CN115996594A

CN115996594A - Display substrate and display device

Info

Publication number: CN115996594A
Application number: CN202310193457.8A
Authority: CN
Inventors: 李宇婧; 樊聪; 董向丹; 都蒙蒙; 田东辉; 何帆; 王蓉; 王玉; 仝可蒙
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2021-06-24
Filing date: 2021-06-24
Publication date: 2023-04-21
Also published as: CN113451526A

Abstract

The embodiment of the invention discloses a display substrate and a display device, relates to the technical field of display, and is used for improving packaging effect and increasing yield of the display substrate and the display device. The display substrate includes: the back plate, set up in one side of back plate and be located the barricade of week district, and set up the encapsulation layer of one side of keeping away from the back plate at the barricade. The back plate includes a substrate. The retaining wall comprises a first retaining wall and a second retaining wall which is positioned on one side of the first retaining wall, which is close to the display area. The packaging layer comprises a first inorganic layer, an organic layer and a second inorganic layer which are sequentially stacked. The organic layer is projected forward on the backboard and is positioned in the forward projection range of the second retaining wall on the backboard. The second retaining wall is positioned in the orthographic projection range of the second inorganic layer on the backboard. The distance between the side surface of the first retaining wall, which is close to the substrate, and the substrate is smaller than the distance between the side surface of the second retaining wall, which is close to the substrate, and the substrate. The display substrate and the display device provided by the embodiment of the invention are used for displaying images.

Description

Display substrate and display device

This application is a divisional application, the filing number of the original application is 202110706624.5, the filing date of the original application is 2021, month 06, 24, and the entire contents of the original application are incorporated herein by reference.

Technical Field

The present invention relates to the field of display technologies, and in particular, to a display substrate and a display device.

Background

Organic Light-Emitting Diode (OLED) has been widely used in display fields because of its advantages of self-luminescence, low driving voltage, high luminous efficiency, fast response speed, flexible display, etc.

Disclosure of Invention

The embodiment of the invention aims to provide a display substrate and a display device, which are used for improving the packaging effect and increasing the yield of the display substrate and the display device.

In order to achieve the above purpose, the embodiment of the invention provides the following technical scheme:

in one aspect, an embodiment of the present invention provides a display substrate. The display substrate has a display area and a peripheral area. The display substrate includes: the back plate is arranged on one side of the back plate and is positioned on the plurality of retaining walls of the peripheral area, and the packaging layer is arranged on one side of the plurality of retaining walls away from the back plate. The back plate includes a substrate. The plurality of retaining walls comprise at least one first retaining wall and at least one second retaining wall which is positioned on one side of the first retaining wall, which is close to the display area. The packaging layer comprises a first inorganic layer, an organic layer and a second inorganic layer which are sequentially stacked. The front projection of the organic layer on the backboard is positioned in the front projection range of the second retaining wall on the backboard. And the orthographic projection of the second retaining wall on the backboard is positioned in the orthographic projection range of the second inorganic layer on the backboard. The distance between the side surface of the first retaining wall, which is close to the substrate, and the substrate is smaller than the distance between the side surface of the second retaining wall, which is close to the substrate, and the substrate.

According to the display substrate provided by some embodiments of the invention, the first retaining wall and the second retaining wall are arranged, so that the second retaining wall is closer to the display area than the first retaining wall, the second retaining wall can be used for blocking the organic solution for forming the organic layer, so that the organic solution stops leveling in front of the second retaining wall, the orthographic projection of the organic layer on the backboard is positioned in the orthographic projection range of the second retaining wall on the backboard, the orthographic projection of the second retaining wall on the backboard is positioned in the orthographic projection range of the second inorganic layer on the backboard, the second inorganic layer can further completely cover the organic layer, the corrosion of water and/or oxygen to the light emitting device through the organic layer is avoided, the packaging effect is ensured, the packaging failure is avoided, and the yield of the display substrate is effectively improved.

Moreover, after the second retaining wall is utilized to enable the organic solution to stop leveling in front of the second retaining wall, the part of the organic solution between the display area and the second retaining wall can be enabled to have larger gradient and smaller size, and the surface of one side, far away from the substrate, of the part of the packaging layer, which is located in the display area, is enabled to be flatter. Under the condition that the display substrate is applied to the display device and the touch structure is included in the display device, the error of etching the metal film used for forming the touch signal lines in the touch structure can be reduced, so that metal residues can be avoided, the condition that metal connection exists between adjacent touch signal lines due to the metal residues and short circuit occurs after the power is applied can be avoided, and the yield of the display device is effectively improved.

In some embodiments, the first retaining wall includes a plurality of first retaining wall patterns stacked in sequence, and the second retaining wall includes one second retaining wall pattern.

In some embodiments, the back plate includes a substrate, a pixel driving circuit layer, a planarization layer, and a pixel defining layer, which are sequentially stacked. One of the first wall patterns is arranged on the same layer as the flat layer, and the other first wall pattern is arranged on the same layer as the pixel defining layer. The second retaining wall pattern and the pixel defining layer are arranged on the same layer.

In some embodiments, a retaining wall comprises: a plurality of first sub-portions extending along the first direction, a plurality of second sub-portions extending along the second direction, and a plurality of third sub-portions connecting adjacent first and second sub-portions. And the intersection point of the extension lines of the adjacent first sub-parts and the second sub-parts is positioned outside the boundary of the retaining wall.

In some embodiments, orthographic projections of the plurality of first sub-portions and the plurality of second sub-portions on the back plate are straight; orthographic projection of the plurality of third sub-parts on the backboard is round.

In some embodiments, the width of the third sub-portion is greater than the width of the first sub-portion. The width of the third sub-portion is greater than the width of the second sub-portion.

In some embodiments, the width of the first sub-portion is equal to the width of the second sub-portion.

In some embodiments, the spacing between the third sub-portions of adjacent two retaining walls is greater than the spacing between the first sub-portions of adjacent two retaining walls. The distance between the third sub-portions of the adjacent two retaining walls is larger than the distance between the second sub-portions of the adjacent two retaining walls.

In some embodiments, a spacing between the first sub-portion of the second retaining wall and the display area is greater than a spacing between the second sub-portion of the second retaining wall and the display area.

In some embodiments, in the case that the number of the first retaining walls and the number of the second retaining walls are plural, a distance between adjacent first retaining walls and second retaining walls is larger than a distance between adjacent two first retaining walls. The distance between the adjacent first retaining wall and the adjacent second retaining wall is larger than the distance between the adjacent second retaining wall.

In some embodiments, the spacing between adjacent ones of the first retaining walls ranges from 10 μm to 90 μm. The distance between two adjacent second retaining walls is in the range of 10-90 μm. The distance between the adjacent first retaining wall and the adjacent second retaining wall ranges from 100 mu m to 300 mu m.

In some embodiments, the ratio of the spacing between two adjacent second retaining walls to the width of the second retaining wall ranges from 1:9 to 9:1.

In some embodiments, a distance between a surface of the second retaining wall on a side away from the back plate and the back plate is smaller than a distance between a surface of the first retaining wall on a side away from the back plate and the back plate.

In some embodiments, in the case that the number of the second retaining walls is plural, one second retaining wall, which is closer to the display area, is lower than the surface, which is farther from the back panel, of the adjacent two second retaining walls, or is level with respect to the back panel.

In some embodiments, in the case that the number of the first retaining walls is plural, one of the adjacent two first retaining walls, which is closer to the display area, is lower than the surface of the one first retaining wall, which is farther from the display area, which is farther from the back panel, with respect to the back panel.

In some embodiments, the display substrate further comprises: and a plurality of light emitting devices positioned between the back plate and the encapsulation layer and positioned in the display area. The light emitting device includes an anode, a light emitting layer, and a cathode, which are sequentially stacked. Wherein, the display substrate further includes: and the power line is arranged on the same layer as the anode and is in direct contact with the second retaining wall.

In some embodiments, in the case that one of the plurality of first wall patterns is disposed in the same layer as the flat layer and the other of the plurality of first wall patterns is disposed in the same layer as the pixel defining layer, the power line extends to a portion of the first wall region through the region where the second wall is disposed, and is interposed between the one first wall pattern and the other first wall pattern.

In another aspect, an embodiment of the present invention provides a display apparatus. The display device includes: a display substrate as in any one of the embodiments above.

In some embodiments, the display device further comprises: and the touch structure is arranged on one side of the packaging layer away from the backboard. The touch structure comprises a touch electrode layer and a plurality of touch signal lines. The peripheral area of the display substrate further comprises a binding area. The touch electrode layer is located in a display area of the display substrate. One end of the touch signal wire is electrically connected with the touch electrode layer. The other end of the touch signal line spans across the retaining walls of the display substrate and extends to the binding area.

The display substrate included in the display device has the same structure and beneficial technical effects as those of the display substrate provided in some embodiments described above, and will not be described in detail herein.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic representations, not as limiting the actual dimensions of the products according to the embodiments of the present disclosure.

FIG. 1 is a block diagram of a display device according to some embodiments of the invention;

FIG. 2 is a block diagram of a display substrate according to some embodiments of the invention;

FIG. 3 is a block diagram of another display substrate according to some embodiments of the invention;

FIG. 4 is a block diagram of a display substrate according to yet another embodiment of the invention;

fig. 5 is a block diagram of a retaining wall according to some embodiments of the present invention;

FIG. 6 is a block diagram of another display device according to some embodiments of the invention;

FIG. 7 is a block diagram of yet another display device according to some embodiments of the invention;

FIG. 8 isbase:Sub>A cross-sectional view of the display device of FIG. 6 taken along the direction A-A';

Fig. 9 is another cross-sectional view of the display device of fig. 6 taken alongbase:Sub>A-base:Sub>A'.

Detailed Description

The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

Throughout the specification and claims, the term "comprising" is to be interpreted as an open, inclusive meaning, i.e. "comprising, but not limited to, unless the context requires otherwise. In the description of the present specification, the terms "one embodiment," "some embodiments," "example embodiments," "examples," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.

In describing some embodiments, the expression "connected" and its derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the disclosure herein.

At least one of "A, B and C" has the same meaning as at least one of "A, B or C," both include the following combinations of A, B and C: a alone, B alone, C alone, a combination of a and B, a combination of a and C, a combination of B and C, and a combination of A, B and C.

"A and/or B" includes the following three combinations: only a, only B, and combinations of a and B.

In addition, the use of "based on" is intended to be open and inclusive in that a process, step, calculation, or other action "based on" one or more of the stated conditions or values may be based on additional conditions or beyond the stated values in practice.

As used herein, "about" or "approximately" includes the stated values as well as average values within an acceptable deviation range of the particular values as determined by one of ordinary skill in the art in view of the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system).

Exemplary embodiments are described herein with reference to cross-sectional and/or plan views as idealized exemplary figures. In the drawings, the thickness of layers and regions are exaggerated for clarity. Thus, variations from the shape of the drawings due to, for example, manufacturing techniques and/or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.

The display substrate in the related art includes a back plate, a light emitting device, a barrier wall, and a package structure. The packaging structure is located one side of the light emitting device and the retaining wall away from the backboard, and comprises a first inorganic layer, an organic layer and a second inorganic layer which are sequentially stacked.

Based on the properties of the organic layer materials described above, the organic layer is generally prepared using inkjet printing techniques. In the process of forming the organic layer, the organic solution (for forming the organic layer) easily flows to the retaining wall. In consideration of the manufacturing accuracy and alignment accuracy in the subsequent manufacturing of the second inorganic layer, the second inorganic layer may not completely cover the organic layer, i.e., the retaining wall. In this case, water and/or oxygen may enter the inside of the display substrate through the barrier wall, corroding the light emitting device, resulting in a reduction in the lifetime of the light emitting device, that is, resulting in package failure.

Based on this, an embodiment of the present invention provides a display device 1000 as shown in fig. 1.

In some examples, display device 1000 may be any device that displays both motion (e.g., video) and stationary (e.g., still image) and whether text or image. More particularly, it is contemplated that the embodiments may be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile telephones, wireless devices, personal data assistants (Personal Digital Assistant, PDA for short), hand-held or portable computers, global positioning system (Global Positioning System) receivers/navigators, cameras, dynamic picture experts group (Moving Picture Experts Group, MP 4) video players, video cameras, game consoles, wrist watches, clocks, calculators, television monitors, computer monitors, automotive displays (e.g., odometer display, etc.), navigators, cockpit controls and/or displays, displays of camera views (e.g., display of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., display of images on a piece of jewelry), and the like.

In some examples, as shown in fig. 1, the display device 1000 described above includes a display substrate 100.

For example, the display device 1000 may further include a frame, a source driving chip, an FPC (Flexible Printed Circuit, a flexible wiring board), a PCB (Printed Circuit Board, a printed wiring board), or other electronic parts, etc.

In some examples, as shown in fig. 5, 6 and 7, the display substrate 100 has a display area AA and a peripheral area SS.

The shape of the display area AA may include various shapes, which are not limited in the present invention, and may be specifically set according to actual needs. The display area AA may be in any one of an oval shape, a trapezoid shape, and a rectangle shape, for example.

The above-mentioned positional relationship between the peripheral area SS and the display area AA is not unique, for example, the peripheral area SS may be located at one side of the display area AA, at both sides of the display area AA, at three sides of the display area AA, or around the display area AA.

Illustratively, the peripheral region SS of the display substrate 100 as shown in fig. 6 and 7 further includes a bonding region B. The position of the binding area B in the peripheral area SS can be selected according to actual needs.

In some examples, as shown in fig. 6 and 7, the display device 1000 further includes: the touch structure 200 is disposed on one side of the display substrate 100, and the touch structure 200 includes a touch electrode layer 21 and a plurality of touch signal lines 22. The touch electrode layer 21 is located in the display area AA.

The types of the touch electrode layer 21 include various types, and may be selected according to actual needs.

In some examples, as shown in fig. 6, the type of the touch electrode Layer 21 is FMLOC (Flexible Multi-Layer On Cell), and a Flexible Multi-Layer structure is made On the encapsulation Layer 3 of the display substrate 100. For the encapsulation layer 3, reference is made to the following description, and no further description is given here.

As shown in fig. 6, 8 and 9, the touch electrode layer 21 includes: a plurality of first touch electrodes 211 extending along the second direction Y. Each first touch electrode 211 includes a plurality of first touch sub-electrodes 2111 connected in series. For example, each of the first touch electrodes 211 is of a unitary structure.

Optionally, as shown in fig. 6, 8 and 9, the touch electrode layer 21 further includes: a plurality of rows of second touch electrodes 212 and a plurality of columns of metal bridges 2122. Each row of second touch sub-electrodes 212 includes a plurality of second touch sub-electrodes 2121 arranged at intervals along the first direction X. In each row of second touch sub-electrodes 2121, any two adjacent second touch sub-electrodes 2121 are electrically connected to one metal bridge 2122 of a corresponding column of metal bridges 2122 through vias, so that the plurality of rows of second touch sub-electrodes 2121 and the plurality of metal bridges 2122 form a plurality of second touch electrodes 212.

The first direction X and the second direction Y intersect, and the size of the included angle between the first direction X and the second direction Y is related to the shape of the display area AA.

For example, in the case where the display area AA is rectangular in shape, the first direction X refers to a direction parallel to one of the adjacent two sides in the boundary of the rectangular display area, and the second direction Y refers to a direction parallel to the other of the adjacent two sides in the boundary of the rectangular display area. At this time, the first direction X and the second direction Y are perpendicular to each other.

In another example, in the case where the display area AA is prismatic in shape, the first direction X refers to a direction parallel to one of the two adjacent sides in the boundary of the prismatic display area, and the second direction Y refers to a direction parallel to the other of the two adjacent sides in the boundary of the prismatic display area. At this time, the angle between the first direction X and the second direction Y is smaller than 90 °.

Based on this, the plurality of touch signal lines 22 may include a plurality of first sub-touch signal lines 221 and a plurality of second sub-touch signal lines 222. One end of the first sub-touch signal line 221 is electrically connected to one first touch electrode 211, and the other end extends to the bonding area B through the peripheral area SS. One end of the second sub-touch signal line 222 is electrically connected to one of the second touch electrodes 212, and the other end extends to the bonding area B through the peripheral area SS.

Optionally, the plurality of touch signal lines 22 and the metal bridge 2122 in the touch electrode layer 21 are disposed in the same layer.

It should be noted that the term "same layer" as used herein refers to a layer structure in which a film layer for forming a specific pattern is formed by the same film forming process and then formed by one patterning process using the same mask plate. Depending on the particular pattern, a patterning process may include multiple exposure, development, or etching processes, and the particular patterns in the formed layer structure may be continuous or discontinuous, and may be at different heights or have different thicknesses. In this way, the metal bridge 2122 in the plurality of touch signal lines 22 and the touch electrode layer 21 can be simultaneously formed in one patterning process, which is beneficial to simplifying the manufacturing process of the display substrate 100.

In other examples, as shown in fig. 7, the type of the touch electrode layer 21 is FSLOC (Flexible Single Layer On Cell, a flexible single-layer structure is made on the encapsulation layer 3 of the display substrate 100).

Illustratively, the touch electrode layer 21 includes: and a plurality of third touch electrodes 213 extending along the second direction Y and spaced apart from each other.

Based on this, among the plurality of touch signal lines 22, one end of one touch signal line 22 is electrically connected to one third touch electrode 213, and the other end extends to the bonding area B through the peripheral area SS.

Optionally, the plurality of touch signal lines 22 and the plurality of third touch electrodes 213 in the touch electrode layer 21 are disposed in the same layer. In this way, the plurality of touch signal lines 22 and the plurality of third touch electrodes 213 in the touch electrode layer 21 can be simultaneously formed in one patterning process, which is beneficial to simplifying the manufacturing process of the display substrate 100.

The structure of the display substrate 100 will be schematically described below taking an example in which the display area AA is rectangular in shape and the peripheral area SS is disposed around the display area AA.

When the display area AA is rectangular in shape, the first direction X refers to, for example, a direction parallel to the short side of the rectangular display area boundary, and the second direction Y refers to, for example, a direction parallel to the long side of the rectangular display area boundary.

In some examples, as shown in fig. 2, the display substrate 100 includes: a back plate 1.

For example, as shown in fig. 2, the back plate 1 may include a substrate 10, a pixel driving circuit layer 11, a planarization layer 12, and a pixel defining layer 13, which are sequentially stacked.

The structure of the substrate 10 includes various structures, and may be selected according to actual needs.

For example, the substrate 10 may be a rigid substrate. The rigid substrate may be, for example, a glass substrate or a PMMA (Polymethyl methacrylate ) substrate. In this case, the display substrate 100 may be a rigid display substrate.

As another example, the substrate 10 may be a flexible substrate. The flexible substrate may be, for example, a PET (Polyethylene terephthalate ) substrate, a PEN (Polyethylene naphthalate two formic acid glycol ester, polyethylene naphthalate) substrate, or a PI (Polyimide) substrate. In this case, the display substrate 100 may be a flexible display substrate.

As illustrated in fig. 2, the pixel driving circuit layer 11 includes a gate conductive layer 111, a gate insulating layer 112, an active layer 113, an interlayer insulating layer 114, and a first source-drain conductive layer 115, which are sequentially stacked.

For example, as shown in fig. 2, the gate conductive layer 111 includes a plurality of gates 1111, the active layer 113 includes a plurality of active patterns 1131, and the first source drain conductive layer 115 includes a plurality of sources 1151 and a plurality of drains 1152. The corresponding one of the active patterns 1131, one of the gates 1111, one of the sources 1151, and one of the drains 1152 may constitute one transistor, for example, and a plurality of transistors may constitute one pixel driving circuit P, for example. The pixel driving circuit layer 11 may include a plurality of pixel driving circuits P. As shown in fig. 2, a transistor is used in the present invention to represent a pixel driving circuit P.

For example, the pixel driving circuit layer 11 may further include a second source drain conductive layer 116 located at a side of the first source drain conductive layer 115 remote from the substrate as shown in fig. 4. The second source drain conductive layer 116 may include a plurality of connection portions 1161.

In some examples, as shown in fig. 2, the display substrate 100 further includes: a plurality of light emitting devices 2 located on a side of the planarization layer 12 remote from the substrate 10 and located in the display area AA. The light emitting device 2 may be an OLED, for example.

The light emitting device 2 includes, for example, an anode 2a, a light emitting layer 2b, and a cathode 2c, which are sequentially stacked.

For example, the anode 2a of the light emitting device 2 is provided on a side surface of the flat layer 12 remote from the substrate 10. The anode 2a of one light emitting device 2 may be electrically connected to one pixel driving circuit P through the planarization layer 12.

In the case where the pixel driving circuit layer 11 further includes the second source-drain conductive layer 116, the anode 2a of one light emitting device 2 may be electrically connected to one pixel driving circuit P through one connection 1161.

For example, the anode 2a may have a structure of a composite structure formed by sequentially stacking a transparent conductive oxide film/a metal film/a transparent conductive oxide film. The material of the transparent conductive oxide film is, for example, any one of ITO (Indium tin oxide) and IZO (Indium zinc oxide Indium zinc oxide), and the material of the metal film is, for example, any one of gold (Au), silver (Ag), nickel (Ni), and platinum (Pt).

As another example, the anode 2a may have a single-layer structure, and the material of the single-layer structure may be any one of ITO, IZO, au, ag, ni, pt.

Illustratively, the pixel defining layer 13 has a plurality of openings. One opening exposes a portion of one anode 2 a. At least a portion of one light-emitting layer 2b is located in one of the openings, forming an electrical connection with the corresponding anode 2 a. That is, each light emitting layer 2b is electrically connected to the corresponding anode 2a by a portion or the whole thereof located in the corresponding opening.

Here, the manner of disposing the light-emitting layer 2b is related to the process of preparing the light-emitting layer 2 b.

For example, in the case of forming the light emitting layer 2b using an evaporation process, a part of the light emitting layer 2b may be positioned within the corresponding opening, and another part may overlap the pixel defining layer 13 around the opening.

In the case of forming the light emitting layer 2b using the inkjet printing technique, the light emitting layer 2b is entirely located within the corresponding opening.

Illustratively, as shown in FIG. 2, the cathode 2c is located on a side of the pixel defining layer 13 remote from the substrate 10. The cathodes 2c of the respective light emitting devices may be electrically connected to each other in an integrated structure.

For example, the material of the cathode 2c may be any one of aluminum (Al), silver (Ag), and magnesium (Mg), or any one of a magnesium-silver alloy and an aluminum-lithium alloy.

Of course, the light emitting device 2 may further include at least one of a hole injection layer, a hole transport layer, and an electron blocking layer disposed between the anode 2a and the light emitting layer 2b, and at least one of an electron injection layer, an electron transport layer, and a hole blocking layer disposed between the cathode 2c and the light emitting layer 2 b.

By providing at least one of a hole injection layer, a hole transport layer, and an electron blocking layer between the anode 2a and the light emitting layer 2b of the light emitting device 2, and providing at least one of an electron injection layer, an electron transport layer, and a hole blocking layer between the cathode 2c and the light emitting layer 2b of the light emitting device 2, the light emitting efficiency of the light emitting device 2 can be improved.

In some examples, as shown in fig. 2, the display substrate 100 further includes: and an encapsulation layer 3 disposed on a side of the light emitting device 2 remote from the back plate 1. Based on this, the plurality of light emitting devices 2 are located between the back plate 1 and the encapsulation layer 3.

Illustratively, as shown in fig. 2, the encapsulation layer 3 includes a first inorganic layer 31, an organic layer 32, and a second inorganic layer 33, which are sequentially stacked.

The first and second

inorganic layers

31 and 33 serve as a main barrier to intrusion of water and/or oxygen into the light emitting device 2, and the organic layer 32 serves as an auxiliary encapsulation and planarization, that is, the flatter the surface of the organic layer 32 on the side remote from the substrate 10, the flatter the surface of the encapsulation layer 3 on the side remote from the substrate 10.

Illustratively, the first and second

inorganic layers

31, 33 may be fabricated from inorganic materials that are nitrides, oxides, oxynitrides, nitrates, carbides, or any combination thereof. The organic layer 32 may be made of acrylic, hexamethyldisiloxane, polyacrylate, polycarbonate, polystyrene, or the like.

In some examples, as shown in fig. 2, the display substrate 100 further includes: a plurality of retaining walls 4 disposed on one side of the back plate 1 and located in the peripheral region SS. The plurality of retaining walls 4 includes at least one first retaining wall 4a, and at least one second retaining wall 4b located on a side of the first retaining wall 4a near the display area AA.

It should be noted that the encapsulation layer 3 is located on the side of the retaining wall 4 away from the back plate 1.

The number of the first retaining wall 4a and the second retaining wall 4b is not limited in the invention, and can be specifically selected according to actual needs.

Illustratively, as shown in fig. 2, the spacing between the substrate 10 and the side surface of the first retaining wall 4a adjacent to the substrate 10 is smaller than the spacing between the substrate 10 and the side surface of the second retaining wall 4b adjacent to the substrate 10.

In the process of forming the display substrate 100, the film layers included in the display substrate 100 are sequentially formed in sequence. This means that a portion of the first retaining wall 4a is formed prior to the second retaining wall 4b, and the thickness of the first retaining wall 4a may be greater than the thickness of the second retaining wall 4b.

The number of the first retaining walls 4a is 1 to 5, and the number of the second retaining walls 4b is 1 to 10.

In some examples, the front projection of the organic layer 32 on the back plate 1 is within the front projection range of one second retaining wall 4b on the back plate 1. The front projection of the second retaining wall 4b on the back plate 1 is located in the front projection range of the second inorganic layer 33 on the back plate 1.

For example, in the case where the number of the second retaining walls 4b is plural, the orthographic projection of the organic layer 32 on the back plate 1 is located within the orthographic projection range of one of the plural second retaining walls 4 b.

The projection relationship between the second inorganic layer 33 and the first retaining wall 4a is not limited in the present invention, and may be selected according to actual needs. For example, the front projection of the second inorganic layer 33 on the back plate 1 may be within the front projection range of the first retaining wall 4a on the back plate 1; alternatively, the front projection of the first retaining wall 4a on the back plate 1 is located within the front projection range of the second inorganic layer 33 on the back plate 1.

Note that the second barrier wall 4b may be used to block the flow of the organic solution for forming the organic layer 32 in the direction in which the display area AA is directed to the peripheral area SS.

Since the second retaining wall 4b is closer to the display area (i.e. closer to the light emitting device 2) than the first retaining wall 4a, when the organic layer 32 is prepared, the organic solution can be stopped from leveling before the second retaining wall 4b, so that the gradient of the side surface of the prepared organic layer 32 is larger, the surface of the side surface of the organic layer 32 away from the substrate 10 is closer to the surface parallel to the substrate 10, i.e. flatter, and the surface of the side surface of the encapsulation layer 3 away from the substrate 10 is flatter.

Moreover, since the front projection of the organic layer 32 on the back plate 1 is located in the front projection range of the second retaining wall 4b on the back plate 1, and the front projection of the second retaining wall 4b on the back plate 1 is located in the front projection range of the second inorganic layer 33 on the back plate 1, the front projection of the organic layer 32 on the back plate 1 can be ensured, and the front projection range of the second inorganic layer 33 on the back plate 1 can be ensured, that is, the second inorganic layer 33 can be ensured to completely cover the organic layer 32, so that water and/or oxygen can be prevented from entering the display substrate 100 through the organic layer 32 to erode the light emitting device 2, and the packaging effect of the packaging layer 3 can be ensured, and packaging failure can be avoided.

In the related art, since the leveling boundary of the organic solution cannot be effectively controlled after the shrinking process is performed when the organic layer is prepared by using the inkjet printing technology, the organic solution easily overflows to the retaining wall, so that the portion of the encapsulation structure located in and close to the display area and the portion located between the boundary of the display area and the retaining wall have slopes, and the slopes are smaller and the size is larger. The side of the surface and the side of the organic layer away from the back plate in the related art may be as shown by the dotted line in fig. 2 and 8.

By providing the second retaining wall 4b, the leveling of the organic solution can be stopped before the second retaining wall 4b, so that the surface of the part of the organic layer 32, which is located in the display area AA and is close to the display area AA and is far away from the back plate 1, is a flat surface, and the gradient of the part of the organic layer 32, which is located between the display area AA and the second retaining wall 4b, is larger and the size is smaller.

In this way, when the display substrate 100 is applied to the display device 1000 and the display device 1000 includes the touch structure 200, as shown in fig. 8 or fig. 9, in a process of preparing the touch signal line 22 forming the touch structure 200 on a surface of a side of the encapsulation layer 3 away from the substrate 10, it is ensured that the touch electrode layer 21 in the touch structure 200 is located on a side of a flat portion (i.e., a portion located in the display area) of the encapsulation layer 3 away from the backplate 1, and in a process of etching (e.g., using a photolithography process) a metal thin film for forming the touch signal line 22, it is ensured that photoresist located in a corresponding position of the frame area SS is completely removed, so that metal residues are avoided, and further, a situation that metal connection exists between adjacent touch signal lines 22 and a short circuit occurs after power-on due to the metal residues is avoided.

In addition, the width of the second retaining wall 4b can be increased, and the space between the adjacent second retaining walls 4b can be increased under the condition that the number of the second retaining walls 4b is more than one, so that the difficulty in etching the part of the metal film for forming the touch signal line 22 corresponding to the second retaining wall 4b can be reduced, and metal residues can be further avoided. Of course, the width of the first retaining walls 4a can be properly reduced, and the space between two adjacent first retaining walls 4a can be properly reduced under the condition that the number of the first retaining walls 4a is more than one, so that materials are saved, and the process difficulty is reduced.

Therefore, in the display substrate 100 provided by some embodiments of the present invention, by disposing the first retaining wall 4a and the second retaining wall 4b, the second retaining wall 4b is closer to the display area AA than the first retaining wall 4a, and the second retaining wall 4b can be used to block the organic solution for forming the organic layer 32, so that the organic solution stops leveling before the second retaining wall 4b, and the front projection of the organic layer 32 on the back plate 1 is located in the front projection range of the second retaining wall 4b on the back plate 1, so that the front projection of the second retaining wall 4b on the back plate 1 is located in the front projection range of the second inorganic layer 33 on the back plate 1, and further, the second inorganic layer 33 can completely cover the organic layer 32, so as to avoid erosion of the light emitting device 2 by the organic layer 32, thereby ensuring the packaging effect, avoiding the packaging failure, and effectively improving the yield of the display substrate 100.

Also, after the organic solution is stopped from being leveled before the second barrier wall 4b by the second barrier wall 4b, the portion of the organic layer 32 between the display area AA and the second barrier wall 4b may be made to have a larger slope and a smaller size, and the surface of the encapsulation layer 3 on the side of the portion of the display area AA away from the substrate 10 may be made to be flatter. In this way, when the display substrate 100 is applied to the display device 1000 and the touch structure 200 is included in the display device 1000, an error of etching the metal film for forming the touch signal lines 22 in the touch structure 200 can be reduced, so that metal residues can be avoided, further, the situation that metal connection exists between adjacent touch signal lines 22 due to the metal residues and a short circuit occurs after the power is applied can be avoided, and the yield of the display device 1000 is effectively improved.

The specific structures of the first retaining wall 4a and the second retaining wall 4b are not limited in the present invention, and may be specifically set according to actual needs.

In some examples, as shown in fig. 2, the first retaining wall 4a includes a plurality of first retaining wall patterns stacked in sequence, and the second retaining wall 4b includes one second retaining wall pattern. Wherein, a first retaining wall pattern corresponds to a film layer, and a second retaining wall pattern corresponds to a film layer.

That is, the number of film layers corresponding to the first retaining wall 4a is greater than the number of film layers corresponding to the second retaining wall 4 b.

In some examples, as shown in fig. 2, the first retaining wall 4a includes a plurality of first retaining wall patterns, one of which is disposed in the same layer as the flat layer 12, and the other of which is disposed in the same layer as the pixel defining layer 13. Thus, the first wall pattern and the planarization layer 12 may be simultaneously formed in one patterning process, and the second wall pattern and the pixel defining layer 13 may be simultaneously formed in one patterning process, which is advantageous in simplifying the manufacturing process of the display substrate 100.

Illustratively, as shown in fig. 4, in the case where the pixel driving circuit layer 11 further includes the second source-drain conductive layer 116, the planarization layer 12 includes a first sub-planarization layer 121 located between the first source-drain conductive layer 115 and the second source-drain conductive layer 116 and a second sub-planarization layer 122 located on a side of the second source-drain conductive layer 116 remote from the substrate 10. At this time, in the case where the first retaining wall 4a includes two first retaining wall patterns, one of the first retaining wall patterns is disposed in the same layer as the first sub-flat layer 121 or the second sub-flat layer 122, and the other first retaining wall pattern is disposed in the same layer as the pixel defining layer 13. In the case where the first retaining wall 4a includes three first retaining wall patterns, one of the first retaining wall patterns is disposed in the same layer as the first sub-flat layer 121 (not shown), the other of the first retaining wall patterns is disposed in the same layer as the second sub-flat layer 122, and the third of the first retaining wall patterns is disposed in the same layer as the pixel defining layer 13.

In some examples, as shown in fig. 2, 3 and 4, the second wall pattern (i.e., the second wall 4 b) is disposed in the same layer as the pixel defining layer 13. This allows the second barrier wall 4b and the pixel defining layer 13 to be simultaneously formed in one patterning process, which is advantageous in simplifying the manufacturing process of the display substrate 100.

In some examples, as shown in fig. 5, retaining wall 4 comprises: a plurality of first sub-portions 41 extending in the first direction X, a plurality of second sub-portions 42 extending in the second direction Y, and a plurality of third sub-portions 43 connecting adjacent first and second sub-portions 41, 42. Wherein the intersection O of the extension lines of adjacent first and second sub-portions 41, 42 is located outside the boundary of retaining wall 4. This can avoid the stress concentration phenomenon of the third sub-portion 43 of the retaining wall 4, and thus can ensure the stability of the structure of the retaining wall 4.

Here, the number of the first sub-portions 41, the number of the second sub-portions 42 and the number of the third sub-portions 43 are related to the orthographic projection shape of the retaining wall 4 on the back plate, and the number of each sub-portion is not limited in the present invention, and may be specifically selected according to actual needs.

Illustratively, the front projection of the retaining wall 4 on the back plate 1 is approximately rectangular.

At this time, each retaining wall 4 includes two first sub-portions 41 extending in the first direction X, two second sub-portions 42 extending in the second direction, and four third sub-portions 43. Each third sub-portion 43 is connected to adjacent first and second sub-portions 41, 42.

Illustratively, the retaining wall 4 has an approximately "concave" shape in orthographic projection on the back plate 1.

At this time, each retaining wall 4 includes four first sub-portions 41 extending in the first direction X, four second sub-portions 42 extending in the second direction Y, and eight third sub-portions 43. Each third sub-portion 43 is connected to adjacent first and second sub-portions 41, 42.

The present invention does not limit the shape of orthographic projection of the first sub-portion 41, the second sub-portion 42, and the third sub-portion 43 on the back plate 1, and may be selected according to actual needs.

Optionally, the front projection shape of the first sub-portions 41 on the back plate 1 is the same. Alternatively, the second sub-portions 42 may have the same shape as the back plate 1 in front projection. Alternatively, the third sub-portions 43 may have the same shape as the back plate 1 in front projection.

Illustratively, the orthographic projections of the first and second sub-portions 41, 42 on the back plate 1 are straight, and the orthographic projections of the third sub-portions 43 on the back plate 1 are rounded.

At this time, the front projection shape of the retaining wall 4 on the back plate 1 is approximately rectangular. By setting the orthographic projection shapes of the first sub-portion 41, the second sub-portion 42 and the third sub-portion 43 on the back plate 1, the manufacturing process difficulty of forming the retaining wall 4 is reduced, and the structural stability of the retaining wall 4 is improved.

In the present invention, the widths of the respective sub-portions are ignored only when describing the projected shapes of the respective sub-portions. Furthermore, the width of each sub-portion referred to in the present invention refers to the minimum distance between the inner boundary (i.e., the boundary near the display area AA side) and the outer boundary (i.e., the boundary far from the display area AA side) of each sub-portion in the orthographic projection on the back plate 1.

It is understood that the retaining wall 4 includes a first retaining wall 4a and a second retaining wall 4b, the retaining wall 4 includes a first sub-portion 41, a second sub-portion 42 and a third sub-portion 43, that is, the first retaining wall 4a includes the first sub-portion 41a, the second sub-portion 42a and the third sub-portion 43a, and the second retaining wall 4b also includes the first sub-portion 41b, the second sub-portion 42b and the third sub-portion 43b.

In some examples, the width c of the third sub-portion 43 of the retaining wall 4 is greater than the width a of the first sub-portion 41 of the retaining wall 4, and the width c of the third sub-portion 43 of the retaining wall 4 is greater than the width b of the second sub-portion 42 of the retaining wall 4.

That is, the width c1 of the third sub-portion 43a of the first retaining wall 4a is larger than the width a1 of the first sub-portion 41a of the first retaining wall 4 a. The width c2 of the third sub-portion 43b of the second retaining wall 4b is greater than the width a2 of the first sub-portion 41b of the second retaining wall 4 b. The width c1 of the third sub-portion 43a of the first retaining wall 4a is greater than the width b1 of the second sub-portion 42a of the first retaining wall 4 a. The width c2 of the third sub-portion 43b of the second retaining wall 4b is greater than the width b2 of the second sub-portion 42b of the second retaining wall 4 b.

Further, for example, the width c1 of the third sub-portion 43a of the first retaining wall 4a is larger than the width a2 of the first sub-portion 41b of the second retaining wall 4 b. The width c2 of the third sub-portion 43b of the second retaining wall 4b is greater than the width a1 of the first sub-portion 41a of the first retaining wall 4 a. The width c1 of the third sub-portion 43a of the first retaining wall 4a is greater than the width b2 of the second sub-portion 42b of the second retaining wall 4 b. The width c2 of the third sub-portion 43b of the second retaining wall 4b is greater than the width b1 of the second sub-portion 42a of the first retaining wall 4 a.

In the process of manufacturing the cathode 2c of the light emitting device 2, a portion of the cathode 2c corresponding to the third sub-portion 43 may be exposed due to unavoidable process errors. By increasing the width of the third sub-portion 43 so that the width of the third sub-portion 43 is larger than the width of the first sub-portion 41 and so that the width of the third sub-portion 43 is larger than the width of the second sub-portion 42, the probability that the first inorganic layer 31 is in direct contact with the exposed cathode 2c at the position corresponding to the third sub-portion 43 can be reduced, and thus the problem of film separation caused by direct contact between the first inorganic layer 31 and the cathode 2c can be avoided, and the yield of the display substrate 100 and the display device 1000 to which the same is applied can be improved.

On the basis, the invention is not limited to the size relation between a and b, the size relation between a1 and a2, the size relation between b1 and b2 and the size relation between c1 and c2, and can be set according to actual needs.

In some examples, the width a of the first sub-portion 41 of the retaining wall 4 is equal to the width b of the second sub-portion 42 of the retaining wall 4.

That is, a1 is equal to b1, and a2 is equal to b2.

Further, for example, a1 is greater than b2, b1 is greater than a2, a1 is greater than a2, b1 is greater than b2, and c1 is greater than c2.

By setting the width a1 of the first sub-portion 41a of the first retaining wall 4a equal to the width b1 of the second sub-portion 42a of the first retaining wall 4a and setting the width a2 of the first sub-portion 41b of the second retaining wall 4b equal to the width b2 of the second sub-portion 42b of the second retaining wall 4b, the difficulty of the process for preparing the first retaining wall 4a and the difficulty of the process for preparing the second retaining wall 4b can be reduced.

In the case where the width a of the first sub-portion 41, the width b of the second sub-portion 42, and the width c of the third sub-portion 43 of the retaining wall 4 satisfy the above-mentioned magnitude relation, specific values of the width a of the first sub-portion 41, the width b of the second sub-portion 42, and the width c of the third sub-portion 43 may be selected according to actual needs, depending on the process capability and the frame size.

Wherein the width of the first sub-portion 41 may be 10 μm < a < 90 μm, the width of the second sub-portion 42 may be 10 μm < a < 90 μm, and the width of the third sub-portion 43 may be 10 μm < a < 90 μm.

Illustratively, the width a of the first sub-portion 41 may be 10 μm, 30 μm, 50 μm, 70 μm or 89 μm. The width b of the second sub-portion 42 may be 10 μm, 30 μm, 50 μm, 70 μm or 89 μm. The width c of the third sub-portion 43 may be 11 μm, 32 μm, 53 μm, 74 μm or 90 μm.

Alternatively, the width of the first sub-portion 41 of the first retaining wall 4a is 40 μm, the width of the second sub-portion 42 of the first retaining wall 4a is 40 μm, and the width of the third sub-portion 43 of the first retaining wall 4a is 42 μm, 43 μm, 45 μm or 48 μm.

Alternatively, the width of the first sub-portion 41 of the second retaining wall 4b is 30 μm, the width of the second sub-portion 42 of the second retaining wall 4b is 30 μm, and the width of the third sub-portion 43 of the second retaining wall 4b is 40 μm, 41 μm or 42 μm.

In some examples, as shown in fig. 5, the spacing between the third sub-portions 43 of adjacent two retaining walls 4 is greater than the spacing between the first sub-portions 41 of adjacent two retaining walls 4. The spacing between the third sub-portions 43 of adjacent two retaining walls 4 is greater than the spacing between the second sub-portions 42 of adjacent two retaining walls 4.

It should be noted that, the "distance" as used herein refers to the minimum distance between the outer boundary of one retaining wall 4 near the display area AA in the front projection of the rear panel 1 and the inner boundary of the other retaining wall 4 far from the display area AA in the front projection of the rear panel 1, among the two adjacent retaining walls 4.

In addition, "the third sub-portion 43 of the adjacent two retaining walls 4" refers to the third sub-portion 43 of the adjacent two retaining walls 4 that is in the same orientation with respect to the display area AA. "the second sub-portions 42 of the adjacent two retaining walls 4" refers to the second sub-portions 42 of the adjacent two retaining walls 4 that are in the same orientation with respect to the display area AA. "the first sub-portions 41 of the adjacent two retaining walls 4" refers to the first sub-portions 41 of the adjacent two retaining walls 4 that are in the same orientation with respect to the display area AA.

It should be further noted that, the "two adjacent retaining walls 4" includes a first retaining wall 4a and a second retaining wall 4b that are adjacent to each other. In the case where the number of the first retaining walls 4a is plural, the "adjacent two retaining walls 4" may include adjacent two first retaining walls 4a. In the case where the number of the second retaining walls 4b is plural, the "adjacent two retaining walls 4" may include two adjacent second retaining walls 4b.

For example, the above-mentioned interval between the third sub-portions 43 of the adjacent two retaining walls 4 is larger than the interval between the first sub-portions 41 of the adjacent two retaining walls 4, which may mean that the interval between the third sub-portions 43a of the adjacent first retaining walls 4a and the third sub-portions 43b of the second retaining walls 4b is larger than the interval between the first sub-portions 41a of the adjacent first retaining walls 4a and the first sub-portions 41b of the second retaining walls 4b, and the interval between the third sub-portions 43a of the adjacent two first retaining walls 4a is larger than the interval between the first sub-portions 41a of the adjacent two first retaining walls 4a, or the interval between the third sub-portions 43b of the adjacent two second retaining walls 4b is larger than the interval between the first sub-portions 41b of the adjacent two second retaining walls 4b.

For example, the above-mentioned interval between the third sub-portions 43 of the adjacent two retaining walls 4 is larger than the interval between the second sub-portions 42 of the adjacent two retaining walls 4, which may mean that the interval between the third sub-portions 43a of the adjacent first retaining wall 4a and the third sub-portions 43b of the second retaining wall 4b is larger than the interval between the second sub-portions 42a of the adjacent first retaining wall 4a and the second sub-portions 42b of the second retaining wall 4b, the interval between the third sub-portions 43a of the adjacent two first retaining walls 4a is larger than the interval between the second sub-portions 42a of the adjacent two first retaining walls 4a, or the interval between the third sub-portions 43b of the adjacent two second retaining walls 4b is larger than the interval between the second sub-portions 42b of the adjacent two second retaining walls 4b.

The beneficial effects of the above structure are the same as the beneficial effects that the width of the third sub-portion 43 is larger than the width of the first sub-portion 41, and the width of the third sub-portion 43 is larger than the width of the second sub-portion 42, and will not be described here again.

On this basis, the present invention is not limited to the relationship between the distance between the first sub-portions 41a of the adjacent two first retaining walls 4a and the distance between the first sub-portions 41b of the adjacent two second retaining walls 4b, and the relationship between the distance between the second sub-portions 42a of the adjacent two first retaining walls 4a and the distance between the second sub-portions 42b of the adjacent two second retaining walls 4b may be selected according to practical needs.

Illustratively, the spacing between the first sub-portions 41a of adjacent first retaining walls 4a is equal to the spacing between the first sub-portions 41a of adjacent second retaining walls 4b, and the spacing between the second sub-portions 42a of adjacent first retaining walls 4a is equal to the spacing between the second sub-portions 42b of adjacent second retaining walls 4 b. Thus being beneficial to reducing the process difficulty.

In some examples, as shown in fig. 5, the spacing between the first sub-portion 41b of the second retaining wall 4b and the display area AA is greater than the spacing between the second sub-portion 42b of the second retaining wall 4b and the display area AA.

In this way, a larger space is provided between the first sub-portion 41b of the display substrate 100 and the display area AA, so that more other structures can be conveniently provided.

Illustratively, the first sub-portion 41b of the second retaining wall 4b is spaced apart from the display area AA by 3970 μm, and the second sub-portion 42b of the second retaining wall 4b is spaced apart from the display area AA by 2970 μm or 2750 μm.

In addition, the space between the third sub-portion 43b of the second retaining wall 4b and the display area AA is illustratively greater than the space between the first sub-portion 41b of the second retaining wall 4b and the display area AA, and greater than the space between the second sub-portion 42b of the second retaining wall 4b and the display area AA.

For example, the space between a certain position of the third sub-portion 43b of the second retaining wall 4b and the display area AA is 4656 μm, 4678 μm, 4820 μm or 5000 μm.

In some examples, as shown in fig. 5, in the case where the number of the first retaining walls 4a and the number of the second retaining walls 4b are plural, the spacing between the adjacent first retaining walls 4a and second retaining walls 4b is larger than the spacing between the adjacent two first retaining walls 4 a. The distance between the adjacent first retaining wall 4a and second retaining wall 4b is larger than the distance between the adjacent two second retaining walls 4 b.

In the process of preparing the encapsulation layer 3, it can be seen from the above description that, since the display substrate 100 has the second barrier wall 4b, the organic layer 32 can stop leveling before the second barrier wall 4b, and thus the space between the adjacent first barrier wall 4a and second barrier wall 4b can be used to reflect the encapsulation boundary of the encapsulation layer 3 in the peripheral region SS. By providing a larger distance between the first retaining wall 4a and the second retaining wall 4b, more process allowance can be provided for the preparation of the second inorganic layer 33, so that the second inorganic layer 33 can be ensured to completely cover the organic layer 32, and the boundary position of the encapsulation layer 3 in the peripheral area SS can be conveniently controlled, so that an accurate reference site is provided for the subsequent process.

The spacing between the two adjacent first retaining walls 4a, the spacing between the two adjacent second retaining walls 4b and the spacing between the two adjacent first retaining walls 4a and the second retaining walls 4b can be selected according to actual requirements, and the process capability and the frame size are determined.

Illustratively, the range of the spacing between the adjacent two first retaining walls 4a and the range of the spacing between the adjacent two second retaining walls 4b may be 10 μm to 90 μm, and the range of the spacing between the adjacent first retaining walls 4a and the second retaining walls 4b may be 100 μm to 300 μm.

For example, the spacing between two adjacent first retaining walls 4a is 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm or 90 μm; the spacing between two adjacent second retaining walls 4b is 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm or 90 μm; the spacing between adjacent first retaining wall 4a and second retaining wall 4b is 100 μm, 150 μm, 200 μm, 250 μm or 300 μm.

Alternatively, the first sub-portions 41a of two adjacent first retaining walls 4a may have a spacing of 40 μm. The spacing between the second sub-portions 42a of two adjacent first retaining walls 4a is 40 μm. The spacing between the third sub-portions 43a of two adjacent first retaining walls 4a is 42 μm, 43 μm, 45 μm or 48 μm.

Alternatively, the spacing between the first sub-portions 41b of two adjacent second retaining walls 4b is 30 μm. The spacing between the second sub-portions 42b of two adjacent second retaining walls 4b is 30 μm. The spacing between the third sub-portions 43b of two adjacent second retaining walls 4b is 40 μm, 41 μm or 42 μm.

Alternatively, the distance between the first sub-portion 41a of the adjacent first retaining wall 4a and the first sub-portion 41b of the second retaining wall 4b is 150 μm. The spacing between the second sub-portion 42a of the adjacent first retaining wall 4a and the second sub-portion 42b of the second retaining wall 4b is 150 μm. The spacing between the third sub-portion 43a of the adjacent first retaining wall 4a and the third sub-portion 43b of the second retaining wall 4b is 155 μm, 158 μm, 160 μm or 162 μm.

It should be noted that the size relationship between the spacing between the adjacent two first retaining walls 4a and the spacing between the adjacent two second retaining walls 4b is not limited, and may be selected according to actual needs.

Illustratively, the spacing between adjacent two first retaining walls 4a is equal to the spacing between adjacent two second retaining walls 4 b.

The present invention is not limited to the value of the ratio of the space between two adjacent second retaining walls 4b to the width of the second retaining wall 4b, and can be selected according to actual needs.

In some examples, the ratio of the spacing between two adjacent second retaining walls 4b to the width of the second retaining wall 4b ranges from 1:9 to 9:1.

Illustratively, the ratio of the spacing between two adjacent second retaining walls 4b to the width of the second retaining wall 4b may be 1:9, 1:3, 1:1, 5:3, 6:1, or 9:1.

Wherein, when the distance between two adjacent second retaining walls 4b is 10 μm and the width of the second retaining wall 4b is 90 μm, the ratio of the distance between two adjacent second retaining walls 4b to the width of the second retaining wall 4b is 1:9. In the case where the spacing between two adjacent second retaining walls 4b is 90 μm and the width of the second retaining wall 4b is 10 μm, the ratio of the spacing between two adjacent second retaining walls 4b to the width of the second retaining wall 4b is 9:1.

In some examples, as shown in fig. 2, a distance H between a surface of the second retaining wall 4b on a side away from the substrate 10 and the substrate 10 is smaller than a distance H between a surface of the first retaining wall 4a on a side away from the substrate 10 and the substrate 10.

Based on the above structure, it can be ensured that in some extreme cases, the organic solution can stop flowing before the first retaining wall 4a, thereby reducing the probability of package failure.

In some examples, in the case where the number of the second retaining walls 4b is plural, one second retaining wall 4b close to the display area AA is lower than the surface of one second retaining wall 4b far from the display area AA on the side of the back plate 1, or both of the adjacent two second retaining walls 4b are leveled with respect to the back plate 1.

With the above structure, the organic solution is effectively prevented from continuing to flow in a direction close to the frame area SS, so that the organic layer 32 is ensured to be located on the side of the second barrier wall 4b close to the display area AA.

In some examples, as shown in fig. 2, in the case where the number of the first retaining walls 4a is plural, one first retaining wall 4a near the display area AA is lower than the surface of the one first retaining wall 4a far from the display area AA on the side of the back plate 1 with respect to the back plate 1, from among the adjacent two first retaining walls 4 a.

Based on the above structure, the difficulty of the organic solution to cross the first retaining wall 4a can be increased, so that it is further ensured that the organic solution can stop flowing before the first retaining wall 4a in some extreme cases, and the probability of package failure is further reduced.

In some examples, as shown in fig. 3, the display substrate 100 further includes: a power supply line VSS arranged in the same layer as the anode 2 a.

This allows the anode electrode 2a and the power line VSS to be simultaneously formed in one patterning process, which is advantageous in simplifying the manufacturing process of the display substrate 100.

Here, as shown in fig. 3, the power line VSS and the anode 2a are separated by the pixel defining layer 13, and no electrical connection is made between the power line VSS and the anode 2 a. And the cathode 2c may be connected to the power line VSS so as to supply a common voltage to the cathode 2c using the power line VSS.

Illustratively, as shown in fig. 3, the power line VSS is in direct contact with the second retaining wall 4 b.

Since the power line VSS is arranged in the same layer as the anode electrode 2a, the second barrier wall 4b is arranged in the same layer as the pixel defining layer 13, the power line VSS is formed earlier than the second barrier wall 4 b. The power line VSS may be located between the second retaining wall 4b and the back plate 1, and a portion of a side surface of the power line VSS away from the back plate 1 may be in direct contact with a portion of a side surface of the second retaining wall 4b close to the back plate 1.

In some examples, as shown in fig. 3, in the case where one of the first wall patterns is disposed in the same layer as the flat layer 12 and the other first wall pattern is disposed in the same layer as the pixel defining layer 13, the power line VSS may extend to the region where a part of the first wall 4a is disposed through the region where the second wall 4b is disposed and be interposed between the one first wall pattern and the other first wall pattern.

Since the planarization layer 12 is formed before the power line VSS is formed before the pixel defining layer 13, the power line VSS may extend between one of the first barrier wall patterns 4a and the other first barrier wall pattern through the region between the second barrier wall 4b and the back plate 1 after the power line VSS is drawn out to the peripheral region SS.

The foregoing is merely a specific embodiment of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art who is skilled in the art will recognize that changes or substitutions are within the technical scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A display substrate, wherein the display substrate has a display area and a peripheral area; the display substrate includes:

a back plate comprising a substrate;

a plurality of retaining walls arranged on one side of the backboard and positioned in the peripheral area; the plurality of retaining walls comprise at least one first retaining wall and at least one second retaining wall positioned on one side of the first retaining wall, which is close to the display area;

the distance between the side surface of the first retaining wall, which is close to the substrate, and the substrate is smaller than the distance between the side surface of the second retaining wall, which is close to the substrate, and the substrate.

2. The display substrate of claim 1, wherein the first barrier wall comprises a plurality of first barrier wall patterns stacked in sequence, and the second barrier wall comprises at least one second barrier wall pattern.

3. The display substrate according to claim 2, wherein the back plate includes a pixel driving circuit layer, a flat layer, and a pixel defining layer which are sequentially stacked on the substrate;

one of the first retaining wall patterns is arranged on the same layer as the flat layer, and the other first retaining wall pattern is arranged on the same layer as the pixel defining layer;

one of the at least one second retaining wall pattern is arranged on the same layer as the pixel defining layer.

4. The display substrate of claim 1, wherein one of the barriers comprises:

a plurality of first sub-portions extending along a first direction; the method comprises the steps of,

and third sub-portions respectively connected to opposite ends of the first sub-portion.

5. The display substrate of claim 4, wherein orthographic projections of the plurality of first sub-portions on the back plate are straight; orthographic projection of the third sub-part on the backboard is round.

6. The display substrate of claim 4, wherein the first wall further comprises: a plurality of second sub-portions extending in a second direction; the third sub-part is connected with the adjacent first sub-part and second sub-part; the first direction and the second direction intersect;

And the intersection point of the extension lines of the adjacent first sub-parts and the second sub-parts is positioned outside the boundary of the retaining wall.

7. The display substrate of claim 6, wherein orthographic projections of the plurality of second sub-portions on the back plate are straight.

8. The display substrate of claim 1, wherein, in the case that the number of the first retaining walls and the number of the second retaining walls are plural,

the distance between the adjacent first retaining walls and the adjacent second retaining walls is larger than the distance between the adjacent two first retaining walls;

the distance between the adjacent first retaining wall and the adjacent second retaining wall is larger than the distance between the adjacent second retaining wall.

9. The display substrate according to claim 8, wherein a distance between two adjacent first retaining walls is in a range of 10 μm to 90 μm;

the distance between two adjacent second retaining walls is in the range of 10-90 μm.

10. The display substrate according to claim 8, wherein a ratio of a space between two adjacent second retaining walls to a width of the second retaining wall is in a range of 1:9 to 9:1.

11. The display substrate according to claim 1, wherein a distance between a surface of the second retaining wall on a side away from the back plate and the back plate is smaller than a distance between a surface of the first retaining wall on a side away from the back plate and the back plate.

12. The display substrate according to claim 1, wherein in the case where the number of the second barrier ribs is plural,

and one second retaining wall, which is close to the display area, of the at least two second retaining walls is lower than the surface, which is far away from the display area, of the surface, which is far away from the back plate, of the second retaining wall, or the surface, which is far away from the display area, of the second retaining wall is leveled.

13. The display substrate according to claim 1, wherein, in the case where the number of the first retaining walls is plural,

and in the adjacent two first retaining walls, relative to the backboard, the surface of one first retaining wall, which is close to the display area, on one side, which is far away from the backboard, is lower than the surface of one first retaining wall, which is far away from the display area, on one side, which is far away from the backboard.

14. The display substrate according to any one of claims 1 to 13, wherein the display substrate further comprises:

the packaging layer is arranged on one side of the retaining walls, far away from the backboard, of the packaging layer; the method comprises the steps of,

a plurality of light emitting devices located between the back plate and the encapsulation layer and located in the display area; the light-emitting device comprises an anode, a light-emitting layer and a cathode which are sequentially stacked;

Wherein, the display substrate further includes: and the power line is arranged on the same layer as the anode, and the orthographic projection of the power line on the backboard at least partially overlaps with the orthographic projection of the second retaining wall on the backboard.

15. The display substrate according to claim 14, wherein one of the plurality of first wall patterns is arranged in the same layer as the flat layer, and the other of the plurality of first wall patterns is arranged in the same layer as the pixel defining layer, the power line extends to a portion of the first wall region through the second wall region, and is interposed between the one of the first wall patterns and the other of the first wall patterns.

16. A display substrate, wherein the display substrate has a display area and a peripheral area; the display substrate includes:

a back plate comprising a substrate;

a plurality of retaining walls arranged on one side of the backboard and positioned in the peripheral area; the plurality of retaining walls comprise at least two first retaining walls and at least two second retaining walls positioned on one side of the at least two first retaining walls, which is close to the display area;

wherein, in the at least two second retaining walls, with respect to the back plate, a surface of one second retaining wall, which is close to the display area, on a side far away from the back plate is lower than a surface of one second retaining wall, which is far away from the display area, on a side far away from the back plate, or is leveled with the two surfaces;

And in the at least two first retaining walls, with respect to the backboard, the surface of one first retaining wall, which is close to the display area, on the side, which is far away from the backboard, is lower than the surface of one first retaining wall, which is far away from the display area, on the side, which is far away from the backboard.

17. The display substrate of claim 16, wherein the orthographic projection of the second wall on a plane perpendicular to the back plate is within the orthographic projection of the first wall on a plane perpendicular to the back plate.

18. The display substrate of claim 17, wherein a spacing between a side surface of the first wall adjacent the substrate and the substrate is less than a spacing between a side surface of the second wall adjacent the substrate and the substrate;

and/or the distance between the surface of the second retaining wall far away from one side of the backboard and the backboard is smaller than the distance between the surface of the first retaining wall far away from one side of the backboard and the backboard.

19. A display device, comprising: a display substrate according to any one of claims 1 to 15 or any one of claims 16 to 18.

20. The display device according to claim 19, wherein the display device further comprises:

The touch structure is arranged on one side of the packaging layer far away from the backboard; the touch structure comprises a touch electrode layer and a plurality of touch signal lines;

the peripheral area of the display substrate further comprises a binding area;

the touch electrode layer is positioned in a display area of the display substrate;

one end of the touch signal wire is electrically connected with the touch electrode layer;

the other end of the touch signal line spans across the retaining walls of the display substrate and extends to the binding area.