CN115823916A

CN115823916A - Heat pipe radiator for reducing thermal contact resistance of evaporation surface

Info

Publication number: CN115823916A
Application number: CN202211413610.5A
Authority: CN
Inventors: 童保健
Original assignee: Huajing Micro Nano Technology Suzhou Co ltd
Current assignee: Huajing Micro Nano Technology Suzhou Co ltd
Priority date: 2022-11-11
Filing date: 2022-11-11
Publication date: 2023-03-21

Abstract

The invention discloses a heat pipe radiator for reducing thermal contact resistance of an evaporation surface. The heat pipe radiator comprises a micro-channel parallel pipe which is in a snake shape and is connected end to end, a fan, a plurality of fins and an air channel, wherein a working medium is filled in the micro-channel parallel pipe, the fan, the fins and the air channel are all located at one end of the micro-channel parallel pipe, and the other end of the micro-channel parallel pipe is turned by 90 degrees and can be in direct contact with a heat source. The heat pipe radiator for reducing the thermal contact resistance of the evaporation surface is arranged by overturning the evaporation section of the parallel pipe of the micro-channel, so that the evaporation section can be directly contacted with a heat source, thereby saving a heat-conducting medium, reducing the influence of the heat-conducting medium, improving the heat transfer efficiency and reducing the cost.

Description

Heat pipe radiator for reducing thermal contact resistance of evaporation surface

Technical Field

The invention relates to the field of radiators, in particular to a heat pipe radiator for reducing thermal contact resistance of an evaporation surface.

Background

The radiator is an indispensable important component in the cooling system, and functions as a heat exchange device for dissipating the heat absorbed by the product into the air under the action of external forced airflow through secondary heat exchange of the redundant heat passing through the heat source. Therefore, the performance of the radiator in the cooling system directly affects the heat dissipation effect, the economical efficiency and the reliability of the product, and even the normal work problem. With the continuous development of the radiator industry, people pay more attention to the research of the radiator, and new technology and new materials are continuously emerging. The radiator product has the advantages of light weight, high reliability, low price, environmental protection in production and the like.

The main structure of the existing radiator is a heat pipe formed by parallel micro-channels filled with media, the heat pipe is divided into an evaporation section and a condensation section, the evaporation section is connected with a heat source through a heat-conducting medium, and the condensation section is provided with related heat-radiating equipment, so that heat of the heat source is diffused by the heat-radiating equipment at the condensation section after passing through the heat-conducting medium and the evaporation section of the heat pipe. The heat conducting medium is generally a metal block convenient for heat dissipation, such as an aluminum block, which not only affects the heat transfer efficiency and reduces the effect of the heat sink, but also is expensive.

Disclosure of Invention

In order to solve the problems, the invention provides a heat pipe radiator for reducing the contact thermal resistance of an evaporation surface.

According to one aspect of the invention, a heat pipe radiator for reducing thermal contact resistance of an evaporation surface is provided, which comprises a micro-channel parallel pipe, a fan, a plurality of fins and an air channel, wherein the micro-channel parallel pipe is in a serpentine shape and is connected end to end, the micro-channel parallel pipe is internally filled with a working medium, the fan, the fins and the air channel are all positioned at one end of the micro-channel parallel pipe, and the other end of the micro-channel parallel pipe is turned by 90 degrees and can be directly contacted with a heat source.

The heat pipe radiator for reducing the thermal contact resistance of the evaporation surface is arranged by overturning the evaporation section of the parallel pipe of the micro-channel, so that the evaporation section can be directly contacted with a heat source, thereby saving a heat-conducting medium, reducing the influence of the heat-conducting medium, improving the heat transfer efficiency and reducing the cost.

In some embodiments, the microchannel parallel tubes make multiple 180 ° bends and are connected end to end. It is beneficial to describe a specific structure of the parallel tubes of the microchannel, which can be bent many times to form a larger area.

In some embodiments, the largest faces of the bends at one end of the microchannel parallel channel turns are juxtaposed and together are in direct contact with the heat source. It is beneficial to further describe the specific structure of the microchannel parallel tube evaporation section, and the largest surface formed by bending and turning is in direct contact with a heat source.

In some embodiments, each of the fins is located between each bend of the parallel tubes of the microchannel and is located inside the air channel, and the fan is mounted on the side of the air channel. The condenser has the advantages that the specific positions of the fins, the fan and the air duct are described, and the end channels of the parallel tubes of the micro-channels are matched to form a condensation section.

In some embodiments, the inner cross-sectional aperture of the parallel tubes of the microchannel is square, rectangular, circular, triangular or trapezoidal. It is advantageous to describe various suitable shapes of the parallel channels of the microchannel.

In some embodiments, the equivalent diameter of the inner cross-sectional hole of the parallel tube of the microchannel is 0.3mm to 3mm. It is advantageous to describe a suitable dimension of the parallel channels of the microchannel, preferably 1.2mm.

In some embodiments, the working medium is water, ethanol, acetone, ammonia, and freon. It is advantageous to describe the type of working medium, wherein the working medium is selected as R134a depending on compatibility.

In some embodiments, the working medium has a liquid charge of generally 30% to 80% of the internal volume of the parallel channels of the microchannel. It is advantageous to describe the charge of the working medium, preferably 65%.

Drawings

FIG. 1 is a first schematic structural diagram of a heat pipe heat sink with reduced evaporation surface contact thermal resistance according to an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view of the heat pipe heat sink with reduced thermal contact resistance of the evaporation surface shown in FIG. 2;

fig. 3 is a second schematic structural diagram of the heat pipe radiator shown in fig. 1 for reducing thermal contact resistance of the evaporation surface.

In the figure: the device comprises a micro-channel parallel pipe 1, a fan 2, fins 3, an air duct 4 and a heat source 5.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

Fig. 1 schematically shows a structure of one angle of a heat pipe radiator for reducing thermal contact resistance of an evaporation surface according to an embodiment of the present invention, fig. 2 shows a cross-sectional structure of the heat pipe radiator for reducing thermal contact resistance of an evaporation surface in fig. 1 at the angle, and fig. 3 shows another angle structure of the heat pipe radiator for reducing thermal contact resistance of an evaporation surface in fig. 1. As shown in fig. 1-3, the heatpipe radiator comprises a microchannel parallel tube 1, a fan 2, a plurality of fins 3, and a duct 4. The parallel pipe 1 of the micro-channel is in a snake shape and is bent for multiple times by 180 degrees, the whole pipe has a larger side area, and the pipe wall of the parallel pipe is made of aluminum alloy.

The interior of the microchannel parallel tube 1 is filled with a flowable working medium after being vacuumized, and then a heat pipe is formed after sealing. Wherein the microchannel parallel tubes 1 can be arranged end to end in a suitable manner in the prior art and can simultaneously ensure smooth filling of working medium and the like.

Preferably, the inner cross-sectional hole of the microchannel parallel channel 1 is in a polygonal shape such as a square, rectangle, circle, triangle or trapezoid, and the equivalent diameter thereof is generally between 0.3mm and 3mm. In this embodiment, however, it is preferable to take the form of a square of the inner cross-sectional hole of the microchannel parallel channel 1, the equivalent diameter of which is 1.2mm.

The working medium is selected from water, ethanol, acetone, ammonia, freon and the like according to the situation, and the liquid filling amount is 30-80% of the internal volume of the microchannel parallel tube 1. In this embodiment, the working medium is selected to be R134a and the charge is 65% depending on compatibility.

The fan 2, each fin 3 and the air channel 4 are located at one end (which end may be called a condensation section) of the heat pipe formed by the microchannel parallel tubes 1, wherein each fin 3 is located between each bend of the microchannel parallel tubes 1, each fin 3 is located inside the air channel 4, and the fan 2 is installed at one side of the air channel 4.

Preferably, a plurality of fans 2 may be provided, and the fans 2 may be mounted on a plurality of sides of the air passage 4, respectively.

At the other end of the heat pipe (which end may be called the evaporation section), the bends of the microchannel parallel pipe 1 are all turned by 90 ° at the end, and the largest faces of the bends are arranged in parallel, and when the heat source 5 is arranged, the largest faces of the bends are in direct contact with the heat source 5 together.

Preferably, when the size is appropriate, each of the plurality of heat sources 5 may be in direct contact with the maximum surface of each bend.

The heat generated by the heat source 5 flows from the evaporation section to the condensation section through the heat pipe, and then is driven to each fin 3, namely, is positioned in the air channel 4, and then the fan 2 provides flowing air to diffuse the heat from the air channel 4.

What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.

Claims

1. A heat pipe radiator for reducing thermal contact resistance of an evaporation surface is characterized in that: the heat exchanger comprises a micro-channel parallel pipe (1) which is in a snake shape and is connected end to end, a fan (2), a plurality of fins (3) and an air duct (4), wherein a working medium is filled in the micro-channel parallel pipe (1), the fan (2), the fins (3) and the air duct (4) are located at one end of the micro-channel parallel pipe (1), and the other end of the micro-channel parallel pipe (1) is overturned by 90 degrees and can be in direct contact with a heat source (5).

2. A heat pipe radiator for reducing thermal contact resistance of evaporation surfaces as defined in claim 1, wherein: the microchannel parallel tubes (1) are bent for multiple 180 degrees and are connected end to end.

3. A heat pipe radiator for reducing evaporative surface contact resistance as defined in claim 2, wherein: the largest faces of the bends at the overturned end of the microchannel parallel tubes (1) are arranged in parallel and are in direct contact with the heat source (5).

4. A heat pipe radiator for reducing evaporative surface contact resistance as defined in claim 2, wherein: each fin (3) is positioned between each bend of the parallel pipes (1) of the micro-channel and is positioned in the air channel (4), and the fan (2) is arranged on the side surface of the air channel (4).

5. A heat pipe radiator for reducing thermal contact resistance of evaporation surfaces as defined in claim 1, wherein: the inner section hole of the micro-channel parallel pipe (1) is square, rectangular, circular, triangular or trapezoidal.

6. A heat pipe radiator for reducing evaporative surface contact resistance as defined in claim 1, wherein: the equivalent diameter of the inner section hole of the micro-channel parallel pipe (1) is 0.3 mm-3 mm.

7. A heat pipe radiator for reducing thermal contact resistance of evaporation surfaces as defined in claim 1, wherein: the working medium is water, ethanol, acetone, ammonia and Freon.

8. A heat pipe radiator for reducing evaporative surface contact resistance as defined in claim 1, wherein: the liquid filling amount of the working medium is 30-80% of the internal volume of the microchannel parallel tube (1).