder 231, wherein the second air claw 232 is used for grabbing and placing the electronic components on the rotary positioning assembly 24 into the clamping assembly 11; the rotary positioning assembly 24 includes a second rotary cylinder 241, and a third air claw 242 connected to the second rotary cylinder 241, where the third air claw 242 is used to clamp the electronic component, and the second rotary cylinder 241 is used to drive the third air claw 242 to rotate and can drive the electronic component to rotate.

As shown in fig. 5, a further improvement of the above embodiment is that the correction device 3 includes a correction bracket 31, a correction lifting cylinder 32 installed on the correction bracket 31, and two sets of correction clamping cylinders 33 symmetrically connected to two sides of the correction lifting cylinder 32, where the correction clamping cylinders 33 are connected with correction clamping jaws 34, the two sets of correction clamping cylinders 33 are used for driving the correction clamping jaws 34 to correct the electronic component centrally, and the two sets of correction clamping cylinders 33 are used for driving the correction clamping jaws 34 to correct the electronic component tightly centrally, so that the subsequent forming is convenient.

Referring to fig. 6 to 10, a further improvement of the above embodiment is that the forming device 4 includes a forming support frame 41, a forming lifting assembly 42, a forming clamping assembly 43, a first rolling forming assembly 44, and a second rolling forming assembly 45, where the forming lifting assembly 42 includes a forming lifting driving module 421 installed on the forming support frame 41, and a forming lifting support 422 installed on a driving end of the forming lifting driving module 421; the forming clamping assembly 43 comprises a positioning module 431 installed on the forming lifting support 422 and located at two sides of the forming clamping assembly 43 and used for positioning pins of the electronic component, and a clamping claw 432 connected to the forming clamping assembly 43 and used for clamping and fixing two ends of the electronic component, wherein the positioning module 431 is used for positioning one side of the pins of the electronic component; the first roll forming assembly 44 is installed on the forming lifting support 422 and located at one side of the forming clamping assembly 43, the first roll forming assembly 44 is provided with a first compression roller 441, and the first compression roller 441 is used for roll forming one pin positioned by the clamping claw 432 and the positioning module 431; the second roll forming assembly 45 is installed on one side of the forming lifting support 422, which is far away from the first roll forming assembly 44, the second roll forming assembly 45 is provided with a second press roller 451, and the second press roller 451 is used for roll forming another pin positioned by the clamping claw 432 and the positioning module 431. Diode both ends and pin are fixed and the location through shaping clamping assembly 43 in the shaping in-process, carry out the roll forming through the roll forming subassembly of two sets of diode both ends after the location, and the shaping fixed subassembly presss from both sides tightly fixed electronic component at this in-process, has guaranteed the fashioned stability of structure, has solved current high to electronic component pin shaping degree of difficulty, especially dysmorphism pin shaping, realizes automatic pin shaping, and shaping is effectual, and structural accuracy is high. The whole molding process is that the molding fixed assembly rotates to the lower part of the molding clamping assembly 43 under the action of the turntable, the molding lifting support 422 is driven to descend under the action of the molding lifting driving module 421, the positioning module 431 positions pins at two ends of an electronic element when descending to a specified position, the molding clamping assembly 43 drives the clamping claw 432 to simultaneously position the two ends and the pins of the electronic element, the positioning module 431 and the clamping claw 432 cooperate to position two sides of the pins, the pins at the two ends are roll-molded under the action of the two groups of roll-molding assemblies after positioning, and full-automatic pin molding is realized.

Further improvements to the above embodiments include a forming lift bracket 422 including a base plate 4221 connected to a forming lift driving module 421, and a T-shaped plate 4222 adjustably mounted to the base plate 4221, wherein the forming clamp assembly 43 and the first roll forming assembly 44 are both mounted to the base plate 4221, and the second roll forming assembly 45 is mounted to one side of the T-shaped plate 4222; the forming lift driving module 421 designed by a sliding table cylinder can be used to drive the forming lift support 422 to rise and fall, in addition, the forming lift support 422 has a base plate 4221 for structural installation, and a T-shaped plate 4222 is used for installation of the second roll forming assembly 45.

In a further improvement of the above embodiment, the T-shaped plate 4222 is provided with a spindle hole for connecting the base plate 4221 and an adjusting slot, the adjusting slot is arc-shaped, and the T-shaped plate 4222 is adjustably mounted on the base plate 4221 by taking the spindle hole as a center through the adjusting slot; the spindle holes are formed to allow the T-shaped plates 4222 to be rotatably adjusted, thereby adjusting the angle of the pins to be formed.

In a further improvement of the above embodiment, the positioning module 431 is positioning plates 4311 installed at two sides of the forming clamping assembly 43, the positioning plates 4311 extend towards the forming clamping assembly 43 to form positioning blocks 4312, the positioning blocks 4312 are provided with positioning shaft pins 4313, and the positioning shaft pins 4313 are provided with positioning needles 4314; the clamping claw 432 is an L-shaped clamping claw, the L-shaped clamping claw comprises a clamping surface 4321 and a positioning surface 4322, the clamping surface 4321 is used for clamping and fixing the end surface of the electronic element, the positioning needle 4314 is used for positioning a pin on one side of the electronic element, and the positioning surface 4322 is used for positioning the pin on the other side of the electronic element; in this embodiment, the clamping surface 4321 and the positioning surface 4322 of the L-shaped clamping jaw are used for positioning the pins, and the other side of the pins is positioned under the action of the positioning needle 4314, so that two-side positioning is formed, and the pin is more stable and has higher precision when being rolled, bent and formed.

In a further improvement of the above embodiment, the first roll forming assembly 44 is provided with a first roll driving cylinder 442 and a first roll pressing block 443 connected to the first roll driving cylinder 442, the first press roll 441 is installed on the first roll pressing block 443, a first roll groove 444 is formed in the outer diameter of the first press roll 441, the first press roll 441 is provided with a first adjusting shaft 445, and the first press roll 441 is adjustably installed on the first roll pressing block 443 through the first adjusting shaft 445; in this embodiment, the first roller block 443 is driven by the first roller driving cylinder 442 to drive the first roller 441 to roll the pins to form, and the first roller groove 444 is provided for matching rolling, so that rolling is stable, and in addition, the first roller block 443 is provided with the first adjusting shaft 445 to be adjusted adaptively, so that the utility is better.

In a further improvement of the above embodiment, the second roll forming assembly 45 is provided with a second roll driving cylinder 452 and a second roll pressing block 453 connected to the second roll driving cylinder 452, the second press roll 451 is installed on the second roll pressing block 453, and the second roll driving cylinder 452 is obliquely installed on the forming lifting support 422; the outer diameter of the second press roll 451 is provided with a second roll groove 454, the second press roll 451 is provided with a second adjusting shaft 455, and the second press roll 451 is adjustably arranged on the second roll block 453 through the second adjusting shaft 455; in this embodiment, the driving structure installed obliquely is adopted, and the adjustment can be performed according to the forming directions of different angles, and in the rolling process, the second rolling block 453 is driven by the second rolling driving cylinder 452 to drive the second rolling block 453 to form the pin roll.

Referring to fig. 11 to 12, a further improvement of the above embodiment is that the shaping device 5 is symmetrically provided with two groups of two pins for shaping the electronic component, the shaping device 5 includes a shaping bracket 51, a shaping pushing cylinder 52 installed on the shaping bracket 51, a shaping sliding plate 53 connected to the shaping pushing cylinder 52, and a shaping module 54 installed on the shaping sliding plate 53, the shaping module 54 includes a first shaping cylinder 541, a shaping connecting rod 542 connected to the first shaping cylinder 541, and a shaping block 543 connected to the shaping connecting rod 542, the shaping block 543 is provided with a shaping slot 544, one side of the shaping slot 544 is provided with a shaping slot 545, one side of the shaping slot 545 is provided with a bending connecting rod 546, the bending connecting rod 546 is connected with a second shaping cylinder 547, and the second shaping cylinder 547 is used for driving the bending connecting rod 546 to bend the pins on the shaping slot 545.

Referring to fig. 13-14, a further modification of the above embodiment is that the pin bushing apparatus 6 includes a bushing discharging assembly 61, a bushing guiding assembly 62 for guiding the bushing positioning, a bushing driving assembly 63 for driving the bushing discharging, a bushing positioning assembly 64 for clamping the bushing positioning, a telescoping assembly 65 for clamping and telescoping the bushing to the pin, and a cutting assembly 66 for cutting the bushing; the sleeve discharging assembly 61 is used for sleeve discharging, the sleeve driving assembly 63 is used for driving the sleeve to be guided and conveyed through the sleeve guiding assembly 62, the sleeve positioning assembly 64 is used for positioning and matching the sleeve sleeving assembly 65 to sleeve the pin, and the cutting assembly 66 is used for cutting the sleeve.

A further improvement of the above embodiment is that the sleeve discharging assembly 61 is located above the sleeve guiding assembly 62 and is used for discharging the sleeve into the sleeve guiding assembly 62, the sleeve driving assembly 63 comprises a driving wheel 631 and a driven wheel 632, a gap is formed between the driving wheel 631 and the driven wheel 632, the driving wheel 631 is connected with a driving motor 633, and the driving motor 633 is used for driving the driving wheel 631 and the synchronous driven wheel 632 is used for conveying the sleeve on the gap; the sleeve positioning assembly 64 includes a positioning sleeve 641 positioned below the gap, and sleeve jaws 642 for clamping and positioning the sleeve guided by the positioning sleeve 641, and the cutting assembly 66 is positioned above the sleeve positioning assembly 64 and has a cutter for cutting the sleeve guided by the positioning sleeve 641.

A further improvement to the above embodiment, the sleeving assembly 65 includes a sleeving lifting cylinder 651, and a sleeving clamping jaw 652 connected to the sleeving lifting cylinder 651, wherein the sleeving clamping jaw 652 is used for clamping and sleeving the cut sleeve to the pin.

As shown in fig. 15, a further improvement of the above embodiment is that the ring clamp device 7 includes a ring clamp bracket 71, a first ring clamp lifting cylinder 72 mounted on the ring clamp bracket 71, a second ring clamp lifting cylinder 73 connected to the first ring clamp lifting cylinder 72, and a ring clamp air claw 74 connected to the second ring clamp lifting cylinder 73, the ring clamp air claw 74 is connected with a pipe pressing claw 75, a first pipe pressing groove 751 and a second pipe pressing groove 752 are formed in the pipe pressing claw 75, the first pipe pressing groove 751 is provided with a first pipe pressing fixing ring, and the second pipe pressing groove 752 is provided with a second pipe pressing fixing ring.

A further improvement of the above embodiment is that the ring air clamping claw 74 is used for driving the pipe pressing claw 75 to drive the first pipe pressing groove and the second pipe pressing groove to clamp two pins of the electronic component, and the sleeve is pressed under the action of the first pipe pressing fixing ring and the second pipe pressing fixing ring.

As shown in fig. 16, a further improvement of the above embodiment is that the blanking device 8 includes a blanking bracket 81, a blanking linear module 82 mounted on the blanking bracket 81, a blanking lifting module 83 mounted on the blanking linear module 82, and a blanking grabbing component 84 mounted on the blanking lifting module 83, where the blanking grabbing component 84 is used to grab the electronic component blanking on the clamping component 11.

According to the invention, full automation is adopted, the feeding device 2 feeds electronic elements to the clamping elements, the electronic elements are clamped through the clamping assemblies 11 on the turntable and are rotated and transmitted under the action of the turntable device 1, the correction device 3 corrects the positions of the electronic elements in a centered manner, the pins are bent and formed to a specified shape through the forming device 4 after correction, the pins are bent and formed for the second time through the forming device 5, the pins are sleeved with the sleeves through the pin sleeve device 6 after positioning, the sleeves are clamped through the ring clamping device 7, and finally the electronic elements are discharged. The whole process is completed by full automation without manual operation, so that the problems of high difficulty in the conventional manual bending and forming process, high difficulty in the sleeve and the like are solved, comprehensive automation is realized, the structural precision is high, the manpower is saved, and the production efficiency is high. Specifically, a turntable device 1, a feeding device 2, a correction device 3, a forming device 4, a shaping device 5, a pin sleeve device 6, a ring clamping device 7 and a blanking device 8 are arranged, a plurality of clamping assemblies 11 are arranged on the turntable device 1 in a surrounding mode, the clamping assemblies 11 are used for clamping and fixing electronic components, and the turntable device 1 is used for driving the clamping assemblies 11 and the clamped electronic components to rotate and drive; the feeding device 2 is used for grabbing and placing the electronic components into the clamping assembly 11; the correcting device 3 is used for centering and correcting the electronic component clamped by the clamping assembly 11; the molding device 4 is used for bending and molding pins of the electronic component clamped by the clamping assembly 11; the shaping device 5 bends and shapes the bent pins; the pin sleeve device 6 is used for sleeving the shaped pins with sleeves; the ring clamping device 7 is used for clamping the sleeve on the pin and sleeving the sleeve in place; the blanking device 8 is used for grabbing and blanking the formed and sleeved electronic components from the clamping assembly 11. The whole process is fully automatic, labor is saved, manual interference is not needed, and the degree of automation is high.

The foregoing examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims

1. An electronic component forming process is characterized in that: the forming device comprises a rotary table device, a feeding device, a correcting device, a forming device, a shaping device, a pin sleeve device, a ring clamping device and a blanking device, wherein a plurality of clamping assemblies are arranged on the rotary table device in a surrounding mode, the clamping assemblies are used for clamping and fixing electronic elements, and the rotary table device is used for driving the clamping assemblies and the clamped electronic elements to rotate and drive; the feeding device is used for grabbing and placing the electronic element into the clamping assembly; the correcting device is used for centering and correcting the electronic element clamped by the clamping assembly; the molding device is used for bending and molding pins of the electronic element clamped by the clamping assembly; the shaping device bends and shapes the bent pins; the pin sleeve device is used for sleeving the sleeve on the shaped pin; the ring clamp device is used for clamping the sleeve on the pin and sleeving the sleeve in place; the blanking device is used for grabbing and blanking the formed and sleeved electronic element from the clamping assembly;

the bending forming process comprises the following steps:

2. The electronic component molding process according to claim 1, wherein: the turntable device comprises a turntable driving module, a disc connected with the turntable driving module and an opening and clamping driving assembly positioned at the lower side of the disc and used for driving the clamping assembly to open and clamp;

the clamping assembly comprises a clamping base, a clamping connecting rod arranged on the clamping base and a fixed clamping jaw connected to the clamping connecting rod, and the opening and clamping driving assembly comprises an opening and clamping driving cylinder which is used for driving the clamping connecting rod to drive the fixed clamping jaw to open and clamp.

3. The electronic component molding process according to claim 1, wherein: the feeding device comprises a linear cylinder, a first transfer assembly and a second transfer assembly which are connected with the linear cylinder, and a rotary positioning assembly for positioning electronic elements;

the first transfer assembly comprises a first lifting cylinder, a first rotary cylinder connected with the first lifting cylinder and a first air claw connected with the first rotary cylinder, the linear cylinder is used for driving the first transfer assembly to drive the electronic element to transfer, and the first rotary cylinder is used for driving the electronic element clamped by the first air claw to be overturned and put into the rotary positioning assembly;

The second transfer assembly comprises a second lifting cylinder and a second air claw connected with the second lifting cylinder, and the second air claw is used for grabbing and putting the electronic element on the rotary positioning assembly into the clamping assembly;

the rotary positioning assembly comprises a second rotary cylinder and a third air claw connected with the second rotary cylinder, wherein the third air claw is used for clamping an electronic element, and the second rotary cylinder is used for driving the third air claw to rotate and can drive the electronic element to rotate.

4. The electronic component molding process according to claim 1, wherein: the correction device comprises a correction support, correction lifting cylinders arranged on the correction support and two groups of correction clamping cylinders symmetrically connected to two sides of the correction lifting cylinders, the correction clamping cylinders are connected with correction clamping jaws, and the two groups of correction clamping cylinders are used for driving the correction clamping jaws to correct electronic elements in a centered mode.

5. The electronic component molding process according to claim 1, wherein: the forming lifting support comprises a base plate connected to the forming lifting driving module and a T-shaped plate which is adjustably arranged on the base plate, the forming clamping assembly and the first rolling forming assembly are both arranged on the base plate, and the second rolling forming assembly is arranged on one side of the T-shaped plate;

The T-shaped plate is provided with a main shaft hole for connecting the substrate and an adjusting pull groove, the adjusting pull groove is arc-shaped, and the T-shaped plate is installed on the substrate by taking the main shaft hole as the center through adjusting the adjusting pull groove.

6. The electronic component molding process according to claim 5, wherein: the positioning module is a positioning plate arranged on two sides of the forming clamping assembly, the positioning plate extends towards the forming clamping assembly to form a positioning block, the positioning block is provided with a positioning shaft pin, and the positioning shaft pin is provided with a positioning needle;

the clamping claw is an L-shaped clamping claw, the L-shaped clamping claw comprises a clamping surface and a positioning surface, the clamping surface is used for clamping and fixing the end face of the electronic element, the positioning needle is used for positioning pins on one side of the electronic element, and the positioning surface is used for positioning pins on the other side of the electronic element.

7. The electronic component molding process according to claim 5, wherein: the first roll forming assembly is provided with a first roll driving cylinder and a first roll pressing block connected to the first roll driving cylinder, the first press roll is installed on the first roll pressing block, a first roll pressing groove is formed in the outer diameter of the first press roll, the first press roll is provided with a first adjusting shaft, and the first press roll is installed on the first roll pressing block in an adjustable mode through the first adjusting shaft.

8. The electronic component molding process according to claim 1, wherein: the second roll forming assembly is provided with a second roll driving cylinder and a second roll pressing block connected with the second roll driving cylinder, the second press roll is arranged on the second roll pressing block, and the second roll driving cylinder is obliquely arranged on the forming lifting bracket;

the external diameter of second compression roller has seted up the second roll groove, the second compression roller is equipped with the second regulating spindle, the second compression roller is adjustable through the second regulating spindle to be installed at the second roller briquetting.

9. The electronic component molding process according to claim 1, wherein: the pin sleeve device comprises a sleeve discharging assembly, a sleeve guiding assembly for guiding sleeve positioning, a sleeve driving assembly for driving the sleeve to discharge, a sleeve positioning assembly for clamping and positioning the sleeve, a sleeving assembly for clamping and sleeving the sleeve to a pin, and a cutting assembly for cutting the sleeve;

the sleeving assembly comprises a sleeving lifting cylinder and a sleeving clamping jaw connected with the sleeving lifting cylinder, and the sleeving clamping jaw is used for clamping and sleeving the cut sleeve to the pin.

10. The electronic component molding process according to claim 1, wherein: the ring clamp device comprises a ring clamp bracket, a first ring clamp lifting cylinder, a second ring clamp lifting cylinder and a ring clamp air claw, wherein the first ring clamp lifting cylinder is installed on the ring clamp bracket, the second ring clamp lifting cylinder is connected with the first ring clamp lifting cylinder, the ring clamp air claw is connected with a pipe clamp claw, a first pipe clamp groove and a second pipe clamp groove are formed in the pipe clamp claw, a first pipe clamp fixing ring is installed in the first pipe clamp groove, and a second pipe clamp fixing ring is installed in the second pipe clamp groove;

the ring air clamping claw is used for driving the pipe pressing clamping claw to drive the first pipe pressing groove and the second pipe pressing groove to clamp two pins of the electronic element, and the sleeve is tightly pressed under the action of the first pipe pressing fixing ring and the second pipe pressing fixing ring;

The blanking device comprises a blanking support, a blanking linear module arranged on the blanking support, a blanking lifting module arranged on the blanking linear module and a blanking grabbing assembly arranged on the blanking lifting module, wherein the blanking grabbing assembly is used for grabbing electronic element blanking on the clamping assembly.