CN115798781A - LTCC conductive silver paste and preparation method thereof - Google Patents
LTCC conductive silver paste and preparation method thereof Download PDFInfo
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- CN115798781A CN115798781A CN202210183485.7A CN202210183485A CN115798781A CN 115798781 A CN115798781 A CN 115798781A CN 202210183485 A CN202210183485 A CN 202210183485A CN 115798781 A CN115798781 A CN 115798781A
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 61
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 239000011521 glass Substances 0.000 claims abstract description 49
- 239000000843 powder Substances 0.000 claims abstract description 31
- 239000000654 additive Substances 0.000 claims abstract description 11
- 230000000996 additive effect Effects 0.000 claims abstract description 11
- 239000002904 solvent Substances 0.000 claims abstract description 9
- 239000004014 plasticizer Substances 0.000 claims abstract description 7
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 7
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 5
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000012634 fragment Substances 0.000 claims description 18
- 238000000227 grinding Methods 0.000 claims description 14
- 239000002994 raw material Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 9
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical group CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000155 melt Substances 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 6
- 239000005751 Copper oxide Substances 0.000 claims description 6
- 239000001856 Ethyl cellulose Substances 0.000 claims description 6
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 6
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 6
- 239000005347 annealed glass Substances 0.000 claims description 6
- 229910000431 copper oxide Inorganic materials 0.000 claims description 6
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 6
- 229920001249 ethyl cellulose Polymers 0.000 claims description 6
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 229940116411 terpineol Drugs 0.000 claims description 6
- 238000005303 weighing Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 239000004952 Polyamide Substances 0.000 claims description 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- -1 alcohol ester Chemical class 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 238000007873 sieving Methods 0.000 claims description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 3
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000004031 devitrification Methods 0.000 claims description 3
- 238000010791 quenching Methods 0.000 claims description 3
- 230000000171 quenching effect Effects 0.000 claims description 3
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 2
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 abstract description 16
- 229910052709 silver Inorganic materials 0.000 abstract description 8
- 239000004332 silver Substances 0.000 abstract description 8
- 238000010344 co-firing Methods 0.000 abstract description 7
- 239000000047 product Substances 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- 239000005337 ground glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000011534 incubation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention provides LTCC conductive silver paste and a preparation method thereof, which can solve the technical problem that the dielectric loss of an LTCC device is improved because glass components in the conductive silver paste are turned to LTCC green ceramics. An LTCC conductive silver paste is characterized in that: the LTCC conductive silver paste comprises, by weight, 75-85 parts of silver powder, 0.3-1 part of glass powder, 2-5 parts of an organic carrier, 1-20 parts of a solvent, 0.1-1 part of an inorganic additive, 0.1-2 parts of a plasticizer and 0.1-2 parts of a thixotropic agent, wherein the glass powder does not contain lead and bismuth. Compared with the traditional silver paste, the dielectric loss of the LTCC device prepared by co-firing the LTCC conductive silver paste is reduced by 0-20% in the range from 1.5GHz to 2GHz, the reduction range of the dielectric loss is gradually increased, and the reduction range of the dielectric loss reaches 20% in 2 GHz.
Description
Technical Field
The invention relates to the technical field of LTCC (Low temperature Co-fired ceramic), in particular to LTCC conductive silver paste and a preparation method thereof.
Background
Low temperature co-fired ceramic (LTCC) is a low temperature sintered ceramic powder made into a green tape with precise and compact thickness, required circuit patterns are made on the green tape by using the processes of laser drilling, micropore grouting, conductive silver paste printing and the like, a plurality of passive components are embedded into a multilayer ceramic substrate, then the passive components are laminated together and sintered at 900 ℃ to make a high-density circuit without mutual interference in three-dimensional space, also a three-dimensional circuit substrate with built-in passive elements can be made, and an IC and an active device can be pasted on the surface of the three-dimensional circuit substrate to make a passive/active integrated functional module.
LTCC technology has found widespread applications in wireless communications, resonators, bluetooth modules, and Ghz frequency encapsulated integrated circuits. LTCC devices must have low dielectric loss, high thermal conductivity for heat dissipation, and near zero resonant frequency temperature to ensure thermal stability if they are to operate in the high frequency range. Therefore, how to reduce the dielectric loss of the LTCC device is one of the technical problems to be solved urgently in the industry.
The applicant finds that the compactness of the LTCC green ceramic is poor, and in the sintering process, the glass component in the silver paste permeates into the LTCC green ceramic, so that the composition of a ceramic matrix is changed, and the dielectric loss of an LTCC device is improved.
Disclosure of Invention
The invention provides LTCC conductive silver paste and a preparation method thereof, which can solve the technical problem that the dielectric loss of an LTCC device is improved because glass components in the conductive silver paste are turned into LTCC green porcelain.
The technical scheme is that the LTCC conductive silver paste comprises the following raw materials, by weight, 75-85 parts of silver powder, 0.3-1 part of glass powder, 2-5 parts of an organic carrier, 1-20 parts of a solvent, 0.1-1 part of an inorganic additive, 0.1-2 parts of a plasticizer and 0.1-2 parts of a thixotropic agent; the glass powder is free of lead and bismuth.
Further, the silver powder is 78-82 parts by weight, and preferably 80 parts by weight.
Further, the glass powder is 10Li 2 O-20B 2 O 3 -50SiO 2 -15Al 2 O 3 -5TiO 2 The devitrified glass is glass powder.
Further, the organic carrier is one or a combination of more than two of ethyl cellulose, rosin ester and acrylic resin.
Further, the organic carrier is ethyl cellulose, and the weight part is 3.5 parts.
Further, the solvent is one or a combination of more than two of diethylene glycol ethyl ether, diethylene glycol butyl ether acetate, diethylene glycol ethyl ether acetate, terpineol, alcohol ester twelve and alcohol ester sixteen.
Furthermore, the solvent is terpineol, and the weight part is 15 parts.
Further, the inorganic additive is one or the combination of more than two of magnesium oxide, titanium dioxide, copper oxide, zinc oxide and aluminum oxide.
Furthermore, the inorganic additive is copper oxide, and the weight part is 0.5 part.
Furthermore, the plasticizer is tributyl citrate 0.5 part by weight, and the thixotropic agent is polyamide wax 0.5 part by weight.
Further, the silver powder is spherical and has a particle diameter of 0.5 to 2.6. Mu.m, preferably 1.5. Mu.m.
Further, the particle size of the glass powder is 0.5-1.5 μm, and the preferred particle size is 1 μm.
Further, the particle size of the inorganic additive is 0.15 to 0.35. Mu.m, preferably 0.25. Mu.m.
The invention also provides a preparation method of the LTCC conductive silver paste, which is characterized by comprising the following steps: weighing the silver powder, the glass powder, the organic carrier, the solvent, the inorganic additive, the plasticizer and the thixotropic agent according to the proportion, mixing, and grinding the mixed material to obtain the LTCC conductive silver paste with the material fineness of less than 10 microns.
10Li of embodiment of the invention 2 O-20B 2 O 3 -50SiO 2 -15Al 2 O 3 -5TiO 2 The preparation method of the devitrified glass powder comprises the following steps:
(1) Weighing Li in a molar percentage of 10% of the following raw materials 2 CO 3 20% of H 3 BO 3 50% SiO 2 15% of Al 2 O 3 And 5% TiO 2 Mixing to obtain mixed raw materials;
(2) Heating the mixture to 1250-1300 ℃, and preserving heat for 30-40 min to obtain a melt;
(3) And (2) quenching the melt to obtain glass fragments, heating the glass fragments to 430-470 ℃, preserving the heat for 90-150 min, cooling to obtain the annealed glass fragments, placing the annealed glass fragments in a grinding machine, grinding by taking water as a grinding medium, sieving by a mesh screen, and drying to obtain the target glass powder.
After the LTCC conductive silver paste is co-fired with LTCC green ceramic, an inner electrode with a clear interface and thick lines can be formed, and the permeation of glass components in the conductive silver paste into the LTCC green ceramic is reduced, compared with the traditional silver paste, the LTCC device prepared by co-firing the LTCC conductive silver paste has the advantages that the dielectric loss of the LTCC device in the range of 1.5GHz to 2GHz is reduced by 0-20%, the reduction range of the dielectric loss is gradually increased, the reduction range of 2GHz reaches 20%, and when the dielectric loss of 1700MHz is reduced by 8.34%.
Drawings
Fig. 1 is an optical microscope observation photograph of the traditional bismuth glass adopted conductive silver paste and LTCC green ceramic after co-firing, wherein the magnification is 62 times.
FIG. 2 is an optical microscope observation photograph of the co-fired conductive silver paste and LTCC green ceramic of the present invention, with a magnification of 62 times.
Fig. 3 shows the insertion loss of the balun product made from the conductive silver paste of the present invention and the balun product made from the conventional bismuth-containing silver paste at different frequencies.
Fig. 4 is a diagram illustrating a predetermined shape of an inner electrode according to an embodiment of the present invention.
Detailed Description
Examples
An LTCC conductive silver paste comprises the following raw materials in parts by weight:
80 parts of silver powder with the particle size of 1.5 mu m;
10Li 2 O-20B 2 O 3 -50SiO 2 -15Al 2 O 3 -5TiO 2 1.5 parts of devitrification glass system glass powder, the grain diameter is 1 mu m;
3.5 parts of ethyl cellulose (available from Ashland, type Aqualon);
15 parts of terpineol;
0.5 part of copper oxide with the particle size of 0.25 mu m;
0.5 part of tributyl citrate;
0.5 part of polyamide wax (from Baisheng Fine chemicals, inc. of Jiangxi, model number BS 8155).
The LTCC conductive silver paste is prepared by the following method, the silver powder, the glass powder, the ethyl cellulose, the terpineol, the copper oxide, the tributyl citrate and the polyamide wax in the proportion are mixed in a stainless steel tank, and the mixed materials are premixed by a high-speed dispersion machine at 800 revolutions per minute for 5 min; and (3) continuously rolling the premixed slurry for 5 times by using a three-roll grinder to enable the fineness of the slurry to reach below 10um, so as to obtain the LTCC conductive silver paste.
Control group
The conductive silver paste adopted by the contrast group is different from the conductive silver paste of the application only in glass powder, and the glass powder of the contrast group is self-made 10Li 2 O-25B 2 O 3 -30SiO 2 -35Bi 2 O 3 。
The conductive silver paste prepared in the embodiment and the conductive silver paste of a comparison group are co-fired with LTCC (LTCC is Dupont9KC green ceramic purchased from DuPont) by the same process respectively, and electron microscope photos of a product after co-firing are shown in figures 1 and 2, on one hand, compared with the comparison group, the conductive silver paste of the invention has wider lines and clearer interfaces of inner electrodes formed after co-firing; on the other hand, in the comparison group, referring to fig. 1, as the glass component in the silver paste permeates into the LTCC green ceramic, the corners of the head and the root of the inner electrode tend to be rounded, while the right-angled shapes of the corners of the head and the root of the inner electrode are obvious, and meanwhile, the width and the length of the transverse part of the root of the inner electrode are superior to those of the comparison group.
The balun product prepared from the conductive silver paste prepared in this example (1.
The glass powder of the contrast group is self-made 10Li 2 O-25B 2 O 3 -30SiO 2 -35Bi 2 O 3 The preparation method comprises the following steps:
（1）weighing Li in a molar percentage of 10% of the following raw materials 2 CO 3 25% of H 3 BO 3 30% of SiO 2 And 35% of Bi 2 O 3 Mixing the raw materials by a powder grinding machine to obtain mixed raw materials;
(2) Placing the mixture into an alumina crucible, heating to 1300 ℃, preserving heat for 30min, and melting to obtain a melt;
(3) And pouring the melt into deionized water for water quenching to obtain glass fragments, placing the glass fragments into a grinder, adding zirconia balls with the mass 3 times that of the glass fragments by taking water as a grinding medium for grinding, sieving with a 400-mesh nylon sieve, and drying to obtain the glass powder.
10Li of embodiment of the invention 2 O-20B 2 O 3 -50SiO 2 -15Al 2 O 3 -5TiO 2 The preparation method of the devitrified glass powder comprises the following steps:
(1) Weighing the following raw materials in percentage by mole 10% of Li 2 CO 3 20% of H 3 BO 3 50% SiO 2 15% of Al 2 O 3 And 5% TiO 2 And mixing the raw materials by a powder grinding machine to obtain mixed raw materials;
(2) Placing the mixture into an alumina crucible, heating to 1300 ℃, and preserving heat for 30min to obtain a melt;
(3) Pouring the melt into deionized water to be quenched into glass fragments; heating the glass fragments to 450 ℃, preserving heat for 120min, and cooling to obtain annealed glass fragments; and (3) placing the annealed glass fragments in a grinder, adding zirconia balls with the mass being 3 times that of the glass fragments into the glass fragments by taking water as a grinding medium for grinding, sieving the ground glass fragments with a 400-mesh nylon sieve, and drying to obtain glass powder.
The co-firing process of the conductive silver paste and the green ceramic refers to that the LTCC green ceramic product printed with the silver paste is sintered according to the proportion of 1 o C/min heating from room temperature to 450 o C, at 450 o Incubation of C for 2 hours followed by 5 o C/min heating to 850 o C, at 850 o And C, preserving the heat for 10min to finish the co-firing.
The silver paste is printed by screen printingThe silver thick liquid is shifted to LTCC green porcelain surface to the mode, and wherein, the preset shape of inner electrode is bilateral symmetrical structure, as shown in FIG. 4, wherein unilateral L shape, unilateral L shape size as follows: l 1 =0.435mm，l 2 =1.850mm，l 3 =0.220mm，l 4 =0.290mm, and the thickness of the screen printing of the inner electrode is 16-17 μm.
Claims (10)
1. An LTCC conductive silver paste is characterized in that: the LTCC conductive silver paste comprises the following raw materials, by weight, 75-85 parts of silver powder, 0.3-1 part of glass powder, 2-5 parts of an organic carrier, 1-20 parts of a solvent, 0.1-1 part of an inorganic additive, 0.1-2 parts of a plasticizer and 0.1-2 parts of a thixotropic agent; the glass powder is free of lead and bismuth.
2. The LTCC conductive silver paste of claim 1, wherein: the glass powder is 10Li 2 O-20B 2 O 3 -50SiO 2 -15Al 2 O 3 -5TiO 2 The glass powder of the devitrification glass system,
the preparation method of the glass powder comprises the following steps:
(1) Weighing the following raw materials in percentage by mole 10% of Li 2 CO 3 20% of H 3 BO 3 50% SiO 2 15% of Al 2 O 3 And 5% TiO 2 Mixing to obtain mixed raw materials;
(2) Heating the mixture to 1250-1300 ℃, and preserving heat for 30-40 min to obtain a melt;
(3) And (2) quenching the melt to obtain glass fragments, heating the glass fragments to 430-470 ℃, preserving heat for 90-150 min, cooling to obtain the annealed glass fragments, putting the annealed glass fragments into a grinding machine, grinding by taking water as a grinding medium, sieving by using a mesh screen, and drying to obtain the target glass powder.
3. The LTCC conductive silver paste of claim 1, wherein: the organic carrier is one or the combination of more than two of ethyl cellulose, rosin ester and acrylic resin.
4. The LTCC conductive silver paste of claim 1, wherein: the solvent is one or the combination of more than two of diethylene glycol ethyl ether, diethylene glycol butyl ether acetate, diethylene glycol ethyl ether acetate, terpineol, alcohol ester twelve and alcohol ester sixteen.
5. The LTCC conductive silver paste of claim 1, wherein: the inorganic additive is one or the combination of more than two of magnesium oxide, titanium dioxide, copper oxide, zinc oxide and aluminum oxide.
6. The LTCC conductive silver paste of claim 1, wherein:
the silver powder accounts for 80 parts by weight;
the glass powder is 10Li2O-25B2O3-30SiO2-35Bi2O3 devitrification glass system glass powder, and the weight portion is 1.5 portions;
the organic carrier is ethyl cellulose, and the weight portion is 3.5 portions;
the solvent is terpineol, and the weight portion is 15 portions;
the inorganic additive is copper oxide, and the weight portion is 0.5 portion;
the plasticizer is tributyl citrate, and the weight portion is 0.5 portion;
the thixotropic agent is polyamide wax, and the weight portion is 0.5 portion.
7. The LTCC conductive silver paste of claim 1, wherein: the silver powder is spherical and has a particle size of 0.5-2.6 μm.
8. The LTCC conductive silver paste of claim 1, wherein: the grain diameter of the glass powder is 0.5-1.5 μm.
9. The LTCC conductive silver paste of claim 1, wherein: the particle size of the inorganic additive is 0.15-0.35 μm.
10. The method for preparing the LTCC conductive silver paste as claimed in any one of claims 1 to 9, is characterized in that: weighing silver powder, glass powder, an organic carrier, a solvent, an inorganic additive, a plasticizer and a thixotropic agent according to a certain proportion, mixing, and grinding the mixed materials to obtain the LTCC conductive silver paste with the material fineness of less than 10 mu m.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5766516A (en) * | 1995-03-30 | 1998-06-16 | Sumitomo Metal (Smi) Electronics Devices Inc. | Silver-based conductive paste and multilayer ceramic circuit substrate using the same |
| CN111312427A (en) * | 2020-04-17 | 2020-06-19 | 洛阳理工学院 | Silver paste for multilayer wiring for low-temperature co-fired low-dielectric-constant dielectric ceramic |
| CN111423127A (en) * | 2020-04-21 | 2020-07-17 | 北京北旭电子材料有限公司 | Preparation method of glass powder and glass powder |
| CN112614608A (en) * | 2020-12-10 | 2021-04-06 | 广东工业大学 | Low-temperature co-fired ceramic inner conductive silver paste and preparation method thereof |
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- 2022-02-28 CN CN202210183485.7A patent/CN115798781B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5766516A (en) * | 1995-03-30 | 1998-06-16 | Sumitomo Metal (Smi) Electronics Devices Inc. | Silver-based conductive paste and multilayer ceramic circuit substrate using the same |
| CN111312427A (en) * | 2020-04-17 | 2020-06-19 | 洛阳理工学院 | Silver paste for multilayer wiring for low-temperature co-fired low-dielectric-constant dielectric ceramic |
| CN111423127A (en) * | 2020-04-21 | 2020-07-17 | 北京北旭电子材料有限公司 | Preparation method of glass powder and glass powder |
| CN112614608A (en) * | 2020-12-10 | 2021-04-06 | 广东工业大学 | Low-temperature co-fired ceramic inner conductive silver paste and preparation method thereof |
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