CN116001149A - Automatic feeding device of plastic packaging material cake and semiconductor packaging equipment - Google Patents
Automatic feeding device of plastic packaging material cake and semiconductor packaging equipment Download PDFInfo
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- CN116001149A CN116001149A CN202211546568.4A CN202211546568A CN116001149A CN 116001149 A CN116001149 A CN 116001149A CN 202211546568 A CN202211546568 A CN 202211546568A CN 116001149 A CN116001149 A CN 116001149A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 28
- 239000005022 packaging material Substances 0.000 title abstract description 11
- 230000007246 mechanism Effects 0.000 claims abstract description 58
- 239000000463 material Substances 0.000 claims description 158
- 230000000903 blocking effect Effects 0.000 claims description 18
- 239000002699 waste material Substances 0.000 claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 9
- 238000004891 communication Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 13
- 230000008569 process Effects 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000007599 discharging Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The application relates to an automatic feeding device of plastic packaging material cake and semiconductor packaging equipment, including feed mechanism and feeding mechanism, feeding mechanism includes bottom plate, delivery sheet and feeding mechanical arm. The feeding mechanism is connected with the feeding plate, a plurality of clamping grooves are formed in the feeding plate, the feeding plate is movably arranged on the upper side of the bottom plate along the horizontal direction, so that the plastic package cakes are sequentially conveyed into the plurality of clamping grooves by the feeding mechanism, and the feeding mechanical arm is configured to be capable of grabbing the plastic package cakes on the plurality of clamping grooves at one time. The full-automatic feeding process is realized, and the feeding speed is improved, so that the efficiency of semiconductor packaging is improved.
Description
Technical Field
The application relates to the technical field of semiconductor production equipment, in particular to an automatic feeding device of a plastic packaging material cake and semiconductor packaging equipment.
Background
In the technical field of semiconductor packaging, a semiconductor product is generally required to be packaged by a plastic packaging material cake, and before the semiconductor product is packaged by plastic packaging, the plastic packaging material cake is required to be placed into a mold for heating and melting. At present, cylindrical plastic package cakes are orderly placed into a feeding die by adopting manpower.
However, the condition that the plastic package material cake is leaked easily occurs in manual material discharging, and whether the plastic package material cake meets the packaging standard is difficult to accurately judge by manpower, and the plastic package material cake which does not meet the standard is easy to place in manual material discharging, so that the semiconductor packaging is failed, and the success rate of the semiconductor packaging is reduced. Manual discharging is also difficult to keep up with the production speed of the whole equipment, resulting in the overall inefficiency of semiconductor production.
Disclosure of Invention
Based on the above, it is necessary to provide an automatic feeding device for plastic cakes, aiming at the problems of low success rate of semiconductor packaging, low efficiency of semiconductor packaging and the like caused by manual discharging.
The application provides an automatic feeding device of plastic packaging material cake and semiconductor packaging equipment adopts following technical scheme:
the utility model provides an automatic feeding device of plastic envelope material cake, includes feed mechanism and feeding mechanism, feeding mechanism includes bottom plate, delivery board and feeding mechanical arm, feed mechanism connects the delivery board, be provided with a plurality of card silo on the delivery board, the delivery board along the horizontal direction movably set up in the bottom plate upside to make the plastic envelope material cake by feed mechanism conveys to a plurality of in proper order in the card silo, feeding mechanical arm is configured to once only snatch a plurality of in the card silo the plastic envelope material cake.
By adopting the technical scheme, the plastic package material cakes in the feeding mechanism are sequentially conveyed into the plurality of clamping grooves along with the movement of the feeding plate and are carried by the bottom plate. In the moving process of the feeding plate, the plastic package material cakes in the clamping grooves are driven to move on the bottom plate, the plastic package material cakes are orderly arranged in the clamping grooves of the feeding plate, the feeding mechanical arm can grasp the plastic package material cakes in the clamping grooves at one time, full-automatic feeding is realized, the feeding speed is guaranteed to be matched with the speed of semiconductor packaging, and the situation that the feeding speed is too slow to keep up with the speed of the semiconductor packaging can not occur.
The traditional feeding mode is mostly manual feeding, the operation speed of the mode is low, the feeding speed is difficult to keep up with the speed of packaging semiconductors by plastic package cakes, and the overall production speed of the semiconductors is reduced. The automatic feeding device provided by the application can replace manual work by a machine, is changed into automatic manual work, greatly improves the feeding speed, further improves the efficiency of the whole semiconductor packaging process, and reduces the production cost.
In this application an embodiment, the automatic feeding device of plastic envelope material cake still includes actuating mechanism, actuating mechanism includes first cylinder, the bottom plate includes first support flitch, first cylinder drive connects first support flitch, the downside of first support flitch is provided with the waste material box.
Through adopting above-mentioned technical scheme, the in-process that plastic envelope material cake enters into feeding mechanism from feed mechanism, at first enters into the card silo on the delivery sheet to provide by first support flitch and bear the weight of the basis, first cylinder can drive first support flitch and remove, when first cylinder drive first support flitch removes, the plastic envelope material cake on the first support flitch can drop to in the waste box of first support flitch downside. When the plastic package material cakes in the clamping groove are unqualified, the first cylinder drives the first material supporting plate to move, the feeding plate is static, the plastic package material cakes in the clamping groove drop into the waste box under the action of gravity due to the fact that the bearing of the first material supporting plate is lost, the quality of each plastic package material cake is guaranteed to meet the standard, and the yield of semiconductor packaging is improved.
In an embodiment of the present application, the bottom plate further includes a second material supporting plate, and the second material supporting plate and the first material supporting plate are disposed on the same horizontal plane.
Through adopting above-mentioned technical scheme, when the delivery sheet removes, the plastic envelope material cake on the first material supporting plate is driven to the second material supporting plate along with the removal of delivery sheet in the card silo, holds in the palm the plastic envelope material cake on the flitch bears a plurality of card silos by the second material supporting plate.
In an embodiment of the present application, the driving mechanism further includes a motor, a screw rod and a first sliding part, the motor is in transmission connection with the screw rod, the first sliding part connected with the feeding plate is disposed on the screw rod, and the screw rod disposed on the lower side of the feeding plate drives the feeding plate to move through the first sliding part.
Through adopting above-mentioned technical scheme, the motor can drive the lead screw and rotate, and the first slider that sets up on the lead screw can make a round trip movement on the lead screw at lead screw pivoted in-process to drive the removal of charge-in board, make the charge-in board can reciprocate on the bottom plate. The motor can control the number of turns of screw rod pivoted to the distance that control first slider moved, the delivery sheet travel distance is the same with the travel distance of first slider, makes the delivery sheet can be according to the distance removal of settlement, guarantees that plastic envelope material cake can enter into in proper order in the card silo at the removal in-process of delivery sheet.
In an embodiment of the present application, the feeding plate is close to the removal axle that one side of bottom plate was provided with, the bottom plate is close to one side of feeding plate is provided with sunken track, sunken track with remove the axle looks joint.
Through adopting above-mentioned technical scheme, remove axle and sunken track joint each other, remove the axle and can remove on sunken track, prevent that the charge-in board from taking place the dislocation at the removal in-process, lead to structural damage, strengthen the stability of charge-in board for the charge-in board can be firmly along removing the axle and remove on the bottom plate.
In an embodiment of the application, the automatic feeding device of the plastic package material cake further comprises a material blocking mechanism, wherein the material blocking mechanism is arranged on one side of the feeding plate close to the clamping groove, and a material inlet is formed in the material blocking mechanism.
Through adopting above-mentioned technical scheme, during the plastic envelope material cake was conveyed a plurality of card silo in proper order, the charge-in board was at the in-process of removal, the circumstances that the plastic envelope material cake falls out from the export of card silo was probably appeared, and set up the striker mechanism at the side of card silo and can fix the plastic envelope material cake in the card silo, prevent that the plastic envelope material cake from breaking away from the card silo.
The material blocking mechanism is provided with the material inlet, so that the plastic package material cakes can enter the material clamping groove through the material inlet, the feeding plate moves to enable the material clamping grooves to sequentially correspond to the material inlet, the plastic package material cakes sequentially enter the material clamping grooves from the material inlet, and the material blocking mechanism ensures that the plastic package material cakes entering the material clamping groove cannot fall out of the material clamping groove.
In an embodiment of the application, the feeding mechanism comprises a vibrating disc and a material conveying component, one end of the material conveying component corresponds to the vibrating disc, and the other end of the material conveying component corresponds to the material inlet.
Through adopting above-mentioned technical scheme, the vibration dish is used for holding the plastic envelope material cake to with plastic envelope material cake vibration transmission to pass material subassembly, the plastic envelope material cake in the material subassembly of passing slides to pan feeding mouth department under the effect of gravity, and the process of whole feeding is put the mode by traditional manual work and is changed automatic feeding mode, and the plastic envelope material cake can enter into in proper order into the card silo through the pan feeding mouth.
In an embodiment of the application, the automatic feeding device of the plastic package material cake further comprises a sensor, wherein the sensor is connected with the first cylinder in a communication mode, and the sensor is arranged on the upper side of the feeding port.
By adopting the technical scheme, the sensor can sense whether the height of the plastic package material cake at the material inlet reaches the set standard. If the height of the plastic packaging material cake cannot reach the set standard, judging that the plastic packaging material cake does not accord with the set standard. The sensor transmits signals to the first air cylinder, the first air cylinder is in transmission connection with the first material supporting plate, after the first air cylinder drives the first material supporting plate to move, the projection of the first material supporting plate and the projection of the waste bin at the lower side are not overlapped, the plastic package material cakes fall into the waste bin, the first air cylinder drives the first material supporting plate to reset, and new plastic package material cakes enter the first material supporting plate from the material inlet. Screening out the plastic package material cakes which do not meet the set standard, preventing the package failure when the plastic package material cakes which do not meet the set standard package the semiconductor, and improving the package success rate and the package quality of the semiconductor.
In an embodiment of the present application, the feeding mechanical arm is provided with a plurality of mechanical grippers.
Through adopting above-mentioned technical scheme, the mechanical tongs on the pay-off arm can snatch the plastic package material cake in a plurality of card silo respectively to put into the assigned position in order fast, the plastic package material cake encapsulation semiconductor of being convenient for.
A semiconductor packaging device comprises the automatic feeding device of the plastic packaging material cake.
In summary, the technical solution provided in the present application has at least one of the following technical effects:
1. through setting up feed mechanism and feeding plate and being connected, set up the bottom plate and bear the weight of the plastic package material cake to set up a plurality of card silo on mobilizable feeding plate, the plastic package material cake passes through feed mechanism and conveys in proper order to a plurality of card silo on the feeding plate, and the feeding arm once only snatchs the plastic package material cake on a plurality of card silo, realizes full automatization material loading process, has greatly improved the efficiency of semiconductor encapsulation, thereby has improved the production efficiency of semiconductor.
2. Through setting up first support flitch in feed mechanism's downside, set up the waste material box in first support flitch downside, if the plastic package material cake height on the first support flitch does not accord with the setting value, then first support flitch removes for in the plastic package material cake drops the waste material box, guarantee the quality of plastic package material cake, with the quality of assurance semiconductor package and encapsulation success rate.
3. Through be provided with the sensor with first cylinder communication connection at the upside of pan feeding mouth, the sensor can detect whether the height of plastic package material cake reaches the setting value, if highly not up to standard, then with signal transmission for first cylinder with drive first support flitch remove for in the plastic package material cake drops to the waste material box.
Drawings
Fig. 1 is a first view of an automatic feeding apparatus for plastic cakes in some embodiments of the present application;
FIG. 2 is a block diagram of a feed robot in some embodiments of the present application;
fig. 3 is a first view of an automatic feeding apparatus for plastic cakes in some embodiments of the present application.
Reference numerals illustrate:
10. a feed mechanism; 20. a feeding mechanism; 30. a driving mechanism; 40. a waste bin; 50. a material blocking mechanism; 60. a sensor; 11. a vibration plate; 12. a material conveying assembly; 21. a bottom plate; 22. a feeding plate; 23. a feeding mechanical arm; 31. a first cylinder; 32. a motor; 33. a screw rod; 34. a first slider; 35. a second slider; 51. a feed inlet; 52. a support frame; 111. a first feed rail; 121. a second feed rail; 122. a direct vibration plate; 211. a first material supporting plate; 212. a second material supporting plate; 213. a recessed track; 221. a clamping groove; 222. a movable shaft; 231. a mechanical gripper; 232. and a second cylinder.
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.
Referring to fig. 1 and fig. 2, fig. 1 is a first view of an automatic feeding device for plastic cakes in some embodiments of the present application, and fig. 2 is a structural diagram of a feeding mechanical arm in some embodiments of the present application. The embodiment of the application provides an automatic feeding device of plastic package material cake, including feed mechanism 10 and feeding mechanism 20, feed mechanism 10 is used for carrying the plastic package material cake, and feeding mechanism 200 receives the plastic package material cake and neatly removes the plastic package material cake to the assigned position.
The feeding mechanism 20 includes a bottom plate 21, a feeding plate 22, and a feeding mechanical arm 23. Specifically, the bottom plate 21 is used for bearing plastic package cakes, the feeding mechanism 10 is connected with the feeding plate 22, a plurality of clamping grooves 221 are formed in the feeding plate 22, the feeding plate 22 is movably arranged on the upper side of the bottom plate 21 along the horizontal direction, so that the plastic package cakes are sequentially conveyed into the plurality of clamping grooves 221 by the feeding mechanism 10, the feeding mechanical arm 23 is configured to be capable of grabbing the plastic package cakes on the plurality of clamping grooves 221 at one time, the full-automatic feeding process is realized, the feeding speed is improved, and the efficiency of semiconductor packaging is improved.
In the embodiment, the distances between the plurality of material clamping grooves 221 on the feeding plate 22 are the same, the diameters are the same, the plastic package material cakes are cylindrical, and the diameter of the material clamping groove 221 is not smaller than the diameter of the cylindrical plastic package material cakes, so that the plastic package material cakes can enter the material clamping groove 221.
Referring to fig. 3, fig. 3 is a first view of an automatic feeding device for plastic cakes according to some embodiments of the present application. The feeding plate 22 is provided with a movable shaft 222 on the side close to the bottom plate 21, and a concave track 213 is provided on the side close to the feeding plate 22 of the bottom plate 21. Specifically, the movable shaft 222 is engaged with the recessed rail 213, and the movable shaft 222 can move on the recessed rail 213, so that structural dislocation of the feeding plate 22 caused by instable structure in the moving process is prevented, and the feeding plate 22 is more stable in the moving process.
With continued reference to fig. 1, the feeding mechanism 10 includes a vibration plate 11 and a material conveying assembly 12. Specifically, the vibration disc 11 is connected with the material conveying assembly 12, the material conveying assembly 12 is connected with the feeding plate 22, a plastic package cake is placed in the vibration disc 11 and can rotate and vibrate, a spiral first feeding track 111 is arranged in the vibration disc 11, and the highest position of the first feeding track 111 is in butt joint with the material conveying assembly 12.
In particular, in the embodiment, the vibration plate 11 has the first feeding track 111, and the vibration plate 11 rotates while vibrating so that the plastic package cake is transferred from the lowest position to the highest position of the first feeding track 111, and thus enters the transfer assembly 12.
The conveying assembly 12 includes a second feeding rail 121 and a linear vibrating plate 122. Specifically, one end of the second feeding track 121 is connected to the first feeding track 111, the other end is connected to the straight vibration plate 122, and the end connected to the first feeding track 111 is higher than the end connected to the straight vibration plate 122, and the straight vibration plate 122 is connected to the feeding plate 22. The plastic package cakes are conveyed from the first feeding track 111 to the second feeding track 121, enter the direct vibrating plate 122 under the action of gravity, and the direct vibrating plate 122 can vibrate, so that the plastic package cakes can be conveyed into the clamping groove 221 of the feeding plate 22.
The driving mechanism 30 includes a motor 32, a screw 33, and a first slider 34. Specifically, the motor 32 is in transmission connection with the screw 33, the screw 33 is in transmission connection with the first sliding piece 34, the first sliding piece 34 arranged on the screw 33 can move on the screw 33, and when the motor 32 drives the screw 33 to rotate, the first sliding piece 34 is driven by the screw 33 to move on the screw 33.
In the embodiment, the motor 32, the screw 33 and the first sliding member 34 are disposed at the lower side of the feeding plate 22, the first sliding member 34 is connected with the feeding plate 22, and when the motor 32 drives the screw 33 to rotate, the first sliding member 34 moves on the screw 33, so as to drive the feeding plate 22 to move, and the plastic package cakes can sequentially enter the plurality of clamping grooves 221.
The automatic feeding device of the plastic package material cakes further comprises a material blocking mechanism 50, wherein the material blocking mechanism 50 is used for stabilizing the plastic package material cakes in the material clamping groove 221. Specifically, the blocking mechanism 50 is disposed on a side of the feeding plate 22 near the clamping groove 221, and stabilizes the plastic package cake in the clamping groove 221, so that the plastic package cake in the clamping groove 221 cannot be separated from the clamping groove 221 in the moving process.
In the embodiment, the material blocking mechanism 50 is provided with a material inlet 51, the material inlet 51 corresponds to the conveying component 12, and the diameter of the material inlet 51 is not smaller than the diameter of the plastic package cake, so that the plastic package cake can be conveyed into the material clamping groove 221 through the material inlet 51.
The support frame 52 is arranged at the lower side of the material blocking mechanism 50 and is used for supporting the material blocking mechanism 50 to stably block the plastic package cakes in the material blocking groove 221, so that the stability of the material blocking mechanism 50 is enhanced and the plastic package cakes in the material blocking groove 221 are prevented from being separated from the material blocking groove 221.
The bottom plate 21 includes a first tray 211 and a second tray 212. Specifically, the first material supporting plate 211 and the second material supporting plate 212 are arranged on the lower side of the feeding plate 22 in parallel in an abutting manner, the plastic package material cakes enter the material clamping groove 221, the plastic package material cakes are carried by the first material supporting plate 211 and the second material supporting plate 212, and the feeding plate 22 drives the plastic package material cakes in the material clamping groove 221 to move on the first material supporting plate 211 and the second material supporting plate 212 when moving.
The driving mechanism 30 further includes a first cylinder 31 and a second slider 35, where the first cylinder 31 is used to drive the first tray 211. Specifically, the first cylinder 31 is in transmission connection with the first material supporting plate 211 through the second sliding member 35, and the first cylinder 31 drives the second sliding member 35 to move, so as to drive the first material supporting plate 211 to move horizontally.
The automatic feeding device of the plastic package material cake further comprises a sensor 60 for detecting whether the height of the plastic package material cake meets the set standard. Specifically, the sensor 60 disposed on the upper side of the feeding port 51 is in communication connection with the first cylinder 31, and when the plastic cake enters the bottom plate 21 from the feeding port 51, the sensor 60 can detect whether the height of the plastic cake reaches a set standard.
The automatic feeding device of the plastic package material cakes further comprises a waste box 40 for accommodating the plastic package material cakes which do not meet the set standard. Specifically, the waste box 40 is disposed at the lower side of the first tray 211, and the orthographic projection of the waste box 40 overlaps with the orthographic projection of the first tray 211.
The plastic package cake enters the first material supporting plate 211 from the material inlet 51, and the sensor 60 on the upper side of the material inlet 51 detects whether the plastic package cake meets the set standard value. If the height of the plastic package cake is too low, the sensor 60 transmits a signal to the first cylinder 31, and the first cylinder 31 drives the first material supporting plate 211 to move, so that the orthographic projection of the first material supporting plate 211 is not overlapped with the orthographic projection of the waste box 40, and the plastic package cake with the height which does not meet the standard value on the first material supporting plate 211 falls into the waste box 40, so as to screen out the plastic package cake which does not meet the packaging standard, ensure that the quality of the plastic package cake for packaging the semiconductor meets the standard, and improve the packaging success rate of the semiconductor and the packaging quality of the semiconductor.
With continued reference to fig. 2, the feeding mechanism 20 further includes a feeding mechanical arm 23 for grabbing the plastic cake on the clamping groove 221. Specifically, the feeding mechanical arm 23 can move horizontally and up and down, and the feeding mechanical arm 23 moves horizontally to the upper side of the clamping groove 221, then moves downward to be close to the clamping groove 221 and grabs the plastic package cake in the clamping groove 221.
In the embodiment, the feeding mechanical arm 23 includes a plurality of mechanical grippers 231 and a plurality of second cylinders 232 connected with the mechanical grippers 231 in a transmission manner, the second cylinders 232 are disposed on the upper sides of the mechanical grippers 231, and the plurality of second cylinders 232 can drive the plurality of mechanical grippers 231 to grasp plastic packages in the plurality of clamping grooves 221 at a time, so that the grabbing efficiency of the feeding mechanical arm 23 is improved.
The application also provides semiconductor packaging equipment, which comprises the automatic feeding device of the plastic packaging material cake and is used for packaging semiconductors.
The application provides an automatic feeding device of plastic envelope cake's implementation principle does: the plastic package cakes in the vibration disc 11 are transmitted to the second feeding track 121 through the first feeding track 111 by rotary vibration, the plastic package cakes on the second feeding track 121 are transmitted to the direct vibration plate 122 under the action of gravity, and the plastic package cakes are sequentially transmitted to the feed inlet 51 by the vibration of the direct vibration plate 122. The motor 32 drives the screw rod 33, so that the first sliding piece 34 moves to drive the feeding plate 22 to move, the feeding opening 51 sequentially corresponds to the plurality of clamping grooves 221, along with the movement of the feeding plate 22, the plastic package cakes sequentially enter the plurality of clamping grooves 221 and are grabbed by the feeding mechanical arm 23 at one time, and the feeding speed in semiconductor packaging is improved, so that the efficiency of semiconductor packaging is improved.
In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.
In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.
Claims (10)
1. Automatic loading attachment of plastic envelope material cake, its characterized in that includes:
a feeding mechanism (10);
feeding mechanism (20), including bottom plate (21), delivery board (22) and feeding arm (23), delivery mechanism (10) are connected delivery board (22), be provided with a plurality of card silo (221) on delivery board (22), delivery board (22) along horizontal direction movably set up in bottom plate (21) upside to make plastic package cake by delivery mechanism (10) are in proper order conveyed to a plurality of in card silo (221), feeding arm (23) are configured to can once only snatch a plurality of in card silo (221) plastic package cake.
2. The automatic feeding device of plastic package cakes according to claim 1, further comprising a driving mechanism (30), wherein the driving mechanism (30) comprises a first air cylinder (31), the bottom plate (21) comprises a first material supporting plate (211), the first air cylinder (31) is in transmission connection with the first material supporting plate (211), and a waste box (40) is arranged on the lower side of the first material supporting plate (211).
3. The automatic feeding device of plastic packaged cakes according to claim 2, wherein the bottom plate (21) further comprises a second material supporting plate (212), and the second material supporting plate (212) and the first material supporting plate (211) are arranged on the same horizontal plane.
4. The automatic feeding device of plastic packaged cakes according to claim 3, wherein the driving mechanism (30) further comprises a motor (32), a screw rod (33) and a first sliding piece (34), the screw rod (33) is connected with the motor (32) in a transmission manner, the first sliding piece (34) connected with the feeding plate (22) is arranged on the screw rod (33), and the screw rod (33) arranged on the lower side of the feeding plate (22) drives the feeding plate (22) to move through the first sliding piece (34).
5. The automatic feeding device of plastic package cakes according to claim 1, wherein a movable shaft (222) is arranged on one surface of the feeding plate (22) close to the bottom plate (21), a concave track (213) is arranged on one surface of the bottom plate (21) close to the feeding plate (22), and the concave track (213) is clamped with the movable shaft (222).
6. The automatic feeding device of plastic package cakes according to claim 2, further comprising a material blocking mechanism (50) arranged on one side of the feeding plate (22) close to the clamping groove (221), wherein a material inlet (51) is formed in the material blocking mechanism (50).
7. The automatic feeding device of plastic packaged cakes according to claim 6, wherein the feeding mechanism (10) comprises a vibrating disc (11) and a material conveying assembly (12), one end of the material conveying assembly (12) is arranged corresponding to the vibrating disc (11), and the other end of the material conveying assembly is arranged corresponding to the material inlet (51).
8. The automatic feeding device of plastic packaged cakes according to claim 6, further comprising a sensor (60), wherein the sensor (60) is in communication connection with the first cylinder (31), and the sensor (60) is arranged on the upper side of the feeding opening (51).
9. The automatic feeding device of plastic packaged cakes according to claim 1, wherein a plurality of mechanical grippers (231) are arranged on the feeding mechanical arm (23).
10. A semiconductor packaging apparatus comprising an automatic feeding device for a plastic package according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211546568.4A CN116001149A (en) | 2023-02-17 | 2023-02-17 | Automatic feeding device of plastic packaging material cake and semiconductor packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211546568.4A CN116001149A (en) | 2023-02-17 | 2023-02-17 | Automatic feeding device of plastic packaging material cake and semiconductor packaging equipment |
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| Publication Number | Publication Date |
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| CN116001149A true CN116001149A (en) | 2023-04-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211546568.4A Pending CN116001149A (en) | 2023-02-17 | 2023-02-17 | Automatic feeding device of plastic packaging material cake and semiconductor packaging equipment |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105881450A (en) * | 2016-06-06 | 2016-08-24 | 台州联方机电科技有限公司 | Automatic assembly device for stop valve |
| CN109037108A (en) * | 2018-08-02 | 2018-12-18 | 安徽大华半导体科技有限公司 | A kind of material cake feeding device with defects detection function |
| CN208261760U (en) * | 2018-05-19 | 2018-12-21 | 宁波恒源轴业有限公司 | A kind of Minisize axial automatic thread rolling machine |
| CN111038983A (en) * | 2019-11-28 | 2020-04-21 | 铜陵富仕三佳机器有限公司 | Automatic resin arraying loader |
| CN112071786A (en) * | 2020-09-29 | 2020-12-11 | 深圳市曜通科技有限公司 | Material loading cake mechanism in semiconductor packaging equipment |
| CN112620142A (en) * | 2020-12-22 | 2021-04-09 | 广州辰创科技发展有限公司 | Automatic weighing and discharging device and method for plastic cakes |
| CN212949129U (en) * | 2020-06-30 | 2021-04-13 | 珠海保税区中富聚酯啤酒瓶有限公司 | Bottle base automatic feeding conveyor |
| CN213996798U (en) * | 2020-12-22 | 2021-08-20 | 安徽耐科装备科技股份有限公司 | Plastic package material cake weighing and screening device |
| CN214086272U (en) * | 2020-12-30 | 2021-08-31 | 苏州润合茂自动化设备科技有限公司 | Buckle sideslip feed mechanism |
| CN217257622U (en) * | 2022-05-07 | 2022-08-23 | 广东福能东方技术研发有限公司 | A micelle automatic feeding device for semiconductor plastic envelope |
-
2023
- 2023-02-17 CN CN202211546568.4A patent/CN116001149A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105881450A (en) * | 2016-06-06 | 2016-08-24 | 台州联方机电科技有限公司 | Automatic assembly device for stop valve |
| CN208261760U (en) * | 2018-05-19 | 2018-12-21 | 宁波恒源轴业有限公司 | A kind of Minisize axial automatic thread rolling machine |
| CN109037108A (en) * | 2018-08-02 | 2018-12-18 | 安徽大华半导体科技有限公司 | A kind of material cake feeding device with defects detection function |
| CN111038983A (en) * | 2019-11-28 | 2020-04-21 | 铜陵富仕三佳机器有限公司 | Automatic resin arraying loader |
| CN212949129U (en) * | 2020-06-30 | 2021-04-13 | 珠海保税区中富聚酯啤酒瓶有限公司 | Bottle base automatic feeding conveyor |
| CN112071786A (en) * | 2020-09-29 | 2020-12-11 | 深圳市曜通科技有限公司 | Material loading cake mechanism in semiconductor packaging equipment |
| CN112620142A (en) * | 2020-12-22 | 2021-04-09 | 广州辰创科技发展有限公司 | Automatic weighing and discharging device and method for plastic cakes |
| CN213996798U (en) * | 2020-12-22 | 2021-08-20 | 安徽耐科装备科技股份有限公司 | Plastic package material cake weighing and screening device |
| CN214086272U (en) * | 2020-12-30 | 2021-08-31 | 苏州润合茂自动化设备科技有限公司 | Buckle sideslip feed mechanism |
| CN217257622U (en) * | 2022-05-07 | 2022-08-23 | 广东福能东方技术研发有限公司 | A micelle automatic feeding device for semiconductor plastic envelope |
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