CN116113165A - Hollowed-out processing method of power battery pack signal sampling assembly - Google Patents

Hollowed-out processing method of power battery pack signal sampling assembly Download PDF

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Publication number
CN116113165A
CN116113165A CN202211725121.3A CN202211725121A CN116113165A CN 116113165 A CN116113165 A CN 116113165A CN 202211725121 A CN202211725121 A CN 202211725121A CN 116113165 A CN116113165 A CN 116113165A
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CN
China
Prior art keywords
circuit board
flexible circuit
film
battery pack
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211725121.3A
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Chinese (zh)
Inventor
刘美才
钟胜祥
苏紫琴
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Xiamen Bolion Tech Co ltd
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Xiamen Bolion Tech Co ltd
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Publication date
Application filed by Xiamen Bolion Tech Co ltd filed Critical Xiamen Bolion Tech Co ltd
Priority to CN202211725121.3A priority Critical patent/CN116113165A/en
Publication of CN116113165A publication Critical patent/CN116113165A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

The invention discloses a hollowed-out processing method of a power battery pack signal sampling assembly, which comprises the following steps: product line design: replacing the nickel sheet electrode with copper foil, and adding the nickel sheet electrode into a circuit design; manufacturing a flexible circuit board by adopting a hollowed-out board manufacturing process, wherein the flexible circuit board comprises a circuit layer and a protective film layer; the circuit layer of the flexible circuit board faces upwards, the lower covering film, the aluminum row and the flexible circuit board are assembled on the carrier according to the stacking sequence from bottom to top, and pre-pressed and fixed; attaching a cover film on a circuit layer of the flexible circuit board, and then pressing the circuit layer, so that a connecting electrode in the flexible circuit board is tightly adhered with the aluminum row in a cover film pressing mode; welding a sensor and a connector; dispensing; and (3) laser welding, namely welding the connecting electrode in the circuit and the aluminum row together by laser. The processing method can greatly reduce equipment investment, reduce the hidden quality trouble of welding the nickel sheet electrode and has high production efficiency through line design optimization and process optimization.

Description

Hollowed-out processing method of power battery pack signal sampling assembly
Technical Field
The invention relates to the field of new energy automobiles, in particular to a hollowed-out processing method of a power battery pack signal sampling assembly.
Background
Along with the strong support and encouragement of national policies to new energy automobiles, the new energy automobile racing tracks are heated more and more, and the new energy battery pack is one of the core components of the new energy automobiles, and the production process, production efficiency and cost of each component become the core competitiveness of each company.
The processing technology of the traditional new energy battery pack signal acquisition component is as follows:
single-sided copper foil substrate material, exposure, etching (wire and fuse), covering film pasting, covering film pressing, reinforcing pasting, reinforcing pressing, shape punching, SMT (nickel plate electrode, NTC, connector) pasting, nickel plate electrode film pressing, nickel plate electrode film dispensing, I BB (I ntegrated Bus Bar for Battery, battery busbar integrated system, commonly called integrated busbar) pressing, dispensing and laser welding.
The traditional process scheme has the following defects:
1) The covering film needs to be pasted and pressed for multiple times, the material and processing cost is high, and the production period is long;
2) The SMT processing is needed, the involved equipment investment is low in processing efficiency, and meanwhile, the quality risks of connectors, NTC cold joint, furnace passing layering and the like are involved.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a processing method of a signal acquisition assembly of a power battery pack, so as to simplify the processing technology and improve the product quality.
In order to achieve the above object, the present invention provides a method for processing a power battery signal sampling assembly, which is characterized by comprising:
step S1, product line design: replacing the connecting electrode with copper foil, and adding the copper foil into the circuit;
s2, manufacturing a flexible circuit board by adopting a hollowed-out board manufacturing process, wherein the flexible circuit board comprises a circuit layer and a protective film layer;
s3, assembling and prepressing an FPC: the circuit layer of the flexible circuit board faces upwards, the lower covering film, the aluminum row and the flexible circuit board are assembled on the carrier according to the stacking sequence from bottom to top, and pre-pressed and fixed; the lower covering film is subjected to windowing treatment;
step S4, film sticking: attaching a layer of covering film on the surface of the circuit layer of the flexible circuit board; the upper covering film is subjected to windowing treatment;
step S5, laminating: the connecting electrode in the flexible circuit board positioned between the upper cover film and the lower cover film is tightly adhered with the aluminum row by the pressing mode of the upper cover film and the lower cover film;
s6, welding a sensor and a connector;
s7, dispensing;
and S8, laser welding, namely welding the connecting electrode in the flexible circuit board in the circuit and the aluminum row together through laser.
Further, the step S2 includes: selecting a single-sided bare copper substrate, and attaching a protective film on the back of the single-sided bare copper substrate; forming a circuit through an etching process; the protective film is windowed to expose the connecting electrode; and punching the appearance of the flexible circuit board by using a die.
Further, the thickness of the single-sided bare copper substrate is 20-50 microns.
Further, the protective film in the step S2 is a PI protective film.
Further, the upper cover film and the lower cover film are insulating cover films with the thickness of 60-150 micrometers.
Further, the sensor is a negative temperature coefficient temperature sensor; the welding mode is spot welding or piercing crimping mode.
Compared with the prior art, the invention has the advantages that:
1) The copper foil is used for replacing the nickel sheet electrode, so that the processes of SMT, nickel sheet material processing and the like are reduced, and the equipment investment of SMT, SP I, AO I and the like is reduced; meanwhile, the hidden quality hazards of empty welding, virtual welding and the like of the nickel sheet electrode are reduced.
2) The dual protection of the I BB lamination and the laser welding eliminates the strength requirement between the copper foil and the aluminum row, and has better electrical performance.
3) The copper foil is thinner than the nickel plate electrode in thickness, so that the production efficiency of laser welding can be improved by several times.
Drawings
FIG. 1 is an example of an FPC of a new energy battery pack signal acquisition assembly currently employing nickel plate electrodes;
FIG. 2 is a process flow diagram of a power battery pack signal sampling assembly of the present invention;
FIG. 3 is an example of a circuit design of the power battery pack signal sampling assembly of the present invention;
FIG. 4 is a schematic illustration of the lamination of an intermediate product after completion of a single sided bare copper coating step;
FIG. 5 is a top view of the intermediate product after completion of the etching and protective film windowing steps;
FIG. 6 is a top view of the intermediate product after completion of the line die cutting step;
FIG. 7 is an example of a design of an upper cover film;
fig. 8 is a design example of the lower cover film;
FIG. 9 is a schematic diagram of the lamination of the intermediate product after completion of FPC assembly pre-compression;
FIG. 10 is a top view of the intermediate product after completion of FPC assembly pre-compression;
FIG. 11 is a schematic illustration of the lamination of the intermediate product after completion of the lamination step;
FIG. 12 is a top view of the intermediate product after completion of the film attachment step;
FIG. 13 is a schematic diagram of the lamination of the intermediate product after completion of the IBB lamination step;
fig. 14 is a top view of the molded product after laser welding is completed.
Detailed Description
For further illustration of the various embodiments, the invention is provided with the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments and together with the description, serve to explain the principles of the embodiments. With reference to these matters, one of ordinary skill in the art will understand other possible embodiments and advantages of the present invention. The components in the figures are not drawn to scale and like reference numerals are generally used to designate like components.
The invention will now be further described with reference to the drawings and detailed description.
As shown in fig. 2, the invention discloses a processing method of a signal sampling assembly of a power battery pack, which comprises the following steps:
step S1, product line design: the nickel sheet electrode is replaced by copper foil, and a connection electrode 2 is formed by adding copper foil to the design of the circuit 1, and a sensor pad 3 is also arranged in the circuit 1. Compared with the traditional process, the process has the following advantages: 1) The copper foil is used for replacing the nickel plate electrode, so that the electric conduction and heat conduction properties are better; 2) The circuit processing can be formed at one time, so that the processes of SMT welding, nickel sheet electrode processing and the like can be saved, and the investment of related equipment such as SMT, SPI, AO I and the like is saved; meanwhile, the hidden quality hazards of cold joint, empty joint and the like of the welding of the nickel sheet electrode are avoided.
And S2, manufacturing a flexible circuit board (FPC) by adopting a traditional hollowed-out board manufacturing process.
The method specifically comprises the following steps:
selecting a common single-sided bare copper base material 4, and attaching a protective film 5 on the back surface of the single-sided bare copper base material 4, as shown in fig. 4;
forming the circuit by etching process (dry film pasting, exposure, development, etching and film stripping); then the protective film 5 is windowed to expose the connecting electrode 2; as shown in fig. 5;
and (3) punching the appearance: the flexible circuit board 6 is punched out by combining the product design and manufacturing die, as shown in fig. 6.
In the step, compared with the traditional hollowed-out plate manufacturing process, the process of attaching the covering film after circuit molding is reduced, the shape is directly punched, the covering film material can be saved, and the production period is shortened.
In particular applications, the single sided bare copper substrate has a thickness of 20 microns to 50 microns, typically 20 microns or 35 microns, with corresponding adjustments in combination with performance requirements and material selection.
Before step S3 is performed, it is necessary to prepare the upper cover film 7 and the lower cover film 8 for bonding the wire 1 and the aluminum row 9. Both the upper cover film 7 and the lower cover film 8 are windowed according to the exposed requirements of the electrical test points and electrical contact points of the lines 1 and the aluminum bars 9. As shown in fig. 7 and 8.
Specifically, the upper cover film 7 and the lower cover film 8 are insulating cover films for protecting the circuit and enhancing the structural strength of the whole signal sampling assembly. The thickness of the upper cover film 7 and the lower cover film 8 is typically 60-150 microns, and can be adjusted accordingly in combination with performance requirements and material selection.
S3, assembling and prepressing an FPC: the lower cover film 8, the aluminum row 9 and the flexible circuit board 6 are assembled on the carrier in the stacking sequence from bottom to top with one surface of the protective film 5 of the flexible circuit board 6 facing downwards, and are pre-pressed and fixed, as shown in fig. 9 and 10.
Step S4, film sticking: a layer of covering film 7 is stuck on the surface of the circuit 1 of the flexible circuit board 6 to protect the circuit. As shown in fig. 11 and 12.
And step S5, pressing the I BB. And the connecting electrode 2 in the flexible circuit board 6 positioned between the upper cover film and the lower cover film is tightly adhered with the aluminum row 9 by the pressing mode of the upper cover film and the lower cover film. As shown in fig. 13.
Step S6, welding the NTC temperature sensor and the connector 10. NTC is a negative temperature coefficient temperature sensor. The NTC temperature sensor generally adopts a drop type temperature sensor, and the welding mode is spot welding or piercing crimping.
And S7, dispensing. And the welded NTC sensor and the connector are fixed by dispensing, so that the bonding force of the device is enhanced, and meanwhile, the dispensing at the position of the NTC sensor has a certain heat conduction effect.
Step S8, laser welding: the connection electrode 2 and the aluminum row 9 in the line are welded together by laser. After the laser welding is completed, the power battery pack signal sampling assembly has been formed. As shown in fig. 14.
Laser welding is the fusion joining of two metals together by means of a laser. In the process, the nickel sheet electrode is replaced by the copper foil, the thickness of the copper foil is about one tenth of that of the nickel sheet electrode, and the production efficiency of laser welding can be improved by several times.
In the conventional process, a nickel plate electrode with a thickness of about 0.3mm is generally used, and the nickel plate electrode is connected with an aluminum row by a laser welding mode. The reason is that the nickel sheet electrode and the aluminum row are two independent structures, and the nickel sheet electrode needs to have enough strength to ensure firm connection, so that the traditional process has higher requirements on the thickness and strength of the nickel sheet electrode.
In the process flow, an I BB lamination process is adopted firstly: the copper foil and the aluminum row are tightly adhered together by a laminating mode of the covering film, and then the copper foil and the aluminum row are conducted by a laser welding mode. The process has the advantages that the copper foil and the aluminum row are combined into a whole through laminating the cover film, so that the strength requirement between the copper foil and the aluminum row is eliminated, thinner copper foil can be adopted in the aspect of material selection, double protection of the cover film and laser welding is realized in the aspect of electrical performance, and the stability is ensured.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (6)

1. The hollowed-out processing method of the power battery pack signal sampling assembly is characterized by comprising the following steps of:
step S1, product line design: replacing the connecting electrode with copper foil, and adding the copper foil into a circuit design;
s2, manufacturing a flexible circuit board by adopting a traditional hollowed-out board manufacturing process, wherein the flexible circuit board comprises a pressed circuit layer and a protective film layer;
s3, assembling and prepressing an FPC: the circuit layer of the flexible circuit board faces upwards, and then the lower covering film, the aluminum row and the flexible circuit board are assembled on the carrier according to the stacking sequence from bottom to top, and are pre-pressed and fixed; the lower covering film is subjected to windowing treatment;
step S4, film sticking: attaching a layer of covering film on the surface of the circuit layer of the flexible circuit board; the upper covering film is subjected to windowing treatment;
step S5, laminating: the connecting electrode in the flexible circuit board positioned between the upper cover film and the lower cover film is tightly adhered with the aluminum row by the pressing mode of the upper cover film and the lower cover film;
s6, welding a sensor and a connector;
s7, dispensing;
and S8, laser welding, namely welding the connecting electrode in the flexible circuit board in the circuit and the aluminum row together through laser.
2. The method for hollowed-out processing of the power battery pack signal sampling assembly according to claim 1, wherein the step S2 comprises:
selecting a single-sided bare copper substrate, and attaching a protective film on the back of the single-sided bare copper substrate;
forming a circuit through an etching process;
the protective film is windowed to expose the connecting electrode;
and punching the appearance of the flexible circuit board by using a die.
3. The method for processing the signal sampling assembly of the power battery pack according to claim 2, wherein the thickness of the single-sided bare copper substrate in the step S2 is 20-50 μm.
4. The method for processing the power battery pack signal sampling assembly according to claim 2, wherein the protective film in the step S2 is a PI protective film.
5. The method for processing the power battery pack signal sampling assembly according to claim 1, wherein the upper cover film and the lower cover film are insulating cover films with the thickness of 60-150 micrometers.
6. The method for processing the power battery pack signal sampling assembly according to claim 1, wherein the sensor is a negative temperature coefficient temperature sensor; the welding mode is spot welding or piercing crimping mode.
CN202211725121.3A 2022-12-30 2022-12-30 Hollowed-out processing method of power battery pack signal sampling assembly Pending CN116113165A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211725121.3A CN116113165A (en) 2022-12-30 2022-12-30 Hollowed-out processing method of power battery pack signal sampling assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211725121.3A CN116113165A (en) 2022-12-30 2022-12-30 Hollowed-out processing method of power battery pack signal sampling assembly

Publications (1)

Publication Number Publication Date
CN116113165A true CN116113165A (en) 2023-05-12

Family

ID=86257441

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211725121.3A Pending CN116113165A (en) 2022-12-30 2022-12-30 Hollowed-out processing method of power battery pack signal sampling assembly

Country Status (1)

Country Link
CN (1) CN116113165A (en)

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