CN115852370A - TCO (transparent conductive oxide) coated carrier plate and method for cleaning TCO film layer on carrier plate - Google Patents
TCO (transparent conductive oxide) coated carrier plate and method for cleaning TCO film layer on carrier plate Download PDFInfo
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- CN115852370A CN115852370A CN202111123923.2A CN202111123923A CN115852370A CN 115852370 A CN115852370 A CN 115852370A CN 202111123923 A CN202111123923 A CN 202111123923A CN 115852370 A CN115852370 A CN 115852370A
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Abstract
The invention discloses a TCO (transparent conductive oxide) coated carrier plate and a method for cleaning a TCO film on the carrier plate, and relates to the technical field of solar cell production. The invention provides a TCO film-coating carrier plate, which comprises a support plate, wherein the support plate is provided with at least one mounting groove; the mounting groove is used for bearing a piece to be coated with a film, at least the inner surface of the mounting groove and the surface of the mounting groove of the support plate are attached with sacrificial layers, at least the surface part of each sacrificial layer can be corroded by alkaline solution, and the support plate and the TCO film layer can be kept in the original state in the alkaline solution.
Description
Technical Field
The invention relates to the technical field of solar cell production, in particular to a TCO (transparent conductive oxide) coated carrier plate and a method for cleaning a TCO film on the carrier plate.
Background
In the prior art, a carrier plate bearing a silicon wafer is placed in a TCO film layer cavity so as to carry out TCO film layer on the silicon wafer, and meanwhile, the carrier plate is also coated with the TCO film layer. After multiple uses, the TCO film layer on the carrier plate needs to be removed. Existing removal methods include high pressure water flushing, physical sand blasting, chemical acid washing, or any combination of the above.
The TCO film layer is removed by utilizing high-pressure water washing and physical sand blasting, so that the carrier plate (particularly the support plate) is abraded and even deformed, the subsequent shaping process is increased, and the service life of the carrier plate (particularly the support plate) is shortened; moreover, the TCO powder subjected to sand blasting contains a lot of sand blasting impurities such as carborundum and the like, so that subsequent TCO powder recovery is not facilitated; and when the support plate is made of the support plate made of graphite, carbon fiber or carbon composite material, the support plate is not suitable for high-pressure water washing or physical sand blasting treatment.
In the chemical pickling treatment, the TCO film layer is generally corroded by dilute acid or weak acid solution, the required treatment time is short, the consumed time is long, the using amount of the acid solution is large, the cost for treating the waste acid solution is high, and the acid solution can corrode the metal carrier plate, so that the service life of the carrier plate is shortened.
Disclosure of Invention
The invention aims to provide a TCO (transparent conductive oxide) coated carrier plate and a method for removing a TCO film on the carrier plate, wherein the TCO coated carrier plate is low in use cost.
In a first aspect, the invention provides a TCO coated carrier plate, which includes a support plate, where the support plate has at least one mounting groove, the mounting groove is used to support a to-be-coated member, at least the inner surface of the mounting groove and the surface of the mounting groove of the support plate are attached with a sacrificial layer, at least the surface of the sacrificial layer can be corroded by an alkaline solution, and the support plate and the TCO film can be kept in the alkaline solution.
Through the technical scheme, after the carrier plate bears the piece to be coated with the film to be coated for TCO coating, TCO film layers are attached to the surface of the sacrificial layer of the supporting plate and the surface of the mounting frame, however, the contact part of the mounting groove and the piece to be coated with the film is not covered by the TCO film layers, and the sacrificial layer is exposed. When the TCO film layer needs to be removed, the support plate can be soaked in alkaline solution, the TCO film layer and the support plate can be kept in the original state in the alkaline solution and are not corroded by the alkaline solution, the exposed sacrificial layer in the installation groove is corroded by the alkaline solution at first, then, the sacrificial layer covered by the TCO film layer is corroded gradually, and the TCO film layer is separated from the support plate gradually. Thereby removing the TCO film layer from the support plate. Wherein, the surface part of the sacrificial layer can be corroded by alkaline solution in one-time soaking, and the TCO film layer attached to the surface of the sacrificial layer is gradually separated from the support plate; or, the sacrificial layer can be completely corroded by the alkaline solution in one soaking, and the TCO film layer attached to the surface of the sacrificial layer is gradually separated from the support plate. Obviously, the support plate is hardly damaged by the alkaline solution or by other mechanical wear during the removal of the TCO film, thereby avoiding a reduction in the service life of the support plate and the need for frequent replacement of the support plate. Therefore, compared with the situation that the supporting plate is corroded by an acid solution, washed by high-pressure water or abraded by sand blasting in the prior art, the TCO coating carrier plate provided by the application has the advantage of low use cost.
In one possible implementation, the sacrificial layer may be a metal material or a non-metal material that can be corroded by the alkaline solution and is suitable for being attached to the support plate, for example, the material of the sacrificial layer may be any one of Al, zn, sn, pb, si and B, or an oxide of any one of Al, zn, sn, pb, si and B, or an alloy mainly containing any one of Al, zn, sn and Pb, or an oxide of any combination of Al, zn, sn, pb, si and B, orCombinations of the above. Such as: al (Al) 2 O 3 、ZnO、SnO 2 、SiO 2 、Zn x Al (1-x) O, etc.
In a possible embodiment, the sacrificial layer may comprise a bulk layer and a surface layer that can be etched by an alkaline solution, the surface layer being located on a side remote from the support plate. In one-time soaking and cleaning, the surface layer can be firstly corroded by alkaline solution, the TCO film layer attached to the surface of the sacrificial layer is gradually separated from the supporting plate, the body layer still exists, and the carrier plate can be continuously used for TCO film coating process. Alternatively, the sacrificial layer may be a single layer, that is, only includes the bulk layer or the surface layer, and the sacrificial layer may be completely etched away by the alkaline solution in one immersion, and the TCO film layer attached to the surface of the sacrificial layer gradually detaches from the supporting plate.
In one example, the material of the body layer and the surface layer may be the same or different. The material of the body layer can be Al2O3, znO, sn2O3, siO2 or ZnxAl (1-x) O; the material of the surface layer can be Al2O3, znO, sn2O3, siO2 or ZnxAl (1-x) O.
In one possible embodiment, the thickness of the sacrificial layer needs to be selected according to the material of the sacrificial layer and the number of times of use. For example, the thickness of the sacrificial layer may be 0.1-20 microns.
In one possible embodiment, the material of the supporting plate may be one of graphite, carbon fiber, carbon composite, stainless steel, titanium and titanium alloy, which are not corroded by the alkaline solution.
In one possible embodiment, the supporting plate is provided with a first surface and a second surface which are opposite, the mounting groove penetrates through the first surface and the second surface, a raised bearing table is formed on the inner wall of the mounting groove and used for bearing a piece to be coated, and sacrificial layers are attached to the first surface and the second surface; by adopting the technical scheme, after the piece to be coated is placed on the bearing table, two opposite surfaces of the piece to be coated are exposed, and two opposite surfaces of the piece to be coated can be coated simultaneously. Or the mounting groove is positioned on the first surface or the second surface and is used for bearing the piece to be coated. Under the condition of adopting the technical scheme, after the piece to be coated is placed on the bearing table, one surface of the piece to be coated is exposed, and one surface of the piece to be coated is coated.
In a possible implementation manner, the TCO coated carrier further includes a mounting bracket for mounting a support plate, a sacrificial layer is attached to the surface of the mounting bracket at least on the side where the mounting groove is located, and the mounting bracket can be kept in an alkaline solution. Under the condition of adopting the technical scheme, after the carrier plate bears the piece to be coated with the film and carries out TCO film coating, TCO film layers are attached to the sacrificial layer on the supporting plate and the sacrificial layer on the mounting frame, the contact part of the mounting frame and the supporting plate is not covered by the TCO film layers, and the sacrificial layer is exposed. When the TCO rete on the support plate needs to be cleaned, the support plate can be detached from the mounting frame, then the mounting frame is soaked in alkaline solution, the TCO rete and the mounting frame can be kept in the original state in the alkaline solution, the exposed sacrificial layer on the mounting frame is firstly corroded by the alkaline solution, the sacrificial layer covered by the TCO rete is gradually corroded by the alkaline solution, and the TCO rete is separated from the mounting frame, so that the TCO rete on the mounting frame is removed. Obviously, in the process of removing the TCO film layer, the mounting frame is not damaged basically, so that the service life of the mounting frame is prevented from being shortened, and the mounting frame needing to be replaced frequently is prevented. Therefore, compared with the situation that the mounting frame is corroded by an acid solution or is washed by high-pressure water and abraded by sand blasting in the prior art, the TCO coating carrier plate provided by the application has the advantage of low use cost. Wherein the sacrificial layer on the mounting frame may be the same as the sacrificial layer on the support plate.
In a second aspect, the present invention provides a method for cleaning a TCO film on a carrier plate, for cleaning the TCO coated carrier plate provided in the first aspect, where the TCO film is attached to a sacrificial layer, and the specific cleaning steps include:
and soaking the support plate in an alkaline solution to corrode the sacrificial layer, and separating the TCO film layer from the support plate to obtain the first cleaning plate. The alkaline solution firstly corrodes the exposed sacrificial layer or the surface of the sacrificial layer of the mounting groove, and then gradually corrodes the surface of the sacrificial layer or the surface of the sacrificial layer between the TCO film layer and the support plate body, so that the TCO film layer is separated from the support plate, and the TCO film layer is cleaned from the support plate.
In one example, after soaking the support plate in an alkaline solution, the sacrificial layer is etched entirely to release the TCO film layer from the support plate, obtaining a first cleaning plate.
In one example, when the sacrificial layer includes the body layer and the sacrificial layer, after the support plate is immersed in an alkaline solution, the surface layer is etched to separate the TCO film layer from the support plate, and the first cleaning plate is obtained.
In a possible implementation manner, the method for cleaning the TCO film on the carrier further includes the steps of: after the first cleaning plate is obtained, cleaning the first cleaning plate by using a weak acidic solution for 1-30 minutes, and removing residual alkali on the surface of the support plate to obtain a second cleaning plate;
and cleaning the second cleaning plate by using clear water, and removing the residual weak acid solution on the surface of the supporting plate to obtain a clean third cleaning plate.
In one example, to clean the second cleaning plate, the second cleaning plate can be cleaned at least twice with clean water, each time for 1-10 minutes, and the pH value of the clean water after each cleaning is between 5-8.
In one possible embodiment, the alkaline solution may be a strong alkaline solution containing NaOH and/or KOH, the concentration of the strong alkaline solution being between 1% and 50%; the sacrificial layer is quickly and thoroughly corroded by the strong alkaline solution. The weak acidic solution is acetic acid, oxalic acid, carbonic acid, phosphoric acid, sulfurous acid, silicic acid, hydrogen sulfide, formic acid, thiocyanic acid, phenol or citric acid, and the concentration of the weak acidic solution can be less than or equal to 10%. The low-concentration weak acid solution can neutralize the residual strong alkaline solution on the surface of the support plate, simultaneously reduces the residual acid amount on the surface of the support plate, reduces the subsequent clear water cleaning procedures, is safer to people, and improves the process safety.
In a possible implementation manner, the method for cleaning the TCO film on the carrier further includes: and when the support plate to be cleaned is soaked in an alkaline solution, ultrasonic cleaning is assisted.
The method for cleaning the TCO film layer on the carrier plate further comprises the following steps: when the sacrificial layer is attached to each position of the outer surface of the mounting frame, the mounting frame is soaked in alkaline solution for 1-300 minutes.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a top view of a TCO coated carrier according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of a support plate of a TCO coated carrier plate according to an embodiment of the present invention, where the cross-sectional position avoids a mounting groove;
fig. 3 is a cross-sectional view of a support plate of another TCO coated support plate according to an embodiment of the present invention, where the cross-sectional position is free from a mounting groove;
FIG. 4 is a cross-sectional view of a mounting groove with a member to be coated positioned in the mounting groove;
FIG. 5 is a cross-sectional view of the mounting groove when the member to be coated is positioned in another mounting groove.
Reference numerals:
the method comprises the following steps of 1-mounting frame, 2-supporting plate, 21-mounting groove, 3-part to be coated, 4-sacrificial layer, 41-body layer, 42-surface layer and 5-TCO film layer.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In a first aspect, the present invention provides a TCO coated carrier plate, as shown in fig. 1 to 3, the carrier plate includes a support plate 2, the support plate 2 has at least one mounting groove 21, the mounting groove 21 is used for supporting a member to be coated 3, at least the inner surface of the mounting groove 21 and the surface of the support plate 2 where the mounting groove 21 is located are attached with a sacrificial layer 4, at least the surface portion of the sacrificial layer 4 can be corroded by an alkaline solution, and the support plate 2 and the TCO film 5 can be kept in an original state in the alkaline solution.
Through the technical scheme, after the supporting plate 2 bears the piece to be coated with the film 3 and the TCO film is coated, the TCO film layers 5 are attached to the surface of the sacrificial layer 4 of the supporting plate 2 and the surface of the mounting frame 1, however, the contact part of the mounting groove 21 and the piece to be coated with the film 3 is not covered by the TCO film layers 5, and the sacrificial layer 4 is exposed. When the TCO film 5 needs to be removed, the support plate 2 may be soaked in an alkaline solution, both the TCO film 5 and the support plate 2 can be kept in the alkaline solution without being corroded by the alkaline solution, the sacrificial layer 4 exposed in the mounting groove 21 is firstly corroded by the alkaline solution, then the sacrificial layer 4 covered by the TCO film 5 is gradually corroded, the TCO film 5 is gradually separated from the support plate 2, and the TCO film 5 is removed from the support plate 2. Wherein, the surface part of the sacrificial layer 4 can be corroded by alkaline solution in one-time soaking, and the TCO film layer 5 attached to the surface of the sacrificial layer 4 is gradually separated from the support plate 2; alternatively, the sacrificial layer 4 may be completely etched away by the alkaline solution in one immersion, and the TCO film layer 5 attached to the surface of the sacrificial layer 4 is gradually separated from the support plate 2. It is clear that during the removal of the TCO film 5 the support plate 2 is hardly damaged by the alkaline solution or by other mechanical wear, thereby avoiding a reduction in the service life of the support plate 2 and the need to frequently replace the support plate 2 with a new one. Therefore, compared with the situation that the supporting plate 2 is corroded by an acid solution, washed by high-pressure water or abraded by sand blasting in the prior art, the TCO coating carrier plate provided by the application has the advantage of low use cost.
In addition, as the TCO film layer 5 does not react with the alkaline solution, after the TCO film layer 5 is separated from the support plate 2, TCO waste residue in the alkaline solution can be recovered in a filtering mode, and almost pollution-free TCO waste residue is obtained, so that the subsequent recycling is facilitated. Therefore, compared with the prior art, the supporting plate 2 is corroded by acid solution, washed by high pressure water or abraded by sand blasting, the TCO film coating carrier plate provided by the application also has the advantages of less impurities in the obtained TCO waste residue and low cost in the recovery of the TCO waste residue. Moreover, the filtered alkaline solution can be reused to corrode the sacrificial layer 4 on the next carrier plate, so that the consumption of the alkaline solution is reduced.
After a carrier plate is coated for multiple times and multiple TCO film layers 5 are accumulated on the surface of the supporting plate 2, the carrier plate is cleaned once by using alkaline solution, so that the cleaning times can be reduced, and the using amount of the alkaline solution can be reduced. In practical production, the thickness of the multilayer TCO film 5 accumulated on the support plate 2 is much larger than that of the sacrificial layer 4, and thus the amount of the acidic solution required for cleaning the multilayer TCO film 5 accumulated on the support plate 2 with the acidic cleaning solution is inevitably larger than the amount of the alkaline solution required for cleaning the sacrificial layer 4. Therefore, when the TCO film layer 5 carrier plate provided by the application is cleaned by using an alkaline solution, the amount of the generated waste alkaline solution is small, and the required waste liquid treatment cost is correspondingly low.
In one possible implementation, the sacrificial layer 4 may be a metal material, a non-metal material or an oxide that can be corroded by an alkaline solution and is suitable for being attached to the support plate 2. For example, the material of the sacrificial layer 4 is any one of Al, zn, sn, pb, si, and B, or an oxide of any one of Al, zn, sn, pb, si, and B, or an alloy mainly containing any one of Al, zn, sn, and Pb, or an oxide of any combination of Al, zn, sn, pb, and Si, or any combination of these. For example, it may be an aluminum alloy, a zinc alloy, an aluminum tin alloy, or an aluminum silicon alloy; may be Al 2 O 3 、ZnO、SiO 2 、ZnxAl(1-x)O、B 2 O 3 、Zn x Sn (1-X) O、Si x Al (1-X) O 2 、SnO 2 One of them. The term "arbitrary combination of the above-mentioned substances" means an arbitrary combination of the above-mentioned monomer materials, alloys, oxides and combined oxides.
In an example, when the sacrificial layer 4 is made of a metal or a non-metal, according to the requirement of the TCO coating process, the surface of the sacrificial layer 4 may be oxidized, so that the surface of the sacrificial layer 4 is made of an oxide, or the entire sacrificial layer 4 is oxidized, so that the entire sacrificial layer 4 is made of an oxide.
In a possible embodiment, the sacrificial layer 4 may comprise a bulk layer 41 and a surface layer 42 that can be etched by an alkaline solution, the surface layer 42 being located on the side remote from the support plate 2. In one immersion cleaning, the surface layer 42 may be first etched away by the alkaline solution, the TCO film layer 5 attached to the surface of the sacrificial layer 4 gradually detaches from the support plate 2, the body layer 41 still exists, and the support plate 2 may be used in the TCO plating process. In one example, the thickness of body layer 41 can be 0.1-10 microns, e.g., 1 micron, 2 microns, 3 microns, 5 microns, 6 microns, 8 microns, etc.; the surface layer 42 can have a thickness of 0.1-10 microns, e.g., 1 micron, 2 microns, 3 microns, 5 microns, 6 microns, 8 microns, etc.
Alternatively, the sacrificial layer 4 may be a single layer, that is, only the bulk layer 41 or the surface layer 42 is included, the sacrificial layer 4 may be completely etched away by the alkaline solution in one immersion, and the TCO film layer 5 attached to the surface of the sacrificial layer 4 is gradually detached from the support plate 2.
In one example, the material of the body layer 41 and the surface layer 42 may be the same or different. The material of the body layer 41 can be Al2O3, znO, sn2O3, siO2 or ZnxAl (1-x) O; the surface layer 42 may be made of Al2O3, znO, sn2O3, siO2, or ZnxAl (1-x) O.
In a possible implementation, the thickness of the sacrificial layer 4 needs to be selected according to the material of the sacrificial layer 4 and the number of cleanings. Under the condition of being capable of isolating the surface of the support plate 2 from the TCO film layer 5, when all the sacrificial layers 4 on the surface of the support plate 2 are planned to be corroded in one-time cleaning, the thickness of the sacrificial layers 4 can be selected to be as small as possible, so that the consumption of alkaline solution for corroding the sacrificial layers 4 is reduced, and the cost for treating waste alkaline solution is reduced; when the surface layer 42 is stacked on the body layer 41, the thickness of both the body layer 41 and the surface layer 42 can be thicker, and only the surface layer 42 is etched in one cleaning, so that the number of times of using the sacrificial layer 4 can be increased. For example, the thickness of the sacrificial layer 4 may be 0.1 to 20 microns, and the thickness of the sacrificial layer 4 per etch may be 0.1 to 10 microns.
Wherein the sacrificial layer 4 can be attached to the support plate 2 by means of electroplating, coating, spraying, printing, CBD (chemical water bath deposition), CVD (chemical water bath deposition), PVD (physical vapour deposition) or VAD (vacuum arc).
In one possible embodiment, the material of the supporting plate 2 may be one of graphite, carbon fiber, carbon composite, stainless steel, titanium and titanium alloy, which are not corroded by alkaline solution.
In a possible embodiment, referring to fig. 3, the supporting plate 2 has a first surface and a second surface opposite to each other, the mounting groove 21 penetrates through the first surface and the second surface, a raised bearing platform is formed on the inner wall of the mounting groove 21, the bearing platform is used for bearing the piece 3 to be coated, and the first surface and the second surface are both attached with the sacrificial layer 4. Under the condition of adopting the technical scheme, after the piece 3 to be coated is placed on the bearing table, two opposite surfaces of the piece 3 to be coated are exposed, and two opposite surfaces of the piece 3 to be coated can be coated simultaneously. The joint position of the bearing platform and the piece 3 to be coated is not covered by the TCO film layer 5, the sacrificial layer 4 at the joint position is exposed, when the bearing platform is soaked in alkaline solution, the alkaline solution firstly corrodes the sacrificial layer 4 at the joint position, and the TCO film layer 5 is gradually separated from the support plate 2 along with the corrosion of the sacrificial layer 4. Here, in the case of the scheme in which the mounting groove 21 penetrates the support plate 2, the support plate 2 needs to be made of a material having a high mechanical strength, such as stainless steel.
In another possible embodiment, the mounting groove 21 is located on the first surface or on the second surface, and the mounting groove 21 is used for bearing the member to be coated 3. That is, the mounting groove 21 may also have a groove bottom, and the film-coating member 3 is stacked on the groove bottom, so that only the surface of the film-coating member 3 far from the groove bottom can be coated in the TCO film-coating chamber.
In one possible implementation, the TCO coated carrier plate may be monolithic, i.e. formed by one monolithic support plate 2; the TCO coated carrier plate may also be assembled, that is, the TCO coated carrier plate may further include a mounting frame 1, the support plates 2 are mounted on the mounting frame 1, and one or more support plates 2 may be mounted on one mounting frame 1.
As shown in fig. 1, the mounting frame 1 may be a planar frame, and the support plate 2 is placed in the planar frame. The mounting rack 1 can be made of a solid rod material, can also be made of a hollow pipe material, or is made of a rod body obtained by bending a plate material, or the solid rod material, the hollow pipe material and the rod body obtained by bending are all used. The mounting rack 1 can be formed by splicing a plurality of parts, and can also be obtained by hollowing and cutting a whole material. As shown in fig. 1 and 2, the support plate 2 may be a flat plate on which at least one mounting groove 21 is formed.
In a possible embodiment, since the TCO film 5 is also attached to the surface of the mounting frame 1 after the carrier plate carries the to-be-coated member 3 for TCO coating, the sacrificial layer 4 is attached to the surface of the mounting frame 1 on the side where at least the mounting groove 21 is located. In one example, the surface of the mount 1 on the side of the mount groove 21 is attached with a sacrificial layer 4. In another example, the outer surface of the mounting 1 is everywhere attached with a sacrificial layer 4. Specifically, when the mounting groove 21 is only located on the first surface or the second surface of the support plate 2, the sacrificial layer 4 may be attached to the surface of the mounting bracket 1 on the side where the mounting groove 21 is located; when the mounting groove 21 penetrates the first surface and the second surface of the support plate 2, the sacrificial layer 4 is attached to the outer surface of the mounting bracket 1 at all positions.
Under the condition of adopting the technical scheme, after the carrier plate bears the piece to be coated with the film 3 and carries out TCO film coating, TCO film layers 5 are attached to the surfaces of the sacrificial layer 4 on the supporting plate 2 and the sacrificial layer 4 on the mounting frame 1, the contact part of the mounting frame 1 and the supporting plate 2 is not covered by the TCO film layers 5, and the sacrificial layer 4 is exposed. When TCO rete 5 on the support plate needs to be cleaned, can dismantle backup pad 2 from mounting bracket 1, then all soak mounting bracket 1 and backup pad 2 in alkaline solution, TCO rete 5 and mounting bracket 1 all can be in the original state of keeping in alkaline solution, exposed sacrificial layer 4 then is corroded by alkaline solution at first on the mounting bracket 1, sacrificial layer 4 along with being covered by TCO rete 5 is corroded by alkaline solution gradually, TCO rete 5 breaks away from with mounting bracket 1 to TCO rete 5 on the mounting bracket 1 is got rid of. Obviously, the mount 1 is not substantially damaged during the removal of the TCO film 5, thereby avoiding a reduction in the lifetime of the mount 1 and avoiding the need to frequently replace the mount 1 with a new one. Therefore, compared with the prior art that the mounting frame 1 is corroded by an acid solution or abraded by sandblasting, the TCO coated carrier plate provided by the application has the advantage of low use cost. Wherein the sacrificial layer 4 on the mounting frame 1 may be the same as or different from the sacrificial layer 4 on the support plate 2.
Generally, the mounting bracket 1 has a greater structural strength and is thicker than the support plate 2, and the service life thereof is longer than that of the support plate 2 even if the cleaning method in the prior art is adopted. Thus, the mount 1 may also be free of the sacrificial layer 4. At this time, the mount 1 and the support plate 2 may be disassembled, the TCO film 5 on the mount 1 may be cleaned or removed using a method in the related art, and the TCO film 5 on the support plate 2 may be removed using an alkaline solution.
In one example, the material of the mounting bracket 1 may be a metal (e.g., stainless steel), ceramic, graphite, carbon-carbon composite material, which cannot be corroded by the alkaline solution, or a combination thereof, for example, the frame of the mounting bracket 1 is made of graphite, and the middle beam is made of metal.
In a second aspect, the present invention provides a method for cleaning a TCO film 5 on a carrier plate, for cleaning the TCO coated carrier plate provided in the first aspect, where the TCO film 5 is attached to a sacrificial layer 4, and the specific cleaning steps include:
and soaking the support plate 2 in an alkaline solution to corrode the sacrificial layer 4, and separating the TCO film layer 5 from the support plate 2 to obtain a first cleaning plate. Wherein, the alkaline solution firstly erodes the exposed sacrificial layer 4 of the mounting groove 21, and then gradually erodes the sacrificial layer 4 between the TCO film 5 and the plate body of the support plate 2, so that the TCO film 5 is separated from the support plate 2, and the TCO film 5 is cleaned from the support plate 2.
In one example, after the support plate 2 is immersed in the alkaline solution, the sacrificial layer 4 is entirely etched to detach the TCO film layer 5 from the support plate 2, and a first cleaning plate is obtained. In this example, the thickness of the sacrificial layer 4 may be 0.1-10 microns.
In one example, when the sacrificial layer 4 includes the body layer 41 and the sacrificial layer 4, after the support plate 2 is immersed in an alkaline solution, the surface layer 42 is etched to detach the TCO film layer 5 from the support plate 2, obtaining a first cleaning plate. In this example, the surface layer 42 is etched, and the body layer 41 remains on the support plate 2, and can be used for the next TCO coating, wherein the thickness of the etched surface layer 42 can be 0.1-10 μm.
In a possible implementation manner, the method for cleaning the TCO film 5 on the carrier further includes: after the first cleaning plate is obtained, cleaning the first cleaning plate by using a weak acidic solution, removing residual alkali on the surface of the supporting plate 2, and obtaining a second cleaning plate, wherein the cleaning time can be 1-30 minutes;
and then, cleaning the second cleaning plate by using clear water, and removing the residual weak acid solution on the surface of the supporting plate 2 to obtain a clean third cleaning plate.
In one example, to be able to clean the second wash plate, the second wash plate may be washed at least twice with fresh water to obtain a third wash plate. In this example, each wash time may be 1-10 minutes, with the clear water pH after each wash being between 5-8.
In one possible embodiment, the alkaline solution may be a strong alkaline solution containing NaOH and/or KOH, the concentration of the strong alkaline solution being between 1% and 50%; the sacrificial layer 4 is quickly and thoroughly corroded by the strong alkaline solution, so that the cleaning process is accelerated. The weak acidic solution is only used for neutralizing the residual alkali liquor on the support plate 2, so that the concentration of the weak acidic solution can be less than or equal to 10%, the weak acidic solution is used for neutralizing the residual alkali liquor on the surface of the support plate 2, the residual acid amount on the surface of the support plate 2 is reduced, the subsequent clear water cleaning procedure is reduced, the low-concentration acid is safer for people, and the process safety is improved. The weakly acidic solution may be acetic acid, oxalic acid, carbonic acid, phosphoric acid, sulfurous acid, silicic acid, hydrogen sulfide, formic acid, thiocyanic acid, phenol or citric acid.
In one example, when the material of the sacrificial layer 4 is Al, the chemical reaction equation between the strong alkaline solution containing NaOH and/or KOH and the sacrificial layer 4 is: 2Al +2OH - +2H 2 O＝＝2AlO 2 - +3H 2 ；
In one example, when the material of the sacrificial layer 4 is Zn, the strong alkaline solution containing NaOH and/or KOH reacts with the sacrificial layer 4 according to the following formula: zn +2OH - +2H 2 O＝[Zn(OH) 4 ] 2- +H 2 ；
In one example, when the material of the sacrificial layer 4 is Sn, the chemical reaction equation between the strong alkaline solution containing NaOH and/or KOH and the sacrificial layer 4 is: sn +2OH - ＝NSnO 2 2- +H 2 ；
In one example, when the material of the sacrificial layer 4 is B, the chemical reaction equation between the strong alkali solution containing NaOH and/or KOH and the sacrificial layer 4 is: 2B +2OH - +2H 2 O＝2BO 2- +3H 2 ；
In one example, when the material of the sacrificial layer 4 is Si, the chemical reaction equation between the strong alkaline solution containing NaOH and/or KOH and the sacrificial layer 4 is: si + H 2 O+2OH - ＝SiO 3 2- ++2H 2 ；
In one example, when the material of the sacrificial layer 4 is Pb, the chemical reaction equation between the strong alkaline solution containing NaOH and/or KOH and the sacrificial layer 4 is: 2Pb + O 2 +2OH-+2H 2 O＝[Pb(OH) 3 ]2-；
In one example, when the material of the sacrificial layer 4 is Al O, the chemical reaction equation between the strong alkaline solution containing NaOH and/or KOH and the sacrificial layer 4 is: al O +2OH - ＝AlO - +H O；
In one example, when the material of the sacrificial layer 4 is ZnO, the chemical reaction equation between the strong alkali solution containing NaOH and/or KOH and the sacrificial layer 4 is: znO +2OH - ＝ZnO 2 2- +H 2 O or ZnO +2OH - +H 2 O＝[Zn(OH) 4 ] 2- ；
In one example, when the material of the sacrificial layer 4 is SnO2, the chemical reaction equation between the strong alkali solution containing NaOH and/or KOH and the sacrificial layer 4 is: snO 2 +2OH - ＝SnO 3 2- +H 2 O；
In one example, when the material of the sacrificial layer 4 is SiO2, the chemical reaction equation between the strong alkali solution containing NaOH and/or KOH and the sacrificial layer 4 is: siO2 2 +2OH - ＝SiO 3 2- +H 2 O；
In one example, when the material of the sacrificial layer 4 is B 2 O 3 When the sacrificial layer 4 reacts with the strong alkaline solution containing NaOH and/or KOH, the chemical reaction equation is as follows: b is 2 O 3 +2OH - ＝2BO 2 - +H 2 O。
In a possible implementation manner, the method for cleaning the TCO film 5 on the carrier further includes: when the support plate 2 to be cleaned is immersed in an alkaline solution, ultrasonic cleaning is assisted. Ultrasonic wave is utilized to assist cleaning, so that the corrosion speed of the sacrificial layer 4 can be increased, the separation speed of the TCO film layer 5 and the supporting plate 2 is increased, and the cleaning process is accelerated.
In a possible implementation manner, the method for cleaning the TCO film 5 on the carrier further includes: when the sacrificial layer 4 is attached to all places of the outer surface of the mount 1, the mount 1 is immersed in an alkaline solution. The exposed sacrificial layer 4 of the mount 1 is first etched by an alkaline solution, and the TCO film 5 gradually detaches from the mount 1 as the sacrificial layer 4 gradually dissolves. In this embodiment, the soaking time may be 1-300 minutes. The sacrificial layer 4 on the mounting frame 1 may be the same as or different from the sacrificial layer 4 on the support plate 2 as long as it can be corroded by an alkaline solution. The method of cleaning the mount 1 may be the same as the method of cleaning the support plate 2.
In addition, after the TCO film layer 5 on the support plate 2 and/or the mounting rack 1 is removed by using an alkaline solution and rinsed clean by using clean water, the surface of the support plate 2 and/or the mounting rack 1 may be dried by using a drying or blowing device.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (16)
1. A TCO film coating carrier plate is characterized by comprising a support plate, wherein the support plate is provided with at least one mounting groove for bearing a piece to be coated,
at least the inner surface of the mounting groove and the surface of the support plate where the mounting groove is located are attached with sacrificial layers, at least the surface part of the sacrificial layers can be corroded by alkaline solution, and the support plate and the TCO film layer can be kept in the original state in the alkaline solution.
2. The TCO coated carrier plate according to claim 1, wherein the sacrificial layer is made of any one of Al, zn, sn, pb, si, and B, or an oxide of any one of Al, zn, sn, pb, si, and B, or an alloy mainly containing any one of Al, zn, sn, and Pb, or an oxide of any combination of Al, zn, sn, pb, and Si, or any combination thereof.
3. The TCO coated carrier plate of claim 1, wherein the sacrificial layer comprises a bulk layer and/or a surface layer capable of being etched by the alkaline solution, the surface layer being located on a side remote from the support plate.
4. The TCO coated carrier plate according to claim 3, wherein the material of the body layer is Al2O3, znO, sn2O3, siO2, znxAl (1-x) O; and/or the surface layer is made of Al2O3, znO, sn2O3, siO2 and ZnxAl (1-x) O.
5. The TCO coated carrier plate of claim 1, wherein the sacrificial layer has a thickness of 0.1-20 μm.
6. The TCO coated carrier plate of claim 1, wherein the support plate is made of one of graphite, carbon fiber, carbon composite, stainless steel, titanium and titanium alloy.
7. The TCO coated carrier plate of claim 1, wherein the support plate has a first surface and a second surface opposite to each other, the mounting groove penetrates through the first surface and the second surface, a raised platform is formed on an inner wall of the mounting groove, the platform is used for supporting the member to be coated, and the sacrificial layer is attached to both the first surface and the second surface;
or the mounting groove is positioned on the first surface or the second surface and is used for bearing the piece to be coated.
8. The TCO coating carrier according to any one of claims 1 to 7, further comprising a mounting bracket for mounting the support plate, the mounting bracket having the sacrificial layer attached to a surface of at least one side of the mounting groove, the mounting bracket being capable of remaining in the alkaline solution.
9. A method for cleaning a TCO film on a carrier substrate, wherein the method is used for cleaning a TCO-coated carrier substrate according to any of claims 1-8, the TCO film is attached to the sacrificial layer, and the cleaning comprises:
and soaking the support plate in the alkaline solution to enable the sacrificial layer to be corroded, and separating the TCO film layer from the support plate to obtain a first cleaning plate.
10. The method of cleaning the TCO film on the support plate according to claim 9, wherein after the support plate is immersed in the alkaline solution, the sacrificial layer is completely corroded to separate the TCO film from the support plate, and a first cleaning plate is obtained.
11. The method for cleaning a TCO film on a carrier plate according to claim 9, wherein when the TCO coated carrier plate is the embodiment of claim 3, after the support plate is immersed in the alkaline solution, the surface layer is etched to separate the TCO film from the support plate, and a first cleaned plate is obtained.
12. Method for cleaning a TCO film on a carrier plate according to any one of claims 9-11, further comprising, after obtaining the first cleaning plate, the steps of:
washing the first washing plate by using a weak acid solution to obtain a second washing plate, wherein the washing time is 1-30 minutes;
and cleaning the second cleaning plate by using clean water to obtain a clean third cleaning plate.
13. The method for cleaning the TCO film on the carrier plate according to claim 12, wherein the second cleaning plate is cleaned at least twice with clean water, each time for 1 to 10 minutes, and the PH of the clean water after each cleaning is between 5 and 8.
14. The method for cleaning the TCO film layer on the carrier plate according to claim 12, wherein the alkaline solution is a strong alkaline solution containing NaOH and/or KOH, and the concentration of the strong alkaline solution is between 1% and 50%; the weak acidic solution is acetic acid, oxalic acid, carbonic acid, phosphoric acid, sulfurous acid, silicic acid, hydrogen sulfide, formic acid, thiocyanic acid, phenol or citric acid, and the concentration of the weak acidic solution is less than or equal to 10%.
15. Method for cleaning TCO film on carrier plate according to any one of claims 9 to 11, wherein ultrasonic cleaning is assisted when the support plate to be cleaned is immersed in the alkaline solution.
16. The method of cleaning a TCO film on a carrier plate according to any one of claims 9 to 11, wherein when the TCO coated carrier plate is the solution of claim 8, the mount is cleaned by soaking in the alkaline solution for 1-300 min.
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