CN116110810B

CN116110810B - Lead frame glues core device

Info

Publication number: CN116110810B
Application number: CN202310385950.XA
Authority: CN
Inventors: 邹佩纯; 赵雪; 温正萍
Original assignee: Sichuan Xumaowei Technology Co ltd
Current assignee: Sichuan Xumaowei Technology Co ltd
Priority date: 2023-04-12
Filing date: 2023-04-12
Publication date: 2023-07-07
Anticipated expiration: 2043-04-12
Also published as: CN116110810A

Abstract

The invention provides a lead frame core bonding device, which belongs to the technical field of semiconductor device packaging, and comprises: the rotating mechanism comprises a rotating pipe which is vertically arranged. The transfer assembly comprises a sucker, one end of the sucker is arranged on the outer wall of the rotary tube in a rotating mode through a rotating shaft, a top surface of the sucker is provided with a top surface suction hole, a detachable base plate is adhered to the top surface of the sucker, a detachable guide plate is arranged above the base plate, the base plate and the guide plate are provided with containing holes corresponding to pins on the lead frame one by one, and at least one top surface suction hole corresponds to the range of each containing hole. The outer part of the rotary pipe is provided with a chip groove, a glue brushing groove, a dismounting mechanism, a lifting device and a charging mechanism in sequence along the circumference, and a turnover mechanism is arranged between the chip groove and the glue brushing groove and between the dismounting mechanism and the lifting device. The spare part simple structure of device, whole cost of manufacture is low, can keep the uniformity of tin cream application volume and the precision of painting the position, and can effectively prevent to glue core in-process chip and drop.

Description

Lead frame glues core device

Technical Field

The invention belongs to the technical field of semiconductor device packaging, and particularly relates to a lead frame core bonding device.

Background

The semiconductor chip for producing diode is characterized by that it has no need of distinguishing front and back sides of chip, so that said chip can be normally in bulk state, in the packaging process the chip can be filled on the chip positioning disk by means of shaking equipment, then the chip positioning disk can be placed on the chip-sticking equipment, and the chip-sticking equipment can utilize the suction tube densely placed on the needle plate to dip solder paste, and can utilize suction tube to coat the solder paste on the pin of lead frame, then utilize another needle plate with suction tube to adsorb the chip on the positioning disk, and can make the chip be assembled on the lead frame pin coated with solder paste, and finally the lead frame can be fed into the sintering furnace by means of bonding pad to make sintering and solid welding. The packaging process has the following problems that the quantity of the solder paste is not easy to control when the solder paste is dipped by utilizing the suction tube, so that the smearing quantity of the solder paste is inconsistent, the solder paste is easy to overflow when the solder paste is more, the rest parts of the lead frame are plated with a solder paste layer, the subsequent packaging effect and the performance of the diode are affected, and the contact surface between a chip and a pin is easy to be reduced if the solder paste is less, so that the solid welding stability is reduced. When the chip is adsorbed by the suction pipe, the suction pipe and the adsorption surface of the chip are limited due to the small volume of the chip, and the chip is at risk of falling during adsorption or transfer. On the other hand, the suction pipes on two needle plates and the chip fixing holes on the positioning disc in the existing core bonding equipment are in one-to-one correspondence with the pins of the lead frame, so that the needle plates are usually corresponding to the types of the lead frame, two needle plates are required to be replaced simultaneously when different types of lead frames are used, the existing core bonding equipment is more in fittings, two needle plates and one positioning disc are required to be equipped for the lead frame of the same type, the needle plates and the positioning disc are complex in structure, and the manufacturing cost is high.

Disclosure of Invention

In order to solve the defects in the prior art, the invention provides the lead frame core bonding device which has the advantages of simple spare part structure and low overall manufacturing cost, can keep consistency of the coating quantity of the solder paste and the precision of the coating position, and can effectively prevent chips from falling off in the core bonding process.

In order to achieve the object of the invention, the following scheme is adopted:

a leadframe die attach apparatus comprising: a rotating mechanism and a transferring assembly.

The rotating mechanism comprises a rotating pipe which is arranged vertically and is arranged in a rotating way around an axis.

The transfer assembly comprises a sucker, one end of the sucker is arranged on the outer wall of the rotary tube in a rotating mode through a rotating shaft, the rotating axis of the rotating shaft is consistent with the normal direction of the rotary tube, a top surface of the sucker is provided with a top surface suction hole, a detachable base plate is adhered to the top surface of the sucker, a detachable guide plate is arranged above the base plate, containing holes corresponding to pins on the lead frame one to one are formed in the base plate and the guide plate and used for containing chips, and at least one top surface suction hole corresponds to the range of each containing hole.

The outer part of the rotary pipe is provided with a chip groove, a glue brushing groove, a dismounting mechanism, a lifting device and a charging mechanism in sequence along the circumference, and a turnover mechanism is arranged between the chip groove and the glue brushing groove and between the dismounting mechanism and the lifting device.

The chip groove is used for filling the chip into the accommodating hole; the bottom of the glue brushing groove is provided with a detachable screen plate, meshes corresponding to the containing holes one by one are arranged on the screen plate, and the glue brushing groove is arranged in a moving way along the vertical direction; the dismounting mechanism is used for dismounting the guide plate on the sucker upwards; the lifting device is used for lifting the bonding pad bearing the lead frame upwards; the charging mechanism is used for assembling the guide plate upwards to the sucker; the turnover mechanism is used for enabling the sucker to turn 180 degrees around the rotating shaft.

Further, the sucking disc is provided with five blocks along the circumferential array of the rotary pipe.

Further, the inner channel has been seted up to the pivot is coaxial, and inner channel and top surface inhale the hole intercommunication, the through-hole with inner channel intercommunication has been seted up to rotatory pipe lateral wall, rotatory pipe rotates locates a locating shaft, the main channel has been seted up to the locating shaft, the main channel links to each other with the air pump, the lateral wall of locating shaft has been seted up the side channel, the arc wall with the side channel intercommunication has been seted up to the outer wall of locating shaft, the arc wall is used for connecting the through-hole, the inlet port has been seted up to the entity position between the corresponding arc wall both ends of locating shaft lateral wall for connecting the through-hole, inlet port and the outside intercommunication of locating shaft, and the inlet port corresponds lifting device setting.

Further, the inside cavity that has with the top surface suction hole intercommunication of sucking disc, the side suction hole with the cavity intercommunication has been seted up to the lateral wall of sucking disc, and the week side of deflector is equipped with the side coaming, and when deflector and base plate subsides, the side coaming covers the side suction hole.

Further, the periphery side cover of sucking disc is equipped with the sealing ring, is equipped with the elastic piece between the bottom surface of sealing ring and sucking disc, and when the elastic piece was the natural state, the sealing ring covered the side and inhaled the hole.

Further, the size of the mesh is smaller than that of the accommodating hole and is positioned in the middle of the accommodating hole, so that the solder paste is smeared at the middle of the chip.

Further, the thickness of the chip is equal to the sum of the thicknesses of the substrate and the guide plate.

Further, the periphery side of swivelling tube is equipped with the support ring for support the pivot, the pivot is used for contacting the position that supports the ring and is rectangular structure, and rectangular structure's top surface and bottom surface all are on a parallel with the top surface and the bottom surface of sucking disc, support ring corresponds tilting mechanism's position and all has the recess, be used for dodging the pivot, the inboard or the outside that support the ring corresponds the arc length scope of recess all is equipped with the arc rack, arc rack and swivelling tube are coaxial, be equipped with the gear in the pivot, be used for with the meshing of arc rack, and the effective length of arc rack equals the half of the effective girth of gear.

Further, the bottom plate of the chip groove is made of soft materials, a top plate capable of moving back and forth is arranged below the bottom plate, and the top surface of the top plate is higher than the plane where the bottom plate is in a natural state.

Further, the lifting device is arranged at the starting end of a conveying groove, and when the lifting device lifts the bonding pad to the bonding core position, the bonding pad is aligned with the conveying groove.

The invention has the beneficial effects that:

1. the device only needs to replace the base plate, the guide plate and the screen plate corresponding to lead frames of different models, and the three are of flat plate structures, so that the structure is simpler and the processing is easier.

2. The device does not need to transfer the chip on the sucker in the process of sticking the core, and the chip and the lead frame are directly assembled by the sucker, so that the risk that the chip falls off in the transfer process is avoided.

Drawings

The drawings described herein are for illustration of selected embodiments only and not all possible implementations, and are not intended to limit the scope of the invention.

Fig. 1 shows a schematic diagram of a tooling operation according to a preferred embodiment of the present application.

Fig. 2 shows a schematic view of a preferred embodiment of the present application when the rotating tube is rotated.

Fig. 3 shows a partial enlarged view at a in fig. 2.

Fig. 4 shows a schematic structural view of the rotation mechanism.

Fig. 5 shows a partial cross-sectional view of a preferred embodiment of the present application.

Fig. 6 shows a schematic structural view of the transfer set of the present application.

Fig. 7 shows a cross-sectional view of a transfer set of the present application.

Fig. 8 shows a partial enlarged view at B in fig. 7.

Fig. 9 shows a bottom configuration view of the chip slot of the present application.

Fig. 10 shows a schematic view of the state of the top plate in operation.

The marks in the figure: the device comprises a rotary pipe-11, a through hole-111, a supporting circular ring-12, a groove-121, a positioning shaft-13, a main channel-131, a side channel-132, an arc-shaped groove-133, an air inlet hole-134, a chip groove-2, a bottom plate-21, a top plate-22, a glue brushing groove-3, a screen plate-31, a mesh-311, a scraping plate-32, a disassembling mechanism-4, a lifting device-5, a bonding pad-51, a conveying groove-52, a charging mechanism-6, a turnover mechanism-7, an arc-shaped rack-71, a gear-72, a sucking disc-81, a rotating shaft-811, a top surface sucking hole-812, an inner channel-813, a cavity-814, a side sucking hole-815, a base plate-82, a containing hole-823, a guide plate-83, a side wall plate-831, a sealing ring-84, an elastic piece-85 and a chip-9.

Description of the embodiments

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the following detailed description of the embodiments of the present invention will be given with reference to the accompanying drawings, but the described embodiments of the present invention are some, but not all embodiments of the present invention.

As shown in fig. 1 to 8, a lead frame die bonding apparatus includes: a rotating mechanism and a transferring assembly. The rotating mechanism comprises a rotating pipe 11 which is vertically arranged and is rotationally arranged around an axis, the rotating pipe 11 is driven by a motor, specifically, a conical gear ring can be arranged on the periphery of the top of the rotating pipe 11, and the rotating pipe 11 is driven to rotate by meshing with the conical gear ring through a conical gear arranged on a motor spindle.

Specifically, as shown in fig. 1 to 8, the transfer assembly includes a suction cup 81, one end of which is rotatably disposed on the outer wall of the rotary tube 11 through a rotary shaft 811, the rotary axis of the rotary shaft 811 is consistent with the normal direction of the rotary tube 11, a top surface suction hole 812 is densely disposed on the top surface of the suction cup 81, a removable substrate 82 is adhered to the top surface of the suction cup 81, a detachable guide plate 83 is disposed above the substrate 82, specifically, a side plate is disposed on the outer periphery side of the guide plate 83, and is in contact with the outer side wall of the suction cup 81, so that the guide plate 83 and the suction cup 81 are detachably connected by friction force, the substrate 82 and the guide plate 83 are both provided with accommodation holes 823 corresponding to pins on a lead frame for accommodating chips, and a dense top surface suction hole 812 is disposed on the top surface of the suction cup 81, so that the top surface suction hole 812 is not only used for adsorbing the chip 9, but also is used for tightly adhering the substrate 82 to the top surface of the suction cup 81, and therefore the substrate 82 is fixed by adopting an adhering mode, the substrate 82 is still needed to be adhered to the lead frame 82, and the adhesive force can be eliminated by the die pad 82 when the chip is required to be adhered to the lead frame 82.

Specifically, as shown in fig. 1, 2 and 4, a chip groove 2, a glue brushing groove 3, a dismounting mechanism 4, a lifting device 5 and a charging mechanism 6 are sequentially arranged on the outer portion of the rotary tube 11 along the circumference in an array mode, and a turnover mechanism 7 is arranged between the chip groove 2 and the glue brushing groove 3 and between the dismounting mechanism 4 and the lifting device 5.

Specifically, the chip pocket 2 is located below the suction cup 81 for filling the receiving hole 823 with the chip 9; the brush glue groove 3 is located the top of sucking disc 81, the bottom is equipped with detachable otter board 31, mesh 311 with holding hole 823 one-to-one is equipped with on the otter board 31 for scribble the solder paste to the top surface of chip 9, brush glue groove 3 is equipped with scrapes the offset plate 32, be used for scraping the solder paste of moving otter board 31 top, adopt mesh 311 location to scribble the mode not only can effectively control the positional accuracy that the solder paste was scribbled, can accurately control the volume of scribbling of solder paste through the thickness of otter board 31 moreover, avoid too much or too little solder paste, and can effectively guarantee the uniformity of the solder paste volume on all pins, brush glue groove 3 removes the setting along vertical direction, in order to control laminating and the separation between otter board 31 and the deflector 83.

The dismounting mechanism 4 is used to dismount the guide plate 83 on the suction cup 81 upwards. Specifically, the dismounting mechanism 4 may use a robot or a vacuum chuck to dismount the guide plate 83 upward. When the guide plate 83 is detached, the chip 9 protrudes out of the top surface of the base plate 82 so as to be convenient for enabling the chip 9 to be in contact with the pins, and after the guide plate 83 is detached, the base plate 82 is still kept on the suction cup 81, so that the position of the chip 9 can be effectively kept fixed, and the chip 9 is prevented from shifting in the overturning process of the suction cup 81; on the other hand, the top suction hole 812 outside the range of the receiving hole 823 on the suction cup 81 can be covered by the solid portion of the substrate 82, so that the inside of the suction cup 81 is kept in a negative pressure state, the negative pressure inside the suction cup 81 is prevented from being reduced, and the suction force to the chip 9 is reduced.

The lifting device 5 is used to lift up the pads 51 carrying the lead frame to bond the leads of the lead frame to the chip 9. The lifting device 5 is a lifting cylinder or a motor for lifting the bonding pad 51 to a predetermined height position, so that the lead frame actively moves toward the suction cup 81 to bring the leads into contact with the chip 9, and the chip 9 is adhered to the leads by using solder paste coated on the chip 9.

The loading mechanism 6 is used for assembling the guide plate 83 upwards onto the suction cup 81, the guide plate 83 with the upward bottom surface is placed at the loading mechanism 6, when the suction cup 81 after the completion of sticking the core rotates to the upper side of the loading mechanism 6, the guide plate 83 is jacked up upwards by using an air cylinder or a motor, so that the guide plate 83 is assembled onto the suction cup 81, and the suction cup 81 is convenient to be refilled with chips 9.

The turnover mechanism 7 is used for turning the suction cup 81 180 degrees around the rotation axis 811, and the turnover mechanism 7 can be a rotating motor or a cylinder arranged outside the circular motion track of the suction cup 81, and the suction cup 81 is driven to rotate by a shifting fork of a U-shaped structure.

The device only needs to replace the base plate 82, the guide plate 83 and the screen plate 31 corresponding to lead frames of different models. The three are all flat plate structures, and compared with the existing needle plate and positioning disc, the structures of the base plate 82, the guide plate 83 and the screen plate 31 are simpler and easier to process. Meanwhile, the chip 9 is directly positioned and transferred by using the sucking disc until final sticking is realized, and the process of transferring the middle suction pipe is reduced, so that the chip 9 is prevented from falling off.

Preferably, as shown in fig. 1 and 2, five sucking discs 81 are arranged along the circumferential array of the rotary tube 11, and chip grooves 2, glue brushing grooves 3, dismounting mechanisms 4, lifting devices 5 and charging mechanisms 6 are sequentially arranged along the circumference of the rotary tube 11 in an array manner, namely five stations are formed on the periphery of the rotary mechanism, the angle interval between each station is the same, and five sucking discs 81 are arranged along the circumferential array of the rotary tube 11, so that multi-station operations of filling chips 9, smearing solder paste, removing the sucking discs 81, bonding chips 9 and assembling guide plates 83 are simultaneously performed, thereby improving the production efficiency.

Preferably, as shown in fig. 5, the rotating shaft 811 is coaxially provided with an inner channel 813, the inner channel 813 is communicated with the top suction hole 812, the side wall of the rotating tube 11 is provided with a through hole 111 communicated with the inner channel 813, the rotating tube 11 is rotatably arranged on a positioning shaft 13, the positioning shaft 13 is provided with a main channel 131, the main channel 131 is connected with an air pump, the side wall of the positioning shaft 13 is provided with a side channel 132, the outer wall of the positioning shaft 13 is provided with an arc-shaped groove 133 communicated with the side channel 132, the arc-shaped groove 133 is used for connecting the through hole 111, and a solid part between two ends of the arc-shaped groove 133 is arranged corresponding to the lifting device 5, so that when the suction disc 81 moves to the position of the lifting device 5, the exhaust channel is cut off, and the air in the suction disc 81 is stopped from being continuously extracted, thereby loosening the chip 9. The air pump is communicated with the main channel 131, and the main channel 131 is communicated with the top suction hole 812 through the side channel 132, the arc groove 133 and the inner channel 813, so that the suction cup 81 continuously keeps the suction effect on the chip 9 in the rotation process within the corresponding range of the arc groove 133.

Preferably, as shown in fig. 5, an air inlet 134 is formed at a solid portion between the two ends of the side wall of the positioning shaft 13 corresponding to the arc-shaped groove 133, and is used for connecting the through hole 111, the air inlet 134 is communicated with the outside of the positioning shaft 13, and the air inlet 134 is arranged corresponding to the lifting device 5. When the through hole 111 is connected with the air inlet 134, external air enters the suction cup 81 through the air inlet 134, so that the inside of the suction cup 81 is kept at the air pressure communicated with the atmosphere, and the top suction hole 812 is used for loosening the chip 9, so that the lead frame is adhered to the chip 9 through the tension of the solder paste, and the core sticking work is completed.

More specifically, the positioning shaft 13 corresponds to the chip groove 2, the glue brushing groove 3, the dismounting mechanism 4 and the charging mechanism 6, and is provided with side channels 132 to increase the gas flow channel, and the adsorption force of the chip 9 can be more directly and smoothly at the corresponding stations.

Preferably, as shown in fig. 7 and 8, the suction cup 81 has a cavity 814 communicating with the top suction holes 812, so that negative pressure air flow is generated simultaneously to all the top suction holes 812 through the cavity 814, consistency and stability of flow sizes of the top suction holes 812 are maintained, side suction holes 815 communicating with the cavity 814 are formed in the side walls of the suction cup 81, side panels 831 are arranged on the peripheral sides of the guide plates 83, when the guide plates 83 are attached to the substrate 82, the side suction holes 815 are covered by the side panels 831, suction generated by the side suction holes 815 is utilized to absorb the side panels 831, and therefore the guide plates 83 are fixed on the suction cup 81.

Further preferably, as shown in fig. 8, a sealing ring 84 is sleeved on the outer periphery of the suction cup 81, an elastic sheet 85 is arranged between the sealing ring 84 and the bottom surface of the suction cup 81, when the elastic sheet 85 is in a natural state, the sealing ring 84 covers the side suction holes 815, so that when the guide plate 83 is assembled to the suction cup 81, the side coaming 831 pushes away the sealing ring 84, so that the side coaming 831 covers the side suction holes 815, the guide plate 83 is fixed by the side suction holes 815, and after the guide plate 83 is taken down, under the elastic force of the elastic sheet 85, the sealing ring 84 blocks the side suction holes 815 to keep the negative pressure stability inside the suction cup 81, thereby keeping the suction force on the chip 9 under the condition of unchanged suction amount and preventing the suction cup 81 from dropping off the chip 9 in the overturning process.

Preferably, as shown in fig. 6, the size of the mesh 311 is smaller than the receiving hole 823 and is located in the middle of the receiving hole 823 to ensure that the solder paste is smeared on the middle of the chip 9.

Preferably, as shown in fig. 8, the thickness of the chip 9 is equal to the sum of the thicknesses of the substrate 82 and the guide plate 83, after the chip 9 is filled into the accommodating hole 823, the top surface of the chip 9 will be flush with the top surface of the guide plate 83, and in the step of applying solder paste, when the guide plate 83 is attached to the screen plate 31, the chip 9 and the screen plate 31 are also in a mutually attached state, so as to avoid the solder paste on the chip 9 from overflowing the range of the mesh 311, thereby accurately controlling the application range of the solder paste on the chip 9 and further avoiding the solder paste from being attached to the rest parts of the lead frame.

More specifically, as shown in fig. 1 to 5, the outer peripheral side of the rotary tube 11 is provided with a supporting circular ring 12 for supporting the rotary shaft 811, the portion of the rotary shaft 811 for contacting the supporting circular ring 12 is in a rectangular structure, the top surface and the bottom surface of the rectangular structure are parallel to the top surface and the bottom surface of the suction cup 81, the position of the supporting circular ring 12 corresponding to the turnover mechanism 7 is provided with grooves 121 for avoiding the rotary shaft 811, more specifically, in order to avoid the portion of the rotary shaft 811 corresponding to the rectangular structure, the arc length range of the groove 121 on the inner side or the outer side of the supporting circular ring 12 is provided with an arc-shaped rack 71, the arc-shaped rack 71 is coaxial with the rotary tube 11, the rotary shaft 811 is provided with a gear 72 for meshing with the arc-shaped rack 71, the effective length of the arc-shaped rack 71 is equal to half the effective circumference of the gear 72, namely, the gear 72 rolls from one end of the arc-shaped rack 71 to the arc-shaped rack 71, and the gear 72 just rotates half circle, namely 180 ° to ensure that the rotary shaft 811 passes through the arc-shaped rack 71 to drive the suction cup 81 to rotate 180 °.

Preferably, the bottom plate 21 of the chip slot 2 is made of soft material, such as rubber or cloth, as shown in fig. 9, a top plate 22 that reciprocates is disposed below the chip slot 2, as shown in fig. 10, the top surface of the top plate 22 is higher than the plane where the bottom plate 21 is in a natural state, and since the suction cup 81 moves above the chip slot 2 in a rotating manner, and then the chips are sucked upwards from the inside of the chip slot 2, a predetermined interval is required between the suction cup 81 and the bottom plate 21, so that the rotation of the suction cup 81 is not affected, and the chips 9 passing through the top plate 22 on the bottom plate 21 can be closer to the suction cup 81 by utilizing the reciprocation of the top plate 22, so that the suction cup 81 can suck the chips 9 better and faster. More specifically, whether chip 9 fills all accommodation holes 823 is judged through the change of the inside negative pressure of sucking disc 81, when all accommodation holes 823 all adsorb chip 9, the inside negative pressure value of sucking disc 81 will reach preset pressure size, and negative pressure value accessible sets up pressure sensor on sucking disc 81 and detects, and this mode can improve the degree of automation of gluing the core device, avoids chip 9 neglected loading to reduce the link of artifical visual inspection.

Preferably, as shown in fig. 1 and 2, the lifting device 5 is disposed at the start end of a conveying groove 52, when the lifting device 5 lifts the bonding pad 51 to the bonding position, the bonding pad 51 is aligned with the conveying groove 52, so that after the bonding operation is completed, the bonding pad 51 can be automatically output by using the conveying groove 52, so as to improve the automation degree of the device.

When the chip sucking device works, the sucking disc 81 is driven to rotate by the rotary pipe 11, the sucking disc 81 is firstly moved to the upper side of the chip groove 2, the substrate 82 and the guide plate 83 are assembled on the top surface of the sucking disc 81 in the way that the guide plate 83 faces downwards, and the chip 9 is sucked by utilizing negative pressure suction force, so that the chip 9 is sucked and fixed in the accommodating hole 823; the rotary tube 11 continuously drives the suction disc 81 to move towards the glue brushing groove 3, in the process, the turnover mechanism 7 drives the suction disc 81 to turn over 180 degrees so as to enable the chip 9 to face upwards, after the suction disc 81 moves to the lower side of the glue brushing groove 3, the glue brushing groove 3 is moved downwards, the screen plate 31 is attached to the guide plate 83, then the solder paste is scraped by the glue scraping plate 32, so that the solder paste is filled into the meshes 311, the solder paste coating operation is completed, and then the glue brushing groove 3 is lifted upwards; the rotary tube 11 continues to drive the sucking disc 81 to move towards the dismounting mechanism 4, and the guide plate 83 is dismounted upwards through the dismounting mechanism 4 so that the chip 9 protrudes out of the top surface of the substrate 82; the rotating pipe 11 continues to drive the sucker 81 to move towards the lifting device 5, in the process, the other turnover mechanism 7 drives the sucker 81 to turn 180 degrees again so as to enable the chip 9 to face downwards, when the sucker 81 moves to the position above the bonding pad 51 on the lifting device 5, the lifting device 5 is used for lifting the bonding pad 51 to a preset position, and pins of the lead frame are in contact with the chip 9, so that the chip bonding work is completed. The whole process can utilize the sucking disc 81 to directly assemble the chip 9 and the lead frame without transferring the chip 9 on the sucking disc 81, thereby avoiding the risk of dropping the chip 9.

The foregoing description of the preferred embodiments of the invention is merely exemplary and is not intended to be exhaustive or limiting of the invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention.

Claims

1. A lead frame die attach apparatus comprising:

the rotating mechanism comprises a rotating pipe (11) which is arranged vertically and is arranged rotationally around an axis;

the transfer assembly comprises a sucker (81), one end of the sucker is rotationally arranged on the outer wall of the rotary pipe (11) through a rotating shaft (811), the rotating axis of the rotating shaft (811) is consistent with the normal direction of the rotary pipe (11), a top surface suction hole (812) is formed in the top surface of the sucker (81), a detachable substrate (82) is adhered to the top surface of the sucker (81), a detachable guide plate (83) is arranged above the substrate, the substrate (82) and the guide plate (83) are respectively provided with a containing hole (823) corresponding to pins on the lead frame one by one, the containing holes are used for containing chips, and at least one top surface suction hole (812) is formed in the range of each containing hole (823);

chip grooves (2), glue brushing grooves (3), a dismounting mechanism (4), a lifting device (5) and a charging mechanism (6) are sequentially arranged on the outer part of the rotary pipe (11) along the circumference in an array mode, and turnover mechanisms (7) are arranged between the chip grooves (2) and the glue brushing grooves (3) and between the dismounting mechanism (4) and the lifting device (5);

the chip groove (2) is used for filling the accommodating hole (823) with the chip (9); the bottom of the glue brushing groove (3) is provided with a detachable screen plate (31), the screen plate (31) is provided with meshes (311) corresponding to the containing holes (823) one by one and used for smearing solder paste on the top surface of the chip (9), the glue brushing groove (3) is provided with a glue scraping plate (32) used for scraping solder paste above the screen plate (31), and the glue brushing groove (3) is arranged in a moving way along the vertical direction; the dismounting mechanism (4) is used for dismounting the guide plate (83) on the sucker (81) upwards; the lifting device (5) is used for lifting the bonding pad (51) carrying the lead frame upwards; the charging mechanism (6) is used for assembling the guide plate (83) to the sucker (81) upwards; the turnover mechanism (7) is used for turning the sucker (81) 180 degrees around the rotating shaft (811).

2. A lead frame die bonding apparatus according to claim 1, wherein the suction cups (81) are provided in five blocks along a circumferential array of the rotary tube (11).

3. The lead frame core bonding device according to claim 1, wherein the rotating shaft (811) is coaxially provided with an inner channel (813), the inner channel (813) is communicated with the top surface suction hole (812), the side wall of the rotating tube (11) is provided with a through hole (111) communicated with the inner channel (813), the rotating tube (11) is rotationally arranged on a positioning shaft (13), the positioning shaft (13) is provided with a main channel (131), the main channel (131) is connected with an air pump, the side wall of the positioning shaft (13) is provided with a side channel (132), the outer wall of the positioning shaft (13) is provided with an arc-shaped groove (133) communicated with the side channel (132), the arc-shaped groove (133) is used for connecting the through hole (111), the side wall of the positioning shaft (13) is provided with an air inlet hole (134) corresponding to a solid part between two ends of the arc-shaped groove (133), the air inlet hole (134) is used for connecting the through hole (111) and is communicated with the outside of the positioning shaft (13), and the air inlet hole (134) is arranged corresponding to the lifting device (5).

4. The lead frame die bonding device according to claim 1, wherein a cavity (814) communicated with the top suction hole (812) is formed in the suction cup (81), a side suction hole (815) communicated with the cavity (814) is formed in the side wall of the suction cup (81), a side surrounding plate (831) is arranged on the peripheral side of the guide plate (83), and the side surrounding plate (831) covers the side suction hole (815) when the guide plate (83) is attached to the base plate (82).

5. The lead frame die bonding device according to claim 4, wherein a sealing ring (84) is sleeved on the outer peripheral side of the suction cup (81), an elastic sheet (85) is arranged between the sealing ring (84) and the bottom surface of the suction cup (81), and when the elastic sheet (85) is in a natural state, the sealing ring (84) covers the side suction hole (815).

6. A lead frame die bonding apparatus according to claim 1, wherein the mesh (311) is smaller in size than the receiving hole (823) and is located in the middle of the receiving hole (823).

7. A lead frame die attach device according to claim 1, characterized in that the thickness of the die (9) is equal to the sum of the thickness of the base plate (82) and the guide plate (83).

8. The lead frame core bonding device according to claim 1, wherein a supporting circular ring (12) is arranged on the outer peripheral side of the rotating tube (11) and used for supporting a rotating shaft (811), the portion of the rotating shaft (811) used for contacting the supporting circular ring (12) is of a rectangular structure, the top surface and the bottom surface of the rectangular structure are parallel to the top surface and the bottom surface of the sucker (81), grooves (121) are formed in positions, corresponding to the turnover mechanism (7), of the supporting circular ring (12) and used for avoiding the rotating shaft (811), arc racks (71) are arranged in arc length ranges, corresponding to the grooves (121), of the inner side or the outer side of the supporting circular ring (12), the arc racks (71) are coaxial with the rotating tube (11), gears (72) are arranged on the rotating shaft (811) and used for being meshed with the arc racks (71), and the effective length of the arc racks (71) is equal to half of the effective circumference of the gears (72).

9. The lead frame bonding device according to claim 1, wherein the bottom plate (21) of the chip groove (2) is made of soft material, a top plate (22) capable of moving back and forth is arranged below the bottom plate, and the top surface of the top plate (22) is higher than the plane where the bottom plate (21) is in a natural state.

10. A lead frame die bonding apparatus according to claim 1, wherein the lifting means (5) is provided at a start end of a transfer slot (52), and the bonding pad (51) is aligned with the transfer slot (52) when the lifting means (5) lifts the bonding pad (51) to the die bonding position.