CN116093005A - Silicon carbide wafer cleaning device and method - Google Patents
Silicon carbide wafer cleaning device and method Download PDFInfo
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- CN116093005A CN116093005A CN202310122025.8A CN202310122025A CN116093005A CN 116093005 A CN116093005 A CN 116093005A CN 202310122025 A CN202310122025 A CN 202310122025A CN 116093005 A CN116093005 A CN 116093005A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 45
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000003860 storage Methods 0.000 claims abstract description 20
- 239000000725 suspension Substances 0.000 claims abstract description 16
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 13
- 230000009347 mechanical transmission Effects 0.000 claims description 23
- 230000000149 penetrating effect Effects 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 8
- 239000003513 alkali Substances 0.000 claims description 6
- 238000011010 flushing procedure Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 241000252254 Catostomidae Species 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 96
- 230000006978 adaptation Effects 0.000 description 7
- 239000003351 stiffener Substances 0.000 description 5
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application provides a silicon carbide wafer cleaning device and a method, which relate to wafer cleaning and comprise a wafer storage tray, wherein a lifting assembly is fixedly connected to the inner bottom wall of the wafer storage tray, a bearing table is placed on one side of the wafer storage tray, a carrier rod moves downwards through the arranged sucker assembly and the lifting assembly, when a wafer on the lifting assembly contacts with a pneumatic sucker, a connecting transverse plate enables the other end to lift upwards due to the fact that one end is stressed, conical clamping plates on two sides can enable a suspension arm to extend outwards due to the fact that a reinforcing rod is fixed, when the expanded conical clamping plates contact the wafer, the wafer is lapped on the surface of a placing groove of the wafer through the placing groove on the inner side, and the problem that the pneumatic sucker is required to be sequentially sucked from the wafer storage tray is avoided; the wafer is fixed, and meanwhile, the position deviation is prevented when the sucking disc is sucked, so that the wafer corner degree deviation is caused, the distance between the pneumatic sucking disc and the tray is reduced, and the sucking and transporting efficiency is improved.
Description
Technical Field
The invention relates to the field of wafer cleaning, in particular to a silicon carbide wafer cleaning device and method.
Background
In semiconductor manufacturing, processing a wafer into a wafer that is populated with integrated circuit devices involves up to several hundred steps. The mainstream processes involved in these processes include photolithography, dry etching, physical vapor deposition, chemical vapor deposition, etc., and usually only manual movement or cleaning of the wafer is used when the wafer is cleaned.
Silicon carbide wafers generally have lattice distortions that require cleaning with a hot solution of KOH prior to use, resulting in a reduction or partial repair of the lattice distortion. The traditional method is carried out manually, for example, silicon carbide wafers are clamped by forceps to be cleaned and put back in KOH hot solution, which is time-consuming and labor-consuming, and is easy to cause alkali liquor to be scattered and splash to hurt the skin.
Disclosure of Invention
The invention aims to provide a silicon carbide wafer cleaning device and a silicon carbide wafer cleaning method, which solve the problems that the traditional method is manually carried out by arranging a sucker assembly, a lifting assembly and a mechanical transmission arm, for example, a tweezers are used for clamping the silicon carbide wafer to clean and put the silicon carbide wafer in KOH hot solution, time and labor are wasted, alkali liquor is easy to spill, and skin is easy to splash.
In order to achieve the above object, the present invention provides the following technical solutions:
silicon carbide wafer cleaning apparatus and method to solve the above-mentioned problems.
The application is specifically such that:
including the wafer accomodates and holds in the palm, the interior bottom wall fixedly connected with of wafer accomodates and holds in the palm lifts the subassembly, the plummer has been placed to one side of wafer accomodates in the palm, one side fixed mounting of plummer upper surface has the solution hot bath cauldron, the middle part fixed mounting of solution hot bath cauldron upper surface has the wafer to wash the dish, one side fixed mounting that the plummer kept away from the wafer and washes the dish upper surface has the mechanical transmission arm, the one end fixed mounting of mechanical transmission arm has the sucking disc subassembly, the sucking disc subassembly all is placed in the top of wafer washing the dish and the top of wafer accomodates the palm, the upper surface middle part fixed mounting of sucking disc subassembly has drive assembly, the wafer is accomodate the support and is constituteed through the rack, the inside wall fixed mounting of rack has the riser.
As the preferred technical scheme of this application, the quantity of stepped plate is a plurality of to form evenly distributed with vertical array, a plurality of the stepped plate with lift subassembly looks adaptation, drive assembly includes the mounting bracket of fixed mounting at mechanical transmission arm front end, the interior roof through-connection of mounting bracket has the cylinder, the inherent ejector pin of one end of cylinder, the one end fixed mounting of ejector pin has the floating joint.
As the preferred technical scheme of this application, one side through-connection that the cylinder is close to the ejector pin has the backup pad, ejector pin through-connection has linear bearing in the one end through-connection of floating joint, linear bearing and cylinder are all through backup pad fixed mounting on the inside wall of mounting bracket, the ejector pin runs through linear bearing and floating joint's one end fixed mounting at the upper surface of sucking disc subassembly.
As the preferred technical scheme of this application, sucking disc subassembly includes the movable block of fixed mounting in ejector pin one end, movable block and cylinder looks adaptation, the equal fixed mounting in both sides of movable block bears the side arm, bear side arm's a side surface edge through pivot swing joint has the suspension arm, side surface bottom of suspension arm has the swing arm of force through pivot swing joint.
As the preferred technical scheme of this application, bear the weight of and link each other through the pivot between side arm, suspension arm and the swing arm of force, swing arm of force one side surface activity joint has the stiffener, swing arm of force has the toper grip block through the extrados swing joint of stiffener, the standing groove has been seted up to the inside wall bottom of toper grip block, a side surface of standing groove is equipped with arc portion.
As the preferred technical scheme of this application, two equal fixed mounting in both ends of stiffener has the sucking disc frame, the sucking disc frame comprises horizontal pole and vertical pole, the contained angle department between sucking disc frame horizontal pole and vertical pole is fixed to the stiffener, the horizontal pole department lower surface of sucking disc frame both sides all fixed mounting has a plurality of pneumatic sucking discs, the slope of toper grip block runs through to the surface of sucking disc frame to with pneumatic sucking disc looks adaptation.
As the preferred technical scheme of this application, lift the subassembly and accomodate the spill frame of holding in the palm upper surface both sides including fixed mounting at the wafer, two the inside wall top of spill frame is through pivot swing joint diaphragm, one side surface of connecting the diaphragm has the fixed pin through pivot swing joint, the opposite side surface of connecting the diaphragm has the lift pole through pivot swing joint, the upper surface fixed mounting who lifts the pole has the tray.
As the preferred technical scheme of this application, the tray is with the wafer looks adaptation on the riser, the upper surface middle part fixed mounting of fixed pin has the telescopic link, the top through connection of telescopic link has vertical bearing housing, the extrados of vertical bearing housing has L shape connecting plate through bolt fixed mounting, one side surface of L shape connecting plate is through bolt fixed mounting on one side surface of holding in the palm is accomodate to the wafer, the top of telescopic link and the horizontal pole looks adaptation on the sucking disc frame.
As the preferred technical scheme of this application, looks activity adaptation between pneumatic sucking disc and the tray, sucking disc subassembly is rotatory to be driven through the mechanical transmission arm to accomodate the support looks adaptation with solution hot bath cauldron and wafer.
A method of cleaning a silicon carbide wafer, comprising the steps of;
the chuck assembly is driven to move to the upper side of the wafer storage tray through the mechanical transmission arm, the conical clamping plates inside the chuck assembly move downwards to overlap the two sides of the wafer when the pneumatic chuck contacts the wafer, the conical clamping plates on the two sides are clamped and fixed after the pneumatic chuck is sucked, the wafer is ensured to be fixed, and meanwhile, position deviation is prevented from occurring when the chuck is sucked, so that the wafer is deflected.
The wafer in the wafer storage tray is lifted by the tray in the lifting assembly, and the line spacing between the wafer and the pneumatic sucker is further shortened by the cooperation between the sucker frame in the sucker assembly and the telescopic rod, so that the sucking and transporting efficiency is improved.
The sucking disc assembly after being driven to be sucked by the mechanical transmission arm moves to the upper part of the wafer flushing vessel and is cleaned by the solution hot bath vessel, so that the mechanical cleaning is realized, the problem that alkali liquor is scattered and skin is splashed by manual execution is avoided, and the cleaning efficiency is improved.
Compared with the prior art, the invention has the beneficial effects that:
in the scheme of the application:
1. through the sucking disc subassembly and the lifting subassembly that set up, realized that the ejector pin moves down, when making the wafer on the lifting subassembly contact with pneumatic chuck, the horizontal pole of sucking disc frame one side can extrude the telescopic link in the subassembly, make the connection diaphragm make the other end upwards rise because of one end atress, and drive the lifting pole of the other end upwards move and make the tray lift the wafer of placing on the step board of bottom to the top, and the toper grip block of both sides can be because of the fixed of stiffener, make the removal of swing arm of force make the suspension arm outwards extend equally, when the toper grip block of expansion contacted the wafer overlap joint the surface of wafer at its standing groove through the standing groove of inboard has solved the problem that need pneumatic chuck to take in proper order from the wafer to accomodate in the prior art; the wafer is fixed, and meanwhile, the position deviation is prevented when the sucking disc is sucked, so that the wafer corner degree deviation is caused, the distance between the pneumatic sucking disc and the tray is reduced, and the sucking and transporting efficiency is improved.
2. Through the drive assembly, mechanical transmission arm and the device such as wafer washware that set up, the inside cylinder of drive assembly starts, and drive the ejector pin downwardly moving, be connected through floating joint and linear bearing, make the ejector pin fixedly extend to on the movable block in the sucking disc subassembly, and transport to the top of wafer washware through mechanical transmission arm has been solved among the prior art and has been cleaned and put back the problem of putting in KOH hot solution through the tweezers of manual work taking, reduce artifical participation, guarantee personnel's safety.
Drawings
FIG. 1 is a schematic plan view of a silicon carbide wafer cleaning apparatus and method provided herein;
FIG. 2 is a schematic view of a silicon carbide wafer cleaning apparatus and method provided herein;
FIG. 3 is a schematic view of a part of the structure of the driving assembly and the chuck assembly of the apparatus and method for cleaning silicon carbide wafers provided in the present application;
FIG. 4 is a schematic view of a wafer carrier of the apparatus and method for cleaning silicon carbide wafers provided herein;
FIG. 5 is a schematic view of the internal structure of a chuck assembly of the apparatus and method for cleaning silicon carbide wafers provided herein;
FIG. 6 is a schematic view of a lift assembly of the apparatus and method for cleaning silicon carbide wafers provided herein;
FIG. 7 is a schematic view of a lift assembly disassembled structure of the apparatus and method for cleaning silicon carbide wafers provided herein;
FIG. 8 is a schematic view of a chuck assembly of a silicon carbide wafer cleaning apparatus and method provided herein;
fig. 9 is a schematic diagram of a transmission assembly disassembly structure of the apparatus and method for cleaning silicon carbide wafers provided in the present application.
The figures indicate:
1. a wafer receiving tray;
2. a lifting assembly; 201. a concave frame; 202. a connecting transverse plate; 203. a fixing pin; 204. a lifting rod; 205. a tray; 206. a telescopic rod; 207. a longitudinal bearing sleeve; 208. an L-shaped connecting plate;
3. a carrying platform;
4. a solution heating bath kettle;
5. rinsing the wafer;
6. a mechanical transmission arm;
7. a suction cup assembly; 701. a movable block; 702. a load-bearing side arm; 703. a suspension arm; 704. swinging the arm of force; 705. a reinforcing rod; 706. a conical clamping plate; 707. a placement groove; 708. a suction cup holder; 709. a pneumatic chuck;
8. a transmission assembly; 801. a mounting frame; 802. a cylinder; 803. a push rod; 804. a floating joint; 805. a linear bearing;
9. a placing rack;
10. a step plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. It will be apparent that the described embodiments are some, but not all, embodiments of the invention.
Thus, the following detailed description of the embodiments of the invention is not intended to limit the scope of the invention, as claimed, but is merely representative of some embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, under the condition of no conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present invention, it should be noted that, the terms "upper", "lower", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or an azimuth or a positional relationship conventionally put in use of the inventive product, or an azimuth or a positional relationship conventionally understood by one skilled in the art, such terms are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element to be referred must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Referring to fig. 1 to 9, the present invention provides a technical solution: and cleaning the silicon carbide wafer.
Example 1:
as shown in fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, fig. 7, fig. 8 and fig. 9, the embodiment provides a silicon carbide wafer cleaning device, including a wafer accommodating tray 1, an inner bottom wall of the wafer accommodating tray 1 is fixedly connected with a lifting assembly 2, a carrying table 3 is placed on one side of the wafer accommodating tray 1, a solution hot bath kettle 4 is fixedly installed on one side of an upper surface of the carrying table 3, a wafer rinsing dish 5 is fixedly installed on a middle part of the upper surface of the solution hot bath kettle 4, a mechanical transmission arm 6 is fixedly installed on one side of the carrying table 3 away from the upper surface of the wafer rinsing dish 5, a sucker assembly 7 is fixedly installed at one end of the mechanical transmission arm 6, the sucker assembly 7 is placed above the wafer rinsing dish 5 and above the wafer accommodating tray 1, a transmission assembly 8 is fixedly installed on the middle part of the upper surface of the sucker assembly 7, the wafer accommodating tray 1 is composed by a placing rack 9, and a step plate 10 is fixedly installed on the inner side wall of the placing rack 9.
The chuck assembly 7 is driven to move to the upper side of the wafer storage tray 1 through the mechanical transmission arm 6, and the tray 205 in the lifting assembly 2 is lifted, so that the conical clamping plates 706 inside the downward moving pneumatic chuck 709 are lapped on two sides of the wafer when the wafer is contacted, when the conical clamping plates 706 on two sides of the pneumatic chuck 709 are clamped and fixed, the wafer is ensured to be fixed, the position deviation is prevented when the chuck absorbs, the wafer corner deviation is caused, meanwhile, the chuck assembly 7 after the suction is driven to move to the upper side of the wafer flushing dish 5 through the mechanical transmission arm 6, the mechanical cleaning is realized, the problem that alkali liquor is scattered and skin is splashed due to manual execution is avoided, and the cleaning efficiency is improved.
Example 2:
the scheme of example 1 is further described in conjunction with the specific operation described below:
as shown in fig. 1, fig. 2, fig. 3, fig. 5, fig. 8 and fig. 9, as a preferred embodiment, further, the number of the stepped plates 10 is several, and is uniformly distributed in a longitudinal array, the number of the stepped plates 10 is adapted to the lifting assembly 2, the transmission assembly 8 includes a mounting frame 801 fixedly mounted at the front end of the mechanical transmission arm 6, an inner top wall of the mounting frame 801 is connected with a cylinder 802 in a penetrating manner, one end of the cylinder 802 is provided with a mandrel 803, one end of the mandrel 803 is fixedly mounted with a floating joint 804, one side of the cylinder 802 close to the mandrel 803 is connected with a supporting plate in a penetrating manner, one end of the mandrel 803 is connected with a linear bearing 805 in a penetrating manner, the linear bearing 805 and the cylinder 802 are fixedly mounted on the inner side wall of the mounting frame 801 through the supporting plate, the ejector rod 803 penetrates through the linear bearing 805 and one end of the floating joint 804 to be fixedly arranged on the upper surface of the sucker assembly 7, the sucker assembly 7 comprises a movable block 701 fixedly arranged at one end of the ejector rod 803, the movable block 701 is matched with the air cylinder 802, two sides of the movable block 701 are fixedly provided with a bearing side arm 702, the edge of one side surface of the bearing side arm 702 is movably connected with a suspension arm 703 through a rotating shaft, the bottom of one side surface of the suspension arm 703 is movably connected with a swinging arm 704 through a rotating shaft, the bearing side arm 702, the suspension arm 703 and the swinging arm 704 are mutually linked through the rotating shaft, one side surface of the swinging arm 704 is movably clamped with a reinforcing rod 705, the swinging arm 704 is movably connected with a conical clamping plate 706 through an outer cambered surface of the reinforcing rod 705, the bottom of the inner side wall of the conical clamping plate 706 is provided with a placing groove 707, one side surface of the placing groove 707 is provided with an arc part, two both ends of the reinforcing rod 705 are fixedly provided with a sucker frame 708, the sucker frame 708 is composed of a transverse rod and a longitudinal rod, the reinforcing rod 705 is fixed at an included angle between the transverse rod and the longitudinal rod of the sucker frame 708, the lower surfaces of the transverse rods on two sides of the sucker frame 708 are fixedly provided with a plurality of pneumatic suckers 709, and the conical clamping plates 706 obliquely penetrate through the surface of the sucker frame 708 and are matched with the pneumatic suckers 709.
When the sucker assembly 7 moves to the upper part of the wafer accommodating support 1 through the mechanical transmission arm 6 and moves downwards, meanwhile, the sucker frame 708 in the sucker assembly 7 extrudes the lifting assembly 2, so that the lifting assembly 2 is lifted upwards, meanwhile, the cylinder 802 in the transmission assembly 8 is started and drives the ejector rod 803 to move downwards, the ejector rod 803 is fixedly extended to the movable block 701 in the sucker assembly 7 through the connection of the floating joint 804 and the linear bearing 805, the automation degree is further improved, when the ejector rod 803 moves downwards, the wafer on the lifting assembly 2 is contacted with the pneumatic sucker 709, the conical clamping plates 706 on two sides can expand outwards due to the fixation of the reinforcing rod 705, meanwhile, due to the linkage between the swinging arm 704, the suspension arm 703 and the bearing side arm 702, the movement of the swinging arm 703 also extends outwards, when the expanded conical clamping plates 706 are contacted with the wafer, the wafer is lapped on the surface of the placing groove 707 through the placing groove on the inner side, meanwhile, due to the downward movement of the sucker frame 708, the two opposite lifting assemblies are completely contracted upwards, and the wafer clamping plates 706 are completely contracted and clamped upwards after the two opposite lifting arms 704 start to move, and the swinging arm 704 starts to clamp the swing arm is completely contracted upwards.
As shown in fig. 2, fig. 4, fig. 6 and fig. 7, as a preferred embodiment, further, the lifting assembly 2 includes concave frames 201 fixedly installed at both sides of the upper surface of the wafer storage tray 1, the tops of the inner side walls of the two concave frames 201 are movably connected with a transverse plate 202 through a rotating shaft, one side surface of the connecting transverse plate 202 is movably clamped with a fixing pin 203 through the rotating shaft, the other side surface of the connecting transverse plate 202 is movably connected with a lifting rod 204 through the rotating shaft, the upper surface of the lifting rod 204 is fixedly provided with a tray 205, the tray 205 is matched with a wafer on the step plate 10, the middle part of the upper surface of the fixing pin 203 is fixedly provided with a telescopic rod 206, the top end of the telescopic rod 206 is penetratingly connected with a longitudinal bearing sleeve 207, the outer arc surface of the longitudinal bearing sleeve 207 is fixedly installed on one side surface of the wafer storage tray 1 through a bolt, the top end of the telescopic rod 206 is matched with a transverse rod 708 on the sucker frame 708, the pneumatic sucker 709 is movably matched with the tray 205, the sucker assembly 7 is rotatably driven by a sucker arm 6, and is matched with the wafer storage tank 1 through a movable arm 4.
When the wafer on the lifting assembly 2 contacts with the sucker frame 708, the cross rod on one side of the sucker frame 708 can squeeze the telescopic rod 206 in the assembly, at this time, the fixing pin 203 fixed on one end of the telescopic rod 206 far away from the sucker frame 708 will squeeze the connecting transverse plate 202 movably clamped, meanwhile, because the concave frame 201 is movably connected to the middle part of the connecting transverse plate 202, when the connecting transverse plate 202 is stressed on one end to enable the other end to lift upwards, and the lifting rod 204 on the other end is driven to move upwards, so that the tray 205 lifts the wafer placed on the step plate 10 on the bottom to the top end, and the distance between the sucker assembly 7 and the lifting assembly 2 is reduced.
Example 3:
the schemes of examples 1 and 2 are further described below in conjunction with specific modes of operation, as described below:
specifically, the method and the operation steps of the silicon carbide wafer cleaning device are as follows:
1. the sucker assembly 7 moves to the upper part of the wafer accommodating support 1 through the mechanical transmission arm 6 and moves downwards, meanwhile, the sucker frame 708 in the sucker assembly 7 extrudes the lifting assembly 2, so that the lifting assembly 2 is lifted upwards, meanwhile, the cylinder 802 in the transmission assembly 8 is started and drives the ejector rod 803 to move downwards, the ejector rod 803 is fixedly extended to the movable block 701 in the sucker assembly 7 through the connection of the floating joint 804 and the linear bearing 805, the automation degree is further improved, the ejector rod 803 moves downwards, when a wafer on the lifting assembly 2 contacts with the sucker frame 708, a cross rod on one side of the sucker frame 708 extrudes the telescopic rod 206 in the assembly, at the moment, the telescopic rod 206 is far away from the fixed pin 203 fixed at one end of the sucker frame 708, the connecting transverse plate 202 movably clamped is extruded,
2. meanwhile, because the concave frame 201 is movably connected to the middle part of the connecting transverse plate 202, when the connecting transverse plate 202 is forced by one end to enable the other end to be lifted upwards, and drives the lifting rod 204 at the other end to move upwards, so that the tray 205 lifts the wafer placed on the step plate 10 at the bottom end to the top end, the distance between the sucker assembly 7 and the lifting assembly 2 is reduced, the conical clamping plates 706 at two sides can enable the swing arm 704 movably connected with the outer cambered surface of the reinforcing rod 705 to expand outwards due to the fixation of the reinforcing rod 705, meanwhile, due to the linkage among the swing arm 704, the suspension arm 703 and the bearing side arm 702, the movement of the swing arm 704 enables the suspension arm 703 to extend outwards as well, when the expanded conical clamping plates 706 contact the wafer, the wafer is lapped on the surface of the placing groove 707 through the placing groove 707 at the inner side,
3. simultaneously, because of the downward movement of the sucker frame 708 and the upward movement of the lifting assembly 2, the two assemblies are oppositely fixed, when the pneumatic sucker 709 is completely sucked, the ejector rod 803 starts to move upwards, at the moment, the swinging arm 704 and the suspension arm 703 start to shrink inwards, so that the conical clamping plate 706 clamps and fixes the wafer, the sucker assembly 7 sucked by the mechanical transmission arm 6 is driven to move to the upper part of the wafer flushing vessel 5, and the mechanical cleaning is realized by cleaning the solution heating bath kettle 4, thereby avoiding the problems of alkali lye scattering and skin splashing caused by manual execution, and improving the cleaning efficiency.
4. The wafer is taken out of the wafer storage tray 1 through the mechanical transmission arm 6, is placed in the solution heating bath kettle 4 for processing through transmission, is placed in the wafer flushing dish 5 for cleaning, and is placed in the wafer tray.
The above embodiments are only for illustrating the present invention and not for limiting the technical solutions described in the present invention, and although the present invention has been described in detail in the present specification with reference to the above embodiments, the present invention is not limited to the above specific embodiments, and thus any modifications or equivalent substitutions are made to the present invention; all technical solutions and modifications thereof that do not depart from the spirit and scope of the invention are intended to be included in the scope of the appended claims.
Claims (10)
1. Silicon carbide wafer belt cleaning device, its characterized in that includes wafer storage support (1), interior bottom wall fixedly connected with of wafer storage support (1) lifts subassembly (2), plummer (3) have been placed to one side of wafer storage support (1), one side fixed mounting of plummer (3) upper surface has solution hot bath cauldron (4), the middle part fixed mounting of solution hot bath cauldron (4) upper surface has wafer to wash dish (5), one side fixed mounting of wafer storage support (3) upper surface is kept away from wafer washing dish (5) has mechanical transmission arm (6), the one end fixed mounting of mechanical transmission arm (6) has sucking disc subassembly (7), sucking disc subassembly (7) all place the top of wafer storage support (1) in the top of wafer washing dish (5), the upper surface middle part fixed mounting of sucking disc subassembly (7) has drive assembly (8), wafer storage support (1) is constituteed through rack (9), inside wall fixed mounting of rack (9) has ladder board (10).
2. The silicon carbide wafer cleaning device according to claim 1, wherein the number of the step plates (10) is a plurality, and the step plates are uniformly distributed in a longitudinal array, the step plates (10) are matched with the lifting assembly (2), the transmission assembly (8) comprises a mounting frame (801) fixedly mounted at the front end of the mechanical transmission arm (6), an air cylinder (802) is connected with the inner top wall of the mounting frame (801) in a penetrating manner, a push rod (803) is fixedly arranged at one end of the air cylinder (802), and a floating joint (804) is fixedly mounted at one end of the push rod (803).
3. The silicon carbide wafer cleaning device according to claim 2, wherein a support plate is connected to one side of the cylinder (802) close to the ejector rod (803) in a penetrating manner, the ejector rod (803) is connected to one end of the floating joint (804) in a penetrating manner, a linear bearing (805) is connected to one end of the floating joint in a penetrating manner, the linear bearing (805) and the cylinder (802) are fixedly installed on the inner side wall of the installation frame (801) through the support plate, and one end of the ejector rod (803) penetrating through the linear bearing (805) and one end of the floating joint (804) are fixedly installed on the upper surface of the sucker assembly (7).
4. The silicon carbide wafer cleaning device according to claim 1, wherein the suction cup assembly (7) comprises a movable block (701) fixedly installed at one end of the ejector rod (803), the movable block (701) is matched with the air cylinder (802), two sides of the movable block (701) are fixedly provided with bearing side arms (702), one side surface edge of the bearing side arms (702) is movably connected with a suspension arm (703) through a rotating shaft, and one side surface bottom of the suspension arm (703) is movably connected with a swinging arm (704) through the rotating shaft.
5. The silicon carbide wafer cleaning device according to claim 4, wherein the bearing side arm (702), the suspension arm (703) and the swinging arm (704) are linked with each other through a rotating shaft, a reinforcing rod (705) is movably clamped on one side surface of the swinging arm (704), a conical clamping plate (706) is movably connected to the swinging arm (704) through an extrados of the reinforcing rod (705), a placing groove (707) is formed in the bottom of the inner side wall of the conical clamping plate (706), and an arc-shaped portion is formed in one side surface of the placing groove (707).
6. The silicon carbide wafer cleaning device according to claim 5, wherein two ends of each reinforcing rod (705) are fixedly provided with a sucker frame (708), each sucker frame (708) comprises a transverse rod and a longitudinal rod, each reinforcing rod (705) is fixed at an included angle between the transverse rod and the longitudinal rod of each sucker frame (708), a plurality of pneumatic suckers (709) are fixedly arranged on the lower surfaces of the transverse rods on two sides of each sucker frame (708), and the conical clamping plates (706) obliquely penetrate through the surfaces of the sucker frames (708) and are matched with the pneumatic suckers (709).
7. The silicon carbide wafer cleaning device according to claim 6, wherein the lifting assembly (2) comprises concave frames (201) fixedly installed on two sides of the upper surface of the wafer storage tray (1), the tops of the inner side walls of the two concave frames (201) are movably connected with a transverse plate (202) through a rotating shaft, one side surface of the transverse plate (202) is movably clamped with a fixing pin (203) through the rotating shaft, the other side surface of the transverse plate (202) is movably connected with a lifting rod (204) through the rotating shaft, and the upper surface of the lifting rod (204) is fixedly provided with a tray (205).
8. The silicon carbide wafer cleaning device according to claim 7, wherein the tray (205) is adapted to the wafer on the step plate (10), a telescopic rod (206) is fixedly installed in the middle of the upper surface of the fixing pin (203), a longitudinal bearing sleeve (207) is connected to the top end of the telescopic rod (206) in a penetrating manner, an L-shaped connecting plate (208) is fixedly installed on the outer cambered surface of the longitudinal bearing sleeve (207) through bolts, one side surface of the L-shaped connecting plate (208) is fixedly installed on one side surface of the wafer accommodating tray (1) through bolts, and the top end of the telescopic rod (206) is adapted to a cross rod on the sucker frame (708).
9. The silicon carbide wafer cleaning device of claim 8, wherein the pneumatic suction cup (709) is movably matched with the tray (205), and the suction cup assembly (7) is driven by the rotation of the mechanical transmission arm (6) and is matched with the solution heating bath kettle (4) and the wafer storage tray (1).
10. A method of using the silicon carbide wafer cleaning device of any of claims 1-9, comprising the steps of:
step one, a step one; the chuck assembly (7) is driven to move to the upper side of the wafer accommodating support (1) through the mechanical driving arm (6), the conical clamping plates (706) inside the wafer accommodating support move downwards when the pneumatic chuck (709) is contacted with the wafer, the conical clamping plates (706) on the two sides of the wafer are clamped and fixed after the pneumatic chuck (709) is sucked, the wafer is ensured to be fixed, and meanwhile, position deviation is prevented from occurring when the chuck absorbs, so that the wafer is deflected.
Step two, a step two is carried out; the wafer in the wafer storage tray (1) is lifted by the tray (205) in the lifting assembly (2), and the line spacing between the wafer and the pneumatic sucker (709) is further shortened by the cooperation between the sucker frame (708) in the sucker assembly (7) and the telescopic rod (206), so that the sucking and transporting efficiency is improved.
Step three, a step of performing; the sucking disc assembly (7) after being sucked is driven by the mechanical driving arm (6) to move to the upper part of the wafer flushing dish (5), and the cleaning is carried out through the solution heating bath kettle (4), so that the mechanical cleaning is realized, the problem that alkali liquor is scattered and the skin is splashed due to manual execution is avoided, and the cleaning efficiency is improved.
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