CN115793062B

CN115793062B - Earphone in-place detection method and device

Info

Publication number: CN115793062B
Application number: CN202211183754.6A
Authority: CN
Inventors: 王斌
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2021-07-22
Filing date: 2021-07-22
Publication date: 2024-04-02
Anticipated expiration: 2041-07-22
Also published as: CN115793062A; CN116047613A; CN114488313A; CN114488313B

Abstract

The application discloses an earphone in-place detection method and device, which are applied to electronic equipment comprising an earphone seat, wherein the earphone seat comprises a DET pin, a LEFT pin, a MIC pin and a first resistor; the first end of the MIC pin is communicated with the negative electrode of the power supply voltage, the second end of the first resistor is communicated with the positive electrode of the power supply voltage, and the first end of the first resistor is communicated with the second end of the MIC pin through an MIC contact section or a GND contact section on the earphone plug when the earphone plug is inserted into the earphone seat; the method comprises the following steps: after the DET pin is communicated with the LEFT pin, a target voltage value is obtained, wherein the target voltage value is the voltage value of the first end of the first resistor; under the condition that the target voltage value is not included in the preset voltage range, determining that the earphone is out of position; or if the target voltage value is included in the preset voltage range, determining that the earphone is in place. Therefore, the problem that the terminal misjudges that the earphone is in place and the audio function of the terminal is abnormal is solved.

Description

Earphone in-place detection method and device

Technical Field

The present disclosure relates to the field of computer storage, and in particular, to a method and apparatus for detecting an earphone in place.

Background

Since the advent of wired headphones, users have become very popular with them by virtue of their advantages such as good connection stability and sound quality.

In general, after determining that the left channel pin and the detection signal pin in the earphone seat are connected, the terminal determines that the earphone is in place, and switches the audio to the earphone channel.

However, in real life, a phenomenon in which foreign matter enters the earphone seat occurs. If the foreign matter is a conductive matter, the left sound channel pin and the detection signal pin in the earphone seat are communicated, so that the terminal misjudges that the earphone is in place, and the audio is switched to the earphone passage, so that the terminal has abnormal conversation or use of audio-video functions and the like.

Disclosure of Invention

The application provides an earphone in-place detection method and device, which are used for reducing the problem that a terminal misjudges that an earphone is in place so that the terminal has abnormal audio functions.

In a first aspect, an embodiment of the present application provides a method and an apparatus for detecting an earphone in place, where the method is applied to an electronic device including an earphone seat, where the earphone seat includes a detection signal DET pin, a LEFT channel LEFT pin, a microphone MIC pin, and a first resistor; the first end of the MIC pin is communicated with the negative electrode of the power supply voltage, the second end of the first resistor is communicated with the positive electrode of the power supply voltage, and the first end of the first resistor is communicated with the second end of the MIC pin through a target contact section on an earphone plug when the earphone plug is inserted into the earphone seat, wherein the target contact section is a microphone MIC contact section or a grounding GND contact section on the earphone plug; the method comprises the following steps: after the DET pin is communicated with the LEFT pin, a target voltage value is obtained, wherein the target voltage value is the voltage value of the first end of the first resistor; determining that the earphone is out of position under the condition that the target voltage value is not included in a preset voltage range; or if the target voltage value is included in the preset voltage range, determining that the earphone is in place, wherein any voltage value in the preset voltage range is used for indicating that the first end of the first resistor is communicated with the second end of the MIC pin.

It is understood that the first end of the MIC pin in the earphone seat is connected to the negative pole of the power supply voltage, the second end of the first resistor is connected to the positive pole of the power supply voltage, and when the earphone plug is inserted into the earphone seat, the second end of the MIC pin is connected to the first end of the first resistor and the target contact section in the earphone plug. That is, when the earphone plug is inserted into the earphone seat, a loop state can be formed among the MIC pin, the first resistor and the power supply voltage, and when the earphone plug is not inserted into the earphone seat, an open circuit state is formed among the MIC pin, the first resistor and the power supply voltage. It can be appreciated that the voltage value of the first end of the first resistor in the open circuit state is different from the voltage value of the first end of the first resistor in the loop state. In the open state, the first end of the first resistor is not in communication with the second end of the MIC pin (it can also be understood that a circuit between the first end of the first resistor and the second end of the MIC pin has a break or circuit-breaking state), and the voltage value of the first end of the first resistor is equal to the voltage value of the supply voltage. In the loop state, the first resistor is a device in the loop, and the voltage value of the power supply voltage is reduced after the power supply voltage passes through the first resistor, so that the voltage value of the first end of the first resistor is smaller than that of the power supply voltage. Therefore, whether the earphone plug is inserted into the earphone seat can be determined by judging whether the voltage value of the first end of the first resistor is in a preset voltage range.

Typically, the headset is confirmed in place by determining that the innermost pin in the headset base has been contacted by the headset plug (i.e., after determining that the DET pin is in communication with the LEFT pin). However, the DET pin and the LEFT pin are communicated, which may be not only the LEFT channel LEFT contact section of the earphone plug, but also other conductive substances except the earphone plug enter the earphone seat, so that the DET pin and the LEFT pin are communicated, and the terminal misjudges that the earphone is in place.

However, by adopting the earphone in-place detection method provided by the application, after the DET pin and the LEFT pin are determined to be communicated by the primary judgment, the secondary judgment is continued to determine whether the voltage value of the first end of the first resistor is in the preset voltage range. If yes, the MIC pin of the earphone seat is indicated to be in contact with the target contact section, and the earphone plug is inserted into the earphone seat so that the DET pin and the LEFT pin of the earphone seat are communicated, and then the earphone is determined to be in place. If not, the MIC pin of the earphone seat is not contacted with the target contact section, and other conductive substances except the earphone plug enter between the DET pin and the LEFT pin, so that the DET pin is communicated with the LEFT pin, and the earphone is determined to be out of position. After the DET pin and the LEFT pin are communicated through primary detection, secondary detection is performed to determine whether an earphone plug is inserted into the earphone seat or not, so that the DET pin and the LEFT pin are communicated, the accuracy of determining that the earphone is in place by the terminal is improved, and the problem that the audio function of the terminal is abnormal due to the fact that the earphone is misjudged in place by the terminal is solved.

In one possible embodiment, any one of the voltage values in the preset voltage range is smaller than the voltage value of the supply voltage.

In the embodiment of the application, the earphone seat is an earphone seat corresponding to the four-section earphone plug. The MIC pin of the earphone seat comprises a plurality of working states. In the first state, no earphone plug is inserted into the earphone seat, and neither the second end of the MIC pin nor the first end of the first resistor is in contact with the target contact section, and the second end of the MIC pin is not communicated with the first end of the first resistor. At this time, the voltage value of the first end of the first resistor is equal to the voltage value of the power supply voltage. In the second state, the four-section earphone plug is inserted into the earphone seat, and the second end of the MIC pin is communicated with the first end of the first resistor through the MIC contact section of the four-section earphone plug, so that a passage is formed among the MIC internal resistance of the MIC pin, the first resistor and the power supply voltage. At this time, the first resistor in the circuit and the MIC internal resistance form a voltage division, the circuit voltage decreases after passing through the first resistor, and the voltage value of the first end of the first resistor is smaller than the voltage value of the supply voltage. In a third state, the three-section earphone plug is inserted into the earphone seat, the second end of the MIC pin, the first end of the first resistor and the grounding port in the earphone seat are communicated through the GND contact section of the three-section earphone plug, so that circuit voltage flows to the grounding wire of the grounding port after passing through the first resistor, the MIC contact section is short-circuited from the circuit, and a passage is formed only among the first resistor, the grounding port and the power supply voltage. At this time, the first end of the first resistor is directly grounded, so that the voltage value of the first end of the first resistor approaches 0.

In this way, in the case that the voltage value of the first resistor is equal to the voltage value of the supply voltage, it is indicated that no earphone plug is inserted into the earphone seat. In case the voltage value of the first resistor is smaller than the voltage value of the supply voltage, it is indicated that a four-segment earphone plug or a three-segment earphone plug is inserted into the earphone seat.

It can be understood that, firstly, the boundary voltage value used for distinguishing whether the three-section earphone is inserted into the earphone seat or the four-section earphone is inserted into the earphone seat is often not a very stable and constant value due to the influence of factors such as a certain internal resistance of a wire in the circuit, the incomplete conformity of the resistance value of a resistance device with the specification, the environmental temperature and the like. If a voltage range with a fixed boundary voltage value is used to distinguish whether a three-segment earphone plug or a four-segment earphone plug is in place, the type of the in-place earphone is often misjudged. Secondly, the three-section earphone plug has not been widely produced and used because of the lack of a microphone function, that is, the probability of inserting the three-section earphone plug into an earphone seat matched with the four-section earphone plug is small, the preset voltage range is set to be a voltage value smaller than the power supply voltage, and the probability of misjudging the type of the in-place earphone is small. Therefore, the preset voltage range is set to be smaller than the voltage value of the power supply voltage, and when the target voltage value is smaller than the voltage value of the power supply voltage, the earphone is determined to be in place, so that the problem that the function of the earphone part cannot be normally used due to misjudgment of the type of the in-place earphone can be reduced. Thirdly, the accurate boundary voltage value is required to be searched for acquiring enough experimental data, so that the analysis of the experimental data and the like can bring a lot of performance loss to the electronic equipment, and simultaneously, larger workload can be brought to a developer.

In one possible embodiment, the target contact segment is a MIC contact segment in a four-segment earphone plug, or a GND contact segment in a three-segment earphone plug; the preset voltage range comprises a first preset voltage range and a second preset voltage range, the voltage values in the second preset voltage range are all larger than or equal to 0 and smaller than a first voltage value, the voltage values in the first preset voltage range are all larger than or equal to the first voltage value and smaller than or equal to a second voltage value, and the second voltage value is smaller than the voltage value of the power supply voltage; any one voltage value in the first preset voltage range is used for indicating that the first end of the first resistor is communicated with the second end of the MIC pin through the MIC contact section in the four-section earphone plug, and any one voltage value in the second preset voltage range is used for indicating that the first end of the first resistor is communicated with the second end of the MIC pin through the GND contact section in the three-section earphone plug.

It will be appreciated that in the second state of the MIC pin, the GND contact will short the MIC internal resistor of the MIC pin from the circuit, the first end of the first resistor being directly grounded, and ideally the voltage value of the first resistor should be 0. However, in reality, due to factors such as a certain internal resistance of the conductive wire (for example, the internal resistance of the conductive wire between the first end of the first resistor and the negative electrode of the power supply voltage, so that a potential difference is formed between the first end of the first resistor and the negative electrode of the power supply voltage), the voltage value of the first end of the first resistor is not equal to 0. Similarly, when the MIC pin is in the first state, the MIC internal resistance and the first resistor form a voltage division, and the voltage value obtained by the voltage division of the first resistor is not a fixed voltage value but is contained in a certain voltage range because the problems that the lead has a certain internal resistance, the resistance value of the resistor device is not completely consistent with specification specifications, the ambient temperature and the like exist. Therefore, the state of the MIC pin can be determined through the first preset voltage range and the second preset voltage range. The voltage value of the power supply voltage is 1.8v, and when the MIC pin is in the second state, the voltage value of the first end of the first resistor is greater than or equal to 0 and less than 0.4v (i.e., the first voltage value is 0.4v, and the second preset voltage range is greater than or equal to 0 and less than 0.4 v). When the MIC pin is in the first state, the voltage value of the first end of the first resistor is greater than or equal to 0.4v and less than or equal to 1.5v (i.e., the second voltage value is 1.5v, and the first preset voltage range is greater than or equal to 0.4v and less than or equal to 1.5 v).

It can be understood that the boundary voltage values of the first preset voltage range and the second preset voltage range can be obtained by collecting a plurality of sample data and analyzing the sample data.

In this application embodiment, under the condition that the boundary voltage value of this first preset voltage range and second preset voltage range possesses certain degree of accuracy, adopt this first preset voltage range and second preset voltage range to distinguish that the earphone in place is four segmentation earphone plugs or syllogic earphone plugs, but as long as have earphone to insert just confirm to be four segmentation earphone in place, can effectively avoid misjudgement in place earphone type and lead to the problem that some functions of earphone plug can't normally use, reduce the function procedure leak, improve user experience sense.

In another possible embodiment, the target contact segment is a MIC contact segment in a four-segment earphone plug, or a GND contact segment in a three-segment earphone plug; the preset voltage range comprises a first preset voltage range and a second preset voltage range, the voltage values in the second preset voltage range are all larger than or equal to 0 and smaller than a first voltage value, and the voltage values in the first preset voltage range are all larger than or equal to the first voltage value and smaller than the voltage value of the power supply voltage; any one voltage value in the first preset voltage range is used for indicating that the first end of the first resistor is communicated with the second end of the MIC pin through the MIC contact section in the four-section earphone plug, and any one voltage value in the second preset voltage range is used for indicating that the first end of the first resistor is communicated with the second end of the MIC pin through the GND contact section in the three-section earphone plug.

It can be appreciated that, on the one hand, the maximum boundary voltage value of the first preset voltage range is determined to be smaller than the voltage value of the supply voltage, a fixed boundary voltage value (for example, the voltage value of the supply voltage is 1.8v, the first preset voltage range is greater than or equal to 0.4 and smaller than 1.8v, and the maximum boundary voltage value of the first preset voltage range is not determined any more, for example, 1.5 v) may not be required, which may effectively avoid the problem that the earphone is not in place due to inaccuracy of the boundary voltage value. On the other hand, experimental data analysis and the like for searching accurate boundary values can bring a lot of performance loss to the electronic equipment, and simultaneously can bring a large workload to a developer, so that the boundary voltage value is reduced, the performance loss of the electronic equipment can be effectively reduced, and the workload of the developer is reduced.

In a possible implementation manner, the earphone is determined to be out of position in the case that the target voltage value is not included in a preset voltage range; or, if the target voltage value is included in the preset voltage range, determining that the earphone is in place includes: determining that the earphone is out of place if the target voltage value is determined to be not included in the first preset voltage range and not included in the second preset voltage range; or, if the target voltage value is determined to be included in the first preset voltage range, determining that the four-segment earphone plug is in place; or if the target voltage value is determined to be included in the second preset voltage range, determining that the three-section earphone plug is in place.

In the embodiment of the application, the first preset voltage range and the second preset voltage range are adopted to distinguish whether the in-place earphone is the four-section earphone or the three-section earphone, so that the functional program loopholes are reduced, and the user experience is improved.

In one possible implementation, after the determining that the headset is not in place, the method further includes: and outputting prompt information, wherein the prompt information is used for indicating other conductive substances except for the earphone plug to enter the earphone seat.

In the embodiment of the application, when it is determined that the target voltage value is not included in the preset voltage range, it is indicated that other conductive substances except for the earphone plug enter the earphone seat, so that the DET pin and the LEFT pin are communicated. The method can output prompt information to prompt the user that the foreign matters enter the earphone seat so that the user can timely remove the foreign matters in the earphone seat according to the prompt information. On the one hand, the operation cost caused by the fact that foreign matters exist in the earphone seat for a long time and the earphone in-place detection module in the electronic equipment is triggered to frequently execute and judge the earphone in-place program is reduced, and the performance loss of the electronic equipment is reduced. In addition, a series of problems (such as that the foreign matters occupy the positions of the DET pin and the LEFT pin of the earphone plug, so that the contact section of the earphone plug is communicated with the pins in the earphone seat in a dislocation manner and the earphone function cannot be normally used) caused when the user does not know that the foreign matters exist in the earphone seat and inserts the earphone plug into the earphone seat can be effectively prevented.

In one possible embodiment, the earphone seat further comprises a first contact and a feeder, the first contact being in communication with a first end of the first resistor, the first contact being for communication with a second end of the MIC pin through the target contact segment; the first end of the feeder line is communicated with a target detection point, the second end of the feeder line is communicated with an earphone in-place detection module for executing the earphone in-place detection method, the target detection point is any position in a circuit which is behind the first contact and in front of the first end of the first resistor, the feeder line is used for feeding back the target voltage value to the earphone in-place detection module, and the step of obtaining the target voltage value comprises the following steps: the earphone in-place detection module obtains the target voltage value through the feeder line.

In this embodiment of the present application, the target voltage value is obtained through the feeder line, and the target voltage value may be sent to the headset in-place detection module through another measurement device (for example, a voltmeter) without measuring the target voltage value through another measurement device. The earphone in-place detection module is used for uniformly acquiring the target voltage value, and the earphone in-place detection module is used for uniformly executing each step in the earphone in-place method provided by the application, so that uniform management of data and monitoring and maintenance of the data are facilitated.

In the embodiment of the present application, the above-mentioned headset in-place detection module may be a hardware component in the electronic device, where the headset in-place detection method provided in the present application may be executed. The headset presence detection module is a chip in the electronic device for executing the headset presence detection method. Alternatively, the earphone presence detection module may be a software function module provided by an existing hardware component in the electronic device and capable of executing the earphone presence detection method provided by the application. Illustratively, the headset bit detection module is an application. The specific form of the earphone in-place detection module is not limited in the embodiment of the application.

In a second aspect, an embodiment of the present application provides an in-place detecting method and apparatus for an earphone, which are applied to an electronic device including an earphone base, where the earphone base includes a detection signal DET pin, a LEFT channel LEFT pin, a microphone MIC pin, and a first resistor; the first end of the MIC pin is communicated with the negative electrode of the power supply voltage, the second end of the first resistor is communicated with the positive electrode of the power supply voltage, and the first end of the first resistor is communicated with the second end of the MIC pin through a target contact section on an earphone plug when the earphone plug is inserted into the earphone seat, wherein the target contact section is a microphone MIC contact section or a grounding GND contact section on the earphone plug; the method comprises the following steps: after the DET pin and the LEFT pin are communicated, acquiring a target noise signal through the MIC pin; determining that the earphone is out of position under the condition that the noise wavelength type of the target noise signal is not contained in the preset noise wavelength type; or if the noise wavelength type of the target noise signal is determined to be contained in the preset noise wavelength type, determining that the earphone is in place, wherein the preset noise wavelength type is used for indicating that the first end of the first resistor is communicated with the second end of the MIC pin.

It can be understood that after the four-section earphone plug is inserted into the earphone seat, the MIC pin in the earphone seat contacts with the MIC contact section in the earphone plug, and a passage is formed among the MIC internal resistance, the first resistor and the power supply voltage of the MIC pin, so that the pickup device in the MIC pin normally performs pickup to obtain the first noise signal. And transmitting the first noise signal to an earphone in-place detection module executing the method of the embodiment of the application through the MIC pin. The noise wavelength of the first noise signal obtained by the earphone in-situ detection module may be a noise wavelength type accompanied by the intensity frequency and variation of the sound wave (or may be understood as that the power fluctuation of the noise wavelength is larger).

After the three-section type earphone plug is inserted into the earphone seat, as the sound pickup device is not arranged in the three-section type earphone plug, the three-section type earphone can not transmit sound pickup results to the earphone in-place detection module through the MIC pin. However, after the three-section earphone plug is inserted into the earphone seat, the MIC pin and the GND pin of the earphone seat can be in good contact, and bottom noise exists in each device. Therefore, the earphone in-place detection module obtains a second noise signal through the MIC pin, the noise type of the second noise signal is background noise, and the noise wavelength type of the second noise signal is consistent with the noise wavelength type of the background noise.

In case that other electrically conductive substances than the earphone plug enter the earphone seat, i.e. the MIC pin is not in contact with neither the MIC contact section nor the GND contact section of the earphone plug, the internal circuit diagram of the MIC pin is open. At this time, the earphone in-place detection module obtains a third noise signal through the MIC pin, and the third noise signal is white noise with relatively uniform frequency points, relatively wider frequency amplitude and relatively lower power.

Thus, whether the earphone plug is inserted into the earphone seat can be determined by the type of noise wavelength of the above-mentioned target noise signal. For example, if the noise wavelength type of the target noise signal is identical to the noise wavelength type of the first noise signal or the second noise signal, it indicates that the earphone plug has been normally inserted into the earphone seat. If the noise wavelength type of the target noise signal is consistent with the noise wavelength type of the third noise signal, the foreign matter enters the earphone seat, and the earphone plug is not inserted into the earphone seat.

By adopting the earphone in-place detection method provided by the embodiment of the application, when the earphone in-place detection module detects that the DET pin and the LEFT pin in the earphone seat are communicated, the earphone is not immediately determined to be in place. And acquiring a target noise signal through an MIC pin in the earphone seat, and judging whether the noise wavelength type of the target noise signal is consistent with the preset noise wavelength. If yes, the MIC pin can be normally picked up or an electric signal exists on the MIC pin, the earphone plug is normally inserted into the earphone seat, and the earphone in-place detection module can determine that the earphone is in place. If not, the MIC pin is indicated to not normally pick up, and if foreign matters enter the DET pin and the LEFT pin of the earphone seat to cause the DET pin and the LEFT pin to be communicated, the earphone in-place detection module can determine that the earphone is out of place. Therefore, the in-place misjudgment of the earphone is reduced with great probability, and the abnormal use of the communication or video and audio functions of the electronic equipment is avoided.

In one possible embodiment, the predetermined noise wavelength type includes a noise wavelength type of noise other than a noise wavelength type of white noise.

It is understood that the three-section type earphone plug has been rarely widely produced and used because of the lack of a microphone function, that is, the probability of inserting the three-section type earphone plug into an earphone seat matched with the four-section type earphone plug is small, the above-mentioned preset noise wavelength type is set to a noise wavelength type including other noise than the noise wavelength type of white noise, and the probability of occurrence of erroneous judgment of the type of the in-place earphone is small. Meanwhile, only whether the noise wavelength type of the target noise signal is consistent with the noise wavelength type of the white noise is judged, and if not, the earphone is determined to be in place; if yes, the earphone is determined to be out of position. The noise wavelength type of the target noise signal is only required to be compared with the noise wavelength type of white noise once, and whether the noise wavelength type of the noise is background noise or other noise is secondary compared is not required to be judged whether the in-place earphone is a three-section earphone plug or a four-section earphone plug, so that program judgment logic is simplified, program complexity is reduced, and program reaction time is optimized.

In one possible embodiment, the target contact segment is a MIC contact segment in a four-segment earphone plug, or a GND contact segment in a three-segment earphone plug; the preset noise wavelength types comprise a first preset noise wavelength type and a second preset noise wavelength type, the second preset noise wavelength type is consistent with the noise wavelength type of the background noise, and the first preset noise wavelength type is a noise wavelength type except the noise wavelength type of the background noise and the noise wavelength type of the white noise; the first preset noise wavelength type is used for indicating that a first end of the first resistor is communicated with a second end of the MIC pin through a MIC contact section in the four-section earphone plug, and the second preset noise wavelength type is used for indicating that the first end of the first resistor is communicated with a second end of the MIC pin through a GND contact section in the three-section earphone plug.

It is understood that in the case where the noise wavelength type of the target noise signal is detected as a noise wavelength type other than white noise, the target noise signal may be the first noise signal or the second noise signal. That is, the in-place earphone may be a three-section earphone plug or a four-section earphone plug, and if the four-section earphone plug is uniformly confirmed to be inserted in place, the in-place earphone type may be misjudged. However, according to the embodiment of the application, the in-place earphone is the four-section earphone plug or the three-section earphone plug through the first preset noise wavelength type and the second preset noise wavelength type, so that the problem that the partial functions of the earphone plug cannot be normally used due to the misjudgment of the type of the in-place earphone can be effectively avoided, the functional program loopholes are reduced, and the user experience is improved.

In a possible implementation manner, in a case that the noise wavelength type of the target noise signal is determined not to be included in the preset noise wavelength type, determining that the earphone is not in place; or, in the case that the noise wavelength type of the target noise signal is determined to be included in the preset noise wavelength type, determining that the earphone is in place includes: determining that a headset is out of position if it is determined that the noise wavelength type of the target noise signal is not included in the first preset noise wavelength type and is not included in the second preset noise wavelength type; or, in the case that the noise wavelength type of the target noise signal is determined to be contained in the first preset noise wavelength type, determining that the four-section earphone is in place; or in the case that the noise wavelength type of the target noise signal is determined to be contained in the second preset noise wavelength type, determining that the three-section earphone is in place.

In the embodiment of the application, the first preset noise wavelength type and the second noise wavelength type are adopted to distinguish whether the in-place earphone is the four-section earphone or the three-section earphone, so that the functional program loophole is reduced, and the user experience sense is improved.

It can be understood that the foreign matter entering the earphone seat is prompted to the user by outputting the prompt information, so that the user can timely remove the foreign matter in the earphone seat according to the prompt information. On the one hand, the operation cost caused by the fact that foreign matters exist in the earphone seat for a long time and the earphone in-place detection module in the electronic equipment is triggered to frequently execute and judge the earphone in-place program is reduced, and the performance loss of the electronic equipment is reduced. In addition, a series of problems (such as that the foreign matters occupy the positions of the DET pin and the LEFT pin of the earphone plug, so that the contact section of the earphone plug is communicated with the pins in the earphone seat in a dislocation manner and the earphone function cannot be normally used) caused when the user does not know that the foreign matters exist in the earphone seat and inserts the earphone plug into the earphone seat can be effectively prevented.

In a third aspect, an embodiment of the present application provides an electronic device, including: one or more processors and memory; the memory is coupled with the one or more processors, the memory for storing computer program code comprising computer instructions that the one or more processors invoke the computer instructions to cause the electronic device to perform the method of the first aspect or any possible implementation of the first aspect.

In a fourth aspect, embodiments of the present application provide a chip system, where the chip system is applied to an electronic device, and the chip system includes one or more processors configured to invoke computer instructions to cause the electronic device to perform the method shown in the first aspect or any possible implementation manner of the first aspect.

In a fifth aspect, embodiments of the present application provide a computer program product comprising instructions which, when run on an electronic device, cause the electronic device to perform the method of the first aspect or any of the possible implementations of the first aspect.

In a sixth aspect, embodiments of the present application provide a computer readable storage medium comprising instructions, which when executed on an electronic device, cause the electronic device to perform the method according to the first aspect or any possible implementation manner of the first aspect.

Drawings

Fig. 1A is a schematic structural diagram of an earphone plug according to an embodiment of the present application;

fig. 1B is a schematic diagram of an internal circuit structure of an earphone seat according to an embodiment of the present application;

fig. 1C is a schematic diagram of an internal circuit of an earphone seat according to an embodiment of the present application;

Fig. 1D is a schematic diagram of communication between DET pin and LEFT pin according to an embodiment of the present application;

fig. 1E is a schematic diagram of another communication between DET pin and LEFT pin provided in an embodiment of the present application;

FIGS. 1F-1G are schematic diagrams of internal circuits providing DET pins and LEFT pins according to embodiments of the present application;

FIGS. 2A-2D are schematic views of a user interface provided in an embodiment of the present application;

fig. 3A is a flow chart of an earphone in-place detection method according to an embodiment of the present application;

fig. 3B-3D are schematic circuit diagrams according to an embodiment of the present application;

fig. 4A is a flowchart of another earphone in-place detection method according to an embodiment of the present application;

FIGS. 4B-4D are waveform diagrams provided in embodiments of the present application;

fig. 4E is a schematic diagram of an earphone in-place detection module receiving a pickup signal according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present application;

fig. 6 is a software configuration block diagram of the electronic device 100 of the embodiment of the present application.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the present application will be further described with reference to the accompanying drawings.

The terms "first" and "second" and the like in the description, claims and drawings of the present application are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprising," "including," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion. Such as a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to the list of steps or elements but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.

In the present application, "at least one (item)" means one or more, "a plurality" means two or more, and "at least two (items)" means two or three or more, and/or "for describing an association relationship of an association object, three kinds of relationships may exist, for example," a and/or B "may represent: only a, only B and both a and B are present, wherein a, B may be singular or plural. The character "/" generally indicates that the context-dependent object is an "or" relationship. "at least one of (a) or a similar expression thereof means any combination of these items. For example, at least one (one) of a, b or c may represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c".

The following detailed description refers to the terminology involved in this application.

(1) Three-section earphone plug, four-section earphone plug:

as shown in fig. 1A, the three-section earphone plug includes three contact sections, namely, a LEFT channel (LEFT) contact section, a RIGHT channel (RIGHT) contact section, and a Ground (GND) contact section, in order from the leftmost (also understood as the topmost section). The international standard four-section earphone plug comprises a LEFT sound channel (LEFT) contact section, a RIGHT sound channel (RIGHT) contact section, a Microphone (MIC) contact section and a Ground (GND) contact section in sequence from the leftmost side; the four-section earphone plug of the domestic standard is sequentially provided with a LEFT contact section, a RIGHT contact section, a GND contact section and a MIC contact section from the leftmost side. It can be understood that the four-section earphone plug divides the GND contact section of the three-section earphone plug into two contact sections, i.e. the length of the GND contact section of the three-section earphone is equal to the sum of the lengths of the GND contact section and the MIC contact section of the four-section earphone.

Alternatively, the diameter of the pin of the three-section earphone plug or the four-section earphone plug may be 2.5mm or 3.5mm, or the diameter of the pin of the three-section earphone plug or the four-section earphone plug may be other sizes, which is not limited in this embodiment of the present application.

It will be appreciated that the three-segment earphone differs from the four-segment earphone in that the four-segment earphone has an added MIC contact segment, which is a microphone (also known as a microphone), which can be used to pick up sound (collect sound signals and convert them into electrical signals).

It can be understood that the earphone plug described in the embodiments of the present application may be a three-segment earphone or a four-segment earphone, but may also be other types of earphone plugs, which are not limited in this embodiment of the present application.

(2) Circuit structure of earphone seat and related circuit diagram:

in this embodiment of the present application, a hardware configuration diagram of an earphone seat corresponding to a four-segment earphone plug is shown in fig. 1B, and includes: LEFT channel (LEFT) pin, detect signal (DET) pin, RIGHT channel (RIGHT) pin, ND/N/a pin, microphone (MIC) pin, resistor R3 (resistor R3 may also be understood as the first resistor described in other embodiments of the present application), ground (GND) pin, ground port, and earphone seat void. Wherein, this earphone empty slot is used for inserting the earphone plug. The LEFT pin and the DET pin may communicate through a LEFT contact section of the earphone plug. The MCI pin and the R3 may communicate through a MIC contact section or a GND contact section of the earphone plug. The GND pin and the ground port may communicate through a GND contact section of the earphone plug. The RIGHT pin is used for communicating with the RIGHT contact section of the earphone plug under the condition that the earphone plug is inserted into the earphone seat. The ND/N/A pin is a reserved pin, and can be used for subsequently expanding other functions of the earphone seat, such as a function pin reserved for matching new functions of the next-generation earphone plug.

It is understood that the length of the GND contact section of the three-section earphone plug is the same as the sum of the lengths of the GND contact section and the MIC contact section of the four-section earphone plug. Thus, when the three-section earphone plug is inserted into the earphone seat corresponding to the four-section earphone plug (for example, the three-section earphone plug shown in fig. 1A is inserted into the earphone seat corresponding to the four-section earphone plug shown in fig. 1B), the GND pin in the earphone seat and the GND contact section of the three-section earphone can still be normally communicated, and the three-section earphone can still be normally used. That is, the earphone seat corresponding to the four-segment earphone plug can be compatible with the three-segment earphone plug.

It can be understood that, whether the earphone socket corresponding to the four-segment earphone plug of the domestic standard is compatible with the four-segment earphone plug of the international standard, or whether the earphone socket corresponding to the four-segment earphone plug of the international standard is compatible with the four-segment earphone plug of the domestic standard is determined by the internal circuit structure of the electronic device in which the earphone socket is installed, and the embodiment of the application is not limited. For convenience of description, the embodiments of the present application will be described by taking, as an example, a headset jack compatible with a domestic standard four-segment headset plug and a domestic standard four-segment headset plug, or a headset jack compatible with an international standard four-segment headset plug and an international standard four-segment headset plug.

In the embodiment of the present application, as shown in fig. 1C, a part of an internal circuit structure diagram related to the earphone seat includes: the earphone bit detection module, the LEFT pin, the ground GND pin, the MIC pin, the DET pin, the resistor R1, the resistor R2, the signal line 101 and the power supply voltage VCC. The LEFT pin communicates with the negative pole of VCC and the DET pin communicates with the positive poles of VCC through R1.

It will be appreciated that the function of resistor R1 is to give the DET pin a stable pull-up voltage (also known as high voltage); meanwhile, the circuit is also used for avoiding that the DET pin and the VCC are directly connected through a lead, so that after the DET pin and the LEFT pin are communicated, larger current can be formed due to smaller internal resistance of the DET pin and the LEFT pin, and the device is damaged. It will be appreciated that the function of R2 on the signal line 101 is to prevent over-current, and also to prevent over-current and damage to the device when the DET pin is in communication with the headset bit detection module.

It is understood that the signal line 101 communicates with the DET pin described above, and the signal line 101 is used to detect the voltage value or voltage state of the DET pin. In the two states in which the DET pin and the LEFT pin are not connected and are connected, the voltage value or the voltage state of the DET pin changes accordingly. The headset in-place detection module may determine whether the DET pin and the LEFT pin are in communication via signal line 101.

Illustratively, the DET pin, resistors R1, VCC, and LEFT pin form a circuit diagram as shown in fig. 1F before the DET pin is not in communication with the LEFT pin. The circuit formed by the R1, DET pins and VCC can be understood as open circuit, and the electric potential before and after the R1 or at the MIC pin is equal, and the voltage at the R1 or the MIC pin is equal to the voltage value of VCC. Thus, the voltage of the DET pin is in a high voltage state.

Illustratively, after the DET pin and the LEFT pin are connected (illustratively, as shown in fig. 1E), a circuit diagram of the DET pin, resistors R1, VCC, and the LEFT pin is shown in fig. 1G. And a loop is formed among the resistor R1, the internal resistor of the DET pin and VCC, and the resistor R1 and the internal resistor of the DET pin form voltage division, so that the voltage value of the DET pin is smaller than that of the VCC. Generally, the resistance value of the R1 is larger, and the resistance value of the internal resistor of the DET pin is smaller, so that the voltage value obtained after the voltage division of the internal resistor of the DET pin is smaller, and the voltage of the DET pin is in a low-voltage state.

Thus, if the level of the high voltage state is recorded as 1 and the level of the low voltage state is recorded as 0, the above-mentioned earphone in-place detection module may detect whether the level of the DET pin jumps from 1 to 0 through the signal line 101 (for example, detect the level state of the black point position shown in fig. 1F or fig. 1G. It is understood that the black point detection position is only an example, or may be another detection point after the DET internal resistance and before the break point, which is not limited in the embodiment of the present application), so as to determine whether the DET signal and the LEFT pin are connected.

It can be understood that the high voltage described in the embodiments of the present application refers to a voltage value greater than or equal to 0.6 times the VCC total voltage, i.e., a high voltage, and a voltage value less than 0.6 times the VCC total voltage, i.e., a low voltage. Illustratively, the voltage value of VCC is 3.3v (it is understood that v is the unit of volts that characterizes the magnitude of the voltage value), then a voltage greater than or equal to 2.0v is a high voltage, and a voltage less than 2.0v is a low voltage.

It is understood that the circuit configuration diagram shown in fig. 1C is a circuit configuration diagram of an earphone socket perfectly matched with the four-segment earphone plug of the national standard, and the circuit configuration diagram of the earphone socket perfectly matched with the four-segment earphone plug of the international standard is similar to the circuit configuration diagram shown in fig. 1B, except that the positions of the MIC pin and the GND pin are different (illustratively, the positions of the MIC pin and the GND pin in the circuit configuration diagram of the earphone socket perfectly matched with the four-segment earphone plug of the international standard are exactly opposite to the positions of the MIC pin and the GND pin in the circuit diagram shown in fig. 1B), and the circuit configuration diagram of the earphone socket perfectly matched with the four-segment earphone plug of the international standard will not be described in detail.

In the embodiment of the present application, the above-mentioned headset in-place detection module may be a hardware component in the electronic device, where the headset in-place detection method provided in the present application may be executed. The headset presence detection module is a chip in the electronic device for executing the headset presence detection method. Alternatively, the earphone presence detection module may be a software function module provided by an existing hardware component in the electronic device and capable of executing the earphone presence detection method provided by the application. Illustratively, the headset bit detection module is an application. The specific form of the earphone presence detection module in the embodiments of the present application is not limited (other embodiments herein have the same definition as the earphone presence detection module).

It is to be understood that, regarding describing the connection ports of the devices as pins (such as DET pins, LEFT pins, etc.) merely as examples, the connection ports of the devices may also be in other forms, or the connection ports of the devices may also be described in other forms, which are not limited in this embodiment of the present application. By way of example, the connection ports of the device may also be described as pins.

In some headset in-place implementations, the headset in-place detection module determines whether the headset is in place by determining whether the DET pin and the LEFT pin of the innermost headset base of the mobile terminal are in communication. If the DET pin and the LEFT pin are communicated, the fact that the earphone plug is completely inserted into the earphone seat is indicated, the earphone is determined to be in place, and the audio channel is switched to the earphone channel.

It will be appreciated that the DET pin and the LEFT pin may be in communication by simply contacting the DET pin with the LEFT pin using a conductive substance. The conductive substance that causes the DET pin to communicate with the LEFT pin may be the LEFT contact section of the earphone plug or may be another conductive substance, which in the embodiment of the present application includes any one of the conductive substances. Such as conductive water or metal strips, etc. (other embodiments herein are described with respect to the other conductive substances as herein). Illustratively, as shown in FIG. 1E, a conductive water drop enters between the DET pin and the LEFT pin, causing the DET pin and the LEFT pin to communicate. If the DET pin is communicated with the LEFT pin due to the other conductive substances, the earphone plug is not inserted into the earphone seat, the earphone is still determined to be in place, and the audio channel is switched to the earphone channel, so that the earphone is misjudged in place, the voice playing function of the mobile terminal cannot be normally used, and the normal conversation or audio-video functions are affected.

By adopting the method provided by the embodiment of the application, after the DET pin and the LEFT pin of the earphone seat are communicated through the primary detection, the secondary detection is continuously performed to determine whether the MIC pin is in a state of being inserted into the earphone plug (namely, whether the MIC pin is in contact with the MIC contact section or the GND contact section of the earphone plug is determined). If yes, the earphone is determined to be in place. If not, it is indicated that other conductive substances except the earphone plug enter between the DET pin and the LEFT pin, so that the DET pin and the LEFT pin are communicated, and the earphone is determined to be out of position. The misjudgment of the earphone in place can be reduced with great probability, and further abnormal use of communication or audio-visual functions is avoided.

The user interface provided by the embodiments of the present application is described below.

It can be appreciated that the method provided in the embodiments of the present application may be performed by any electronic device in which a headset jack is mounted and in which a headset plug is supported for insertion into the headset jack. The electronic device includes, for example, a mobile terminal, tablet computer, desktop computer, laptop computer, handheld computer, notebook computer, ultra-mobile personal computer (UMPC), netbook, and the like. For convenience of description, a user interface provided in an embodiment of the present application will be described with a mobile terminal as an example of the electronic device.

First, a user interface related to the earphone presence detection method is introduced. Please refer to fig. 2A-2D.

As shown in fig. 2A, the electronic device displays a home screen interface 10. As shown in fig. 2A, the home screen interface 10 includes a status bar 201. The status bar 201 may include the name of the operator (e.g., chinese movement), time, WI-FI icon, signal strength, and current remaining power. The electronic device also includes an earphone seat 202, which supports the insertion of an earphone plug into the earphone seat 202 for use. It is understood that the position of the earphone seat 202 may be any position of the electronic device, which is not limited in the embodiments of the present application.

As shown in fig. 2B, the status bar 201 may further include an earphone in-place icon 2011, where when the audio channel of the electronic device is switched to the earphone channel, the earphone in-place icon 2011 is displayed in the status bar 201. It will also be appreciated that the headset on-bit icon 2011 is used to indicate to the user that the audio channel of the current electronic device has been switched to the headset channel. It can be understood that, besides indicating that the earphone is in place through the earphone in-place icon, the earphone can be also indicated to be in place through other indication methods, which is not limited in the embodiment of the present application.

It will be appreciated that as shown in fig. 2B, the earphone plug 203 is inserted into the earphone seat 202, the electronic device switches the audio channel to the earphone channel, and the status bar 201 displays the earphone in-place icon 2011. This is the accurate earphone in-place determination. As shown in fig. 2C, the earphone plug is not inserted into the earphone seat 202, and the status bar 201 displays an earphone in-place icon 2011. That is, the electronic device misjudges that the earphone is in place and switches the audio channel to the earphone channel in the case where the earphone head is not inserted into the earphone seat 202. This is a misjudgment of the earphone in place, and may cause abnormal audio functions of the electronic device.

The reason why the earphone is misjudged is that, generally, when the electronic device detects that the DET pin and the LEFT pin of the earphone seat 202 are connected, it is determined that the earphone plug has been inserted into the earphone seat (i.e., the earphone is in place), and the audio channel is switched to the earphone channel. However, the DET pin and the LEFT pin of the earphone seat 202 communicate, possibly due to the insertion of the earphone plug 203 into the earphone seat 202 (i.e., the LEFT contact section of the earphone plug causes the DET pin and the LEFT pin of the earphone seat to communicate). It is also possible that, as shown in fig. 1F, other electrically conductive substances than the earphone plug enter between the DET pin and the LEFT pin (i.e., the other electrically conductive substances enter between the DET pin and the LEFT pin so that the DET pin and the LEFT pin communicate through the other electrically conductive substances). If the other conductive substances enter between the DET pin and the LEFT pin to cause the DET pin and the LEFT pin to be communicated, the earphone is determined to be in place, and the earphone is judged to be in place in error.

However, with the earphone in-place detection method provided in the embodiment of the present application, when the earphone in-place detection module detects that the DET pin and the LEFT pin of the earphone seat 202 are connected, the earphone in-place is not immediately determined (i.e. the audio channel is not switched to the earphone channel). Rather, a second test is performed to determine if an earphone plug is inserted into the earphone seat 202 so that the DET pin and the LEFT pin communicate. If yes, determining that the earphone is in place, and switching the audio channel to the earphone channel; if not, the foreign matter enters the earphone seat, the earphone is out of position, and the audio channel is not switched to the earphone channel. Therefore, the in-place misjudgment of the earphone is reduced with great probability, and the abnormal use of the communication or video and audio functions of the electronic equipment is avoided.

Alternatively, by adopting another earphone in-place detection method provided in the embodiment of the present application, when the earphone in-place detection module detects that the DET pin and the LEFT pin of the earphone seat 202 are connected, the earphone is not immediately determined to be in place. Instead, the MIC pin of the earphone seat 202 is used to acquire the target noise signal and determine whether the noise wavelength type of the target noise signal is consistent with the noise wavelength of white noise. If yes, the MIC pin is indicated to be not normally picked up (namely, the MIC pin is indicated to be suspended and is not contacted with the MIC contact section or the GND contact section of the earphone plug, and foreign matters enter the DET pin and the LEFT pin of the earphone seat to cause the DET pin and the LEFT pin to be communicated), and then the earphone in-place detection module can determine that the earphone is out of place. If not, the MIC pin can pick up sound normally or an electrical signal exists on the MIC pin (namely, the MIC pin contacts with an MIC contact section or a GND contact section of an earphone plug, the earphone plug is inserted into the earphone seat), and the earphone in-place detection module can determine that the earphone is in place. Therefore, the in-place misjudgment of the earphone is reduced with great probability, and the abnormal use of the communication or video and audio functions of the electronic equipment is avoided.

Optionally, in the embodiment of the present application, if it is determined that the foreign matter enters the earphone seat and causes the DET pin and the LEFT pin to be communicated, as shown in fig. 2D, a prompt message may also be output through the message popup window 204, so as to prompt the user to clean the foreign matter on the earphone seat. It can be understood that, besides the message popup window, the user may also be prompted to enter the foreign object through other prompting methods (such as a specific prompting icon for entering the foreign object by the earphone seat, etc.), which is not limited in the embodiment of the present application.

According to the earphone in-place detection method provided by the embodiment of the application, after the DET pin in the earphone seat is communicated with the LEFT pin through primary detection, secondary detection is continued to determine whether the MIC pin in the earphone seat is in contact with the MIC contact section or the GND contact section of the earphone plug. If yes, the earphone plug is indicated to enter the earphone seat so that the DET pin and the LEFT pin are communicated, and the earphone is determined to be in place. If not, it indicates that a foreign matter enters between the DET pin and the LEFT pin, resulting in communication between the DET pin and the LEFT pin, and it is determined that the earphone is not in place.

The present application is further described below with reference to the accompanying drawings.

Referring to fig. 3A, fig. 3A is a flow chart of an earphone in-place detection method according to an embodiment of the present application. As shown in fig. 3A, the method for detecting the presence of the earphone includes the following steps:

The headset in-place detection module determines 301 whether the detection signal DET pin of the headset base and the LEFT channel LEFT pin are in communication.

It can be understood that multiplexing fig. 1B, the earphone seat refers to an earphone hole into which an earphone plug can be inserted. The earphone seat can be installed on the mobile terminal, or the earphone seat can be a simple device only comprising the complete circuit structure of the earphone seat.

In this embodiment, as shown in fig. 1D and fig. 1E, the DET pin and the LEFT pin of the earphone seat are communicated, and it is possible that an earphone plug is inserted into the earphone seat, and a LEFT contact section at the top of the earphone plug communicates the DET pin and the LEFT pin. Alternatively, it is also possible that other electrically conductive substances than the earphone plug enter between the LEFT pin of the earphone seat and the DET pin, so that the DET pin and the LEFT pin communicate.

It will be appreciated that determining whether the DET pin and the LEFT pin communicate is in several ways:

in embodiment 1, the level signal in the high voltage state is denoted as 1, and the level signal in the low voltage state is denoted as 0. 1F-1G, when the DET pin is not communicated with the LEFT pin, the level state of the DET pin is 1; after the DET pin and the LEFT pin are not connected, the level state of the DET pin is 0. By polling to detect whether the level signal of the DET pin jumps from 1 to 0, it is determined whether the DET pin and the LEFT pin are connected. If the level signal of the DET pin transitions from 1 to 0, it is determined that the DET pin and the left channel signal pin communicate. For a related schematic description describing the transition of the level signal of the DET pin from 1 to 0, reference may be made to other embodiments of the present application (e.g., the related description of fig. 1F-1G), which will not be described in detail herein.

Mode 2 refers to a level signal in a high voltage state as 0 and a level signal in a low voltage state as 1. 1F-1G, when the DET pin is not communicated with the LEFT pin, the level state of the DET pin is 0; after the DET pin and the LEFT pin are not connected, the level state of the DET pin is 1. By detecting whether the level signal jumps from 0 to 1 through polling, it is determined whether the DET pin and the LEFT pin are connected. If the level signal of the DET pin transitions from 0 to 1, it is determined that the DET pin and the left channel signal pin communicate. For a description of the principle of the transition of the level signal of the DET pin from 0 to 1, please refer to the description of the other embodiments of the present application (e.g., the description of fig. 1F-1G) similar to the principle of the transition of the level signal of the DET pin from 1 to 0 described in other embodiments of the present application.

Illustratively, the period of the poll detection in the above-described modes 1 and 2 may be 400ms. It is understood that the period of the polling detection may be other suitable durations, which are not limited in this embodiment of the present application.

Mode 3, it is determined whether the DET pin and the LEFT pin are connected by detecting the voltage value of the DET pin as shown in fig. 1A (illustratively, the voltage value of the position of the black point detection point as shown in the circuit diagram of fig. 1F). In the case where the voltage value of the DET pin is equal to the voltage value of VCC, it is determined that the DET pin is not connected to the LEFT pin. In the case that the voltage value of the DET pin is smaller than the voltage magnitude of the VCC, it is determined that the DET pin communicates with the LEFT pin.

Mode 4, determining whether the DET pin and the LEFT pin are connected by measuring the resistance value between the DET pin and the LEFT pin. Illustratively, if the resistance between the DET pin and the LEFT pin is measured to be infinite, it is determined that the DET pin and the LEFT pin are not connected. If the resistance between the DET pin and the LEFT pin is measured to be a specific resistance, it is determined that the DET pin and the LEFT pin are connected.

Alternatively, the headset bit detection module shown in fig. 1C may perform the above-mentioned polling detection of whether the level signal of the DET pin transitions from 1 to 0, or perform the above-mentioned polling detection of whether the level signal transitions from 0 to 1, or perform the above-mentioned detection of the voltage value of the DET pin shown in fig. 1A, or perform the above-mentioned measurement of the resistance value between the DET pin and the LEFT pin; and judging whether the DET pin and the LEFT pin are communicated or not by the earphone in-place detection module according to the detection result or the measurement result.

Alternatively, the polling detection may be performed by other detecting means, or may be performed by detecting whether the level signal of the DET pin transitions from 1 to 0, or by detecting whether the level signal transitions from 0 to 1 (e.g., detecting means for the level signal), or by detecting the voltage value of the DET pin (e.g., voltmeter means) as shown in fig. 1A, or by measuring the resistance value between the DET pin and the LEFT pin (e.g., measuring means for the resistance value). Then the other detection devices send the detection results or the measurement results to the earphone in-place detection module; after the earphone in-place detection module receives the detection result or the measurement result, whether the DET pin is communicated with the LEFT pin or not is further judged according to the detection result or the measurement result. Or, after the detection result or the measurement result is obtained by the other detection device, the other detection device may judge whether the DET pin and the LEFT pin are connected according to the detection result or the measurement result; and then the other detection devices send the judgment result to the earphone in-place detection module, and the earphone in-place detection module receives the judgment result.

It can be appreciated that the above method for determining whether the DET pin and the LEFT pin are connected is merely an example, and whether the DET pin and the LEFT pin are connected may also be determined by other methods, which is not limited in this embodiment of the present application.

302, in the case that the DET pin and the LEFT pin are determined to be communicated, the headset obtains a target voltage value by the bit detection module.

In the embodiment of the present application, the circuit diagram shown in fig. 1C further includes a microphone MIC pin, a MIC internal resistor, a resistor R3, a first contact 102, and a supply voltage. The second end of the R3 is connected to the positive electrode of the power supply voltage, the first end of the MIC internal resistance is connected to the negative electrode of the power supply voltage, and the second end of the MIC internal resistance can be connected to the first end of the R3 through a target contact section (MIC contact section or GND contact section) of the earphone plug. Illustratively, the first end of R3 communicates with the target contact segment via the first contact 102, and the second end of the MIC resistor communicates with the target contact segment such that the first end of R3 communicates with the second end of the MIC resistor via the target contact segment. It is understood that the MIC internal resistor is the internal resistor of the MIC pin, the first end of the MIC internal resistor can be understood as the first end of the MIC pin, and the second end of the MIC internal resistor can be understood as the second end of the MIC pin.

In this embodiment of the present application, the target voltage value is a voltage value of the first end of the resistor R3 as shown in fig. 1C. Illustratively, the target voltage value is a voltage value of a target detection point, which may be a position before the first end of the resistor R3 and after the first contact 102 in the circuit diagram shown in fig. 1C. Illustratively, the target detection point is a black point position shown as target detection point 103 shown in fig. 1C. It is understood that the black point position of the target detection point 103 is only an example, and the target detection point may be any position between the first end of the resistor R3 and the first contact 102, which is not limited in the embodiment of the present application.

In the embodiment of the application, the earphone bit detection module can provide a supply voltage for the resistor R3. In some embodiments, the supply voltage may not include a supply switch, and the supply voltage continues to supply power to the target detection point. In other embodiments, the supply voltage may also include a supply switch that is a controllable voltage (e.g., a bias voltage). If the power supply voltage comprises a power supply switch, before acquiring a target voltage value, determining whether the power supply switch of the power supply voltage is turned on or not; if the power supply switch is not opened, the power supply switch needs to be opened.

Optionally, as shown in fig. 1C, a feeding mechanism is set in the target detection point and the earphone in-place detection module, so that the earphone in-place detection module obtains the target voltage value through the feeder 104. Illustratively, the earphone in-place detection module provides a power supply voltage to a circuit composed of the MIC internal resistance and the R3 through an electric feed line (it can also be understood that the earphone in-place detection module transmits power to the target detection point through the electric feed line). The electric feeder circuit comprises a feeder 104, and the target detection point feeds back the voltage information of the target detection point to the earphone in-situ detection module through the feeder, so that the earphone in-situ detection module obtains the target voltage value.

Alternatively, the target voltage value may be obtained by another detecting device (for example, a voltmeter). And then the other detection devices send the target voltage value to the earphone on-site detection module, and the earphone on-site detection module receives the target voltage value, so that the target voltage value is obtained.

In the embodiment of the application, the MIC pin of the earphone seat comprises a plurality of working states. In the first state, neither the MIC pin nor the first end of R3 is in contact with the MIC contact section or the GND contact section of the earphone plug, and an open circuit is formed between the MIC pin and the first contact 102. In the second state, the MIC pin is communicated with the first end of the R3 through the MIC contact section of the four-section earphone plug, so that a passage is formed among the MIC internal resistor, the R3 and the power supply voltage. In the third state, the MIC pin, the first end of the R3, the GND pin and the ground port are connected through the GND contact segment of the three-segment earphone plug, so that the power supply voltage flows to the ground line of the ground port after passing through the R3, and the MIC contact segment is shorted out of the circuit, and a path is formed only among the R3, the ground port and the power supply voltage.

In the case where the MIC pin is in the first state, a circuit diagram of the MIC internal resistance, R3, and the power supply voltage is shown in fig. 3B. Since neither the MIC pin nor the first end of R3 is in contact with the MIC contact segment or the GND contact segment of the earphone plug, a break point 3021 exists between the MIC internal resistor and the circuit of R3, thereby forming an open circuit. It will be appreciated that the electrical potentials of the circuit before break point 3021 are equal, i.e., the electrical potential before and after R3 is equal before the break point. That is, if the voltage value of the power supply voltage is set to W, the target voltage value is equal to W.

In the case where the MIC pin is in the second state, a circuit diagram of the MIC internal resistance, R3, and the power supply voltage is shown in fig. 3C. Because the MIC pin is communicated with the first end of the R3 through the MIC pin of the four-section type earphone plug, a passage is formed among the MIC internal resistor, the R3 and the power supply voltage, and the MIC internal resistor and the R3 are connected into a circuit in a serial connection mode. And partial pressure is formed between the R3 resistor and the MIC contact section of the earphone plug.

It will be appreciated that in this second state, the target voltage value is determined by R3, the MIC internal resistance of the MIC pin, and the specific voltage division of the internal resistance of the MIC contact of the earphone plug in the circuit shown in fig. 3B. Illustratively, the supply voltage is recorded as W, and the voltage obtained by R3 is V _R3 In an ideal state (i.e. in an ideal state where the wires in the circuit have no internal resistance, the resistance of the resistive device is completely consistent with specification specifications, the ambient temperature, etc.), the target voltage value is (W-V _R3 )。

However, in practical situations, the lead always has a certain internal resistance, the resistance of the resistor device always has a certain deviation from the specification, the ambient temperature also changes, or the resistor device oxidizes, so that the target voltage value is not a voltage value which is fixed for a long time, but a relatively stable voltage range. That is, when the MIC pin is in the second state, the target voltage value is included in the first preset voltage range.

For example, if the voltage value of the power supply voltage is set to be 1.8v, and the voltage range of the voltage value obtained by R3 in the circuit diagram shown in fig. 3C is greater than or equal to 0.3v and less than 1.4v when the MIC pin is in the second state, the voltage range of the target detection point (i.e., the preset voltage range) is greater than or equal to 0.4v and less than 1.5v.

It can be understood that the specific voltage value of the endpoint value in the first preset voltage range can be obtained by analyzing the collected sample data. For example, the voltage values of the end point values in the first preset voltage range are only 0.4v and 1.5v, and the voltage values of the end point values in the first preset voltage range may be other suitable values, which is not limited in this embodiment of the present application.

In the case where the MIC pin is in the third state, a circuit diagram of the MIC internal resistance, R3, and the power supply voltage is shown in fig. 3D. Because the MIC pin and the R3 are communicated with the GND of the three-section earphone plug, the power supply voltage is directly grounded after passing through the R3, and the MIC pin is short-circuited from a circuit. Then ideally the circuit voltage becomes 0v after passing R3, i.e. the voltage at the target detection point is 0v.

It can be understood that, when the MIC pin is in the third state, the wire at the target detection point is directly grounded, but there is also a possibility that a weak voltage exists at the target detection point due to a certain internal resistance of the wire. That is, when the MIC pin is in the third state, the target voltage value is included in the second predetermined voltage range.

It is understood that a voltage value smaller than the first preset voltage range in the power supply voltage may be determined as the second preset voltage range. For example, if the voltage value of the power supply voltage is 1.8v, the first preset range is greater than or equal to 0.4v and less than 1.5v, and the second preset range is greater than or equal to 0 and less than 0.4v. It is understood that the second preset voltage range may be used to determine that the MIC pin is in the third state (i.e., that the MIC pin in the earphone seat is in contact with the GND pin in the earphone plug) if it is determined that the target voltage value is included in the second preset voltage range, thereby determining that the earphone plug belongs to the three-segment earphone plug.

It can be understood that the specific voltage values of the end points in the second preset voltage range may be obtained by analyzing the collected sample data, and for the voltage values of the end points in the second preset voltage range of 0 and 0.4v, only examples are given, and the voltage values of the end points in the second preset voltage range may also be other suitable values not included in the first preset voltage range, which is not limited in this embodiment of the present application.

It can be appreciated that, the values of the internal resistances of the MIC pins or the voltage values of the power supply voltages may be inconsistent for different electronic devices, so that the first preset voltage ranges may be different. Optionally, the resistance of R3 may be adjusted according to specific needs, so that, when the MIC pin is in the second state, the target voltage is stabilized to a first preset voltage range with a relatively fixed value, and the second preset voltage range is further determined according to the first preset voltage range.

For example, in the case where the voltage value of the power supply voltage is W1 (e.g., 1.8 v), the magnitude of the resistance of the MIC internal resistance is M1 (e.g., 2.2kΩ), at this time, if the magnitude of the target voltage value is in the range of greater than or equal to T1 (e.g., 0.4 v) and less than T2 (e.g., 1.5 v) with the MIC pin in the second state, the first preset voltage value is determined to be greater than or equal to T1 and less than T2. When the voltage value of the power supply voltage is W2 (e.g. 3.3 v), the resistance value of the MIC internal resistance is M2 (e.g. 2kΩ), and if the target voltage value range is not within the first preset voltage range when the MIC pin is in the second state, the resistance value of R3 is adjusted to a target resistance value, and the target voltage value is included in the first preset voltage range when the MIC pin is in the second state (e.g. the resistance value of R3 is adjusted to 4kΩ, such that the target voltage value is greater than or equal to T1 and less than T2).

Or, alternatively, the first preset voltage range of the target detection point may be flexibly designed according to the resistance value of the MIC internal resistance and the voltage value of the power supply voltage in different electronic devices, and the second preset voltage range may be further determined according to the first preset voltage range.

For example, in the case where the voltage value of the power supply voltage is W1 (e.g., 1.8 v), the magnitude of the resistance of the MIC internal resistance is M1 (e.g., 2.2kΩ), at this time, if the magnitude of the target voltage value is in the range of greater than or equal to T1 (e.g., 0.4 v) and less than T2 (e.g., 1.5 v) with the MIC pin in the second state, the first preset voltage value is determined to be greater than or equal to T1 and less than T2. When the voltage value of the power supply voltage is W2 (e.g. 3.3 v), the resistance value of the MIC internal resistance is M2 (e.g. 2kΩ), and if the range of the target voltage value is greater than or equal to T3 (e.g. 2.0 v) and less than T4 (e.g. 2.6 v) under the condition that the MIC pin is in the second state, the first preset voltage value is determined to be greater than or equal to T3 and less than T4.

It may be understood that the specific value intervals of the first preset voltage range and the second preset voltage range are only examples, and the specific value intervals of the first preset voltage range and the second preset voltage range may also be other value intervals, and may be custom designed according to practical situations, which is not limited in this embodiment of the present application.

In the embodiment of the present application, the third state (that is, the MIC pin in the earphone seat is in contact with the GND contact section of the earphone plug) may be formed by inserting the three-section earphone plug into the earphone seat (the earphone seat shown in fig. 1B) corresponding to the four-section earphone. Or can be formed by inserting a domestic standard four-section earphone plug into an earphone seat corresponding to an international standard four-section earphone plug. Or may be formed by inserting an international standard four-section earphone plug into an earphone seat corresponding to a domestic standard four-section earphone plug. The embodiments of the present application are not limited in this regard.

It can be understood that in the case where the four-segment headphones of the national standard and the four-segment headphones of the international standard are not compatible and are not compatible, the four-segment headphone plug of the national standard is inserted into the headphone stand corresponding to the four-segment headphone plug of the international standard, or the four-segment headphone plug of the international standard is inserted into the headphone stand corresponding to the four-segment headphone plug of the national standard. The MIC pin of the earphone seat is communicated with the GND contact section of the earphone plug, so that the MIC contact section on the earphone plug cannot normally contact with the MIC pin, and the microphone function of the earphone plug cannot be normally used. That is, it is equivalent to the four-segment earphone not having the MIC pin, that is, it is equivalent to the four-segment earphone being used as a three-segment earphone.

303, the earphone bit detection module determines whether the target voltage value is included in a preset voltage range.

In the embodiment of the application, the state of the MIC pin in the first state, the second state or the third state can be determined through the target voltage value, and whether the earphone plug is in place or not is determined through the state of the MIC pin.

As can be seen from the above step 302, in the case that the MIC pin is in the first state, the target voltage value is equal to the voltage value of the power supply voltage. The target voltage value is smaller than the voltage value of the power supply voltage in the case that the MIC pin is in the second state or the third state. Specifically, when the MIC pin is in the second state, the target voltage value is included in the first preset voltage range. In the case that the MIC pin is in the third state, the target voltage value is included in the second predetermined voltage range.

In this embodiment of the present application, the preset voltage range may have the following two values:

in mode 1, the preset voltage range is a voltage value range smaller than the voltage value of the power supply voltage.

For example, if the voltage value of the power supply voltage is 1.8v, the preset voltage range is less than 1.8v. In the case where the target voltage value is equal to 1.8v, the MIC pin is in the first state, the earphone is out of position, and other conductive substances enter between the DET pin and the LEFT pin causing the DET pin to communicate with the LEFT pin. In the case that the target voltage value is less than 1.8v (i.e., the target voltage value is included in the preset voltage range), the MIC pin is in the second state or the third state, and the earphone plug is in place.

In mode 2, the preset voltage range includes the first preset voltage range and a second preset voltage range. Specifically, the preset voltage range is a union of the first preset voltage range and the second preset voltage range.

For example, if the voltage value of the power supply voltage is 1.8v, the first preset voltage range is greater than or equal to 0.4v and less than 1.5v, and the second preset voltage range is greater than or equal to 0 and less than 0.4v. The preset voltage range is greater than or equal to 0 and less than 1.5v.

304, the earphone in-place detection module determines that the earphone is in place if the target voltage value is determined to be included in the preset voltage range.

In this embodiment of the present application, if it is determined that the DET pin in the earphone seat is in the second state or the third state (which may be understood as determining that the MIC pin is in contact with the MIC pin or the GND pin of the earphone plug) after it is determined that the DET pin and the LEFT pin in the earphone seat are in communication, it is indicated that the earphone plug enters the earphone seat so that the DET pin and the LEFT pin are in communication, and it may be determined that the earphone is in place.

It can be understood that, in the case that the predetermined voltage range is a voltage value range smaller than the voltage value of the power supply voltage, the target voltage value is included in the predetermined voltage range, which indicates that the MIC pin is in the second state or the third state, and the earphone can be determined to be in place.

It can be understood that, in the case that the preset voltage range includes the first preset voltage range and the second preset voltage range, the target voltage value is included in the first preset voltage range or the second preset voltage range, which indicates that the MIC pin is in the second state or the third state.

In the embodiment of the application, the earphone is determined to be in place, and meanwhile, the earphone in place can be determined to be a three-section earphone or a four-section earphone. In an exemplary case where it is determined that the target voltage value is included in the predetermined voltage range, it is further determined whether the target voltage value is included in the first predetermined voltage range or the second predetermined voltage range. If the target voltage value is determined to be included in the first preset voltage range, the MIC pin is indicated to be in the second state (that is, the MIC pin contacts with the MIC contact section of the earphone plug), and the in-place earphone belongs to the four-section earphone. If the target voltage value is determined to be included in the second preset voltage range, the MIC pin is indicated to be in a third state (that is, the MIC pin contacts the GND contact section of the earphone plug), and the in-place earphone belongs to the three-section earphone.

In the embodiment of the application, whether the earphone is in place can also be determined by determining whether the earphone type is a three-segment earphone or a four-segment earphone. It is also understood that in the case where the earphone type is determined to be a three-segment earphone or a four-segment earphone, then the earphone is determined to be in place; in the event that it is determined that the headset type cannot be identified, it is determined that the headset is not in place.

In an embodiment of the present application, after determining that the earphone is in place, switching the audio to the earphone channel is further included.

It will be appreciated that the above-described switching of audio to the headphone channel is performed by the electronic device. In some embodiments, the above-mentioned switching of audio to the headphone channel may also be performed by a headphone presence detection module, which may be a hardware component or a software functional module in the electronic device.

305, under the condition that the voltage value is determined not to be included in the preset voltage range, the earphone in-place detection module determines that the earphone is out of place and outputs prompt information for prompting that foreign matters enter the earphone hole.

In this embodiment of the present application, if it is determined that the DET pin in the earphone seat is in the first state after the DET pin and the LEFT pin in the earphone seat are communicated (i.e., it is determined that the MIC pin is not in contact with the MIC pin or the GND pin of the earphone plug), it is indicated that other conductive substances except the earphone plug enter between the DET pin and the LEFT pin in the earphone seat, so that the DET pin is communicated with the LEFT pin, and it may be determined that the earphone is out of place.

It can be understood that, in the case that the predetermined voltage range is a voltage value range smaller than the voltage value of the power supply voltage, the target voltage value is not included in the predetermined voltage range, which indicates that the MIC pin is in the first state, and it can be determined that the earphone is out of place.

It can be appreciated that, in the case where the preset voltage range includes the first preset voltage range and the second preset voltage range, the target voltage value is not included in the preset voltage range, which indicates that the MIC pin is in the first state, and it can be determined that the earphone is not in place.

In the embodiment of the application, when the earphone is determined to be out of position and the audio is not switched to the earphone channel, the prompting information for prompting the earphone seat to have foreign matters enter can be output. So that the user can remove the foreign matters in the earphone seat according to the prompt information.

By adopting the earphone in-place detection method provided by the application, after the earphone in-place detection module detects and determines that the DET pin is communicated with the LEFT pin once, the earphone in-place detection module continues to detect and determine whether the voltage of the target detection point is in a preset voltage range or not. If so, the MIC pin of the earphone seat is contacted with the MIC contact section or the GND contact section of the earphone plug, namely the earphone plug is inserted into the earphone seat so that the DET pin of the earphone seat is communicated with the LEFT pin, and the MIC pin of the earphone seat is contacted with the MIC contact section or the GND contact section of the earphone plug, so that the earphone is determined to be in place. If not, the MIC pin of the earphone seat is not contacted with the MIC contact section or the GND contact section of the earphone plug, and the conductive substance except the earphone plug enters between the DET pin and the LEFT pin, so that the DET pin is communicated with the LEFT pin, and the earphone is determined to be out of position. After the DET pin and the LEFT pin are communicated through primary detection, secondary detection is performed to determine whether an earphone plug is inserted into the earphone seat, so that the DET pin and the LEFT pin are communicated, misjudgment of the earphone in place is reduced with high probability, and abnormal use of a conversation or video and audio function is avoided.

It can be understood that, if the above-mentioned other conductive substances, besides causing the DET pin to be in communication with the LEFT pin, also contact with the MIC pin of the earphone seat so that the circuit diagram shown in fig. 3B forms a loop, the target voltage value is also in the preset range, thereby causing the earphone to be in a false alarm.

Exemplary, under the circumstances that the earphone seat intakes and the inflow is more, water fills to the MIC pin department of earphone seat, and water and MIC pin contact. Or a metal strip with a longer length enters the earphone seat, the metal strip enters a space between the DET pin and the LEFT pin of the earphone seat, and the metal strip is in contact with the MIC pin in the earphone seat. Therefore, the DET pin is communicated with the LEFT pin, and meanwhile, the MIC pin is communicated with the R3 to form a loop shown in fig. 3C or fig. 3D, so that the target voltage value is contained in the preset voltage range, and the earphone is caused to be in a false alarm.

In other embodiments, the preset voltage range may be flexibly adjusted for the case that the MIC pin is also contacted with the other conductive substance, so as to identify that the MIC pin is contacted with the other conductive substance to form a loop in the circuit diagram shown in fig. 3B.

It will be appreciated that the above-mentioned other conductive substances, such as electrolyte water, have relatively poor conductivity, or some metals having inferior conductivity to the metal material of the earphone plug (for example, metals having inferior conductivity to copper such as copper, gold or aluminum of the earphone plug), etc., have relatively large resistance values. Thus, the resistive characteristics can be used to experimentally analyze how much of the other conductive material will get a voltage division in the circuit as shown in fig. 3C, distinguishing whether the MIC pin is in contact with an earphone plug or with water or other metal with poor conductivity. It is understood that since water has various conductive impurities different in content, such as seawater, mineral water, river water or sewage, the conductivity thereof is different. Or, different metals have different conductive properties, and the preset voltage range should be adjusted according to specific conditions so as to more accurately distinguish that the earphone is in place or foreign matters enter the earphone, and the earphone is out of place. It can be understood that the specific value of the preset voltage range depends on the specific situation, and the embodiment of the present application is not limited to this.

It can be understood that the distance between the MIC pin and the inlet of the earphone seat is very small, and the other conductive substances can be easily found by a user and cleaned in time when entering the MIC pin, so that the probability of the earphone in-place false alarm phenomenon caused by the fact that the other conductive substances enter the MIC pin is not great, and if a detection mechanism is specially made for the situation, the practicability is not strong and resources are wasted.

In other embodiments, the method for detecting the presence of the earphone in place provided in the embodiments of the present application may include only the steps 302 to 304, that is, the step of determining whether the DET pin and the LEFT pin of the earphone seat are connected is not performed, the step of directly obtaining the target voltage value is performed, and the earphone is determined to be in place when the target voltage value is determined to be included in the preset voltage range. In the case that the target voltage value is determined not to be included in the preset voltage range, it is determined that the earphone is not in place. It will be appreciated that in the event that it is determined that the target voltage value is not included in the predetermined voltage range, there are two ways in which the earphone is not in place. One is that the earphone plug is not inserted into the earphone seat, and other conductive substances except the earphone plug do not enter the earphone seat; another is that the earphone plug is not inserted into the earphone seat, and the other conductive substance enters between the DET pin and the LEFT pin in the earphone seat. In other embodiments, it may also be determined whether the other conductive substance is entering the headset seat by performing step 301 described above after determining that the headset is out of position. Specifically, after determining that the earphone is out of position, determining whether a DET pin and a LEFT pin in the earphone seat are communicated; in case it is determined that the DET pin and the LEFT pin are in communication, it is determined that the earphone plug is not entered into the earphone seat, and the other conductive substance is entered into the earphone seat. In the event that the DET pin and the LEFT pin are determined not to be in communication, it is determined that the earphone plug is not entered into the earphone seat, and the other conductive substance is not entered into the earphone seat.

It can be understood that the two devices described in the embodiments of the present application are connected (for example, the first end of the MIC internal resistor is connected to the negative electrode of the power supply voltage), which may be the ports of the two devices are directly connected, or may be connected through a wire (it may also be understood that other circuits may exist between the two devices), which is not limited in this embodiment of the present application.

It can be understood that the main execution body of steps 301 to 305 in the embodiment of the present application is the above-mentioned earphone in-place detection module. In other embodiments, the execution subject of steps 301-305 may also be an electronic device including the headset presence detection module.

Referring to fig. 4A, fig. 4A is a schematic diagram illustrating another method for detecting the presence of an earphone according to an embodiment of the present application. As shown in fig. 4A, the earphone in-place detection method includes:

the headset in-place detection module determines 401 if the detection signal DET pin of the headset base and the LEFT channel LEFT pin are in communication.

For a method of implementation of how to determine whether the DET pin and the LEFT pin are connected, please refer to the relevant description of other embodiments of the present application (as described in detail above with respect to step 301).

402, after the DET pin and the LEFT pin are communicated, the earphone in-place detection module obtains a target noise signal through the MIC pin of the earphone seat.

In this embodiment, after the four-segment earphone plug is inserted into the earphone seat, the pickup device in the earphone plug performs pickup (it is understood that pickup means collecting a sound signal). After the four-section type earphone plug is inserted into the earphone seat, an MIC pin in the earphone seat is contacted with an MIC contact section in the earphone plug, and an MIC internal resistor, an R3 and a power supply voltage in the earphone seat form a passage shown in FIG. 3C, so that the MIC pin works normally. And contacts with an MIC pin through the MIC contact section, wherein the MIC pin receives the first noise signal transmitted by the transmitting device of the earphone plug. And transmitting the first noise signal to the earphone in-place detection module of the electronic equipment provided with the earphone seat through the MIC pin. Whereby the headset receives (acquires) the first noise signal at the bit detection module. The noise wavelength of the first noise signal may be of a noise wavelength type accompanied by a change in the intensity frequency and variation of the sound wave (or may also be understood as a large power fluctuation of the noise wavelength), and the highest decibel intensity per 200HZ period in the noise wavelength of the first noise signal is, illustratively, more than 10dB (it is understood that dB is in decibel units). Exemplary, the waveform of the first noise signal is shown in fig. 4B.

In this application embodiment, after the three-section earphone plug inserts the earphone seat, because there is not pickup device in the three-section earphone plug, then this three-section earphone can not pass through the MIC pin and transmit pickup result to this earphone in-place detection module. However, the three-section earphone plug is inserted into the earphone seat, so that the MIC internal resistance, R3 and the power supply voltage in the earphone seat form a path as shown in fig. 3D. The MIC pin of the earphone seat is well contacted with the GND pin, and as each device has bottom noise, after the MIC pin is well contacted with the GND pin to form a loop as shown in fig. 3D, the MIC internal resistor, the resistor R3 and the like can generate corresponding bottom noise. Therefore, the earphone in-place detection module acquires a second noise signal of the MIC pin, and the noise type of the second noise signal is bottom noise. Illustratively, the highest decibel intensity per 200HZ period of the noise wavelength of the second noise signal is less than-100 dB. Exemplary waveforms of the second noise signal are shown in fig. 4C.

In the embodiment of the present application, fig. 1E is multiplexed if the DET pin and the LEFT pin are connected due to other conductive substances except for the earphone plug entering the earphone seat. I.e. the MIC pin does not contact either the MIC contact section or the GND contact section of the earphone plug, at which point the internal circuit diagram of the MIC pin is open as shown in fig. 3B. The earphone obtains a third noise signal of the MIC pin by the in-situ detection module, wherein the third noise signal is white noise with relatively uniform frequency points, relatively wider frequency amplitude and relatively lower power. Illustratively, the highest decibel intensity per 200HZ period of the noise wavelength of the third noise signal is less than 10dB and greater than-5 dB. Exemplary, the waveform of the third noise signal is shown in fig. 4D.

It will be appreciated that if the noise wavelength type of the target noise signal is identical to the noise wavelength type of the first noise signal or the second noise signal, it is indicated that the earphone plug has been normally inserted into the earphone seat. If the noise wavelength type of the target noise signal is consistent with the noise wavelength type of the third noise signal, the foreign matter enters the earphone seat, and the earphone plug is not inserted into the earphone seat.

In the embodiment of the application, the earphone in-place detection module provides a power supply voltage (power supply voltage) to the MIC pin, the MIC internal resistance and R3 in the earphone seat. In some embodiments, the power supply voltage does not include a power switch, and the power supply voltage continuously supplies power to the MIC pin, the MIC internal resistance, and R3. In other embodiments, the power supply voltage includes a power supply switch, and before the target noise signal is obtained through the MIC pin of the earphone seat, it is determined whether the power supply switch of the power supply voltage is turned on; if the power switch is not turned on, the bias switch is turned on.

It can be understood that the waveform diagrams shown in fig. 4B to fig. 4D are only examples, and in particular, the noise signals have different wavelength forms due to performance differences (such as differences in noise reduction performance) of the electronic device or the earphone plug device, or differences in environmental sound, etc., so that the specific wavelength form of the noise signals is not limited in the embodiment of the present application.

403, the earphone in-place detection module determines whether the noise wavelength type of the target noise signal is included in a preset noise wavelength type.

In the embodiment of the present application, the preset noise wavelength type may be a noise wavelength type of noise other than white noise. It will be appreciated that if the noise wavelength type of the target noise signal is identical to the noise wavelength type of the white noise, the target noise signal is described as the third noise signal. It is indicated that the MIC pin of the earphone seat does not contact either the MIC contact section of the earphone plug or the GND contact section of the earphone plug, i.e. foreign matter enters the earphone seat and the earphone is out of place. If the target noise signal is other noise than white noise, it is indicated that the target noise signal is the first noise signal or the second noise signal. It is indicated that the target noise signal is derived from the MIC pin being in contact with the MIC contact segment or GND contact segment of the earphone plug.

Alternatively, determining whether the noise wavelength type of the target noise signal is included in a preset noise wavelength type may be performed by the headset in-situ detection module. The other determining device may determine whether the noise wavelength type of the target noise signal is included in the preset noise wavelength type, and the other determining device may send the determination result to the earphone in-situ detection module, where the earphone in-situ detection module receives the determination result, and determines whether the noise wavelength type of the target noise signal is included in the preset noise wavelength type according to the determination result.

404, in case it is determined that the noise wavelength type of the target noise signal is included in the preset noise type, the earphone in-place detecting module determines that the earphone is in place.

It can be understood that if the noise wavelength type of the target noise signal is included in the preset noise type, it indicates that the target noise signal is the first noise signal or the second noise signal, that is, the target noise signal is transmitted into the earphone in-place detection module by the earphone plug. Illustratively, as shown in fig. 4E, after the earphone plug is inserted into the earphone seat, the LEFT contact section of the earphone plug causes the DET pin and the LEFT pin in the earphone seat to communicate. The earphone in-place detection module receives a level signal sent by a DET pin of the earphone seat, after the DET pin and a LEFT pin in the earphone seat are communicated according to the level signal, the earphone in-place detection module obtains a pickup result of an MIC contact section of an earphone plug, and under the condition that the noise wavelength type of the pickup result (namely, a target noise signal) is consistent with that of the first noise signal, the earphone plug determined to be four-section is inserted into the earphone seat, namely, the earphone is in place.

405, in the case that the target noise signal is determined not to be included in the preset noise wavelength type, the earphone in-place detection module determines that the earphone is not in place, and outputs a prompt message for prompting that the earphone hole has foreign matters.

In this embodiment of the present application, if it is determined that the target noise signal is not included in the preset noise type, it indicates that the earphone seat has foreign objects entering, and a prompt message may be output to prompt the user to clear the foreign objects in the earphone seat.

By adopting the earphone in-place detection method provided by the embodiment of the application, when the earphone in-place detection module detects that the DET pin and the LEFT pin of the earphone seat 202 are communicated, the earphone is not immediately determined to be in place. Instead, the target noise signal is obtained through the MIC pin of the earphone seat 202, and it is determined whether the noise wavelength type of the target noise signal is consistent with the preset noise wavelength. If yes, the MIC pin can be normally picked up or an electric signal exists on the MIC pin, and the earphone plug is inserted into the earphone seat, so that the earphone in-place detection module can determine that the earphone is in place. If not, the MIC pin is indicated to not normally pick up, and if foreign matters enter the DET pin and the LEFT pin of the earphone seat to cause the DET pin and the LEFT pin to be communicated, the earphone in-place detection module can determine that the earphone is out of place. Therefore, the in-place misjudgment of the earphone is reduced with great probability, and the abnormal use of the communication or video and audio functions of the electronic equipment is avoided.

In this embodiment, if the DET pin and the LEFT pin are in communication due to other conductive substances except for the earphone plug entering the earphone seat, and the other conductive substances are also in contact with the MIC pin in the earphone seat (for a relevant scenario of the other conductive substances contacting the MIC pin in the earphone seat and for details of this scenario, refer to other embodiments of the present application), the internal circuit pattern of the MIC pin as shown in fig. 3B is formed into a path. The earphone obtains a fourth noise signal of the MIC pin at this time, and the noise wavelength type of the fourth noise signal may be similar to the noise wavelength type of the bottom noise.

Alternatively, if the other conductive substance is considered to be in contact with the MIC pin in the earphone seat, the first noise classification model, which can be used to distinguish whether the noise signal to be classified belongs to the fourth noise signal or the second noise signal, can be trained by collecting sample data. Specifically, the other conductive substance is controlled to exist only between the DET pin and the LEFT pin of the earphone seat, and at least two second noise signals are collected. The other electrically conductive substance is controlled to exist between the DET pin and the LEFT pin of the earphone seat and at the MIC pin, and at least two of the fourth noise signals are collected. And inputting the collected at least two second noise signals and at least two fourth noise signals into a noise classification training model to obtain the first noise classification model.

Under the condition that the noise signal to be classified does not belong to the first noise signal or the third noise signal, inputting the noise signal to be classified into the first noise classification model, and if the noise signal to be classified is output to belong to the second noise signal, indicating that the MIC pin is in contact with the GND pin of the earphone plug, namely the earphone is in place. If the model to be classified is output to belong to the fourth noise signal, the MIC pin is indicated to be in contact with the other conductive substances, that is, foreign matters enter the earphone seat, and the earphone is not in place.

Optionally, if the other conductive substance is also in contact with the MIC pin in the earphone seat, a second noise classification model may be trained by collecting sample data, where the second noise classification model may be used to distinguish what noise signal is the first noise signal, the second noise signal, the third noise signal, or the fourth noise signal. The specific training method is similar to the training method of the first noise classification model, and will not be described in detail herein.

In the embodiment of the application, the type of the earphone plug of the in-place earphone can be further determined through the second noise classification model. Specifically, if the target noise signal is determined to belong to the first noise signal, determining that the earphone plug type of the in-situ earphone is a four-segment earphone type. If the target noise signal is determined to belong to the second noise signal, determining that the earphone plug type of the in-position earphone is a three-section earphone type.

It can be understood that the noise signal described in the embodiments of the present application may be an acoustic signal or an electrical signal, and if the noise signal is an acoustic signal, the acoustic signal needs to be converted into an electrical signal to obtain wavelength information of the noise signal.

It can be understood that the main execution body of steps 401 to 405 in the embodiment of the present application is the above-mentioned earphone in-place detection module. In other embodiments, the execution subject of step 401-step 405 may also be an electronic device that includes the headset presence detection module.

It will be appreciated that the method provided by the above embodiments of the present application may be performed by any electronic device in which a headset jack is mounted and in which a headset plug is supported for insertion into the headset jack. Exemplary electronic devices include mobile terminals, tablet computers, desktop computers, laptop computers, handheld computers, notebook computers, ultra-mobile personal computer (UMPC), and netbooks.

For example, referring to fig. 5, fig. 5 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present application, and a detailed description is given below by using a mobile terminal as an example of the electronic device.

The electronic device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (universal serial bus, USB) interface 130, a charge management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, a sensor module 180, keys 190, a motor 191, an indicator 192, a camera 193, a display 194, and a subscriber identity module (subscriber identification module, SIM) card interface 195, etc. The sensor module 180 may include a pressure sensor 180A, a gyro sensor 180B, an air pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, and the like.

It should be understood that the illustrated structure of the embodiment of the present invention does not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, electronic device 100 may include more or fewer components than shown, or certain components may be combined, or certain components may be split, or different arrangements of components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

The processor 110 may include one or more processing units, such as: the processor 110 may include an Application Processor (AP), a modem processor, a graphics processor (graphics processing unit, GPU), an image signal processor (image signal processor, ISP), a controller, a memory, a video codec, a digital signal processor (digital signal processor, DSP), a baseband processor, and/or a neural network processor (neural-network processing unit, NPU), etc. Wherein the different processing units may be separate devices or may be integrated in one or more processors.

The controller may be a neural hub and a command center of the electronic device 100, among others. The controller can generate operation control signals according to the instruction operation codes and the time sequence signals to finish the control of instruction fetching and instruction execution.

A memory may also be provided in the processor 110 for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. The memory may hold instructions or data that the processor 110 has just used or recycled. If the processor 110 needs to reuse the instruction or data, it can be called directly from the memory. Repeated accesses are avoided and the latency of the processor 110 is reduced, thereby improving the efficiency of the system.

In some embodiments, the processor 110 may include one or more interfaces. The interfaces may include an integrated circuit (inter-integrated circuit, I2C) interface, an integrated circuit built-in audio (inter-integrated circuit sound, I2S) interface, a pulse code modulation (pulse code modulation, PCM) interface, a universal asynchronous receiver transmitter (universal asynchronous receiver/transmitter, UART) interface, a mobile industry processor interface (mobile industry processor interface, MIPI), a general-purpose input/output (GPIO) interface, a subscriber identity module (subscriber identity module, SIM) interface, and/or a universal serial bus (universal serial bus, USB) interface, among others.

The I2C interface is a bi-directional synchronous serial bus comprising a serial data line (SDA) and a serial clock line (derail clock line, SCL). In some embodiments, the processor 110 may contain multiple sets of I2C buses. The processor 110 may be coupled to the touch sensor 180K, charger, flash, camera 193, etc., respectively, through different I2C bus interfaces. For example: the processor 110 may be coupled to the touch sensor 180K through an I2C interface, such that the processor 110 communicates with the touch sensor 180K through an I2C bus interface to implement a touch function of the electronic device 100.

The I2S interface may be used for audio communication. In some embodiments, the processor 110 may contain multiple sets of I2S buses. The processor 110 may be coupled to the audio module 170 via an I2S bus to enable communication between the processor 110 and the audio module 170. In some embodiments, the audio module 170 may transmit an audio signal to the wireless communication module 160 through the I2S interface, to implement a function of answering a call through the bluetooth headset.

PCM interfaces may also be used for audio communication to sample, quantize and encode analog signals. In some embodiments, the audio module 170 and the wireless communication module 160 may be coupled through a PCM bus interface. In some embodiments, the audio module 170 may also transmit audio signals to the wireless communication module 160 through the PCM interface to implement a function of answering a call through the bluetooth headset. Both the I2S interface and the PCM interface may be used for audio communication.

The UART interface is a universal serial data bus for asynchronous communications. The bus may be a bi-directional communication bus. It converts the data to be transmitted between serial communication and parallel communication. In some embodiments, a UART interface is typically used to connect the processor 110 with the wireless communication module 160. For example: the processor 110 communicates with a bluetooth module in the wireless communication module 160 through a UART interface to implement a bluetooth function. In some embodiments, the audio module 170 may transmit an audio signal to the wireless communication module 160 through a UART interface, to implement a function of playing music through a bluetooth headset.

The MIPI interface may be used to connect the processor 110 to peripheral devices such as a display 194, a camera 193, and the like. The MIPI interfaces include camera serial interfaces (camera serial interface, CSI), display serial interfaces (display serial interface, DSI), and the like. In some embodiments, processor 110 and camera 193 communicate through a CSI interface to implement the photographing functions of electronic device 100. The processor 110 and the display 194 communicate via a DSI interface to implement the display functionality of the electronic device 100.

The GPIO interface may be configured by software. The GPIO interface may be configured as a control signal or as a data signal. In some embodiments, a GPIO interface may be used to connect the processor 110 with the camera 193, the display 194, the wireless communication module 160, the audio module 170, the sensor module 180, and the like. The GPIO interface may also be configured as an I2C interface, an I2S interface, a UART interface, an MIPI interface, etc.

The USB interface 130 is an interface conforming to the USB standard specification, and may specifically be a Mini USB interface, a Micro USB interface, a USB Type C interface, or the like. The USB interface 130 may be used to connect a charger to charge the electronic device 100, and may also be used to transfer data between the electronic device 100 and a peripheral device. And can also be used for connecting with a headset, and playing audio through the headset. The interface may also be used to connect other electronic devices, such as AR devices, etc.

It should be understood that the interfacing relationship between the modules illustrated in the embodiments of the present invention is only illustrative, and is not meant to limit the structure of the electronic device 100. In other embodiments of the present application, the electronic device 100 may also use different interfacing manners, or a combination of multiple interfacing manners in the foregoing embodiments.

The charge management module 140 is configured to receive a charge input from a charger. The charger can be a wireless charger or a wired charger. In some wired charging embodiments, the charge management module 140 may receive a charging input of a wired charger through the USB interface 130. In some wireless charging embodiments, the charge management module 140 may receive wireless charging input through a wireless charging coil of the electronic device 100. The charging management module 140 may also supply power to the electronic device through the power management module 141 while charging the battery 142.

The power management module 141 is used for connecting the battery 142, and the charge management module 140 and the processor 110. The power management module 141 receives input from the battery 142 and/or the charge management module 140 and provides power to the processor 110, the internal memory 121, the external memory, the display 194, the camera 193, the wireless communication module 160, and the like. The power management module 141 may also be configured to monitor battery capacity, battery cycle number, battery health (leakage, impedance) and other parameters. In other embodiments, the power management module 141 may also be provided in the processor 110. In other embodiments, the power management module 141 and the charge management module 140 may be disposed in the same device.

The wireless communication function of the electronic device 100 may be implemented by the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, a modem processor, a baseband processor, and the like.

The antennas 1 and 2 are used for transmitting and receiving electromagnetic wave signals. Each antenna in the electronic device 100 may be used to cover a single or multiple communication bands. Different antennas may also be multiplexed to improve the utilization of the antennas. For example: the antenna 1 may be multiplexed into a diversity antenna of a wireless local area network. In other embodiments, the antenna may be used in conjunction with a tuning switch.

The mobile communication module 150 may provide a solution for wireless communication including 2G/3G/4G/5G, etc., applied to the electronic device 100. The mobile communication module 150 may include at least one filter, switch, power amplifier, low noise amplifier (low noise amplifier, LNA), etc. The mobile communication module 150 may receive electromagnetic waves from the antenna 1, perform processes such as filtering, amplifying, and the like on the received electromagnetic waves, and transmit the processed electromagnetic waves to the modem processor for demodulation. The mobile communication module 150 can amplify the signal modulated by the modem processor, and convert the signal into electromagnetic waves through the antenna 1 to radiate. In some embodiments, at least some of the functional modules of the mobile communication module 150 may be disposed in the processor 110. In some embodiments, at least some of the functional modules of the mobile communication module 150 may be provided in the same device as at least some of the modules of the processor 110.

The modem processor may include a modulator and a demodulator. The modulator is used for modulating the low-frequency baseband signal to be transmitted into a medium-high frequency signal. The demodulator is used for demodulating the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low frequency baseband signal to the baseband processor for processing. The low frequency baseband signal is processed by the baseband processor and then transferred to the application processor. The application processor outputs sound signals through an audio device (not limited to the speaker 170A, the receiver 170B, etc.), or displays images or video through the display screen 194. In some embodiments, the modem processor may be a stand-alone device. In other embodiments, the modem processor may be provided in the same device as the mobile communication module 150 or other functional module, independent of the processor 110.

The wireless communication module 160 may provide solutions for wireless communication including wireless local area network (wireless local area networks, WLAN) (e.g., wireless fidelity (wireless fidelity, wi-Fi) network), bluetooth (BT), global navigation satellite system (global navigation satellite system, GNSS), frequency modulation (frequency modulation, FM), near field wireless communication technology (near field communication, NFC), infrared technology (IR), etc., as applied to the electronic device 100. The wireless communication module 160 may be one or more devices that integrate at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via the antenna 2, modulates the electromagnetic wave signals, filters the electromagnetic wave signals, and transmits the processed signals to the processor 110. The wireless communication module 160 may also receive a signal to be transmitted from the processor 110, frequency modulate it, amplify it, and convert it to electromagnetic waves for radiation via the antenna 2.

In some embodiments, antenna 1 and mobile communication module 150 of electronic device 100 are coupled, and antenna 2 and wireless communication module 160 are coupled, such that electronic device 100 may communicate with a network and other devices through wireless communication techniques. The wireless communication techniques may include the Global System for Mobile communications (global system for mobile communications, GSM), general packet radio service (general packet radio service, GPRS), code division multiple access (code division multiple access, CDMA), wideband code division multiple access (wideband code division multiple access, WCDMA), time division code division multiple access (time-division code division multiple access, TD-SCDMA), long term evolution (long term evolution, LTE), BT, GNSS, WLAN, NFC, FM, and/or IR techniques, among others. The GNSS may include a global satellite positioning system (global positioning system, GPS), a global navigation satellite system (global navigation satellite system, GLONASS), a beidou satellite navigation system (beidou navigation satellite system, BDS), a quasi zenith satellite system (quasi-zenith satellite system, QZSS) and/or a satellite based augmentation system (satellite based augmentation systems, SBAS).

The electronic device 100 implements display functions through a GPU, a display screen 194, an application processor, and the like. The GPU is a microprocessor for image processing, and is connected to the display 194 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. Processor 110 may include one or more GPUs that execute program instructions to generate or change display information.

The display screen 194 is used to display images, videos, and the like. The display 194 includes a display panel. The display panel may employ a liquid crystal display (liquid crystal display, LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED) or an active-matrix organic light-emitting diode (matrix organic light emitting diode), a flexible light-emitting diode (flex), a mini, a Micro led, a Micro-OLED, a quantum dot light-emitting diode (quantum dot light emitting diodes, QLED), or the like. In some embodiments, the electronic device 100 may include 1 or N display screens 194, N being a positive integer greater than 1.

The electronic device 100 may implement photographing functions through an ISP, a camera 193, a video codec, a GPU, a display screen 194, an application processor, and the like.

The ISP is used to process data fed back by the camera 193. For example, when photographing, the shutter is opened, light is transmitted to the camera photosensitive element through the lens, the optical signal is converted into an electric signal, and the camera photosensitive element transmits the electric signal to the ISP for processing and is converted into an image visible to naked eyes. ISP can also optimize the noise, brightness and skin color of the image. The ISP can also optimize parameters such as exposure, color temperature and the like of a shooting scene. In some embodiments, the ISP may be provided in the camera 193.

The camera 193 is used to capture still images or video. The object generates an optical image through the lens and projects the optical image onto the photosensitive element. The photosensitive element may be a charge coupled device (charge coupled device, CCD) or a Complementary Metal Oxide Semiconductor (CMOS) phototransistor. The photosensitive element converts the optical signal into an electrical signal, which is then transferred to the ISP to be converted into a digital image signal. The ISP outputs the digital image signal to the DSP for processing. The DSP converts the digital image signal into an image signal in a standard RGB, YUV, or the like format. In some embodiments, electronic device 100 may include 1 or N cameras 193, N being a positive integer greater than 1.

The digital signal processor is used for processing digital signals, and can process other digital signals besides digital image signals. For example, when the electronic device 100 selects a frequency bin, the digital signal processor is used to fourier transform the frequency bin energy, or the like.

Video codecs are used to compress or decompress digital video. The electronic device 100 may support one or more video codecs. In this way, the electronic device 100 may play or record video in a variety of encoding formats, such as: dynamic picture experts group (movingpicture experts group, MPEG) 1, MPEG2, MPEG3, MPEG4, etc.

The NPU is a neural-network (NN) computing processor, and can rapidly process input information by referencing a biological neural network structure, for example, referencing a transmission mode between human brain neurons, and can also continuously perform self-learning. Applications such as intelligent awareness of the electronic device 100 may be implemented through the NPU, for example: image recognition, face recognition, speech recognition, text understanding, etc. The decision model provided by the embodiment of the application can also be realized through the NPU.

The external memory interface 120 may be used to connect an external memory card, such as a Micro SD card, to enable expansion of the memory capabilities of the electronic device 100. The external memory card communicates with the processor 110 through an external memory interface 120 to implement data storage functions. For example, files such as music, video, etc. are stored in an external memory card.

The internal memory 121 may be used to store computer executable program code including instructions. The processor 110 executes various functional applications of the electronic device 100 and data processing by executing instructions stored in the internal memory 121. The internal memory 121 may include a storage program area and a storage data area. The storage program area may store an application program (such as a sound playing function, an image playing function, etc.) required for at least one function of the operating system, etc. The storage data area may store data created during use of the electronic device 100 (e.g., audio data, phonebook, etc.), and so on. In addition, the internal memory 121 may include a high-speed random access memory, and may further include a nonvolatile memory such as at least one magnetic disk storage device, a flash memory device, a universal flash memory (universal flash storage, UFS), and the like.

The electronic device 100 may implement audio functions through an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, an application processor, and the like. Such as music playing, recording, etc.

The audio module 170 is used to convert digital audio information into an analog audio signal output and also to convert an analog audio input into a digital audio signal. The audio module 170 may also be used to encode and decode audio signals. In some embodiments, the audio module 170 may be disposed in the processor 110, or a portion of the functional modules of the audio module 170 may be disposed in the processor 110.

The speaker 170A, also referred to as a "horn," is used to convert audio electrical signals into sound signals. The electronic device 100 may listen to music, or to hands-free conversations, through the speaker 170A.

A receiver 170B, also referred to as a "earpiece", is used to convert the audio electrical signal into a sound signal. When electronic device 100 is answering a telephone call or voice message, voice may be received by placing receiver 170B in close proximity to the human ear.

Microphone 170C, also referred to as a "microphone" or "microphone", is used to convert sound signals into electrical signals. When making a call or transmitting voice information, the user can sound near the microphone 170C through the mouth, inputting a sound signal to the microphone 170C. The electronic device 100 may be provided with at least one microphone 170C. In other embodiments, the electronic device 100 may be provided with two microphones 170C, and may implement a noise reduction function in addition to collecting sound signals. In other embodiments, the electronic device 100 may also be provided with three, four, or more microphones 170C to enable collection of sound signals, noise reduction, identification of sound sources, directional recording functions, etc.

The earphone interface 170D is used to connect a wired earphone. The headset interface 170D may be a USB interface 130 or a 3.5mm open mobile electronic device platform (open mobile terminal platform, OMTP) standard interface, a american cellular telecommunications industry association (cellular telecommunications industry association of the USA, CTIA) standard interface.

The pressure sensor 180A is used to sense a pressure signal, and may convert the pressure signal into an electrical signal. In some embodiments, the pressure sensor 180A may be disposed on the display screen 194.

The pressure sensor 180A is of various types, such as a resistive pressure sensor, an inductive pressure sensor, a capacitive pressure sensor, and the like. The capacitive pressure sensor may be a capacitive pressure sensor comprising at least two parallel plates with conductive material. The capacitance between the electrodes changes when a force is applied to the pressure sensor 180A. The electronic device 100 determines the strength of the pressure from the change in capacitance. When a touch operation is applied to the display screen 194, the electronic apparatus 100 detects the touch operation intensity according to the pressure sensor 180A. The electronic device 100 may also calculate the location of the touch based on the detection signal of the pressure sensor 180A. In some embodiments, touch operations that act on the same touch location, but at different touch operation strengths, may correspond to different operation instructions. For example: and executing an instruction for checking the short message when the touch operation with the touch operation intensity smaller than the first pressure threshold acts on the short message application icon. And executing an instruction for newly creating the short message when the touch operation with the touch operation intensity being greater than or equal to the first pressure threshold acts on the short message application icon.

The gyro sensor 180B may be used to determine a motion gesture of the electronic device 100. In some embodiments, the angular velocity of electronic device 100 about three axes (i.e., x, y, and z axes) may be determined by gyro sensor 180B. The gyro sensor 180B may be used for photographing anti-shake. For example, when the shutter is pressed, the gyro sensor 180B detects the shake angle of the electronic device 100, calculates the distance to be compensated by the lens module according to the angle, and makes the lens counteract the shake of the electronic device 100 through the reverse motion, so as to realize anti-shake. The gyro sensor 180B may also be used for navigating, somatosensory game scenes.

The air pressure sensor 180C is used to measure air pressure. In some embodiments, electronic device 100 calculates altitude from barometric pressure values measured by barometric pressure sensor 180C, aiding in positioning and navigation.

The magnetic sensor 180D includes a hall sensor. The electronic device 100 may detect the opening and closing of the flip cover using the magnetic sensor 180D. In some embodiments, when the electronic device 100 is a flip machine, the electronic device 100 may detect the opening and closing of the flip according to the magnetic sensor 180D. And then according to the detected opening and closing state of the leather sheath or the opening and closing state of the flip, the characteristics of automatic unlocking of the flip and the like are set.

The acceleration sensor 180E may detect the magnitude of acceleration of the electronic device 100 in various directions (typically three axes). The magnitude and direction of gravity may be detected when the electronic device 100 is stationary. The electronic equipment gesture recognition method can also be used for recognizing the gesture of the electronic equipment, and is applied to horizontal and vertical screen switching, pedometers and other applications.

A distance sensor 180F for measuring a distance. The electronic device 100 may measure the distance by infrared or laser. In some embodiments, the electronic device 100 may range using the distance sensor 180F to achieve quick focus.

The proximity light sensor 180G may include, for example, a Light Emitting Diode (LED) and a light detector, such as a photodiode. The light emitting diode may be an infrared light emitting diode. The electronic device 100 emits infrared light outward through the light emitting diode. The electronic device 100 detects infrared reflected light from nearby objects using a photodiode. When sufficient reflected light is detected, it may be determined that there is an object in the vicinity of the electronic device 100. When insufficient reflected light is detected, the electronic device 100 may determine that there is no object in the vicinity of the electronic device 100. The electronic device 100 can detect that the user holds the electronic device 100 close to the ear by using the proximity light sensor 180G, so as to automatically extinguish the screen for the purpose of saving power. The proximity light sensor 180G may also be used in holster mode, pocket mode to automatically unlock and lock the screen.

The ambient light sensor 180L is used to sense ambient light level. The electronic device 100 may adaptively adjust the brightness of the display 194 based on the perceived ambient light level. The ambient light sensor 180L may also be used to automatically adjust white balance when taking a photograph. Ambient light sensor 180L may also cooperate with proximity light sensor 180G to detect whether electronic device 100 is in a pocket to prevent false touches.

The fingerprint sensor 180H is used to collect a fingerprint. The electronic device 100 may utilize the collected fingerprint feature to unlock the fingerprint, access the application lock, photograph the fingerprint, answer the incoming call, etc.

The temperature sensor 180J is for detecting temperature. In some embodiments, the electronic device 100 performs a temperature processing strategy using the temperature detected by the temperature sensor 180J. For example, when the temperature reported by temperature sensor 180J exceeds a threshold, electronic device 100 performs a reduction in the performance of a processor located in the vicinity of temperature sensor 180J in order to reduce power consumption to implement thermal protection. In other embodiments, when the temperature is below another threshold, the electronic device 100 heats the battery 142 to avoid the low temperature causing the electronic device 100 to be abnormally shut down. In other embodiments, when the temperature is below a further threshold, the electronic device 100 performs boosting of the output voltage of the battery 142 to avoid abnormal shutdown caused by low temperatures.

The touch sensor 180K, also referred to as a "touch panel". The touch sensor 180K may be disposed on the display screen 194, and the touch sensor 180K and the display screen 194 form a touch screen, which is also called a "touch screen". The touch sensor 180K is for detecting a touch operation acting thereon or thereabout. The touch sensor may communicate the detected touch operation to the application processor to determine the touch event type. Visual output related to touch operations may be provided through the display 194. In other embodiments, the touch sensor 180K may also be disposed on the surface of the electronic device 100 at a different location than the display 194.

The bone conduction sensor 180M may acquire a vibration signal. In some embodiments, bone conduction sensor 180M may acquire a vibration signal of a human vocal tract vibrating bone pieces. The bone conduction sensor 180M may also contact the pulse of the human body to receive the blood pressure pulsation signal. In some embodiments, bone conduction sensor 180M may also be provided in a headset, in combination with an osteoinductive headset. The audio module 170 may analyze the voice signal based on the vibration signal of the sound portion vibration bone block obtained by the bone conduction sensor 180M, so as to implement a voice function. The application processor may analyze the heart rate information based on the blood pressure beat signal acquired by the bone conduction sensor 180M, so as to implement a heart rate detection function.

The keys 190 include a power-on key, a volume key, etc. The keys 190 may be mechanical keys. Or may be a touch key. The electronic device 100 may receive key inputs, generating key signal inputs related to user settings and function controls of the electronic device 100.

The motor 191 may generate a vibration cue. The motor 191 may be used for incoming call vibration alerting as well as for touch vibration feedback. For example, touch operations acting on different applications (e.g., photographing, audio playing, etc.) may correspond to different vibration feedback effects. The motor 191 may also correspond to different vibration feedback effects by touching different areas of the display screen 194. Different application scenarios (such as time reminding, receiving information, alarm clock, game, etc.) can also correspond to different vibration feedback effects. The touch vibration feedback effect may also support customization.

The indicator 192 may be an indicator light, may be used to indicate a state of charge, a change in charge, a message indicating a missed call, a notification, etc.

The SIM card interface 195 is used to connect a SIM card. The SIM card may be inserted into the SIM card interface 195, or removed from the SIM card interface 195 to enable contact and separation with the electronic device 100. The electronic device 100 may support 1 or N SIM card interfaces, N being a positive integer greater than 1. The SIM card interface 195 may support Nano SIM cards, micro SIM cards, and the like. The same SIM card interface 195 may be used to insert multiple cards simultaneously. The types of the plurality of cards may be the same or different. The SIM card interface 195 may also be compatible with different types of SIM cards. The SIM card interface 195 may also be compatible with external memory cards. The electronic device 100 interacts with the network through the SIM card to realize functions such as communication and data communication. In some embodiments, the electronic device 100 employs esims, i.e.: an embedded SIM card. The eSIM card can be embedded in the electronic device 100 and cannot be separated from the electronic device 100.

Fig. 6 is a software configuration block diagram of the electronic device 100 according to the embodiment of the present invention.

The layered architecture divides the software into several layers, each with distinct roles and branches. The layers communicate with each other through a software interface. In some embodiments, the Android system is divided into four layers, from top to bottom, an application layer, an application framework layer, an Zhuoyun row (Android running time) and system libraries, and a kernel layer, respectively.

The application layer may include a series of application packages.

As shown in fig. 6, the application package may include applications (also referred to as applications) such as headset presence detection modules, gallery, calendar, talk, map, navigation, WLAN, bluetooth, music, camera, short messages, etc. The earphone in-place detection module is configured to execute the earphone in-place detection method provided by the embodiment of the present application, and for related description of the earphone in-place detection module, please refer to other embodiments of the present application.

It will be appreciated that more or fewer applications may be included in the electronic device of embodiments of the present application, and are not limited to the applications shown in fig. 6.

The application framework layer provides an application programming interface (application programming interface, API) and programming framework for application programs of the application layer. The application framework layer includes a number of predefined functions.

As shown in fig. 6, the application framework layer may include a window manager, a content provider, a view system, a phone manager, a resource manager, a notification manager, a Local Profile management assistant (Local ProfileAssistant, LPA), and the like.

The window manager is used for managing window programs. The window manager can acquire the size of the display screen, judge whether a status bar exists, lock the screen, intercept the screen and the like.

The content provider is used to store and retrieve data and make such data accessible to applications. The data may include video, images, audio, calls made and received, browsing history and bookmarks, phonebooks, etc.

The view system includes visual controls, such as controls to display text, controls to display pictures, and the like. The view system may be used to build applications. The display interface may be composed of one or more views. For example, a display interface including a text message notification icon may include a view displaying text and a view displaying a picture.

The telephony manager is used to provide the communication functions of the electronic device 100. Such as the management of call status (including on, hung-up, etc.).

The resource manager provides various resources for the application program, such as localization strings, icons, pictures, layout files, video files, and the like.

The notification manager allows the application to display notification information in a status bar, can be used to communicate notification type messages, can automatically disappear after a short dwell, and does not require user interaction. Such as notification manager is used to inform that the download is complete, message alerts, etc. The notification manager may also be a notification presented in the form of a chart or scroll bar text in the system top status bar, such as a notification of a background running application, or a notification presented on a screen in the form of a dialog interface. For example, a text message is prompted in a status bar, a prompt tone is emitted, the electronic device vibrates, and an indicator light blinks, etc.

It is understood that the inclusion of the earphone presence detection module in the application layer is merely an example, and the earphone presence detection module may also be included in the application framework layer, which is not limited in this embodiment of the present application.

Android Runtime (Android run) includes a core library and virtual machines. Android run time is responsible for scheduling and management of the Android system.

The core library consists of two parts: one part is a function which needs to be called by java language, and the other part is a core library of android.

The application layer and the application framework layer run in a virtual machine. The virtual machine executes java files of the application program layer and the application program framework layer as binary files. The virtual machine is used for executing the functions of object life cycle management, stack management, thread management, security and exception management, garbage collection and the like.

The system library may include a plurality of functional modules. For example: surface manager (surface manager), media Libraries (Media Libraries), three-dimensional graphics processing Libraries (e.g., openGL ES), two-dimensional graphics engines (e.g., SGL), etc.

The surface manager is used to manage the display subsystem and provides a fusion of two-Dimensional (2D) and three-Dimensional (3D) layers for multiple applications.

Media libraries support a variety of commonly used audio, video format playback and recording, still image files, and the like. The media library may support a variety of audio and video encoding formats, such as MPEG4, h.264, MP3, AAC, AMR, JPG, PNG, etc.

The three-dimensional graphic processing library is used for realizing 3D graphic drawing, image rendering, synthesis, layer processing and the like.

The 2D graphics engine is a drawing engine for 2D drawing.

The kernel layer is a layer between hardware and software. The kernel layer at least comprises a display driver, a camera driver, an audio driver, a sensor driver and a virtual card driver.

The workflow of the electronic device 100 software and hardware is illustrated below in connection with capturing a photo scene.

When touch sensor 180K receives a touch operation, a corresponding hardware interrupt is issued to the kernel layer. The kernel layer processes the touch operation into the original input event (including information such as touch coordinates, time stamp of touch operation, etc.). The original input event is stored at the kernel layer. The application framework layer acquires an original input event from the kernel layer, and identifies a control corresponding to the input event. Taking the touch operation as a touch click operation, taking a control corresponding to the click operation as an example of a control of a camera application icon, the camera application calls an interface of an application framework layer, starts the camera application, further starts a camera driver by calling a kernel layer, and captures a still image or video by the camera 193.

As used in the above embodiments, the term "when …" may be interpreted to mean "if …" or "after …" or "in response to determination …" or "in response to detection …" depending on the context. Similarly, the phrase "at the time of determination …" or "if detected (a stated condition or event)" may be interpreted to mean "if determined …" or "in response to determination …" or "at the time of detection (a stated condition or event)" or "in response to detection (a stated condition or event)" depending on the context.

In the above embodiments, it may be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loaded and executed on a computer, produces a flow or function in accordance with embodiments of the present application, in whole or in part. The computer may be a general purpose computer, a special purpose computer, a computer network, or other programmable apparatus. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from one website, computer, server, or data center to another website, computer, server, or data center by a wired (e.g., coaxial cable, fiber optic, digital subscriber line), or wireless (e.g., infrared, wireless, microwave, etc.). The computer readable storage medium may be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. that contains an integration of one or more available media. The usable medium may be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid state disk), etc.

Those of ordinary skill in the art will appreciate that implementing all or part of the above-described method embodiments may be accomplished by a computer program to instruct related hardware, the program may be stored in a computer readable storage medium, and the program may include the above-described method embodiments when executed. And the aforementioned storage medium includes: ROM or random access memory RAM, magnetic or optical disk, etc.

The above embodiments are merely for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. The earphone in-place detection method is characterized by being applied to electronic equipment comprising an earphone seat, wherein the earphone seat comprises a detection signal DET pin, a LEFT sound channel LEFT pin, a microphone MIC pin and a first resistor; the first end of the MIC pin is communicated with the negative electrode of the power supply voltage, the second end of the first resistor is communicated with the positive electrode of the power supply voltage, and the first end of the first resistor is communicated with the second end of the MIC pin through a target contact section on an earphone plug when the earphone plug is inserted into the earphone seat, wherein the target contact section is a microphone MIC contact section or a grounding GND contact section on the earphone plug; the method comprises the following steps:

After the DET pin and the LEFT pin are communicated, acquiring a target noise signal through the MIC pin;

determining that the earphone is out of position under the condition that the noise wavelength type of the target noise signal is not contained in the preset noise wavelength type; or,

and under the condition that the noise wavelength type of the target noise signal is contained in the preset noise wavelength type, determining that the earphone is in place, wherein the preset noise wavelength type is used for indicating that the first end of the first resistor is communicated with the second end of the MIC pin.

2. The method of claim 1, wherein the predetermined noise wavelength type includes a noise wavelength type of noise other than a noise wavelength type of white noise.

3. The method of claim 1 or 2, wherein the target contact is a MIC contact in a four-segment earphone plug, or a GND contact in a three-segment earphone plug;

the preset noise wavelength types comprise a first preset noise wavelength type and a second preset noise wavelength type, the second preset noise wavelength type is consistent with the noise wavelength type of the background noise, and the first preset noise wavelength type is a noise wavelength type except the noise wavelength type of the background noise and the noise wavelength type of the white noise; the first preset noise wavelength type is used for indicating that a first end of the first resistor is communicated with a second end of the MIC pin through a MIC contact section in the four-section earphone plug, and the second preset noise wavelength type is used for indicating that the first end of the first resistor is communicated with a second end of the MIC pin through a GND contact section in the three-section earphone plug.

4. The method of claim 3, wherein the determining that the headset is out of position is performed if the noise wavelength type of the target noise signal is determined not to be included in a predetermined noise wavelength type; or, in the case that the noise wavelength type of the target noise signal is determined to be included in the preset noise wavelength type, determining that the earphone is in place includes:

determining that a headset is out of position if it is determined that the noise wavelength type of the target noise signal is not included in the first preset noise wavelength type and is not included in the second preset noise wavelength type; or,

determining that the four-segment earphone is in place under the condition that the noise wavelength type of the target noise signal is contained in a first preset noise wavelength type; or,

and determining that the three-section earphone is in place under the condition that the noise wavelength type of the target noise signal is determined to be contained in the second preset noise wavelength type.

5. The method of claim 1 or 2, wherein after the determining that the headset is not in place, the method further comprises:

and outputting prompt information, wherein the prompt information is used for indicating other conductive substances except for the earphone plug to enter the earphone seat.

6. The method of claim 3, wherein after the determining that the headset is not in place, the method further comprises:

7. The method of claim 4, wherein after the determining that the headset is not in place, the method further comprises:

8. An electronic device, the electronic device comprising: one or more processors, memory, and a display screen;

the memory is coupled to the one or more processors, the memory for storing computer program code comprising computer instructions that the one or more processors invoke to cause the electronic device to perform the method of any of claims 1-7.

9. A chip system for application to an electronic device, the chip system comprising one or more processors for invoking computer instructions to cause the electronic device to perform the method of any of claims 1-7.

10. A computer readable storage medium comprising instructions which, when run on an electronic device, cause the electronic device to perform the method of any of claims 1-7.