CN115831815B - Chip mounting system and mounting method thereof - Google Patents
Chip mounting system and mounting method thereof Download PDFInfo
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- CN115831815B CN115831815B CN202211474992.2A CN202211474992A CN115831815B CN 115831815 B CN115831815 B CN 115831815B CN 202211474992 A CN202211474992 A CN 202211474992A CN 115831815 B CN115831815 B CN 115831815B
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- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 16
- 239000012528 membrane Substances 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 5
- 238000012536 packaging technology Methods 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
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- 239000004065 semiconductor Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
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- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
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- 238000012858 packaging process Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The invention provides a chip mounting system and a mounting method thereof, wherein the chip mounting system comprises: a wafer film carrying the chips; the wafer moving mechanism is used for adjusting the initial position and angle of the wafer film; the ejector pin mechanism is positioned below the wafer film and is used for ejecting the chip upwards to separate the chip from the wafer film; the wafer identification camera is positioned above the thimble mechanism and is coaxial with the thimble mechanism and used for identifying and positioning the position of the chip; a mounting substrate positioned above the wafer recognition camera; the mounting device comprises a normal mounting mechanism, a flip-chip mechanism and a mounting mechanism, wherein the normal mounting mechanism is used for realizing normal mounting of chips, the flip-chip mechanism is used for realizing flip-chip of the chips, and the mounting mechanism is arranged on the two-dimensional moving mechanism and used for picking up the chips from the normal mounting mechanism or the flip-chip mechanism and mounting the chips on a position to be mounted on a mounting substrate. The invention can be compatible with flip-chip mounting technology and normal mounting technology, and can also improve the mounting efficiency and positioning accuracy of chips.
Description
Technical Field
The invention relates to the technical field of chip mounting, in particular to a chip mounting system and a chip mounting method.
Background
The semiconductor industry is a fundamental and strategic industry for technological development, and chip packaging is one of the important links of the semiconductor industry. In recent years, the packaging industry in China is continuously developed, innovative packaging design and manufacturing technology is continuously advanced, and a chip packaging technology integrated by a high-density thin system represents a main stream direction of the development of the packaging technology, so that advanced packaging technologies such as WLCSP, fan-Out, integrated IC, 3D WLCSP, 3D IC, 2.5D interposer and the like are formed. In the future, advanced packaging technology is moving toward short interconnect lengths, versatility, high integration, and high heat dissipation, and its design, fabrication, and application reliability are challenged unprecedented.
The chip mounting process is one of the important processes of the chip packaging process, and the chip mounting is generally to mount chips on a plurality of predetermined mounting positions on a substrate surface such as a lead frame, a bar, a substrate wafer, a substrate flat plate, etc., and the chips mounted on the predetermined positions are arranged in rows and columns on the substrate surface. In order to improve the yield, the mounting precision of the chip on the substrate needs to be improved; in order to reduce the packaging cost of the chips, it is required to shorten the mounting time of each chip as much as possible; meanwhile, according to different packaging requirements, the chip is required to be mounted through a flip-chip process and a forward mounting process.
The existing chip mounting system and mounting method are that a substrate is fixed on a horizontally placed substrate bearing mechanism in a vacuum adsorption or clamping mode, the substrate bearing mechanism drives the substrate to move in an X-Y plane, a pre-mounting position on the substrate is moved to a designated mounting position and fixed, meanwhile, the mounting mechanism picks up a chip from a chip supply mechanism and then moves to the position above the designated mounting position, after correcting an X-Y position error provided by a vision alignment system, the chip is mounted on the pre-mounting position on the substrate, and the chip mounting process is completed.
The defects of the chip mounting system and the chip mounting method are as follows:
1. In one mounting period, the mounting mechanism moves in the X-vertical direction, the substrate bearing mechanism moves in the X-vertical direction, and both mechanisms have positioning deviation, so that larger positioning deviation can be generated by accumulation, and the positioning accuracy of the chip is low;
2. only a single mounting mechanism can be adopted, and the mounting efficiency is low;
3. the method is only suitable for a single flip-chip mounting process or a normal mounting process, cannot be compatible with two mounting processes, and has limitation.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides a chip mounting system and a mounting method thereof, wherein the chip mounting system has the advantages of both a flip-chip mounting process and a normal mounting process, and has high positioning precision and high mounting efficiency.
In order to achieve the above purpose, the present invention adopts the following specific technical scheme:
The chip mounting system provided by the invention comprises: the wafer film is provided with a chip, and the right side of the chip faces upwards; the wafer moving mechanism is used for driving the wafer film to move and adjusting the initial position and angle of the wafer film; the ejector pin mechanism is positioned below the wafer film and is used for ejecting the chip upwards to separate the chip from the wafer film; the wafer recognition camera is positioned above the thimble mechanism, the center of the wafer recognition camera and the center of the thimble mechanism form a straight line in the Z direction, and the wafer recognition camera is used for recognizing and positioning the position of the chip; a mounting substrate, which is positioned above the wafer recognition camera and is used as a mounting target of chips on the wafer film; the number of the mounting devices is at least one, and each mounting device comprises a normal mounting mechanism, a flip mounting mechanism, a two-dimensional moving mechanism, a mounting mechanism identification camera, a mounting substrate identification camera and a data processor; the flip-chip mechanism is used for picking up a chip separated from the wafer film and driving the chip to flip 180 degrees so that the back surface of the chip faces upwards; the positive mounting mechanism is positioned above the flip-chip mechanism and is used for picking up the chip on the flip-chip mechanism and driving the chip to turn over 180 degrees so that the right side of the chip faces upwards; the mounting mechanism is arranged on the two-dimensional moving mechanism, and is used for picking up the chip on the flip mechanism or the normal mounting mechanism under the drive of the two-dimensional moving mechanism and moving to the position above the recognition camera of the mounting mechanism; the mounting mechanism identification camera is used for identifying a chip position A on the mounting mechanism; the mounting substrate recognition camera is used for recognizing a position B to be mounted on the mounting substrate; the data processor is used for correcting the position B to be mounted according to the chip position A, sending the corrected position to the mounting mechanism, and the mounting mechanism mounts the picked chip to the corrected position on the mounting substrate.
Preferably, the two-dimensional moving mechanism comprises a first horizontal direction linear module, a second horizontal direction linear module and a vertical direction linear module, two ends of the vertical direction linear module are fixedly connected with the modules of the first horizontal direction linear module and the second horizontal direction linear module, and the mounting mechanism is fixed on a sliding block of the vertical direction linear module.
Preferably, the number of the mounting devices is two.
The flip chip mounting method provided by the invention comprises the following steps:
S1, adjusting the initial position of a wafer film through the cooperation of a wafer moving mechanism and a wafer identification camera, so that a current chip to be mounted on the wafer film moves to be coaxial with a thimble mechanism;
s2, the thimble mechanism jacks up the current chip to be mounted upwards, so that the current chip to be mounted is separated from the wafer film;
S3, the flip-chip mechanism picks up the current chip to be mounted and turns over 180 degrees, so that the back surface of the current chip to be mounted faces upwards;
S4, driving the mounting mechanism to move to the upper part of the flip mechanism through the two-dimensional moving mechanism, picking up the chip on the flip mechanism, and moving to the upper part of the recognition camera of the mounting mechanism;
s5, recognizing a chip position A on the mounting mechanism through the mounting mechanism and recognizing a to-be-mounted position B on the mounting substrate through the mounting substrate recognition camera, correcting the to-be-mounted position B according to the chip position A by the data processor, and sending the corrected to-be-mounted position to the mounting mechanism;
s6, the mounting mechanism mounts the picked chip to the corrected position to be mounted on the mounting substrate.
The chip forward mounting and mounting method provided by the invention comprises the following steps:
S1, adjusting the initial position of a wafer film through the cooperation of a wafer moving mechanism and a wafer identification camera, so that a current chip to be mounted on the wafer film moves to be coaxial with a thimble mechanism;
s2, the thimble mechanism jacks up the current chip to be mounted upwards, so that the current chip to be mounted is separated from the wafer film;
S3, the flip-chip mechanism picks up the current chip to be mounted and turns over 180 degrees, so that the back surface of the current chip to be mounted faces upwards;
s4, the positive mounting mechanism moves to the upper side of the flip-chip mechanism, picks up the chip on the flip-chip mechanism and turns over 180 degrees, so that the front side of the chip faces upwards;
s5, driving the mounting mechanism to move to the upper part of the normal mounting mechanism through the two-dimensional moving mechanism, picking up the chip on the normal mounting mechanism, and moving to the upper part of the recognition camera of the mounting mechanism;
s6, recognizing a chip position A on the mounting mechanism through the mounting mechanism and recognizing a to-be-mounted position B on the mounting substrate through the mounting substrate recognition camera, correcting the to-be-mounted position B according to the chip position A by the data processor, and sending the corrected to-be-mounted position to the mounting mechanism;
S7, the mounting mechanism mounts the picked chip to the corrected position to be mounted on the mounting substrate.
The invention can obtain the following technical effects:
1. The invention realizes the compatibility of the flip-chip mounting process and the normal mounting process by arranging the normal mounting mechanism and the flip-chip mounting mechanism.
Meanwhile, at least two mounting mechanisms are adopted, so that the mounting efficiency is improved, the mounting substrate is fixed, and the positioning accuracy of the chip can be improved.
2. The invention uses at least two mounting mechanisms to mount the chip, so that the mounting efficiency can be improved.
3. The invention only needs to move the mounting mechanism and the mounting substrate is fixed, so that the positioning error can be reduced and the positioning precision of the chip can be improved.
Drawings
Fig. 1 is a schematic structural diagram of a chip mounting system according to an embodiment of the present invention.
Wherein reference numerals include: wafer film 1, chip 2, ejector pin mechanism 3, wafer recognition camera 4, mounting substrate 5, mounting device 6, normal mounting mechanism 61, flip-chip mechanism 62, two-dimensional moving mechanism 63, mounting mechanism 64, mounting mechanism recognition camera 65, mounting substrate recognition camera 66, first horizontal direction straight line module 631, second horizontal direction straight line module 632, and vertical direction straight line module 633.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, like modules are denoted by like reference numerals. In the case of the same reference numerals, their names and functions are also the same. Therefore, a detailed description thereof will not be repeated.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not to be construed as limiting the invention.
Fig. 1 shows a structure of a chip mounting system provided according to an embodiment of the present invention.
As shown in fig. 1, a chip mounting system provided in an embodiment of the present invention includes: wafer membrane 1, chip 2, thimble mechanism 3, wafer recognition camera 4, mounting base plate 5 and mounting device 6, chip 2 bonds on wafer membrane 1 through specific glue, the front of chip 2 is up, thimble mechanism 3 is located the below of wafer membrane 1 for jack-up chip 2 for chip 2 and wafer membrane 1 separation, wafer recognition camera 4 is located the top of wafer membrane 1, is used for the position of discernment chip 2, and mounting base plate 5 is located the wafer recognition camera 4 directly over, and mounting device 6 is used for picking up the chip that separates with wafer membrane 1 to the dress position of waiting of mounting base plate 5.
The wafer film 1 realizes the adjustment of position and angle through the wafer moving mechanism, adjusts the angle of the wafer film 1 in order to make the wafer film 1 be in the horizontality, adjusts the position of the wafer film 1 in order to guarantee that the chip to be mounted at present moves to the position directly over the thimble mechanism 3, and the center of the chip to be mounted at present is coaxial with the center of the thimble mechanism 3.
The specific structure of the ejector pin mechanism 3 refers to the patent of the invention with the application number 201280018547.3, the wafer film 1 is fixed in a vacuum adsorption mode, and the chip 2 is lifted upwards through the ejector pin in the ejector pin mechanism, so that the chip 2 is separated from the wafer film 1.
The center of the wafer recognition camera 4 is coaxial with the center of the thimble mechanism 3, the center of the wafer recognition camera 4 is the center of the thimble mechanism 3, the position of the chip to be mounted currently on the wafer film 1 is recognized through the wafer recognition camera 4, if the center of the chip to be mounted currently does not coincide with the center of the wafer recognition camera 4, the position deviation of the chip to be mounted currently is sent to the wafer moving mechanism, and the wafer moving mechanism moves to drive the wafer film 1 to move, so that the center of the chip to be mounted currently is coaxial with the center of the thimble mechanism 3.
In order to improve the mounting efficiency, the number of the mounting devices 6 is at least two, and under the condition that the movement does not interfere, a plurality of mounting devices 6 can be adopted, and the structures of each mounting device 6 are the same.
The mounting device 6 includes a normal mounting mechanism 61, a flip-chip mechanism 62, a two-dimensional moving mechanism 63, a mounting mechanism 64, a mounting mechanism recognition camera 65, and a mounting substrate recognition camera 66, the normal mounting mechanism 61 is used for realizing normal mounting of the chip 2, the flip-chip mechanism 62 is used for realizing flip-chip mounting of the chip 2, the mounting mechanism 64 is fixedly mounted on the two-dimensional moving mechanism 63, movement of the mounting mechanism 64 in the horizontal direction and the vertical direction is realized by the two-dimensional moving mechanism 63, the mounting mechanism 64 is used for picking up the chip on the normal mounting mechanism 61 or the flip-chip mechanism 62, the mounting mechanism recognition camera 65 is used for recognizing the chip position on the mounting mechanism 64, the mounting substrate recognition camera 66 is used for recognizing the position to be mounted of the mounting substrate 5, the data processor corrects the position to be mounted recognized by the mounting substrate recognition camera 66 based on the chip position recognized by the mounting mechanism recognition camera 65, and sends the corrected position to the mounting mechanism 64, and the mounting mechanism 64 pastes the picked up chip to the corrected position to be mounted on the mounting substrate 5.
The normal mounting mechanism 61, the flip-chip mechanism 62, and the mounting mechanism 64 pick up the chip 2 in a vacuum adsorption manner or a clamping manner, and the specific structures of the normal mounting mechanism 61, the flip-chip mechanism 62, and the mounting mechanism 64 are all of the prior art, so that the details are not repeated here.
When the chip mounting system performs the front mounting process, the flip-chip mechanism 62 picks up the chip 2 separated from the wafer film 1 and turns over the chip 2 by 180 degrees, so that the back surface of the chip 2 faces upward, then the front mounting mechanism 61 moves to a position right above the flip-chip mechanism 62 and is coaxial with the flip-chip mechanism 62, the front mounting mechanism 61 vacuum adsorbs the back surface of the chip on the flip-chip mechanism 62, then the front mounting mechanism 61 turns over the chip 2 by 180 degrees, so that the front surface of the chip 2 faces upward, and finally the mounting mechanism 64 adsorbs the front surface of the chip on the front mounting mechanism 61 and mounts the front surface of the chip on the front mounting mechanism to the mounting substrate 5 at the position to be mounted, so that the front mounting of the chip is realized.
When the chip mounting system performs the flip-chip mounting process, the front mounting mechanism 61 is moved to other positions from the position right above the flip-chip mechanism 62, so that the collision between the mounting mechanism 64 and the front mounting mechanism 61 is avoided, and the mounting mechanism 64 directly vacuum adsorbs the back surface of the chip on the flip-chip mechanism 62 and mounts the back surface of the chip onto the position to be mounted of the mounting substrate 5, thereby realizing flip-chip mounting of the chip.
The two-dimensional moving mechanism 63 includes a first horizontal direction linear module 631, a second horizontal direction linear module 632 and a vertical direction linear module 633, one end of the vertical direction linear module 633 is fixedly connected with the slider of the first horizontal direction linear module 631, the other end of the vertical direction linear module 633 is fixedly connected with the slider of the second horizontal direction linear module 632, the mounting mechanism 64 and the mounting mechanism identification camera 65 are respectively and fixedly installed on the slider of the vertical direction linear module 633, the first horizontal direction linear module 631 and the second horizontal direction linear module 632 are used for driving the mounting mechanism 64 to move along the horizontal direction, and the vertical direction linear module 633 is used for driving the mounting mechanism 64 and the mounting mechanism identification camera 65 to move along the vertical direction.
The two horizontal linear modules are adopted to effectively improve the accuracy and the speed of chip mounting.
The mounting device 6 adopted by the invention can be compatible with a forward mounting process and a flip mounting process, and the number of the mounting devices is at least two, so that the mounting efficiency of chips is improved.
Since the mounting substrate 5 is fixed all the time, positioning errors can be reduced and positioning accuracy of the chip can be improved.
The above details the structure of the chip mounting system provided by the embodiment of the present invention, and correspondingly, the embodiment of the present invention also provides a chip forward mounting method and a chip flip mounting method implemented by using the chip mounting system.
The flip chip mounting method provided by the embodiment of the invention comprises the following steps:
s1, adjusting the initial position of a wafer film through the cooperation of the wafer moving mechanism and the wafer recognition camera, so that the current chip to be mounted on the wafer film moves to be coaxial with the ejector pin mechanism.
S2, the ejector pin mechanism pushes up the current chip to be mounted upwards, so that the current chip to be mounted is separated from the wafer film.
S3, the flip-chip mechanism picks up the current chip to be mounted and turns over 180 degrees, so that the back surface of the current chip to be mounted faces upwards.
S4, driving the mounting mechanism to move to the upper side of the flip mechanism through the two-dimensional moving mechanism, picking up the chip on the flip mechanism and moving to the upper side of the recognition camera of the mounting mechanism.
S5, recognizing a chip position A on the mounting mechanism through the mounting mechanism recognition camera, recognizing a to-be-mounted position B on the mounting substrate through the mounting substrate recognition camera, correcting the to-be-mounted position B according to the chip position A by the data processor, and sending the corrected to-be-mounted position to the mounting mechanism.
S6, the mounting mechanism mounts the picked chip to the corrected position to be mounted on the mounting substrate.
The chip forward mounting and mounting method provided by the embodiment of the invention comprises the following steps:
s1, adjusting the initial position of a wafer film through the cooperation of the wafer moving mechanism and the wafer recognition camera, so that the current chip to be mounted on the wafer film moves to be coaxial with the ejector pin mechanism.
S2, the ejector pin mechanism pushes up the current chip to be mounted upwards, so that the current chip to be mounted is separated from the wafer film.
S3, the flip-chip mechanism picks up the current chip to be mounted and turns over 180 degrees, so that the back surface of the current chip to be mounted faces upwards.
S4, the positive mounting mechanism moves to the upper side of the flip-chip mechanism, picks up the chip on the flip-chip mechanism and turns over 180 degrees, so that the front side of the chip faces upwards.
S5, driving the mounting mechanism to move to the upper side of the normal mounting mechanism through the two-dimensional moving mechanism, picking up the chip on the normal mounting mechanism, and moving to the upper side of the recognition camera of the mounting mechanism.
S6, recognizing a chip position A on the mounting mechanism through the mounting mechanism and recognizing a to-be-mounted position B on the mounting substrate through the mounting substrate recognition camera, correcting the to-be-mounted position B according to the chip position A by the data processor, and sending the corrected to-be-mounted position to the mounting mechanism;
S7, the mounting mechanism mounts the picked chip to the corrected position to be mounted on the mounting substrate.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
The above embodiments of the present invention do not limit the scope of the present invention. Any of various other corresponding changes and modifications made according to the technical idea of the present invention should be included in the scope of the claims of the present invention.
Claims (4)
1. A chip mounting system, comprising:
The wafer film is provided with a chip, and the front side of the chip faces upwards;
The wafer moving mechanism is used for driving the wafer film to move and adjusting the initial position and angle of the wafer film;
the ejector pin mechanism is positioned below the wafer film and used for ejecting the chip upwards to separate the chip from the wafer film;
The wafer recognition camera is positioned above the thimble mechanism, the center of the wafer recognition camera and the center of the thimble mechanism form a straight line in the Z direction, and the wafer recognition camera is used for recognizing and positioning the position of the chip;
a mounting substrate, which is positioned above the wafer recognition camera and is used as a mounting target of the chip on the wafer film;
the mounting device comprises at least one set of mounting devices, wherein each set of mounting device comprises a normal mounting mechanism, a flip mounting mechanism, a two-dimensional moving mechanism, a mounting mechanism identification camera, a mounting substrate identification camera and a data processor; wherein,
The flip-chip mechanism is used for picking up the chip separated from the wafer film and driving the chip to flip 180 degrees so that the back surface of the chip faces upwards;
The positive mounting mechanism is positioned above the flip-chip mechanism and is used for picking up the chip on the flip-chip mechanism and driving the chip to turn over 180 degrees so that the right side of the chip faces upwards;
The mounting mechanism is arranged on the two-dimensional moving mechanism, and is used for picking up the chip on the flip mechanism or the normal mounting mechanism under the drive of the two-dimensional moving mechanism and moving to the position above the recognition camera of the mounting mechanism;
The mounting mechanism identification camera is used for identifying a chip position A on the mounting mechanism;
the mounting substrate recognition camera is used for recognizing a position B to be mounted on the mounting substrate;
The data processor is used for correcting the position B to be mounted according to the chip position A, and sending the corrected position to the mounting mechanism, and the mounting mechanism mounts the picked chip to the corrected position on the mounting substrate;
The two-dimensional moving mechanism comprises a first horizontal direction linear module, a second horizontal direction linear module and a vertical direction linear module, wherein two ends of the vertical direction linear module are fixedly connected with the modules of the first horizontal direction linear module and the second horizontal direction linear module, and the mounting mechanism is fixed on a sliding block of the vertical direction linear module.
2. The chip mounting system of claim 1 wherein the number of mounting devices is two.
3. A flip chip mounting method implemented by the chip mounting system of claim 1, comprising the steps of:
s1, adjusting the initial position of a wafer film through the cooperation of a wafer moving mechanism and a wafer identification camera, so that a chip to be mounted currently on the wafer film moves to be coaxial with a thimble mechanism;
S2, the thimble mechanism jacks up the current chip to be mounted upwards, so that the current chip to be mounted is separated from the wafer film;
S3, the flip-chip mechanism picks up the current chip to be mounted and turns over 180 degrees, so that the back surface of the current chip to be mounted faces upwards;
s4, driving the mounting mechanism to move to the upper side of the flip mechanism through the two-dimensional moving mechanism, picking up the chip on the flip mechanism, and moving to the upper side of the recognition camera of the mounting mechanism;
s5, recognizing a chip position A on the mounting mechanism through the mounting mechanism recognition camera, recognizing a to-be-mounted position B on the mounting substrate through the mounting substrate recognition camera, correcting the to-be-mounted position B according to the chip position A by the data processor, and sending the corrected to-be-mounted position to the mounting mechanism;
S6, the mounting mechanism mounts the picked chip to the corrected position to be mounted on the mounting substrate.
4. A chip normal mounting method implemented by the chip mounting system according to claim 1, comprising the steps of:
s1, adjusting the initial position of a wafer film through the cooperation of a wafer moving mechanism and a wafer identification camera, so that a chip to be mounted currently on the wafer film moves to be coaxial with a thimble mechanism;
S2, the thimble mechanism jacks up the current chip to be mounted upwards, so that the current chip to be mounted is separated from the wafer film;
S3, the flip-chip mechanism picks up the current chip to be mounted and turns over 180 degrees, so that the back surface of the current chip to be mounted faces upwards;
S4, the normal mounting mechanism moves to the upper side of the flip mechanism, picks up the chip on the flip mechanism and turns over 180 degrees to enable the front side of the chip to face upwards;
s5, driving the mounting mechanism to move to the position above the normal mounting mechanism through the two-dimensional moving mechanism, picking up the chip on the normal mounting mechanism, and moving to the position above the recognition camera of the mounting mechanism;
S6, recognizing a chip position A on the mounting mechanism through the mounting mechanism recognition camera, recognizing a to-be-mounted position B on the mounting substrate through the mounting substrate recognition camera, correcting the to-be-mounted position B according to the chip position A by the data processor, and sending the corrected to-be-mounted position to the mounting mechanism;
and S7, the mounting mechanism mounts the picked chip to the corrected position to be mounted on the mounting substrate.
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| CN202211474992.2A CN115831815B (en) | 2022-11-23 | 2022-11-23 | Chip mounting system and mounting method thereof |
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| CN117393655B (en) * | 2023-12-08 | 2024-02-20 | 苏州易缆微光电技术有限公司 | High-precision mounting method and system for silicon optical chip and active device |
| CN117594519B (en) * | 2024-01-18 | 2024-04-02 | 东莞触点智能装备有限公司 | Chip high-precision die bonder and ultrathin chip nondestructive jacking method thereof |
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| JP2015076411A (en) * | 2013-10-04 | 2015-04-20 | 株式会社日立ハイテクインスツルメンツ | Die bonder |
| CN113035719B (en) * | 2021-02-25 | 2023-03-24 | 东莞普莱信智能技术有限公司 | Chip mounting method and device |
| CN113035745B (en) * | 2021-02-25 | 2022-03-18 | 东莞普莱信智能技术有限公司 | Chip mounting device |
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| CN101794009A (en) * | 2010-03-23 | 2010-08-04 | 哈尔滨工业大学 | Chip image collecting and locating device based on rotary reflector |
| CN108155124A (en) * | 2017-12-25 | 2018-06-12 | 北京中电科电子装备有限公司 | A kind of chip attachment device and method |
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