CN115776975A - Glass with at least one electrically and/or thermally conductive feed-through, method for the production thereof and use thereof - Google Patents
Glass with at least one electrically and/or thermally conductive feed-through, method for the production thereof and use thereof Download PDFInfo
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- CN115776975A CN115776975A CN202080100576.9A CN202080100576A CN115776975A CN 115776975 A CN115776975 A CN 115776975A CN 202080100576 A CN202080100576 A CN 202080100576A CN 115776975 A CN115776975 A CN 115776975A
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- 239000011521 glass Substances 0.000 title claims description 198
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- 238000010438 heat treatment Methods 0.000 description 5
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- 229910045601 alloy Inorganic materials 0.000 description 2
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- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
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- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Organic Chemistry (AREA)
- Joining Of Glass To Other Materials (AREA)
- Photovoltaic Devices (AREA)
Abstract
The present invention provides a method of making a glazing having at least one electrically and/or thermally conductive feed-through connection, and a glazing having at least one electrically and/or thermally conductive feed-through connection, which is capable of providing a sealed path for transporting electrical current and/or heat through the glazing without the need to make an opening in the interior of the glazing.
Description
The invention relates to a method for producing a glazing having at least one electrically and/or thermally conductive feed-through connection and to a glazing having at least one electrically and/or thermally conductive feed-through connection.
Glass is used as a back glass for solar cells or flat panel displays to seal and protect electronic components and/or layers. The electrically conductive feed-through connections in the back glass are usually realized by openings in the back glass which are used for feed-through electrical connections and which are mechanically produced, for example by drilling or laser cutting.
A non-open conductive feed-through connection in the back glass is not present in the prior art to date.
In the prior art, glass substrates with conductive layers are known. These coated glass substrates only show electrical conductivity in the plane of the glass substrate and do not have electrical conductivity in the plane perpendicular to the plane of the glass substrate, and therefore these coated glass substrates are not suitable for use in conductive feed-through connections.
DE1928005C discloses a method for producing float glass with wire reinforcement. The molten glass mixture is cast onto a liquid bath of tin to form a glass layer. At a temperature of 1050 ℃ of the glass layer, the wire reinforcement is inserted into the glass layer without the insertion device contacting the surface of the glass layer. Wire-reinforced float glass is used as safety glass and does not provide any electrical conductivity in the direction perpendicular to the plane of the glass.
DE102014102256A1 describes a glass article with embedded fluorescent particles and an apparatus and method for making the same; the glass product is, for example, a plate glass. The glass article includes a surface, a first type of particle, and a second type of particle. The particles have optically functional properties, such as non-scattering high refractive index particles, scattering particles, radiation absorbing particles and/or wavelength converting particles, which may be or comprise TiO 2 、ZnO、ITO、AZO、Al 2 O 3 And IZO. The glass article is made by distributing a first type of particle through a first surface in a molten glass matrix such that the particle is completely surrounded by the molten glass matrix. Such glass articles may be formed andarranged opposite to the extraction structure and/or the coupling structure of the electromagnetic radiation and acting as a carrier and/or a cover for the optoelectronic component, such as a light emitting diode. Particles within such glass articles do not provide a conductive feedthrough connection.
It is an object of the present invention to provide a method for producing a glazing having at least one electrically and/or thermally conductive feed-through connection and a glazing having at least one electrically and/or thermally conductive feed-through connection.
In order to achieve the object defined above, the invention provides a method for producing a glazing having at least one electrically and/or thermally conductive feed-through connection and a glazing having at least one electrically and/or thermally conductive feed-through connection, and also further preferred embodiments.
A method of making glass having at least one electrically and/or thermally conductive feed-through connection, comprising:
a) Providing a glass substrate having at least one molten zone;
b) Inserting at least one electrically and/or thermally conductive element into at least one melting region of the glass substrate, the at least one electrically and/or thermally conductive element forming at least one electrically and/or thermally conductive feed-through connection; and
c) The glass substrate with the at least one electrically and/or thermally conductive element inserted is further processed to form a glass with the at least one electrically and/or thermally conductive element.
Wherein at least one molten zone of the glass matrix in step b) has a kinematic viscosity of 10 5 To 10 12 Pa.s at a temperature of 400 to 800 ℃.
An electrically and/or thermally conductive feed-through connection refers to a sealed path within the glass formed by an electrically and/or thermally conductive element that transfers current and/or heat from a first surface of the glass to a second surface of the glass. The first and second surfaces of the glass are both planar, which may be flat or curved planes and perpendicular to the thickness direction of the glass. For example, if the glass is a flat glass in the form of a glass sheet, the first and second surfaces of the glass are parallel planes perpendicular to the thickness direction of the glass and are spaced apart from each other by the thickness of the glass sheet. Advantageously, such electrically and/or thermally conductive feed-through connections within the glass allow electrically and/or thermally conductive hermetic connections and/or pathways to be achieved throughout the glass in devices such as solar modules, flat panel displays, and the like, without the need to make openings in the glass. A sealed path within the glass means that at least one electrically and/or thermally conductive feed-through connection formed by electrically and/or thermally conductive elements is sealed to prevent gas, liquid and/or solid foreign agents from passing through the surrounding glass matrix. In one embodiment, at least one electrically and/or thermally conductive feed-through connection is vacuum.
The glass substrate is a non-conductive, non-metallic, inorganic glass substrate. The non-conductive, non-metallic, inorganic glass matrix may be a non-oxide based glass matrix or an oxide based glass matrix. The non-oxide-based glass matrix is, for example, a halide glass or a chalcogenide glass. The oxide-based glass matrix may be a phosphate glass, a silicate glass, or a borate glass. The borate glass is, for example, an alkali metal borate glass. Silicate glass is for example aluminosilicate glass, lead silicate glass, alkali-alkaline earth silicate glass or borosilicate glass; such as soda-lime-silicate glass. In one embodiment, the glass matrix is an oxide-based glass matrix, preferably a soda lime glass matrix.
In one embodiment, at least one melting region of the glass substrate has a 10 in the range of 200 ℃ to 700 ℃ 1 To 10 7 S·m -1 The electrical conductivity of (1).
The glass matrix is obtained by mixing and melting raw materials. Mixing and melting can be performed as a batch or a continuous process, meaning that a quantity of raw materials are mixed and melted to form a glass melt, or the raw materials are continuously mixed and melted to continuously provide a glass melt. The melting temperature of the raw materials depends on the type of glass and the type of raw materials and is known to the person skilled in the art and is generally above 1200 ℃. The glass melt is typically refined to remove gas bubbles, which are typically contained in the glass melt and constitute glass defects in the glass matrix. Refining methods are known to the person skilled in the art, for example based on chemical reactions with refining agents, high-temperature and stirring treatments, ultrasonic treatments or blowing of gases directly into the glass melt. After refining, the glass melt may be shaped and/or shaped and then cooled to form a glass matrix.
Shaping and/or shaping of the refined glass melt is accomplished by known methods such as casting, rolling, drawing, bending, etc., wherein the shaping and/or shaping of the glass melt can be performed before or during cooling of the glass melt. The glass substrate manufactured in this manner includes, for example, a flat glass substrate or a bent glass substrate.
After shaping and/or setting, the glass substrate is cooled to room temperature.
The glass substrate having at least one molten zone may be a flat glass, a bent glass or a laminated glass obtained by mixing and melting, refining, shaping and/or setting, cooling and locally heating at least one zone of the glass substrate. In one embodiment, the glass substrate having at least one melted region provided in step a) is selected from a flat glass substrate, a bent glass substrate, a flat laminated glass substrate, or a combination thereof, each glass substrate having at least one melted region.
Providing the glass substrate of step a) having at least one molten zone by locally heating at least one zone of the glass substrate.
According to step b), inserting at least one electrically and/or thermally conductive element into at least one melting region of the glass matrix, wherein the kinetic viscosity of the at least one melting region of the glass matrix is 10 5 To 10 12 Pa.s at 400-800 deg.C.
Advantageously, the dynamic viscosity of at least one molten zone of the glass matrix allows the at least one electrically and/or thermally conductive element to be inserted into the glass matrix at a determined position without the risk of the at least one electrically and/or thermally conductive element flowing into the molten glass matrix.
The inserted at least one electrically and/or thermally conductive element forms at least one electrically and/or thermally conductive feed-through connection. Thus, at least one electrically and/or thermally conductive element is inserted into at least one melted region of the glass substrate such that the first and second surfaces of the electrically conductive element are integrated at the first and second surfaces of the glass substrate. As a result, the first and second surfaces of the conductive element become part of the first and second surfaces of the glass substrate, respectively. The first and second surfaces of the conductive element are referred to as planes, which may be flat or curved planes, and are perpendicular to the thickness direction of the conductive element, and if the planes are flat planes, they are spaced apart from each other by the thickness of the conductive element. In one embodiment, the thickness of the conductive element is greater than the thickness of the glass substrate. Thus, after inserting the conductive element in at least one melted region of the glass matrix, the conductive element extends onto at least one surface of the glass matrix, which means that the conductive element penetrates at least one surface of the glass matrix. In one embodiment, the electrically and/or thermally conductive element is inserted in step b) such that one surface of the electrically and/or thermally conductive element is integrated in one surface of the glass substrate and the other surface of the electrically conductive element extends beyond the other surface of the glass substrate.
According to the invention, in step c) the glass substrate with the at least one electrically and/or thermally conductive element inserted is further processed to form a glass with at least one electrically and/or thermally conductive feed-through connection. Further processing means that the glass substrate with the at least one electrically and/or thermally conductive element inserted therein is cooled at least to room temperature.
In one embodiment, the further processing in step c) comprises heat treatment of the glass substrate. The heat treatment may be carried out before, during or after cooling the glass substrate in step c). Advantageously, the mechanical stress between the inserted conductive element and the glass matrix will be reduced. In one embodiment, the heat treatment is performed locally in the area around the inserted at least one electrically and/or thermally conductive element.
If step a) provides a flat glass substrate having at least one molten zone, the further processing in step c) may also include a lamination and/or bending process to form a laminated and/or bent glass having at least one electrically and/or thermally conductive feed-through connection. The laminating and/or bending process may be performed after cooling the glass substrate in step c). In one embodiment, the laminated foil for lamination comprises at least one hole or at least one electrically conductive area at the location of at least one electrically conductive element, if at least two glasses are laminated, each comprising at least one interposed electrically and/or thermally conductive element. Advantageously, the solution of the invention avoids the presence of a non-conductive laminated foil at the interface between at least two laminated glasses, where an electrically and/or thermally conductive element is interposed. In another embodiment it may be advantageous to add a solid or fluid electrically and/or thermally conductive medium to at least one hole of the laminated foil. During lamination, the electrically and/or thermally conductive medium will fill the at least one hole to provide an electrically conductive connection at the interface of the inserted electrically and/or thermally conductive element.
In another embodiment, if one of the glasses being laminated comprises at least one electrically and/or thermally conductive element extending from the first surface of the glass substrate to the second surface of the glass substrate, the other glass being laminated comprises at least one electrically and/or thermally conductive element extending from the first surface of the glass substrate beyond the second surface of the glass substrate, the interposed electrically conductive elements being in contact with each other during lamination with the laminated foil comprising holes at the locations of the interposed electrically conductive elements to form an electrically conductive feed-through connection inside the laminated glass. In another embodiment, the intervening conductive elements that are in contact with each other during lamination may additionally be welded together by, but not limited to, ultrasonic techniques, laser welding, high current welding, and the like.
The further processing in step c) may also comprise depositing layers on the glass with the at least one electrically and/or thermally conductive feed-through connection, or depositing at least one contact material on at least one surface of the at least one interposed electrically and/or thermally conductive element. Advantageously, the contact material increases the contact area, which can serve as a contact point for more external electrical connectors.
In a preferred embodiment, step a) provides a fully molten glass matrix. The kinetic viscosity of the fully molten glass matrix was 10 5 ～10 12 Pa.s at a temperature of 400～800℃。
A fully molten glass matrix may be obtained by mixing and melting and refining, such as by making flat glass, prior to shaping and/or setting the glass melt.
It is well known that the kinetic viscosity of a molten glass matrix or at least one molten region of a glass matrix depends on the temperature of the molten glass matrix or molten region of a glass matrix. In general, dynamic viscosity decreases with increasing temperature. As known to those skilled in the art, the kinematic viscosity of the molten glass matrix or molten region of the glass matrix can be determined by a variety of techniques, such as, but not limited to, parallel plate viscometry, ball penetration viscometry, rotating concentric cylinder viscometry, and fiber elongation viscometry, with rotating concentric cylinder viscometry being preferred.
It is also known that the dynamic viscosity of a completely molten glass matrix or a molten region of a glass matrix, suitable for inserting at least one electrically and/or thermally conductive element, depends on the type of glass matrix and the molten raw materials.
In one embodiment, step a) provides a fully molten glass matrix having a temperature below the melting point of the raw material species and above the forming temperature of the glass melt. It is known that the forming temperature depends on the kind of glass and the kind of raw material.
In one embodiment, step a) provides SiO 2 -NaCO 3 A fully molten glass matrix. In step b), in the completely molten SiO 2 -NaCO 3 The temperature of the glass substrate is 700 ℃ to 800 ℃ and the dynamic viscosity is 10 5 To 10 7 Pa s, inserting at least one electrically and/or thermally conductive element into the completely melted SiO 2 -NaCO 3 In a glass matrix.
In one embodiment, the at least one electrically and/or thermally conductive element in step b) is inserted by a positioning device. In one embodiment, the positioning device comprises a feeding device and a punching device, wherein the feeding device is used for at least one electrically and/or thermally conductive element. The feeding device and the punching device are disposed opposite to each other, such as a feeding device near a first surface of the glass substrate and a punching device near a second surface of the glass substrate. By "adjacent to the first or second surface" is meant that the feeding device or the punching device is disposed at an angle of 90 ° to the first or second surface of the glass substrate. The feed device allows linear movement of the conductive element in a direction perpendicular to the surface of the glass substrate to insert the conductive element into at least one molten region of the glass substrate. The punching device comprises a hole with sharp edges, wherein the size of the hole is the same as the size of the electrically and/or thermally conductive element to be inserted into the at least one molten zone of the glass substrate. The punching device is replaceable to adjust the punching device to any size of conductive element. Further, the punching device does not perform a linear movement in a direction perpendicular to the surface of the glass substrate. Upon insertion of the electrically and/or thermally conductive element, the feeding device is moved toward the glass substrate to insert the electrically conductive element into at least one molten region of the glass substrate. The inserted conductive element thereby removes a melted region of the glass matrix or a region of the fully melted glass matrix that is pushed into the hole of the punching device. The punching device may further comprise at least one cutting blade located at a side of the punching device facing one of the surfaces of the glass substrate for removing any thin layer of the glass substrate still present on the surface of the electrically conductive element and for opening and closing the hole of the punching device. In one embodiment, the thin layer of glass matrix that remains on the surface of the conductive element after insertion may be removed by additional processing (e.g., polishing and/or laser ablation). This additional treatment can be carried out before, during or after cooling of the matrix glass in step c).
In another embodiment, the positioning device comprises a feeding device and at least two manipulator devices. The feed device and the at least two manipulator devices may be disposed proximate the same surface of the fully molten glass substrate. The manipulator device is adapted to temporarily open a hole at a designated location in the fully melted glass matrix for insertion of at least one electrically and/or thermally conductive element.
In a preferred embodiment, the at least one electrically and/or thermally conductive element in step b) comprises at least one of a wire, a strip, a rod and a pre-powdered element.
Advantageously, commercially available wires, ribbons and rods are of various sizes and materials that are easily inserted into the molten glass matrix.
By pre-manufactured powder element is meant a pressed and/or sintered element made of at least one powder material. Advantageously, the pressed and/or sintered powder elements provide good electrical and/or thermal conductivity.
In a preferred embodiment, at least one electrically and/or thermally conductive element is made of a material having a melting point higher than 550 ℃.
Advantageously, the melting point of the material of the at least one electrically and/or thermally conductive element is higher than the softening point of the glass, so that the at least one electrically and/or thermally conductive element does not melt when the glass with the at least one electrically and/or thermally conductive element is manufactured.
In one embodiment, at least one electrically and/or thermally conductive element is made of a material having a melting point below 2000 ℃.
In a preferred embodiment, the at least one electrically and/or thermally conductive element is made of a material comprising at least one of a metal, a metal alloy, a metal compound and an electrically conductive semiconductor.
Examples of the metal, metal alloy and metal compound include transition metals, alkali metals, alloys of the above metals and compounds of the above metals. Wherein, the transition metal includes but is not limited to Cu, mo, cr, ag; alkali metals include, but are not limited to, al.
The conductive semiconductor is a doped semiconductor, e.g. an elemental semiconductor, such as Si, ge, C-based semiconductor, or a compound semiconductor, such as GaAs, in 2 O 3- 、SnO 2 ZnO, etc.
Advantageously, the electrically and/or thermally conductive element provides good electrically and/or thermally conductive properties. In one embodiment, the at least one electrically and/or thermally conductive element has a thickness of greater than 10 3 S·m -1 The electrical conductivity of (1). In another embodiment, at least one electrically and/or thermally conductive element has a thickness of more than 50W · m -1 ·K -1 Thermal conductivity of (2).
The invention also provides a glazing with at least one electrically and/or thermally conductive feed-through connection, comprising at least one electrically and/or thermally non-conductive glass matrix and at least one electrically and/or thermally conductive element. At least one electrically and/or thermally conductive element is disposed in the at least one electrically and/or thermally non-conductive glass substrate such that the at least one electrically and/or thermally conductive element extends from a first surface of the at least one electrically and/or thermally non-conductive glass substrate to a second surface of the at least one electrically and/or thermally non-conductive glass substrate and forms an electrically and/or thermally conductive feed-through connection.
The non-conductive and/or non-conductive glass substrate may be any type of non-conductive, inorganic non-metallic glass substrate, such as quartz glass, soda lime glass, solar glass, or display glass. The inorganic non-metallic glass matrix may be a non-oxide based glass or an oxide based glass, wherein the non-oxide based glass is, for example, a halide glass or a chalcogenide glass. The oxide-based glass may be a phosphate glass, a silicate glass, or a borate glass, such as an alkali borate glass. The silicate glass may be an aluminosilicate glass, a lead silicate glass, an alkali-alkaline earth silicate glass, or a borosilicate glass, such as a soda-lime silicate glass. Preferably, the electrically and/or thermally non-conductive glass substrate is a solar glass or a display glass. Solar glass or display glass refers to insulating inorganic non-metallic glass in which the content of iron and/or alkali elements is reduced, such as soda lime.
At least one electrically and/or thermally conductive element, as an electrically and/or thermally conductive element, forms an electrically and/or thermally conductive feed-through connection in the glass. An electrically and/or thermally conductive feed-through connection refers to a sealed path within the glass formed by an electrically and/or thermally conductive element that transfers current and/or heat from a first surface to a second surface of the glass.
The first and second surfaces of at least one non-electrically and/or thermally conductive glass substrate are planar, may be flat or curved planar, and are perpendicular to the direction of the thickness of the glass substrate. The thickness of the glass substrate is the extension of the glass in a direction perpendicular to the plane of the glass.
In one embodiment, the glass having at least one electrically and/or thermally conductive feed-through connection is present in the form of a flat glass, a bent glass, a laminated glass or a combination thereof.
Flat glass refers to glass having a first surface and a second surface that are parallel to each other and spaced apart from each other by the thickness of the glass, wherein the direction of the thickness is perpendicular to the first and second surfaces of the glass.
Curved glass refers to glass having a first surface and a second surface, each of which is a curved surface and spaced from each other by the thickness of the glass.
Laminated glass refers to glass laminated together by at least two non-conductive and/or non-conductive glass substrates through a polymer foil such that one surface of a first non-conductive and/or non-conductive glass substrate is bonded to one surface of a second non-conductive and/or non-conductive glass substrate through the polymer foil. The laminated glass may be a flat laminated glass or a bent laminated glass.
In one embodiment, a glass having at least one electrically and/or thermally conductive feedthrough connection includes: a coating on at least one surface of at least one electrically and/or thermally non-conductive glass substrate. The coating comprising, for example, an anti-reflective coating or a conductive coating
Advantageously, such electrically and/or thermally conductive feedthrough connections within the glass can enable electrically and/or thermally conductive hermetic connections throughout the glass in devices such as solar modules, flat panel displays, and the like, without the need to make openings in the glass. A sealed path within the glass means that at least one electrically and/or thermally conductive feed-through connection formed by electrically and/or thermally conductive elements is sealed, preventing gaseous, liquid and/or solid foreign agents from passing through the surrounding glass matrix. In one embodiment, at least one electrically and/or thermally conductive feed-through connection is vacuum.
In a preferred embodiment, the at least one electrically and/or thermally conductive element comprises at least one of a wire, a strip, a rod and a pre-powdered element.
Advantageously, commercially available wires, ribbons and rods are of various sizes and materials. Furthermore, the pre-formed powder elements can be obtained in a customized form and provide good electrical and/or thermal conductivity.
In a preferred embodiment, the at least one electrically and/or thermally conductive element comprises at least one of a metal, a metal alloy, a metal compound and an electrically conductive semiconductor.
Examples of the metal, metal alloy and metal compound include transition metals, alkali metals, alloys of the above metals and compounds of the above metals. Wherein, the transition metal includes but is not limited to Cu, mo, cr, ag; alkali metals include, but are not limited to, al.
The conductive semiconductor is a doped semiconductor, e.g. an elemental semiconductor, such as Si, ge, C-based semiconductor, or a compound semiconductor, such as GaAs, in 2 O 3- 、SnO 2 ZnO, etc.
Advantageously, the electrically and/or thermally conductive element provides good electrically and/or thermally conductive properties. In one embodiment, the at least one electrically and/or thermally conductive element has a thickness of greater than 10 3 S·m -1 The electrical conductivity of (1). In another embodiment, at least one electrically and/or thermally conductive element has a thickness of more than 50W · m -1 ·K -1 Thermal conductivity of (2).
In a preferred embodiment, the glass with at least one electrically and/or thermally conductive feed-through connection according to the invention is used as a back glass for a solar module or as a glass substrate for a flat panel display or a light-emitting device.
Advantageously, the glass having at least one electrically and/or thermally conductive feed-through connection provides a sealed environment for the electronic components of the solar module, flat panel display or light emitting device from the outside atmosphere, since no openings are required inside the glass, which can transport gaseous, liquid and/or solid foreign agents to the electronic components. Furthermore, advantageously, the glass having at least one electrically and/or thermally conductive feed-through connection may provide suitable electrical interconnections for electronic components of a solar module, flat panel display or light emitting device having an external electrical connector (e.g., junction box).
The invention provides a method for producing a glazing having at least one electrically and/or thermally conductive feed-through connection and a glazing having at least one electrically and/or thermally conductive feed-through connection, which are explained by way of illustration in the following exemplary embodiments and the drawings, without the invention being restricted thereto. Any modifications, variations, equivalent arrangements, and combinations thereof, should be considered to be within the scope of the present invention.
Drawings
Fig. 1 shows a specific embodiment of a method for producing a glazing having at least one electrically and/or thermally conductive feed-through connection.
FIG. 2 shows an embodiment of a glass with at least one electrically and/or thermally conductive feed-through connection
Examples
According to fig. 1, a glass having at least one electrically and/or thermally conductive feed-through connection is prepared by providing a fully molten glass matrix in step S1. The completely molten glass matrix provided in step S1 is a soda-lime glass matrix obtained by mixing and melting raw materials having a composition of 70% SiO 2 、15％ Na 2 O, 9% CaO and 6% other raw materials. Soda-lime glass melts are refined to remove bubbles. The soda-lime glass melt was shaped into a flat glass substrate by rolling and cooled to 700 ℃.
Subsequently, in step S2, an electrically and/or thermally conductive element is inserted into the fully molten soda-lime-silica glass matrix, the temperature of which is 700 ℃ and the kinematic viscosity of which is 10 7 Pa · s, measured by the rotating concentric cylinder viscometry. An electrically and/or thermally conductive element is inserted such that it forms at least one electrically and/or thermally conductive feed-through connection. The electrically and/or thermally conductive element is a Cu/Cr wire having a diameter of 3mm to 5mm and a length of 3.2mm to 3.5mm.
Then, in step S3, the molten glass matrix with the inserted electrically and/or thermally conductive wire elements is further processed to form a flat glass with electrically and/or thermally conductive feed-through connections by cooling to room temperature.
Fig. 2 shows a plate glass with at least one electrically and/or thermally conductive feed-through connection 1, comprising: an electrically and/or thermally non-conductive glass substrate 10 and an electrically and/or thermally conductive element 2. Having at least one electrical and/or thermal conductorThe plate glass of the feedthrough connection 1 has a thickness of 3.2mm and a width and length of 1200cm and 1600cm, respectively. The electrically and/or thermally non-conductive glass substrate 10 is a soda lime glass substrate. The electrically and/or thermally conductive element 2 is a prefabricated powder element made of SnO 2 Pressing and sintering the powder. The prefabricated powder elements 2 have a diameter of 5mm to 10mm and a length of 3.2mm to 3.5mm. Electrically and/or thermally conductive SnO 2 The powder component 2 is disposed within the soda-lime glass matrix 10, extending from a first surface 11 of the soda-lime glass matrix 10 to a second surface 12 of the soda-lime glass matrix 10.
The features of the claims are combined with the embodiments described above to advantage. However, the embodiments described in the specification are merely for illustration, and the present invention is not limited thereto. Any modifications, variations, equivalent arrangements, and combinations thereof, of the embodiments should be considered to be within the scope of the present invention.
Reference numerals
1. Glass with at least one electrically and/or thermally conductive feed-through connection
10. Non-conductive and/or non-conductive glass matrix
11. First surface of glass substrate which is electrically and/or thermally non-conductive
12. Second surface 2 of the electrically and/or thermally non-conductive glass substrate is an electrically and/or thermally conductive element
Claims (9)
1. A method of making glass having at least one electrically and/or thermally conductive feed-through connection, comprising:
a) Providing a glass substrate having at least one molten zone;
b) Inserting at least one electrically and/or thermally conductive element into at least one melting region of the glass substrate such that the at least one electrically and/or thermally conductive element forms at least one electrically and/or thermally conductive feed-through connection; and
c) Further processing the glass substrate with the at least one electrically and/or thermally conductive element inserted therein to form a glass with at least one electrically and/or thermally conductive feed-through connection;
wherein at least one molten zone of the glass matrix in step b) has a kinematic viscosity of 10 5 To 10 12 Pa.s at a temperature of 400 to 800 ℃.
2. The method of claim 1, wherein the glass matrix in step a) is fully molten.
3. The method according to claim 1 or 2, wherein the at least one electrically and/or thermally conductive element inserted in step b) comprises: at least one of a wire, a ribbon, a rod, and a pre-formed powder element.
4. A method as in any one of the claims from 1 to 3, wherein the at least one electrically and/or thermally conductive element inserted in step b) is made of a material having a melting point higher than 550 ℃.
5. The method of claim 4, wherein the at least one electrically and/or thermally conductive element is made of a material comprising at least one of a metal, a metal alloy, a metal compound, and an electrically conductive semiconductor.
6. A glazing having at least one electrically and/or thermally conductive feed-through connection, comprising: at least one electrically and/or thermally non-conductive glass matrix and at least one electrically and/or thermally conductive element,
wherein the at least one electrically and/or thermally conductive element is arranged inside the at least one electrically and/or thermally non-conductive glass substrate such that the at least one electrically and/or thermally conductive element extends from a first surface of the at least one electrically and/or thermally non-conductive glass substrate to a second surface of the at least one electrically and/or thermally non-conductive glass substrate and forms an electrically and/or thermally conductive feed-through connection.
7. The glass having at least one electrically and/or thermally conductive feed-through connection of claim 6, wherein the at least one electrically and/or thermally conductive element comprises at least one of a wire, a ribbon, a rod, and a pre-powder element.
8. The glass having at least one electrically and/or thermally conductive feed-through connection of claim 7, wherein the at least one electrically and/or thermally conductive element comprises at least one of a metal, a metal alloy, a metal compound, and an electrically conductive semiconductor.
9. Use of a glass having at least one electrically and/or thermally conductive feed-through connection as claimed in any of claims 6 to 8 as a back glass for solar modules or as a glass substrate in flat panel displays or light emitting devices.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/088633 WO2021223070A1 (en) | 2020-05-06 | 2020-05-06 | Method for manufacture a glass with at least one electrically and/or thermally conductive feed-through, a glass with at least one electrically and/or thermally conductive feed-through and use of a glass with at least one electrically and/or thermally conductive feed-through |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115776975A true CN115776975A (en) | 2023-03-10 |
Family
ID=78467758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080100576.9A Pending CN115776975A (en) | 2020-05-06 | 2020-05-06 | Glass with at least one electrically and/or thermally conductive feed-through, method for the production thereof and use thereof |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP4146607A4 (en) |
| CN (1) | CN115776975A (en) |
| WO (1) | WO2021223070A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3445211A (en) * | 1966-05-10 | 1969-05-20 | Sylvania Electric Prod | Process for sealing connectors in a planar structure |
| US3515530A (en) * | 1966-06-01 | 1970-06-02 | Tokyo Shibaura Electric Co | Process for sealing metal body to glass body |
| CN102070120A (en) * | 2010-12-31 | 2011-05-25 | 东南大学 | Preparation method for high-density interposer for microelectronic system-in-package |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2167482A (en) * | 1936-05-15 | 1939-07-25 | Gen Electric | Glass-to-metal seal |
| AT306274B (en) * | 1968-06-14 | 1973-04-10 | Floatglas Gmbh | Method and system for manufacturing a wired glass ribbon using the float method |
| JPS51100112A (en) * | 1975-02-28 | 1976-09-03 | Asahi Glass Co Ltd | Hokyosareta furootogarasuno seizohoho |
| JPS5393140A (en) * | 1977-01-26 | 1978-08-15 | Central Glass Co Ltd | Anticorrosive method of glass plate holding metallic wire and anticorrosive structure |
| JP2002124845A (en) * | 2000-08-07 | 2002-04-26 | Nippon Sheet Glass Co Ltd | Crystal vibrator package and its manufacturing method |
| JP2010235356A (en) * | 2009-03-30 | 2010-10-21 | Central Glass Co Ltd | Method for manufacturing metal wired flat glass |
| DE102015109764A1 (en) * | 2015-06-18 | 2016-12-22 | Infineon Technologies Ag | A laminar structure, a semiconductor device, and method of forming semiconductor devices |
-
2020
- 2020-05-06 CN CN202080100576.9A patent/CN115776975A/en active Pending
- 2020-05-06 WO PCT/CN2020/088633 patent/WO2021223070A1/en unknown
- 2020-05-06 EP EP20934816.8A patent/EP4146607A4/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3445211A (en) * | 1966-05-10 | 1969-05-20 | Sylvania Electric Prod | Process for sealing connectors in a planar structure |
| US3515530A (en) * | 1966-06-01 | 1970-06-02 | Tokyo Shibaura Electric Co | Process for sealing metal body to glass body |
| CN102070120A (en) * | 2010-12-31 | 2011-05-25 | 东南大学 | Preparation method for high-density interposer for microelectronic system-in-package |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4146607A4 (en) | 2024-07-03 |
| WO2021223070A1 (en) | 2021-11-11 |
| EP4146607A1 (en) | 2023-03-15 |
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