CN115847276A - Pin ring for double-side polishing equipment and double-side polishing machine - Google Patents
Pin ring for double-side polishing equipment and double-side polishing machine Download PDFInfo
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- CN115847276A CN115847276A CN202211617493.4A CN202211617493A CN115847276A CN 115847276 A CN115847276 A CN 115847276A CN 202211617493 A CN202211617493 A CN 202211617493A CN 115847276 A CN115847276 A CN 115847276A
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- pin ring
- pin
- double
- ring
- gasket
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- 238000005498 polishing Methods 0.000 title claims abstract description 97
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 29
- 229910052710 silicon Inorganic materials 0.000 claims description 29
- 239000010703 silicon Substances 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000005060 rubber Substances 0.000 claims description 4
- 238000012423 maintenance Methods 0.000 abstract description 7
- 239000012634 fragment Substances 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 29
- 238000012545 processing Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920006169 Perfluoroelastomer Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The embodiment of the invention discloses a pin ring for double-sided polishing equipment and a double-sided polishing machine, wherein the pin ring comprises: the plurality of pin shafts are uniformly fixed on the lower polishing unit of the double-sided polishing equipment along the circumferential direction; a plurality of sleeves rotatably mounted on each of the plurality of pins; a gasket disposed between the sleeve and the lower polishing unit, the gasket including a plurality of through-holes through which each of the plurality of pins passes, the through-holes being configured to pass one of the plurality of pins, wherein the gasket is configured in a ring shape composed of at least one sector section, the sector section including at least two of the through-holes. The gasket can simplify the installation steps, save the assembly time and reduce the risk of fragments caused by the loss of the gasket during equipment maintenance.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a pin ring for double-side polishing equipment and a double-side polishing machine.
Background
In recent years, with the development of the semiconductor industry, higher requirements are being placed on the flatness of silicon wafers, and in addition to GBIR (Global backside-referenced Ideal plane/Range), SFQR (Site front-side-referenced least square/Range), SBIR (Site backside-referenced Ideal plane/Range), and the like, which have been used as flatness evaluation indexes so far, the following new indexes have been used: ROA (Roll Off Amount), also called Edge Roll Off Amount, ESFQR (Edge Site front surface reference least square/Range) for evaluating flatness of a silicon wafer; the ZDD (Z-Height Double Differentiation) of the change in curvature was evaluated.
The double-side polishing process is one of the most effective methods for obtaining local planarization and global planarization of a silicon wafer, and when double-side grinding and polishing equipment is used, a bearing disc bearing the silicon wafer to be ground is positioned through a pin ring arranged in the double-side grinding and polishing equipment. When assembling double-sided grinding and polishing equipment, because the round pin ring part is scattered and a large amount, lead to loading and unloading to consume time and need artifical careful inspection after the assembly whether have the omission, right double-sided grinding and polishing equipment need carry out the high pressure when carrying out regular maintenance and wash, spare part on the round pin ring is owing to the dispersion is washed out by high-pressure squirt easily, leads to appearing fragment or metal contamination's phenomenon in the follow-up processing.
Disclosure of Invention
In order to solve the above technical problems, embodiments of the present invention desirably provide a pin ring and a double-side polishing machine for a double-side polishing apparatus, so as to reduce maintenance cost of the double-side polishing apparatus and ensure quality of subsequent processing.
The technical scheme of the invention is realized as follows:
in a first aspect, the present invention provides a pin ring for a double-side polishing apparatus, the pin ring comprising:
the plurality of pin shafts are uniformly fixed on the lower polishing unit 5 of the double-sided polishing equipment along the circumferential direction; a plurality of sleeves rotatably mounted on each of the plurality of pins; a gasket disposed between the sleeve and the lower polishing unit, the gasket including a plurality of through-holes through which each of the plurality of pins passes, the through-holes being configured to pass one of the plurality of pins, wherein the gasket is configured in a ring shape composed of at least one sector section, the sector section including at least two of the through-holes.
In a second aspect, the present invention also provides a double-side polishing machine, comprising: an upper polishing unit; a lower polishing unit; the silicon wafer bearing disc is arranged between the polishing units; the pin ring of any one of claims 1 to 8, mounted on said lower polishing unit, said pin ring for restraining said carrier disks and driving said carrier disks to rotate between polishing units, wherein the number of said pin rings is selected
Two in number, a first pin ring and a second pin ring, respectively, disposed radially outwardly around the 5 th pin ring.
The embodiment of the invention provides a pin ring for double-side polishing equipment and a double-side polishing machine, wherein the scatter of the pin ring is eliminated by a gasket consisting of at least one sector section, a through hole for a pin shaft to pass through is formed in the sector section, and the gasket is assembled on the pin shaft in a mode that the pin shaft passes through the through hole, so that the integral part of the pin ring is reduced
The quantity has saved the dismouting time of equipment, simultaneously, has avoided 0 dashing of packing ring and the phenomenon of losing when using high-pressure squirt to wash to prevent to process the emergence that the silicon chip leads to the piece under the condition of disappearance packing ring.
Drawings
FIG. 1 is a schematic diagram of a double-side polishing apparatus according to the prior art;
FIG. 2 is a top view of a lower polishing unit of a double-side polishing apparatus according to the prior art;
FIG. 3 is a schematic cross-sectional view of two adjacent subunits in a prior art pin ring;
FIG. 4 is a cross-sectional view of a pin ring for a double-sided polishing apparatus according to an embodiment of the present invention;
FIG. 5 is a schematic view of a washer configuration for a pin ring of a double-sided polishing apparatus according to an embodiment of the present invention;
FIG. 6 is a schematic view of a butt joint structure of a gasket according to another embodiment of the present invention;
FIG. 7 is a schematic view of a washer according to another embodiment of the present invention;
FIG. 8 is a schematic structural view of an extension for a double-side polishing apparatus according to an embodiment of the present invention;
fig. 9 is a top view of a lower polishing unit of a double-side polishing machine according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1, in a conventional double-side polishing apparatus, the double-side polishing apparatus includes an upper polishing unit P for polishing an upper surface of a silicon wafer and a lower polishing unit S for polishing a lower surface of the silicon wafer. In the actual polishing process, referring to fig. 1 and 2, a pin ring 1 is provided on the lower polishing unit S to position the wafer carrier C and guide the wafer carrier C to rotate between the upper polishing unit P and the lower polishing unit S. Referring to fig. 2 and 3, the pin ring 1 is composed of a plurality of sub-units a arranged in a ring shape, each of which includes a pin shaft 101, a sleeve 102, and a spacer 103. The double-sided polishing equipment further comprises a driving device, wherein the driving device is used for driving the pin ring 1 to rotate so as to drive the silicon wafer bearing disc C to rotate, so that the double-sided polishing equipment can remove materials from the silicon wafer, such as honing, grinding, polishing or grinding.
Referring to fig. 2 and 3, a common pad 103 and a sleeve 102 are sleeved on a pin shaft 101, and the pad 103 is disposed between the sleeve 102 and a lower polishing unit S, wherein the pin ring 1 is composed of a plurality of sub-units a, each sub-unit a is provided with an independent pad 103, each pad 103 needs to be installed one by one in an assembly stage, a worker needs to spend a lot of time and effort to confirm whether the pad 103 is assembled correctly, meanwhile, when the equipment is maintained regularly, the lower polishing unit needs to be washed by a high-pressure water gun to remove crystals and/or fragments on the lower polishing unit S, the sleeve 102 needs to be disassembled for cleaning in a washing process, the independent pads 103 in the single sub-unit a are easily washed away and lost, so that metal contamination is formed in subsequent processing due to the absence of the pad 103 at the bottom of the sleeve 102, and after a part of the pads 103 at the bottom of the sleeve 102 are lost, the heights of all the sleeves 102 are not uniform, the force of the silicon wafer carrier discs C is uneven, so that the polishing quality is affected, and even the occurrence of silicon wafers is caused.
In order to solve the above technical problem, referring to fig. 4 and 5, an embodiment of the present invention provides a pin ring 2 for a double-side polishing apparatus, the pin ring 2 including:
the plurality of pin shafts 201 are uniformly fixed on the lower polishing unit S of the double-sided polishing equipment along the circumferential direction;
a plurality of sleeves 202, said sleeves 202 rotatably mounted on each of said plurality of pins 201;
a washer 203 disposed between the sleeve 202 and the lower polishing unit S, the washer 203 including a plurality of through holes 2031 for each pin 201 of the plurality of pins 201 to pass through, the through holes 2031 being configured for one pin 201 of the plurality of pins 201 to pass through, wherein the washer 203 is configured in a ring shape composed of at least one segment including at least two of the through holes 2031.
In the present invention, the gasket 203 is a single gasket 203 composed of at least one segment, and the single gasket 203 is a single gasket 203 formed by at least one segment in a mechanical coupling manner, so that the single gasket 203 can simplify the installation process, save the assembly time, and reduce the risk of fragments caused by missing gaskets during the maintenance of the equipment.
The plurality of pins 201 are uniformly arranged on the lower polishing unit S along the circumferential direction, referring to fig. 4, the pins 201 are substantially cylindrical, and the pins 201 are fixedly mounted on the lower polishing unit S in a manner of being perpendicular to the surface of the lower polishing unit S. Since the silicon wafer carrier C rotates against the pin ring 2 by direct contact, the pin shaft 201 is made of hardened metal to better support the silicon wafer carrier C, wherein hard materials such as carbon nitride or alloy such as stainless steel, tungsten carbide, etc. may be used.
Referring to fig. 4, the pin ring 2 further includes a plurality of sleeves 202, and the sleeves 202 are rotatably disposed on each pin 201, that is, the number of the sleeves 202 is equal to the number of the pins 201. Specifically, the sleeve 202 is overall cylindrical, the sleeve 202 has a concave hole 2021 with an opening on one side, and the inside of the concave hole 2021 is smooth, so that when the sleeve 202 is assembled on the pin 201, the sleeve 202 can rotate around its central axis by using the pin 201 as a rotating shaft. The inner diameter of the concave hole 2021 is configured to be greater than or equal to the diameter of the pin 201, so that the pin 201 can extend into the concave hole 2021 and contact with the bottom of the concave hole 2021 along the opening direction. Preferably, the diameter of the pin shaft 201 is gradually reduced along the vertical direction, so that the sleeve 202 is more conveniently assembled, and the assembling efficiency of the equipment is improved. The sleeve 202 is in direct contact with the silicon wafer carrier C, and preferably, the outer portion of the sleeve 202 is engaged with the outer portion of the silicon wafer carrier C in a toothed manner. When the sleeve 202 is assembled on the pin shaft 201, no friction force exists between the pin shaft 201 and the silicon wafer bearing disc C, direct contact occurs between the sleeve 202 and the silicon wafer bearing disc C, most of the sleeve 202 is borne on the pin shaft 201 along the length direction, and therefore abrasion of the pin shaft 201 is reduced, and after abrasion of a certain degree occurs, the sleeve 202 can be directly replaced to improve maintenance efficiency of equipment. The sleeve 202 directly contacts with the silicon wafer bearing disc C and guides the silicon wafer bearing disc C to rotate, and similarly, in order to better support the silicon wafer bearing disc C, the sleeve 202 is made of the hard material to form the sleeve 202.
Referring to fig. 4 and 5, the pin ring 2 further includes a washer 203, and the washer 203 is disposed between the sleeve 202 and the lower polishing unit S to protect a surface of the sleeve 202 contacting the lower polishing unit S. In addition, the washer 203 can compensate for the gap inside the pin ring 2, thereby preventing polishing liquid, which is polished or cleaned, from undesirably flowing into the apparatus. The washer 203 includes a plurality of through holes 2031, the through holes 2031 are configured to pass through the plurality of pins 201, and preferably, the washer 203 is configured to pass through one of the plurality of pins 201, that is, the number of the through holes 2031 is equal to the number of the pins 201, so that the washer 203 is present at the bottom of each sleeve 202 to isolate the sleeve 202 from the lower polishing unit S. The through hole 2031 is configured to have an inner diameter equal to or slightly larger than the maximum diameter of the pin 201 to ensure that the pin 201 can pass through the through hole 2031. Wherein, the gasket 203 is made of rubber, and the optional materials are styrene-butadiene rubber, hydrogenated rubber, ethylene propylene diene monomer, silica gel, fluorine rubber, neoprene, perfluoroelastomer and the like, so that the stretchability and the wear resistance of the gasket 203 are ensured. Referring to fig. 5, it is schematically shown that the washer 203 includes 8 through holes 2031, and accordingly, the washer 203 shown in fig. 5 is applied to a pin ring 2 having 8 pins 201 and 8 sleeves 202.
The washer 203 further comprises at least one segment constituting a ring-shaped washer 203, wherein contact surfaces of adjacent segments abut against each other to ensure the integrity of the washer 203, wherein each segment comprises at least two through holes 2031. Referring to fig. 5, which shows a schematic structural diagram of the gasket 203, schematically, the gasket 203 includes two sector sections, namely a first sector section 2032 and a second sector section 2033, the first sector section 2032 and the second sector section 2033 are identical in structure and each has a sector section with a central angle of 180 °, and contact surfaces of the first sector section 2032 and the second sector section 2033 are two planes abutting each other. In another embodiment, referring to fig. 6, another combination of the contact surfaces of the first segment 2032 and the second segment 2033 is shown, wherein the end of the first segment 2032 is provided with a protrusion and the end of the second segment 2033 is provided with a groove for receiving the protrusion, and the protrusion and the groove are configured to be coupled in an interference fit to ensure a tight connection between the first segment 2032 and the second segment 2033. Specifically, the sum of the number of through holes 2031 on the first and second sector sections 2032 and 2033 is equal to the number of through holes 2031, so that the gasket 203 can be between the lower polishing unit S and each sleeve 202 to protect the pin ring 2 and polishing apparatus. In another embodiment of the present invention, referring to fig. 7, the pin ring 2 is formed by a sector with a central angle of 360 °, i.e. the washer 203 is a unitary ring, and the washer 203 is a component, so that the assembly steps can be simplified and the assembly efficiency can be improved when the washer 203 is assembled on the pin shaft. When the double-sided polishing apparatus is assembled, the through holes 2031 are aligned with the pins 201, wherein the circumferential distance between adjacent through holes 2031 is equal to the circumferential distance between adjacent pins 201, that is, after any two through holes 2031 on the gasket 203 are aligned with their corresponding pins 201, the other through holes 2031 can also be directly aligned with their corresponding pins 201, so that the gasket 203 and the pins 201 can be simply assembled.
Preferably, in order to further ensure that a gasket 203 can line the bottom of the sleeve 202 to protect the sleeve 202 and the lower polishing unit S and prevent the polishing unit S from being worn, the sector section further includes an extension portion 2034, the extension portion 2034 is disposed at the outer periphery of the corresponding through hole 2031, the extension portion 2034 extends outward in the radial direction of the through hole 2031 around the through hole 2031, see fig. 8, which shows a schematic view of the extension portion 2034, and the extension portion 2034 extends outward in the radial direction of the through hole 2031 in a substantially circular ring shape, wherein the length of the extension portion 2034 in the extending direction thereof is greater than or equal to the thickness of the sleeve 202, and herein, the thickness of the sleeve 202 refers to the thickness of the sleeve 202 in the radial direction. The extension 2034 is preferably integrally formed with the segment to ensure that the extension 2034 is coaxial with the bore 2031, so that the extension 2034 can precisely correspond to the bottom of the sleeve 202, while also simplifying the manufacturing process of the gasket 203.
In the pin ring 2 for a double-sided polishing apparatus disclosed in the embodiment of the present invention, the washer 203 is formed by a sector with a central angle of 360 °, that is, the washer 203 is a complete single annular component, and the washer 203 is assembled in the following manner: the washers 203 are fitted to the pins 201 along the length direction of the pins 201 (the direction perpendicular to the surface of the lower polishing unit S), wherein the washers 203 are configured such that each pin 201 passes through one through hole 2031 and is received in the through hole 2031 when the washers 203 are assembled to the pins 201. Through the structure, when the gasket 203 is assembled on the pin shaft 201, the gasket 203 can be assembled through a single sleeving action along the vertical direction only by aligning the pin shaft 201 with the through hole 2031, and the gasket 203 can be disassembled through a single movement along the vertical direction during equipment maintenance.
The embodiment of the present invention further provides a double-side polishing machine 3, wherein the double-side polishing machine 3 comprises an upper polishing unit P and a lower polishing unit S for processing the surface of a silicon wafer, and a silicon wafer carrier C for carrying the silicon wafer to move between the polishing units, the double-side polishing machine 3 further comprises two pin rings 2 disclosed in the above embodiment, referring to fig. 9, which shows a top view of the lower polishing unit S of the double-side polishing machine 3, wherein no sleeve is shown, the number of the pin rings 2 is two, and the pin rings are respectively a first pin ring 21 and a second pin ring 22, compared with the double-side polishing apparatuses of the prior art shown in fig. 1 to fig. 3, the double-side polishing machine 3 replaces a pin ring 1 with the pin ring 2 disclosed in the embodiment of the present invention, and replaces a scattered gasket with an integrated gasket, thereby simplifying the assembly steps of the double-side polishing machine 3, saving the assembly time, and avoiding the risk of gasket loss during the maintenance process of the double-side polishing machine 3.
Wherein the first pin ring 21 is disposed on the surface of the lower polishing unit S coaxially with the lower polishing unit S, and the second pin ring 22 is disposed on the surface of the lower polishing unit S radially outwardly around the first pin ring 21, i.e., the second pin ring 22 has a larger diameter than the first pin ring 21. The first pin ring 21 comprises a first pin shaft 211 and a first washer 213, the second pin ring 22 comprises a first pin shaft 221 and a first washer 223, in the above configuration, the silicon wafer bearing disc C moves in the gap between the first pin ring 21 and the second pin ring 22, and the region between the first pin ring 21 and the second pin ring 22 forms the processing region of the silicon wafer. The silicon wafer bearing disc C is provided with a first pin ring 21 and a second pin ring 22, wherein the first sleeve in the first pin ring 21 and the second sleeve in the second pin ring 22 are both provided with driving teeth, correspondingly, receiving teeth matched with the driving teeth are arranged on the outer portion of the silicon wafer bearing disc C, and the first pin ring 21 and the second pin ring 22 drive the bearing disc C to move in a manner that the driving teeth are meshed with the receiving teeth.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A pin ring for a double-side polishing apparatus, the pin ring comprising:
the plurality of pin shafts are uniformly fixed on the lower polishing unit of the double-sided polishing equipment along the circumferential direction;
a plurality of sleeves rotatably mounted on each of the plurality of pins;
a gasket disposed between the sleeve and the lower polishing unit, the gasket including a plurality of through-holes through which each of the plurality of pins passes, the through-holes being configured to pass one of the plurality of pins, wherein the gasket is configured in a ring shape composed of at least one sector section, the sector section including at least two of the through-holes.
2. The pin ring of claim 1 wherein said number of segments is one and said number of through holes in said segments is equal to said number of pins.
3. The pin ring of claim 1 or 2, wherein said through hole is configured with an inner diameter greater than or equal to a diameter of said pin shaft.
4. The pin ring of claim 1 or 2, wherein the sector further comprises an extension extending radially outward around each of the through holes, the extension having a length in the radial direction greater than or equal to a thickness of the sleeve in the radial direction.
5. The pin ring of claim 4, wherein said extension is integrally formed with said washer.
6. The pin ring of claim 1 or 2, wherein said sleeve outer wall and said carrier plate are configured to engage in a toothed manner.
7. A pin ring according to claim 1 or 2, wherein the pin and the sleeve are made of a hard material.
8. A pin ring according to claim 1 or 2, wherein the washer is made of rubber.
9. A double side polishing machine, characterized in that it comprises:
an upper polishing unit;
a lower polishing unit;
the silicon wafer bearing disc is arranged between the polishing units;
the pin ring of any one of claims 1 to 8, mounted on said lower polishing unit, said pin ring for retaining said carrier disc and driving said carrier disc to rotate between polishing units, characterized in that said pin rings are two in number, being a first pin ring and a second pin ring, respectively, said second pin ring being arranged radially outwardly around said first pin ring.
10. The double-sided buffing machine of claim 9 wherein the carrier disc rotates in a gap between the first pin ring and the second pin ring by engaging the first pin ring and the second pin ring.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211617493.4A CN115847276A (en) | 2022-12-15 | 2022-12-15 | Pin ring for double-side polishing equipment and double-side polishing machine |
| TW112105546A TW202330171A (en) | 2022-12-15 | 2023-02-16 | Pin ring for double-sided polishing equipment and double-sided polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211617493.4A CN115847276A (en) | 2022-12-15 | 2022-12-15 | Pin ring for double-side polishing equipment and double-side polishing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115847276A true CN115847276A (en) | 2023-03-28 |
Family
ID=85673365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211617493.4A Pending CN115847276A (en) | 2022-12-15 | 2022-12-15 | Pin ring for double-side polishing equipment and double-side polishing machine |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115847276A (en) |
| TW (1) | TW202330171A (en) |
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| JP2013173194A (en) * | 2012-02-24 | 2013-09-05 | Hamai Co Ltd | Polishing apparatus |
| JP2018088490A (en) * | 2016-11-29 | 2018-06-07 | 株式会社ディスコ | Polishing device |
| CN209140642U (en) * | 2018-09-29 | 2019-07-23 | 天津布莱德尔机床有限公司 | A kind of lower wall and dual-end face grinder of dual-end face grinder |
| JP2022079151A (en) * | 2020-11-16 | 2022-05-26 | 株式会社太陽 | Double-side polishing device |
| CN112923063A (en) * | 2021-02-24 | 2021-06-08 | 兰州理工大学 | Magnetic force manifold type dry gas seal structure |
| CN113969971A (en) * | 2021-10-08 | 2022-01-25 | 锐奇控股股份有限公司 | Trip stop structure of electric drill gear box |
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| TW202330171A (en) | 2023-08-01 |
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