CN115971597A - Temperature monitoring method and device for reflow soldering and storage medium - Google Patents
Temperature monitoring method and device for reflow soldering and storage medium Download PDFInfo
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Abstract
The application belongs to the technical field of temperature monitoring, and particularly relates to a temperature monitoring method, equipment and a storage medium for reflow soldering based on a sine function. The method comprises the following steps: acquiring historical temperature data of reflow soldering; correcting a preset sine function based on historical temperature data to obtain a temperature monitoring model; constructing a HotellingT2 control chart based on a temperature monitoring model; the temperature of the solder reflow is monitored by a HotellingT2 control chart. The problem of inaccurate temperature monitoring of reflow soldering can be solved. Through fitting historical temperature data, the function parameter of presetting the sine function is obtained, thereby obtain the temperature monitoring model, establish HotellingT2 control chart based on the temperature monitoring model again, monitor reflow soldering's temperature through HotellingT2 control chart, therefore, need not to set up the temperature range in every region, can acquire the temperature information of the current moment in the reflow soldering process in real time, and compare at the temperature that the current moment corresponds with HotellingT2 control chart, can improve reflow soldering's temperature monitoring's accuracy.
Description
Technical Field
The application belongs to the technical field of temperature monitoring, and particularly relates to a temperature monitoring method, equipment and a storage medium for reflow soldering.
Background
The reflow soldering technology is an important link of the surface mount technology, reflow soldering data mainly comprises a group of complex time and temperature data, a corresponding temperature curve comprises four areas of preheating, constant temperature, reflow soldering, cooling and the like, and welding quality problems can be caused when the temperature of any area is too high or too low, so that the temperature in the reflow soldering process needs to be monitored.
The traditional temperature monitoring method for reflow soldering comprises the following steps: and respectively setting the temperature range of each area, and outputting prompt information under the condition that the current temperature is higher than the temperature range of the current area.
However, in the reflow soldering process, the temperature in each area changes in real time, and if the temperature monitoring is performed according to the temperature range of each area, there may be a situation that the actual temperature at a certain moment is higher than the required temperature at the current moment and is still within the temperature range of the current area, which leads to an inaccurate temperature monitoring of the reflow soldering.
Disclosure of Invention
The application provides a temperature monitoring method, equipment and a storage medium for reflow soldering, which can solve the problem of inaccurate temperature monitoring of reflow soldering. The application provides the following technical scheme:
in a first aspect, a method for monitoring temperature of reflow soldering is provided, the method comprising:
acquiring historical temperature data of reflow soldering;
correcting a preset sine function based on the historical temperature data to obtain a temperature monitoring model;
constructing a HotellingT2 control chart based on the temperature monitoring model;
the temperature of the reflow soldering is monitored by the HotellingT2 control chart.
Optionally, the historical temperature data comprises n data; the preset sine function is a nonlinear sine function, and the preset sine function is as follows:
wherein i is used for representing the ith sine function; j is used for representing the jth data and is a positive integer smaller than n; x is used to represent temperature data; a is used for representing the amplitude of the preset sine function; b is used to represent the frequency of the sine function; epsilon is an error term; c is a constant term; s is used to indicate the number of summations.
Optionally, i is an integer greater than or equal to 1 and less than or equal to 8.
Optionally, the value of s is 2.
Optionally, the modifying the preset sine function based on the historical temperature data to obtain the temperature monitoring model includes:
fitting the historical temperature data to obtain a fitting result;
determining function parameters of the preset sine function based on the fitting result;
and inputting the function parameters into the preset sine function to obtain the temperature monitoring model.
Optionally, the function parameters include at least one group of function parameters, and before the function parameters are input into the preset sine function to obtain the temperature monitoring model, the method further includes:
and verifying the at least one group of function parameters, and determining the function parameters for inputting the preset sine function in the at least one group of function parameters.
Optionally, the monitoring the temperature of reflow soldering through the HotellingT2 control chart includes:
in the temperature monitoring process of reflow soldering, acquiring real-time temperature information;
and when the temperature indicated by the temperature data is higher than or lower than the temperature corresponding to the HotellingT2 control chart at the current moment, outputting prompt information.
In a second aspect, an electronic device is provided, the device comprising a processor and a memory; the memory stores therein a program that is loaded and executed by the processor to implement the temperature monitoring method for reflow soldering of the first aspect.
In a third aspect, a computer-readable storage medium is provided, wherein the storage medium stores a program, and the program is used for realizing the temperature monitoring method for reflow soldering provided by the first aspect when being executed by a processor.
The beneficial effect of this application lies in: acquiring historical temperature data of reflow soldering; correcting a preset sine function based on historical temperature data to obtain a temperature monitoring model; constructing a HotellingT2 control chart based on a temperature monitoring model; the temperature of the solder reflow is monitored by the HotellingT2 control chart. The problem of inaccurate temperature monitoring of reflow soldering can be solved. Through fitting historical temperature data, the function parameter of presetting the sine function is obtained, thereby obtain the temperature monitoring model, establish HotellingT2 control chart based on the temperature monitoring model again, monitor reflow soldering's temperature through HotellingT2 control chart, therefore, need not to set up the temperature range in every region, can acquire the temperature information of the current moment in the reflow soldering process in real time, and compare at the temperature that the current moment corresponds with HotellingT2 control chart, can improve reflow soldering's temperature monitoring's accuracy.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings used in the detailed description or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic temperature diagram of a reflow soldering process provided by one embodiment of the present application;
FIG. 2 is a flow chart of a method for temperature monitoring of reflow soldering provided by one embodiment of the present application;
FIG. 3 is a schematic illustration of an abnormal temperature during a reflow process provided by one embodiment of the present application;
FIG. 4 is a schematic temperature diagram of a reflow process provided by one embodiment of the present application;
FIG. 5 is a schematic diagram of a control chart provided by one embodiment of the present application;
FIG. 6 is a schematic diagram of a control chart provided by one embodiment of the present application;
FIG. 7 is a schematic diagram illustrating a control diagram for a parent-less approach provided in one embodiment of the present application;
FIG. 8 is a block diagram of a reflow soldering temperature monitoring apparatus provided in one embodiment of the present application;
FIG. 9 is a block diagram of an electronic device provided by an embodiment of the application.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
B-2022CN348-I
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the accompanying drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
In this application, where the context does not dictate to the contrary, the use of directional terms such as "upper, lower, top, bottom" generally refers to the orientation as shown in the drawings, or to the component itself in a vertical, perpendicular, or gravitational orientation; likewise, for ease of understanding and description, "inner and outer" refer to the inner and outer relative to the profile of the components themselves, but the above directional words are not intended to limit the application.
The following is a description of the terminology used in this application.
Reflow Soldering technique (Reflow Soldering): the Reflow soldering data is an important link of Surface Mount Technology (SMT), the Reflow soldering data is mainly a set of complex time and temperature data, and the Reflow soldering temperature Profile (Reflow Profile) includes four large areas including Pre-heat (Pre-heat), constant temperature (Soak), reflow soldering (Reflow) and Cooling (Cooling), so that the Reflow soldering data is not a linear data but a nonlinear curve data.
The temperature profile control consists mainly of temperature changes in four zones:
1. a preheating zone: typically from room temperature to 150 c, the temperature range of this zone should be from 1 to 2 c per second,
2. a constant-temperature area: the temperature is usually controlled in a constant temperature area of 180 ℃ and usually accounts for 90 to 120 seconds of the whole temperature curve
3. A reflow area: in the area with the highest temperature, different peak temperatures are set according to the surface elements of different circuit boards, and are generally 230-250 DEG C
4. A cooling area: the temperature is reduced from 240 ℃ to about 45 ℃, the welding quality problem can be caused by too long or too short time of the temperature reduction process, and the temperature reduction rate is generally 3-10 ℃ per second.
The temperature specification is plotted as a graph, and referring to fig. 1, when the temperature in any one area is too high or too low, the soldering quality may be problematic, since the circuit board of each product may contain different electronic components, and the lowest refractory component of each product may be different at the peak temperature, so that the temperature curve plotted for each product will be different, and the temperature curve allows the operator to make appropriate changes to optimize the reflow process.
B-2022CN348-I
The following describes the temperature monitoring method for reflow soldering in detail.
As shown in fig. 1, an embodiment of the present application provides a temperature monitoring method for reflow soldering, where the method may be implemented by a computer program, where the computer program may be run on a computer device such as a smart phone, a tablet computer, a personal computer, or on a server, and the embodiment does not limit an operation subject of the method, and the method includes at least the following steps:
step 101, obtaining historical temperature data of reflow soldering.
In this embodiment, the historical temperature data includes n collected historical temperature data in the reflow soldering process.
Wherein n is an integer greater than 0, for example, the value of n includes 12 or 16.
In actual implementation, the value of n may also be other positive integers, and the value of n is not limited in this embodiment.
And 102, correcting a preset sine function based on historical temperature data to obtain a temperature monitoring model.
The preset sine function is a nonlinear sine function.
Specifically, the preset sine function is:
wherein i is used to represent the ith sine function; j is used for representing the jth data and is a positive integer smaller than n; x is used to represent temperature data; a is used for representing the amplitude of the preset sine function; b is used to represent the frequency of the sine function; epsilon is an error term; c is a constant term; s is used to indicate the number of summations.
Optionally, i is an integer greater than or equal to 1 and less than or equal to 8.
Because historical temperature data in the reflow soldering process is not linear data but nonlinear curve data, based on the data, in the embodiment, the temperature monitoring model is constructed through a nonlinear preset sine function. Wherein, the temperature monitoring model is a mathematical model.
Specifically, the method for obtaining the temperature monitoring model by correcting the preset sine function based on the historical temperature data comprises the following steps: fitting the historical temperature data to obtain a fitting result; determining function parameters of a preset sine function based on the fitting result; and inputting the function parameters into a preset sine function to obtain a temperature monitoring model.
Optionally, after the historical temperature data is fitted to obtain a fitting result, the function parameters may be obtained through a preset parameter estimation algorithm.
The preset parameter estimation algorithm is a Non-linear Least square (NLS) method.
In addition, in this embodiment, since the historical temperature data includes n pieces of data, the estimated function parameters include at least one set of function parameters. And verifying each group of obtained function parameters to determine the function parameter with the best effect from at least one group of function parameters and input a preset sine function.
Specifically, before inputting the function parameter into the preset sine function to obtain the temperature monitoring model, the method further includes: and verifying the at least one group of function parameters, and determining the function parameters for inputting the preset sine function in the at least one group of function parameters.
Optionally, verifying at least one set of function parameters includes: and verifying at least one group of function parameters through a preset verification algorithm.
Wherein the preset verification algorithm is Schwarz Information Criterion (SIC).
Such as: after the verification by the preset verification algorithm, the performance of the obtained sinusoidal function which sums twice is the best, and at this time, the sinusoidal function can be represented by the following formula:
f(x i，j ，β i )＝a 1i sin(b 1i x ij )+a 2i sin(b 2i x ij +c 2i )+ε ij
wherein i is used to represent the ith sine function; j is used for representing j data; x is used to represent temperature data; a is used for representing the amplitude of the preset sine function; b is used to represent the frequency of the sine function; epsilon is an error term; c is a constant term.
And 103, constructing a HotellingT2 control chart based on the temperature monitoring model.
And 104, monitoring the temperature of the reflow soldering through a HotellingT2 control chart.
After the reflow soldering process is carried out for multiple times, a plurality of temperature-time data can be obtained, temperature standard curves of four areas of preheating, constant temperature, reflow soldering and cooling can be set based on the plurality of temperature-time data, and the temperature in the reflow soldering process is monitored through the temperature standard curves.
Such as: referring to fig. 2, it can be seen that when one datum is in the cooling zone, the temperature is higher than other data at the same time point, which may cause the soldered electronic component to shift, resulting in problems in soldering quality and ultimately product scrap.
In a conventional method for monitoring the temperature of reflow soldering, referring to fig. 3, each area is set with a hierarchical manner to monitor the temperature, however, when the temperature is shifted, there is a possibility that abnormality cannot be effectively monitored.
Referring to the outliers in the cooling zone of FIG. 2, the outliers in FIG. 2 are significantly different from the outliers in other data and are higher than the temperature specification curve, but do not exceed the range of the monitored temperature of the cooling zone of FIG. 3 and therefore cannot be monitored.
In order to solve the above problem, in this embodiment, a function parameter of a preset sine function is obtained by fitting historical temperature data, so as to obtain a temperature monitoring model, a HotellingT2 control diagram is constructed based on the temperature monitoring model, and the temperature of reflow soldering is monitored through the HotellingT2 control diagram, so that the temperature range of each region does not need to be set, the temperature information of the current moment in the reflow soldering process can be obtained in real time, and is compared with the temperature corresponding to the HotellingT2 control diagram at the current moment, and when the temperature indicated by the temperature information at the current moment is higher than or lower than the temperature corresponding to the control diagram at the current moment, prompt information is output to prompt a user that the temperature is abnormal.
Specifically, the temperature of the reflow soldering is monitored through HotellingT2 control chart, which comprises the following steps: acquiring real-time temperature information in the temperature monitoring process of reflow soldering; and in the case that the temperature indicated by the temperature data is higher or lower than the temperature corresponding to the HotellingT2 control chart at the current moment, outputting prompt information.
In another conventional reflow soldering temperature monitoring method, namely a polynomial regression method, in the case of an excessively complex temperature curve, an overfitting condition is caused, and finally inaccurate monitoring is caused in the temperature monitoring process. The polynomial regression generally has the problems of excessive estimation parameters and poor model fitting degree. Meanwhile, in the polynomial regression method, the curve is divided into multiple segments for smooth handover, so that the parameters are too many, the operation speed is reduced, and a large number of samples are required for estimation.
Referring to fig. 5 and 6, fig. 5 is a control chart corresponding to the modified sine function, fig. 6 is a control chart corresponding to the polynomial regression method, fig. 5 and 6 both include the abnormal values indicated by the cooling zone in fig. 2, and the abnormal data is determined in both fig. 5 and 6. However, in the control chart corresponding to the polynomial regression method, the control line is closer to the normal data, so that the probability of erroneous determination is increased, and in the control chart corresponding to the modified sine function, the abnormal value and the normal value can be clearly distinguished, so that the possibility of erroneous determination can be reduced.
In another conventional reflow temperature monitoring method, i.e., the non-parent method, the Deviation degree between each temperature curve and the baseline is found out by the baseline (base line), and the Deviation degree can be determined by some methods for measuring the distance, such as Maximum Deviation (Maximum Deviation), sum of Square Deviation (Sum of Square Deviation), sum of Absolute Deviation (Sum of Absolute Deviation), etc., and the distances measured by these methods are used to determine whether the data is an abnormal value as the basis for warning. However, the method without a parent number has low sensitivity, and cannot effectively monitor the abnormality in real time when the abnormality occurs.
In one example, to compare the effectiveness between the reflow temperature monitoring method, the polynomial regression method and the non-parent method provided in this embodiment, the performance of the three methods in ARLout is compared by using the same ARLin =200 as a reference in the control chart mode when the temperature data is abnormal.
Wherein ARLin is in control Average Run Length, which means that when the monitored temperature data is normal, the control chart averagely controls the frequency of alarming. That is, the greater the value of ARLin, the better when the monitored temperature is normal. The lower the probability of false alarms occurring on the representative control chart.
On the other hand, ARLout is expected to be better when abnormality occurs in the monitored temperature, and therefore, the ARLout value is better as it is smaller.
The comparison method shifts one parameter at a time, and the shift degree is obtained by adding the average parameter value to m times of the standard deviation of the parameter, wherein the range of m is 0.5-3.
From the equation:
abnormal temperature data is generated.
Wherein the content of the first and second substances,
the 16 sets of function parameters generated for the 16 sets of historical temperature data were averaged, and the mean and standard deviation of the parameters are shown in table one:
table one:
ε ij the error term is a normal distribution variable with the average value of 0 and the standard deviation of 1, the equation is used for generating simulated temperature data to monitor a control chart, the generation of the data is stopped until an alarm is given, the alarm is given in the second time, the average obtained by iterating 200 times is the result of the ARLout method, and the simulated temperature data is generated by the parameter offset mode to compare the efficiency of the ARLout methods.
The non-parent method is a mixed index, 16 groups of curves averaged from historical temperature data are used as baselines, and the maximum deviation is used:
sum of squared deviations sum:
summed absolute deviations:
wherein i is the ith group of data,
for group i curves>
As a baseline, as a method for measuring the distance between the curve and the baseline, each method will obtain 16 points, and the respective control chart is as follows:
The comparison results are shown in tables 3, 4, 5, 6, and 7:
table 3:
table 4:
table 5:
table 6:
table 7:
from the results in tables 3, 4, 5, 6 and 7, it can be seen that the performance of ARLout in the case of the deviation or abnormality of the reflow temperature profile is generally lower than that of the other two methods, and when m is greater than or equal to 2, the performance of ARLout is quite close to 1. In the table, parameters a1 and a2 are the amplitude of the curve, parameters b1 and b2 are the frequency of the curve, and parameter c1 is the horizontal phase constant of the curve.
The temperature monitoring method of reflow soldering provided by the embodiment can accurately represent reflow soldering technical data, parameters are interpretable, and competitive monitoring performance is provided.
In summary, the temperature monitoring method for reflow soldering provided by this embodiment obtains historical temperature data of reflow soldering; correcting a preset sine function based on historical temperature data to obtain a temperature monitoring model; constructing a HotellingT2 control chart based on a temperature monitoring model; the temperature of the solder reflow is monitored by a HotellingT2 control chart. The problem of inaccurate temperature monitoring of reflow soldering can be solved. Through fitting historical temperature data, the function parameter of presetting the sine function is obtained, thereby obtain the temperature monitoring model, establish HotellingT2 control chart based on the temperature monitoring model again, monitor reflow soldering's temperature through HotellingT2 control chart, therefore, need not to set up the temperature range in every region, can acquire the temperature information of the current moment in the reflow soldering process in real time, and compare at the temperature that the current moment corresponds with HotellingT2 control chart, can improve reflow soldering's temperature monitoring's accuracy.
Fig. 8 is a block diagram of a temperature monitoring apparatus for reflow soldering based on sine function according to an embodiment of the present application, which includes at least the following modules: a data acquisition module 810, a function modification module 820, a control chart construction module 830, and a temperature monitoring module 840.
A data acquisition module 810, configured to acquire historical temperature data of reflow soldering;
a function correcting module 820, configured to correct a preset sine function based on historical temperature data to obtain a temperature monitoring model;
a control diagram construction module 830, configured to construct a HotellingT2 control diagram based on the temperature monitoring model;
and the temperature monitoring module 840 is used for monitoring the temperature of the reflow soldering through HotellingT2 control chart.
For relevant details reference is made to the above-described embodiments.
It should be noted that: in the foregoing embodiment, when the temperature monitoring device for reflow soldering is used to monitor the temperature of reflow soldering, only the division of the functional modules is used as an example, and in practical applications, the function distribution may be completed by different functional modules according to needs, that is, the internal structure of the temperature monitoring device for reflow soldering is divided into different functional modules, so as to complete all or part of the functions described above. In addition, the temperature monitoring device for reflow soldering and the temperature monitoring method for reflow soldering provided by the embodiments belong to the same concept, and specific implementation processes thereof are detailed in the method embodiments and are not described herein again.
The embodiment provides an electronic device, as shown in fig. 9, which may be the self-moving device in fig. 1. The electronic device comprises at least a processor 901 and a memory 902.
Processor 901 may include one or more processing cores such as: 4 core processors, 8 core processors, etc. The processor 901 may be implemented in at least one hardware form of a DSP (Digital Signal Processing), an FPGA (Field-Programmable Gate Array), and a PLA (Programmable Logic Array). The processor 901 may also include a main processor and a coprocessor, where the main processor is a processor for Processing data in an awake state, and is also called a Central Processing Unit (CPU); a coprocessor is a low power processor for processing data in a standby state. In some embodiments, the processor 901 may be integrated with a GPU (Graphics Processing Unit), which is responsible for rendering and drawing the content required to be displayed on the display screen. In some embodiments, the processor 901 may further include an AI (Artificial Intelligence) processor for processing computing operations related to machine learning.
Memory 902 may include one or more computer-readable storage media, which may be non-transitory. The memory 902 may also include high-speed random access memory, as well as non-volatile memory, such as one or more magnetic disk storage devices, flash memory storage devices. In some embodiments, a non-transitory computer readable storage medium in memory 902 is used to store at least one instruction for execution by processor 901 to implement a method of temperature monitoring for reflow soldering as provided by method embodiments herein.
In some embodiments, the electronic device may further include: a peripheral interface and at least one peripheral. The processor 901, memory 902 and peripheral interfaces may be connected by buses or signal lines. Each peripheral may be connected to the peripheral interface by a bus, signal line, or circuit board. Illustratively, peripheral devices include, but are not limited to: radio frequency circuit, touch display screen, audio circuit, power supply, etc.
Of course, the electronic device may include fewer or more components, which is not limited by the embodiment.
Optionally, the present application further provides a computer-readable storage medium, where a program is stored, and the program is loaded and executed by a processor to implement the method for clearing push records of the foregoing method embodiments.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. A method of temperature monitoring of reflow soldering, the method comprising:
acquiring historical temperature data of reflow soldering;
correcting a preset sine function based on the historical temperature data to obtain a temperature monitoring model;
constructing a HotellingT2 control chart based on the temperature monitoring model;
the temperature of the reflow soldering is monitored by the HotellingT2 control chart.
2. The method of claim 1, wherein the historical temperature data comprises n pens of data; the preset sine function is a nonlinear sine function, and the preset sine function is as follows:
wherein i is used for representing the ith sine function; j is used for representing the jth data and is a positive integer smaller than n; x is used to represent temperature data; a is used for representing the amplitude of the preset sine function; b is used to represent the frequency of the sine function; epsilon is an error term; c is a constant term; s is used to indicate the number of summations.
3. The method of claim 2, wherein i is an integer greater than or equal to 1 and less than or equal to 8.
4. The method of claim 2, wherein s has a value of 2.
5. The method of claim 1, wherein modifying the preset sine function based on the historical temperature data to obtain a temperature monitoring model comprises:
fitting the historical temperature data to obtain a fitting result;
determining function parameters of the preset sine function based on the fitting result;
and inputting the function parameters into the preset sine function to obtain the temperature monitoring model.
6. The method of claim 4, wherein the function parameters comprise at least one set of function parameters, and before inputting the function parameters into the preset sine function to obtain the temperature monitoring model, the method further comprises:
and verifying the at least one group of function parameters, and determining the function parameters for inputting the preset sine function in the at least one group of function parameters.
7. The method of claim 1, wherein said monitoring the temperature of the solder reflow by said HotellingT2 control map comprises:
acquiring real-time temperature information in the temperature monitoring process of reflow soldering;
and outputting prompt information when the temperature indicated by the temperature data is greater than or lower than the temperature corresponding to the HotellingT2 control chart at the current moment.
8. An electronic device, characterized in that the electronic device comprises: a processor and a memory; the memory stores a program that is loaded and executed by the processor to implement the temperature monitoring method of reflow soldering according to any one of claims 1 to 7.
9. A computer-readable storage medium, characterized in that the storage medium has stored therein a program which, when executed by a processor, is adapted to implement the method of temperature monitoring for reflow soldering according to any one of claims 1 to 7.
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