CN116100845A - Method for integrating 3D printing torsion Liang Weixing with scanning micro-mirror - Google Patents
Method for integrating 3D printing torsion Liang Weixing with scanning micro-mirror Download PDFInfo
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- CN116100845A CN116100845A CN202310018914.XA CN202310018914A CN116100845A CN 116100845 A CN116100845 A CN 116100845A CN 202310018914 A CN202310018914 A CN 202310018914A CN 116100845 A CN116100845 A CN 116100845A
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- 238000010146 3D printing Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 40
- 238000005530 etching Methods 0.000 claims abstract description 21
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 20
- 238000007639 printing Methods 0.000 claims abstract description 20
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 20
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000002002 slurry Substances 0.000 claims abstract description 15
- 239000012779 reinforcing material Substances 0.000 claims abstract description 12
- 238000005516 engineering process Methods 0.000 claims abstract description 11
- 229910052681 coesite Inorganic materials 0.000 claims abstract description 10
- 229910052906 cristobalite Inorganic materials 0.000 claims abstract description 10
- 229910052682 stishovite Inorganic materials 0.000 claims abstract description 10
- 229910052905 tridymite Inorganic materials 0.000 claims abstract description 10
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 239000000654 additive Substances 0.000 claims abstract description 4
- 230000000996 additive effect Effects 0.000 claims abstract description 4
- 238000000151 deposition Methods 0.000 claims abstract description 4
- 239000003607 modifier Substances 0.000 claims abstract description 4
- 238000001259 photo etching Methods 0.000 claims abstract description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 239000002041 carbon nanotube Substances 0.000 claims description 9
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000012153 distilled water Substances 0.000 claims description 5
- 238000000708 deep reactive-ion etching Methods 0.000 claims description 4
- 239000001913 cellulose Substances 0.000 claims description 3
- 229920002678 cellulose Polymers 0.000 claims description 3
- 239000002121 nanofiber Substances 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 abstract description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012742 biochemical analysis Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D99/00—Subject matter not provided for in other groups of this subclass
- B29D99/0003—Producing profiled members, e.g. beams
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Micromachines (AREA)
Abstract
The invention discloses a method for integrating a scanning micro-mirror by 3D printing torsion Liang Weixing, which comprises the following preparation steps: step one, depositing a layer of SiO2 on a Si layer; step two, photoresist is coated on the SiO2 surface in a spin mode, and partial photoresist is etched by utilizing MEMS photoetching technology to obtain a torsion beam plane structure; thirdly, printing slurry to fill gaps of the photoresist by using a 3D printing technology; step four, removing the solvent in the printing material, and leaving the reinforcing material in the slurry; step five, densifying the torsion beam structure by using a CVD additive coating on the reinforcing material; step six, reversely etching out torsion Liang Deceng, etching silicon dioxide by using HF, releasing the monocrystalline silicon micromechanical structure of the device layer, and leaving a micromirror torsion beam; step seven, etching to remove the residual photoresist material; and step eight, breaking the supporting beam by the laser modifier, and remaining the needed torsion beam.
Description
Technical Field
The invention relates to the technical field of 3D printing, in particular to a method for integrating a scanning micro mirror by using a 3D printing torsion Liang Weixing.
Background
The torsion micromirror is a micro optical device which is widely used in recent years along with the development of MEMS technology, and has very wide application in the aspects of modern optical communication, spatial light modulator, projection display, biochemical analysis and the like. The micro-optical electromechanical system is usually obtained by mutually crossing and fusing three technologies of micro-machinery, micro-electronics and micro-optics by using silicon with good mechanical properties as a structural material, and can obtain relatively high working frequency and larger scanning angle. The micromirror is required to be able to rotate rapidly to a certain extent, and the angular variation is an important factor in controlling the accuracy of the micromirror operation. The torsion beam is a direct condition for controlling the angle variable, and is a key point that the micromirror can be truly put into use. At present, efficient fabrication of micro-mirror torsion beams has become one of research hotspots and important development directions of MEMS micro-mirrors.
The fabrication of a micromirror torsion beam using SOI as a substrate, while providing sufficient strength for proper angular torsion of the micromirror, is expensive in the SOI layer, and when a large number of torsion beams are required to be fabricated, it is burdened with great costs. In addition, the micromirror manufactured by SOI requires the torsion beam length to be designed long enough to meet the use requirement of a large torsion angle, and the silicon micromachining process and the easy surface defect thereof make the large torsion angle and high strength not compatible. When the micro-mirror torsion beam is manufactured by using other materials as the basis, the obtained beam structure still has insufficient strength and high toughness, so that a preparation method with low cost, high torsion and high strength is needed.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides: a method of integrating scanning micromirrors with a 3D printing torsion Liang Weixing.
The technical scheme adopted for solving the technical problems is as follows: a method of 3D printing torsion Liang Weixing integrated scanning micro-mirrors, comprising the steps of:
step one, depositing a layer of SiO2 on a Si layer;
step two, photoresist is coated on the SiO2 surface in a spin mode, and partial photoresist is etched by utilizing MEMS photoetching technology to obtain a torsion beam plane structure;
thirdly, printing slurry to fill gaps of the photoresist by using a 3D printing technology;
step four, removing the solvent in the printing material, and leaving the reinforcing material in the slurry;
step five, densifying the torsion beam structure by using a CVD additive coating on the reinforcing material;
step six, reversely etching out torsion Liang Deceng, etching silicon dioxide by using HF, releasing the monocrystalline silicon micromechanical structure of the device layer, and leaving a micromirror torsion beam;
step seven, etching to remove the residual photoresist material;
and step eight, breaking the supporting beam by the laser modifier, and remaining the needed torsion beam.
Preferably, in the third step, the 3D printing paste preparation method includes the following steps:
firstly, dissolving a solvent into distilled water, stirring and dissolving for 1-2 hours at room temperature by a magnetic stirrer, and preparing a solution with a certain range;
secondly, configuring corresponding one-dimensional nano reinforcing materials such as carbon nano tube powder, cellulose, ceramic nano fibers and ceramic whiskers according to the micro-mirror torsion beam to be printed;
and thirdly, adding powder into the solution obtained in the first step, and stirring by ultrasonic vibration to obtain printing slurry. Preferably, in the sixth step, the specific method of back etching is as follows:
etching the back substrate monocrystalline silicon corresponding to the micro mirror and torsion beam structure by DRIE until the silicon dioxide layer stops;
a second step of removing the exposed silicon dioxide layer from the back surface using HF;
and thirdly, successfully removing the upper layer and the lower layer, and releasing the micro-mirror torsion beam in a suspending way.
Preferably, carbon nanotube quantum materials are also added in the 3D printing slurry.
Compared with the prior art, the method for integrating the 3D printing torsion Liang Weixing with the scanning micro mirror has the beneficial effects that:
1. the cost for preparing the micro-mirror torsion beam by taking the SOI substrate as a material is greatly reduced by using the pure silicon substrate;
2. reinforcing materials such as carbon nano tubes are added into the printing slurry, so that the strength and toughness of the torsion beam can be improved, the torsion angle and strength of the beam are increased, and the control of the micro mirrors is enhanced;
3. the 3D printing technology is mature at present, and the 3D printing micro-mirror torsion beam can improve the preparation speed of the beam and reduce the time cost;
1. the micro-mirror torsion beam prepared by the method can be finished by using a 3D printer and simple etching raw materials, and the equipment is simpler.
Drawings
FIG. 1 is a schematic diagram of a micro integrated scanning micro-mirror development method based on a 3D printing torsion beam;
in the figure: a is to deposit SIO2 on the SI layer, B is to spin-coat photoresist on the SIO2 layer, C is to print out a torsion beam containing one-dimensional fiber material by using a 3D printing nozzle, D is a device after printing is finished, E is the torsion beam after back etching is released, and F is a finished micro-mirror torsion beam after photoresist is finally removed.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
According to fig. 1, a method for integrating a scanning micro-mirror with a 3D printing torsion Liang Weixing comprises the following preparation steps:
step one, depositing a layer of SiO2 on a Si layer;
step two, photoresist is coated on the SiO2 surface in a spin mode, and partial photoresist is etched by utilizing MEMS photoetching technology to obtain a torsion beam plane structure;
thirdly, printing slurry to fill gaps of the photoresist by using a 3D printing technology;
step four, removing the solvent in the printing material, and leaving the reinforcing material in the slurry;
step five, densifying the torsion beam structure by using a CVD additive coating on the reinforcing material;
step six, reversely etching out torsion Liang Deceng, etching silicon dioxide by using HF, releasing the monocrystalline silicon micromechanical structure of the device layer, and leaving a micromirror torsion beam;
step seven, etching to remove the residual photoresist material;
and step eight, breaking the supporting beam by the laser modifier, and remaining the needed torsion beam.
In the third step, the preparation method of the 3D printing paste comprises the following steps:
firstly, dissolving a solvent into distilled water, stirring and dissolving for 1-2 hours at room temperature by a magnetic stirrer, and preparing a solution with a certain range;
secondly, configuring corresponding one-dimensional nano reinforcing materials such as carbon nano tube powder, cellulose, ceramic nano fibers and ceramic whiskers according to the micro-mirror torsion beam to be printed;
and thirdly, adding powder into the solution obtained in the first step, and stirring by ultrasonic vibration to obtain printing slurry. In the sixth step, the specific method of the reverse etching is as follows:
etching the back substrate monocrystalline silicon corresponding to the micro mirror and torsion beam structure by DRIE until the silicon dioxide layer stops;
a second step of removing the exposed silicon dioxide layer from the back surface using HF;
and thirdly, successfully removing the upper layer and the lower layer, and releasing the micro-mirror torsion beam in a suspending way.
Carbon nanotube quantum materials are also added into the 3D printing slurry.
Example 1:
(1) Growing a SiO2 film on the surface of the cleaned silicon by PECVD, wherein the empirical selection ratio of silicon to SiO2 is 100:1, a step of;
(2) Coating photoresist on the surface of a sample in a spin coating mode, and simultaneously, leaving a printing groove of the torsion beam by a dry etching sacrificial layer method;
(3) According to the requirements of a micro-mirror torsion beam material, dissolving PEO powder into distilled water, stirring and dissolving the distilled water for 1-2 hours at room temperature by a magnetic stirrer to prepare a PEO solution with the weight percent of 5%, and adding carbon nano tubes with the content of 20%, and uniformly mixing the mixture to finally prepare printing slurry;
(4) Starting a printer, formally printing the micro-mirror torsion beam, and taking out a printing piece after printing is finished;
(5) Dissolving PEO fiber film in the printing piece in water to obtain a carbon nano tube material layer prepared by 3D printing; the method comprises the steps of carrying out a first treatment on the surface of the
(6) Introducing a carbon-containing gaseous substance into a high-purity high-performance solid film by taking hydrogen as a reducing gas in a high-vacuum environment by utilizing a chemical vapor deposition method;
(7) The printing piece is placed in an H2O/O2 gas atmosphere for dry cleaning, dried under the condition of CF4 plasma, dried under the condition of O2 plasma, and finally residual photoresist is removed;
(8) And etching redundant parts on the silicon substrate by DRIE to obtain the complete micro-mirror torsion beam connected with the micro-mirror.
The foregoing is a further detailed description of the invention in connection with the preferred embodiments, and it is not intended that the invention be limited to the specific embodiments described. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the invention, and these should be considered to be within the scope of the invention.
Claims (4)
1. A method for integrating a scanning micro-mirror with a 3D printing torsion Liang Weixing, comprising the following steps:
step one, depositing a layer of SiO2 on a Si layer;
step two, photoresist is coated on the SiO2 surface in a spin mode, and partial photoresist is etched by utilizing MEMS photoetching technology to obtain a torsion beam plane structure;
thirdly, printing slurry to fill gaps of the photoresist by using a 3D printing technology;
step four, removing the solvent in the printing material, and leaving the reinforcing material in the slurry;
step five, densifying the torsion beam structure by using a CVD additive coating on the reinforcing material;
step six, reversely etching out torsion Liang Deceng, etching silicon dioxide by using HF, releasing the monocrystalline silicon micromechanical structure of the device layer, and leaving a micromirror torsion beam;
step seven, etching to remove the residual photoresist material;
and step eight, breaking the supporting beam by the laser modifier, and remaining the needed torsion beam.
2. The method of integrating a scanning micromirror with a 3D printing torque Liang Weixing as claimed in claim 1, wherein in the third step, the 3D printing paste is prepared as follows:
firstly, dissolving a solvent into distilled water, stirring and dissolving for 1-2 hours at room temperature by a magnetic stirrer, and preparing a solution with a certain range;
secondly, configuring corresponding one-dimensional nano reinforcing materials such as carbon nano tube powder, cellulose, ceramic nano fibers and ceramic whiskers according to the micro-mirror torsion beam to be printed;
and thirdly, adding powder into the solution obtained in the first step, and stirring by ultrasonic vibration to obtain printing slurry.
3. The method for integrating a scanning micromirror with a 3D printing torsion Liang Weixing as claimed in claim 1, wherein in the sixth step, the specific method for back etching is as follows:
etching the back substrate monocrystalline silicon corresponding to the micro mirror and torsion beam structure by DRIE until the silicon dioxide layer stops;
a second step of removing the exposed silicon dioxide layer from the back surface using HF;
and thirdly, successfully removing the upper layer and the lower layer, and releasing the micro-mirror torsion beam in a suspending way.
4. The method of integrating scanning micro-mirrors with 3D printing torsion Liang Weixing of claim 1, wherein carbon nanotube quantum material is further added to the 3D printing paste.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310018914.XA CN116100845A (en) | 2023-01-06 | 2023-01-06 | Method for integrating 3D printing torsion Liang Weixing with scanning micro-mirror |
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Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001048527A2 (en) * | 1999-12-28 | 2001-07-05 | Robert Bosch Gmbh | Micromirror |
| KR20030047019A (en) * | 2001-12-07 | 2003-06-18 | 조동일 | Micromirror and the Fabrication Method Therefor |
| KR20060018683A (en) * | 2004-08-25 | 2006-03-02 | 엘지전자 주식회사 | Electrostatic mems scanning micromirror and fabrication method thereof |
| CN1844938A (en) * | 2006-05-12 | 2006-10-11 | 中国科学院上海微***与信息技术研究所 | Optical current sensor based on microelectronic mechanical system, making and detecting method thereof |
| CN101852917A (en) * | 2010-03-31 | 2010-10-06 | 重庆大学 | Large turn angle piezoelectric scanning micromirror |
| US20110085220A1 (en) * | 2009-10-08 | 2011-04-14 | Eiji Mochizuki | Optical scanning device, image forming apparatus, and image projection device |
| CN104742369A (en) * | 2015-03-16 | 2015-07-01 | 东莞劲胜精密组件股份有限公司 | 3D printing device and method |
| US20180017783A1 (en) * | 2016-07-13 | 2018-01-18 | Senplus Inc. | Scanning micromirror |
| CN107601425A (en) * | 2017-08-10 | 2018-01-19 | 大连理工大学 | A kind of printing manufacture method of nano beam structure |
| CN110737088A (en) * | 2019-10-10 | 2020-01-31 | 贺思源 | External electromagnet flexible printed circuit board micro-mirror for large-angle laser scanning |
| CN111856430A (en) * | 2020-07-28 | 2020-10-30 | 合肥工业大学 | Double-layer comb tooth driving MEMS scanning mirror for laser radar and preparation method |
| CN113960782A (en) * | 2021-11-12 | 2022-01-21 | 苏州知芯传感技术有限公司 | Electrostatic MEMS micro-mirror with piezoresistive feedback and manufacturing method |
| CN114408854A (en) * | 2021-12-16 | 2022-04-29 | 西北工业大学宁波研究院 | Two-dimensional micromechanical bidirectional torsion mirror array and manufacturing method thereof |
| CN115397651A (en) * | 2020-05-11 | 2022-11-25 | Io技术集团公司 | System and method for high resolution negative 3D printer |
-
2023
- 2023-01-06 CN CN202310018914.XA patent/CN116100845A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001048527A2 (en) * | 1999-12-28 | 2001-07-05 | Robert Bosch Gmbh | Micromirror |
| KR20030047019A (en) * | 2001-12-07 | 2003-06-18 | 조동일 | Micromirror and the Fabrication Method Therefor |
| KR20060018683A (en) * | 2004-08-25 | 2006-03-02 | 엘지전자 주식회사 | Electrostatic mems scanning micromirror and fabrication method thereof |
| CN1844938A (en) * | 2006-05-12 | 2006-10-11 | 中国科学院上海微***与信息技术研究所 | Optical current sensor based on microelectronic mechanical system, making and detecting method thereof |
| US20110085220A1 (en) * | 2009-10-08 | 2011-04-14 | Eiji Mochizuki | Optical scanning device, image forming apparatus, and image projection device |
| CN101852917A (en) * | 2010-03-31 | 2010-10-06 | 重庆大学 | Large turn angle piezoelectric scanning micromirror |
| CN104742369A (en) * | 2015-03-16 | 2015-07-01 | 东莞劲胜精密组件股份有限公司 | 3D printing device and method |
| US20180017783A1 (en) * | 2016-07-13 | 2018-01-18 | Senplus Inc. | Scanning micromirror |
| CN107601425A (en) * | 2017-08-10 | 2018-01-19 | 大连理工大学 | A kind of printing manufacture method of nano beam structure |
| CN110737088A (en) * | 2019-10-10 | 2020-01-31 | 贺思源 | External electromagnet flexible printed circuit board micro-mirror for large-angle laser scanning |
| CN115397651A (en) * | 2020-05-11 | 2022-11-25 | Io技术集团公司 | System and method for high resolution negative 3D printer |
| CN111856430A (en) * | 2020-07-28 | 2020-10-30 | 合肥工业大学 | Double-layer comb tooth driving MEMS scanning mirror for laser radar and preparation method |
| CN113960782A (en) * | 2021-11-12 | 2022-01-21 | 苏州知芯传感技术有限公司 | Electrostatic MEMS micro-mirror with piezoresistive feedback and manufacturing method |
| CN114408854A (en) * | 2021-12-16 | 2022-04-29 | 西北工业大学宁波研究院 | Two-dimensional micromechanical bidirectional torsion mirror array and manufacturing method thereof |
Non-Patent Citations (4)
| Title |
|---|
| 徐士浩: "面向激光雷达的双轴MEMS微镜结构设计与制备工艺研究", 《工程科技 信息科技》, no. 3, 1 March 2022 (2022-03-01), pages 38 - 53 * |
| 惠瑜;高超群;王磊;景玉鹏;陈大鹏;: "电磁驱动推拉式射频MEMS开关的设计与制作", 微纳电子技术, no. 06, 15 June 2010 (2010-06-15) * |
| 李加东;张平;吴一辉;宣明;刘永顺;王淑荣;: "用于微镜制作的叠层光刻胶工艺及残余应力控制", 光学精密工程, no. 11, 15 November 2008 (2008-11-15) * |
| 王丛舜, 熊春阳, 杨振川, 张大成, 方竞: "一种新型静电驱动的单轴扭转微镜", 微纳电子技术, no. 1 * |
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