CN116031352A

CN116031352A - Micro LED structure, manufacturing method thereof and light-emitting device

Info

Publication number: CN116031352A
Application number: CN202211643055.5A
Authority: CN
Inventors: 符民
Original assignee: Shenzhen Stan Technology Co Ltd
Current assignee: Shenzhen Stan Technology Co Ltd
Priority date: 2022-12-20
Filing date: 2022-12-20
Publication date: 2023-04-28

Abstract

The application provides a miniature LED structure, a preparation method thereof and a light-emitting device, and relates to the technical field of light emission. The miniature LED structure that this application provided includes driver chip, light emitting chip, spotlight layer and apron, light emitting chip with driver chip bonding is connected, one side of spotlight layer is provided with the microlens array, the apron laminate in spotlight layer deviates from one side of microlens array, the microlens array cover in on the light emitting chip. The miniature LED structure can improve the problem that miniature LED structure display effect is poor.

Description

Micro LED structure, manufacturing method thereof and light-emitting device

Technical Field

The application relates to the technical field of luminescence, in particular to a miniature LED structure, a preparation method thereof and a luminescence device.

Background

Micro-LED (Micro-Light Emitting Diode, micro light emitting diode) technology has greater advantages in terms of brightness, resolution, contrast, energy consumption, service life, response speed, thermal stability, and the like, and has wide application prospects in various fields such as flat panel display, augmented Reality (Augmented Reality, AR), virtual Reality (VR), mixed Reality (MR), spatial display, flexible transparent display, wearable/implantable photoelectric devices, optical communication/optical interconnection, medical detection, intelligent car lights, and the like.

In the related art, the micro LED structure has a problem of poor display effect.

Disclosure of Invention

In view of the foregoing, it is an object of the present application to provide a micro LED structure, a method for manufacturing the same, and a light emitting device.

In order to achieve the above purpose, the technical scheme adopted in the application is as follows:

in a first aspect, embodiments of the present application provide a micro LED structure, including:

the driving chip controls the light-emitting work of the micro LED structure;

the light-emitting chip is connected with the driving chip in a bonding way;

a light condensing layer, wherein one side of the light condensing layer is provided with a micro lens array;

the cover plate is attached to one side, away from the micro lens array, of the light condensation layer;

the micro lens array covers one side of the light-emitting chip, which is away from the driving chip.

In one embodiment of the first aspect, an extinction layer is disposed on a side, provided with the microlens array, of the light condensation layer, the extinction layer is provided with a hollowed-out area, and the microlens array is correspondingly disposed in the hollowed-out area.

In one embodiment of the first aspect, a color matching layer is disposed in the hollowed-out area, and a protective layer is disposed on one side of the extinction layer away from the light condensation layer.

In one embodiment of the first aspect, an adhesive frame is disposed on a peripheral side of the light emitting chip, and two sides of the adhesive frame are connected to the protective layer and the driving chip.

In one embodiment of the first aspect, the adhesive frame is a ring-shaped frame structure.

In one embodiment of the first aspect, an adhesive layer is disposed on a side of the light emitting chip facing away from the driving chip, and the protective layer covers the adhesive layer.

In one embodiment of the first aspect, the color matching layer includes at least one group of color matching units, each group of color matching units includes at least two primary color matching units, and the primary colors corresponding to each group of color matching units can synthesize white light.

In one embodiment of the first aspect, each set of the toning units includes a red unit, a green unit, and a blue unit;

the light emitted by the light emitting chip is blue light, red quantum dot materials are filled in the red unit, and green quantum dot materials are filled in the green unit;

or the light emitted by the light emitting chip is purple light, the red quantum dot material is filled in the red unit, the green quantum dot material is filled in the green unit, and the blue quantum dot material is filled in the blue unit.

In one embodiment of the first aspect, the light-condensing layer is a polyester layer, and the refractive index of the polyester layer is 1.65 or more.

In one embodiment of the first aspect, a light extinction layer is disposed on a side, facing away from the microlens array, of the light condensation layer, a hollow area is disposed on the light extinction layer, the microlens array is correspondingly disposed in the hollow area, a color matching layer is disposed in the hollow area, a protective layer is disposed on a side, facing away from the light condensation layer, of the light extinction layer, the color matching layer includes at least one group of color matching units, each group of color matching units includes at least two primary color matching units which are sequentially arranged, and primary colors corresponding to each group of color matching units can synthesize white light;

an adhesive frame is arranged on the periphery of the light-emitting chip, and two sides of the adhesive frame are connected with the protective layer and the driving chip;

or an adhesive layer is arranged on one side of the light-emitting chip, which is away from the driving chip, and the protective layer covers the adhesive layer.

In a second aspect, embodiments of the present application further provide a light emitting device including a micro LED structure as described in any of the embodiments of the first aspect.

In a third aspect, an embodiment of the present application further provides a method for manufacturing a micro LED structure, including:

preparing a condensing layer on one side of the cover plate;

preparing a micro lens array on one side of the light condensation layer, which is away from the cover plate;

providing a base structure after bonding of a light emitting chip and a driving chip, wherein a substrate of the light emitting chip is stripped;

and covering one side of the light-gathering layer, which is provided with the micro lens array, on one side of the light-emitting chip, which is away from the driving chip.

In one embodiment of the third aspect, the preparing a microlens array on a side of the light-condensing layer facing away from the cover plate includes:

preparing a mould corresponding to the pixel matrix of the light-emitting chip in advance, and pressing the mould on the polyester material through a nanoimprint technology to form the micro lens array;

or after a mask corresponding to the pixel matrix of the light emitting chip is paved on the light condensing layer, the micro lens array is obtained through a photoetching technology.

In one embodiment of the third aspect, the method for manufacturing the micro LED structure further includes:

and preparing a extinction layer on one side of the light condensation layer, which is provided with the micro lens array, and arranging a hollow area on the extinction layer so as to expose the micro lens array.

setting a filling quantum dot material in the hollow area to form a color matching layer;

and a protective layer is arranged on one side of the extinction layer, which is away from the light condensation layer.

In one embodiment of the third aspect, the covering the side of the light-gathering layer provided with the microlens array on the light-emitting chip includes:

preparing an adhesive frame on the driving chip, and enabling the adhesive frame to be enclosed on the periphery of the light-emitting chip;

and covering the cover plate and the light condensing layer on the bonding frame.

an adhesive layer is arranged on one side of the light-emitting chip, which is away from the driving chip;

and covering the cover plate and the light condensing layer on the bonding layer.

The application provides a miniature LED structure, a manufacturing method thereof and a light-emitting device. For the correlation technique, this application is through setting up the apron on luminous chip to set up the spotlight layer on the apron, the spotlight layer deviates from one side of apron and is provided with the microlens array. In the working process of the micro LED structure, light rays are refracted through the interfaces of the micro lens array, the light rays are emitted in a straight line in a mutually parallel mode, the divergent light rays are collimated, a good condensing effect is achieved, the utilization rate of the light rays is improved, the light rays are converged, and therefore the light emitting angle of the micro LED structure is controlled, and the display quality and the light emitting brightness are improved. The problem that display effect is poor exists in miniature LED structure among the related art, and this application can collimate the light, improves the light scattering phenomenon to promote miniature LED structure display effect.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 shows a schematic diagram of the optical path structure of a prior art micro LED structure;

FIG. 2 illustrates a schematic diagram of the optical path structure of a micro LED structure in some embodiments of the present application;

FIG. 3 illustrates a schematic structural view of a cover plate in some embodiments of the present application;

FIG. 4 is a schematic diagram of a microlens array in some embodiments of the present application;

FIG. 5 illustrates a schematic diagram of the structure after coating of matting material in some embodiments of the present application;

FIG. 6 illustrates a schematic diagram of the structure of a matting layer in some embodiments of the present application;

FIG. 7 illustrates a schematic structural diagram of a toner layer in some embodiments of the present application;

FIG. 8 illustrates a schematic top view of a matting layer in some embodiments of the present application;

FIG. 9 is a schematic diagram of the structure of a protective layer according to some embodiments of the present application;

FIG. 10 is a schematic diagram showing the structure of a light emitting chip and a driving chip according to some embodiments of the present application;

FIG. 11 illustrates a schematic structural view of an adhesive frame in some embodiments of the present application;

FIG. 12 is a schematic diagram of a frame-mounted micro LED structure according to some embodiments of the present application;

FIG. 13 illustrates a schematic structural view of an adhesive layer in some embodiments of the present application;

FIG. 14 illustrates a schematic diagram of a full-paste micro LED structure in some embodiments of the present application;

FIG. 15 illustrates a flowchart of a method of fabricating a micro-LED structure in some embodiments of the present application;

FIG. 16 illustrates a block diagram of a method of pasting some embodiments of the present application;

fig. 17 illustrates a flow chart of a full-fit method in some embodiments of the present application.

Description of main reference numerals:

1-a light emitting chip.

110-cover plate; 120-concentrating layers; 130-a microlens array; 140-matting layer; 150-protecting layer; 160-a color matching layer; 170-a light emitting chip; 180-driving a chip; 190-bonding pads; 1100-bonding a frame; 1110-hollow out area; 1120-an adhesive layer.

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

As shown in fig. 1, an optical path structure diagram of a micro LED structure in the related art is shown. The inventor of the present application found that, during the operation of the light emitting chip 1, there is a problem that the light emitting angle is large due to the problem of light scattering, resulting in poor display effect of the micro LED structure.

As shown in fig. 2, an embodiment of the first aspect of the present application provides a micro LED structure, which can effectively collimate and converge light, and reduce problems such as optical crosstalk and color shift of a display screen. The method can be used in the fields of AR (Augmented Reality )/VR (Virtual Reality), projection and the like.

Specifically, the micro LED structure includes a driving chip 180, a light emitting chip 170, a light condensing layer 120 and a cover plate 110, wherein the driving chip 180 controls the light emitting operation of the micro LED structure; the light-emitting chip 170 is used as a display light source of the micro LED structure and is connected with the driving chip 180 in a bonding way; the cover plate 110 is disposed on a side of the light emitting chip 170 away from the driving chip 180, that is, on a light emitting side of the light emitting chip 170, and the cover plate 110 is a display interface of a micro LED structure; the condensing layer 120 is disposed on one side of the cover plate 110 near the light emitting chip 170, and is used for collimating and converging light, so as to improve the light emitting efficiency of the light emitting surface.

Further, a micro-lens array 130 is disposed on a side of the light-focusing layer 120 away from the cover plate 110, and the cover plate 110 is attached to a side of the light-focusing layer 120 away from the micro-lens array 130, and the micro-lens array 130 is covered on the light-emitting chip 170 to collimate the light emitted by the light-emitting chip 170.

Further, the cover plate 110 may be a glass cover plate 110, and the light-gathering layer 120 is made of transparent high refractive index material, and its refractive index is greater than or equal to 1.65. In this embodiment, the material of the light-condensing layer 120 may be PDMS (Polydimethylsiloxane).

Still further, the material for preparing the light-focusing layer 120 may be one of poly pentabromophenyl acrylate, poly pentabromobenzyl methacrylate, poly pentabromobenzyl acrylate, etc.

Still further, a plurality of recesses are disposed on a side of the condensing layer 120 away from the cover plate 110, and the plurality of recesses are distributed in a matrix to form the microlens array 130.

Still further, the concave side far away from the light emitting chip 170 is in an arc structure, and the light rays are emitted after being collimated at the critical surface of the arc surface of the micro lens and the cover plate 110 through the arc-shaped arrangement of the micro lens, so as to play a role in collimation and convergence.

Still further, the microlens may have an aspherical curvature structure, which has a better effect on the collection and collimation of light.

In some embodiments of the first aspect of the present application, a extinction layer 140 is disposed on a side of the condensation layer 120 facing away from the microlens array 130, the extinction layer 140 is provided with a hollowed-out region 1110, the hollowed-out region 1110 is distributed in a matrix, and the microlens array 130 is correspondingly disposed on the hollowed-out region 1110, so that light rays of the light emitting chip 170 pass through the hollowed-out region 1110 and are emitted through the microlens array 130, and meanwhile, light rays with larger light emitting angles are absorbed by the extinction layer 140, so that the problems of optical crosstalk and unclear display of the micro LED structure due to larger light emitting angles are improved.

Specifically, the extinction layer 140 may be made of extinction materials such as black glue and gray glue, so as to absorb the received light. In this embodiment, the extinction layer 140 may be a black photoresist extinction photoresist.

Further, a color matching layer 160 is disposed in the hollowed-out region 1110, and a protective layer 150 is disposed on a side of the extinction layer 140 facing away from the condensing layer 120. The color matching layer 160 is used for converting the initial light color generated by the light emitting chip 170, and the protection layer 150 covers the extinction layer 140 and the color matching layer 160 for protecting the color matching layer 160.

Further, the protective layer 150 may be made of ITO (Indium tin oxide), or other transparent and protective materials such as PFA (soluble polytetrafluoroethylene) may be used.

Specifically, the color matching layer 160 is formed by filling color quantum dot materials, and sequentially arranged in the hollow area 1110 in the order of red, green and blue to form three optical primary colors, and the three primary colors are mixed to form a display screen to display colors so as to meet the color display requirement of the Micro-LED display structure.

Still further, the color matching layer 160 includes at least one group of color matching units, each group of color matching units includes at least two primary color matching units, and the primary colors corresponding to each group of color matching units can synthesize white light _。

Specifically, each primary color toning unit can correspond to a single color light, white light can be formed between each group of toning units after mixing, and each group of toning units can be any primary color combination for synthesizing white light, such as a combination of blue light and yellow light obtained by exciting yellow fluorescent powder by using the blue light.

Still further, each set of the color matching units may include a red unit, a green unit, and a blue unit. In practice, the red, green, and blue elements of each set of toning elements may be arranged in sequence, for example, in the order "red element-green element-blue element".

In some embodiments of the first aspect of the present application, the emitted light of the light emitting chip 170 is blue light, and the red unit is filled with red quantum dot material to convert the original blue light into red light; the green unit is filled with green quantum dot material to convert the original blue light into green light; the blue unit is not filled with quantum dot materials, and can be suitable for being filled with other materials, such as polyester materials with high refractive index and the like. In other embodiments, blue quantum dot material may be filled in the blue cells to improve the color purity of blue light used to synthesize white light.

In some embodiments of the first aspect of the present application, the emitted light of the light emitting chip 170 is violet light, and the red unit is filled with red quantum dot material to convert the original violet light into red light; the green unit is filled with green quantum dot material to convert the original purple light into green light; the blue cell is filled with blue quantum dot material to convert the original violet light into blue light. The purple light can be purple visible light or ultraviolet light.

In some embodiments of the first aspect of the present application, the cover plate 110 and the driving chip 180 are attached in a frame manner, that is, an adhesive frame 1100 is disposed on a peripheral side of the light emitting chip 170, two sides of the adhesive frame 1100 are respectively connected to the protective layer 150 and the driving chip 180, and an edge side of the adhesive frame 1100 is located between the light emitting chip 170 and the bonding pad 190. In some embodiments, the adhesive frame 1100 may also function as a support, controlling the spacing between the cover plate 110 and the driving chip 180.

In some embodiments, the adhesive frame 1100 may be formed of a plurality of intermittently disposed supporting blocks distributed in a frame structure on the peripheral side of the light emitting chip 170, and the height of each adhesive frame 1100 is maintained to be uniform or approximately uniform, so that the interval between the cover plate 110 and the driving chip 180 is uniform.

In some embodiments, the bonding frame 1100 may also be an annular frame structure, and the positions of the bonding frame 1100 are highly uniform, so that a sealed vacuum environment is formed between the cover plate 110 and the driving chip 180, thereby reducing energy consumption of light, improving the light utilization rate, and improving the display effect and the light-emitting brightness of the micro LED structure. Further, the height of the adhesive frame 1100 may be slightly higher than that of the light emitting chip 170, and is hermetically connected with the protective layer 150 and the driving chip 180, so that a sealed vacuum environment is formed between the light emitting chip 170 and the protective layer. The sides of the adhesive frame 1100 have the same height, so that the distance between the cover plate 110 and the driving chip 180 is uniform, and the display effect of the micro LED structure is improved.

In some embodiments of the first aspect of the present application, the cover plate 110 and the driving chip 180 are fully attached, that is, an adhesive layer 1120 is disposed on a side of the light emitting chip 170 facing away from the driving chip 180, and the protective layer 150 covers the adhesive layer 1120. The full-lamination mode enables the cover plate 110, the light-gathering layer 120, the color matching layer 160, the extinction layer 140 and the protection layer to be directly covered on the light-emitting chip 170, the distance between the cover plate 110 and the light-emitting chip 170 is easier to keep uniform, light directly enters the color matching layer 160 through the bonding layer 1120 and the protection layer, and the light utilization rate is higher.

Specifically, the adhesive layer 1120 is made of UV (Ultraviolet) adhesive or OCA (Optically Clear Adhesive, optical adhesive), and in this embodiment, the adhesive layer 1120 is made of UV adhesive.

Embodiments of the second aspect of the present application also provide a light emitting device comprising the micro LED structure of any of the embodiments of the first aspect.

As shown in fig. 15, an embodiment of the third aspect of the present application further provides a method for preparing a micro LED structure, which is used for preparing the micro LED structure in any one of the foregoing embodiments, including:

s10, a condensing layer 120 is prepared at one side of the cap plate 110.

Referring to fig. 3, the cover plate 110 may be a glass cover plate 110, and a polyester material with a refractive index greater than or equal to 1.65 is laid on one side of the cover plate 110, so that the polyester material is completely laid on the cover plate 110.

S20, preparing a micro lens array 130 on one side of the condensing layer 120 away from the cover plate 110.

As also shown in fig. 4, a mold for preparing the microlens array 130 may be prepared in advance, and the mold may be pressed onto the polyester material by a nanoimprint technique to form the microlens array 130.

Further, the preparation method of the micro lens may be photolithography, and the micro lens array 130 is obtained by photolithography after a mask is laid on the light-condensing layer 120.

S30, preparing a extinction layer 140 on a side of the condensing layer 120 where the microlens array 130 is disposed.

As shown in fig. 5, a matting material is coated on the side of the light-condensing layer 120 where the microlens array 130 is disposed, and the matting material is completely filled in the recesses of the microlens array 130, and the filling height of the matting material is higher than the depth of the recesses of the microlenses to form a matting layer 140.

Specifically, the extinction layer 140 may be made of an extinction material such as black glue or gray glue, so as to absorb the received light. In this embodiment, the extinction layer 140 may be a black photoresist extinction photoresist.

As shown in fig. 6 and 8, further, the region corresponding to the microlens array 130 of the extinction layer 140 may be etched by exposure and development technology to form a hollowed-out region 1110 corresponding to the microlens. In the application of the single-color micro LED structure, the light emitted by the light emitting chip 170 passes through the hollowed-out area 1110, and is collimated by the micro lens and then emitted, and meanwhile, the light with a larger light emitting angle is absorbed by the extinction layer 140, so as to reduce the light crosstalk phenomenon.

S40, the color matching layer 160 is prepared.

As also shown in fig. 7, a filled quantum dot material is disposed in the hollowed-out region 1110 to form a color matching layer 160. The color of the initial light emitted from the light emitting chip 170 is converted by the color matching layer 160 to satisfy the application of the color micro LED structure.

Specifically, the hollowed-out area 1110 may be sequentially filled with quantum dot materials with different colors, and sequentially filled with red-green-blue materials to form three optical primary colors, so as to form a display color of the display screen, so as to meet the color display requirement of the Micro-LED display structure. The toner layer 160 includes at least one set of toner units, each set of toner units including a red unit, a green unit, and a blue unit, which are sequentially arranged.

In some embodiments of the present application, the emitted light of the light emitting chip 170 is blue light, and the red unit is filled with red quantum dot material to convert the original blue light into red light; the green unit is filled with green quantum dot material to convert the original blue light into green light; the blue unit is not filled with quantum dot material, and can be filled with other materials, such as polyester materials with high refractive index. In some embodiments, to enhance the color purity of blue light, blue quantum dot material may be filled within the blue cells.

In some embodiments, the emitted light of the light emitting chip 170 is violet light, and the red unit is filled with red quantum dot material to convert the original violet light into red light; the green unit is filled with green quantum dot material to convert the original purple light into green light; the blue cell is filled with blue quantum dot material to convert the original violet light into blue light.

S50, a protective layer 150 is arranged on one side of the extinction layer 140 away from the condensation layer 120.

Referring to fig. 9, a transparent material is laid on the extinction layer 140 to form a protection layer 150, and the protection layer 150 completely covers the extinction layer 140 and the color matching layer 160 to protect the quantum material.

Further, the protective layer 150 may be made of ITO (Indium tin oxide), or other materials having transparent and protective effects, such as PFA (soluble polytetrafluoroethylene), may be used.

S60, providing a base structure after bonding the light emitting chip 170 and the driving chip 180, and peeling the substrate of the light emitting chip 170.

As shown in fig. 10, the light emitting chip 170 and the driving chip 180 may be bonded by ball bonding, and the bonding material may be at least one of gold, titanium, nickel, aluminum, copper, indium, tin, or silver-tin alloy.

Here, the base structure may be provided by bonding the light emitting chip 170 to the driving chip 180 and peeling off the substrate of the light emitting chip 170 in the process of manufacturing the micro LED structure, or may be purchased by having previously bonded and peeled off the substrate.

S70, a side of the light-condensing layer 120 provided with the microlens array 130 is covered on a side of the light-emitting chip 170 facing away from the driving chip 180.

Referring to fig. 16 together, in some embodiments, the cover plate 110 and the driving chip 180 are attached by a frame, and step S70 includes:

s71, an adhesive frame 1100 is prepared on the driving chip 180, and the adhesive frame 1100 is enclosed on the periphery of the light emitting chip 170.

As shown in fig. 11, specifically, a frame glue is applied to the driving chip 180, and the side of the adhesive frame 1100 is located between the light emitting chip 170 and the bonding pad 190, so that the height of the adhesive frame 1100 is slightly higher than that of the light emitting chip 170, and the side of the adhesive frame 1100 is uniform.

S72, the cover plate 110 and the light condensing layer 120 are covered on the adhesive frame 1100.

As shown in fig. 12, the cover plate 110 is covered on the light emitting chip 170, the microlens array 130 corresponds to the light emitting chip 170, and the protective layer 150 is pressed against the adhesive frame 1100 and stabilized by UV curing. The adhesive frame 1100 is hermetically connected to the protective layer 150 and the driving chip 180, so that a hermetic vacuum environment is formed between the light emitting chip 170 and the protective layer.

Referring to fig. 17 together, in some embodiments, the cover plate 110 and the driving chip 180 are fully attached, and step S70 includes:

s73, an adhesive layer 1120 is provided on a side of the light emitting chip 170 facing away from the driving chip 180.

As shown in fig. 13, an adhesive material is applied to the surface of the light emitting chip 170 to form an adhesive layer 1120.

Specifically, the preparation material of the adhesive layer 1120 may be UV glue, OCA, etc., and in this embodiment, the preparation material of the adhesive layer 1120 is UV glue.

S74, the cover plate 110 and the light condensing layer 120 are covered on the adhesive layer 1120.

Referring to fig. 14, the cover plate 110 is covered on the light emitting chip 170, the microlens array 130 corresponds to the light emitting chip 170, and the protective layer 150 is pressed against the adhesive layer 1120. The full-lamination mode enables the cover plate 110, the light-gathering layer 120, the color matching layer 160, the extinction layer 140 and the protection layer to be directly covered on the light-emitting chip 170, the distance between the cover plate 110 and the light-emitting chip 170 is easier to keep uniform, light directly enters the color matching layer 160 through the bonding layer 1120 and the protection layer, and the light utilization rate is higher.

In summary, the cover plate 110 is disposed on the light emitting chip 170, and the condensing layer 120 is disposed on the cover plate 110, where a microlens array 130 is disposed on a side of the condensing layer 120 facing away from the cover plate 110. In the working process of the micro LED structure, the light emitted by the light emitting chip 170 is emitted through the micro lens array 130, and the light is converged under the collimation of the micro lens, so that the light emitting angle of the micro LED structure is controlled, and the display quality is improved. The light scattering phenomenon can be improved by collimating the light rays, so that the display effect of the micro LED structure is improved.

The micro LED structure can be applied to electronic equipment to realize the technologies of AR, VR, MR and the like. For example, the micro LED structure may be a projection part of an electronic device, such as a projector, head Up Display (HUD), etc.; for another example, the micro LED structure may also be a display portion of an electronic device, e.g. the electronic device may comprise: smart phones, smart watches, notebook computers, tablet computers, automobile recorders, navigator, head-mounted devices, and any device having a display screen. Also for example, the micro LED structure may also be an illumination portion of an electronic device, e.g. the electronic device may comprise: vehicles, street lamps, etc. any device having a lighting assembly.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives, and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application.

Claims

1. A micro LED structure, comprising:

the driving chip controls the light-emitting work of the micro LED structure;

the light-emitting chip is connected with the driving chip in a bonding way;

2. The micro LED structure of claim 1, wherein a extinction layer is disposed on a side of the light focusing layer where the micro lens array is disposed, the extinction layer is provided with a hollowed-out area, and the micro lens array is correspondingly disposed in the hollowed-out area.

3. The micro LED structure of claim 2, wherein a color matching layer is disposed in the hollowed-out area, and a protective layer is disposed on a side of the extinction layer facing away from the light focusing layer.

4. A micro LED structure according to claim 3, wherein the color matching layer comprises at least one group of color matching elements, each group of color matching elements comprises at least two primary color matching elements, and the primary colors corresponding to each group of color matching elements can synthesize white light _。

5. The micro LED structure of claim 4, wherein each set of the color matching units comprises a red unit, a green unit, and a blue unit;

6. The micro LED structure according to any one of claims 3 to 5, wherein an adhesive frame is provided on a peripheral side of the light emitting chip, and both sides of the adhesive frame are connected to the protective layer and the driving chip.

7. The micro LED structure of claim 6, wherein the adhesive frame is a ring-shaped frame structure.

8. The micro LED structure according to any of the claims 3 to 5, wherein an adhesive layer is provided on a side of the light emitting chip facing away from the driving chip, and the protective layer covers the adhesive layer.

9. The micro LED structure of any one of claims 1 to 8, wherein the light focusing layer is a polyester layer and the refractive index of the polyester layer is 1.65 or more.

10. The micro LED structure according to claim 1, wherein a light extinction layer is disposed on a side of the light condensation layer facing away from the micro lens array, the light extinction layer is provided with a hollow area, and the micro lens array is correspondingly disposed in the hollow area _， A color matching layer is arranged in the hollowed-out area, a protective layer is arranged on one side, which is away from the light focusing layer, of the light extinction layer, the color matching layer comprises at least one group of color matching units, each group of color matching units comprises at least two primary color matching units which are sequentially arranged, and primary colors corresponding to each group of color matching units can synthesize white light;

11. A light emitting device comprising the micro LED structure of any one of claims 1 to 10.

12. A method for manufacturing a micro LED structure, comprising:

preparing a condensing layer on one side of the cover plate;

13. The method of claim 12, wherein preparing a microlens array on a side of the light focusing layer facing away from the cover plate comprises:

14. The method of manufacturing a micro LED structure of claim 12, further comprising:

15. The method of manufacturing a micro LED structure of claim 14, further comprising:

16. The method of any one of claims 12 to 15, wherein the covering the side of the light-gathering layer with the microlens array on the light-emitting chip comprises:

17. The method of any one of claims 12 to 15, wherein the covering the side of the light-gathering layer with the microlens array on the light-emitting chip comprises: