CN115954757A - Packaging tube shell of semiconductor laser and processing technology thereof - Google Patents
Packaging tube shell of semiconductor laser and processing technology thereof Download PDFInfo
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- CN115954757A CN115954757A CN202310034943.5A CN202310034943A CN115954757A CN 115954757 A CN115954757 A CN 115954757A CN 202310034943 A CN202310034943 A CN 202310034943A CN 115954757 A CN115954757 A CN 115954757A
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Abstract
The application relates to a packaging tube shell of a semiconductor laser and a processing technology thereof, wherein the main technical scheme is the packaging tube shell of the semiconductor laser, which comprises a frame body, a bottom plate, an assembly part, a lead and an insulator, wherein the bottom of the frame body is connected with the bottom plate in a soldering manner; the lead is fixed on the assembly part through an insulator in a sintering mode; the side of the frame body is provided with an assembly hole corresponding to the assembly part, and the assembly part is fixedly connected with the frame body. This application is through setting up the assembly part to seal fixedly the lead wire with melting, thereby remove the restriction of the preceding machine tooling of framework, make the framework can braze and car processing with the bottom plate in the lump, greatly shortened whole process time, and the framework volume before the car processing is great, anti deformability is strong, and size precision keeps better, and for the follow-up simultaneous car processing of framework and bottom plate has created the condition, maintain with better dissipation internal stress and shape, and then greatly improved size precision.
Description
Technical Field
The application relates to the field of semiconductor lasers, in particular to a packaging tube shell of a semiconductor laser and a processing technology thereof.
Background
Semiconductor lasers are a class of lasers that mature earlier and progress faster, are simple to fabricate, low cost, easy to mass produce due to their wide wavelength range, and are small, lightweight, and long-lived due to their small size. The semiconductor laser has been widely applied in laser ranging, laser radar, laser communication, laser simulated weapons, laser warning, laser guidance and tracking, ignition and detonation, automatic control, detecting instruments and the like, and forms a wide market.
The output power, the conversion efficiency and the reliability are three main parameters for describing the performance of the semiconductor laser, and the packaging tube shell of the semiconductor laser plays a key role in ensuring the parameters.
The packaging tube shell of the existing semiconductor laser comprises a frame body, a bottom plate, a lead and a glass insulator. The manufacturing method comprises the steps of machining a frame body to form an assembly hole, placing a glass insulator and a lead in the assembly hole in advance, sintering at a high temperature of 980 ℃ in a sintering mode, sealing the glass insulator in a melting mode at a high temperature to fix the lead in the assembly hole in the frame body, brazing (at a temperature of 780 ℃ or so) to enable the frame body and a bottom plate to be brazed and sintered, and finally, carrying out CNC machining forming on the bottom plate to obtain the packaging tube shell.
In the above, since the sintering temperature of the glass insulator is much higher than the brazing temperature and the tolerance temperature of the bottom plate, the frame body needs to be machined first to create the condition that the glass insulator can be pre-installed on the frame body, then the glass is sintered first to fix the lead wire on the frame body, then the frame body and the bottom plate with the lead wire fixed are brazed and sintered, and finally the CNC processing is performed on the bottom plate.
However, the frame body also deforms to a certain extent in the high-temperature glass sintering process, and in addition, the deformation of the brazing sintering process influences the size precision of the packaging tube shell, and further influences the use effect of the packaging tube shell.
Disclosure of Invention
In order to improve the size precision of the packaging tube shell, the application provides the packaging tube shell of the semiconductor laser and a processing technology thereof.
The application provides a semiconductor laser's encapsulation tube shell adopts following technical scheme:
a packaging tube shell of a semiconductor laser comprises a frame body, a bottom plate, an assembly part, a lead and an insulator, wherein the bottom of the frame body is connected with the bottom plate in a brazing mode; the lead is fixed on the assembly part through an insulator in a sintering mode; the side of the frame body is provided with an assembly hole corresponding to the assembly part, and the assembly part is fixedly connected with the frame body.
Through adopting above-mentioned technical scheme, through setting up the assembly part, in order to melt and seal and fix the lead wire, as independent subassembly, thereby need not to install on the framework from the beginning the lead wire, and then remove the restriction of the preceding machine tooling of framework, make the framework can braze in the lump with the bottom plate and car processing, whole process time has greatly been shortened, and the framework volume before car processing is great, anti deformability is strong, size precision keeps better, and for the follow-up while car processing of framework and bottom plate has created the condition, in order to better dissipate internal stress and shape and maintain, and then size precision has greatly been improved.
And the assembly part, the insulator and the lead are used as independent components, so that scrappage caused by poor insulator due to the fact that the insulator is directly sintered by the frame body can be reduced, and accordingly scrappage cost is reduced.
Optionally, the assembly is brazed to the frame.
Through adopting above-mentioned technical scheme, can greatly improve joint strength and leakproofness between assembly spare and the framework.
Meanwhile, the requirement on the dimensional accuracy of the assembly part is not high, so that even the brazing connection is selected, the use accuracy of the integral structure cannot be greatly influenced.
Optionally, the assembly part is matched with the assembly hole in shape, a brazing groove is arranged at an orifice of the assembly hole far away from the center of the frame body, and the brazing groove is used for placing a soldering lug; and a flange is convexly constructed at the orifice of the assembly hole close to the center of the frame body.
Through adopting above-mentioned technical scheme, the flange plays the positioning action to the assembly part, and when the assembly part adaptation was in the mounting hole, the soldering lug in the brazing groove covered the clearance between assembly part and the mounting hole just when melting to the leakproofness has been improved more.
Optionally, the assembly part is a long plate, the assembly part is provided with a plurality of through holes arranged along the length of the assembly part at intervals, the through holes are in one-to-one correspondence with the leads, and the assembly holes are long holes.
The existing installation process of the glass insulator before high-temperature sintering is that the insulator is firstly placed in a machined hole of a frame body, and then a lead passes through the insulator, so that the pre-installation among the lead, the insulator and the frame body is completed.
Because, the size of framework itself is less, and the operating space of wearing to establish of tiny lead wire is less, and the degree of difficulty of this assembly is big promptly, and secondly, a plurality of lead wires are arranged respectively on the different faces of framework, and the lead wire of one side has consequently been installed, then need move the framework to the lead wire of installation opposite side, so move then easily lead to originally good lead wire or insulator not hard up to fall out, further increased the difficulty of assembly, assembly efficiency is low.
By adopting the technical scheme, the plurality of leads are arranged on the same assembly part, then the assembly part is independently fused and sintered, namely the leads are fixed at the moment, so that the assembly part provided with the leads is directly fixed on the frame body more simply, unnecessary movement of the frame body is reduced, loosening of the leads or insulators is also reduced, the operating space for arranging the leads to the assembly part is large, the assembly difficulty is comprehensively reduced, and the assembly efficiency is improved.
Optionally, the assembly part includes two edges the pilot hole is seted up first assembly piece and the second assembly piece of direction superpose, the perforation has all been seted up to first assembly piece and second assembly piece, first assembly piece with the second assembly piece dislocation set, works as when the perforation of first assembly piece and the perforation of second assembly piece are coaxial, the perforation of first assembly piece and the perforation of second assembly piece make up into the through-hole.
Through adopting above-mentioned technical scheme, with first assembly piece and the superpose of second assembly piece earlier for the perforation of the two is coaxial, then packs into the insulator in two perforations, then when the frit seal sintering, the insulator is the molten condition, and it is softer, consequently misplaces first assembly piece and second assembly piece, thereby carries out the shearing of a small distance to the insulator of molten condition, makes the insulator divide into the two parts of dislocation, and two parts are located two perforations respectively.
Therefore, the tortuosity of the through hole is greatly increased, the difficulty of external water vapor invading the inside of the tube shell is increased, and the contact area of the insulator to the first assembling piece and the second assembling piece is also increased, so that the installation stability of the lead is improved. And thirdly, the insulator in the molten state is disturbed by the dislocation action, so that the insulator in the molten state can flow more easily to fill the through hole, and the cavity condition is reduced.
Optionally, the perforation of first assembly piece with the perforation of second assembly piece is square hole, first assembly piece with the second assembly piece sets up along first assembly piece width direction dislocation, the second assembly piece with first assembly piece sets up along second assembly piece length direction dislocation, and just along first assembly piece width direction's dislocation distance and along second assembly piece length direction's dislocation distance equal.
Through adopting above-mentioned technical scheme, the insulator is the square, and it can assemble earlier in the perforation of the first assembly piece of coaxial setting and second assembly piece, then when the fused seal sintering, the insulator is the molten state, and it is softer, then carries out width direction and length direction's dislocation for the through-hole size of square diminishes in proportion, with the extrusion insulator, makes the clearance between insulator and the through-hole littleer, reduces the cavity condition.
The application also provides a processing technology of the packaging tube shell of the semiconductor laser, which adopts the following technical scheme:
a processing technology of a packaging tube shell of a semiconductor laser comprises the following steps:
processing a pipe shell blank: stacking the frame body blank and the bottom plate blank, and performing brazing sintering to fix the frame body blank on the bottom plate blank to prepare a tube shell blank;
processing a semi-finished product of the pipe shell: machining the tube shell blank to obtain a tube shell semi-finished product;
processing a lead assembly: a lead passes through the insulator to be pre-installed in a through hole on the assembly part, and then fusion sealing is carried out to fix the insulator on the assembly part;
processing a finished product of the pipe shell: and pre-mounting the assembly body on the assembly hole on the frame body, and then performing brazing and sintering to obtain a finished product of the tube shell.
Through adopting above-mentioned technical scheme, through the independent processing that additionally sets up the lead wire subassembly to remove the restriction of the preceding machine tooling of framework, make the framework can braze and car processing in the lump with the bottom plate, greatly shortened whole process time.
And the tube shell blank is integrally lathed, so that the internal stress between the frame body blank and the bottom plate blank is better dissipated, the overall shape is convenient to trim, and the size precision is greatly improved.
And the frame body blank and the bottom plate blank before the turning have larger volumes, strong deformation resistance and better size precision maintenance, and precision conditions are created for the subsequent simultaneous turning of the frame body and the bottom plate.
And the assembly part, the insulator and the lead are used as independent components, so that scrappage caused by poor insulator due to the fact that the insulator is directly sintered by the frame body can be reduced, and accordingly scrappage cost is reduced.
Optionally, in the step of processing the lead assembly, the insulator and the lead are clamped and fixed by a graphite clamp during the fusion sealing and sintering.
By adopting the technical scheme, when the insulator is sintered, the graphite clamp is not easy to stick to the insulator in a molten state, the heat resistance of the graphite clamp is better, the deformation of the graphite clamp is smaller, the clamping precision can be ensured, and secondly, the graphite clamp is not easy to damage an assembly part, namely, the graphite clamp is more suitable for clamping small-sized workpieces.
Optionally, the assembly part comprises a first assembly piece and a second assembly piece which are stacked along the direction of the assembly hole, the first assembly piece and the second assembly piece are both provided with a through hole, a long side of the first assembly piece is provided with a first elastic sheet, and a short side of the second assembly piece is provided with a second elastic sheet;
in the step of processing the lead assembly, fixing the lead assembly by using a tool and a clamping tool, wherein the tool comprises two clamping pieces arranged in half and half, a clamping cavity for clamping a first assembling piece and a second assembling piece is formed between the two clamping pieces, the clamping cavity of the clamping piece corresponding to the first assembling piece is only used for the first assembling piece to slide along the width direction of the clamping cavity, and the clamping cavity of the clamping piece corresponding to the second assembling piece is only used for the second assembling piece to slide along the length direction of the clamping cavity; the first assembling piece and the second assembling piece which are in a superposed state are fixed by the two clamping pieces at the same time, the first elastic piece and the second elastic piece are elastically abutted against the cavity wall of the clamping cavity, then the first assembling piece and the second assembling piece are forced to move, the through holes of the first assembling piece and the second assembling piece are coaxial, the square insulator is placed into the coaxial through holes of the first assembling piece and the second assembling piece at the same time, then the tooling piece is fixed on the fixture, the fixture comprises a base body, and the base body is provided with a chuck for clamping two ends of the lead.
Through adopting the above technical scheme, the installation stage, utilize the relative displacement of square insulator in order to restrict first assembly piece and second assembly piece, this moment, the compression state is all located to first shell fragment and second shell fragment, when being in the sintering stage, the insulator is the melting form, it is softer, it reduces the spacing effect of first assembly piece and second assembly piece, consequently, first shell fragment and second shell fragment resume deformation, in order to force first assembly piece to remove a segment distance along width direction respectively, the second assembly piece removes a segment distance along length direction, thereby carry out the shearing of a small distance to the insulator of melting state, make the insulator divide into the two parts of dislocation, and two parts are located two perforations respectively. Therefore, the tortuosity of the through hole is greatly increased, the difficulty of external water vapor invading the inside of the tube shell is increased, and the contact area of the insulator to the first assembly piece and the second assembly piece is increased, so that the installation stability of the lead is improved. Thirdly, the dislocation action has produced the disturbance to the insulator of molten state for the insulator of molten state is changeed the flow and is filled the perforation, thereby reduces the cavity condition, and fourth, first assembly piece and second assembly piece carry out width direction and length direction's removal, make the through-hole size of square diminish in proportion, with the extrusion insulator, make the clearance between insulator and the through-hole littleer, reduce the cavity condition.
Optionally, the chuck is rotatably connected with the base body around the axis of the lead, and the base body is provided with a twisting assembly for driving the two ends of the lead to rotate in opposite directions.
By adopting the technical scheme, the twisting assembly is adopted, so that the lead is twisted, the disturbance effect on the insulator is improved, the gap between the insulator and the through hole is smaller, the cavity condition is reduced, the roughness of the twisted lead surface is larger, and the combination degree of the lead and the insulator can be improved.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the lead is fixed by the aid of the assembling parts through fusion sealing, so that the limitation of pre-machining of the frame body is removed, the frame body and the bottom plate can be brazed and machined, the overall machining time is greatly shortened, the size of the frame body before machining is large, the deformation resistance is high, the size precision is kept well, conditions are created for subsequent simultaneous machining of the frame body and the bottom plate, internal stress and shape trimming are dissipated better, and the size precision is greatly improved;
2. the plurality of leads are installed on the same assembly part, then the assembly part is independently fused and sintered, namely the leads are fixed, so that the assembly part with the leads is simpler when being directly fixed on the frame body, unnecessary movement of the frame body is reduced, loosening of the leads or insulators is reduced, the operation space for installing the leads to the assembly part is larger, the assembly difficulty is comprehensively reduced, and the assembly efficiency is improved;
3. the assembly part, the insulator and the lead are used as independent components, so that scrapping caused by poor insulators due to direct sintering of the insulators by the frame body can be reduced, and scrapping cost is reduced.
Drawings
Fig. 1 is a schematic structural view of a package case of embodiment 1.
Fig. 2 is a sectional view showing the fitting relationship of the lead assembly and the frame body according to embodiment 1.
FIG. 3 is a block flow diagram of the processing of example 1.
Fig. 4 is a schematic structural view of the blank of the tube case of example 1.
Fig. 5 is a schematic structural view of a semi-finished product of a tube case of embodiment 1.
Fig. 6 is an exploded view of example 2 for illustrating the fitting relationship of the clip to the fitting.
Fig. 7 is a schematic view of the clip of embodiment 2 engaged with a clip.
Figure 8 is a clip diagram of example 2.
Fig. 9 isbase:Sub>A sectional view taken in the direction ofbase:Sub>A-base:Sub>A in fig. 8.
Fig. 10 is a sectional view taken in the direction B-B in fig. 8.
Fig. 11 is a schematic view of embodiment 2 for showing a state in which the first mounting tabs and the second mounting tabs are displaced.
Fig. 12 is a schematic view of the clip of example 3 engaged with a clip.
Description of reference numerals: 1. semi-finished product of the pipe shell; 2. a lead assembly; 3. a clip; 4. a holder; 10. a frame body blank; 11. a frame body; 111. an assembly hole; 112. blocking edges; 113. a brazing groove; 12. a base plate; 20. a base plate blank; 21. an assembly member; 211. a first fitting piece; 212. a second fitting piece; 213. perforating; 214. a first spring plate; 215. a second elastic sheet; 216. a first gap; 217. a second gap; 210. a through hole; 22. an insulator; 23. a lead wire; 30. a clamping cavity; 31. a first rib; 32. a first groove; 33. a second convex strip; 41. a base body; 42. a support plate; 43. rotating the rod; 44. a chuck; 51. a gear; 52. a rack; 53. a linear drive.
Detailed Description
The present application is described in further detail below with reference to figures 1-12.
The embodiment 1 of the application discloses a packaging tube shell of a semiconductor laser.
Referring to fig. 1, a package case of a semiconductor laser includes a frame 11, a bottom plate 12, an assembly 21, a lead 23, and an insulator 22, wherein the frame 11 may be made of 10# steel, which has good performance in various aspects, the bottom plate 12 may be made of oxygen-free copper, which has good heat dissipation performance, and the bottom of the frame 11 and the bottom plate 12 are fixed by brazing to form a half-finished package case 1.
As shown in fig. 1 and 2, the assembly member 21, the lead 23 and the insulator 22 form an independently assembled lead assembly 2, specifically, the insulator 22 has a ring structure, which may be circular or square, the insulator 22 may be made of glass or ceramic, the insulator 22 is sleeved on the lead 23, the insulator 22 is matched with the through hole 210 on the assembly member 21, and the lead 23 is sintered and fixed on the assembly member 21 through the insulator 22, so as to achieve the assembly of the assembly member 21, the lead 23 and the insulator 22.
In this embodiment, in order to simplify the assembly difficulty, the assembly member 21 is configured to be a long plate, the assembly member 21 is provided with a plurality of through holes 210 arranged at intervals along the length of the assembly member 21, and the through holes 210 are arranged in one-to-one correspondence with the leads 23 and the insulators 22, so that one assembly member 21 can be used for assembling a plurality of leads 23.
As shown in fig. 1, a fitting hole 111 is opened in a side surface of the frame 11, and the fitting 21 is mounted in the fitting hole 111, and in other embodiments, a plurality of fittings 21 are provided, and thus a plurality of fitting holes 111 are correspondingly provided, whereas in the present embodiment, the fitting 21 is in a long plate shape, and thus the fitting hole 111 is correspondingly provided as a long hole.
In order to increase the assembling stability of the assembly member 21, it is also possible to provide that a rib 112 is convexly configured at an opening of the assembly hole 111 near the center of the frame body 11, the rib 112 is used for positioning the assembly member 21, and secondly, a brazing groove 113 is provided at an opening of the assembly hole 111 far from the center of the frame body 11, and the brazing groove 113 is used for placing a soldering lug, thereby facilitating the brazing connection between the assembly member 21 and the frame body 11.
Embodiment 1 also discloses a process for manufacturing a package case of a semiconductor laser, as shown in fig. 3, including the following steps:
processing a pipe shell blank: stacking the frame body blank 10 and the bottom plate blank 20 with a soldering lug in between, then placing the frame body blank and the bottom plate blank into a clamp, wherein the clamp is preferably a clamp made of a No. 10 material, then sintering the frame body blank and the bottom plate blank in a tunnel furnace in a nitrogen-hydrogen protective atmosphere, and carrying out braze welding sintering at the sintering temperature of 775-795 ℃ and the furnace speed of 65mm/min to obtain a tube shell blank (see figure 4).
Processing a semi-finished product of the tube shell 1: the tube shell blank is lathed, and CNC forming processing can be adopted to manufacture a tube shell semi-finished product 1 (see figure 5).
In order to facilitate subsequent processing, a cleaning and drying step can be added, specifically, the semi-finished product 1 of the tube shell is placed into a tunnel furnace with the surface oil stain cleaned by ultrasonic waves, then the tunnel furnace is placed into a 600 ℃ nitrogen-hydrogen protective atmosphere tunnel furnace for 30min, and the furnace is cooled; after the cleaning is finished, the surface of the semi-finished product 1 of the tube shell can be pre-plated with nickel for 2 to 5 mu m.
And (3) processing the lead assembly 2: the lead wire 23 is passed through the insulator 22 to be pre-fitted into the through hole 210 of the fitting member 21, and then the fitting member 21 is fixed by a jig, preferably a graphite jig, in a tunnel furnace in a nitrogen-hydrogen atmosphere, and sintered and sealed at 985 ℃ at a furnace speed of 65mm/min to fix the lead wire 23 to the fitting member 21, thereby obtaining the lead wire assembly 2.
Processing a finished product of the pipe shell: and assembling the lead assembly 2 and the semi-finished product 1 of the tube shell, namely, pre-installing the assembly body on an assembling hole 111 on the frame body 11, putting the soldering lug into a brazing groove 113, putting the soldering lug into a clamp, wherein the clamp is preferably a No. 10 steel clamp, putting the soldering lug into a tunnel furnace in a nitrogen-hydrogen protective atmosphere for sintering, and performing brazing and sintering at 775-795 ℃ at the furnace speed of 65mm/min to obtain the finished product of the tube shell.
The implementation principle of the embodiment 1 is as follows: through setting up assembly part 21 to the seal of melting is fixed lead wire 23, it is as independent lead wire subassembly 2, need not to install lead wire 23 on framework 11 from the beginning, and then remove the restriction of the preceding machine tooling of framework 11, make framework 11 can braze and car processing with bottom plate 12 in the lump, greatly shortened whole process time, simultaneously, the pipe shell blank carries out integral type car processing, with the internal stress between better dissipation framework blank 10 and bottom plate blank 20 and the whole shape of being convenient for is maintained, and then greatly improved size precision.
Moreover, the frame body blank 10 and the bottom plate blank 20 have larger volumes, so that the frame body blank 10 and the bottom plate blank 20 have strong deformation resistance and better dimensional accuracy during brazing and sintering, and an accuracy condition is created for subsequent simultaneous turning of the frame body 11 and the bottom plate 12.
The assembly 21, the insulator 22, and the lead 23 are independent components, so that the scrapping of the insulator 22 due to the direct sintering of the insulator 22 by the frame 11 can be reduced, and the scrapping cost can be reduced.
Example 2
In the step of processing the lead assembly 2, a tooling piece and a clamping fixture 4 are also used, as shown in fig. 6 and 7, the tooling piece includes two half-and-half arranged clips 3, wherein a first protruding strip 31 is convexly configured on a side surface of one clip 3, a first groove 32 is formed in the other clip 3, the assembly of the two clips 3 is realized through the cooperation of the first protruding strip 31 and the first groove 32, clamping cavities 30 are formed on opposite surfaces of the two clips 3, the two clamping cavities 30 are respectively used for accommodating the first assembly piece 211 and the second assembly piece 212, and the clamping cavity 30 of the clip 3 corresponding to the first assembly piece 211 is only used for sliding the first assembly piece 211 along the width direction thereof, that is, the width of the clamping cavity 30 is greater than the width of the first assembly piece 211, and the clamping cavity 30 of the clip 3 corresponding to the second assembly piece 212 is only used for sliding the second assembly piece 212 along the length direction thereof, that is, the length of the clamping cavity 30 is greater than the length of the second assembly piece 212.
As shown in fig. 7, the clamping device 4 includes a base 41, the bottom portions of the two clamping pieces 3 are fixed with second protruding strips 33, the upper surface of the base 41 is provided with a slot (not shown) for inserting the second protruding strips 33, the base 41 is fixed with a clamping head 44, the two clamping heads 44 are arranged corresponding to one lead 23, and the clamping head 44 is used for clamping the end portion of the lead 23, so as to stabilize the position of the lead 23.
In the step of processing the lead assembly 2, the first assembling piece 211 and the second assembling piece 212 are respectively placed into the two clamping cavities 30, then the clip 3 is closed, at this time, the first elastic piece 214 of the first assembling piece 211 elastically abuts against the cavity walls of the clamping cavities 30, the second elastic piece 215 of the second assembling piece 212 elastically abuts against the cavity walls of the clamping cavities 30, the through hole 213 of the first assembling piece 211 and the through hole 213 of the second assembling piece 212 are arranged in a staggered manner, then the first assembling piece 211 and the second assembling piece 212 are pulled off, so that the through holes 213 of the first assembling piece 211 and the second assembling piece 212 are coaxial (the first elastic piece 214 and the second elastic piece 215 are in a compressed state), so as to place the square insulator 22 into the coaxial through holes 213 of the first assembling piece 211 and the second assembling piece 212, the square insulator 22 is used to limit the relative displacement of the first assembling piece 211 and the second assembling piece 212, at this time, as shown in fig. 9 and fig. 10, a first gap 216 is formed between a long side edge of the first assembling piece 211 and a corresponding cavity wall of the clamping cavity 30, and a corresponding gap 217 is formed between the second assembling piece 212 and a corresponding short side edge 217 of the clamping cavity 30.
The clip 3 is then mounted on the housing 41 by engaging the second protrusion 33 with the slot, and then the clip 44 is used to fix the end of the lead 23.
Then put the overall structure into the tunnel furnace to carry out the melt-sealing sintering, in this process, the insulator 22 is the melting form, it is softer, its spacing effect to first assembly piece 211 and second assembly piece 212 reduces, therefore first shell fragment 214 and second shell fragment 215 resume deformation, in order to force first assembly piece 211 to move a short distance along the width direction respectively, second assembly piece 212 moves a short distance along length direction, in order to shorten first clearance 216 and second clearance 217 respectively (see fig. 11), thereby carry out the shearing of a short distance to the insulator 22 of molten state, make the insulator 22 divide into two parts of dislocation, and two parts are located two perforation 213 respectively.
Therefore, the tortuosity of the through hole 210 is greatly increased, the difficulty of external moisture invading the inside of the tube shell is increased, and the contact area of the insulator 22 to the first assembly piece 211 and the second assembly piece 212 is increased, so that the installation stability of the lead 23 is improved. Third, the moving distances of the first assembly piece 211 and the second assembly piece 212 in the width direction and the length direction are equal, so that the size of the square through hole 210 is reduced in proportion, the insulator 22 is compressed, the gap between the insulator 22 and the through hole 210 is reduced, the hollow condition is reduced, and the sealing performance is further achieved.
Example 3
In embodiment 3, as shown in fig. 12, an arrangement is made in which a pivot lever 43 is fixed to a collet 44, a stay 42 is provided on a seat body 41, and the pivot lever 43 and the stay 42 are pivotally connected around the axis of the lead 23, in addition to embodiment 2.
The base body 41 is provided with a twisting component, and the twisting component is used for driving the chucks 44 at the two ends of the lead 23 to rotate reversely. Specifically, the twisting assembly includes a gear 51, a rack 52 and a linear driving element 53, wherein the gear 51 is fixed on the rotating rod 43, the rack 52 is slidably connected with the support plate 42 along the length direction thereof, the rack 52 is engaged with the plurality of gears 51 at the same time, the linear driving element 53 is used for driving the rack 52 to linearly reciprocate, and the linear driving element 53 may be an electric push rod or an air cylinder.
During the fusion sealing and sintering, the linear driving member 53 is started to drive the rotating rod 43 to rotate, the chucks 44 at the two ends of the same lead 23 rotate in opposite directions, so that the lead 23 is twisted, the surface roughness of the twisted lead 23 is large, and the combination degree of the lead 23 and the insulator 22 can be improved.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: equivalent changes in structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (10)
1. A packaging tube shell of a semiconductor laser is characterized in that: the lead wire structure comprises a frame body (11), a bottom plate (12), an assembly piece (21), a lead wire (23) and an insulator (22), wherein the bottom of the frame body (11) is connected with the bottom plate (12) in a brazing mode; the lead (23) is fixed on the assembly part (21) through an insulator (22) in a sintering way; the side surface of the frame body (11) is provided with an assembling hole (111) corresponding to the assembling part (21), and the assembling part (21) is fixedly connected with the frame body (11).
2. A package for a semiconductor laser as defined in claim 1, wherein: the assembly (21) is connected with the frame body (11) in a brazing mode.
3. A package for a semiconductor laser as claimed in claim 1 or 2, wherein: the shape of the assembly piece (21) is matched with that of the assembly hole (111), a brazing groove (113) is formed in the opening, far away from the center of the frame body (11), of the assembly hole (111), and the brazing groove (113) is used for placing soldering lugs; the orifice of the assembly hole (111) close to the center of the frame body (11) is convexly provided with a rib (112).
4. A package for a semiconductor laser as claimed in claim 1 wherein: the assembly part (21) is a long plate, a plurality of through holes (210) arranged at intervals along the length of the assembly part (21) are formed in the assembly part, the through holes (210) and the leads (23) are arranged in a one-to-one correspondence mode, and the assembly holes (111) are long holes.
5. A package for a semiconductor laser as claimed in claim 4 wherein: assembly member (21) include two edges first assembly piece (211) and second assembly piece (212) of direction superpose are seted up in pilot hole (111), perforation (213) have all been seted up in first assembly piece (211) and second assembly piece (212), first assembly piece (211) with second assembly piece (212) dislocation set, work as during perforation (213) of first assembly piece (211) and perforation (213) the disalignment of second assembly piece (212), perforation (213) of first assembly piece (211) and perforation (213) of second assembly piece (212) make up into through-hole (210).
6. A package for a semiconductor laser as claimed in claim 5, wherein: perforation (213) of first assembly piece (211) with perforation (213) of second assembly piece (212) are square hole, first assembly piece (211) with second assembly piece (212) are along first assembly piece (211) width direction dislocation set, second assembly piece (212) with first assembly piece (211) are along second assembly piece (212) length direction dislocation set, and along first assembly piece (211) width direction's dislocation distance and along second assembly piece (212) length direction's dislocation distance equal.
7. A processing technology of a packaging tube shell of a semiconductor laser is characterized in that: the method comprises the following steps:
processing a tube shell blank: stacking the frame body blank (10) and the bottom plate blank (20), and performing brazing and sintering to fix the frame body blank (10) on the bottom plate blank (20) to obtain a tube shell blank;
processing a semi-finished product (1) of the tube shell: machining the tube shell blank to obtain a tube shell semi-finished product (1);
processing the lead assembly (2): a lead wire (23) passes through the insulator (22) to be pre-installed in a through hole (210) on the assembly part (21), and then fusion sealing is carried out to fix the insulator (22) on the assembly part (21);
processing a finished product of the pipe shell: the assembly body is pre-installed on an assembling hole (111) on the frame body (11), and then brazing and sintering are carried out to obtain a finished product of the tube shell.
8. A process for fabricating a package for a semiconductor laser as defined in claim 7, wherein: in the step of processing the lead assembly (2), the assembly (21), the insulator (22) and the lead (23) are clamped and fixed by a graphite clamp during the fusion sealing and sintering.
9. A process for fabricating a package for a semiconductor laser as defined in claim 7, wherein: the assembly part (21) comprises a first assembly piece (211) and a second assembly piece (212) which are overlapped along the opening direction of the assembly hole (111), the first assembly piece (211) and the second assembly piece (212) are both provided with through holes (213), one long side edge of the first assembly piece (211) is provided with a first elastic sheet (214), and one short side edge of the second assembly piece (212) is provided with a second elastic sheet (215);
in the step of processing the lead assembly (2), the lead assembly (2) is fixed by using a tool and a clamping tool (4), the tool comprises two clamping pieces (3) which are arranged in half, a clamping cavity (30) for clamping a first assembling piece (211) and a second assembling piece (212) is formed between the two clamping pieces (3), the clamping cavity (30) of the clamping piece (3) corresponding to the first assembling piece (211) only allows the first assembling piece (211) to slide along the width direction of the clamping cavity, and the clamping cavity (30) of the clamping piece (3) corresponding to the second assembling piece (212) only allows the second assembling piece (212) to slide along the length direction of the clamping cavity; the clamping fixture comprises a clamping piece (3), a first assembling piece (211) and a second assembling piece (212) which are overlapped are fixed by the clamping piece (3), the first elastic piece (214) and the second elastic piece (215) are elastically abutted to the cavity wall of a clamping cavity (30), then the first assembling piece (211) and the second assembling piece (212) are forced to move, through holes (213) of the first assembling piece (211) and the second assembling piece (212) are coaxial, a square insulator (22) is placed into the coaxial through holes (213) of the first assembling piece (211) and the second assembling piece (212) at the same time, then the fixture is fixed on the clamping fixture (4), the clamping fixture (4) comprises a base body (41), and clamping heads (44) used for clamping two ends of a lead (23) are arranged on the base body (41).
10. A process for fabricating a package for a semiconductor laser as defined in claim 9, wherein: the chuck (44) is rotatably connected with the base body (41) around the axis of the lead (23), the base body (41) is provided with a twisting component, and the twisting component is used for driving two end parts of the lead (23) to rotate reversely.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310034943.5A CN115954757A (en) | 2023-01-10 | 2023-01-10 | Packaging tube shell of semiconductor laser and processing technology thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310034943.5A CN115954757A (en) | 2023-01-10 | 2023-01-10 | Packaging tube shell of semiconductor laser and processing technology thereof |
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| CN202310034943.5A Pending CN115954757A (en) | 2023-01-10 | 2023-01-10 | Packaging tube shell of semiconductor laser and processing technology thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116586881A (en) * | 2023-07-17 | 2023-08-15 | 武汉莱恩输变电设备股份有限公司 | Welding tool and welding method for high-voltage power transmission and transformation insulator |
| CN116810270A (en) * | 2023-08-02 | 2023-09-29 | 湖南迈克森伟电子科技有限公司 | Electronic fuze assembly coaxiality and height control tool and method |
| CN117422718A (en) * | 2023-12-19 | 2024-01-19 | 中江立江电子有限公司 | Insulator performance evaluation method, device, equipment and medium |
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2023
- 2023-01-10 CN CN202310034943.5A patent/CN115954757A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116586881A (en) * | 2023-07-17 | 2023-08-15 | 武汉莱恩输变电设备股份有限公司 | Welding tool and welding method for high-voltage power transmission and transformation insulator |
| CN116586881B (en) * | 2023-07-17 | 2023-09-29 | 武汉莱恩输变电设备股份有限公司 | Welding tool and welding method for high-voltage power transmission and transformation insulator |
| CN116810270A (en) * | 2023-08-02 | 2023-09-29 | 湖南迈克森伟电子科技有限公司 | Electronic fuze assembly coaxiality and height control tool and method |
| CN116810270B (en) * | 2023-08-02 | 2024-02-27 | 湖南迈克森伟电子科技有限公司 | Electronic fuze assembly coaxiality and height control tool and method |
| CN117422718A (en) * | 2023-12-19 | 2024-01-19 | 中江立江电子有限公司 | Insulator performance evaluation method, device, equipment and medium |
| CN117422718B (en) * | 2023-12-19 | 2024-04-16 | 中江立江电子有限公司 | Insulator performance evaluation method, device, equipment and medium |
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