CN115896761A - Selective area chemical plating process based on common plastic - Google Patents
Selective area chemical plating process based on common plastic Download PDFInfo
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- CN115896761A CN115896761A CN202211368155.1A CN202211368155A CN115896761A CN 115896761 A CN115896761 A CN 115896761A CN 202211368155 A CN202211368155 A CN 202211368155A CN 115896761 A CN115896761 A CN 115896761A
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- plating
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- 238000007747 plating Methods 0.000 title claims abstract description 77
- 239000000126 substance Substances 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 55
- 239000010949 copper Substances 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 23
- 238000003698 laser cutting Methods 0.000 claims abstract description 18
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052737 gold Inorganic materials 0.000 claims abstract description 17
- 239000010931 gold Substances 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 238000007788 roughening Methods 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 25
- 239000000243 solution Substances 0.000 claims description 22
- 238000005240 physical vapour deposition Methods 0.000 claims description 13
- 229910052763 palladium Inorganic materials 0.000 claims description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 9
- 238000007772 electroless plating Methods 0.000 claims description 9
- 239000011259 mixed solution Substances 0.000 claims description 9
- 230000004913 activation Effects 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 239000008139 complexing agent Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 238000005554 pickling Methods 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 abstract description 15
- 239000000463 material Substances 0.000 abstract description 7
- 238000001465 metallisation Methods 0.000 abstract description 5
- 230000001360 synchronised effect Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000037452 priming Effects 0.000 description 2
- ZBTDWLVGWJNPQM-UHFFFAOYSA-N [Ni].[Cu].[Au] Chemical compound [Ni].[Cu].[Au] ZBTDWLVGWJNPQM-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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Abstract
The invention relates to the technical field of chemical plating production of plastic materials, and particularly discloses a selective regional chemical plating process based on common plastic, which comprises the following steps: laser coarsening: coarsening the surface of the plastic through laser; vacuum plating: after coarsening, carrying out vacuum plating on the plastic to obtain a substrate metal layer; laser cutting: removing the unnecessary patterns by laser cutting to obtain a target pattern; electroless copper, nickel and gold plating: and carrying out chemical copper plating, nickel plating and gold plating on the cut product to obtain a metal layer with corresponding thickness. The process can be used for roughening the surfaces of various materials, has wider operation space relative to chemical roughening, enables the thickness of the substrate to be more uniform, and simultaneously can obtain synchronous metallization of patterns of non-connection regions without electrifying electroplating.
Description
Technical Field
The invention relates to the technical field of chemical plating production of plastic materials, in particular to a selective regional chemical plating process based on common plastic.
Background
At present, common plastic electroplating is mainly based on plastic full plating and cannot meet the requirement of selective multi-module electroplating of plastic, common special LDS plastic can meet the requirement of selective multi-module chemical plating, but the price of the plastic is high, and the performance of part of the plastic cannot meet the requirement.
In the prior art, the general plastic electroplating process mainly comprises the following steps (see fig. 1 and 2): 1. chemical coarsening: the method mainly comprises the steps of chemically corroding a plastic matrix by using coarsening liquid to form a pit structure, and 2, activating palladium: adsorbing active palladium on the surface of the plastic to enable the plastic to have the chemical plating capacity, 3, metallizing: chemically priming nickel to form a substrate nickel layer, and then electroplating copper and nickel to obtain a required plating layer; the main steps of the LDS plastic chemical plating include the following steps (see fig. 3 and 4): 1. injection molding: injection molding with modified plastic particles, 2, laser activation: irradiating the plastic surface by laser to form a circuit pattern, 3, metalizing the circuit: and performing metallization on the circuit pattern area to form a circuit.
However, in the prior art, all common plastic electroplating is mainly full-plating, and areas not required to be plated are plated after electroplating treatment, so that the electroplating requirements of specific patterns cannot be met, and in addition, part of plastic materials cannot be subjected to chemical roughening, and the LDS chemical plating process can obtain specific patterns, but the plastic is expensive and high in cost, and part of the plastic cannot be modified, so that the performance requirements cannot be met.
Disclosure of Invention
The invention aims to provide a selective area chemical plating process based on common plastic, and aims to solve the technical problems that the electroplating requirement of a specific pattern cannot be met, part of plastic cannot be modified, and the performance requirement cannot be met in the prior art.
In order to achieve the purpose, the selective area chemical plating process based on the common plastic adopted by the invention comprises the following steps:
laser coarsening: coarsening the surface of the plastic through laser;
vacuum plating: after coarsening, carrying out vacuum plating on the plastic to obtain a substrate metal layer;
laser cutting: removing the unnecessary patterns by laser cutting to obtain a target pattern;
electroless copper/nickel/gold plating: and carrying out chemical copper plating, nickel plating and gold plating on the cut product to obtain a metal layer with corresponding thickness.
In the laser coarsening step, the laser power is 8-12W, the speed is 2m/s, the frequency is 40-60 KHz, and the wavelength is 1064nm.
Wherein, in the step of vacuum plating, processing is carried out by Physical Vapor Deposition (PVD), and parameters of the PVD are as follows: the flow rate of argon gas is 200-300 ml/s, the power is 10-169w, the reciprocating times of Ni/Gr are 5 times, the reciprocating times of Cu are 9 times, and the running speed of the carrier plate is 2m/min.
In the step of laser cutting, the power of the laser cutting is 2-3W, the speed is 0.5m/s, the frequency is 40-60 KHz, and the wavelength is 355nm.
Wherein, in the step of electroless copper nickel gold, the following steps are included:
deoiling;
acid washing;
chemical copper plating;
a palladium activation step;
chemical nickel plating;
chemical gold plating;
and (5) drying.
Wherein in the oil removing step, the solution with the concentration of oil removing powder of 30-70 g/L is used for removing oil and soaking for 5-10 min at the temperature of 40-60 ℃; the step of acid washing uses H with the concentration of 3 to 5 percent 2 SO 4 Pickling the solution for 3-5 min at 30-50 deg.c; the step of electroless copper plating uses NaOH with the concentration of 3-4 g/L and HCHO with the concentration of 2-4 g/LCu of 2 to 3g/L concentration 2+ The solution and EDTA mixed solution with the concentration of 0.1-0.14 mol/L are plated with copper, and the mixed solution with the temperature of 30-50 ℃ is plated with copper for 4-6 h; the step of palladium activation uses Pd with the concentration of 15-25 ppm 2+ Solution and 3-5% by volume of H 2 SO 4 The mixed solution is reacted for 3 to 5min at the temperature of between 25 and 35 ℃; the step of chemical nickel plating uses Ni with the concentration of 5-6 g/L 2+ Solution, reacting at 78-82 deg.C for 10-25 min, and the Ni 2+ The pH value of the solution is 4.5-5; in the chemical gold plating step, au with the concentration of 0.2-0.5 g/L is used + The solution and the complexing agent with the concentration of 80-120 ml/L are mixed and react for 8-12 min under the condition of the temperature of 78-82 ℃; in the drying step, drying is carried out for 60-120 min under the environment of 70-80 ℃.
The selective area chemical plating process based on the common plastic has the beneficial effects that: the laser roughening method has the advantages that the laser roughening is used, various materials can be roughened, the operation space is wider than that of chemical roughening, PVD is used for replacing palladium activated priming nickel, the thickness of a substrate is more uniform, the binding force is better, newly-added laser cutting is achieved, required patterns can be obtained, common electroplating cannot be achieved, the chemical plating mode is more uniform in thickness, power-on electroplating is not needed, and synchronous metallization of patterns in non-connection areas can be obtained.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of the conventional plastic electroplating process in the prior art.
FIG. 2 is a flow chart of a conventional plastic electroplating process in the prior art.
FIG. 3 is a flow chart of the process steps of LDS plastic electroless plating in the prior art.
FIG. 4 is a flow chart of LDS plastic electroless plating in the prior art.
FIG. 5 is a flowchart of the steps of a conventional plastic-based selective area electroless plating process.
FIG. 6 is a flow chart of selective area electroless plating based on common plastic in accordance with the present invention.
FIG. 7 is a flowchart of the process steps for electroless copper/nickel/gold plating of the present invention.
Detailed Description
Referring to fig. 5 to 7, the present invention provides a selective area chemical plating process based on general plastic, which includes the following steps:
s1: laser coarsening: coarsening the surface of the plastic through laser;
s2: vacuum plating: after coarsening, carrying out vacuum plating on the plastic to obtain a substrate metal layer;
s3: laser cutting: removing the unnecessary patterns by laser cutting to obtain a target pattern;
s4: electroless copper, nickel and gold plating: and carrying out chemical copper plating, nickel plating and gold plating on the cut product to obtain a metal layer with corresponding thickness.
Through using laser to carry out the alligatoring to the plastic for multiple material all can carry out the surface alligatoring, and is wider than chemical alligatoring operating space, uses PVD to replace palladium activated bottoming nickel, and basement thickness is more even, and the cohesion is better, newly-increased laser cutting, can obtain required pattern, and ordinary electroplating can't realize, and the mode thickness of chemical plating is more even, does not need the circular telegram electroplating, and can obtain the synchronous metallization of non-connection zone pattern.
In the laser coarsening step, the power of laser is 8-12W, the speed is 2m/s, the frequency is 40-60 KHz, and the wavelength is 1064nm.
In the step of vacuum plating, processing is carried out by Physical Vapor Deposition (PVD), and parameters of the PVD are as follows: the flow rate of argon gas is 200-300 ml/s, the power is 10-169w, the reciprocating times of Ni/Gr are 5 times, the reciprocating times of Cu are 9 times, and the running speed of the carrier plate is 2m/min.
In the step of laser cutting, the power of the laser cutting is 2-3W, the speed is 0.5m/s, the frequency is 40-60 KHz, and the wavelength is 355nm.
The step of electroless copper, nickel and gold plating comprises the following steps:
s41: oil removal;
s42: acid washing;
s43: chemical copper plating;
s44: a palladium activation step;
s45: chemical nickel plating;
s46: chemical gold plating;
s57: and (5) drying.
In the oil removing step, the solution with the concentration of oil removing powder of 30-70 g/L is used for removing oil and soaking for 5-10 min at the temperature of 40-60 ℃; the acid washing step uses H with the concentration of 3-5 percent 2 SO 4 Pickling the solution for 3-5 min at 30-50 deg.c; the step of electroless copper plating comprises using NaOH with the concentration of 3-4 g/L, HCHO with the concentration of 2-4 g/L and Cu with the concentration of 2-3 g/L 2+ The solution and EDTA mixed solution with the concentration of 0.1-0.14 mol/L are plated with copper, and the mixed solution with the temperature of 30-50 ℃ is plated with copper for 4-6 h; the step of palladium activation uses Pd with the concentration of 15-25 ppm 2+ Solution and 3-5% by volume of H 2 SO 4 The mixed solution is reacted for 3 to 5min at the temperature of between 25 and 35 ℃; the step of chemical nickel plating uses Ni with the concentration of 5-6 g/L 2+ Solution, reacting at 78-82 deg.C for 10-25 min, and the Ni 2+ The pH value of the solution is 4.5-5; in the chemical gold plating step, au with the concentration of 0.2-0.5 g/L is used + The solution and the complexing agent with the concentration of 80-120 ml/L are mixed and react for 8-12 min under the condition of the temperature of 78-82 ℃; in the drying step, drying is carried out for 60-120 min under the environment with the temperature of 70-80 ℃.
The invention relates to a selective area chemical plating process based on common plastic, which adds laser coarsening, PVD, laser cutting and chemical plating compared with the common plastic plating process, wherein laser can decompose the surface of the plastic, so that the plastic with extremely strong hydrophobicity is irradiated by specific laser, part of the plastic is removed, the surface becomes rough, a base metal layer is obtained on a base material through vacuum plating and is used for subsequent chemical plating, the metal layer without the base of the pattern is removed through the laser to obtain a required pattern, a non-connection area can be plated with the metal layer by using a chemical plating mode, the surface can be coarsened by using the laser coarsening, the operation space is wider than that of the chemical coarsening, PVD is used for replacing base nickel activated by palladium, the thickness of the base is more uniform, the bonding force is better, the laser cutting is newly added, the required pattern can be obtained, the common plating can not be realized, the thickness of the chemical plating mode is more uniform, the power-on plating is not needed, and the synchronous metallization of the pattern of the non-connection area can be obtained.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. A selective area chemical plating process based on common plastic is characterized by comprising the following steps:
laser coarsening: roughening the surface of the plastic through laser;
vacuum plating: after coarsening, carrying out vacuum plating on the plastic to obtain a substrate metal layer;
laser cutting: removing the unnecessary patterns by laser cutting to obtain a target pattern;
electroless copper, nickel and gold plating: and carrying out chemical copper plating, nickel plating and gold plating on the cut product to obtain a metal layer with corresponding thickness.
2. The process of claim 1, wherein the step of selectively electroless plating is performed on the plastic,
in the laser coarsening step, the laser power is 8-12W, the speed is 2m/s, the frequency is 40-60 KHz, and the wavelength is 1064nm.
3. The common plastic-based selective area electroless plating process of claim 2,
in the step of vacuum plating, processing is carried out by Physical Vapor Deposition (PVD), and parameters of the PVD are as follows: the flow rate of argon gas is 200-300 ml/s, the power is 10-169w, the reciprocating times of Ni/Gr are 5 times, the reciprocating times of Cu are 9 times, and the running speed of the carrier plate is 2m/min.
4. The process of claim 3, wherein the step of selectively electroless plating is performed on the plastic,
in the step of laser cutting, the power of the laser cutting is 2-3W, the speed is 0.5m/s, the frequency is 40-60 KHz, and the wavelength is 355nm.
5. The process of claim 4, wherein the step of selectively electroless plating is performed on the plastic,
the step of electroless copper, nickel and gold plating comprises the following steps:
deoiling;
acid washing;
chemical copper plating;
a palladium activation step;
chemical nickel plating;
chemical gold plating;
and (5) drying.
6. The common plastic selective area electroless plating process of claim 5,
in the oil removing step, the solution with the concentration of oil removing powder of 30-70 g/L is used for oil removing and soaking for 5-10 min at the temperature of 40-60 ℃; the acid washing step uses H with the concentration of 3-5 percent 2 SO 4 Pickling the solution for 3-5 min at 30-50 deg.c; the step of electroless copper plating uses NaOH with the concentration of 3-4 g/L,HCHO with concentration of 2-4 g/L and Cu with concentration of 2-3 g/L 2+ The solution and EDTA mixed solution with the concentration of 0.1-0.14 mol/L are plated with copper, and the mixed solution with the temperature of 30-50 ℃ is plated with copper for 4-6 h; the step of palladium activation uses Pd with the concentration of 15-25 ppm 2+ Solution and 3-5% by volume of H 2 SO 4 The mixed solution is reacted for 3 to 5min at the temperature of between 25 and 35 ℃; the step of chemical nickel plating uses Ni with the concentration of 5-6 g/L 2+ Solution, reacting at 78-82 deg.C for 10-25 min, and the Ni 2+ The pH value of the solution is 4.5-5; in the chemical gold plating step, au with the concentration of 0.2-0.5 g/L is used + The solution and the complexing agent with the concentration of 80-120 ml/L are mixed and react for 8-12 min under the condition of the temperature of 78-82 ℃; in the drying step, drying is carried out for 60-120 min under the environment with the temperature of 70-80 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211368155.1A CN115896761A (en) | 2022-11-03 | 2022-11-03 | Selective area chemical plating process based on common plastic |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211368155.1A CN115896761A (en) | 2022-11-03 | 2022-11-03 | Selective area chemical plating process based on common plastic |
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| CN115896761A true CN115896761A (en) | 2023-04-04 |
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| CN202211368155.1A Pending CN115896761A (en) | 2022-11-03 | 2022-11-03 | Selective area chemical plating process based on common plastic |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120107522A1 (en) * | 2009-07-10 | 2012-05-03 | Sankyo Kasei Co., Ltd. | Method for producing formed circuit component |
| CN112725796A (en) * | 2020-12-17 | 2021-04-30 | 广东博迅通信技术有限公司 | Process for improving compactness of selective metallization coating on surface of common plastic and improving coating preparation efficiency |
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- 2022-11-03 CN CN202211368155.1A patent/CN115896761A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120107522A1 (en) * | 2009-07-10 | 2012-05-03 | Sankyo Kasei Co., Ltd. | Method for producing formed circuit component |
| CN112725796A (en) * | 2020-12-17 | 2021-04-30 | 广东博迅通信技术有限公司 | Process for improving compactness of selective metallization coating on surface of common plastic and improving coating preparation efficiency |
Non-Patent Citations (1)
| Title |
|---|
| 赵时璐: "高性能刀具及涂层刀具材料的切削性能", 31 May 2015, 冶金工业出版社, pages: 133 * |
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