CN116032238A - Interdigital transducer and honeycomb structure surface acoustic wave filter - Google Patents

Interdigital transducer and honeycomb structure surface acoustic wave filter Download PDF

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Publication number
CN116032238A
CN116032238A CN202310104822.3A CN202310104822A CN116032238A CN 116032238 A CN116032238 A CN 116032238A CN 202310104822 A CN202310104822 A CN 202310104822A CN 116032238 A CN116032238 A CN 116032238A
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CN
China
Prior art keywords
bus bar
resonator unit
series
acoustic wave
surface acoustic
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CN202310104822.3A
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Chinese (zh)
Inventor
安虹瑾
安建光
许夏茜
董元旦
杨涛
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Chengdu Pinnacle Microwave Co Ltd
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Chengdu Pinnacle Microwave Co Ltd
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Priority to CN202310104822.3A priority Critical patent/CN116032238A/en
Publication of CN116032238A publication Critical patent/CN116032238A/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00Reducing energy consumption in communication networks
    • Y02D30/70Reducing energy consumption in communication networks in wireless communication networks

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Abstract

The invention relates to the technical field of surface acoustic wave filters, in particular to an interdigital transducer and a surface acoustic wave filter with a honeycomb structure; the interdigital transducer comprises a first bus bar, a second bus bar, a reflecting grating and interdigital electrodes arranged between the first bus bar and the second bus bar; and the first interdigital electrode and the second interdigital electrode are surrounded by the first bus bar, the second bus bar and the reflecting grating, so that the interdigital transducer with the regular hexagon structure is formed. The bus bar on any side of the hexagon can be connected with the bus bar in a current mode, therefore, a metal winding structure is reduced, the area of the surface acoustic wave layout is reduced, and the product cost is reduced. And because the interdigital transducer is regular hexagon, an included angle corresponding to the main part is formed, sound waves can be reflected, bus bar leakage waves are reduced, and the performance index of the surface acoustic wave filter is improved.

Description

Interdigital transducer and honeycomb structure surface acoustic wave filter
Technical Field
The invention relates to the technical field of surface acoustic wave filters, in particular to an interdigital transducer and a surface acoustic wave filter with a honeycomb structure.
Background
Along with the continuous development of communication technology, the miniaturization requirement of mobile communication equipment on devices is more and more urgent, especially in the aspect of surface acoustic wave filters; a use field Jing Duowei terminal device of the surface acoustic wave filter; in order to reduce the volume of the surface acoustic wave filter, it is important to reduce the planar area of the surface acoustic wave filter, and how to ensure the power capacity and the electrical performance, so that the planar area of the surface acoustic wave filter is minimum is always an important research direction.
The surface acoustic wave filter converts an electric signal on an interdigital transducer (IDT: interdigital transducer) into mechanical energy through the inverse piezoelectric effect of a piezoelectric material, and converts the mechanical energy into the electric signal by utilizing the piezoelectric effect on the other surface of the interdigital transducer, thereby realizing frequency selection; the interdigital transducer of a conventional surface acoustic wave filter is generally formed by a rectangular structure (see fig. 1), and due to structural limitations, there are many special limitations in layout, resulting in an excessive circuit area; if the area of the interdigital transducer is reduced, the problems of reduced power tolerance, reduced electrical performance and the like are caused.
Disclosure of Invention
In order to solve the above-mentioned prior art problems, the present invention provides an interdigital transducer and a surface acoustic wave filter having a honeycomb structure, which at least reduce the circuit area without affecting the power tolerance and the electrical performance.
An interdigital transducer comprising:
a piezoelectric substrate;
two reflective gratings;
a first bus bar and a second bus bar arranged on the piezoelectric substrate at an opposite interval;
a plurality of first interdigital electrodes and a plurality of second interdigital electrodes are alternately arranged between the first bus bar and the second bus bar;
the first interdigital electrode is led out from the first bus bar and extends towards the second bus bar, and a gap is reserved between the extending end of the first interdigital electrode and the second bus bar;
the second interdigital electrode is led out from the second bus bar and extends towards the first bus bar, and a gap is reserved between the extending end of the second interdigital electrode and the first bus bar;
the first bus bar, the second bus bar and the reflecting grating encircle the first interdigital electrode and the second interdigital electrode to form an interdigital transducer with a positive n-shaped structure, wherein n is more than or equal to 6 and is an integer multiple of 2.
According to the invention, the interdigital transducer with the positive n-shaped structure is arranged, n is more than or equal to 6 and is an integer multiple of 2, so that current connection can be performed on the bus bar on any one side of the n-shaped structure, thereby reducing the metal winding structure, being beneficial to reducing the area of the surface acoustic wave layout and reducing the product cost.
And because the interdigital transducer is in a positive n-shape, an included angle corresponding to a main part is formed, sound waves can be reflected, bus bar leakage waves are reduced, and the performance index of the surface acoustic wave filter is improved.
Preferably, n is equal to 6. The interdigital transducer with the regular hexagon structure is preferably adopted, the bus bar on any one side can be connected with current, the metal winding structure is reduced, the area of the surface acoustic wave layout is reduced, and the product cost is reduced; and because the interdigital transducer is regular hexagon, the included angle formed between adjacent edges of the regular hexagon can reflect sound waves, reduce bus bar leakage waves and improve the performance index of the surface acoustic wave filter.
Preferably, any one of the bus bars is connected with one of the reflective grids, and a gap is reserved between the other bus bar and the other reflective grid.
Preferably, two of the bus bars are respectively connected to one of the reflective grids.
Preferably, a gap is reserved between the two bus bars and the reflecting grating.
A honeycomb structure surface acoustic wave filter comprising:
a series resonator group and a parallel resonator group connected between input and output ends of the surface acoustic wave filter;
the resonator adopts the structure of the interdigital transducer.
Preferably, the resonators in the series resonator group and the parallel resonator group are arranged in a honeycomb shape on a substrate.
Preferably, the series resonator group includes a first series resonator unit, a second series resonator unit, a third series resonator unit, and a fourth series resonator unit that are sequentially connected in series;
the parallel resonator unit includes:
the input end of the first parallel resonator unit is connected between the first series resonator unit and the second series resonator unit, and the output end of the first parallel resonator unit is grounded;
the input end of the second parallel resonator unit is connected between the second series resonator unit and the third series resonator unit, and the output end of the second parallel resonator unit is grounded;
and a third parallel resonator unit having an input terminal connected between the third series resonator unit and the fourth series resonator unit, and an output terminal of the third parallel resonator unit being signal-grounded.
Preferably, the first series resonator unit, the second series resonator unit, and the third series resonator unit each include two resonators connected in series with each other.
Preferably, the fourth series resonator unit includes one resonator.
Preferably, each of the first parallel resonator unit and the third parallel resonator unit includes one resonator.
Preferably, the second parallel resonator unit includes two resonators connected in series.
The beneficial effects of the invention at least comprise:
according to the invention, the interdigital transducer with the positive n-shaped structure is arranged, n is more than or equal to 6 and is an integer multiple of 2, so that current connection can be performed on the bus bar on any one side of the n-shaped structure, thereby reducing the metal winding structure, being beneficial to reducing the area of the surface acoustic wave layout and reducing the product cost.
And because the interdigital transducer is in a positive n-shape, an included angle corresponding to a main part is formed, sound waves can be reflected, bus bar leakage waves are reduced, and the performance index of the surface acoustic wave filter is improved.
Drawings
Fig. 1 is a schematic diagram of the overall composition of a conventional interdigital transducer provided by the present invention.
Fig. 2 is a schematic diagram of the overall composition of the interdigital transducer provided by the present invention.
Fig. 3 is a schematic circuit diagram of an embodiment of a surface acoustic wave filter according to the present invention.
Fig. 4 is a schematic diagram of a layout of a conventional interdigital transducer provided by the present invention.
Fig. 5 is a schematic diagram of a layout of an interdigital transducer provided by the present invention.
Fig. 6 is a schematic view of various bus bar structures of the interdigital transducer provided by the invention.
FIG. 7 is a comparative graph of performance tests provided by the present invention.
Reference numerals:
1. a first bus bar; 2. a second bus bar; 3. an interdigital transducer; 4. a reflective grating; 5. and an included angle.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 2, an interdigital transducer, which has a regular hexagonal shape as a whole, comprises:
a piezoelectric substrate;
a first bus bar 1 and a second bus bar 2 arranged at an opposite interval on the piezoelectric substrate;
a plurality of first interdigital electrodes and a plurality of second interdigital electrodes are alternately arranged between the first bus bar 1 and the second bus bar 2;
the first interdigital electrode is led out from the first bus bar 1 and extends towards the second bus bar 2, and the extending end of the first interdigital electrode and the second bus bar 3 keep a gap;
the second interdigital electrode is led out from the second bus bar 2 and extends towards the first bus bar 1, and the extending end of the second interdigital electrode keeps a gap with the first bus bar 1;
the first bus bar 1 and the second bus bar 2 are respectively connected with a reflecting grating;
the first bus bar 1, the second bus bar 2 and the reflecting grating 4 enclose the first interdigital electrode and the second interdigital electrode, and form the interdigital transducer 3 with a regular hexagon structure.
Referring to fig. 2, as the interdigital transducer 3 is hexagonal, the interdigital electrode at the included angle 5 of the hexagon is partially reduced, so that the partial included angle 5 can reflect sound waves, reduce bus bar leakage waves, and further improve the performance index of the surface acoustic wave filter.
Referring to fig. 3 and 5, a surface acoustic wave filter of honeycomb structure includes:
a series resonator group and a parallel resonator group connected between input and output ends of the surface acoustic wave filter;
the resonator adopts the structure of the interdigital transducer 3 described in the present embodiment.
As a further implementation manner in the present embodiment, the series resonator group and the resonators in the parallel resonator group are arranged in a honeycomb shape on a substrate.
As a possible implementation manner in the present embodiment, the series resonator group includes a first series resonator unit, a second series resonator unit, a third series resonator unit, and a fourth series resonator unit that are sequentially connected in series;
the parallel resonator unit includes:
the input end of the first parallel resonator unit is connected between the first series resonator unit and the second series resonator unit, and the output end of the first parallel resonator unit is grounded;
the input end of the second parallel resonator unit is connected between the second series resonator unit and the third series resonator unit, and the output end of the second parallel resonator unit is grounded;
and a third parallel resonator unit having an input terminal connected between the third series resonator unit and the fourth series resonator unit, and an output terminal of the third parallel resonator unit being signal-grounded.
Specifically, referring to fig. 3, the first series resonator unit includes two resonators S1 connected in series with each other;
the second series resonator unit includes two resonators S2 connected in series with each other;
the third series resonator unit includes two resonators S3 connected in series with each other;
the fourth series resonator unit includes one resonator S4;
the first resonator unit, the second resonator unit, the third resonator unit, and the fourth resonator unit are connected in series in this order from the input end to the output end of the surface acoustic wave filter.
The first parallel resonator unit comprises one resonator P1;
the second parallel resonator unit includes two resonators P2 connected in series with each other;
the third parallel resonator unit includes one resonator P3.
As a possible implementation manner in this embodiment, fig. 6 is a schematic diagram of various bus bar structures of the interdigital transducer provided by the present invention, and the interdigital transducer in fig. 6a is in a regular hexagon overall, where the reflective grating at two ends of the resonator is in a triangle structure, and the resonator itself is in an octagon shape. A plurality of first interdigital electrodes and a plurality of second interdigital electrodes are alternately arranged between the first bus bar 1 and the second bus bar 2, and gaps exist between the two bus bars and the reflecting grating.
As a possible implementation manner in this embodiment, the interdigital transducer in fig. 6b has a regular hexagon overall, in which the reflective gratings at two ends of the resonator have a triangular structure, and the resonator itself has an octagon shape. The first bus bar 1 is connected to the left reflection grid and the second bus bar 2 is connected to the right reflection grid.
As a possible implementation manner in this embodiment, the interdigital transducer in fig. 6c has a regular hexagon overall, in which the reflective gratings at two ends of the resonator have a triangular structure, and the resonator itself has an octagon. The first bus bar 1 has a gap with the reflective grids at both ends, and is not connected. The second bus bar 2 is connected to the right reflecting grating and the left reflecting grating is not connected to any bus bar.
As a possible implementation manner in this embodiment, the interdigital transducer in fig. 6d has a regular hexagon overall, in which the reflective gratings at two ends of the resonator have a triangular structure, and the resonator itself has an octagon. The first bus bar 1 has a gap with the reflective grids at both ends, and is not connected. The second bus bar 2 is connected to the left reflecting grating and the right reflecting grating is not connected to any bus bar.
In order to further demonstrate the beneficial effects achieved by the present invention, the following is a test of the existing surface acoustic wave filter and the surface acoustic wave filter proposed by the present invention;
referring to fig. 1, a schematic structure of a conventional surface acoustic wave filter is shown, which also includes:
a first bus bar 1 and a second bus bar 2 arranged at an opposite interval on the piezoelectric substrate;
a reflective grating 4;
a plurality of interdigital electrodes are arranged between the first bus bar 1 and the second bus bar 2, and two adjacent interdigital electrodes are respectively led out from the first bus bar 1 and the second bus bar 2;
the interdigital electrode led out from the first bus bar 1 extends to the second bus bar 2, and a gap is reserved between the extending end and the second bus bar 2;
the interdigital electrode led out from the second bus bar 2 extends to the first bus bar 1, and the extending end and the first bus bar 1 keep a gap.
Referring to fig. 3 and fig. 4 again, fig. 4 is a surface acoustic wave filter structure for layout arrangement using the conventional interdigital transducer 3; fig. 3 is a schematic diagram of a corresponding circuit connection.
Referring to fig. 7, S (16, 17) is a test result of a surface acoustic wave filter with layout arrangement using the conventional interdigital transducer 3; s (24, 25) is the test result of the surface acoustic wave filter formed by the regular hexagon honeycomb interdigital transducer; based on this, passband performance is known to be substantially unchanged; in addition, the honeycomb arrangement is carried out through the hexagonal interdigital transducers, so that the connection winding between the interdigital transducers is reduced, and the flexibility of placing the interdigital transducers on a layout is greatly improved.
In summary, the invention reduces the circuit area on the premise of not affecting the power tolerance degree and the electrical performance; and the flexibility of the interdigital transducer in layout is greatly improved.
In describing embodiments of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "center", "top", "bottom", "inner", "outer", "inside", "outside", etc. indicate orientations or positional relationships based on the drawings are merely for the purpose of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Wherein "inside" refers to an interior or enclosed area or space. "peripheral" refers to the area surrounding a particular component or region.
In the description of embodiments of the present invention, the terms "first," "second," "third," "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", "a third" and a fourth "may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In describing embodiments of the present invention, it should be noted that the terms "mounted," "connected," and "assembled" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, unless otherwise specifically indicated and defined; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the description of embodiments of the invention, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.
In describing embodiments of the present invention, it will be understood that the terms "-" and "-" are intended to be inclusive of the two numerical ranges, and that the ranges include the endpoints. For example, "A-B" means a range greater than or equal to A and less than or equal to B. "A-B" represents a range of greater than or equal to A and less than or equal to B.
In the description of embodiments of the present invention, the term "and/or" is merely an association relationship describing an association object, meaning that three relationships may exist, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (10)

1. An interdigital transducer comprising:
a piezoelectric substrate;
two reflective gratings;
a first bus bar and a second bus bar arranged on the piezoelectric substrate at an opposite interval;
a plurality of first interdigital electrodes and a plurality of second interdigital electrodes are alternately arranged between the first bus bar and the second bus bar;
the first interdigital electrode is led out from the first bus bar and extends towards the second bus bar, and a gap is reserved between the extending end of the first interdigital electrode and the second bus bar;
the second interdigital electrode is led out from the second bus bar and extends towards the first bus bar, and a gap is reserved between the extending end of the second interdigital electrode and the first bus bar;
the first bus bar, the second bus bar and the reflecting grating encircle the first interdigital electrode and the second interdigital electrode to form an interdigital transducer with a positive n-shaped structure, wherein n is more than or equal to 6 and is an integer multiple of 2.
2. An interdigital transducer according to claim 1, wherein n is equal to 6.
3. An interdigital transducer according to claim 1, wherein any one of the bus bars is connected to one of the reflective gratings, and a gap is left between the other bus bar and the other reflective grating.
4. An interdigital transducer according to claim 1, wherein two of the bus bars are each connected to one of the reflective gratings.
5. An interdigital transducer according to claim 1, wherein a gap is maintained between both of the bus bars and the reflective grating.
6. A surface acoustic wave filter of a honeycomb structure, comprising:
a series resonator group and a parallel resonator group connected between input and output ends of the surface acoustic wave filter;
the resonator adopts the structure of the interdigital transducer as claimed in any one of claims 1 to 5.
7. The surface acoustic wave filter of a honeycomb structure according to claim 6, wherein the resonators in the series resonator group and the parallel resonator group are arranged in a honeycomb shape on the substrate.
8. The surface acoustic wave filter of claim 7, wherein the series resonator group includes a first series resonator unit, a second series resonator unit, a third series resonator unit, and a fourth series resonator unit, which are sequentially connected in series.
9. The surface acoustic wave filter of a honeycomb structure according to claim 6, wherein the parallel resonator group comprises:
the input end of the first parallel resonator unit is connected between the first series resonator unit and the second series resonator unit, and the output end of the first parallel resonator unit is grounded;
the input end of the second parallel resonator unit is connected between the second series resonator unit and the third series resonator unit, and the output end of the second parallel resonator unit is grounded;
and a third parallel resonator unit having an input terminal connected between the third series resonator unit and the fourth series resonator unit, and an output terminal of the third parallel resonator unit being signal-grounded.
10. The surface acoustic wave filter of a honeycomb structure according to claim 9, wherein the first series resonator unit, the second series resonator unit, and the third series resonator unit each include two resonators connected in series with each other;
the fourth series resonator unit includes one resonator;
the first parallel resonator unit and the third parallel resonator unit each include one resonator;
the second parallel resonator unit includes two resonators connected in series.
CN202310104822.3A 2023-02-13 2023-02-13 Interdigital transducer and honeycomb structure surface acoustic wave filter Pending CN116032238A (en)

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JP2002353762A (en) * 2001-05-23 2002-12-06 Hitachi Kokusai Electric Inc Manufacturing method for surface acoustic wave element
DE10238932B3 (en) * 2002-08-24 2004-06-09 Deutsches Zentrum für Luft- und Raumfahrt e.V. Sensor and/or actuator component for measuring or operating device with elastically-deformable honeycomb structure and transducer elements converting deformation into electrical signal or vice versa
JP2007097117A (en) * 2005-03-28 2007-04-12 Kyocera Corp Surface acoustic wave resonator, surface acoustic wave filter and surface acoustic wave duplexer, and communication apparatus
US20100176900A1 (en) * 2007-10-18 2010-07-15 Murata Manufacturing Co., Ltd. Surface acoustic wave resonator and ladder-type filter
US20100219910A1 (en) * 2009-03-02 2010-09-02 Denso Corporation Surface acoustic wave device
US20100237963A1 (en) * 2007-12-11 2010-09-23 Murata Manufacturing Co., Ltd. Surface acoustic wave device and duplexer
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US20150021734A1 (en) * 2013-07-18 2015-01-22 Infineon Technologies Dresden Gmbh Semiconductor device, a micro-electro-mechanical resonator and a method for manufacturing a semiconductor device
CN112968687A (en) * 2021-02-18 2021-06-15 浙江大学 High-quality-factor surface acoustic wave resonator
CN215773066U (en) * 2021-09-03 2022-02-08 西安聚安光科物联网科技有限公司 Novel surface acoustic wave filter reflection grating structure and surface acoustic wave filter
CN114268294A (en) * 2022-03-03 2022-04-01 深圳新声半导体有限公司 SAW device including hybrid weighting type reflection grating and hybrid weighting type reflection grating
CN114710134A (en) * 2022-04-08 2022-07-05 浙江星曜半导体有限公司 Surface acoustic wave resonator and surface acoustic wave filter
CN115395922A (en) * 2022-10-28 2022-11-25 成都频岢微电子有限公司 Bulk acoustic wave duplexer

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4683394A (en) * 1983-12-15 1987-07-28 Kabushiki Kaisha Toshiba Acoustic surface wave resonator device
JP2002353762A (en) * 2001-05-23 2002-12-06 Hitachi Kokusai Electric Inc Manufacturing method for surface acoustic wave element
DE10238932B3 (en) * 2002-08-24 2004-06-09 Deutsches Zentrum für Luft- und Raumfahrt e.V. Sensor and/or actuator component for measuring or operating device with elastically-deformable honeycomb structure and transducer elements converting deformation into electrical signal or vice versa
JP2007097117A (en) * 2005-03-28 2007-04-12 Kyocera Corp Surface acoustic wave resonator, surface acoustic wave filter and surface acoustic wave duplexer, and communication apparatus
US20100176900A1 (en) * 2007-10-18 2010-07-15 Murata Manufacturing Co., Ltd. Surface acoustic wave resonator and ladder-type filter
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CN112968687A (en) * 2021-02-18 2021-06-15 浙江大学 High-quality-factor surface acoustic wave resonator
CN215773066U (en) * 2021-09-03 2022-02-08 西安聚安光科物联网科技有限公司 Novel surface acoustic wave filter reflection grating structure and surface acoustic wave filter
CN114268294A (en) * 2022-03-03 2022-04-01 深圳新声半导体有限公司 SAW device including hybrid weighting type reflection grating and hybrid weighting type reflection grating
CN114710134A (en) * 2022-04-08 2022-07-05 浙江星曜半导体有限公司 Surface acoustic wave resonator and surface acoustic wave filter
CN115395922A (en) * 2022-10-28 2022-11-25 成都频岢微电子有限公司 Bulk acoustic wave duplexer

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